JPH11213328A - Thin film magnetic head chip and assembly - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an assembly of a double azimuth type thin film magnetic head wherein assembling work efficiency is good and the damage of a magnetic head element can be prevented. SOLUTION: This head chip is provided with a first protective substrate 1, a first element layer 2 adjacent to the first protective substrate, a first chip substrate 3 adjacent to a second element layer, a second chip substrate 4 adjacent to the first chip substrate 3, a second element layer 5 adjacent to the second chip substrate 4 and a second protective substrate 6 adjacent to the second element layer 5. The head chip is stuck to a support base 42 having support side leads 71, 72, 73 and 74 composed of FPC wirings 101 and 102.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film magnetic head chip and a thin-film magnetic head assembly suitable for use in a rotary head type magnetic recording / reproducing apparatus such as a VTR. The present invention relates to a thin-film magnetic head chip having the above-described magnetic head element, and a thin-film magnetic head assembly in which one magnetic head assembly has two independent magnetic head elements.

[0002]

2. Description of the Related Art In a rotary head type magnetic recording / reproducing apparatus such as a VTR and a DAT, a magnetic head assembly (12, 1) mounted on a cylinder 40 rotating at a high speed as shown in FIG.
3, 41) are arranged so as to face the recording medium, and the magnetic head element in the magnetic head assembly slides on the recording medium to record and reproduce signals. FIG. 28A is a top view of the cylinder 40, and FIG. 28B is a cross-sectional view showing a state of the magnetic head assemblies (12, 13, 41) mounted on the cylinder 40.

FIG. 29 shows details of the magnetic head assemblies (12, 13, 41). In FIG. 29A, two thin-film magnetic head chips (hereinafter, referred to as “head chips”) 412 and 41 are provided on one support base 41.
3 is installed. Such a thin film magnetic head assembly having two head chips on one support base 41 is called a "double azimuth type thin film magnetic head assembly".

In a conventional double azimuth type thin film magnetic head assembly, as shown in FIG.
Are attached to the support base 41 so as to face each other. The first head chip 412 has the first
(Hereinafter referred to as “magnetic head element”), and a second magnetic head element (not shown) is mounted on the second head chip 413. The predetermined interval between the first and second magnetic head elements is defined as "H interval". Usually, the first and second magnetic head elements are exposed to each other in a bare manner.

FIG. 29B shows a plan view of the support base 41 as viewed from the second main surface side opposite to the first main surface to which the first and second head chips 12 and 13 are attached. FIG. External electrode terminals 35, 3 are provided on the second main surface.
6, 37, and 38 are provided. Support base 41
28, a screw hole 48 for fixing the support base 41 to the cylinder 40 as shown in FIG.
Is provided. As shown in FIG. 29A, the first head chip is provided with pad patterns 431 and 432 connected to the thin film coil of the first magnetic head element 421. Needless to say, a similar pad pattern is provided on the second head chip. Wires 61 and 62 made of a copper (Cu) wire having a thickness of about 30 μmφ are connected to the pad patterns 431 and 432, and are led to the external electrode terminals 35 and 36 on the second main surface of the support base 41. . Similarly, wires 63 and 64 are connected from the second head chip to the external electrode terminals 37 on the second main surface from the first main surface side of the support base 41.
It is led to 38.

The first main surface of the support base 41 serves as a reference surface for attachment to the cylinder 40 and is flattened by means such as polishing. As shown in FIG. 28B, a notch 49 is provided on the uppermost surface (reference surface) of the cylinder 40.
Are prepared, and the first and second head chips 12, 13 are provided.
Is designed not to hit the cylinder 40. As shown in FIG. 28A, the external electrode terminals 35, 3
6, 37, 38 are connected to cables (core wires) 69, 68, 65, 66 of a multi-core conductor 78 provided in the cylinder 40, respectively.
To the electronic circuit via The support base 41 is attached to the cylinder 40 by a male screw 58.
Therefore, the female thread 57 is cut in the cylinder 40.

[0007]

As shown in FIG. 29 (a), in a conventional double azimuth type thin film magnetic head assembly, two magnetic head elements are respectively exposed, so that During the running of the tape, there is a problem that the magnetic head element is liable to be damaged such as peeling off from the non-magnetic substrate of the head chip. Further, since there is a gap between the first magnetic head element and the second magnetic head element,
During the running of the magnetic tape, there is a problem that the head is easily clogged due to dust.

Further, in the conventional double azimuth type thin film magnetic head assembly as shown in FIG. For this reason, the magnetic head element has a disadvantage that it is easily worn.

By the way, it is difficult to connect the wire to the pad pattern of the magnetic head after attaching the magnetic head to the support base even in a single type thin film magnetic head assembly having one head chip on one support base. It is. In a double azimuth type thin film magnetic head assembly in which two thin film magnetic head chips are mounted on one support base, the space between the first head chip 12 and the second head chip 13 is narrow. The degree of difficulty increases dramatically, and it can be said that this is an absolutely impossible technology in view of productivity. Therefore, when assembling the double azimuth type thin film magnetic head assembly,
First, a wire must be connected to the pad pattern of the head chip, and then this head chip must be attached to the support base. However, sticking the head chip with the wire on the support base is because the hanging wire hinders the work,
It presents a problem that it cannot be attached with high accuracy. In addition, a wire having a diameter of about 30 μmφ is very easily cut, so that the yield is significantly reduced, and the productivity of the conventional double azimuth type thin film magnetic head assembly is extremely low.

As described above, the conventional double azimuth type head chip and double azimuth type thin film magnetic head assembly have many problems, and these double azimuth type head chip and double azimuth type thin film magnetic head assembly are problematic. It is currently difficult to mass-produce.

SUMMARY OF THE INVENTION An object of the present invention is to provide a double azimuth type head chip and a double azimuth type thin film magnetic head assembly which can be mass-produced by solving many of the above problems.

More specifically, it is an object of the present invention to provide a double azimuth type head chip in which the magnetic head element does not peel off from the head chip.

It is another object of the present invention to provide a double azimuth type head chip which is free from the possibility of dust adhering and clogging during head running.

It is still another object of the present invention to provide a double azimuth type head chip with less head wear.

Still another object of the present invention is to provide a double azimuth type head chip in which the H interval can be easily and reliably determined.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly in which a magnetic head element does not peel off from a head chip.

Still another object of the present invention is to provide a double azimuth type thin-film magnetic head assembly which is free from dust and clogging while the head is running.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly which has less head wear.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly in which the H interval can be easily and reliably determined.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly and a single type thin film magnetic head assembly in which the operation of attaching a head chip to a support base is easy and the attachment accuracy of the head chip is high. It is to provide.

Still another object of the present invention is to provide an easy-to-use electrical insulation between a support-side lead and a support base regardless of whether the support base is conductive or non-conductive. An object of the present invention is to provide a double azimuth type thin film magnetic head assembly and a single type thin film magnetic head assembly which can be easily designed.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly and a single type thin film magnetic head assembly in which electrical connection between a support side lead and a chip side lead is easy and reliable. It is.

Still another object of the present invention is to provide a double azimuth type thin film magnetic head assembly and a single type thin film magnetic head assembly having a high production yield and excellent mass productivity.

[0024]

In order to achieve the above object, a first feature of the present invention is that a first protective substrate, a first element layer adjacent to the first protective substrate, A first chip substrate adjacent to one element layer, a second chip substrate adjacent to the first chip substrate, a second element layer adjacent to the second chip substrate, And a second protection substrate adjacent to the element layer. Here, "head chip" means a thin film magnetic head chip as defined at the beginning. The first element layer has a first magnetic head element, and the second element layer has a second magnetic head element.

According to the structure of the first aspect of the present invention, the first protective substrate is disposed adjacent to the first element layer, and the second protective substrate is disposed adjacent to the second element layer. Will be done. That is, the first magnetic head element and the second magnetic head element are not exposed and are protected by the first and second protection substrates. Therefore, these magnetic head elements do not peel off, and there is no fear that the magnetic head elements become dusty or clogged while the head is running. Further, since the first and second protection substrates are provided between the first and second element layers, wear of the head chip and the magnetic head element is reduced.

Further, according to the structure of the first aspect of the present invention, the H interval is determined by the thickness of the first and second chip substrates sandwiched between the first and second element layers. Since it is possible, the H interval becomes highly accurate. Further, assembling of the double azimuth type head chip is facilitated. More specifically, the first
The thickness of the chip substrate and the thickness of the second chip substrate,
It is preferable to select each of them not more than 1/2 of the H interval.

A second feature of the present invention is that a first protection substrate, a first element layer adjacent to the first protection substrate, a first chip substrate adjacent to the first element layer, At least a second chip substrate adjacent to the first chip substrate, a second element layer adjacent to the second chip substrate, and a second protection substrate adjacent to the second element layer. The thin-film magnetic head assembly comprises at least a head chip configured and a support base on which the head chip is mounted.

According to the structure of the second aspect of the present invention,
The first magnetic head element and the second magnetic head element are not exposed, and are protected by the first and second protection substrates, respectively. Therefore, these magnetic head elements do not peel off, and there is no fear that the magnetic head elements become dusty or clogged while the head is running. Further, since the first and second chip substrates are provided between the first and second element layers, wear of the head chip and the magnetic head element is reduced. Further, since the H interval can be determined by the thickness of the first and second chip substrates sandwiched between the first and second element layers, the double azimuth type thin film magnetic head assembly can be easily assembled. , H intervals become highly accurate. For example, the thickness of the first and second chip substrates is
Each may be selected to be equal to or less than 1/2 of the H interval.

