JPH11135469A - Substrate cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent contamination of a substrate due to particles caused from a sliding contact part. SOLUTION: A bearing block 51 has a fixing part 53 constituted in a cylindrical shape, a cylindrical inner periheral wall 54 provided vertically downward of an inner margin at a lower end of the fixing part 53, and a cylindrical outer peripheral wall 55 provided vertically downward of an outer margin at a lower end of the fixing part 53. The fixing part 53 is provided with a bearing 56 rotatably holding a rotating shaft 52, and an oil seal 57 below this bearing 56. A brush holder 64 is detachably attached to the rotating shaft 52. The inner peripheral wall 54 is entered into an annular groove 70 formed on an upper face of the brush holder 64, whereby there is formed a communication path 75 communicating an internal chamber 74 formed between the bearing block 51 and the brush holder 64 with an external space 76. A brush detergent is supplied to the internal chamber 74 via a brush detergent supply pipe 77 and a connection inlet 78.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for performing a cleaning process on various substrates to be processed, such as a semiconductor wafer, a glass substrate for a liquid crystal display, and a glass substrate for a PDP (plasma display panel). The present invention relates to a cleaning device.

[0002]

2. Description of the Related Art In a manufacturing process of an VLSI or a liquid crystal display device, a process of performing a cleaning process on a surface of a substrate to be processed such as a semiconductor wafer or a glass substrate for a liquid crystal display panel or a thin film formed on the surface is performed. This is one of the important steps. FIG. 4 shows a conceptual configuration of a substrate cleaning apparatus for performing the cleaning process.

The substrate cleaning apparatus includes a spin chuck 131 that rotates while holding a semiconductor wafer W (hereinafter, simply referred to as “wafer W”) horizontally, and a spin chuck 1 that rotates the semiconductor wafer W.
It has a scrub brush 132 provided above the nozzle 31 and a nozzle 133 for discharging a cleaning liquid onto the surface of the wafer W held by the spin chuck 131. The scrub brush 132 includes a brush holding portion 13 formed on the lower surface of the tip of a swing arm 135 that swings around a swing shaft 134.
6 attached. The scrub brush 132 can rotate around a vertical axis passing through the center thereof, and can revolve around a swing shaft 134 by swinging of the swing arm 135. In addition, the swing shaft 13
Numeral 4 is configured to be able to move up and down, and by moving the swing shaft 134 up and down, the scrub brush 132 can be brought into contact with the surface of the wafer W or separated from the surface of the wafer W.

At the time of cleaning, the spin chuck 131 is rotated at a high speed, and the cleaning liquid is discharged from the nozzle 133 toward the surface of the wafer W while the wafer W held by the spin chuck 131 is rotated. On the other hand, the scrub brush 132 scans the surface of the wafer W from the center to the periphery while rotating, while in contact with the surface of the wafer W. Thus, the entire surface of the wafer W can be scrub-cleaned by the scrub brush 132,
Contaminants attached to the surface of the wafer W can be removed.

[0005]

However, in the conventional substrate cleaning apparatus, particles resulting from dust generated in the brush holding portion 136 for rotatably holding the scrub brush 132 generate wafer W after the cleaning process. On the surface of the wafer W and contaminate the surface of the wafer W.

More specifically, as shown in FIG.
The brush holding portion 136 includes a bearing block 137 fixed to the lower surface of the tip of the swing arm 135, and a bearing block 137.
The rotation shaft 138 rotatably held by the rotation shaft 1
37 and a brush holder 139 attached to the outer peripheral surface of the brush 37. The scrub brush 132 is attached to the lower surface of the brush holder 139 by a cap 140. The bearing block 137 rotatably holds the rotation shaft 138 and the brush holder 138 inside the bearing block 137.
1, 142, 143 are provided. An oil seal 144 for isolating the inside of the bearing block 137 from the external space is provided at the lower end of the bearing block 137. The oil seal 144 prevents the cleaning liquid from entering the inside of the bearing block 137, and prevents particles generated by sliding of the bearings 141, 142, and 143 from scattering into the external space.

