JPH11150057A - Board processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board processor capable of reduction of the area of an occupied floor, the improvement of reliability, and the cost reduction. SOLUTION: A device body 1 is placed on floor material 200. An underfloor cabinet 100 is attached right below the floor material 200 under the device body 1. The underfloor cabinet 100 is constituted of member having permeability. A part of the constituent unit of a fluid facility, an exhaust facility, an intake facility, an electric facility, etc., is accommodated in the underfloor cabinet 100. The floor material 200 on the underfloor cabinet 100 is provided with a hole 201, and a conduit 101 to connect the underfloor cabinet 100 with the device body 1 is provided within the hole 201. A pipe and wiring to connect the constituent unit accommodated in the underfloor cabinet 100 with the device body 1 are inserted in the conduit 101.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus for performing a predetermined process on a substrate.

[0002]

2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk. For example, in a semiconductor device manufacturing process, a substrate processing apparatus in which each of a series of processes is unitized and a plurality of processing units are integrated is used in order to increase production efficiency.

FIG. 6 is a cross-sectional view showing an example of a conventional substrate processing apparatus, and FIG. 7 is a side view of the substrate processing apparatus shown in FIG.

In FIG. 6, an apparatus main body 1 of a substrate processing apparatus is shown.
In the processing area A on the front side of a, a rotary coating unit (spin coater) 10 for applying a processing liquid such as a photoresist to the substrate and a rotary developing unit (spin developer) 20 for performing a developing processing on the substrate are arranged in parallel. Has been established. In the processing area B on the back side of the apparatus main body 1a, a heating unit (hot plate) for performing a heating process on the substrate, a cooling unit (cooling plate) for performing a cooling process on the substrate,
A plurality of heat treatment units 30 such as an adhesion strengthening unit for performing an adhesion strengthening process on a substrate are respectively arranged in a plurality of stages.

In the transport area C between the processing areas A and B, the substrate is transported in the direction of arrow Y, and the rotary coating unit 10, the rotary developing unit 20,
Transport unit 4 for loading and unloading substrates with respect to
0 is provided.

A loading / unloading device (indexer) 50 for accommodating a substrate and loading and unloading the substrate is disposed at one end of the apparatus main body 1a. Loading / unloading device 50
Includes a cassette mounting table 51 on which a plurality of cassettes 60 for storing substrates W are mounted, and a transport unit 52 for loading and unloading substrates. The transport unit 52 moves in the direction of arrow X, takes out the substrate W from the cassette 60 on the cassette mounting table 51, passes the substrate W to the transport unit 40 in the transport area C, and transfers the substrate subjected to the series of processing to the transport area C. It is received from the transport unit 40 and returned to the cassette 60 on the cassette mounting table 51. An air adjusting unit 90 including a filter and a fan is disposed above the carry-in / out device 50.

A built-in unit 70 is provided below the rotary coating unit 10, the rotary developing unit 20, and the heat treatment unit 30, as shown in FIG. The built-in unit 70 has built-in fluid equipment such as a pump, a tank, bottles, and valves, supplies a fluid such as a processing liquid to the rotary coating unit 10 and the rotary developing unit 20, and includes the rotary coating unit 10 and the rotary type. The waste liquid from the developing unit 20 is discharged to the outside, and electric equipment such as a liquid level sensor is built in to control operations of a pump, a tank, an electromagnetic valve, and the like.

[0008]

As described above, the constituent units (components) such as the fluid equipment and the electrical equipment are housed in the built-in unit 70 provided at the lower part of the apparatus main body 1a. Thereby, an increase in the occupied floor area (footprint) of the substrate processing apparatus is suppressed.

However, as the number of constituent units such as fluid equipment and electrical equipment increases, it becomes difficult to house all the constituent units in the built-in unit 70. In such a case, as shown in FIGS. 6 and 7, a separate cabinet 2 is added separately from the apparatus main body 1a, and a part of the constituent units such as the fluid equipment and the electrical equipment are stored in the separate cabinet 2. . This causes a problem that the floor area occupied by the substrate processing apparatus in the clean room increases.

Further, it is necessary to provide a pipe 3 and a wiring 4 for connecting constituent units such as fluid equipment and electrical equipment housed in the separate cabinet 2 to the apparatus main body 1a. In this case, the reliability is reduced and the cost is increased due to the addition of the crossover piping and wiring between the separate cabinet 2 and the apparatus main body 1a.

An object of the present invention is to provide a substrate processing apparatus capable of reducing an occupied floor area, improving reliability and reducing costs.

[0012]

Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention has a processing unit for processing a substrate and has an apparatus main body installed on a floor material having a space below. In a substrate processing apparatus, a part of components related to processing of a processing unit is disposed in a space directly below a floor material at a lower part of the apparatus main body.

In the substrate processing apparatus according to the present invention, some of the components related to the processing of the processing section are arranged in the space directly below the floor material at the bottom of the apparatus main body, so that the occupied floor area of the apparatus main body is reduced. It is possible to do. Further, even when the number of components increases, it is possible to suppress an increase in the floor area occupied by the apparatus main body.

