JPH11135041A - Vacuum airtight container, display element, and power element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress crack formation of a frit glass seal part in a part in contact with a wiring part, to prevent the leakage, and to provide high efficiency and reliability by forming an inner terminal and an outer terminal in the sealing inside and the sealing outside of a first substrate, electrically connecting to each other, and wiring a lead wire via the inside of the first substrate. SOLUTION: A vacuum airtight container is provided with a cathode array substrate 8, a frame intermediate panel 7, and a front panel 9 on a rear panel 1 in order. Outer terminals 3, 5 connected to the inner lead wire are provided in the rear face of the rear panel 1. The rear panel 1 is provided with a recess part for storing the cathode array substrate 8, and an array inner terminal electrode and an inner terminal electrode for an anode electrode are formed on the circumferential part. The front panel 9 is provided with a transparent electrode and an anode electrode composed of a phosphor are provided on a transparent glass substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum hermetic container, and more particularly to a vacuum hermetic container enclosing a field emission cathode.

[0002]

2. Description of the Related Art A conventional vacuum-tight container is, for example, shown in FIG.
As shown in FIG. 1, a front panel 102 on which an anode electrode 105 is formed and a rear glass panel 101 on which a field emission cathode array substrate 104 is provided are arranged via a glass substrate 103 on the side. Front panel 102
And the side glass substrate 103 and between the rear glass panel 101 and the side glass substrate 103 are sealed with frit glass 106 for sealing, and a vacuum-tight container is formed by holding the inside of the container at a vacuum. I have.

FIG. 41 is a partially enlarged view of the anode electrode 105 and the cathode array substrate 104. As illustrated, the cathode array substrate 104 has an emitter electrode 114 provided on the cathode electrode 111 and a gate electrode 113 provided with an insulating layer 112 interposed. On the other hand, the front glass panel 102 has a transparent electrode 1
Electrode 10 formed by laminating phosphor 16 and phosphor 115
5 are formed. Driving wiring is drawn out from the end of the cathode array substrate 104, and the drawing wiring is electrically connected to the wiring routed on the cathode substrate with a conductive adhesive such as doughite or Ag paste. .

At the ends of the front panel substrate 102 and the rear panel substrate 101, wiring is taken out as shown in the sectional view of FIG. 42 for supplying power to the anode electrode 105 and driving the cathode array substrate 104. Part 107
Are formed through the inside of the seal portion 106. Between the side panel 103 and the front panel 102 and between the side panel 103 and the back panel 101 are fused with a seal portion 106 made by firing frit glass. In the vacuum airtight container having such a configuration, the wiring take-out section 10
In order to take 7 out of the container, as shown in the sectional view of FIG. 42, it is necessary to penetrate the sealing frit glass 106 from the inside of the container. Since the wiring metal and the frit glass are in direct contact, the following problem has occurred due to the difference in the coefficient of thermal expansion. That is, there is a large difference in the coefficient of thermal expansion between the wiring portion 107 and the frit glass 103, and a minute crack is generated in the frit glass seal portion 106 in contact with the wiring metal, and a leak is generated from the crack to keep the inside of the container at a vacuum. I couldn't do that.

Further, as described above, in the conventional structure, the cathode array substrate is taken out of the driving wires by applying a conductive adhesive to the wires drawn on the back panel to make electrical connection. However, with this method, it is becoming impossible to cope with the miniaturization of the driving wiring accompanying the high definition of the cathode array.

On the other hand, as a large-area element accommodating a plurality of cathode substrates, there is a vacuum hermetic container as disclosed in Japanese Patent Application Laid-Open No. 7-230943. FIG. 43 is a plan view showing the structure of the vacuum-tight container, and FIG. 44 is a cross-sectional view taken along line GG ′ of the plan view. As shown in FIG. 44, a plurality of cathode array substrates 211 are housed inside a frame 221 arranged on a support substrate 220, and the phosphor substrates 230 are arranged at regular intervals by interposing spacers 240. Have been. The end portion of the phosphor substrate 230 is fixed by an adhesive seal portion 233, exhausted from the exhaust through hole 234 to make the inside of the container a high vacuum, and then the through hole 234 is sealed with a solder 236 to seal the inside of the container. High vacuum can be maintained. As shown in FIG. 43, a lead electrode 222 for driving the cathode substrate is drawn out of the container.