According to the second feature of the present invention, it is preferable to form a support-side lead pattern made of a flexible metal thin film called "FPC wiring" on the surface of the support base. Then, a chip-side lead pattern is formed on each of the surfaces of the first and second element layers, and the support-side lead pattern made of the FPC wiring and the end of the chip-side lead pattern are brought into contact with each other to perform electrical connection. What should I do? Here, “FPC wiring” means a Cu plating layer on a base film such as a polyimide film,
It is a flexible wiring layer formed by stacking multiple layers of Ni plating layers, Au plating layers, and the like. It is preferable that the support-side lead pattern made of the FPC wiring is adhered to the surface of the support base with a bond film, and further, a head chip is attached to the support base. Note that the lead pattern is a “thin film technique” in which a thin film formed by a vacuum deposition method, a sputtering method, a CVD method, a plating method, or the like is patterned by a photolithography method, or a paste obtained by kneading a noble metal powder and a glass powder with a binder is screened. It may be a wiring layer that is formed in close contact with the head support by, for example, a “thick film technology” that is applied and baked by printing.

When the head chip is attached to the first main surface (front surface) of the support base and external electrode terminals are provided on the second main surface (back surface) facing the first main surface. If the FPC wiring is used, from the first main surface,
The support-side lead pattern can be easily guided to the second main surface via the side surface of the support base. In addition, if the support-side lead is configured by FPC wiring, the support base may be either a conductor or a non-conductor. FP
This is because the base film of the C wiring is electrically insulated between the support-side lead and the support base.
Therefore, according to the present invention, the design of the double azimuth type thin film magnetic head assembly and the single type thin film magnetic head assembly becomes easy.

Then, corresponding to the support-side lead pattern provided on the surface of the support base, the chip-side surface electrically connected to the magnetic head element is also provided on the surfaces of the first and second element layers. A “lead pattern” is provided. Usually, a plurality of support-side and chip-side lead patterns are provided. In order for the plurality of chip-side lead patterns to be connected to the support-side lead patterns, respectively, the ends of the plurality of chip-side lead patterns may be configured to correspond to the positions of the ends of the support-side lead patterns. Good. The “lead pattern” may be composed of a “lead”, which is a wiring portion extending at a constant line width, and a “pad pattern” such as a rectangle provided at an end of the wiring portion.

According to such a configuration, the terminal of the head chip and the external electrode terminal do not have to be connected by a wire or the like. For this reason, it is not necessary to cut a wire or the like during the attaching operation. In addition, since there is no obstacle during the pasting, the head chip pasting accuracy can be easily obtained.
As a result, the time for attaching the head chip is reduced, the production yield of the double azimuth thin film magnetic head assembly is improved, and the working efficiency is greatly improved.

In particular, in the second aspect of the present invention, the first aspect
In addition, if the bonding recess and the bonding slit are provided in the second element layer, the electrical connection between the support-side lead and the chip-side lead of the double azimuth type thin-film magnetic head assembly can be easily and reliably performed. become. The joining slit portion may be provided so as to penetrate to the first and second chip substrates.
The bonding recess may be a shallow recess whose bottom stops inside the first and second element layers, or may be a deep recess reaching the first and second chip substrates.

A third feature of the present invention is that a head chip having a chip-side lead pattern and a recess (joining recess) or a slit (joining slit) provided at an end of the chip-side lead pattern; And a support base having a support-side lead pattern made of a flexible metal thin film. The thin-film magnetic head assembly has an end of the support-side lead pattern inserted into the recess or slit.
The “flexible metal thin film” refers to the FPC wiring described above or a metal thin film having a structure similar to the FPC wiring. The third feature of the present invention is not limited to the double azimuth type thin film magnetic head assembly, but may be a single type thin film magnetic head assembly. At least the protective substrate, the element layer adjacent to the protective substrate, and the chip substrate adjacent to the element layer may be a single type magnetic head assembly or a double azimuth type thin film magnetic head assembly. .

According to the third feature of the present invention, since the bonding recess and the bonding slit are provided in the element layer, the electrical connection between the support-side lead and the chip-side lead of the thin-film magnetic head assembly is provided. Connection is easy and reliable.
Further, since the FPC wiring is used, the support-side lead pattern can be easily guided from the first main surface to the second main surface via the side surface of the support base. Further, since the support-side leads are formed by FPC wiring, the support base may be either a conductor or a non-conductor. This is because the support-side lead and the support base are electrically insulated by the base film of the FPC wiring. Therefore, according to the present invention, the design of the double azimuth type thin film magnetic head assembly and the single type thin film magnetic head assembly becomes easy.

[0036]

Embodiments of the present invention will be described below with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals.
However, it should be noted that the drawings are schematic.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
It is a bird's-eye view of the double azimuth type thin film magnetic head assembly according to the embodiment. The thin-film magnetic head assembly according to the first embodiment of the present invention shown in FIG.
And a first element layer 2 adjacent to the first protection substrate 1.
And a first chip substrate 3 adjacent to the first element layer 2.
A second chip substrate 4 adjacent to the first chip substrate 3, a second element layer 5 adjacent to the second chip substrate 4, and a second element layer 5 adjacent to the second element layer 5. A head chip composed of the protective substrate 6 of FIG.

As shown in FIG. 1, the support base 42 has a first main surface (front surface) and a second main surface (back surface).
External electrode terminals, not shown, are provided on the second main surface. Then, from the first main surface, the FPC wiring 101,
102 has been led. The FPC wirings 101 and 102
, A plurality of support-side leads 71, 72, 73, 7
4 are formed. As shown in FIG. 2, the FPC wirings 101 and 102 are made of a base film 11 such as a polyimide film.
It is a flexible wiring layer on which Cu plating layers 12 and 13, Ni plating layers 14 and 15 and Au plating layers 16 and 17 are formed. The base film 11 has a thickness of 10 to 30 μm.
m, preferably about 12.5 μm. Cu plating layer 1
2, 13 have a thickness of 10 to 25 μm, preferably 18 μm
The thickness of the Ni plating layers 14 and 15 is 1 to 10 μm, preferably about 3 μm. In addition, the Au plating layer 16,
17 has a thickness of 0.05 to 3 μm, preferably about 0.1 μm.

The support-side leads 71, 72, 73, 74 composed of the FPC wirings 101, 102
Are connected to chip-side leads 21, 22, 23, 24 provided on the first and second element layers (the chip-side leads 23, 24 are shown in FIG. 3B). ing. Support side leads 71, 72, 73, 74
Of the second main surface are led to external electrode terminals (not shown) on the second main surface. In the first embodiment of the present invention, since the external electrode terminals are provided on the second main surface, the reference mounting surface of the support base 42 with respect to the cylinder is the first reference surface opposite to the second main surface. The main surface of. The first main surface serving as an attachment reference surface of the support base 42 is flattened by means such as polishing. Of course, external electrode terminals may be provided on the first main surface. If the external electrode terminals are on the first main surface, the support-side leads 71, 72, 73, 74
There is no need to guide to the second main surface through the side wall of
Wiring becomes easy. In this case, the reference mounting surface with respect to the cylinder is the second main surface.

The width of the support-side leads 71, 72, 73, 74 composed of the FPC wirings 101, 102 is, for example, 0.1 to 0.15 mm. Support side lead 7
The distance between 1, 72, 73 and 74 is, for example, 0.1 m.
m. The support base 42 may be either a conductor or a non-conductor. Even if the support base 42 is a conductor, the support-side leads 7 are formed by the polyimide film that is the base film 11 of the FPC wirings 101 and 102.
This is because the insulation between the bases 1, 72, 73, 74 and the support base 42 is electrically insulated.

A first magnetic head element 51 is formed on the first element layer 2 as shown in FIG. 3A, and a first magnetic head element 51 is formed on the second element layer 5 as shown in FIG. A second magnetic head element 52 is formed. Although not shown, each of the first and second magnetic head elements 51 and 52 includes a thin-film magnetic core and a contact portion (intermediate pole layer) between the upper magnetic pole layer and the lower magnetic pole layer constituting the thin-film magnetic core. And at least a thin-film coil layer arranged to circulate. 3A and 3B, the ends of the upper magnetic pole layer and the lower magnetic pole layer are exposed with the gap layer interposed therebetween at the ends serving as the recording medium sliding surfaces.

As shown in FIG. 3A, chip-side leads 21 and 22 are provided on the thin-film coil layer of the first magnetic head element 51.
Are connected to each other, and pad patterns 31 and 32 are provided at the other end of the chip-side lead. Similarly, as shown in FIG. 3B, one end of each of the chip-side leads 23 and 24 is connected to the thin-film coil layer of the second magnetic head element 52, and a pad is connected to the other end of the chip-side lead. Patterns 33 and 34 are provided.

