JPH11195859A - Device mounting structure - Google Patents
Device mounting structureInfo
- Publication number
- JPH11195859A JPH11195859A JP36902397A JP36902397A JPH11195859A JP H11195859 A JPH11195859 A JP H11195859A JP 36902397 A JP36902397 A JP 36902397A JP 36902397 A JP36902397 A JP 36902397A JP H11195859 A JPH11195859 A JP H11195859A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- hole
- emitting element
- base
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【課題】 素子を取付基板に確実に固定していない状態
での素子の動作を防止できる素子の基板取付構造を提供
する。
【解決手段】 貫通孔103の周囲に2つの電極パター
ン10−1,2を設けてなる取付基板100と、発光部
121と基部123とを有し基部123の上面に各電極
パターン10−1,2に接続する2つの端子を設けてな
る発光素子120とを具備する。発光素子120の発光
部121を貫通孔103に挿入して基部123を取付基
板100の下面に当接した状態で所定角度回動すること
によって発光素子120に設けた係合部を貫通穴103
の内周側面に係合させて固定すると共に基部123上面
に設けた2つの端子をそれぞれ電極パターン10−1,
2に当接せしめる。一方の電極パターン10−2は発光
部121を貫通孔103に挿入した際には端子に当接せ
ず、発光素子120を回動して始めて端子に当接する形
状・位置に形成されている。
(57) [Problem] To provide an element substrate mounting structure capable of preventing operation of an element in a state where the element is not securely fixed to a mounting substrate. SOLUTION: A mounting substrate 100 provided with two electrode patterns 10-1 and 10-2 around a through hole 103, and a light emitting unit 121 and a base 123 are provided. A light-emitting element 120 provided with two terminals connected to the light-emitting element 120. By inserting the light emitting portion 121 of the light emitting element 120 into the through hole 103 and rotating the base portion 123 by a predetermined angle in a state where the base portion 123 is in contact with the lower surface of the mounting substrate 100, the engaging portion provided on the light emitting element 120 is
The two terminals provided on the upper surface of the base 123 are fixed to the electrode patterns 10-1,
Make contact with 2. One electrode pattern 10-2 is formed in a shape and position in which the light emitting portion 121 does not come into contact with the terminal when the light emitting portion 121 is inserted into the through hole 103, but comes into contact with the terminal only after the light emitting element 120 is rotated.
Description
【0001】[0001]
【発明の属する技術分野】本発明は発光素子などの各種
素子の基板取付構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate mounting structure for various devices such as a light emitting device.
【0002】[0002]
【従来の技術】従来、例えば自動車のコンソールボック
スに取り付ける各種メータ等の機器を夜間に照明するた
め、その裏面側に固定する取付基板に直接発光素子を取
り付けることが行なわれている。2. Description of the Related Art Conventionally, in order to illuminate equipment such as various meters mounted on a console box of an automobile at night, a light emitting element has been directly mounted on a mounting substrate fixed to the back side thereof.
【0003】図4はこの種従来の取付基板100に、発
光素子120を取り付ける状態を示す斜視図である。同
図に示す取付基板100は硬質基板の上下面(図では下
面のみ示す)にそれぞれ図示しない所望の回路パターン
を印刷形成し、その所定位置にそれぞれ図示しない電子
部品を取り付け、さらに取付基板100の所定位置に貫
通孔103を設け、取付基板100の下面の貫通孔10
3の周囲に半円弧状の2つの電極パターン105,10
5を形成して構成されている。貫通孔103の形状は、
円形であってその外周の対向する部分から2つの突出部
103a,103aを設けた形状である。FIG. 4 is a perspective view showing a state where a light emitting element 120 is mounted on a conventional mounting board 100 of this kind. The mounting substrate 100 shown in the figure is formed by printing desired circuit patterns (not shown) on the upper and lower surfaces of the hard substrate (only the lower surface is shown in the figure), and mounting electronic components (not shown) at predetermined positions. A through hole 103 is provided at a predetermined position, and the through hole
3, two semicircular electrode patterns 105, 10
5 is formed. The shape of the through hole 103 is
It is circular and has a shape in which two protruding portions 103a, 103a are provided from opposing portions of the outer periphery.
