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JPH11163513A - Carrying mechanism for reflow soldering device - Google Patents

Carrying mechanism for reflow soldering device

Info

Publication number
JPH11163513A
JPH11163513A JP33047697A JP33047697A JPH11163513A JP H11163513 A JPH11163513 A JP H11163513A JP 33047697 A JP33047697 A JP 33047697A JP 33047697 A JP33047697 A JP 33047697A JP H11163513 A JPH11163513 A JP H11163513A
Authority
JP
Japan
Prior art keywords
carrying
transport
conveyor means
movable frame
pawl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33047697A
Other languages
Japanese (ja)
Inventor
Takayuki Mogi
孝行 茂木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Gunma Ltd
Original Assignee
NEC Gunma Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Gunma Ltd filed Critical NEC Gunma Ltd
Priority to JP33047697A priority Critical patent/JPH11163513A/en
Publication of JPH11163513A publication Critical patent/JPH11163513A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chain Conveyers (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable smooth soldering for a printed circuit board according to a wide range of conditions, by alternatively controlling a pawl carrying chain conveyer and a mesh belt conveyer to elevate and to lower at the upper and the lower parts of a carrying path of a reflow soldering device for surface mounting parts. SOLUTION: A pawl carrying chain conveyer 1 and a mesh belt conveyer 2 are both installed on a movable frame 3 which moves up and down and drives and controls a piston cylinder such as a liquid pressure system or the like, on the movable frame 3. One of carrying pawls 6 and 7 which pass through both sides of carrying path A of the pawl carrying chain conveyer 1 is transferred and controlled in the width direction. Endless carrying chains 11 and 12 to which the carrying pawls 6 and 7 are equipped in the carrying direction at a predetermined pitch are supported by a chain supporting frame 8 of the carrying pawl 6 and a chain supporting frame of the carrying pawl 7 in the wound state around a sprocket wheel. In this manner, a carrying system can be selected according to mounting conditions on a printed circuit board A, by driving and controlling the piston cylinder mechanism 4 to elevate and lower the movable frame 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント配線板の
リフロー半田付けを行うリフロー半田付け装置における
プリント配線板の搬送機構に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board transport mechanism in a reflow soldering apparatus for performing reflow soldering of a printed wiring board.

【0002】[0002]

【従来の技術】従来、プリント配線板のリフロー半田付
けは、メッシュベルトコンベア手段、または、爪搬送チ
ェンコンベア手段による何れかの搬送方式で搬送される
過程で行われていた。
2. Description of the Related Art Heretofore, reflow soldering of a printed wiring board has been performed in a process of being transported by a mesh belt conveyor means or a nail transport chain conveyor means.

【0003】[0003]

【発明が解決しようとする課題】しかし、搬送対象とな
るプリント配線板は、これをメッシュベルトコンベア手
段で搬送すると、その裏面に実装部品が装着されていな
い場合はよいが、その裏面に実装部品が装着されている
場合には、前記実装品がベルト表面に接触しているの
で、その搬送過程で、部品の位置ずれを起こし、リフロ
ー半田付けの自動作業に支障をきたす。そこで、プリン
ト配線板を爪搬送チェンコンベア手段で搬送する方式を
採用することになるが、搬送爪によるプリント配線板の
支持の仕方は、プリント配線板の両側のみとなるので、
プリント配線板が薄くて、自体の重さで反りを生じる場
合には、リフロー半田付け作業に支障をきたす。
However, when the printed wiring board to be conveyed is conveyed by a mesh belt conveyor means, it is good if no mounted parts are mounted on the back side, but the mounted parts are mounted on the back side. In the case where is mounted, since the mounted product is in contact with the belt surface, the components are displaced during the transport process, which hinders the automatic reflow soldering operation. Therefore, a method in which the printed wiring board is transported by the claw transport chain conveyor means is adopted, but the method of supporting the printed wiring board by the transport claw is only on both sides of the printed wiring board,
If the printed wiring board is thin and warps due to its own weight, it interferes with the reflow soldering operation.