In the thin-film magnetic head assembly according to the first embodiment of the present invention, a first chip substrate 3 and a second chip substrate 4 are arranged to face each other, and they are brought into contact with each other to provide a double azimuth. Constituting a die head chip. And
Each of the ends of the support-side leads 71, 72, 73, and 74 composed of the FPC wirings 101 and 102 shown in FIG. 1 is provided with a pad pattern 3 shown in FIGS.
Spatial positioning is performed so that 1, 32, 33, and 34 correspond one-to-one. Therefore, the chip-side leads 21 and 22 and the pad patterns 31 and 32 on the first element layer 2 shown in FIG. 3A are the chip-side leads 23 and 24 and the pad patterns 33 and 34 on the second element layer 5. Are patterned so as to have a mirror image relationship with each other. A typical chip-side lead 21, 22, 23, 24 has a line width of 20.
To 80 μm, and the pad patterns 31, 32, 3
The dimensions of 3, 34 are 80 μm □ to 500 μm □.

The thicknesses of the first chip substrate 3 and the second chip substrate 4 are selected so that a desired H interval is obtained. Here, the distance between the first magnetic head element 51 and the second magnetic head element 52 is defined as “H interval”. The first chip substrate 3 and the second
It is preferable that the thickness of each of the chip substrates 4 is selected to be not more than の of the H interval. A typical H interval is 0.6
mm to about 0.8 mm, and the thickness of the chip substrate is selected to be 0.3 mm or less to 0.4 mm or less. Depending on the design of the system, the H interval may be equal to or greater than 1 mm, and may be equal to or less than 0.5 mm. In any case, the thickness of the chip substrate may be selected to be １ ／ or less of the predetermined H interval.

The thin-film magnetic head assembly according to the first embodiment of the present invention can be manufactured as follows.

(A) First, a support base 42 as shown in FIG. 1 is prepared in advance. For example, a metal block (metal plate) such as brass may be formed by a known mechanical processing means such as punching, cutting, and grinding. Electric discharge machining or the like may be used. Further, the first main surface is flattened by polishing or the like. When the support base 42 is a non-conductive material such as ceramics, it may be formed by punching, laser processing, ultrasonic processing, or the like. In the following, the support base 42 is described as being made of brass.

(B) FPC wirings 101, 1 shown in FIG.
02, using a bond film having a thickness of about 50 μm,
The support-side leads 71, 72, 73, 74 are formed by bonding to predetermined positions on the support base 42.

(C) On the other hand, the first and second substrates such as a non-magnetic substrate
Are prepared. The first element layer 2 is formed on the first chip substrate 3 and the second element layer 2 is formed on the second chip substrate 4.
Is formed. That is, a thin-film coil layer, a thin-film magnetic core, chip-side leads 21 and 22; 23 and 24, and a pad pattern 3 are formed on the first and second chip substrates 3 and 4.
The first and second element layers 2 and 5 are formed by forming 1, 32; First and second element layers 2 and 5
May be formed by a predetermined process such as a thin film forming technique such as vacuum evaporation, sputtering, or CVD, a photolithography technique, and a microetching technique such as RIE. For example, chip-side leads 21, 22;
The pad patterns 31 and 32; 33 and 34 may be patterned by using a lift-off method to vacuum deposit a gold (Au) thin film having a thickness of 0.5 to 3 μm. A protective film (passivation film) such as an oxide film (SiO ₂ ), a nitride film (Si ₃ N ₄ ), or a polyimide film is formed on the thin film coil layer and the thin film magnetic core. If necessary, a chemical mechanical polishing ( C
MP) or the like to flatten the surface.

(D) Next, as shown in FIG.
A part of the upper surface of the element layer 2 is covered with a first protective substrate 1, and the first element layer 2 and the first protective substrate 1 are bonded to each other with an adhesive such as a glass resin. The first chip substrate 3, the first
The multilayer structure including the element layer 2 and the first protective substrate 1 is formed by a known processing means such as cutting and grinding to complete a first head chip 111 having a shape as shown in FIG. . Similarly, a part of the upper surface of the second element layer 5 is covered with the second protective substrate 6 and bonded to each other with a glass resin or the like. The multilayer structure including the second chip substrate 4, the second element layer 5, and the second protection substrate 6 is formed by a predetermined processing means, and is formed as shown in FIG.
A head chip 112 having a shape as shown in FIG.

(E) Preliminary solder is applied to the ends of the support-side leads 71, 72, 73, 74 composed of the FPC wirings 101, 102. Similarly, the first head chip 111
Upper pad patterns 31, 32, second head chip 1
Preliminary soldering is also performed on the pad patterns 33 and 34 on the substrate 12.

(F) And the support-side leads 71, 72
The first head chip 111 is attached to the support base 42 with an adhesive such as an instantaneous adhesive so that the position of the end portion of the first head chip 111 matches the position of the pad patterns 31 and 32. Similarly, the second head chip 112 is attached to the support base 42 such that the positions of the ends of the support-side leads 73 and 74 and the positions of the pad patterns 33 and 34 match. An appropriate alignment mark may be used to align the ends of the support-side leads 71, 72, 73, 74 with the pad patterns 31, 32, 33, 34.

(G) Finally, hot air is sent to the thin-film magnetic head assembly bonded in (f) to fuse the spare solders with each other, so that the support-side leads 71, 72, 73, 74 and the chip-side leads 21, 22 are formed. , 23, and 24 are obtained, and the thin-film magnetic head assembly according to the first embodiment of the present invention is completed. In addition, the hot air may be sent at the time of bonding with the adhesive (f), and the process (f) and the process (g) may be performed simultaneously. Also, instead of solder, the ends of the support-side leads 71, 72, 73, 74 and the pad pattern 31,
A thermocompression bonding or an ultrasonic bonding may be performed by arranging a gold (Au) sphere at a joint portion with 32, 33, 34.

The manufacturing method of the thin-film magnetic head assembly according to the first embodiment of the present invention has been understood above. In addition, as shown in FIG. A manufacturing method may be employed in which a double azimuth type head chip is formed by bonding the second head chip 112 and the second head chip 112 and then bonded to the support base 42 to complete the electrical connection. .

[First Modification] FIG. 5 is a bird's-eye view of a thin-film magnetic head assembly according to a modification of the first embodiment of the present invention. The feature of this modified example (first modified example) lies in the shape of the sliding surface of the double azimuth type head chip. The double azimuth type head chip shown in FIG. 1 has two surfaces of curvature, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4, but the double azimuth head chip shown in FIG. In the azimuth type head chip, the sliding surface is constituted by a single curvature surface, and such discontinuity does not exist. The sliding surface shape shown in FIG. 1 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 5 is effective when the H interval is relatively narrow, for example, when the H interval is 1 m.
It is effective when it is less than m. Fig. 1
Alternatively, by selecting the shape of the sliding surface shown in FIG. 5, an optimal sliding pressure with the recording medium (magnetic tape) can be obtained, and highly reliable recording and reproduction can be performed.

[Second Modification] FIG. 6 is a bird's-eye view of a thin-film magnetic head assembly according to another modification (second modification) of the first embodiment of the present invention. Support side lead 7
1, 72, 73 and 74 do not necessarily need to use FPC wiring. FIG. 6 shows an example in which no FPC wiring is used. As shown in FIG. 6, a thin-film magnetic head assembly according to the second modification includes a plurality of support-side leads 81, 8 formed by plating wiring on a first main surface of a support base.
2, 83, 84 are formed. Support side lead 8
1, 82, 83, 84 have a first end
And the chip-side leads 21 and 22 (23, 24) provided on the second element layers 2 and 5, and the other end is led to an external electrode terminal (not shown). In the second modification, the external electrode terminals are provided on the first main surface. In this case, the reference mounting surface of the support base 42 with respect to the cylinder is a second main surface opposite to the first main surface. The second main surface serving as a reference mounting surface of the support base 42 is flattened by a means such as polishing.

When the support base 42 is a conductor, an insulating film such as an oxide film (SiO ₂ ), a nitride film (Si ₃ N ₄ ), or a polyimide film is used as a support lead and the support base 42.
To be electrically insulated from each other.
Preferably, a polyimide sheet having a thickness of about 100 μm is attached to the entire surface of the conductive support base 42,
On this, the support side leads 81, 8 by plating wiring
2, 83, 84 may be formed. In this case, copper (Cu) is vapor-deposited on the polyimide sheet by using a lift-off method to form a base pattern, and nickel (Ni) and gold (Au) are selectively plated using the base pattern. I just need. The thickness of the Ni / Au plating layer may be, for example, 2 to 10 μm, preferably 2 to 3 μm. Thus, the support-side leads 81, 82, 83,
Reference numeral 84 does not necessarily require the use of FPC wiring, and is not limited to plating wiring. Other than plating wiring,
A good conductor wiring pattern formed by a so-called thin film technique or a thick film technique may be used. The “thin film technology” is a technology in which a thin film formed by a vacuum deposition method, a sputtering method, a CVD method, or the like is patterned by closely attaching a wiring pattern of a good conductor to a head support by a photolithography method. The term "thick film technology" refers to a technology in which a paste obtained by kneading a noble metal powder and a glass powder with a binder is applied by screen printing and then baked to form a good conductor wiring pattern in close contact with the head support. I do.