【0004】一方図5は発光素子120を示す図であ
り、同図(a)は平面図、同図(b)は側面図である。
同図に示すように発光素子120は、略円板状の基部1
23の上に略円柱状の発光部(機能部)121を取り付
けて構成されている。[0004] On the other hand, Fig. 5 is a view showing a light emitting element 120, wherein Fig. 5 (a) is a plan view and Fig. 5 (b) is a side view.
As shown in the figure, the light emitting element 120 has a substantially disc-shaped base 1.
A light emitting unit (functional unit) 121 having a substantially cylindrical shape is attached on the light emitting unit 23.
【0005】基部123の上面には基部123の下面か
ら引き出したワイヤを切欠き125に引っ掻けて巻き回
すことで2つの棒状の端子127,127が形成されて
いる。[0005] On the upper surface of the base 123, two rod-shaped terminals 127, 127 are formed by scratching and winding the wire drawn from the lower surface of the base 123 into the notch 125.
【0006】また基部123の上面であって発光部12
1の根元の外周面には、基部123から逆L字状に突出
するような形状の2つの突起129,129を設けるこ
とで突起129,129と基部123の間に係合部13
0,130(図では一方のみ示す)を形成している。The light emitting section 12 on the upper surface of the base 123
By providing two protrusions 129, 129 having a shape protruding from the base 123 in an inverted L-shape on the outer peripheral surface at the base of the base 1, the engagement portion 13 is formed between the protrusions 129, 129 and the base 123.
0, 130 (only one is shown in the figure).
【0007】そして図4に示す取付基板100の下面側
からその貫通孔103に発光素子120の発光部121
を挿入してその基部123を取付基板100の下面に当
接する。このとき2つの突起129,129はそれぞれ
突出部103a,103aに挿入される。このとき基部
123上面に設けた端子127,127はそれぞれ電極
パターン105,105に当接する。そしてこの状態で
発光素子120を回動することによってその係合部13
0,130を貫通穴103の内周側面に挾み込ませるよ
うに係合して固定する。[0007] The light emitting portion 121 of the light emitting element 120 is inserted into the through hole 103 from the lower surface side of the mounting substrate 100 shown in FIG.
To make the base 123 contact the lower surface of the mounting board 100. At this time, the two protrusions 129, 129 are inserted into the protrusions 103a, 103a, respectively. At this time, the terminals 127 and 127 provided on the upper surface of the base 123 are in contact with the electrode patterns 105 and 105, respectively. By rotating the light emitting element 120 in this state, the engaging portion 13 is rotated.
0 and 130 are engaged and fixed so as to be sandwiched between the inner peripheral side surfaces of the through holes 103.
【0008】ここで端子127,127と電極パターン
105,105の接続状態を詳細に説明すると、まず基
部123を取付基板100の下面に当接した際に両者は
接触し、図6(a)に示す状態となる。そして発光素子
120を回動して取付基板100に固定する際に端子1
27,127は電極パターン105,105上を摺動し
て、図6(b)に示す位置に移動し、この位置において
両者の接続状態は保持される。Here, the connection state between the terminals 127, 127 and the electrode patterns 105, 105 will be described in detail. First, when the base 123 contacts the lower surface of the mounting substrate 100, they come into contact with each other, and FIG. The state shown in FIG. When the light emitting element 120 is rotated and fixed to the mounting board 100, the terminal 1
27, 127 slide on the electrode patterns 105, 105 and move to the position shown in FIG. 6B, where the connection between them is maintained.
【0009】なおこの発光素子120は球切れの場合が
あるので、発光素子120を取り替えるときには逆方向
に回動することで取付基板100の下面側から引き抜い
て取り外しができるように構成されている。Since the light emitting element 120 may be out of ball, the light emitting element 120 is configured to be able to be pulled out from the lower surface side of the mounting substrate 100 and removed when the light emitting element 120 is replaced by rotating in the opposite direction.
