JPH11195563A - Apparatus and method for separating sample and manufacture of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for separating a substrate having a porous layer at the porous layer therefrom. SOLUTION: A bonding substrate 101, having a porous layer 101b is supported by substrate supporting portions 120 and 150, while being rotated. High-velocity and high-pressure water (jet) is jetted from a nozzle 102, and the resultant jet is passed into the bonding substrate 101. While the supporting portions 120, 150 permit the bonding substrate 101 to warp in the vicinity of the central portion of the bonding substrate 101 by the action of the water pressure injected thereinto, they hold the bonding substrate 101 so as to limit the degree of the warpage. In this way, a force from inside toward the outside (separating force) with respect to the bonding substrate 101 is efficiently acted thereon, and the bonding substrate 101 is prevented from cracking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for separating a sample, and a method for manufacturing a substrate. More particularly, the present invention relates to an apparatus and a method for separating a plate-shaped sample having a fragile layer therein by the fragile layer. The present invention relates to a method, a device for supporting a sample used in the device, and a method for manufacturing a substrate using the separation device.

[0002]

2. Description of the Related Art As a substrate having a single crystal Si layer on an insulating layer, a substrate (SOI substrate) having an SOI (silicon on insulator) structure is known. Devices using this SOI substrate have a number of advantages that cannot be achieved with a normal Si substrate. The advantages include, for example, the following. (1) Dielectric separation is easy and suitable for high integration. (2) Excellent radiation resistance. (3) The stray capacitance is small, and the operation speed of the element can be increased. (4) No well step is required. (5) Latch-up can be prevented. (6) A complete depletion type field effect transistor can be formed by thinning.

[0003] Since the SOI structure has various advantages as described above, research on a forming method thereof has been advanced in recent decades.

As an SOI technique, SOS (silicon on s) is conventionally formed by forming Si on a single crystal sapphire substrate by heteroepitaxial growth by a CVD (chemical vapor deposition) method.
apphire) technology is known. Although this SOS technology has gained a reputation as the most mature SOI technology,
Practical due to large number of crystal defects due to lattice mismatch at the interface between the Si layer and the underlying sapphire substrate, mixing of aluminum constituting the sapphire substrate into the Si layer, cost of the substrate, delay in increasing the area, etc. Has not progressed.

Following SOS technology, SIMOX (separa
tion by ion implanted oxygen) technology has emerged. With respect to the SIMOX technology, various methods have been attempted with the aim of reducing crystal defects and reducing manufacturing costs. As this method, a method of implanting oxygen ions into a substrate to form a buried oxide layer, bonding two wafers with an oxide film interposed therebetween, and polishing or etching one of the wafers to form a thin single-crystal Si layer A method of leaving on an oxide film, furthermore, hydrogen ions are implanted at a predetermined depth from the surface of the Si substrate on which the oxide film is formed, and after bonding with the other substrate, a thin film is formed on the oxide film by heat treatment or the like. A method of removing the bonded substrate (the other substrate) while leaving the single crystal Si layer, or the like can be given.

The present applicant has disclosed a new SOI technique in Japanese Patent Application Laid-Open No. Hei 5-21338. According to this technique, a first substrate in which a non-porous single-crystal layer (SiO ₂ ) is formed on a single-crystal semiconductor substrate in which a porous layer is formed is separated from an insulating layer (Si).
O ₂ ) is applied to the second substrate, the two substrates are separated by a porous layer, and the non-porous single crystal layer is transferred to the second substrate. This technique has excellent thickness uniformity of the SOI layer, can reduce the crystal defect density of the SOI layer, has good surface flatness of the SOI layer,
Eliminates the need for expensive special equipment
It is excellent in that an SOI substrate having an SOI film in the range of about Å to 10 μm can be manufactured by the same manufacturing apparatus.

[0007] Further, the applicant of the present invention has disclosed Japanese Patent Application Laid-Open No. 7-30288.
In No. 9, after the first substrate and the second substrate are bonded to each other, the first substrate is separated from the second substrate without breaking, and then the separated surface of the first substrate is removed. A technique has been disclosed in which a porous layer is formed again after smoothing and reused. This technique has excellent advantages that the first substrate can be used without waste, so that the manufacturing cost can be greatly reduced and the manufacturing process is simple.

[0008]

In the above technique, when the two substrates are separated from each other, there is no damage to both substrates, and there is little contamination of the substrate and the manufacturing apparatus due to generation of particles. Is required.

The present invention has been made in view of the above circumstances, and a separation apparatus and method suitable for separating a sample such as a substrate, a sample supporting apparatus used in the separation apparatus,
It is another object of the present invention to provide a method for manufacturing a substrate using the separation device.

[0010]

SUMMARY OF THE INVENTION A sample separation apparatus according to the present invention is a separation apparatus for separating a plate-shaped sample having a fragile layer therein by the fragile layer, wherein a fluid is directed toward the sample. An ejecting unit for ejecting the sample, and a pair of holding units for holding the sample so as to sandwich the sample from both sides; the pair of holding units are configured such that two samples of the sample are formed by the pressure of the fluid ejected from the ejecting unit and injected into the sample. It is characterized in that it is allowed to bend in such a way that it is divided into two, while limiting the amount of warpage.