[Third Modification] FIG. 7 is a bird's-eye view of a thin-film magnetic head assembly according to still another modification of the first embodiment of the present invention. As in the second modification, Ni / A
The support side leads 85, 86, 87,
Although 88 is provided, external electrode terminals are provided on the second main surface. Since the external electrode terminals are on the second main surface, the support-side leads 85, 86, 87, and 88 are guided to the second main surface via the side walls of the support base 42. In this case, the reference mounting surface with respect to the cylinder is the first main surface. It is apparent that it is easier to attach the above-mentioned FPC wiring and lead the Ni / Au plating layer to the second main surface than to lead the Ni / Au plating layer along the side wall of the support base 42 to the second main surface. Will.

[Fourth Modification] FIG. 8 is a bird's-eye view of a thin-film magnetic head assembly according to still another modification of the first embodiment of the present invention. The first protection substrate 1 shown in FIG.
A first protection substrate 1L and a second protection substrate 6L larger than the second protection substrate 6 are used. That is, the thin-film magnetic head assembly according to the fourth modified example includes a first protection substrate 1L.
And a first element layer 2 adjacent to the first protection substrate 1L.
And a first chip substrate 3 adjacent to the first element layer 2.
A second chip substrate 4 adjacent to the first chip substrate 3, a second element layer 5 adjacent to the second chip substrate 4, and a second element layer 5 adjacent to the second element layer 5. The head chip composed of the protective substrate 6L of FIG.
It is stuck on and configured. Support side lead 7
1, 72, 73 and 74 are the same as those in FIG. 1 in that FPC wirings 101 and 102 are used.

In a rotary head type magnetic recording / reproducing apparatus,
When the number of heads is large, stable recording and reproduction cannot be obtained unless the tension of the tape is increased. A large first protection substrate 1L and a second protection substrate 6L as shown in FIG.
By using the above, the sliding area is increased, the wear of the head chip is suppressed, and highly reliable recording / reproduction can be performed.

[Fifth Modification] FIG. 9 is a bird's-eye view of a thin-film magnetic head assembly according to still another modification of the first embodiment of the present invention. This modified example (fifth modified example) is different from the fourth modified example in the shape of the sliding surface of the double azimuth type head chip. The double azimuth type head chip shown in FIG. 8 has two curvature surfaces, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4,
In the double azimuth type head chip shown in FIG. 9, the sliding surface is constituted by a single curvature surface, and such a discontinuity does not exist. The sliding surface shape shown in FIG. 8 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 9 is effective when the H interval is relatively narrow. By selecting the sliding surface shape in FIG. 8 or FIG. 9 according to the size of the H interval, an optimal sliding pressure with the recording medium (magnetic tape) can be obtained, and at the same time, the large first protective substrate 1L and Since the second protection substrate 6L is used,
The sliding area increases, and wear of the head chip is suppressed. Therefore, highly reliable recording and reproduction can be performed.

(Second Embodiment) FIG. 10 is a bird's-eye view of a double azimuth type thin film magnetic head assembly according to a second embodiment of the present invention. The thin-film magnetic head assembly according to the second embodiment of the present invention shown in FIG. 10 includes a first protection substrate 1, a first element layer 7 adjacent to the first protection substrate 1, A first chip substrate 3 adjacent to the first element layer 7, a second chip substrate 4 adjacent to the first chip substrate 3, and a second element layer 8 adjacent to the second chip substrate 4. And a head chip having at least a second protection substrate 6 adjacent to the second element layer 8 is attached to a support base 42.

The support base 42 shown in FIG. 10 is a view seen from the first main surface (front surface) side, but is not shown on the second main surface (back surface) side facing the first main surface. External electrode terminals are provided. Then, the FPC wirings 101 and 102 are led from the first main surface to the second main surface via the side surface of the support base 42. This FPC
A plurality of support-side leads 7 are provided by the wirings 101 and 102.
1, 72, 73 and 74 are formed. FPC wiring 1
Reference numerals 01 and 102 have structures as shown in FIG. 2 described in the first embodiment of the present invention. That is, a Cu plating layer 12, 1 is formed on a base film 11 such as a polyimide film.
3, Ni plating layers 14, 15 and Au plating layers 16, 17
Is a flexible wiring layer. Then, ends of the FPC wirings 101 and 102 are punched into a strip shape and bent so as to rise from the first main surface of the support base 42. The first of the support base 42
Support-side leads 71, 7 raised from the main surface of
One end of each of 2, 73, 74 is inserted into a recess (bonding recess) provided in the first and second element layers 7, 8, and the chip-side leads 21, 22, 23, 24 ( The chip-side leads 23 and 24 are connected to FIG. 11 (b). A conductive adhesive is used in the recess, and the support-side leads 71, 72, 73, 74 and the chip-side leads 21, 22, 23, 24 are electrically connected to each other. In addition to conductive adhesive, soldering, gold (Au)
Electrical connection by bonding using a sphere may be performed. The FPC wirings 101 and 102 other than the portions to be connected to the chip-side leads 21, 22, 23 and 24 are adhered to the support base 42 with a wide base film. The bonding portion between the FPC wirings 101 and 102 and the support base 42 of the base film is formed by laying a bond film under the base film and bonding the base film and the support base 42. Support-side leads 71, 7 inserted into recesses provided in the first and second element layers
Reference numerals 2, 73, and 74 also have a structure including a base film / Cu plating layer / Ni plating layer / Au plating layer, respectively. The other ends of the support-side leads 71, 72, 73, 74 are
FPC wirings 101, 1 are connected to external electrode terminals on the second main surface side.
02. In the second embodiment of the present invention, since the external electrode terminals are provided on the second main surface, the reference mounting surface of the support base 42 to the cylinder is the first reference surface opposite to the second main surface. The main surface of. Of course, external electrode terminals may be provided on the first main surface.

The width of the support-side leads 71, 72, 73, 74 composed of the FPC wirings 101, 102 is, for example, 0.1 to 0.15 mm. Support side lead 7
The distance between 1, 72, 73 and 74 is, for example, 0.1 m.
m. The support base 42 may be either a conductor or a non-conductor.

A first magnetic head element 51 is formed on the first element layer 7 as shown in FIG.
A second magnetic head element 52 is formed on the element layer 8 as shown in FIG. 11B. The first and second magnetic head elements 51 and 52 are arranged so as to go around the thin-film magnetic core and the contact portion (intermediate pole layer) between the upper magnetic pole layer and the lower magnetic pole layer constituting the thin-film magnetic core. Needless to say, at least the thin film coil layer is provided. The ends of the upper magnetic pole layer and the lower magnetic pole layer are exposed with the gap layer interposed therebetween at the ends serving as the recording medium sliding surfaces shown in FIGS. 11 (a) and 11 (b). As shown in FIG. 11A, one end of each of the chip-side leads 21 and 22 is connected to the thin-film coil layer of the first magnetic head element 51, and the other end of the chip-side lead is provided with a bonding recess. 221 and 222 are provided. Similarly, as shown in FIG.
One ends of the chip-side leads 23 and 24 are connected to the thin-film coil layer of the magnetic head element 52, and bonding recesses 223 and 224 are provided at the other ends of the chip-side leads.

In the thin-film magnetic head assembly according to the second embodiment of the present invention, the first chip substrate 3 and the second chip substrate 4 are arranged to face each other, Constituting a die head chip. And
As shown in FIG. 10, the support-side leads 71, which are portions of the FPC wirings 101, 102 which are punched in a strip shape,
At the ends of 72, 73, 74, respectively, the joining recesses 221, 222, 223, 22 of FIGS.
Spatial positioning is performed so that 4 corresponds to 1: 1. Therefore, the chip-side leads 21 and 22 on the first element layer 2 shown in FIG.
222 denotes chip-side leads 23, 2 on the second element layer 5.
4. Patterned so as to have a mirror image relationship with the joining concave portions 223 and 224. The typical chip-side leads 21, 22, 23, and 24 have a line width of 20 to 80 μm. The width may be slightly smaller than the width. For example, 10 to 70 μm
And it is sufficient. Joining recesses 221, 222, 223, 2
The height of the groove of 24 is the support side lead 71,72,7.
The width may be slightly wider than the line width of 3,74, for example, 0.15 to 0.25 mm. Joining recesses 221 and 22
The depth of the grooves of 2,223,224 is 10 to 100 μm
Degree is fine.

The thicknesses of the first chip substrate 7 and the second chip substrate 8 are selected so as to obtain a desired H interval. The first chip substrate 3 and the second
It is preferable that the thickness of each of the chip substrates 4 is selected to be not more than の of the H interval. A typical H interval is 0.6
mm to about 0.8 mm, and the thickness of the chip substrate is selected to be 0.3 mm or less to 0.4 mm or less.

The thin-film magnetic head assembly according to the second embodiment of the present invention can be manufactured as follows.

(A) First, a support base 42 as shown in FIG. 10 is prepared in advance. For example, a predetermined metal block (metal plate) may be formed by a known mechanical processing means such as punching, cutting, and grinding. Electric discharge machining or the like may be used. Further, the first main surface is flattened by polishing or the like. When the support base 42 is a non-conductive material such as ceramics, it may be formed by punching, laser processing, ultrasonic processing, or the like. Hereinafter, the metal support base 42 will be described.