However, since the oil seal 144 is also in contact with the brush holder 139, the brush holder 13
9 rotates, the oil seal 144 and the brush holder 1
There is a problem that particles are generated by sliding contact with the wafer 39 and adhere to the surface of the wafer W after the cleaning process. Therefore, an object of the present invention is to solve the above-mentioned technical problem and to provide a substrate cleaning apparatus capable of preventing contamination of a substrate by particles from a sliding portion which is slid by rotation of a rotation shaft of a scrub member. It is to be.

[0008]

Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, in order to achieve the above object, it is possible to rotate around a predetermined rotation axis while contacting the substrate for cleaning the substrate. A scrub member, a sliding portion that slides by rotation of the rotating shaft, an inner chamber formed below the sliding portion so as to surround the rotating shaft, and communicates the inner chamber with the outer space. A liquid supply means for supplying liquid to the internal chamber; and a liquid supply means provided at any position in a space extending from the internal chamber to the communication path for storing the liquid supplied from the liquid supply means. A substrate cleaning apparatus comprising:

According to this configuration, the sliding portion slides by the liquid stored in any position in the space from the internal chamber to the communication passage, in other words, the storage portion provided in the internal chamber or the communication passage. Particles generated by the movement are captured. Also, on the wall forming the internal chamber and the communication passage,
Since the liquid supplied to the internal chamber adheres and is wet, particles are also captured by the wall surface. therefore,
Particles generated from the sliding portion are scattered in the external space, adhere to the surface of the substrate after the cleaning process, and can reduce the risk of contaminating the substrate.

Further, by appropriately supplying the liquid from the liquid supply means to the internal chamber, particles in the internal chamber and the communication passage and particles captured by the liquid stored in the storage portion can be washed away. Note that the scrub member may be constituted by a disc brush that contacts a surface of the substrate while rotating around a rotation axis provided perpendicular to the surface of the substrate, or a rotation shaft that is provided parallel to the surface of the substrate. It may be constituted by a roll brush that rotates around and the peripheral surface of which contacts the surface of the substrate.

The sliding portion which is slid by the rotation of the rotating shaft is, for example, a bearing for rotatably holding the rotating shaft or a sealing member such as an oil seal provided in close contact with the rotating shaft. You may. Furthermore, it is preferable that the internal chamber and the communication chamber are formed between a rotating part that rotates with the rotation of the rotating shaft and a fixed part that is not rotated by the rotation of the rotating shaft.

The invention according to claim 2 is characterized in that a constricted path which extends downward and then extends upward is provided at an intermediate portion of the communication path. This is a substrate cleaning apparatus. According to this configuration, since the constricted path is provided in the middle of the communication path, particles generated from the sliding portion are prevented from scattering from the internal chamber to the external space through the communication path. Therefore, the risk that the substrate after the cleaning process is contaminated by particles generated from the sliding portion can be further reduced.

Further, it is possible to prevent the atmosphere in the external space from entering the internal chamber through the communication passage. therefore,
If the substrate cleaning device is configured to clean the substrate using an acidic or alkaline chemical, the atmosphere containing the chemical in the external space may enter the internal chamber and corrode the sliding parts and the rotating shaft. Can be reduced.

The invention according to claim 3 is the substrate cleaning apparatus according to claim 2, wherein the storage section is provided in a narrow path of the communication path. According to this configuration, since the storage section is provided in the narrow path, the internal chamber and the external space are completely shut off by the liquid stored in the storage section. Therefore, the particles generated from the sliding portion do not scatter into the external space, so that the particles do not contaminate the substrate. Further, since the atmosphere in the external space does not enter the internal chamber through the communication path, for example, the sliding portion and the rotating shaft are not affected by the atmosphere containing the chemical in the external space.

According to a fourth aspect of the present invention, the substrate is provided in the interior chamber so as to surround the rotating shaft. It is a cleaning device. According to this configuration, since the storage section is provided in the internal chamber, particles generated from the sliding section are immediately captured by the liquid stored in the storage section. Therefore, scattering of particles into the external space can be effectively prevented.