In the above separation apparatus, it is preferable that at least one of the pair of holding portions has, for example, a smooth convex support surface, and the sample is held by the support surface.

[0012] In the above separation apparatus, the support surface may include:
For example, it is preferably substantially a part of a spherical surface.

[0013] In the above separating apparatus, the support surface may include:
For example, it is preferable that the top is a surface formed by a cone having a convex surface.

In the above separating apparatus, the support surface may be:
For example, it is preferable that the surface is a substantially frustoconical surface.

In the above separating apparatus, the support surface may be:
For example, it is preferable that the surface is a surface in which several truncated cones overlap to form a smooth convex shape as a whole.

In the above separation apparatus, the support surface may include:
For example, it is preferable that the surface is a surface in which several columns overlap to form a convex shape as a whole.

In the above separating apparatus, it is preferable that at least one of the pair of holding portions includes, for example, an elastic body and is deformed by a force received from a sample.

In the above-described separation apparatus, it is preferable that at least one of the pair of holding units has, for example, a support part at least partially composed of an elastic body, and the sample is held by the support part.

In the above-described separation apparatus, it is preferable that at least one of the pair of holding portions has, for example, a portion that can come into contact with a sample made of an elastic material.

In the above separating apparatus, it is preferable that at least one of the pair of holding portions has, for example, an annular support portion made of an elastic body.

In the above separating apparatus, it is preferable that at least one of the pair of holding portions has a support portion connected to the main body thereof via an elastic body, for example.

[0022] It is preferable that the separation device further includes a rotation mechanism for rotating the holding section about an axis provided in a direction perpendicular to the surface of the sample.

It is preferable that the separation device further includes an adjusting mechanism for adjusting a distance between the pair of holding portions.

In the above separating apparatus, it is preferable that the adjusting mechanism adjusts the interval between the pair of holding portions so as to press the sample when the sample is separated by a fluid.

In the above separation apparatus, it is preferable that the adjusting mechanism keeps, for example, the interval between the pair of holding portions substantially constant when separating the sample with the fluid.

In the above separation apparatus, it is preferable that the pair of holding units have an adsorption mechanism for adsorbing the sample in vacuum.

The above separation apparatus is suitable for processing for separating a substrate having a porous layer as a fragile layer.

The sample holding device according to the present invention is a sample supporting device used in a separation device for separating a plate-shaped sample having a fragile layer therein by the fragile layer, and holds the sample from both sides. Equipped with a pair of holding parts to hold
The pair of holding sections allow the sample to be divided into two pieces by the pressure of the fluid injected from the ejection section provided in the separation device and injected into the sample, and allow the sample to be warped. It is characterized by limiting the amount.

In the above supporting apparatus, it is preferable that at least one of the pair of holding portions has, for example, a smooth convex supporting surface, and the sample is held by the supporting surface.

In the above supporting device, the supporting surface is
For example, it is preferably substantially a part of a spherical surface.

In the above supporting device, the supporting surface is
For example, it is preferable that the top is a surface formed by a cone having a convex surface.

In the above supporting device, the supporting surface is
For example, it is preferable that the surface is a substantially frustoconical surface.

In the above supporting device, the supporting surface is
For example, it is preferable that the surface is a surface in which several truncated cones overlap to form a smooth convex shape as a whole.

In the above support device, the support surface is
For example, it is preferable that the surface is a surface in which several columns overlap to form a convex shape as a whole.

In the above support device, it is preferable that at least one of the pair of holding portions includes, for example, an elastic body and is deformed by a force received from the sample.

In the above-mentioned supporting apparatus, it is preferable that at least one of the pair of holding portions has, for example, a supporting portion at least partially constituted by an elastic body, and the sample is held by the supporting portion.

In the above support device, it is preferable that at least one of the pair of holding portions has, for example, a portion that can come into contact with the sample is formed of an elastic body.

In the above support device, it is preferable that at least one of the pair of holding portions has, for example, an annular support portion made of an elastic body.

In the above-mentioned supporting device, it is preferable that at least one of the pair of holding portions has, for example, a supporting portion connected to its main body via an elastic body.

[0040] It is preferable that the support device further includes a rotation mechanism for rotating the holding section about an axis provided in a direction perpendicular to the surface of the sample.

It is preferable that the support device further includes an adjusting mechanism for adjusting a distance between the pair of holding portions.

In the above supporting apparatus, it is preferable that the adjusting mechanism adjusts the interval between the pair of holding portions so as to press the sample when the sample is separated by the fluid.

In the above supporting apparatus, it is preferable that the adjusting mechanism keeps, for example, the interval between the pair of holding portions substantially constant when the sample is separated by the fluid.

In the above-mentioned supporting device, the pair of holding parts are
It is preferable to have an adsorption mechanism for vacuum-adsorbing the sample.

The above-described supporting device is suitable as a supporting device for supporting a substrate having a porous layer as a fragile layer and performing a separation process.