【0010】[0010]
【発明が解決しようとする課題】しかしながら上記従来
例にあっては、以下のような問題点があった。即ち機器
の組み立て工程時又は発光素子120の取替え時に、発
光素子120を取付基板100に取り付ようとして貫通
孔103に挿入したが、発光素子120を回動するのを
忘れて固定不良状態のままにしてしまう場合があるが、
そのような場合にも前述の図6(a)のように端子12
7,127は電極パターン105,105に当接してし
まうので、検査の際に電極パターン105,105間に
電圧を印加すると発光素子120に通電されて点灯して
しまい、その取り付けが確実に行なわれたと勘違いして
しまう恐れがあった。However, the above-mentioned prior art has the following problems. That is, at the time of assembling the device or replacing the light emitting element 120, the light emitting element 120 was inserted into the through hole 103 in order to attach the light emitting element 120 to the mounting board 100. But sometimes,
Even in such a case, as shown in FIG.
7, 127 are in contact with the electrode patterns 105, 105. When a voltage is applied between the electrode patterns 105, 105 at the time of inspection, the light emitting element 120 is energized and turned on, so that the light emitting element 120 is securely mounted. There was a risk of misunderstanding.
【0011】そしてこの取付基板100を取り付けた機
器がその後振動したりすると、前記発光素子120が取
付基板100から外れて点灯不良となってしまう。If the device on which the mounting board 100 is mounted subsequently vibrates, the light emitting element 120 is detached from the mounting board 100, resulting in defective lighting.
【0012】本発明は上述の点に鑑みてなされたもので
ありその目的は、素子が取付基板に確実に取り付けられ
ていない状態での素子の動作を確実に防止できる素子の
基板取付構造を提供することにある。The present invention has been made in view of the above points, and an object of the present invention is to provide an element substrate mounting structure capable of reliably preventing the operation of the element when the element is not securely mounted on the mounting substrate. Is to do.
【0013】[0013]
【課題を解決するための手段】上記問題点を解決するた
め本発明は、所定形状の貫通孔を設けるとともにその下
面の貫通孔の周囲に1以上の電極パターンを設けてなる
取付基板と、前記貫通孔に挿入される機能部と該貫通孔
を貫通しない形状の基部とを有し、前記基部に前記電極
パターンに接続する1以上の端子を設けると共に貫通孔
の内周側面に係合する係合部を設けてなる素子とを具備
し、前記素子の機能部を取付基板の下面側から貫通孔に
挿入してその基部を取付基板の下面に当接した状態で回
動することによってその係合部を貫通穴の内周側面に係
合せしめて固定すると共に前記端子を前記電極パターン
に当接せしめる構造の素子の基板取付構造において、前
記電極パターンの少なくとも1つを、前記素子の機能部
を前記貫通孔に挿入した際には端子に当接せず、素子を
回動した際に端子に当接する位置に形成して構成した。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a mounting substrate having a through hole having a predetermined shape and one or more electrode patterns provided around the through hole on the lower surface thereof. A functional part inserted into the through-hole and a base not shaped to penetrate through the through-hole, provided with one or more terminals connected to the electrode pattern on the base, and engaged with an inner peripheral side surface of the through-hole; A functional part of the element is inserted into the through-hole from the lower surface side of the mounting substrate, and the base is rotated in a state of contacting the lower surface of the mounting substrate, thereby turning on the element. In a substrate mounting structure of an element having a structure in which a joining portion is engaged with and fixed to an inner peripheral side surface of a through hole and the terminal is brought into contact with the electrode pattern, at least one of the electrode patterns is provided with a functional part of the element. Insert into the through hole When the do not abut the terminal, and configured by forming a position abutting the terminal upon rotating the device.
【0014】[0014]
【発明の実施の形態】以下、本発明の実施形態を図面に
基づいて詳細に説明する。図1は本発明の一実施形態に
かかる発光素子の基板取付構造を示す斜視図である。同
図において前記従来例と相違する点は、取付基板100
の下面に形成する電極パターン10−1,10−2の形
状のみである。それ以外の部分については同一符号を付
してその詳細な説明は省略する。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing a substrate mounting structure of a light emitting device according to one embodiment of the present invention. The difference from the conventional example in FIG.
Are only the shapes of the electrode patterns 10-1 and 10-2 formed on the lower surface of. The other parts are denoted by the same reference numerals, and detailed description thereof will be omitted.