According to a fifth aspect of the present invention, there is further provided a control unit for controlling the liquid supply means so as to supply the liquid to the internal chamber during a period when the substrate does not exist below the scrub member. A substrate cleaning apparatus according to any one of claims 1 to 4. According to this configuration, the supply of the liquid to the internal chamber by the liquid supply unit is performed during a period in which the substrate does not exist below the scrub member, so that the substrate is contaminated by the particles washed out from the internal chamber and the communication path. Never.

It is preferable that the period in which the substrate does not exist below the scrubbing member is before starting the cleaning process of the substrate by the scrubbing member or after finishing the cleaning process of the substrate.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a conceptual diagram showing a configuration of a substrate cleaning apparatus according to one embodiment of the present invention. This substrate cleaning apparatus performs a pre-processing step (for example, CMP for polishing a thin film formed on the surface of the wafer W).
(Chemical Mechanical Polishing) This is for removing unnecessary substances (particles, abrasives, extraneous substances such as extra thin films) remaining on the surface of the wafer W after the processing step is performed, and holds the wafer W horizontally. Chuck 10 that rotates while rotating, nozzle 20 for supplying a chemical solution to the surface of wafer W held by spin chuck 10, and self-revolution for scrub cleaning the surface of wafer W held by spin chuck 10 And a brush device 30.

The spin chuck 10 includes a vertically extending chuck shaft 11, six arms 12 radially extending from the upper end of the chuck shaft 11 along the horizontal direction at an angular interval of 60 degrees, And a chuck pin 13 erected at the tip, and the chuck pin 13 holds the peripheral portion of the wafer W. Further, a rotation drive mechanism (not shown) including, for example, a motor is coupled to the chuck shaft 11. Therefore, by rotating the chuck shaft 11 by the rotation driving mechanism while the wafer W is chucked by the chuck pins 13,
The wafer W can be rotated in a horizontal plane.

The nozzle 20 is provided obliquely above the wafer W held by the spin chuck 10,
By discharging the wafer cleaning liquid toward the center of the
The wafer cleaning liquid is supplied to the entire surface of the wafer W. Examples of the wafer cleaning liquid supplied from the nozzle 20 to the surface of the wafer W include a chemical such as hydrofluoric acid, hydrochloric acid, sulfuric acid, phosphoric acid, ammonia, and an aqueous solution of hydrogen peroxide thereof, or pure water.

The self-revolving brush device 30 has a support shaft 31 rotatable around a vertical axis set outside the wafer W held by the spin chuck 10, and extends horizontally from an upper end of the support shaft 31. The swing arm 32 includes a brush holder 33 formed on the lower surface of the tip of the swing arm 32, and a disk brush 34 as a scrub member rotatably held by the brush holder 33. In addition, the self-revolving brush device 30 includes a revolving drive mechanism for rotating the support shaft 31, a vertical drive mechanism for vertically moving the support shaft 31, and a disk brush 34 that is substantially perpendicular to the surface of the wafer W. A brush drive mechanism 35 including a rotation drive mechanism for rotationally driving around an axis along the direction is coupled.

By rotating the support shaft 31 by the revolving drive mechanism of the brush drive mechanism 35 and swinging the swing arm 32, the disc brush 34 passes through the center of the wafer W held by the spin chuck 10. It can be displaced between a position on the vertical line and a home position provided outside the wafer W. Also, the brush driving mechanism 35
The support shaft 31 is moved up and down by the up and down drive mechanism to move the swing arm 32 up and down, so that the disc brush 34 is moved up and down, and the disc brush 34 is brought into contact with the wafer W held by the spin chuck 10. Can be separated.

When cleaning the wafer W, first, the disk brush 34 waiting at the home position is moved above the center position of the wafer W being rotated at a high speed by the spin chuck 10. Next, the disk brush 34 is lowered while rotating, and the lower surface of the disk brush 34 contacts the surface of the wafer W. Then, the disk brush 34 is moved from the center position of the wafer W to the peripheral edge thereof while being in contact with the surface of the wafer W. Thereafter, the disk brush 34 is separated upward from the surface of the wafer W, and is returned to the center position from the peripheral portion of the wafer W. In this way, by repeatedly reciprocating the disk brush 34 in the range from the center position of the wafer W to the peripheral portion,
The foreign substances adhering to the surface of the wafer W can be raised, and the foreign substances can be further swept out of the wafer W. After the scrub cleaning operation has been performed for a predetermined time, the disc brush 34 is returned to the home position.