A sample separation method according to the present invention is characterized in that a sample having a fragile layer is separated using the above-described separation apparatus.

In the above separation method, it is preferable to use, for example, water as the fluid to be jetted from the jetting section.

In another separation method according to the present invention, the non-porous layer side of a first substrate having a porous layer and a non-porous layer formed on one surface in this order is bonded to a second substrate. A separation method for separating a substrate by the porous layer, wherein the separation device is used for the separation.

The method of manufacturing a substrate according to the present invention comprises the steps of: adhering the non-porous layer side of a first substrate having a porous layer and a non-porous layer formed on one surface in that order to a second substrate; A separation step of separating the bonded substrates by the porous layer, wherein the separation step,
It is characterized by using the above separation device.

[0050]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 14 is a view for explaining a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

In the step shown in FIG.
A substrate 11 is prepared, and a porous Si layer 12 is formed on the surface of the substrate 11 by anodization or the like. Next, in a step shown in FIG. 14B, a non-porous single-crystal Si layer 13 is formed on the porous Si layer 12 by an epitaxial growth method. Thereby, a first substrate () is formed.

In the step shown in FIG. 14C, first, an insulating layer (for example, an SiO ₂ layer) is formed on the surface of the single crystal Si substrate 14.
A second substrate () on which the first substrate (15) is formed is prepared, and the first substrate () and the second substrate () are separated at room temperature such that the non-porous single-crystal Si layer 13 and the insulating layer 15 face each other. Adhere.
After that, the first substrate () and the second substrate () are bonded to each other by anodic bonding, pressing, heat treatment, or a combination thereof. By this processing, the non-porous single-crystal Si layer 13 and the insulating layer 15 are firmly bonded. The insulating layer 15 may be formed on the single-crystal Si substrate 14 side as described above, may be formed on the non-porous single-crystal Si layer 13, or may be formed on both. When the first substrate and the second substrate are brought into close contact with each other, FIG.
The state shown in FIG.

In the step shown in FIG. 14D, the two bonded substrates are separated at the porous Si layer 12.
Thereby, the second substrate side ("+") is made of porous Si.
Layer 12 ″ / single-crystal Si layer 13 / insulating layer 15 / single-crystal Si
The substrate 14 has a laminated structure. On the other hand, the first substrate side (′) has a porous Si layer 1 on a single-crystal Si substrate 11.
The structure has 2 ′.

The substrate (') after the separation is used to form the first substrate () again by removing the remaining porous Si layer 12' and, if necessary, flattening the surface. Used as a single crystal Si substrate 11.

After separating the bonded substrates, FIG.
In the step shown in (e), the porous layer 12 '' on the surface of the second substrate side ("+") is selectively removed. This allows
A substrate having a stacked structure of single crystal Si layer 13 / insulating layer 15 / single crystal Si substrate 14, that is, a substrate having an SOI structure is obtained.

In this embodiment, FIG.
In the step shown in (2), that is, in the step of separating two bonded substrates (hereinafter, a bonded substrate), a high-pressure liquid or gas (fluid) is selectively applied to the porous Si layer as a separation region. A separation device that separates the substrate into two in the separation region by spraying is used.

[Basic Configuration of Separation Apparatus]
The water jet method was applied. In general,
In the water jet method, water (abrasive material is added when cutting hard material) is jetted at high speed and high pressure in a bundle to the object, and ceramics, metal, concrete, resin, rubber, This is a method of cutting and processing wood and the like, removing a coating film on the surface, cleaning the surface, and the like (see Water Jet Vol. 1, No. 1, page 4). Conventionally, the water jet method has been used for cutting, processing, removing a coating film, and cleaning the surface as described above by mainly removing a part of the material.

This separating apparatus jets a high-speed, high-pressure fluid in a bundle-like flow in the direction of the surface of the porous layer (separation region) of the bonded substrate, which is a fragile structure, in the plane direction of the substrate. The substrate is separated at the portion of the porous layer by selectively collapsing the porous layer. Hereinafter, this bundled flow is referred to as a “jet”. Further, the fluid constituting the jet is referred to as “jet constituting medium”. As a jet constituting medium, water, an organic solvent such as alcohol, hydrofluoric acid,
Nitric acid and other acids, potassium hydroxide and other alkalis, air, nitrogen gas, carbon dioxide gas, rare gas, etching gas and other gases, plasma and the like can be used.

When this separation apparatus is applied to a manufacturing process of a semiconductor device, for example, a separation process of a bonded substrate, it is preferable to use pure water from which impurity metals, particles and the like have been removed as much as possible. However, since this separation step is a completely low-temperature process, it is not always necessary to use high-purity water as a jet constituting medium, and the substrate can be washed after the separation step.

This separation device removes the porous layer from the outer peripheral portion toward the central portion by jetting a jet toward the porous layer (separation region) exposed on the side surface of the bonded substrate. As a result, the bonded substrate is separated into two substrates without damaging the main body portion, removing only the separation region having weak mechanical strength. Note that even when the side surface of the bonded substrate is covered with some thin layer and the porous layer is not exposed, the layer is removed by jetting, and thereafter, the bonding is performed in the same manner as described above. The mating substrate can be separated.

