JPH11200096A - Plating jig for wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating jig for a wafer which is capable of diminishing electric resistance, facilitate mounting work, allows easy change of the positions and number of pieces of energizing pins, does not require a space for housing, wiring, etc., and may be formed compact. SOLUTION: This plating jig includes a first holding member 10 and second holding member 40 holding the front and rear surfaces of the wafer 100. The second holding member 40 has an opening 41 to expose the surface to be electroplated of the wafer 100 and is provided with a seal packing 43 between the first holding member 10 and second holding member 40 on the circumference of the opening 41. The region B where the plating liquid does not infiltrate is formed by this seal packing 43. Further, an energizing 60-1 is mounted at the part of the region B. The energizing member 60-1 comprises an annular conducting part 61-1 mounted at the second holding member 40 side and the energizing pin 63-1 pressed to the wafer 100 by projecting from the conducting part 61-1 toward the first holding member 10 side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer plating jig used for fixing a wafer and performing electrolytic plating on the surface of the wafer.

[0002]

2. Description of the Related Art When electroplating a wafer surface, it is necessary to immerse the wafer in an electroplating solution and at the same time to contact a conductive pin formed on the wafer surface with a current-carrying pin to flow a current through the conductive film. Therefore, a jig for plating a wafer is used.

FIG. 5 shows a conventional jig for plating a wafer of this kind, wherein FIG. 5A is a perspective view (opened state), and FIG. 5B is a side sectional view (closed state). (C) is an enlarged view of a portion C in (b) of FIG.

That is, the jig includes first and second holding members 110 and 140 for holding the front and back surfaces of the wafer 100,
One side of both is hingedly connected by a hinge 131,
A seal packing 143 is attached in a ring shape around the opening 141 provided in the second holding member 140, and three energizing pins 145 are attached to the seal packing 143.

Each energizing pin 145 is connected by a metal wire 147 wired in a ring-shaped storage groove (not shown) provided in the second holding member 140, and one of the energizing pins 14
5 is connected to the second holding member 140.
Is drawn out through a through-hole 151 (see FIG. 3C) provided in the above.

The first holding member 11 shown in FIG.
0, the wafer 100 is housed in the recess 111, and the second holding member 140 is placed on the wafer 100 and sandwiched, and the periphery of the wafer 100 is pressed by the seal packing 143 as shown in FIG. The leading end of the conduction pin 145 is brought into contact with a conductive film (not shown) on the surface to enable conduction.

[0007]

However, in the case where a method of connecting a metal wire 147 is used as a method of passing a current to each of the energizing pins 145 as in the above conventional example, the metal wire 147 is provided on the second holding member 140. The thickness of the metal wire 147 must be reduced in order to fit in the storage groove, and the electrical resistance may not be negligible.

Further, since it is necessary to connect the metal wire 147 to each energizing pin 145, the connection work is complicated. This is all the more so when the number of conducting pins 145 increases.

Further, in order to cope with various wafers, it is necessary to change the position and the number of the energizing pins, but this cannot be easily performed.

Further, since a storage groove for storing the metal wire 147 is required in the second holding member 140, the thickness of the second holding member 140 is not reduced.

The present invention has been made in view of the above points, and has as its object the purpose of reducing the electric resistance, facilitating the mounting work, easily changing the position and the number of the current-carrying pins, and improving the wiring and the like. An object of the present invention is to provide a jig for plating a wafer which requires no storage space and can be made compact.