【0015】即ち同図においても前記従来例と同様に、
取付基板100の下面側から発光素子120の発光部1
21を挿入してその基部123を取付基板100の下面
に当接することで2つの突起129,129をそれぞれ
突出部103a,103aに挿入し、この状態で発光素
子120を回動することによってその係合部130,1
30(図5参照)を貫通穴103の内周側面に挾み込ま
せるように係合して固定する構造である。That is, in FIG.
The light emitting section 1 of the light emitting element 120 from the lower surface side of the mounting substrate 100
The two protrusions 129 and 129 are inserted into the protrusions 103a and 103a, respectively, by inserting the base 21 into contact with the lower surface of the mounting board 100, and the light emitting element 120 is rotated by rotating the light emitting element 120 in this state. Joint 130,1
30 (see FIG. 5) is engaged with and fixed to the inner peripheral side surface of the through hole 103.
【0016】ここで取付基板100下面の電極パターン
10−1,10−2の内の一方の電極パターン10−1
は前記従来例と同様に、両突起部103a,103a間
にわたって円弧状に形成されているが、他方の電極パタ
ーン10−2は電極パターン10−1の略半分の範囲の
みに形成されている。Here, one of the electrode patterns 10-1 and 10-2 on the lower surface of the mounting board 100 is used.
Is formed in an arc shape between the two protrusions 103a, 103a, as in the conventional example, but the other electrode pattern 10-2 is formed only in a range approximately half of the electrode pattern 10-1.
【0017】さらに具体的に言うと電極パターン10−
2は、図2(a)に点線で示すように、発光素子120
の発光部121を貫通孔103に挿入して基部123を
取付基板100の下面に当接した際は端子127に当接
せず(このとき電極パターン10−1はもう一方の端子
127に当接する)、発光素子120を回動して固定し
ようとする際に始めて当接する位置に形成されている。
つまり発光素子120を回動して固定した際は図2
(b)に示すように両電極パターン10−1,2がとも
に端子127,127に接触し、この位置において両者
の接続状態は保持される。More specifically, the electrode pattern 10-
2 is a light emitting element 120 as shown by a dotted line in FIG.
When the light emitting portion 121 is inserted into the through hole 103 and the base portion 123 is in contact with the lower surface of the mounting board 100, the light emitting portion 121 does not contact the terminal 127 (at this time, the electrode pattern 10-1 contacts the other terminal 127). ), The light emitting element 120 is formed at a position where the light emitting element 120 comes into contact only when the light emitting element 120 is to be rotated and fixed.
That is, when the light emitting element 120 is rotated and fixed, FIG.
As shown in (b), both the electrode patterns 10-1 and 10-2 are in contact with the terminals 127 and 127, and the connection between them is maintained at this position.
【0018】つまり本発明によれば、機器の組み立て工
程時又は発光素子120の取替え時に、発光素子120
を取付基板100に取り付ようとして貫通孔103に挿
入したが、発光素子120を回動するのを忘れて固定不
良状態のままにしてしまう場合があるが、このような場
合にも図2(a)のように一方の電極パターン10−2
と端子127は接触していないので、検査の際に電極パ
ターン10−1,2間に電圧を印加しても発光素子12
0には通電されず点灯せず、その取り付けが不良である
ことが検出できる。That is, according to the present invention, the light emitting element 120
Is inserted into the through-hole 103 in order to attach the light-emitting element 120 to the mounting substrate 100. However, there is a case where the light-emitting element 120 is forgotten to rotate and is left in a fixing failure state. In such a case, FIG. One electrode pattern 10-2 as in a)
And the terminal 127 are not in contact with each other, so that even if a voltage is applied between the electrode patterns 10-1 and 10-2 at the time of inspection, the light emitting element 12
0 is not energized and does not light up, and it can be detected that the attachment is defective.
【0019】一方発光素子120を回動して取付基板1
00に固定した際は図2(b)のように両電極パターン
10−1,2が共に端子127,127に接続されるの
で、点灯可能となる。On the other hand, the light emitting element 120 is rotated to mount the mounting substrate 1.
When fixed to 00, both electrode patterns 10-1 and 10-2 are both connected to terminals 127 and 127 as shown in FIG.