In order to separate the bonded substrates mainly only by the cutting force of the jet, it is necessary to apply a high pressure of, for example, several thousand kgf per square cm to the jet constituting medium. In this case, the outer peripheral portion of the bonded substrate is damaged, or the internal pressure in both the separation regions is increased,
There is a concern that the bonded substrate may be broken.

Therefore, in order to avoid this concern, the pressure applied to the jet forming medium is set to, for example, 500 / cm 2.
The pressure is preferably as low as about kgf. When such a low-pressure jet is employed, the bonded substrate is expanded by the jet-constituting medium injected inside, rather than colliding the jet with the porous layer and cutting the porous layer by the impact. Then, the bonded substrates are separated by separating the substrates from each other. Therefore, cutting chips are hardly generated and damage to the substrate is small. Furthermore, there is no need to mix abrasives with the jet-constituting medium.

At the periphery of the bonded substrate, the effect of separating the bonded substrate into two substrates as described above is as follows.
This is extremely effective when there is a V-shaped (concave) groove along the circumferential direction in the outer peripheral portion of the bonded substrate. FIG.
It is a figure which shows notionally the force which acts on the bonding board | substrate according to the presence or absence of the groove | channel of a type | mold. FIG. 15A shows a bonded substrate having a V-shaped groove 22, and FIG. 15B shows a bonded substrate having no V-shaped groove.

As shown in FIG. 15A, a V-shaped groove 22 is formed.
Is applied from the inside to the outside of the bonded substrate (hereinafter, separation force) as indicated by an arrow 23. On the other hand, as shown in FIG. 15B, in a bonded substrate having a convex outer peripheral portion,
As shown by an arrow 24, a force is applied from the outside to the inside of the bonded substrate. Therefore, in the bonded substrate whose outer peripheral portion has a convex shape, the separating force does not act unless the outer peripheral portion of the porous layer 12 which is the separation region is removed by the jet 21.

Even when a thin layer is formed on the surface of the outer peripheral portion of the bonded substrate, as shown in FIG. Since a separating force acts on the substrate, the layer can be easily broken.

The axial separating force applied to the bonded substrate is preferably, for example, about several hundred gf per square cm in order to prevent the substrate from being damaged.

For effective use of the jet, the width W1 of the opening of the V-shaped groove 22 is preferably equal to or greater than the diameter d of the jet 21. For example,
Consider a case where the first substrate () and the second substrate () are each about 1 mm thick and the bonded substrate is about 2 mm thick.
Since the width W1 of the opening of the V-shaped groove 22 is usually about 1 mm, the diameter of the jet is preferably 1 mm or less. A typical water jet device has a diameter of 0.1
Since a jet of about 0.5 mm is used, such a general water jet device (for example, a water jet nozzle) can be used.

Here, as the shape of the nozzle for jetting the jet, various shapes other than a circle can be adopted. For example, by adopting a slit-shaped nozzle and jetting a jet having an elongated rectangular cross section, the jet can be efficiently inserted (inserted between two substrates) into the separation region.

The jet injection conditions may be determined according to, for example, the type of the separation region (for example, the porous layer), the shape of the outer peripheral portion of the bonded substrate, and the like. The jet ejection conditions include, for example, the pressure applied to the jet constituting medium, the scanning speed of the jet, the width or diameter of the nozzle (substantially the same as the diameter of the jet), the nozzle shape, the distance between the nozzle and the separation region, the flow rate of the jet constituting medium. Are important parameters.

For the method of separating the bonded substrates, for example,
1) A method in which a jet is inserted parallel to the bonding surface in the vicinity of the bonding surface and the nozzle is scanned along the bonding surface, and 2) The nozzle is parallel to the bonding surface in the vicinity of the bonding surface. 3) a method in which a jet is inserted and a bonded substrate is scanned, and 3) a method in which a jet is inserted in parallel with the bonding surface with respect to the vicinity of the bonding surface and the jet is scanned in a fan shape with the nozzle vicinity as a hip. 4)
A method in which a jet is inserted in the vicinity of the bonding surface in parallel with the bonding surface and the bonded substrate is rotated about the center of the bonded substrate as an axis (particularly effective when the bonded substrate has a disk shape). ). Note that the jet does not necessarily need to be jetted completely parallel to the bonding surface.

FIG. 1 is a diagram showing a schematic configuration of a separation apparatus according to a preferred embodiment of the present invention. This separation device 10
In the case of 0, the separating substrate is efficiently applied to the bonded substrate in order to separate the bonded substrate by a low-pressure jet, while the separating substrate is prevented from being broken by the separating force. Support the substrate. As a specific example, the separation apparatus 100 allows the bonded substrate to be warped by the pressure of the jet constituting medium injected therein during the separation processing, The bonded substrate is supported in a limited amount.