[0012]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a jig for plating a wafer, which holds the wafer so as to expose a surface to be subjected to electrolytic plating. Has a first holding member and a second holding member for holding the front and back surfaces of the wafer, the second holding member has an opening exposing a surface of the wafer to be subjected to electrolytic plating, and at least a second holding member is provided around the opening. A sealing member is provided for contacting the member and the wafer, a region where the plating solution does not enter is formed by the sealing member, and a current-carrying member is attached to a portion of the region, and the current-carrying member is attached to the second holding member side. And a ring-shaped conductive portion and a current-carrying pin that projects from the conductive portion toward the first holding member and contacts the wafer. Here, the seal member has a structure in which an inner peripheral side and an outer peripheral side of the current-carrying member are sealed to form a region where the plating solution does not intrude in a portion therebetween. Further, the seal member has a structure in which only the inner peripheral side of the current-carrying member is sealed to form a region where the plating solution does not infiltrate in a portion on the outer peripheral side of the seal. On the other hand, the current-carrying member is characterized in that a current-carrying pin projecting from an inner periphery or an outer periphery of a conducting portion formed of a ring-shaped metal plate is bent. Further, the current-carrying member is characterized in that the conductive portion and the current-carrying pin are formed as an integrally molded product or are formed by joining and integrating both. Further, the current-carrying member is characterized in that a current-carrying member formed by projecting a current-carrying pin from one side of a conductive portion formed of a band plate is wound in a cylindrical shape. The power supply pin may be configured to be elastically pressed against the surface of the wafer sandwiched between the first holding member and the second holding member. The current-carrying pin is bent at a plurality of positions so that a line connecting a tip portion and a root portion of the current-carrying pin is substantially perpendicular to the surface of the wafer sandwiched between the first holding member and the second holding member. It is characterized by comprising. Further, at least a portion of the current-carrying pin that contacts the wafer is made of a conductive elastic body.

[0013]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1A and 1B are views showing a jig for plating a wafer according to an embodiment of the present invention. FIG. 1A is a perspective view (opened state), and FIG. 1B is a side sectional view (closed state). (C) is an enlarged view of a portion A in (b) of FIG.

As shown in FIG.
It has first and second holding members 10 and 40 for holding the front and back surfaces of the front and back sides, and one side of both is connected to be openable and closable by a hinge 31. Hereinafter, each component will be described.

The first holding member 10 is a rectangular flat plate, and is provided with a concave portion 11 for accommodating the wafer 100 at the center thereof.

On the other hand, the second holding member 40 is provided with an opening 41 at a position facing the recess 11, and a ring-shaped seal packing (packing member) 43 is attached around the opening 41 so as to surround it. A current-carrying member 60-1 is attached to the center of the packing 43.

Here, the seal packing 43 has a U-shaped cross section, and both ends 43a and 43b are formed so as to have dimensions such that they contact the surface of the wafer 100 and the surface of the first holding member 10, respectively. A region B in which the plating solution does not enter is formed between both side edges 43a and 43b.

Next, FIG. 2 is a view showing the conducting member 60-1, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a side view.
As shown in the figure, the current-carrying member 60-1 is formed of a single metal plate (for example, made of stainless steel). Specifically, from the inner periphery of the ring-shaped and flat conductive portion 61-1. Six triangular energizing pins 63-1 are protruded, and each energizing pin 63-1 is bent upward (the same applies to the downward direction). The conduction portion 61-1 has three mounting holes 6
5-1 is provided. The width of the conducting portion 61-1 is
It is formed smaller than the width of the concave portion of the seal packing 43 (that is, the region B where the plating solution does not enter).

Then, as shown in FIG.
-1 is connected to one wiring 49 passing through a through hole 51 provided in the second holding member 40,
Into the region B of the center of the seal packing 43 attached to the second holding member 40 where the plating solution does not enter, and
1-1 is brought into contact with the bottom surface of the concave portion of the seal packing 43, and is fixed by screwing a screw 75 (see FIG. 1C) into the three mounting holes 65-1.

That is, it is not necessary to connect the metal wire 147 to each of the energizing pins 145 as in the conventional example shown in FIG. 5, and the mounting operation can be easily performed.

Since the cross-sectional area of the conductive portion 61-1 can be increased, the electric resistance does not increase.

Further, since there is no need for a storage groove for storing the metal wire 147 as in the conventional example shown in FIG. 5, the thickness of the second holding member 40 can be reduced and the size can be reduced.