【0004】本発明は、上記事情に基づいてなされたも
ので、その目的とするところは、搬送対象となるプリン
ト配線基板の状況に応じて、例えば、裏面に実装部品が
ないプリント配線板の場合は、メッシュベルトコンベア
手段を用いた搬送を、また、裏面に実装部品があるプリ
ント配線板の場合は、爪搬送チェンコンベア手段を用い
た搬送を選択して、幅広い条件に応じたプリント配線板
のリフロー半田付けが円滑に行えるように工夫したリフ
ロー半田付け装置の搬送機構を提供することである。
The present invention has been made on the basis of the above circumstances, and an object thereof is to provide, for example, a case of a printed wiring board having no mounted components on the back surface according to the situation of the printed wiring board to be transported. Is a conveyor using mesh belt conveyor means, and in the case of a printed wiring board with mounted components on the back side, select a conveyance using a claw transport chain conveyor means, and print the printed wiring board according to a wide range of conditions. An object of the present invention is to provide a transport mechanism of a reflow soldering device that is devised so that reflow soldering can be performed smoothly.

【0005】[0005]

【課題を解決するための手段】このため、本発明では、
一定の搬送経路を経て搬送されるプリント配線板に対し
て、表面実装部品の半田付けを行うリフロー半田付け装
置において、前記搬送経路の上下に爪搬送チエンコンベ
ア手段とメッシュベルトコンベア手段とを配置し、これ
らコンベア手段を搬送経路に対して交代的に昇降制御す
る制御手段を装備したことを特徴とする。
Therefore, in the present invention,
In a reflow soldering apparatus for soldering surface mounted components to a printed wiring board conveyed through a fixed conveyance path, a claw conveyance chain conveyor means and a mesh belt conveyor means are arranged above and below the conveyance path. And a control means for alternately controlling the elevation of the conveyor means with respect to the transport path.

【0006】なお、この場合、前記コンベア手段は、共
に上下動可能な可動フレームに装備されており、該可動
フレームが前記制御手段で昇降されるように構成してあ
るとよく、また、前記制御手段は、液圧式あるいは気圧
式のピストンシリンダ機構を固定フレームに装備し、こ
のピストンシリンダ機構の駆動制御で、前記可動フレー
ムを昇降するように構成されているのが好ましい。
In this case, it is preferable that the conveyor means is mounted on a movable frame which can move up and down, and the movable frame is moved up and down by the control means. Preferably, the means is provided with a hydraulic or pneumatic piston cylinder mechanism on the fixed frame, and is configured to move up and down the movable frame by drive control of the piston cylinder mechanism.

【0007】更に、前記爪搬送チェンコンベア手段は、
前記搬送経路の両側を通る搬送爪を、搬送方向に所定ピ
ッチで配置してあり、少なくとも一方の搬送爪は前記搬
送経路の幅方向に移動調整可能であるとよく、また、前
記両コンベア手段は、前記可動フレームに設けた電動モ
ータから伝動系を介して共通に駆動される構成であると
よい。
Further, the claw transport chain conveyor means includes:
The transport claws passing on both sides of the transport path are arranged at a predetermined pitch in the transport direction, and at least one of the transport claws may be movable and adjustable in the width direction of the transport path, and the two conveyor means may be It is preferable that the electric motor provided on the movable frame is commonly driven via a transmission system.

【0008】従って、裏面に実装部品がないプリント配
線板の場合は、搬送経路のレベルまでメッシュベルトコ
ンベア手段を上昇させて、これによりプリント配線板の
搬送を行い、裏面に実装部品があるプリント配線板の場
合は、爪搬送チェンコンベア手段を下降させて、これに
よりプリント配線板の搬送を行うので、プリント配線板
の条件に応じて搬送方式を選択でき、好ましい形で、搬
送過程でのリフロー半田付け作業を行うことができる。
Accordingly, in the case of a printed wiring board having no mounted components on the back surface, the mesh belt conveyor means is raised to the level of the transport path, whereby the printed wiring board is transported, and the printed wiring board having the mounted components on the back surface is provided. In the case of a board, the claw transfer chain conveyor means is lowered, thereby carrying the printed wiring board, so that the conveyance method can be selected according to the conditions of the printed wiring board, and in a preferable form, the reflow soldering in the conveyance process is performed. Work can be performed.