The separating apparatus 100 has substrate holding parts 120 and 150 provided with a vacuum suction mechanism, and holds the bonded substrate 101 by sandwiching the bonded substrate 101 from both sides. The bonded substrate 101 has a porous layer 101b, which is a fragile component, inside, and is separated into two substrates 101a and 101c at the portion of the porous layer 101b by the separating device 100. In the separation apparatus 100, for example, the substrate 101a is set so as to be on the first substrate side (') in FIG. 1 and the substrate 101c is set on the second substrate side ("+") in FIG.

The substrate holders 120 and 150 exist on the same rotation axis. The substrate holding unit 120 includes the bearing 10
The rotation shaft 104 is connected to one end of a rotation shaft 104 rotatably supported by a support table 109 via the shaft 8, and the other end of the rotation shaft 104 is connected to a rotation shaft of a motor 110. Therefore, the rotation force generated by the motor 110 causes the substrate holding unit 120 to rotate.
Then, the bonded substrate 101 vacuum-adsorbed to the substrate rotates. The motor 110 rotates the rotation shaft 104 at a designated rotation speed in accordance with a command from a controller (not shown) when the bonded substrate 101 is separated.

The substrate holding section 150 is connected to one end of a rotating shaft 103 slidably and rotatably supported by a supporting table 109 via a bearing 111, and the other end of the rotating shaft 103 is connected to the supporting table 109. Air cylinder 112 fixed to
It is connected to. The air cylinder 112 is
Is extruded, the bonded substrate 101 is pressed by the substrate holding unit 150.

The substrate supports 120 and 150 can be removed from the rotating shafts 104 and 103, respectively. In addition, one or a plurality of suction units (for example, annular grooves) 181 and 182 are respectively provided on the substrate support units 120 and 150 as a vacuum suction mechanism.
The suction portions 181 and 182 pass through the rotation shafts 104 and 103, respectively, and
a, 103a. Rotary seal part 104a, 1
03a is connected to vacuum lines 104b and 103b, respectively. An electromagnetic valve is attached to these vacuum lines 104b and 103b, and by controlling this electromagnetic valve, attachment and detachment of the bonded substrate 101 can be controlled.

The substrate supporting portions 120 and 150 hold the bonded substrate 101 so that the separating force acts on the bonded substrate 101 efficiently during the separation process. Substrate holder 1
A specific configuration example of 20, 150 will be described later.

Hereinafter, the substrate separation processing by the separation apparatus 100 will be described.

The separation substrate 100 is attached to the
In order to set 1, first, the rotation shaft 103 is housed in the air cylinder 112 to provide a corresponding distance between the suction surfaces of the substrate holding units 120 and 150. Next, after the bonded substrate 101 is placed on the positioning shaft 113, the rotating shaft 103 is pushed out by the air cylinder 112, whereby the bonded substrate 1 is formed.
01 is pressed and held (the state shown in FIG. 1). Note that the positioning shaft 113 is rotatably supported by the support table 109 via bearings 105 and 107.

In this embodiment, the bonded substrate 10
1 is held by the pressure applied by the air cylinder 112, not by vacuum suction. For example, the response pressure is preferably, for example, about 3 kgf. However, it is of course possible to hold the bonded substrate 101 by vacuum suction. Here, during the separation process, it is preferable to control the air cylinder 112 so that the distance between the substrate holding unit 120 and the substrate holding unit 150 is maintained substantially constant.

Next, a jet forming medium (for example, water) is sent from the pump 114 to the nozzle 102,
Wait until the jet injected from 2 stabilizes. When the jet is stabilized, the shutter 106 is opened, and the jet is inserted near the separation region of the bonded substrate 101. At this time, the bonded substrate 101 is rotated by the motor 110. At this time, the rotating shaft 104, the substrate holding unit 120, the bonded substrate 101, the substrate holding unit 150, and the rotating shaft 10
3 rotates integrally.

When the jet is sandwiched, a separation force is exerted on the bonded substrate 101 by the pressure of the jet constituting medium continuously injected into the porous layer 101b, which is a fragile structure. The porous layer 101b connecting 101a and 101c is destroyed. By this processing, the bonded substrate 101 is separated into two substrates in about two minutes, for example.

When the bonded substrate 101 is separated into two substrates, the shutter 106 is closed and the pump 114
Stop the operation of. Further, by stopping the rotation of the motor 110 and controlling the above-described solenoid valve, the substrate holding unit 1
The separated substrates are vacuum-adsorbed to the substrates 20 and 150, respectively.

Next, the rotating shaft 103 is attached to the air cylinder 112.
Is accommodated, the two physically separated substrates are separated from each other by breaking the surface tension of the jet constituting medium (for example, water).

In order to effectively apply a separating force to the bonded substrate 101 while preventing the bonded substrate 101 from breaking, it is necessary to devise the structure of the substrate holding units 120 and 150. In this embodiment, at the time of the separation process,
While ensuring the space for the bonded substrate 101 to warp, the separating force is effectively applied, while limiting the amount of warpage, the bonded substrate 101 is prevented from cracking.

Hereinafter, examples of preferred configurations of the substrate holding unit will be listed. In the following configuration example, the pair of opposing substrate holding portions has a symmetric structure, but both may have a separate structure.