(B) The FPC wirings 101 and 102 are punched out into a predetermined shape by a press. And FIG.
As shown in (1), the FPC wirings 101 and 102 are bonded to predetermined positions on the support base 42. 50 thickness for bonding
A bond film of about μm may be used. At this time, be careful not to attach a bond film to the tips of the FPC wirings 101 and 102 punched in the form of strips, and bend the tips so that the support-side leads 71, 72, 73,
The end of 74 is lifted off the support base 42.

(C) On the other hand, the first and second substrates such as a non-magnetic substrate
Are prepared. A first element layer 7 is formed on the first chip substrate 3 and a second element layer 7 is formed on the second chip substrate 4.
Is formed. That is, a thin-film coil layer, a thin-film magnetic core, chip-side leads 21, 22, 23, 24, etc. are formed on the first and second chip substrates 3, 4, and the first and second element layers 7, 8 is formed. The first and second element layers 7 and 8 may be formed by a predetermined process such as a thin film formation technique, a photolithography technique, and an etching technique, similar to the first embodiment of the present invention. For example, the chip-side leads 21 and 22; 23 and 24 may be patterned by vacuum evaporation of a gold (Au) thin film having a thickness of 0.5 to 3 μm using a lift-off method. A protective film (passivation film) such as an oxide film (SiO ₂ ), a nitride film (Si ₃ N ₄ ), or a polyimide film is formed on the thin film coil layer and the thin film magnetic core. If necessary, a chemical mechanical polishing ( C
MP) or the like to flatten the surface.

(D) Next, as shown in FIG. 11A, a part of the upper surface of the first element layer 7 is covered with the first protection substrate 1,
The first element layer 7 and the first protection substrate 1 are bonded to each other with an adhesive such as a glass resin. The multilayer structure including the first chip substrate 3, the first element layer 7, and the first protection substrate 1 is formed by a known processing means such as cutting and grinding. continue,
Ion milling, reactive ion etching (RI
E) etc. dry etching technology or laser processing,
Joining recesses 221 and 22 by ultrasonic machining, electric discharge machining, etc.
2 is completed to complete a first head chip 121 having a shape as shown in FIG. Similarly, a part of the upper surface of the second element layer 8 is covered with the second protective substrate 6 and bonded to each other with a glass resin or the like. A multilayer structure composed of the second chip substrate 4, the second element layer 5, and the second protection substrate 6 is formed by a predetermined processing means, and further, bonding recesses 223, 224 are opened, and FIG. The head chip 122 having the shape shown in FIG.

(E) Support-side leads 71, 72, 73, 74 which are strip-shaped ends of the FPC wirings 101, 102.
Tip and joining recesses 221, 222, 223, 2
Preliminary solder or conductive adhesive is applied to the periphery of 24. Support-side leads 71, 7 with conductive adhesive
2, 73, 74 and chip-side leads 21, 22, 23, 2
4 for electrical connection with the bonding recess 22.
A conductive adhesive may be applied inside 1, 222, 223, 224.

(F) The first head chip 121 is attached to the support base 42 such that the positions of the ends of the support-side leads 71 and 72 match the positions of the joining recesses 221 and 222.
Is adhered by an adhesive means such as an instant adhesive. Similarly, the positions of the ends of the support-side leads 73 and 74 and the joint recess 22
The second head chip 122 is attached to the support base 42 so that the positions of 3, 224 match. An appropriate alignment mark may be used for alignment with the joining recesses 221, 222, 223, and 224. Then, the ends of the support-side leads 71 and 72 are bent and inserted into the joining recesses 221 and 222. Similarly, support side lead 7
3, 74 are bent at their ends to form joint recesses 223, 224.
Insert The support-side leads 71, 72, 7
3 and 74 are joined first with the joining recesses 221, 222 and 22.
3 and 224, the first head chip 12
Support base 4 for first and second head chips 122
A procedure such as pasting to step 2 may be used.

(G) Finally, hot air is sent to the thin-film magnetic head assembly bonded in (f) to fuse the preliminary solders together.
Alternatively, if bonding with a conductive adhesive is performed, the support-side leads 71, 72, 73, 74 and the chip-side leads 21,
22, 23, and 24 electrical connections are obtained,
The thin film magnetic head assembly according to the embodiment is completed.
In addition, hot air is sent at the time of pasting with the adhesive of (f),
The step (f) and the step (g) may be performed simultaneously.

Although the method of manufacturing the thin film magnetic head assembly according to the second embodiment of the present invention has been understood above, in addition to the first head chip as shown in FIG. A manufacturing method may be employed in which a double azimuth-type head chip is formed by bonding the second head chip 122 to the second head chip 122, and then bonded to the support base 42 to complete electrical connection. . Also,
First head chip 121 and second head chip 1
After bonding the FPC wiring 22 to the support base 42,
1, 102 may be adhered to the support base 42, and then the electrical connection between the support-side leads 71, 72, 73, 74 and the chip-side leads 21, 22, 23, 24 may be performed.

FIG. 10 shows support-side leads 71, 72, 73, 74 and chip-side leads 21, 21 with conductive adhesive.
FIG. 13 is a bird's-eye view of the double azimuth-type thin-film magnetic head assembly when electrically connected to 2, 23, and 24;
FIG. 9 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a second embodiment of the present invention after soldering. Although the solders 91 and 92 provided in the joining recesses 221 and 222 are exaggerated, the solders 91 and 92 may be extremely thin.

[First Modification] FIG. 14 is a bird's-eye view of a thin-film magnetic head assembly according to a modification of the second embodiment of the present invention. The feature of this modified example (first modified example) lies in the shape of the sliding surface of the double azimuth type head chip. FIG.
The double azimuth type head chip shown in FIGS. 13 and 13 has two curvature surfaces, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4, but the double azimuth head chip shown in FIG. In the azimuth type head chip, the sliding surface is constituted by a single curvature surface, and such discontinuity does not exist. The sliding surface shape shown in FIGS. 10 and 13 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 14 is effective when the H interval is relatively narrow, for example, when the H interval is 1 mm or less. is there. 10 and 13 or FIG. 14 depending on the size of the H interval.
By selecting the shape of the sliding surface, an optimal sliding pressure with the recording medium (magnetic tape) can be obtained, and highly reliable recording / reproducing becomes possible.

[Second Modification] FIG. 15 shows a second modification of the present invention.
FIG. 21 is a bird's-eye view of a thin-film magnetic head assembly according to another modification of the embodiment. A first protection substrate 1L and a second protection substrate 6L which are larger than the first protection substrate 1 and the second protection substrate 6 shown in FIGS. 10 and 13 are used. That is, the second
The thin film magnetic head assembly according to the modification of the first embodiment includes a first protection substrate 1L, a first element layer 7 adjacent to the first protection substrate 1L, and a first element layer 7 adjacent to the first element layer 7. Chip substrate 3, a second chip substrate 4 adjacent to the first chip substrate 3, and a second chip substrate 4 adjacent to the second chip substrate 4
And a second protection substrate 6L adjacent to the second element layer 8, a head chip is attached to the support base 42. FPC wiring 10
1 and 102 are punched in a strip shape and lifted up from the first main surface of the support base 42. It is the same as FIGS. 10 and 13 in that it is inserted into the recess provided in the second element layer.

By using the large first protection substrate 1L and the second protection substrate 6L as shown in FIG. 15, the sliding area increases, the wear of the head chip is suppressed, and the reliability is high. Recording and reproduction can be performed. Even if the tension of the tape is increased, the wear of the head chip is suppressed, so that the sliding surface shape is effective in a rotary head type magnetic recording / reproducing apparatus having a large number of heads. Therefore, a stable record
Reproduction is obtained.

[Third Modification] FIG. 16 is a bird's-eye view of a thin-film magnetic head assembly according to still another modification of the second embodiment of the present invention. This modified example (third modified example) differs from the second modified example in the shape of the sliding surface of the double azimuth type head chip. The double azimuth type head chip shown in FIG. 15 has two surfaces of curvature, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4, but the double azimuth head chip shown in FIG. In the azimuth type head chip, the sliding surface is constituted by a single curvature surface, and such discontinuity does not exist. The sliding surface shape shown in FIG. 15 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 16 is effective when the H interval is relatively narrow. By selecting the sliding surface shape of FIG. 15 or FIG. 16 according to the size of the H interval, an optimal sliding pressure with the recording medium (magnetic tape) can be obtained, and at the same time, the large first protective substrate 1L and Since the second protection substrate 6L is used, the sliding area increases, and wear of the head chip is suppressed. Therefore, it is possible to perform recording and reproduction with higher reliability.

(Third Embodiment) FIG. 17 is a bird's-eye view of a double azimuth thin film magnetic head assembly according to a third embodiment of the present invention. The thin-film magnetic head assembly according to the third embodiment of the present invention shown in FIG. 17 includes a first protection substrate 1, a first element layer 9 adjacent to the first protection substrate 1, A first chip substrate 3 adjacent to the first element layer 9, a second chip substrate 4 adjacent to the first chip substrate 3, and a second element layer 10 adjacent to the second chip substrate 4. And a second protection substrate 6 adjacent to the second element layer 10, a head chip is attached to a support base 42. The first and second element layers 9 and 10 have slit portions 2 as shown in FIG.
The difference from the second embodiment of the present invention lies in that 31, 32, 233 and 234 are provided.