【0009】[0009]

【発明の実施の形態】次に、本発明の実施の形態につい
て、図面を参照して詳細に説明する。なお、図1は搬送
機構の正面図、図2は同じく側面図である。ここでは、
一定の搬送経路Aを経て搬送されるプリント配線板Bに
対して、表面実装部品のリフロー半田付けを行うのであ
るが、搬送経路Aの上下には、爪搬送チエンコンベア手
段1とメッシュベルトコンベア手段2とが配置されてい
る。また、この搬送機構は、これらコンベア手段1、2
を搬送経路Aに対して交代的に昇降制御する制御手段
(後述)が装備されている。
Next, an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view of the transport mechanism, and FIG. 2 is a side view of the transport mechanism. here,
The reflow soldering of the surface mount components is performed on the printed wiring board B conveyed through the fixed conveyance path A. The claw conveyance chain conveyor means 1 and the mesh belt conveyor means are provided above and below the conveyance path A. 2 are arranged. Further, the transport mechanism is provided with these conveyor means 1, 2
Control means (described later) for alternately raising and lowering the transport path A with respect to the transport path A is provided.

【0010】特に、この実施の形態では、両コンベア手
段1、2は、共に上下動可能な可動フレーム3に装備さ
れており、可動フレーム3が前記制御手段で昇降される
ように構成してある。前記制御手段は、液圧式あるいは
気圧式のピストンシリンダ機構4を固定フレーム5に装
備し、このピストンシリンダ機構4の駆動制御で、可動
フレーム3を昇降するように構成されている。
Particularly, in this embodiment, both conveyor means 1 and 2 are mounted on a movable frame 3 which can be moved up and down, and the movable frame 3 is configured to be moved up and down by the control means. . The control means includes a hydraulic or pneumatic piston cylinder mechanism 4 mounted on the fixed frame 5, and the movable frame 3 is moved up and down by drive control of the piston cylinder mechanism 4.

【0011】また、爪搬送チェンコンベア手段1は、搬
送経路Aの両側を通る搬送爪6、7を、搬送方向に所定
ピッチで配置してあり、少なくとも一方の搬送爪7は搬
送経路Aの幅方向に移動調整可能である。このために、
この実施の形態では、固定フレーム5に、少なくとも搬
送経路Aの始端および終端に位置して、搬送爪6のため
のチエン支持フレーム8を支持固定しているが、一方、
搬送爪7のためのチェン支持フレーム9は、搬送経路A
の幅方向に延びるガイド10(少なくとも搬送経路Aの
始端および終端に位置して配置される)によって、左右
に移動調整可能に支持されている。
The claw transport chain conveyor means 1 has transport claws 6, 7 passing on both sides of the transport path A arranged at a predetermined pitch in the transport direction, and at least one of the transport claws 7 has a width of the transport path A. The direction of movement can be adjusted. For this,
In this embodiment, the chain support frame 8 for the transport claws 6 is supported and fixed to the fixed frame 5 at least at the beginning and end of the transport path A.
The chain support frame 9 for the transport claws 7 is
The guide 10 (which is located at least at the start end and the end of the transport path A) is supported so as to be movable right and left.

【0012】各チエン支持フレーム8、9には、搬送爪
6、7を搬送方向に所定ピッチで取り付けた無端搬送チ
エン11、12が、スプロケットホイール11A、12
Aに巻回した状態で支持されている。更に詳述すると、
各チエン支持フレーム8、9は、垂直軸11B、12B
を軸支していて、これらに上述のスプロケットホイール
を取り付けており、その内の各1つの垂直軸に、無端搬
送チエン11、12を駆動するための駆動力が伝達され
るようにしてある。
Endless transport chains 11, 12 having transport claws 6, 7 mounted at a predetermined pitch in the transport direction are attached to the chain support frames 8, 9, respectively, with sprocket wheels 11A, 12A.
It is supported in a state wound around A. More specifically,
Each chain support frame 8, 9 has a vertical axis 11B, 12B
, And the above-mentioned sprocket wheels are attached thereto, and a driving force for driving the endless transport chains 11, 12 is transmitted to one of the vertical shafts.

【0013】即ち、両コンベア手段1、2は、可動フレ
ーム3に設けた電動モータ13からチエン伝動系14、
15、更には16を介して共通に駆動される構成であ
り、この実施の形態では、爪搬送チェンコンベア手段1
については、各1つのチエン支持フレーム8、9に共通
の水平伝動軸17に動力が伝達され、これをベベルギヤ
機構や斜歯ギヤ機構(図示せず)などを介して、前述の
各1つの垂直軸に伝える構成が、また、メッシュベルト
コンベア手段2については、その駆動のための水平伝動
軸18に駆動力を伝達する構成が、それぞれ、採用され
ている。
That is, the two conveyor means 1 and 2 are connected to an electric motor 13 provided on the movable frame 3 by a chain transmission system 14.
15 and, furthermore, are driven in common through the 16; in this embodiment, the claw transport chain conveyor means 1
With respect to the above, the power is transmitted to a horizontal transmission shaft 17 common to each of the chain supporting frames 8 and 9, and the power is transmitted to the above-mentioned one vertical shaft via a bevel gear mechanism or a bevel gear mechanism (not shown). A configuration for transmitting the driving force to the shaft and a configuration for transmitting the driving force to the horizontal transmission shaft 18 for driving the mesh belt conveyor means 2 are employed.