[First Configuration Example of Substrate Holding Unit] FIGS. 2 to 4 show a substrate holding unit 120 according to a first configuration example of the present invention.
FIG. 2 is a diagram illustrating a configuration of a second embodiment. FIG. 2 is a perspective view, FIG. 3 is a sectional view showing a state before separation processing, and FIG. 4 is a sectional view showing a state during separation processing.

The substrate holders 120 and 15 according to this configuration example
Numeral 0 has supporting surfaces 120a and 150a each formed of a part of a spherical surface and formed of a convex surface. This support surface 120a, 1
50a is a surface that supports the bonded substrate 101 in a state where the bonded substrate 101 can warp, and also a surface that restricts excessive warping of the bonded substrate 101 during the separation process. . Here, the warp amount h is, for example, 0.1
It is preferable to set it to about 0.5 mm.

When the separating apparatus 100 having such substrate holding parts 120 and 150 is used, the bonded substrate 101
In about 30 seconds after the insertion of the jet (separation process) with respect to the
Separation proceeds to near the center of 0a, 150a. At this time, the portions of the bonded substrate 101 that are separated into two are respectively supported by the support surfaces 120a as shown in FIG. 4 due to the pressure (separation force) of the jet constituting medium injected into the bonded substrate 101. , 150a. Then, by further performing the separation process, the bonded substrate 101 is completely separated in about two minutes after the start of the separation process.

As described above, by holding the bonded substrate 101 in a state where the bonded substrate 101 can warp, the separating force can be efficiently applied, and the separation processing can be performed efficiently. Can be. On the other hand, bonded substrate 1
By limiting the amount of warpage of 01, the separated substrate can be prevented from being excessively warped and the bonded substrate 101 can be prevented from cracking.

As described above, in order to disperse the stress acting on the bonded substrate 101, the support surfaces 120a and 150a are preferably spherical, but the contact surfaces need not necessarily be spherical. Hereinafter, as a modified example of the substrate holding units 120 and 150 according to this configuration example, a configuration example of the substrate holding unit having a smooth convex surface will be described.

FIGS. 5 to 8 show the substrate holders 120 and 120, respectively.
It is sectional drawing which shows the modification of 150. The substrate holding parts 121 and 151 shown in FIG. 5 have support surfaces 121a and 151a in which the apex of the cone is formed as a convex surface. The substrate holding units 122 and 152 shown in FIG. 6 have support surfaces 122a and 152a formed by frusto-conical surfaces. The substrate holding portions 123 and 153 shown in FIG. 7 have support surfaces 123a and 153a which are formed by stacking several truncated cones and forming convex surfaces as a whole. The substrate holding parts 124 and 15 shown in FIG. 8 have support surfaces 124a and 154a which are formed by stacking a plurality of cylinders and forming convex surfaces as a whole.

As shown in FIGS. 2 to 8, it is preferable that the substrate holding portion has a diameter capable of supporting the entire surface of the bonded substrate 101, but it is more than half the diameter of the bonded substrate 101. With a diameter of, a corresponding effect is exhibited. However, the present invention does not exclude a substrate holding portion having a diameter of less than half of the bonded substrate.

The substrate holding portion is preferably disk-shaped, but may have a radial, grid-like or other structure.

[Second Configuration Example of Substrate Holding Unit] FIGS. 9 and 10 are sectional views showing the configuration of the substrate holding unit according to the second configuration example of the present invention. FIG. 9 is a diagram showing a state before the separation process, and FIG. 10 is a diagram showing a state during the separation process. In addition,
The illustrated substrate holders 125 and 155 are used to replace the substrate holders 120 and 150 shown in FIG. 1, respectively.

The substrate holders 125 and 15 according to this configuration example
Reference numeral 5 denotes a disk-shaped support portion 125b, 1 made of an elastic body (for example, rubber) on a disk-shaped main body 125a, 155a, respectively.
55b is attached. This support 125b,
155b is a member that supports the bonded substrate 101 in a state where the bonded substrate 101 can warp, and also a member that restricts excessive warping of the bonded substrate 101 during the separation process. . Here, the warp amount h is preferably, for example, about 0.1 to 0.5 mm.

When the separation apparatus 100 having such substrate holding portions 125 and 155 is used, the bonded substrate 101
About 30 seconds after the start of the (separation process), the separation proceeds from the outer periphery of the bonded substrate 101 to the vicinity of the center thereof. At this time, the part of the bonded substrate 101 that has been separated into two sheets is caused by the pressure (separation force) of the jet constituting medium injected into the bonded substrate 101, as shown in FIG.
Open in a V-shape. At this time, the amount of warpage of the bonded substrate 101 is an amount that balances the separation force with the resistance of the support portions 125b and 155b. Then, by further performing the separation process, the bonded substrate 101 is obtained in about two minutes after the start of the separation process.
Are completely separated.

By holding the bonded substrate 101 in such a state that the bonded substrate 101 can warp, the separating force can be efficiently applied, and the separating process can be performed efficiently. it can. On the other hand, the bonded substrate 10
By limiting the amount of warpage of 1, the separated substrate can be prevented from being excessively warped, and the bonded substrate 101 can be prevented from breaking.