The support base 42 shown in FIG. 17 is a view as seen from the first main surface (front surface) side. External electrode terminals are provided on the second main surface (rear surface) side opposite to the first main surface. Is provided. Then, the FPC wiring 10 is connected from the first main surface to the second main surface via the side surface of the support base 42.
1, 102 are led and are electrically connected to external electrode terminals. The FPC wirings 101 and 102 form support-side leads 71, 72, 73 and 74. The FPC wirings 101 and 102 have the structure described in the first embodiment of the present invention. That is, it is a flexible wiring having a multilayer structure of a base film / Cu plating layer / Ni plating layer / Au plating layer. And this FP
The ends of the C wirings 101 and 102 are punched in a strip shape,
The end is raised from the first main surface of the support base 42. The respective ends of the support-side leads 71, 72, 73, 74 raised from the first main surface of the support base 42 are inserted into slits provided in the first and second element layers 9, 10, respectively. Chip-side lead 21,
22, 23, 24 (chip-side leads 23, 24 are
8 (b)). A conductive adhesive is used for the slit portion, and the support-side leads 71, 72,
73, 74 and the chip-side leads 21, 22, 23, 24 are electrically connected to each other. In addition to the conductive adhesive, electrical connection may be performed by soldering or bonding using a gold (Au) ball. Chip-side lead 21,
The FPC wirings 101 and 102 other than the portions to be connected to 22, 23 and 24 are bonded to the support base 42 with a wide base film. FPC wiring 101, 1
02, the bonding portion of the base film with the support base 42, the bond film is laid under the base film,
The base film and the support base 42 are bonded. Support-side leads 71, 72, 73, 74 inserted into slits provided in the first and second element layers
Also has a structure composed of a base film / Cu plating layer / Ni plating layer / Au plating layer, respectively. Support side lead 7
The other ends of 1, 72, 73 and 74 are led to external electrode terminals on the second main surface side by FPC wirings 101 and 102. In the third embodiment of the present invention, since the external electrode terminals are provided on the second main surface, the reference mounting surface of the support base 42 with respect to the cylinder is the first reference surface opposite to the second main surface. The main surface of.

A first magnetic head element 51 is formed on the first element layer 9 as shown in FIG.
As shown in FIG. 18B, a second magnetic head element 52 is formed on the element layer 10 of FIG. Of course, each of the first and second magnetic head elements 51 and 52 has at least a thin-film magnetic core and a thin-film coil layer. The ends of the upper magnetic pole layer and the lower magnetic pole layer constituting the thin-film magnetic core are exposed at the ends serving as the sliding surfaces of the recording medium shown in FIGS. ing. As shown in FIG. 18A, the first magnetic head element 5
One end of each of the chip-side leads 21 and 22 is connected to one thin-film coil layer, and bonding slits 231 and 232 are provided at the other end of each of the chip-side leads. Similarly, as shown in FIG. 18B, the second magnetic head element 52
One ends of the chip-side leads 23 and 24 are connected to the thin film coil layer, and bonding slits 233 and 234 are provided at the other ends of the chip-side leads.

In the thin-film magnetic head assembly according to the third embodiment of the present invention, the first chip substrate 3 and the second chip substrate 4 are arranged to face each other, Constituting a die head chip. And
As shown in FIG. 17, the support-side leads 71, which are portions of the FPC wirings 101 and 102 that are punched in a strip shape,
At the ends of 72, 73 and 74, respectively, the joining slits 231, 232 and 23 shown in FIGS.
The spatial positioning is performed so that 3,234 correspond to one-to-one. Therefore, the first signal shown in FIG.
The chip-side leads 21 and 22 and the joining slits 231 and 232 on the element layer 9 of the second element layer are connected to the chip-side leads 23 and 24 and the joining slits 233 and 234 on the second element layer 10.
Are patterned so as to have a mirror image relationship with each other. The typical chip-side leads 21, 22, 23, and 24 have a line width of 20 to 80 μm,
The groove widths of 1, 232, 233, and 234 may be slightly smaller than the line widths of the chip-side leads 21, 22, 23, and 24. For example, the thickness may be 10 to 70 μm. The grooves of the joining slits 231 and 232 are
And the first element layer 9, and the grooves of the joining slit portions 233 and 234 are formed in the second chip substrate 4 and the second chip substrate 4.
Is provided so as to penetrate the element layer 10.

The thicknesses of the first chip substrate 7 and the second chip substrate 8 are selected so that a desired H interval is obtained. The first chip substrate 3 and the second
It is preferable that the thickness of each of the chip substrates 4 is selected to be not more than の of the H interval. A typical H interval is 0.6
mm to about 0.8 mm, and the thickness of the chip substrate is selected to be 0.3 mm or less to 0.4 mm or less.

The thin-film magnetic head assembly according to the third embodiment of the present invention can be manufactured as follows.

(A) First, a support base 42 as shown in FIG. 17 is prepared in advance. For example, a conductor such as a predetermined metal plate or a non-conductor such as ceramics may be formed by known mechanical processing means. Further, the first main surface is flattened by polishing or the like.

(B) The FPC wirings 101 and 102 are
The sheet is punched by a press so as to have a predetermined shape as shown in FIG. Then, using a bond film having a thickness of about 50 μm, as shown in FIG.
3, 74 are formed. At this time, the F stamped into a strip shape
The tip portions of the PC wirings 101 and 102 are free from the bond film so that the tip portions are free.

(C) On the other hand, the first and second substrates such as a non-magnetic substrate
Are prepared. A first element layer 9 is formed on the first chip substrate 3 and a second element layer 9 is formed on the second chip substrate 4.
Is formed. That is, a thin-film coil layer, a thin-film magnetic core, chip-side leads 21, 22, 23, 24, etc. are formed on the first and second chip substrates 3, 4, and the first and second element layers 9, 24 are formed. Form 10. First and second
The element layers 9 and 10 may be formed by a predetermined process such as a thin film forming technique, a photolithography technique, and an etching technique similar to the first embodiment of the present invention. For example, chip-side leads 21, 22;
In this case, a gold (Au) thin film having a thickness of 0.5 to 3 μm may be vacuum-deposited and patterned using a lift-off method.
An oxide film (SiO 2) is formed on the thin film coil layer and the thin film magnetic core.
₂ ) A protective film (passivation film) such as a nitride film (Si ₃ N ₄ ) or a polyimide film is formed, and if necessary, the surface may be planarized by chemical mechanical polishing (CMP) or the like.

(D) Next, as shown in FIG. 18A, a part of the upper surface of the first element layer 9 is covered with the first protective substrate 1, and
The first element layer 9 and the first protection substrate 1 are bonded to each other with an adhesive such as a glass resin. The multilayer structure including the first chip substrate 3, the first element layer 9, and the first protection substrate 1 is formed by a known processing means such as cutting and grinding. continue,
The joining slit portions 231 and 232 are opened by slit opening means such as an outer peripheral diamond blade, a wire saw, laser processing, ultrasonic processing, electric discharge processing, and the like.
A first head chip 131 having a shape as shown in FIG. Similarly, a part of the upper surface of the second element layer 10 is covered with the second protective substrate 6 and bonded to each other with a glass resin or the like. The multilayer structure including the second chip substrate 4, the second element layer 10, and the second protection substrate 6 is formed by a predetermined processing means, and the joining slit portions 233 and 234 are opened.
A head chip 132 having a shape as shown in FIG. 18B is completed.

(E) Support-side leads 71, 72, 73, 74 which are strip-shaped ends of the FPC wirings 101, 102.
Tip and joining slits 231, 232, 23
Preliminary solder or conductive adhesive is also applied to the periphery of 3,234. Support side lead 7 with conductive adhesive
1, 72, 73, 74 and chip-side leads 21, 22, 2
If an electrical connection is made to the bonding slits 3 and 24, a conductive adhesive may be applied to the inside of the joining slits 231, 232, 233 and 234.

(F) And the support-side leads 71, 72
The first head chip 131 is adhered to the support base 42 with an adhesive such as an instant adhesive so that the position of the end of the first head chip 131 and the position of the joining slits 231 and 232 match. Similarly, the second head chip 132 is attached to the support base 42 such that the positions of the ends of the support-side leads 73 and 74 and the positions of the joining slits 233 and 234 match. Ends of the support-side leads 71, 72, 73, 74 and the joining slits 231, 232, 233, 23
For alignment with the position No. 4, an appropriate alignment mark may be used. Then, the ends of the support-side leads 71 and 72 are bent and inserted into the joining slits 231 and 232. Similarly, the ends of the support-side leads 73 and 74 are bent and inserted into the joining slits 233 and 234. First, the ends of the support-side leads 71, 72, 73, 74 are connected to the joining slits 231, 232, 233, 234.
Then, put it in a free state,
Head chip 131 and second head chip 132
May be attached to the support base 42.

(G) Finally, hot air is sent to the thin-film magnetic head assembly bonded in (f) to fuse the preliminary solders together.
Alternatively, if bonding with a conductive adhesive is performed, the support-side leads 71, 72, 73, 74 and the chip-side leads 21,
22, 23, and 24 electrical connections are obtained.
The thin film magnetic head assembly according to the embodiment is completed.
In addition, hot air is sent at the time of pasting with the adhesive of (f),
The step (f) and the step (g) may be performed simultaneously.