In particular, since some of the components are disposed directly below the floor material under the apparatus main body, the connection distance between the components and the apparatus main body is shortened. Thereby, the reliability is improved and the cost is reduced. Further, by providing a port such as an opening in the flooring material or by removing a part of the flooring material, the maintenance work of the components directly above the flooring material from the flooring material can be easily performed.

A substrate processing apparatus according to a second aspect of the present invention is the substrate processing apparatus according to the first aspect of the present invention, wherein a part of the components is housed in a storage container attached directly below a floor material at a lower portion of the apparatus main body. It was done.

In this case, since some of the components are stored in the storage container attached directly below the floor, the components are easily disposed in the space directly below the floor without directly fixing the components to the floor. It is possible to do.

A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the second aspect of the present invention, wherein the storage container is formed of a member having air permeability.

In this case, since the storage container has air permeability, it is possible to prevent the storage container from obstructing exhaust or downward flow (downflow) below the apparatus main body.

According to a fourth aspect of the present invention, there is provided a substrate processing apparatus comprising:
In the configuration of the substrate processing apparatus according to the second or third aspect, some of the components are electrical equipment, fluid equipment, air supply equipment, or exhaust equipment.

In this case, it is possible to suppress an increase in the occupied floor area of the apparatus main body due to the electrical equipment, fluid equipment, air supply equipment, or exhaust equipment.

[0021]

FIG. 1 is a front view of a substrate processing apparatus according to a first embodiment of the present invention, FIG. 2 is a side view of the substrate processing apparatus of FIG. 1, and FIG. 3 is a cross section of the substrate processing apparatus of FIG. FIG.

In FIG. 3, an apparatus main body 1 of the substrate processing apparatus is shown.
A rotary coating unit (spin coater) 10 for applying a processing liquid such as a photoresist to a substrate and a rotary developing unit (spin developer) 20 for performing a developing process on the substrate are arranged in parallel in a processing area A on the front side of the substrate. Is done. In the processing area B on the back side of the apparatus main body 1, a heating unit (hot plate) for performing a heating process on the substrate, a cooling unit (cooling plate) for performing a cooling process on the substrate, and an adhesion enhancement for performing an adhesion enhancement process on the substrate are provided. A plurality of heat treatment units 30 such as units are arranged in a plurality of stages.

In the transport area C between the processing areas A and B, the substrate is transported in the direction of arrow Y, and the rotary coating unit 10, the rotary developing unit 20,
Transport unit 4 for loading and unloading substrates with respect to
0 is provided.

A loading / unloading device (indexer) 50 for accommodating the substrate and loading and unloading the substrate is disposed at one end of the apparatus main body 1. The loading / unloading device 50
A cassette mounting table 51 on which a plurality of cassettes 60 for storing substrates are mounted, and a transport unit 52 for loading and unloading substrates are provided. The transport unit 52 moves in the direction of arrow X, takes out the substrate W from the cassette 60 on the cassette mounting table 51, passes the substrate W to the transport unit 40 in the transport area C, and transfers the substrate subjected to the series of processing to the transport area C. It is received from the transport unit 40 and returned to the cassette 60 on the cassette mounting table 51.

As shown in FIGS. 1 and 2, a built-in unit 70 is provided below the rotary coating unit 10, the rotary developing unit 20, and the heat treatment unit 30. The built-in unit 70 has built-in fluid equipment such as a pump, a tank, bottles, and a valve, supplies a fluid such as a processing liquid to the rotary coating unit 10 and the rotary developing unit 20, and includes a rotary coating unit 10 and a rotary It discharges the waste liquid from the developing unit 20 to the outside, and has built-in electrical equipment such as a liquid level sensor to control the operation of a pump, a tank, an electromagnetic valve and the like.

An air adjusting unit 80 including a filter and a fan is disposed above the rotary coating unit 10, the rotary developing unit 20, and the heat treatment unit 30. An air adjustment unit 90 including a filter and a fan is also arranged above the carry-in / out device 50.

The apparatus main body 1 is installed on a flooring 200 made of grating (grating). The floor material 200 is supported by a plurality of support columns 220 above a concrete floor 210. That is, the floor material 200 separates the upper floor from the lower floor.

In particular, in this embodiment, the underfloor cabinet 100 is hung and mounted directly below the floor material 200 at the lower part of the apparatus main body 1. This underfloor cabinet 100
It is composed of a member having air permeability such as grating and punching metal.

In the underfloor cabinet 100, some of the structural units such as fluid equipment, air supply equipment, exhaust equipment, and electrical equipment are housed. In particular, it is preferable that the underfloor cabinet 100 house components such as a servo amplifier, a power supply unit, a constant temperature water unit, a buffer tank, and a HMDS (hexamethyldisilazane) bubbling tank, which are relatively infrequently maintained or replaced. Further, other constituent units such as a transformer, a chemical solution bottle, a chemical solution tank, and an air adjusting unit may be stored in the underfloor cabinet 100.