As described above, in order to disperse the stress acting on the bonded substrate 101, the support portions 125b, 155
It is preferable that the entire surface of b is formed of an elastic body, but it is not always necessary that the entire surface of the support portion is formed of an elastic body. Also,
As described above, the substrate holding portion preferably has a diameter capable of supporting the entire surface of the bonded substrate 101. However, a diameter equal to or more than half the diameter of the bonded substrate 101 exhibits a corresponding effect. . Hereinafter, modified examples of the substrate holding units 125b and 155b according to this configuration example will be described.

FIG. 11 to FIG.
It is sectional drawing which shows the modified example of 5,155. In the substrate holding portions 126 and 156 shown in FIG. 11, the second support portions 126b and 156b made of an annular elastic body (for example, rubber) are fitted into the first support portions 126a and 156a having a convex cross-section. It becomes. The substrate holding units 127 and 15 shown in FIG.
Reference numeral 7 denotes a disk-shaped first support portion 127a having a convex cross section.
O-ring-shaped second support portions 127b and 157b made of an elastic body (for example, rubber) are fitted into 157a.
The substrate holding portions 128 and 158 shown in FIG. 13 have main bodies 128a and 158a having a convex cross section,
a, coil springs 128b, 158 connected to 158a
b, and the annular support portions 128c, 158c connected to the other ends of the coil springs 128b, 158b.

The above-described separation apparatus can be used not only for bonding substrates and other semiconductor substrates, but also for separating various samples.

The characteristic technical ideas have been described with reference to the specific embodiments. However, the present invention is not limited to the matters described in these embodiments.
Various modifications can be made within the scope of the technical idea described in the claims.

[0103]

According to the present invention, it is possible to suppress the damage to the sample to be separated and to increase the efficiency of the separation process.

Further, according to the present invention, a good substrate can be manufactured.

[0105]

[Brief description of the drawings]

FIG. 1 is a diagram showing a schematic configuration of a separation device according to a preferred embodiment of the present invention.

FIG. 2 is a perspective view of a substrate holding unit according to a first configuration example of the present invention.

FIG. 3 is a cross-sectional view of a substrate holding unit according to a first configuration example of the present invention.

FIG. 4 is a sectional view of a substrate holding section according to a first configuration example of the present invention.

FIG. 5 is a sectional view showing a modification of the substrate holding unit according to the first configuration example of the present invention.

FIG. 6 is a sectional view showing a modification of the substrate holding unit according to the first configuration example of the present invention.

FIG. 7 is a cross-sectional view showing a modification of the substrate holding unit according to the first configuration example of the present invention.

FIG. 8 is a sectional view showing a modification of the substrate holding unit according to the first configuration example of the present invention.

FIG. 9 is a cross-sectional view illustrating a modification of the substrate holding unit according to the second configuration example of the present invention.

FIG. 10 is a sectional view showing a modification of the substrate holding unit according to the second configuration example of the present invention.

FIG. 11 is a cross-sectional view illustrating a modification of the substrate holding unit according to the second configuration example of the present invention.

FIG. 12 is a cross-sectional view illustrating a modification of the substrate holding unit according to the second configuration example of the present invention.

FIG. 13 is a cross-sectional view illustrating a modification of the substrate holding unit according to the second configuration example of the present invention.

FIG. 14 is a diagram illustrating a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

FIG. 15 is a diagram conceptually showing a force acting on a bonded substrate depending on the presence or absence of a V-shaped groove.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Single-crystal Si substrate 12, 12 ', 12' 'Porous Si layer 12 13 Non-porous single-crystal Si layer 14 Single-crystal Si substrate 15 Insulating layer 100 Substrate separation device 101 Bonded substrate 101a Substrate 101b Porous layer 101c Substrate 102 Nozzle 103, 104 Rotary shaft 103a, 104a Rotary seal 103b, 104b Vacuum line 105, 107 Bearing 106 Shutter 108, 111 Bearing 109 Support 110 Motor 112 Air cylinder 120-128, 150-158 Substrate holder 181, 182 Suction Department

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takao Yonehara 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc.

Claims (40)