Since the energizing pins 63-1 are formed by simply bending a metal plate, the six energizing pins 63-1 are formed.
Of these, unnecessary ones can be greatly bent so as not to contact the wafer 100 described below, and the number of the energizing pins 63-1 can be easily changed.

In the energizing member 60-1, the energizing pins 63-1 protrude from the inner peripheral side of the ring-shaped conductive portion 61-1. However, the energizing pins 63-1 may protrude from the outer peripheral side of the conductive portion 61-1. good.

Next, a method of using this jig will be described. That is, the wafer 100 is housed in the concave portion 11 of the first holding member 10 shown in FIG. 1A, and the second holding member 40 is put thereon and clamped, and as shown in FIG. The periphery is held down by the seal packing 43, and at the same time, the tip of the conducting pin 63-1 contacts the conductive film (not shown) on the surface of the wafer 100 to enable conduction. The first and second holding members 10 and 40 are fixed between the side 13 of the first holding member 10 and the second holding member 40.
Is performed by holding between the sides 55 by a “U” -shaped fixture 70.

Then, the jig is immersed in an electrolytic plating solution, and an electric current is applied between an anode (not shown) provided in the electrolytic plating solution and the wiring 49, whereby the exposed surface of the wafer 100 is electrolytically plated. The portion where the energizing pins 63-1 are in contact with the surface of the wafer 100, that is, the region B where the plating solution does not enter, is sealed by the seal packing 43 and does not touch the electrolytic plating solution.

Next, FIG. 3 is a view showing a current-carrying member 60-2 having another structure used in the present invention. FIG. 3 (a) is a plan view and FIG. 3 (b) is a side view. Conducting member 60-2 shown in FIG.
Is formed by pressing a conductive portion 61-2 formed of a ring-shaped metal plate (for example, made of stainless steel) to form six conical conducting pins 63-2 from the surface of the conductive portion 61-2.
Are projected. That is, since the conductive portion 61-2 and the conducting pin 63-2 are formed as an integrally molded product, the manufacture thereof can be performed easily.

The conducting member 61-2 may be constructed by separately manufacturing the conducting portion 61-2 and the conducting pin 63-2 and joining them together by welding or the like.

Next, FIG. 4 is a view showing a current-carrying member 60-3 having another structure used in the present invention. FIG. 4A is a plan view, FIG. 4B is a side view, and FIG. Is a development view. The current-carrying member 60-3 shown in the drawing has six triangular-shaped current-carrying pins 63-3 protruding from one side of a conductive portion 61-3 formed of a metal (for example, stainless steel) band plate, and the other. Six rectangular fixing plates 67 having mounting holes 65-3 from the sides
After the fixing plate 67-3 is bent in one direction, the conducting portion 61-3 is wound into a cylindrical shape and inserted into the recess of the seal packing 43 shown in FIG. Then, a screw 75 (see FIG. 1C) is screwed into each mounting hole 65-3 to be fixed.
Since the fixing plates 67-3 are fixed by the screws 75, the joining portions at both ends of the conducting portion 61-3 wound in a cylindrical shape need not be particularly fixed.

Also in the case of the energizing pins 63-3, unnecessary ones can be greatly bent so as not to contact the wafer 100, and the number of the energizing pins 63-3 can be easily changed.

Further, in the case of the current-carrying member 60-3, since the strip-shaped conductive portion 61-3 is manufactured by bending it into a cylindrical shape, its working is easy, and the amount of bending is changed to change its circumference. Wafers 100 of different sizes by adjusting the length
, The same conducting member 60-3 can be used, so that the type of conducting member 60-3 can be reduced.

The current-carrying members 60-1 to 60-3 having the structures according to the above-described embodiments are suitable for obtaining strong contact with the wafer 100 because the elasticity of the current-carrying pins 63-1 to 3-3 themselves is small. When the force is excessively increased, the wafer 1
00 surface may be damaged. In the following embodiments, the energizing pins themselves have elasticity so that the pressing force against the wafer 100 does not become excessive.