At a home position of the disk brush 34, a brush cleaning pot 36 for cleaning the disk brush 34 is arranged. Brush cleaning pot 36
Is a bottomed cylindrical container having an open upper surface, and can store a brush cleaning liquid (pure water or dilute ammonia water) supplied from a brush cleaning liquid tank (not shown) via a valve 37. The valve 37 is always open during the operation of the substrate cleaning apparatus, and the brush cleaning liquid always overflows from the brush cleaning pot 36. The lower surface of the disk brush 34 returned to the home position is immersed in the brush cleaning liquid stored in the brush cleaning pot 36.

The cleaning of the disk brush 34 is performed every time a predetermined number (for example, 25) of wafers W are cleaned. The disk brush 34 returned to the home position after cleaning a predetermined number of wafers W is rotated with its lower surface immersed in the brush cleaning liquid in the brush cleaning pot 36. Accordingly, the foreign matter attached to the disc brush 34 is removed, and the disc brush 34 can be kept clean.

In the self-revolving brush device 30 according to this embodiment, the brush cleaning liquid is supplied from the brush cleaning liquid tank (not shown) through the valve 38 into the brush holding portion 33 provided at the tip of the swing arm 32. It can be supplied. When the disk brush 34 is cleaned, the valve 38 is opened while the disk brush 34 is rotated, and the brush cleaning liquid is supplied to the inside of the brush holder 33 to clean the inside of the brush holder 33. be able to.

The cleaning process of the wafer W and the cleaning process of the disk brush 34 and the brush holding portion 33 described above
The control unit 40 including U, ROM and RAM controls the operation of each unit such as the brush driving mechanism 35 and the valves 37 and 38, and is realized. FIG. 2 shows the swing arm 3
FIG. 2 is a cross-sectional view illustrating a configuration of a tip portion of a second embodiment. FIG. 2 shows a state in which the disk brush 34 is waiting at the home position, and also shows a configuration for driving the disk brush 34 to rotate.

The swing arm 32 includes an arm main body 32a including a bottom plate 101 formed in a long shape of a flat rectangular shape and a peripheral side plate 102 rising upward from a peripheral edge of the bottom plate 101.
And an arm cover 32b for closing the arm body 32a from above. Bottom plate 101 of arm body 32a
A circular fitting hole 103 is formed near the front end (near the left end in FIG. 2), and a brush holding portion 33 is formed in relation to the fitting hole 103.

The brush holder 33 includes a bearing block 51
And a rotation shaft 52 rotatably held by the bearing block 51. The bearing block 51 includes a fixed portion 53 having a substantially cylindrical shape, a cylindrical inner peripheral wall 54 hanging down from an inner peripheral edge at a lower end of the fixed portion 53, and a cylindrical outer peripheral wall hanging down from an outer peripheral edge at a lower end of the fixed portion 53. 55. The bearing block 51 is fixed to the bottom plate 101 by fitting the fixing portion 53 into a fitting hole 103 formed in the bottom plate 101 of the arm main body 32a.

On the inner periphery of the fixed portion 53, a bearing holding portion 53a and a seal holding portion 53b formed below the bearing holding portion 53a and having a diameter larger than that of the bearing holding portion 53a are formed. A bearing 56 for rotatably holding the rotation shaft 52 is press-fitted and fixed to the bearing holding portion 53a. Also, the seal holding portion 53b
, An oil seal 57 is fixed by press-fitting, thereby preventing particles generated by sliding on the bearing 56 from scattering downward.

The rotation shaft 52 has a cylindrical portion 52a extending in the vertical direction, and a prism portion 52b extending vertically downward from the lower end of the cylindrical portion 52a. The rotation shaft 52 is rotatably held by a bearing 56 provided on the bearing block 51 and a bearing 58 provided on the arm cover 32b. A driven pulley 59 is fixed to a portion of the cylindrical portion 52a between the bearings 56 and 58, that is, a portion of the cylindrical portion 52a located inside the swing arm 32.