Although the method of manufacturing the thin-film magnetic head assembly according to the third embodiment of the present invention has been understood above, in addition to the first head chip as shown in FIG. A double azimuth-type head chip may be formed by pasting the 131 and the second head chip 132 together, and then pasting to the support base 42 to complete the electrical connection. . Also,
First head chip 131 and second head chip 1
After bonding the FPC wiring 32 to the support base 42, the FPC wiring 10
1, 102 may be adhered to the support base 42, and then the electrical connection between the support-side leads 71, 72, 73, 74 and the chip-side leads 21, 22, 23, 24 may be performed.

FIG. 17 shows support-side leads 71, 72, 73, 74 and chip-side leads 21, 21 with conductive adhesive.
FIG. 20 is a bird's-eye view of the double azimuth-type thin-film magnetic head assembly when electrically connected to 2, 23 and 24;
FIG. 11 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a third embodiment of the present invention after soldering. Solder 91 provided in joining slit portions 231 and 232,
Although 92 is exaggerated, the solders 91 and 92 may be extremely thin.

[First Modification] FIG. 21 is a bird's-eye view of a thin-film magnetic head assembly according to a modification of the third embodiment of the present invention. The feature of this modified example (first modified example) lies in the shape of the sliding surface of the double azimuth type head chip. FIG.
The double azimuth type head chip shown in FIGS. 20 and 21 has two curvature surfaces, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4, but as shown in FIG. In the azimuth type head chip, the sliding surface is constituted by a single curvature surface, and such discontinuity does not exist. The sliding surface shape shown in FIGS. 17 and 20 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 21 is effective when the H interval is relatively narrow. By selecting the sliding surface shape of FIG. 17 and FIG. 20 or FIG. 21 according to the size of the H interval, an optimal sliding pressure with the magnetic tape can be obtained, and highly reliable recording / reproducing becomes possible.

[Second Modification] FIG. 22 shows a third modification of the present invention.
FIG. 21 is a bird's-eye view of a thin-film magnetic head assembly according to another modification of the embodiment. A first protection substrate 1L and a second protection substrate 6L that are larger than the first protection substrate 1 and the second protection substrate 6 shown in FIGS. 17 and 20 are used. That is, the second
The thin-film magnetic head assembly according to the modification of (1) includes a first protection substrate 1L, a first element layer 9 adjacent to the first protection substrate 1L, and a first element layer 9 adjacent to the first element layer 9. Chip substrate 3, a second chip substrate 4 adjacent to the first chip substrate 3, and a second chip substrate 4 adjacent to the second chip substrate 4
Element layer 10 and a second element layer 10 adjacent to the second element layer 10.
And a protection substrate 6L are attached to the support base 42. The strip-shaped ends of the FPC wirings 101 and 102 rise from the first main surface of the support base 42, and the support-side leads 71, 72, 73,
74 is similar to FIGS. 17 and 20 in that it is inserted into a slit provided in the first and second element layers.

By using the large first protection substrate 1L and the second protection substrate 6L as shown in FIG. 22, the sliding area increases, the wear of the head chip is suppressed, and the reliability is high. Recording and reproduction can be performed. Even if the tension of the tape is increased, the wear of the head chip is suppressed, so that the sliding surface shape is effective in a rotary head type magnetic recording / reproducing apparatus having a large number of heads. Therefore, a stable record
Reproduction is obtained.

[Third Modification] FIG. 23 is a bird's-eye view of a thin-film magnetic head assembly according to still another modification of the third embodiment of the present invention. This modified example (third modified example) differs from the second modified example in the shape of the sliding surface of the double azimuth type head chip. The double azimuth type head chip shown in FIG. 22 has two surfaces of curvature, and the curvature is discontinuous at the interface between the first chip substrate 3 and the second chip substrate 4, but the double azimuth head chip shown in FIG. In the azimuth type head chip, the sliding surface is constituted by a single curvature surface, and such discontinuity does not exist. The sliding surface shape shown in FIG. 22 is effective when the H interval is relatively wide, and the sliding surface shape shown in FIG. 23 is effective when the H interval is relatively narrow. By selecting the shape of the sliding surface in FIG. 22 or FIG. 23 according to the size of the H interval, an optimal sliding pressure with the recording medium (magnetic tape) can be obtained. Since the second protection substrate 6L is used, the sliding area increases, and wear of the head chip is suppressed. Therefore, it is possible to perform recording and reproduction with higher reliability.

(Fourth Embodiment) FIG. 24 is a bird's-eye view of a single type thin film magnetic head assembly according to a fourth embodiment of the present invention. The thin-film magnetic head assembly according to the fourth embodiment of the present invention shown in FIG.
A single head chip having at least an element layer 302 adjacent to the protection substrate 301 and a chip substrate 303 adjacent to the element layer 302 is attached to the support base 42.

The support base 42 shown in FIG. 24 is a view as seen from the first main surface (front surface) side, but is not shown on the second main surface (rear surface) side facing the first main surface. External electrode terminals are provided. Then, the FPC wiring 101 is led from the first main surface to the second main surface via the side surface of the support base 42. This FPC wiring 10
1, support-side leads 71 and 72 are formed. The FPC wirings 101 and 102 have the structure described in the first embodiment of the present invention. That is, it is a flexible wiring layer having a multilayer structure of a base film / Cu plating layer / Ni plating layer / Au plating layer. Then, an end of the FPC wiring 101 is punched in a strip shape, and floats from the first main surface of the support base 42. The ends of the support-side leads 71 and 72 raised from the first main surface of the support base 42 are connected to the element layer 302.
Are connected to the chip-side leads 321 and 322. A conductive adhesive is used for the concave portions, and the support-side leads 71 and 72 and the chip-side leads 321 and 322 are electrically connected to each other. In addition to conductive adhesive, soldering,
Electrical connection by bonding using a gold (Au) ball may be performed. The FPC wiring 101 other than the connection portion with the chip-side leads 21 and 22 is bonded to the support base 42 with a wide base film. The bonding portion between the base film and the support base 42 of the FPC wiring 101 is formed by laying a bond film below the base film and bonding the base film and the support base 42 together. The support-side leads 71 and 72 inserted into the recesses provided in the element layer 302 also have a base film / Cu plating layer /
The structure consists of a Ni plating layer / Au plating layer.

A magnetic head element 351 is formed on the element layer 302 as shown in FIG. Magnetic head element 3
Of course, 51 has at least a thin-film magnetic core and a thin-film coil layer. The ends of the upper magnetic pole layer and the lower magnetic pole layer, which form part of the thin-film magnetic core, are exposed across the gap layer at the ends serving as the recording medium sliding surface shown in FIG. One end of each of the chip-side leads 321 and 322 is connected to the thin-film coil layer of the magnetic head element 351, and the other end of each of the chip-side leads is connected to a bonding recess 331.332.
Is provided. Representative chip-side leads 21 and 22
Has a line width of 20 to 80 μm,
The groove width of 332 may be slightly smaller than the line width of the chip-side leads 21 and 22. For example, the thickness may be 10 to 70 μm. The height of the grooves of the joining recesses 331 and 332 is
Slightly wider than the line width of the support-side leads 71 and 72,
For example, it may be 0.15 to 0.25 mm. The depth of the grooves of the joining recesses 331 and 332 is 10 to 100 μm
Degree is fine.

The method for manufacturing a single type thin film magnetic head assembly according to the fourth embodiment of the present invention is similar to the method for manufacturing a double azimuth type thin film magnetic head assembly according to the second embodiment of the present invention. Basically, the description is omitted.

(Fifth Embodiment) FIG. 26 is a bird's-eye view of a single type thin film magnetic head assembly according to a fifth embodiment of the present invention. The thin-film magnetic head assembly according to the fifth embodiment of the present invention shown in FIG.
A single head chip having at least an element layer 312 adjacent to the protection substrate 301 and a chip substrate 303 adjacent to the element layer 312 is supported by the support base 42.
It is stuck on and configured. The element layer 312 is different from the fourth embodiment of the present invention in that slit portions 241, 242 as shown in FIG. 27 are provided.

The support base 42 shown in FIG. 26 is a view as seen from the first main surface (front surface) side. External electrode terminals are provided on the second main surface (rear surface) side opposite to the first main surface. Is provided. Then, the FPC wiring 101 is connected to the second main surface from the first main surface via the side surface of the support base 42.
And are electrically connected to the external electrode terminals.
With the FPC wiring 101, the support-side leads 71,
72 are formed. The FPC wiring 101 is made of the base film / Cu described in the first embodiment of the present invention.
Flexible wiring with a multilayer structure of plating layer / Ni plating layer / Au plating layer. And this FPC wiring 1
The end of the support base 42 is punched out in a strip shape, and the end is raised from the first main surface of the support base 42. Each of the ends of the support-side leads 71 and 72 raised from the first main surface of the support base 42 is connected to the element layer 312.
Are connected to chip-side leads 21 and 22. Slit part 2
The conductive adhesive is used for 41 and 242, and the support-side leads 71 and 72 and the chip-side leads 321 and 322 are electrically connected to each other. In addition to the conductive adhesive, electrical connection may be performed by soldering or bonding using a gold (Au) ball. Chip side lead 32
The FPC wiring 101 other than the connection portion with the first and second terminals 322 is bonded to the support base 42 with a base film wider than the chip-side leads 321 and 322. Third of the present invention
In this embodiment, since the external electrode terminals are provided on the second main surface, the reference mounting surface of the support base 42 with respect to the cylinder is the first main surface opposite to the second main surface. .