FIGS. 6A and 6B are diagrams showing a current-carrying member 60-4 having another structure used in the present invention. FIG. 6A is a plan view and FIG. 6B is a side view. Similarly to the conducting member 60-1 shown in FIG. 2, the conducting member 60-4 protrudes eight substantially triangular conducting pins 63-4 from the inner periphery of the ring-shaped and flat conducting portion 61-4. Each of the energizing pins 63-4 is bent upward (the same applies to the downward direction). And FIG.
Is different from the energizing member 60-1 shown in FIG.
The bending angle of -4 is not made a right angle with respect to the conducting portion 61-4, but is set to a smaller angle.
4 in that the surface is inclined obliquely with respect to the plane No. 4.

FIG. 7 is an enlarged sectional view (corresponding to FIG. 1 (c)) of a main part when the current-carrying member 60-4 is attached to a plating jig. In FIG. 7, the same parts as those in FIG. 1 (c) are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in FIG.
Since the contact is made in a state of being obliquely inclined with respect to the surface of No. 0, the power supply pin 63-4 itself has elasticity. Therefore, the wafer 10
The pressing force to zero is not excessive, and the wafer 10
There is no danger of damaging the zero surface.

According to the shape of the current-carrying member 60-4, the current-carrying pin 63-4 protrudes obliquely to increase its mounting space. Instead of being constituted by one member, an outer ring-shaped first seal packing (seal member) 43'-1 as in this embodiment,
Inner ring shaped second seal packing (seal member)
43'-2 and the second holding member 4
The conductive portion 61-4 of the current-carrying member 60-4 is fixed to a space formed therebetween, that is, a surface of the second holding member 40 in a region B where the plating solution does not enter. It is needless to say that the structure in which the seal packing is divided as described above is similarly applicable to the above embodiments.

The shape of the energizing pin is not limited to this embodiment, and various other modifications are possible. In short, any shape can be used as long as it has a predetermined elasticity and is in contact with the wafer. It may be a pin.

FIG. 8 is a plan view showing a current-carrying member 60-5 having another structure used in the present invention. The only difference between the conducting member 60-5 and the conducting member 60-4 shown in FIG. 6 is that the number of conducting pins 63-5 is increased. With this configuration, the number of contact points with the wafer 100 increases, and the electric resistance can be reduced.

FIGS. 9A and 9B are diagrams showing a current-carrying member 60-6 having another structure used in the present invention. FIG. 9A is a plan view, and FIG. 9B is a cross-sectional view taken along the line DD in FIG. It is an enlarged view. The current-carrying member 60-6 includes a ring-shaped and flat conductive portion 61-6.
A large number of substantially rectangular conducting pins 63-6 are projected obliquely upward from the inner periphery of the inside, and a spherical soft conducting member 635 is attached to the tip of each conducting pin 63-6.
The soft conducting member 635 is made of, for example, conductive rubber. The reason for this configuration is as follows. That is, the end of the energizing pin contacts the seed layer on the wafer. However, since the end of the energizing pin is usually a metal such as gold plating or stainless steel, the area of the contact is small and the contact resistance is increased. For this reason, in the case of this embodiment, a soft conducting member 635 is attached to the tip of the conducting pin 63-6 to secure a contact area with the surface of the wafer 100. The state at that time is shown in FIG. 10 (FIG. 10 is an enlarged sectional view of a main part when the conducting member 60-6 is attached to the plating jig (FIG. 1 (c)).
)).

In this embodiment, the energizing pins 63
Although the soft energizing member 635 was attached only to the tip of −6,
The present invention is not limited to this embodiment. In short, it is only necessary that at least a portion of the energizing pin that contacts the wafer 100 is made of a conductive elastic body.