【0020】以上のことから取付基板100への発光素
子120の取り付け不良を容易に発見できる。From the above, it is possible to easily find a defective mounting of the light emitting element 120 on the mounting substrate 100.
【0021】ところで電極パターン10−1,2の形状
は種々の変形が可能であり、例えば図3に示すように、
両電極パターン10−1,2共に、発光素子120を貫
通孔103に挿入した際に端子127,127が当接し
ないように小さく形成してもよい。また電極パターンの
数は1つ又は3つ以上であっても良い。Incidentally, the shapes of the electrode patterns 10-1 and 10-2 can be variously modified. For example, as shown in FIG.
Both the electrode patterns 10-1 and 10-2 may be formed small so that the terminals 127 and 127 do not abut when the light emitting element 120 is inserted into the through hole 103. The number of electrode patterns may be one or three or more.
【0022】要は電極パターンの少なくとも1つが、発
光素子を取付基板の貫通孔に挿入しただけでは発光素子
の端子に当接せず、発光素子を回動して始めて当接する
位置に形成されていればよい。The point is that at least one of the electrode patterns is formed at a position where the light emitting element does not come into contact with the terminal of the light emitting element by merely inserting the light emitting element into the through hole of the mounting substrate, but comes into contact only after the light emitting element is rotated. Just do it.
【0023】また図7に示すように電極パターン10−
2と同一側にダミー用パターン11を設け、電極パター
ン10−2とダミー用パターン11で略半円弧状になる
ようにし、両者の間に円周方向に対して斜めとなるよう
な溝13を設けるようにしても良い。ダミー用パターン
11には何ら回路パターンは接続されていない。Further, as shown in FIG.
2, a dummy pattern 11 is provided on the same side as the electrode pattern 10-2, and the electrode pattern 10-2 and the dummy pattern 11 are formed into a substantially semicircular arc shape. It may be provided. No circuit pattern is connected to the dummy pattern 11.
【0024】このように構成しておけば、発光素子12
0の発光部121を貫通孔103に挿入した際はダミー
用パターン11が端子127に当接し、回動するとダミ
ー用パターン11から電極パターン10−2に当接して
いくが、両パターン10−2,11は同一面なので、端
子127の移動がスムーズで、該移動の際に電極パター
ン10−2の端部において端子127が基板面から乗り
上げることで剥がれが生じるなどの問題が生じない。With this configuration, the light emitting element 12
When the light-emitting portion 121 of No. 0 is inserted into the through-hole 103, the dummy pattern 11 contacts the terminal 127, and when rotated, the dummy pattern 11 contacts the electrode pattern 10-2. , And 11 are on the same surface, so that the movement of the terminal 127 is smooth, and there is no problem such that the terminal 127 runs off the substrate surface at the end of the electrode pattern 10-2 during the movement.
【0025】また取付基板100に取り付ける素子は発
光素子120に限定されず、他の種々の用途に用いる素
子であっても良い。要は取付基板の貫通孔に挿入される
機能部と該貫通孔を貫通しない形状の基部とを有し、基
部に取付基板に設けた電極パターンに接続する端子を設
けると共に貫通孔の内周側面に係合する係合部を設けて
なる構造の素子であればどのような素子であっても良
い。The element mounted on the mounting substrate 100 is not limited to the light emitting element 120, and may be an element used for various other purposes. In short, it has a functional part inserted into the through-hole of the mounting board and a base that does not penetrate the through-hole. The base has a terminal connected to the electrode pattern provided on the mounting board, and the inner peripheral side surface of the through-hole. Any element may be used as long as it is an element having a structure provided with an engaging portion that engages with.
【0026】[0026]
【発明の効果】以上詳細に説明したように本発明によれ
ば、電極パターンの形成位置を修正するという簡単な設
計変更のみであるにもかかわらず、素子を取付基板に確
実に固定していない状態では素子が動作することを確実
に防止できるという優れた効果を有する。As described in detail above, according to the present invention, the element is not securely fixed to the mounting substrate despite the simple design change of correcting the formation position of the electrode pattern. In the state, there is an excellent effect that the element can be reliably prevented from operating.