[Claims] 1. A separation device for separating a plate-shaped sample having a fragile layer therein by the fragile layer, the jetting unit jetting a fluid toward the sample, and holding the sample so as to sandwich the sample from both sides. A pair of holding portions, wherein the pair of holding portions allow the sample to be divided into two pieces by the pressure of the fluid injected from the jetting portion and injected into the sample, and to be warped. A separating device for limiting the amount of warpage. 2. At least one of the pair of holding parts,
2. The separation device according to claim 1, wherein the separation device has a smooth convex support surface, and the sample is held by the support surface. 3. The separation device according to claim 2, wherein the support surface is substantially a part of a spherical surface. 4. The separation device according to claim 2, wherein the support surface is a surface formed by a cone having a convex top. 5. The separation device according to claim 2, wherein the support surface is a surface formed by a substantially frustoconical surface. 6. The separation apparatus according to claim 2, wherein the support surface is a surface having a plurality of truncated cones overlapping one another to form a smooth convex shape as a whole. 7. The separation device according to claim 2, wherein the support surface is a surface in which a plurality of columns overlap each other to form a convex shape as a whole. 8. At least one of the pair of holding portions,
The separation device according to claim 1, wherein the separation device includes an elastic body and is deformed by a force received from the sample. 9. At least one of said pair of holding parts,
2. The apparatus according to claim 1, further comprising a support portion at least partially formed of an elastic body, wherein the support portion holds the sample.
The separation device according to claim 1. 10. The separation apparatus according to claim 1, wherein at least one of the pair of holding portions has a portion that can come into contact with a sample made of an elastic body. 11. The separation device according to claim 1, wherein at least one of the pair of holding portions has an annular support portion made of an elastic body. 12. The separation device according to claim 1, wherein at least one of the pair of holding portions has a supporting portion connected to a main body thereof via an elastic body. 13. The apparatus according to claim 1, further comprising a rotation mechanism configured to rotate the holding section around an axis provided in a direction orthogonal to a surface of the sample. The separation device according to any one of the preceding claims. 14. The separation device according to claim 1, further comprising an adjustment mechanism for adjusting a distance between the pair of holding portions. 15. The separation device according to claim 14, wherein the adjusting mechanism adjusts a distance between the pair of holding portions so as to press the sample when the sample is separated by a fluid. 16. The separation device according to claim 14, wherein the adjusting mechanism maintains a substantially constant interval between the pair of holding portions when separating the sample with the fluid. 17. The separation apparatus according to claim 1, wherein the pair of holding units have an adsorption mechanism for adsorbing a sample under vacuum. 18. The separation apparatus according to claim 1, wherein the sample is a substrate having a porous layer as a fragile layer. 19. A sample support device used in a separation device for separating a plate-shaped sample having a fragile layer therein by the fragile layer, comprising a pair of holding portions for holding the sample so as to sandwich the sample from both sides. While, the pair of holding portions, while allowing the sample to be warped so that the sample is divided into two by the pressure of the fluid injected from the injection unit provided in the separation device and injected into the sample, A support device for limiting the amount of warpage. 20. The support device according to claim 19, wherein at least one of the pair of holding portions has a smooth convex support surface, and the sample is held by the support surface. 21. The support device according to claim 20, wherein the support surface is substantially a part of a spherical surface. 22. The supporting device according to claim 20, wherein the supporting surface is a surface formed by a cone having a convex top. 23. The support device according to claim 20, wherein the support surface is a surface formed by a substantially frustoconical surface. 24. The support device according to claim 20, wherein the support surface is a surface in which several truncated cones are overlapped to form a smooth convex shape as a whole. 25. The support device according to claim 20, wherein the support surface is a surface in which a plurality of columns overlap each other to form a convex shape as a whole. 26. The supporting device according to claim 19, wherein at least one of the pair of holding portions includes an elastic body, and is deformed by a force received from a sample. 27. The apparatus according to claim 19, wherein at least one of the pair of holding parts has a supporting part at least partially constituted by an elastic body, and the sample is held by the supporting part. Support device. 28. The support device according to claim 19, wherein at least one of the pair of holding portions has a portion that can come into contact with a sample made of an elastic body. 29. The supporting device according to claim 19, wherein at least one of the pair of holding portions has an annular supporting portion made of an elastic body. 30. The supporting device according to claim 19, wherein at least one of the pair of holding portions has a supporting portion connected to a main body thereof via an elastic body. 31. The apparatus according to claim 19, further comprising a rotation mechanism configured to rotate the holding section about an axis provided in a direction orthogonal to a surface of the sample. A support device as described. 32. The supporting device according to claim 19, further comprising an adjusting mechanism for adjusting a distance between the pair of holding portions. 33. The support device according to claim 32, wherein the adjusting mechanism adjusts a distance between the pair of holding portions so as to press the sample when the sample is separated by a fluid. 34. The support device according to claim 32, wherein the adjusting mechanism maintains the distance between the pair of holding portions substantially constant when separating the sample by the fluid. 35. The supporting device according to claim 19, wherein the pair of holding units have an adsorption mechanism for adsorbing a sample in vacuum. 36. The separation apparatus according to claim 19, wherein the sample is a substrate having a porous layer as a fragile layer. 37. Any one of claims 1 to 18
A separation method, comprising separating a sample having a fragile layer using the separation device described in the above section. 38. The separation method according to claim 37, wherein water is used as the fluid to be jetted from the jetting unit. 39. A substrate formed by laminating a non-porous layer side of a first substrate having a porous layer and a non-porous layer formed on one surface in that order to a second substrate, and separating the substrate by the porous layer A separation method, wherein the separation apparatus according to any one of claims 1 to 18 is used for the separation. 40. A step of bonding the non-porous layer side of a first substrate, on which a porous layer and a non-porous layer are sequentially formed on one surface, to a second substrate; 19. A method for manufacturing a substrate, comprising: a separation step of separating a substrate by a porous layer, wherein the separation device uses the separation device according to claim 1 in the separation step. Production method.