【0014】このような構成では、前記制御手段におい
て、ピストンシリンダ機構4を駆動制御することで、可
動フレーム3を昇降することで、裏面に実装部品がない
プリント配線板Bの場合は、搬送経路Aのレベルまでメ
ッシュベルトコンベア手段2を上昇させて、これにより
プリント配線板Aの搬送を行い、また、裏面に実装部品
があるプリント配線板Aの場合は、爪搬送チェンコンベ
ア手段1を下降させて、これによりプリント配線板Aの
搬送を行うので、プリント配線板Aの実装条件などに応
じて搬送方式を選択でき、好ましい形で、搬送過程での
リフロー半田付け作業を行うことができる。
In such a configuration, the control means drives and controls the piston cylinder mechanism 4 to move the movable frame 3 up and down. The mesh belt conveyor means 2 is raised to the level of A, thereby carrying the printed wiring board A. In the case of the printed wiring board A having mounted components on the back surface, the claw transport chain conveyor means 1 is lowered. Since the printed wiring board A is transported by this, the transport method can be selected according to the mounting conditions of the printed wiring board A and the like, and the reflow soldering operation in the transporting process can be performed in a preferable manner.

【0015】[0015]

【発明の効果】本発明は、以上詳述したようになり、一
定の搬送経路を経て搬送されるプリント配線板に対し
て、表面実装部品の半田付けを行うリフロー半田付け装
置において、前記搬送経路の上下に爪搬送チエンコンベ
ア手段とメッシュベルトコンベア手段とを配置し、これ
らコンベア手段を搬送経路に対して交代的に昇降制御す
る制御手段を装備している。
As described in detail above, the present invention relates to a reflow soldering apparatus for soldering a surface mount component to a printed wiring board conveyed through a fixed conveyance path. A claw transport chain conveyor means and a mesh belt conveyor means are arranged above and below the control means, and a control means for alternately controlling the elevation of the conveyor means with respect to the transport path is provided.

【0016】従って、裏面に実装部品がないプリント配
線板の場合は、搬送経路のレベルまでメッシュベルトコ
ンベア手段を上昇させて、これによりプリント配線板の
搬送を行い、裏面に実装部品があるプリント配線板の場
合は、爪搬送チェンコンベア手段を下降させて、これに
よりプリント配線板の搬送を行うので、プリント配線板
の条件に応じて搬送方式を選択でき、好ましい形で、搬
送過程でのリフロー半田付け作業を行うことができる。
Therefore, in the case of a printed wiring board having no mounted components on the rear surface, the mesh belt conveyor means is raised to the level of the transport path, whereby the printed wiring board is transported. In the case of a board, the claw transfer chain conveyor means is lowered, thereby carrying the printed wiring board, so that the conveyance method can be selected according to the conditions of the printed wiring board, and in a preferable form, the reflow soldering in the conveyance process is performed. Work can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態を示す一部概略側面図であ
る。
FIG. 1 is a partial schematic side view showing an embodiment of the present invention.

【図2】同じく、概略端面図である。FIG. 2 is also a schematic end view.

【符号の説明】[Explanation of symbols]

1 爪搬送チェンコンベア手段 2 メッシュベルトコンベア手段 3 可動フレーム 4 ピストンシリンダ機構 5 固定フレーム 6、7 搬送爪 8、9 チエン支持フレーム 10 ガイド 11、12 無端搬送チエン 11A、12A スプロケットホイール 11B、12B 垂直軸 13 電動モータ 14、15、16 チエン伝動系 17、18 水平駆動軸 DESCRIPTION OF SYMBOLS 1 Claw transport chain conveyor means 2 Mesh belt conveyor means 3 Movable frame 4 Piston cylinder mechanism 5 Fixed frame 6, 7 Transport claw 8, 9 Chain support frame 10 Guide 11, 12 Endless transport chain 11A, 12A Sprocket wheel 11B, 12B Vertical axis 13 Electric motor 14, 15, 16 Chain transmission system 17, 18 Horizontal drive shaft