FIGS. 11A and 11B are diagrams showing a current-carrying member 60-7 having another structure used in the present invention. FIG. 11A is a plan view, and FIG. 11B is a sectional view taken along line EE of FIG. The enlarged view and FIG. 2C are enlarged views of a main part of an arrow F portion in FIG. The energizing member 60-7 protrudes a large number of substantially rectangular energizing pins 63-7 from the inner periphery of the ring-shaped and flat conducting portion 61-7, and connects each energizing pin 63-7 at its root portion 633. Once bent upward (toward the first holding member 10) in the outer circumferential direction, bent again in the inner circumferential direction, and
31 is bent right above. Power supply pin 6
The width of 3-7 is the root portion 6 connected to the conducting portion 61-7.
By providing a narrow portion at 33, it is easy to bend, and the portion beyond it has a uniform width. That is, in the case of this embodiment, the energizing pin 63-7 is bent three times at a portion near the root portion 633 and the tip portion 631 and at a central portion between them, so that the tip portion 631 is positioned vertically above the root portion 633. Is configured.

FIG. 12 is an enlarged sectional view (corresponding to FIG. 1 (c)) of a main part when the energizing member 60-7 is attached to a plating jig. In FIG. 12, FIG.
The same parts as those described above are denoted by the same reference numerals, and detailed description thereof will be omitted. As shown in the figure, the leading end 631 of the conducting pin 63-7 comes into contact with the surface of the wafer 100. However, since the conducting pin 63-7 is bent at a plurality of positions, it has elasticity in the vertical direction. Therefore, the pressing force against the wafer 100 does not become excessive, and there is no possibility that the surface of the wafer 100 may be damaged.

The power supply pins 63-4 shown in FIG.
In such a case, the tip portion moves on the surface of the wafer 100 when the wafer 100 is pressed against the wafer 100, so that the surface of the wafer 100 may be damaged and particles may be generated. Therefore, it is preferable that the shape of the energizing pins be as small as possible on the surface of the wafer 100. However, in the case of the energizing pins 63-7 of the present embodiment, a line connecting the tip portion 631 and the root portion 633 is formed by the wafer 100.
Because it is configured to be perpendicular to the surface of
Even if this is pressed against the wafer 100, the tip portion 631 does not move on the wafer 100 (or the moving distance is very short), and there is no possibility that the surface of the wafer 100 is damaged. Note that the structure of the energizing pin whose tip does not move on the wafer is not limited to the above embodiment, and various other modifications are possible. In short, the tip of the energizing pin is bent at least at a plurality of positions. Any structure may be used as long as it is a conduction pin configured such that the line connecting the base and the root portion is substantially perpendicular to the surface of the wafer sandwiched between the first holding member and the second holding member.

In this embodiment, the current-carrying member 6
The first and second seal packings 43'-1 and 43'-1 are divided in order to increase the mounting space of 0-7.

FIG. 13 is an enlarged sectional view (corresponding to FIG. 1C) of a main part of a plating jig using another sealing structure. This plating jig is different from the plating jig shown in FIG.
The only difference is that a ring-shaped seal packing (seal member) 111 is attached to the recess 11 of the first holding member 10 facing 3'-2.

If the rigidity of the first and second holding members 10 and 40 cannot be sufficiently ensured due to demands for downsizing and thinning of the plating jig, the first and second holding members 10 and 40 may be deformed. Accordingly, the sealing performance of the wafer 100 may be reduced.
Therefore, in order to prevent this, the seal packing 111 is provided not only on the front surface of the wafer 100 but also at substantially the same position on the back surface.

Note that the seal member is not limited to the seal packing having the above-described configuration, and can be variously modified. In short, any material and structure can be used as long as the seal member seals the front and back surfaces of the wafer 100. May be.