On the other hand, inside the support shaft 31 (see FIG. 1) supporting the swing arm 32, the brush rotation motor 6 is provided.
The input shaft 61 to which the driving force of 0 is input is inserted,
A drive pulley 62 is fixed to the upper end of the input shaft 61. An endless timing belt 63 is wound around the drive pulley 62 and the driven pulley 59 fixed to the column portion 52a. Therefore, the rotation of the brush rotation motor 60 is transmitted to the driven pulley 59 via the input shaft 61, the driving pulley 62, and the timing belt 63, and rotates the driven pulley 59 and the rotation shaft 52.

A brush holder 64 that rotates together with the rotation shaft 52 is detachably attached to the rotation shaft 52. The brush holder 64 has an outer shape that is rotationally symmetric with respect to an axis passing through the center of the rotation shaft 52, and has a locking portion through which a flat circular hole 65 that penetrates the cylindrical portion 52 a of the rotation shaft 52 is formed. 6 and a hole 6 formed in a continuous square shape below the locking portion 66 and inserted through the prism portion 52 b of the rotation shaft 52.
7 includes a square hole portion 68 formed to penetrate therethrough, and a cylindrical cylindrical portion 69 provided continuously below the square hole portion 68.

The locking portion 66 has an outer diameter of the bearing block 5.
The outer peripheral wall 55 is formed smaller than the inner diameter of the outer peripheral wall 55. An annular groove 70 is formed on the upper surface of the locking portion 66 at a position corresponding to the inner peripheral wall 54 of the bearing block 51. Further, an annular concave portion 71 is formed in the vicinity of the middle of the peripheral surface of the hole 65 formed in the locking portion 66, and the concave portion 71 has an O
A ring 72 is fitted. On the other hand, the cylindrical portion 52a of the rotation shaft 52 has a section V at a position corresponding to the O-ring 72.
A letter-shaped cut 73 is formed, and the O-ring 72 is fitted into the cut 73 to prevent the brush holder 64 from falling off.

When the brush holder 64 is mounted on the rotation shaft 52, the inner peripheral wall 54 of the bearing block 51 is inserted into an annular groove 70 formed in the locking portion 66.
A labyrinth space is formed between the bearing block 51 and the brush holder 64. In this state, the upper surface of the locking portion 66 and the oil seal 57 fixed to the bearing block 51 are separated by a predetermined distance. That is, an internal chamber 74 is formed between the oil seal 57 and the brush holder 64 so as to surround the cylindrical portion 52a of the rotation shaft 52. The internal chamber 74 is formed between the bearing block 51 and the brush holder 64. The communication space 75 formed by the labyrinth space between the outer space 7 of the brush holding portion 33
It communicates with 6.

A connection port 78 for connecting the tip of a brush cleaning liquid supply pipe 77 extending from a brush cleaning liquid tank (not shown) is formed through the peripheral wall of the fixed portion 53 of the bearing block 51 so as to penetrate to the internal chamber 74. ing. The brush cleaning liquid supplied from the brush cleaning liquid supply pipe 77 to the internal chamber 74 via the connection port 78 flows from the internal chamber 74 to the communication path 75, and is formed by the annular groove 70 and the inner peripheral wall 54 of the bearing block 51. It is stored in a constricted portion 79 having a U-shaped cross section formed on the way.

Therefore, the inner chamber 74 is provided with a constricted portion 79.
Is sealed from the external space 76 by the brush cleaning liquid 1 stored in the outside. Accordingly, particularly when the wafer processing liquid is a chemical, the atmosphere containing the wafer cleaning liquid (chemical) in the outer space 76 does not reach the internal chamber 76, so that the oil seal 57 is not corroded by the wafer cleaning liquid (chemical) atmosphere. Can be prevented. Further, even if particles are generated by sliding contact between the cylindrical portion 52a of the rotation shaft 52 and the oil seal 57, the internal chamber 74 and the external space 76 are isolated by the brush cleaning liquid 1 stored in the constricted portion 79, so that The particles do not scatter to the external space 76. Therefore, the particles do not adhere to the surface of the wafer W after the cleaning process and contaminate the surface of the wafer W.