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI B65G 49/02 B65G 49/02 K ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI B65G 49/02 B65G 49/02 K

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 一定の搬送経路を経て搬送されるプリン
ト配線板に対して、表面実装部品の半田付けを行うリフ
ロー半田付け装置において、前記搬送経路の上下に爪搬
送チエンコンベア手段とメッシュベルトコンベア手段と
を配置し、これらコンベア手段を搬送経路に対して交代
的に昇降制御する制御手段を装備したことを特徴とする
リフロー半田付け装置における搬送機構。
1. A reflow soldering apparatus for soldering a surface mount component to a printed wiring board conveyed through a fixed conveyance path, wherein a claw conveyance chain conveyor means and a mesh belt conveyor are provided above and below the conveyance path. And a control means for arranging the conveyor means alternately with respect to a conveying path.
【請求項2】 前記コンベア手段は、共に上下動可能な
可動フレームに装備されており、該可動フレームは前記
制御手段で昇降されるように構成したことを特徴とする
請求項1に記載のリフロー半田付け装置の搬送機構。
2. The reflow apparatus according to claim 1, wherein said conveyor means is mounted on a movable frame which can move up and down, and said movable frame is configured to be moved up and down by said control means. Transfer mechanism for soldering equipment.
【請求項3】 前記制御手段は、液圧式あるいは気圧式
のピストンシリンダ機構を固定フレームに装備し、この
ピストンシリンダ機構の駆動制御で、前記可動フレーム
を昇降することを特徴とする請求項2に記載のリフロー
半田付け装置の搬送機構。
3. The control device according to claim 2, wherein the control means includes a hydraulic or pneumatic piston cylinder mechanism mounted on the fixed frame, and the movable frame is moved up and down by drive control of the piston cylinder mechanism. The transport mechanism of the reflow soldering apparatus described in the above.
【請求項4】 前記爪搬送チェンコンベア手段は、前記
搬送経路の両側を通る搬送爪を、搬送方向に所定ピッチ
で配置してあり、少なくとも一方の搬送爪は前記搬送経
路の幅方向に移動調整可能であることを特徴とする請求
項1〜3の何れかに記載のリフロー半田付け装置の搬送
機構。
4. The claw transport chain conveyor means has transport claws passing on both sides of the transport path arranged at a predetermined pitch in the transport direction, and at least one of the transport claws is moved and adjusted in the width direction of the transport path. The transport mechanism of the reflow soldering apparatus according to claim 1, wherein the transport mechanism is capable of being performed.
【請求項5】 前記両コンベア手段は、前記可動フレー
ムに設けた電動モータから伝動系を介して共通に駆動さ
れる構成であることを特徴とする請求項1〜4の何れか
に記載のリフロー半田付け装置の搬送機構。
5. The reflow device according to claim 1, wherein said both conveyor means are commonly driven via an electric motor provided on said movable frame via a transmission system. Transfer mechanism for soldering equipment.
JP33047697A 1997-12-01 1997-12-01 Carrying mechanism for reflow soldering device Pending JPH11163513A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33047697A JPH11163513A (en) 1997-12-01 1997-12-01 Carrying mechanism for reflow soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33047697A JPH11163513A (en) 1997-12-01 1997-12-01 Carrying mechanism for reflow soldering device

Publications (1)

Publication Number Publication Date
JPH11163513A true JPH11163513A (en) 1999-06-18

Family

ID=18233061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33047697A Pending JPH11163513A (en) 1997-12-01 1997-12-01 Carrying mechanism for reflow soldering device

Country Status (1)

Country Link
JP (1) JPH11163513A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105346975A (en) * 2014-08-22 2016-02-24 清华大学 Vehicle dragging system and vehicle checking system
CN107745950A (en) * 2017-11-30 2018-03-02 苏州哈工众志自动化科技有限公司 It is easy to the auto arrangement induction system of product stacking or packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105346975A (en) * 2014-08-22 2016-02-24 清华大学 Vehicle dragging system and vehicle checking system
CN107745950A (en) * 2017-11-30 2018-03-02 苏州哈工众志自动化科技有限公司 It is easy to the auto arrangement induction system of product stacking or packaging

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