A hole 201 is provided in the floor material 200 on the underfloor cabinet 100, and a conduit (duct) 10 connecting the apparatus body 1 and the underfloor cabinet 100 is formed in the hole 201.
1 is provided. In the conduit 101, piping and wiring for connecting constituent units such as fluid equipment, air supply equipment, exhaust equipment, and electrical equipment in the underfloor cabinet 100 to the apparatus main body 1 are inserted.

In the substrate processing apparatus according to the present embodiment, a part of the constituent units is housed in the underfloor cabinet 100 attached immediately below the floor member 200, so that the apparatus body 1
Occupied floor area is reduced. Further, even when the number of constituent units increases, the increase in the floor area occupied by the apparatus main body 1 is suppressed.

Further, the distance between the piping and wiring connecting the component units housed in the underfloor cabinet 100 and the apparatus body 1 is shortened, so that the reliability is improved and the cost is reduced. Further, by providing a port (not shown) such as an opening in the flooring material 200 or by removing a part of the flooring material 200, the flooring material 200 can be directly above the flooring material 200 without going downstairs. The maintenance work of the constituent units stored in the underfloor cabinet 100 can be easily performed.

In particular, since the underfloor cabinet 100 has air permeability, it is possible to prevent the underfloor cabinet 100 from obstructing the exhaust or downflow of the apparatus body 1 below.

In the present embodiment, the rotary coating unit 10
The rotary developing unit 20, the heat treatment unit 30, the transport unit 40, and the loading / unloading device 50 correspond to a processing unit, and the underfloor cabinet 100 corresponds to a storage container.

FIG. 4 is a front view of a substrate processing apparatus according to a second embodiment of the present invention, and FIG. 5 is a side view of the substrate processing apparatus of FIG. The cross-sectional view of the substrate processing apparatus of the present embodiment is the same as the cross-sectional view shown in FIG.

As shown in FIG. 4 and FIG.
An exhaust manifold 110 is mounted directly below the lower floor material 200. Holes 202 are provided in the floor material 200 near the exhaust manifold 110. The pipes 111 and 112 of the exhaust manifold 110 are connected to the apparatus main body 1 through the holes 202 of the floor material 200. The piping 113 of the exhaust manifold 110 is connected to exhaust equipment in a factory.

In this embodiment, the exhaust manifold 110 corresponds to a part of a constituent unit. The configuration of the other parts of the substrate processing apparatus of the present embodiment is the same as the configuration of the substrate processing apparatus of the first embodiment.

In the substrate processing apparatus of the present embodiment, since the exhaust manifold 110 is disposed immediately below the floor member 200 below the apparatus main body 1, the occupied floor area of the apparatus main body 1 does not increase. Further, the exhaust manifold 110 and the device main body 1
Since the lengths of the pipes 111 and 112 for connecting the two are shortened, the reliability is improved and the cost is reduced.

Further, a port (not shown) such as an opening may be provided in the flooring material 200 or the flooring material 200 may be provided.
By removing a part of, without going downstairs,
Maintenance work of the exhaust manifold 110 can be easily performed from above the floor material 200.

In the above embodiment, the case where the present invention is applied to a substrate processing apparatus having a plurality of processing units has been described. However, the present invention is applied to a coating process, a developing process, a cleaning process, a heat treatment, a transport process, The present invention can be similarly applied to a substrate processing apparatus having a single processing unit such as a loading / unloading process.

The constituent units provided in the space directly below the floor below the apparatus main body are not limited to the above-described embodiment, and various constituent units can be provided.

[Brief description of the drawings]

FIG. 1 is a front view of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view of the substrate processing apparatus of FIG.

FIG. 3 is a cross-sectional view of the substrate processing apparatus of FIG.

FIG. 4 is a front view of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 5 is a side view of the substrate processing apparatus of FIG.

FIG. 6 is a cross-sectional view of a conventional substrate processing apparatus.

FIG. 7 is a side view of the substrate processing apparatus of FIG.

[Explanation of symbols]

 Reference Signs List 1 apparatus main body 10 rotary coating unit 20 rotary developing unit 30 heat treatment unit 70 built-in unit 100 underfloor cabinet 101 conduit 110 exhaust manifold 111, 112, 113 pipe 200 floor material 201, 202 hole 210 concrete floor 220 support column

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/30 569C

Claims (4)

[Claims] 1. A substrate processing apparatus having a processing unit for performing processing on a substrate and having an apparatus main body installed on a floor material having a space below, wherein one of components related to processing of the processing unit is provided. A substrate processing apparatus, wherein a portion is disposed in a space directly below the floor material at a lower portion of the apparatus main body. 2. The substrate processing apparatus according to claim 1, wherein a part of the constituent elements is stored in a storage container attached directly below the floor material at a lower portion of the apparatus main body. 3. The substrate processing apparatus according to claim 2, wherein said storage container is made of a member having air permeability. 4. The substrate processing apparatus according to claim 1, wherein a part of the components is an electrical equipment, a fluid equipment, an air supply equipment, or an exhaust equipment.