In each of the above embodiments, a method of forming the region B where the plating solution does not enter by the sealing member is performed by sealing the inner peripheral side and the outer peripheral side of the current-carrying member so that the region where the plating liquid does not enter the portion therebetween. B was formed. This is because the entire plating jig is immersed in the plating solution. When the upper part of the second holding member 40-8 itself is configured as the plating tank 130 as shown in FIG. , A seal packing 4 for sealing only the inner peripheral side of the current-carrying member 60-8 (same as the current-carrying member 60-4, but may be of another embodiment).
By simply providing 3-8 (the same as the second seal packing 43'-2 in FIG. 7), a region B where the plating solution does not enter can be formed in the outer peripheral portion of the seal packing 43-8. That is, the seal (the first seal packing 43'-1 in FIG. 7) outside the conducting member 60-8 is not required. 1
31 is a plating solution, 133 is an anode, and 135 is a power supply.

It goes without saying that the jig for plating a wafer according to the present invention can be used for various electrolytic plating such as bump plating and damascene.

[0049]

As described in detail above, the present invention has the following excellent effects. Since the energizing pin and the conductive portion are integrated, there is no need to connect a wiring to each energizing pin, and the mounting work is facilitated. Also, even if the number of energizing pins increases, the mounting operation does not become complicated.

Since the cross-sectional area of the conductive portion can be easily increased, the electric resistance does not increase.

Since there is no need to wire each energizing pin even if the number of energizing pins is large, it is not necessary to secure a space for accommodating the wiring, and the jig can be made compact.

If necessary, the number and position of the current-carrying pins can be changed simply by replacing the current-carrying member in which the current-carrying pins and the conductive portion are integrated, so that various wafers having different contact positions can be easily handled.

When the energizing pins are configured to be elastically pressed against the surface of the wafer held between the first holding member and the second holding member, the pressing force against the wafer does not become excessive, and There is no risk of damaging the surface.

By bending the current-carrying pins at a plurality of positions, the line connecting the leading end portion and the root portion of the current-carrying pins is substantially perpendicular to the surface of the wafer sandwiched between the first holding member and the second holding member. In this case, even if it is pressed against the wafer, the tip portion that contacts the wafer does not move on the wafer (or the moving distance is very short), and there is no risk of damaging the wafer surface.

When the portion of the energizing pin that contacts the wafer is made of a conductive elastic body, the contact area between the energizing pin and the wafer surface can be increased.

[Brief description of the drawings]

FIG. 1 is a view showing a jig for plating a wafer according to an embodiment of the present invention, wherein FIG. 1A is a perspective view and FIG.
Is a side sectional view, and FIG. 3C is an enlarged view of a portion A in FIG.

FIG. 2 is a view showing a current-carrying member 60-1, and FIG.
Is a plan view, and FIG. 2B is a side view.

FIGS. 3A and 3B are diagrams showing a current-carrying member 60-2 having another structure used in the present invention, wherein FIG. 3A is a plan view and FIG. 3B is a side view.

4A and 4B are diagrams showing a current-carrying member 60-3 having another structure used in the present invention, wherein FIG. 4A is a plan view, FIG. 4B is a side view, and FIG. is there.

FIG. 5 is a view showing a conventional example, and FIG. 5 (a) is a perspective view,
FIG. 1B is a side sectional view, and FIG. 1C is an enlarged view of a portion C in FIG. 1B.

FIGS. 6A and 6B are diagrams showing a current-carrying member 60-4 having another structure used in the present invention, wherein FIG. 6A is a plan view and FIG. 6B is a side view.

FIG. 7 is an enlarged cross-sectional view of a main part (a part corresponding to FIG. 1C) when a current-carrying member 60-4 is attached to a plating jig.

FIG. 8 is a plan view showing a current-carrying member 60-5 having another structure used in the present invention.

9A and 9B are diagrams showing a current-carrying member 60-6 having another structure used in the present invention, wherein FIG. 9A is a plan view and FIG. 9B is an enlarged cross-sectional view taken along the line DD of FIG. It is.

FIG. 10 is an enlarged cross-sectional view of a main part when a current-carrying member 60-6 is attached to a plating jig (a portion corresponding to FIG. 1C).
It is.