FIG. 45 is a plan view showing the electrical connection between the emitter electrode and the gate electrode of each cathode array substrate 211 and the outside. As shown in FIG. 45, each of the emitter electrode lines 213 and the gate electrode lines 21
4 is drawn out to the end of the cathode array substrate 211. At this end, a protrusion (Au / Ni laminate) (not shown) having good wettability with solder is formed.

As shown in the figure, a plurality of cathode array substrates 211 are housed inside a frame 221 and solder wires are brought into contact with the projections at the ends of the respective cathode array substrates 211 so that the solder layers 261 are formed on the projections. Is formed, and at the same time, electrical connection with the adjacent cathode array substrate 211 is established. In addition, by securing the electrical connection between the extraction electrode 222 formed on the frame 221 and the cathode array substrate 211 in the same manner, the extraction electrode 222 provided on the frame 221 can be used. 2
In this configuration, it is possible to drive the cathode array 210 of the plurality of cathode array substrates 211 housed in the inside 21.

In this conventional configuration, the extraction electrode 222 is drawn out of the container through the adhesive seal portion 233 using frit glass from the inside of the container on the frame 221. Since the wiring metal and the frit glass are in direct contact with each other, the adhesive seal portion 23 that comes into contact with the wiring metal due to the difference in the coefficient of thermal expansion between them
In No. 3, there was a problem that a minute crack was generated, and a leak was generated from the crack, so that the inside of the container could not be maintained at a vacuum.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is intended to prevent the occurrence of cracks in a frit glass seal portion at a portion in contact with a wiring portion to thereby prevent leakage. An object of the present invention is to provide an efficient and reliable vacuum hermetic container. Another object of the present invention is to provide a display element and a power element using the vacuum hermetic container.

[0011]

In order to solve the above-mentioned problems, the present invention provides a first substrate and a space between the first substrate and the first substrate.
A second substrate facing the first substrate, a sealing member for sealing the first substrate and the second substrate, and a second substrate formed on a surface of the second substrate facing the first substrate; A field emission cathode substrate having a gate electrode and an emitter array, the anode electrode being disposed on the first substrate at a distance from the second substrate, and a sealing interior of the first substrate. And an external terminal formed outside the sealing of the first substrate, and the internal terminal and the external terminal are electrically connected to each other through the inside of the first substrate. Provided is a vacuum-tight container having a wiring routed therein.

Further, the present invention seals a first substrate, a second substrate arranged to be spaced apart from and opposed to the first substrate, and sealing the first substrate and the second substrate. A sealing member,
An anode electrode formed on a surface of the second substrate facing the first substrate; a gate electrode and an emitter array disposed on the first substrate at a distance from the second substrate; A plurality of field emission cathode substrates each having an internal terminal formed inside a seal of the first substrate; an external terminal formed outside a seal of the first substrate; Electrically connecting with the external terminal,
A vacuum-tight container, comprising: a wiring routed through the inside of the first substrate.

[0013] The present invention further provides a vacuum-tight container as described above,
First voltage applying means for applying a positive voltage to the anode electrode; a load disposed between the first voltage applying means and the anode electrode; and a voltage applied to a gate electrode of the cathode substrate. And a second voltage applying means for applying the power.

Still further, the present invention provides a mounting substrate, a driving circuit disposed on the mounting substrate, and a plurality of FED elements mounted on the mounting substrate and electrically connected to the driving circuit. Wherein the FED element comprises a first
A substrate, a second substrate arranged to be separated from and opposed to the first substrate, a seal member for sealing the first substrate and the second substrate, A field emission cathode having an anode electrode formed on a surface facing the first substrate, and a gate electrode and an emitter array disposed on the first substrate at an interval from the second substrate; A substrate, an internal terminal formed inside the sealing of the first substrate, an external terminal formed outside the sealing of the first substrate, and electrically connecting the internal terminal and the external terminal Further, the present invention provides a display element comprising vacuum-tight containers each having a wiring routed through the inside of the first substrate.