On the outer peripheral surface of the cylindrical portion 69 of the brush holder 64, there is formed a tongue portion 80 projecting outward by a predetermined distance and further hanging downward. The upper surface of the tongue portion 80 is a tapered surface 80a that spreads downward.
An annular concave portion 81 is formed on the inner peripheral surface of the cylindrical portion 69, and an O-ring 82 is fitted into the annular concave portion 81.

A joint 83 is detachably attached to the cylindrical portion 69 of the brush holder 64. The joint 83 includes a fitting portion 84 fitted inside the cylindrical portion 69 and a cylindrical portion 69.
And a bolt portion 86 provided below the flange portion 85. Fitting 8
In the center of 3, a flat square engaging hole 83a with which the tip of the prism portion 52b of the rotation shaft 52 engages is formed. A cut 87 having a V-shaped cross section is formed at a predetermined position on the outer peripheral surface of the fitting portion 84. Therefore, the joint 83
Is attached to the cylindrical portion 69, and the prism portion 52b
Is engaged with the engagement hole 83a, and the cylindrical portion 6
9 fits into the O-ring 82
The brush rotation motor 6 does not fall off from the cylindrical portion 69 and
The rotation driving force from 0 is transmitted through the rotation shaft 52 and driven.

A male screw 88 is formed on the outer peripheral surface of the bolt portion 86 so that a cap 89 for fixing the disk brush 34 to the joint 83 can be screwed thereon. More specifically, the disk brush 34 has a configuration in which a cylindrical brush part 34b having a smaller diameter than the base part 34a is fixed to the lower surface of a disk-shaped base part 34a. The cap 89 includes a bottom portion 91 having a hole 90 of a size that allows the insertion of the brush portion 34b and prevents the insertion of the base portion 34a, and a peripheral wall that rises upward from the periphery of the bottom portion 91. And a portion 92. On the inner peripheral surface of the peripheral wall portion 92, a female screw 93 is formed from the upper end to near the middle. The attachment of the disc brush 34 to the joint 83 accommodates the base portion 34a inside the cap 89,
With the brush portion 34b inserted into the hole 90, the peripheral wall portion 92
This is achieved by screwing a female screw 93 into an external thread 88 on the outer periphery of the bolt portion 86.

As described above, when the disk brush 34 is cleaned, the lower surface of the disk brush 34 is rotated while being immersed in the brush cleaning liquid in the brush cleaning pot 36. On the other hand, the valve 38 is opened, and the brush cleaning liquid is supplied from the brush cleaning liquid supply pipe 77 to the internal chamber 74. As a result, the brush cleaning liquid supplied to the inner chamber 74 flows from the inner chamber 74 into the communication passage 75, and further overflows from the constricted portion 79 formed in the middle of the communication passage 75, and the outer peripheral wall 55 of the bearing block 51. And flows out of the brush holder 64 into the external space 76 from between the square hole 68 of the brush holder 64. Thus, the brush cleaning liquid 1 in the constricted portion 79 can be replaced, and the particles captured by the brush cleaning liquid 1 can be discharged. Also, the internal chamber 74
The particles captured by the brush cleaning liquid attached to the wall surface (the surface of the bearing block 51 and the brush holder 64) forming the communication passage 75 can also be washed away.

Further, when the wafer cleaning liquid is a chemical liquid,
By replacing the brush cleaning liquid 1 in the constricted portion 79, the wafer cleaning liquid (chemical solution) dissolved in the brush cleaning liquid in the constricted portion 79 can be discharged during the cleaning processing of the wafer W. The valve 38 is closed a predetermined time before the cleaning of the disk brush 34 is completed, and the disk brush 34 (the brush holder 64) is further rotated even after the valve 38 is closed. Due to the centrifugal force generated by the rotation of the brush holder 64, a part of the brush cleaning liquid 1 accumulated up to the upper end of the constricted portion 79 is discharged, and the level of the brush cleaning liquid 1 stored in the constricted portion 79 decreases. Therefore, at the time of cleaning the wafer W, the brush cleaning liquid 1 stored in the constricted portion 79 does not overflow due to the rotation of the brush holder 64 and contaminate the wafer W.