【図1】本発明の一実施形態にかかる発光素子の基板取
付構造を示す斜視図である。FIG. 1 is a perspective view showing a substrate mounting structure of a light emitting device according to an embodiment of the present invention.
【図2】端子127,127と電極パターン10−1,
2の接続過程の説明図である。FIG. 2 shows terminals 127, 127 and electrode patterns 10-1,
FIG. 4 is an explanatory diagram of a connection process of No. 2;
【図3】他の形状の電極パターン10−1,2を示す要
部拡大図である。FIG. 3 is an enlarged view of a main part showing electrode patterns 10-1 and 10-2 having other shapes.
【図4】従来の発光素子の基板取付構造を示す斜視図で
ある。FIG. 4 is a perspective view showing a conventional light emitting element substrate mounting structure.
【図5】発光素子120を示す図であり、同図(a)は
平面図、同図(b)は側面図である。5A and 5B are diagrams showing a light emitting element 120, FIG. 5A is a plan view, and FIG. 5B is a side view.
【図6】端子127,127と電極パターン105,1
05の接続過程の説明図である。FIG. 6 shows terminals 127, 127 and electrode patterns 105, 1
It is explanatory drawing of the connection process of 05.
【図7】他の実施形態を示す要部拡大図である。FIG. 7 is an enlarged view of a main part showing another embodiment.
10−1,10−2 電極パターン 100 取付基板 103 貫通孔 120 発光素子(素子) 121 発光部(機能部) 123 基部 127 端子 130 係合部 10-1, 10-2 Electrode pattern 100 Mounting board 103 Through hole 120 Light emitting element (element) 121 Light emitting section (functional section) 123 Base 127 Terminal 130 Engaging section
Claims (1)
下面の貫通孔の周囲に1以上の電極パターンを設けてな
る取付基板と、 前記貫通孔に挿入される機能部と該貫通孔を貫通しない
形状の基部とを有し、前記基部に前記電極パターンに接
続する1以上の端子を設けると共に貫通孔の内周側面に
係合する係合部を設けてなる素子とを具備し、 前記素子の機能部を取付基板の下面側から貫通孔に挿入
してその基部を取付基板の下面に当接した状態で回動す
ることによってその係合部を貫通穴の内周側面に係合せ
しめて固定すると共に前記端子を前記電極パターンに当
接せしめる構造の素子の基板取付構造において、 前記電極パターンの少なくとも1つは、前記素子の機能
部を前記貫通孔に挿入した際には端子に当接せず、素子
を回動した際に端子に当接する位置に形成されているこ
とを特徴とする素子の基板取付構造。1. A mounting board having a through hole of a predetermined shape and one or more electrode patterns provided around the through hole on the lower surface thereof, a functional part inserted into the through hole, and not penetrating the through hole. A base having a shape, and an element having at least one terminal connected to the electrode pattern on the base and an engaging portion engaging with an inner peripheral side surface of the through hole. The functional portion is inserted into the through hole from the lower surface side of the mounting substrate, and the base portion is rotated while being in contact with the lower surface of the mounting substrate, so that the engaging portion is engaged with the inner peripheral side surface of the through hole and fixed. And a substrate mounting structure for an element having a structure in which the terminal is brought into contact with the electrode pattern, wherein at least one of the electrode patterns does not come into contact with the terminal when the functional part of the element is inserted into the through hole. , When the element is turned A substrate mounting structure for an element, wherein the substrate mounting structure is formed at a position where the element contacts an element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36902397A JPH11195859A (en) | 1997-12-26 | 1997-12-26 | Device mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP36902397A JPH11195859A (en) | 1997-12-26 | 1997-12-26 | Device mounting structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11195859A true JPH11195859A (en) | 1999-07-21 |
Family
ID=18493363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP36902397A Pending JPH11195859A (en) | 1997-12-26 | 1997-12-26 | Device mounting structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11195859A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109835264A (en) * | 2017-11-29 | 2019-06-04 | 宝沃汽车(中国)有限公司 | Glove box assembly and vehicle |
-
1997
- 1997-12-26 JP JP36902397A patent/JPH11195859A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109835264A (en) * | 2017-11-29 | 2019-06-04 | 宝沃汽车(中国)有限公司 | Glove box assembly and vehicle |
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