FIG. 11 shows a current-carrying member 60-7 having another structure used in the present invention.
FIG. 3A is a plan view, FIG. 3B is an enlarged cross-sectional view taken along the line EE of FIG. 3A, and FIG. 3C is FIG.
It is a principal part enlarged view of arrow F part.

FIG. 12 is an enlarged cross-sectional view of a main part when a current-carrying member 60-7 is attached to a plating jig (a portion corresponding to FIG. 1C).
It is.

FIG. 13 is an enlarged cross-sectional view (a portion corresponding to FIG. 1C) of a main part of a plating jig using another seal packing structure.

FIG. 14 is a schematic side sectional view showing another plating jig.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 wafer 10 first holding member 40 second holding member 41 opening 43 seal packing (sealing member) B area where plating solution does not penetrate 60-1 conducting member 61-1 conducting portion 63-1 conducting pin 60-2 conducting member 61- 2 Conducting part 63-2 Conducting pin 60-3 Conducting member 61-3 Conducting part 63-3 Conducting pin 60-4 Conducting member 61-4 Conducting part 63-4 Conducting pin 43'-1 First seal packing (seal member) 43'-2 Second seal packing (seal member) 60-5 Conducting member 63-5 Conducting pin 60-6 Conducting member 61-6 Conducting portion 63-6 Conducting pin 635 Soft conducting member 60-7 Conducting member 61-7 Conducting Part 63-7 Current-carrying pin 631 Tip 633 Root portion 40-8 Second holding member 43-8 Seal packing (seal member) 60-8 Current-carrying member 13 Plating bath

Claims (9)

[Claims] 1. A jig for plating a wafer for holding a wafer so as to expose a surface to be subjected to electrolytic plating, wherein the jig for plating a wafer includes a first holding member for holding the front and back surfaces of the wafer and a second holding member. A holding member, wherein the second holding member has an opening exposing a surface of the wafer to be subjected to electrolytic plating, and a seal member is provided around the opening to contact at least the second holding member and the wafer; Forming a region in which the plating solution does not infiltrate, and further attaching a current-carrying member to the portion of the region, wherein the current-carrying member is a ring-shaped conductive portion attached to the second holding member side and a first holding member from the conductive portion. A jig for plating a wafer, comprising: an energizing pin projecting toward the side and abutting on the wafer. 2. The sealing member according to claim 1, wherein an inner peripheral side and an outer peripheral side of the current-carrying member are sealed to form a region in which a plating solution does not intrude in a portion therebetween. Jig for plating wafers. 3. The sealing member according to claim 1, wherein only the inner peripheral side of the current-carrying member is sealed to form a region where the plating solution does not enter into the outer peripheral side of the seal. 2. The jig for plating a wafer according to 1. 4. The conductive member according to claim 1, wherein the conductive member is formed by bending a conductive pin protruding from an inner periphery or an outer periphery of a conductive portion formed of a ring-shaped metal plate. The jig for plating a wafer according to any one of the preceding claims. 5. The conductive member according to claim 1, wherein the conductive part and the conductive pin are formed as an integrally molded product or are formed by joining and integrating the both. The jig for plating a wafer according to any one of the above items. 6. The conductive member according to claim 1, wherein the conductive member is formed by winding a conductive member formed of a band plate with a conductive pin protruding from one side thereof in a tubular shape. The jig for plating a wafer according to any one of the above. 7. The apparatus according to claim 1, wherein said energizing pins are configured to be elastically pressed against a surface of the wafer sandwiched between the first holding member and the second holding member. The jig for plating a wafer according to any one of the above. 8. The current-carrying pin is bent at a plurality of positions so that a line connecting a tip portion and a root portion of the current-carrying pin is substantially perpendicular to the surface of the wafer sandwiched between the first holding member and the second holding member. 8. The jig for plating a wafer according to claim 7, wherein the jig is configured so that: 9. The wafer plating method according to claim 1, wherein at least a portion of the energizing pin that contacts the wafer is formed of a conductive elastic body. jig.