FIG. 3 is a sectional view showing the configuration of a brush holding section 110 according to a second embodiment of the present invention. 3, portions corresponding to the respective portions shown in FIG. 2 are denoted by the same reference numerals. In the following, a description will be given mainly of a portion different from the configuration of the brush holding portion 33 according to the first embodiment, and a detailed description of a portion having a similar configuration will be omitted.

The brush holder 110 is provided with the swing arm 3
2 is formed on the lower surface of the tip of the bearing block 111.
And a rotation shaft 52 rotatably held by the bearing block 111, a brush holder 112 detachably attached to the rotation shaft 52, and a joint 83 detachably attached to the brush holder 112. Disk brush 34
Is attached to the lower surface of the joint 83 by a cap 89.

The bearing block 111 has a substantially cylindrical shape, and has a bearing holding portion 53a on its inner periphery.
And a seal holding portion 53b having a larger diameter than the bearing holding portion 53a formed below the bearing holding portion 53a.
Are formed. A bearing 56 and an oil seal 57 are press-fitted and fixed to the bearing holding portion 53a and the seal holding portion 53b, respectively. The rotation seal 52 and the bearing 56 are formed by the oil seal 57.
This prevents particles generated by sliding contact with the particles from scattering downward.

The brush holder 112 has an outer shape that is rotationally symmetric with respect to an axis passing through the center of the rotation shaft 52, and has a flat circular hole 65 formed through the cylindrical portion 52 a of the rotation shaft 52. A rectangular hole portion 114 which is provided below the locking portion 113 and is continuous with the rectangular portion 52b of the rotation shaft 52 and penetrates the rectangular column portion 52b of the rotation shaft 52; It further includes a cylindrical portion 115 provided further below and having a smaller diameter than the locking portion 113 and the square hole portion 114.

The locking portion 113 has substantially the same outer diameter as the bearing block 111, and an annular groove-shaped storage tank 116 is formed on the upper surface thereof. In a state where the brush holder 112 is attached to the rotation shaft 52, the locking portion 113 and the oil seal 57 fixed to the bearing block 111 are separated by a predetermined distance, and around the cylindrical portion 52 a of the rotation shaft 52. , An internal chamber 117 including a storage tank 116 is formed. The inner chamber 117 is communicated with the outer space 76 of the brush holding unit 110 by a gap between the locking unit 113 and the oil seal 57. That is, in the second embodiment, the gap between the locking portion 113 and the oil seal 57 is
A communication passage that connects the internal chamber 117 and the external space 76 is configured.

Further, on the peripheral wall of the bearing block 111, a connection port 118 for connecting a tip of a brush cleaning liquid supply pipe 77 extending from a brush cleaning liquid tank (not shown) is formed. The connection port 118 is formed horizontally by a predetermined distance from the outer peripheral surface of the bearing block 111 toward the rotation shaft 52,
It is formed further downward, and its outlet is
I am facing 7. Therefore, the brush cleaning liquid supply pipe 77
Is supplied to the internal chamber 117 through the connection port 118, and is stored in the storage tank 116 formed in the brush holder 112.

Thus, even if particles are generated by sliding contact between the cylindrical portion 52a of the rotation shaft 52 and the oil seal 57, the particles fall into the brush cleaning liquid 2 stored in the storage tank 116 and are captured. . Therefore, even with the configuration according to the second embodiment, it is possible to reduce the risk that particles generated by the sliding contact between the rotation shaft 52 and the oil seal 57 scatter into the external space 76,
As a result, the particles are washed by the wafer W after the cleaning process.
Is less likely to adhere to the surface of the wafer W and contaminate the surface of the wafer W.

The particles captured by the brush cleaning liquid 2 in the storage tank 116 open the valve 38 when the disk brush 34 is cleaned and supply the brush cleaning liquid, as in the case of the above-described first embodiment. The brush cleaning liquid can be supplied from the pipe 77 to the internal chamber 117 and discharged from the storage tank 116 by overflowing the brush cleaning liquid.