A magnetic head element 351 is formed on the element layer 312 as shown in FIG. Magnetic head element 3
Of course, 51 has at least a thin-film magnetic core and a thin-film coil layer. As shown in FIG. 26, the ends of the upper magnetic pole layer and the lower magnetic pole layer constituting the thin-film magnetic core are exposed with the gap layer interposed therebetween at the end serving as the recording medium sliding surface. One ends of the chip-side leads 321 and 322 are connected to the thin-film coil layer of the magnetic head element 351, and bonding slits 241 and 242 are provided at the other ends of the chip-side leads. Typical chip-side leads 321 and 322 have a line width of 20 to 80 μm,
The groove width of the joining slits 241 and 242 may be slightly smaller than the line width of the chip-side leads 321 and 322. For example, the thickness may be 10 to 70 μm. The grooves of the joining slits 241 and 242 are provided to penetrate the chip substrate 303 and the element layer 312.

The method for manufacturing a single type thin film magnetic head assembly according to the fifth embodiment of the present invention is similar to the method for manufacturing a double azimuth type thin film magnetic head assembly according to the third embodiment of the present invention. Basically, the description is omitted.

[0108]

According to the present invention, the first and second magnetic head elements constituting the double azimuth type thin film magnetic head assembly are protected by the first and second protective substrates having high mechanical strength. I have. That is, since the first and second magnetic head elements are not exposed to the outside, peeling of the first and second magnetic head elements is prevented.

Further, according to the present invention, since the first and second chip substrates are provided between the first element layer and the second element layer, dust and clogging during running of the head are prevented. Stable and highly reliable recording / reproduction becomes possible.

Further, according to the present invention, the first and second chip substrates are provided between the first element layer and the second element layer, the sliding area is increased, the head wear is small, and the life is long. It is.

Further, according to the present invention, since the H interval can be determined by the thickness of the first and second chip substrates, the assembling work of the double azimuth type thin film magnetic head assembly is facilitated, and the H interval is reduced. High accuracy.

Furthermore, according to the present invention, when attaching the head chip to the support base, there is no object that hinders the work, and therefore, the double azimuth type thin film magnetic head assembly and The head chip can be easily attached in the assembling work of the single-type thin-film magnetic head assembly, and the attaching accuracy is increased.

When the support-side leads are formed by FPC wiring, the support base may be either a conductor or a non-conductor. By the base film of FPC wiring,
This is because the support-side lead and the support base are electrically insulated. Therefore, according to the present invention, the design of the double azimuth type thin film magnetic head assembly and the single type thin film magnetic head assembly becomes easy.

In particular, if a bonding concave portion and a bonding slit portion are provided in the element layer, the double azimuth type thin film magnetic head assembly and the single type thin film magnetic head assembly can be used.
The electrical connection between the support lead and the chip lead
Easy and secure.

Further, according to the present invention, there is provided a double azimuth type thin film magnetic head assembly and a single type thin film magnetic head assembly which have a high production yield and are excellent in mass productivity, since defects such as wire breakage do not occur. can do.

In particular, since a conductive adhesive can be used for the joint concave portion and the joint slit portion, electrical connection between the support-side lead and the chip-side lead becomes easy,
Suitable for mass production and low production cost.

[Brief description of the drawings]

FIG. 1 is a bird's eye view of a double azimuth type thin film magnetic head assembly according to a first embodiment of the present invention.

FIG. 2 is a schematic sectional view showing a structure of an FPC wiring.

FIG. 3 is a bird's-eye view of the head chip according to the first embodiment of the present invention.

FIG. 4 is a bird's-eye view of the double azimuth-type head chip according to the first embodiment of the present invention.

FIG. 5 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a modification (first modification) of the first embodiment of the present invention.

FIG. 6 shows another modification (second embodiment) of the first embodiment of the present invention.
FIG. 21 is a bird's-eye view of a double azimuth-type thin-film magnetic head assembly according to a modified example of FIG.

FIG. 7 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to yet another modification (third modification) of the first embodiment of the present invention.

FIG. 8 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to yet another modification (fourth modification) of the first embodiment of the present invention.

FIG. 9 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to yet another modification (fifth modification) of the first embodiment of the present invention.

FIG. 10 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a second embodiment of the present invention.

FIG. 11 is a bird's-eye view of a head chip according to a second embodiment of the present invention.

FIG. 12 is a bird's-eye view of a double azimuth-type head chip according to a second embodiment of the present invention.

FIG. 13 is a bird's-eye view for schematically explaining a solder connection in the double azimuth type thin-film magnetic head assembly according to the second embodiment of the present invention.

FIG. 14 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a modification (first modification) of the second embodiment of the present invention.

FIG. 15 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to another modification (second modification) of the second embodiment of the present invention.

FIG. 16 is a bird's-eye view of a double azimuth-type thin-film magnetic head assembly according to still another modification (third modification) of the second embodiment of the present invention.

FIG. 17 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a third embodiment of the present invention.

FIG. 18 is a bird's-eye view of a head chip according to a third embodiment of the present invention.

FIG. 19 is a bird's-eye view of a double azimuth-type head chip according to a third embodiment of the present invention.

FIG. 20 is a bird's-eye view for schematically explaining a solder connection in a double azimuth type thin-film magnetic head assembly according to a third embodiment of the present invention.

FIG. 21 is a bird's-eye view of a double azimuth type thin-film magnetic head assembly according to a modification (first modification) of the third embodiment of the present invention.

FIG. 22 is a bird's-eye view of a double azimuth-type thin-film magnetic head assembly according to another modification (second modification) of the third embodiment of the present invention.

FIG. 23 is a bird's-eye view of a double azimuth-type thin-film magnetic head assembly according to still another modification (third modification) of the second embodiment of the present invention.

FIG. 24 is a bird's-eye view of a single type thin-film magnetic head assembly according to a fourth embodiment of the present invention.

FIG. 25 is a bird's-eye view of a single type head chip according to a fourth embodiment of the present invention.

FIG. 26 is a bird's-eye view of a single-type thin-film magnetic head assembly according to a fifth embodiment of the present invention.

FIG. 27 is a bird's-eye view of a single type head chip according to a fifth embodiment of the present invention.

FIG. 28 is a diagram illustrating a state in which a conventional thin-film magnetic head assembly is mounted on a cylinder.

FIG. 29 is a view schematically illustrating a conventional thin-film magnetic head assembly.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... 1st protective substrate 2, 7, 9 ... 1st element layer 3 ... 2nd chip substrate 4 ... 2nd chip substrate 5, 8, 10 ... 2nd element layer 6 ... 2nd protective substrate 11 Base film 12, 13 Cu plating layer 14, 15 Ni plating layer 16, 17 Au plating layer 21, 22, 23, 24, 321, 322 Chip side leads 31, 32, 33, 34, 431, 432 pad patterns 35, 36, 37, 38 external electrode terminals 40 cylinders 41, 42 support base 48 screw holes 49 cutouts 51, 421 first magnetic head element 52 second magnetic head Element 57 Female screw 58 Male screw 61, 62, 63, 64 Wire 65, 66, 68, 69 Cable 70 Hole 71, 72, 73, 74 Support lead (FPC)
Wiring) 78 Multi-conductor wire 81, 82, 83, 84, 85, 86, 87, 88 ...
Support-side leads (plating wiring) 91, 92 Solder 101, 102 FPC wiring 111, 121, 131, 412 First head chip 112, 122, 132, 413 Second head chip 221, 222, 223 224, 331, 332 ...
Connection recesses 231,232,233,234,241,242 ...
Connection slit 301 Protection substrate 302, 312 Element layer 303 Chip substrate 351 Magnetic head element

Claims (5)

[Claims] 1. A first protection substrate, a first element layer adjacent to the first protection substrate, a first chip substrate adjacent to the first element layer, and the first chip substrate Second adjacent to
A thin film magnetic head chip comprising at least a chip substrate, a second element layer adjacent to the second chip substrate, and a second protection substrate adjacent to the second element layer. . 2. A first protection substrate, a first element layer adjacent to the first protection substrate, a first chip substrate adjacent to the first element layer, and the first chip substrate Second adjacent to
A head chip comprising at least a chip substrate, a second element layer adjacent to the second chip substrate, and a second protection substrate adjacent to the second element layer; and a support for mounting the head chip. A thin film magnetic head assembly comprising at least a base. 3. A support-side lead pattern made of a flexible metal thin film is formed on the surface of the support base, and a chip-side lead pattern is formed on the surface of the first and second element layers, respectively. 3. The thin-film magnetic head assembly according to claim 2, wherein the pattern and the end of the chip-side lead pattern are in contact with each other and are electrically connected. 4. An end of the chip-side lead pattern,
4. The thin-film magnetic head assembly according to claim 2, wherein a concave portion or a slit portion is provided, and an end of the support-side lead pattern is inserted into the concave portion or the slit portion. 5. A head chip having a chip-side lead pattern, a recess or a slit provided at an end of the chip-side lead pattern, and a support base having a support-side lead pattern made of a flexible metal thin film And an end of said support-side lead pattern is inserted into said recess or slit.