Although the two embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, but can be implemented in various forms. For example, in the first embodiment, as shown by a two-dot chain line in FIG. 2, an annular groove formed in the bearing block according to the second embodiment is formed on the upper surface of the locking portion 66 of the brush holder 64. May be further formed. In this case, scattering of particles generated by sliding contact between the rotation shaft and the oil seal can be more reliably prevented.

The cleaning of the disk brush is not limited to after the above-described predetermined number of wafer cleaning processes, but may be performed at any timing other than during the wafer brush cleaning process, for example, immediately before the wafer cleaning process is started. It can be carried out. By performing the cleaning of the disk brush other than during the wafer cleaning process, it is possible to prevent the wafer from being contaminated by particles discharged together with the brush cleaning liquid from the internal chamber. In addition, if a collecting means for collecting the brush cleaning liquid is further provided so that the brush cleaning liquid overflowing from the internal chamber does not scatter to the wafer, the internal chamber can be cleaned even during the wafer cleaning processing. It is. Specifically, in the embodiment of FIG. 2, the collecting means may be configured such that a pipe for collecting the brush cleaning liquid is provided around the tongue 80 of the cylindrical section 69 with a collecting tank connected to the bottom. .

Further, in each of the above-described embodiments, the description has been given of the substrate cleaning apparatus provided with the self-revolving brush device for scrub cleaning the surface of the horizontally held wafer with a disk brush. However, the present invention is not limited to the substrate cleaning apparatus provided with the rotation-revolving brush device, but also includes a roll brush provided on a peripheral surface of a rotation shaft extending vertically on a surface of a wafer held along a vertical plane. The present invention can be applied to a substrate cleaning device employing a roll brush device for cleaning.

In each of the above embodiments, an apparatus for cleaning a wafer has been described as an example. However, the present invention is not limited to this, and the present invention can be applied to other types of substrates such as a glass substrate for a liquid crystal display and a glass substrate for a PDP display. The present invention can also be applied to an apparatus for cleaning a processing substrate. In addition, it is possible to make various design changes within the technical scope described in the claims.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram illustrating a configuration of a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a configuration of a tip portion of the swing arm shown in FIG.

FIG. 3 is a sectional view for explaining a second embodiment of the present invention.

FIG. 4 is a diagram showing a conceptual configuration of a substrate cleaning device employing a self-revolving brush device.

FIG. 5 is a cross-sectional view illustrating a configuration of a conventional self-revolving brush device.

[Explanation of symbols]

 34 Disc brush (scrub member) 56, 58 Bearing (sliding part) 57 Oil seal (sliding part) 38 Valve (liquid supply means) 40 Control part 52 Rotating shaft 74, 117 Internal chamber 75 Communication path 76 External space 77 Brush Cleaning liquid supply pipe (liquid supply means) 78, 118 Connection port (liquid supply means) 79 Neck (constriction path, storage) 116 Storage tank (storage)

Claims (5)

[Claims] 1. A scrub member rotatable around a predetermined rotation axis while being in contact with the substrate for cleaning the substrate, a sliding section that slides by rotation of the rotation axis, and a sliding section. An inner chamber formed so as to surround the rotating shaft below the inner shaft; a communication passage communicating the inner chamber with the outer space; a liquid supply unit for supplying a liquid to the inner chamber; A substrate storage device provided at any position of the space leading to the communication path, wherein the storage unit stores the liquid supplied from the liquid supply unit. 2. The substrate cleaning apparatus according to claim 1, wherein a constricted path extending upward after extending downward is provided at an intermediate portion of the communication path. 3. The substrate cleaning apparatus according to claim 2, wherein the storage section is provided in a narrow path of the communication path. 4. The substrate cleaning apparatus according to claim 1, wherein the storage section is provided inside the internal chamber so as to surround the rotation shaft. 5. The apparatus according to claim 1, further comprising a control unit for controlling said liquid supply means so as to supply liquid to said internal chamber during a period when no substrate exists below said scrub member. A substrate cleaning apparatus according to any one of the above.