In the vacuum-tight container according to the present invention, since the routing wiring is provided inside the first substrate which is the back panel on which the cathode array substrate is installed, external wiring is provided to the anode electrode via the routing wiring. , And can drive the cathode substrate. Since the wiring circuit is provided inside the rear panel in this way, there is no need for a wiring take-out part that penetrates the frit glass seal, and the problem of cracks due to the difference in the coefficient of thermal expansion between the wiring metal and the frit glass is assured. Could be avoided. Therefore, according to the present invention, a highly efficient and highly reliable field emission device can be realized.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) FIG. 1 is a perspective view schematically showing a configuration of an example of a vacuum-tight container of Embodiment 1, and FIG. 2 is a cross-sectional view of the vacuum-tight container shown in FIG. Shown in

As shown in the drawing, the vacuum-tight container of the present embodiment basically has a configuration in which a cathode array substrate 8, a frame-shaped intermediate panel 7, and a front panel 9 are sequentially provided on a rear panel 1. is there. On the side surface of the back panel 1, there are provided external terminals 3 and 5, respectively, which are connected to internal wiring. In the present invention, these external terminals 3
The outer surface of the container in which the containers 5 and 5 are provided, or the outside from the outer surface, is defined as a sealed outside, and the inside of the container defined by the back panel 1, the front panel 9, the intermediate panel 7, and the like is defined as the sealed inside. The inside of the seal includes not only the area inside the container but also the seal portion of the seal member 10 as shown in FIG.

As shown in FIG. 2, the front panel 9 has a structure in which a transparent electrode 12 and an anode electrode made of a phosphor 13 are provided on a translucent glass substrate.

FIG. 3 shows the structure of the back panel 1 used in the vacuum-tight container of this embodiment. The rear panel 1 has a concave portion for accommodating the cathode array substrate 8, and has an array internal terminal electrode 15 and an anode internal electrode electrode 16 formed on the peripheral edge thereof. The terminal electrode here can be formed by, for example, laminating a Cu layer and an Au layer on the W electrode. As shown in the cross-sectional view of FIG. 2, the array internal terminal electrode 15 is connected to an external terminal formed on an outer peripheral portion thereof through a wiring circuit 4 including a through hole filled with a conductive material and internal wiring. 3 is electrically connected. The internal terminal electrode 16 for the anode electrode also has an internal wiring circuit (not shown).
And is electrically connected to an external terminal 5 formed on the outer peripheral portion.

A notch 14 for exhaust is provided in advance on one side of the peripheral portion of the back panel 1, and the T-shaped jig 2 corresponding to the notch 14 is joined via an adhesive. After the evacuation, the inside of the T-shaped jig 2 can be maintained at a vacuum by sealing the T-shaped jig 2. FIG. 4 shows an example of the T-shaped jig 2.
In FIG. 4, reference numeral 17 denotes a cutout sealing material.

FIG. 5 is a perspective view showing the intermediate panel 7 used in the vacuum airtight container of this embodiment. FIG. 5 (a)
Fig. 5 (b) is a configuration viewed from the front panel 9 side.
Shows the configuration of the intermediate panel 7 as viewed from the rear panel 1 side.

As shown in FIGS. 5A and 5B, on the upper and lower surfaces of the intermediate panel 7, internal terminal electrodes 6a and 6b corresponding to lead wires of the anode substrate are formed, respectively. Further, as shown in FIG. 5B, on the rear panel 1 side of the intermediate panel 7, an internal terminal electrode 11 corresponding to the lead wiring of the cathode substrate is provided. The internal terminal electrodes 6a, 6b, 11 on the upper and lower main surfaces are electrically connected via a wiring circuit (not shown) composed of through holes formed in the intermediate panel 7 and wirings.

FIG. 6 shows the intermediate panel 7 shown in FIG.
7 shows an enlarged view of the internal terminal electrode 11 provided on the rear panel 1 side of the intermediate panel 7. FIG. In these drawings, the intermediate panel 7 is shown in a direction arranged on the back panel 1. As shown in the figure, the internal terminal electrode 11 has two projecting electrodes 11a and a wiring 11b connecting them at both ends. As shown in the enlarged view of FIG. 7, the terminal electrode 11 is composed of a wiring 11b mainly composed of W and a protruding electrode 11a, and a Cu layer 19 and an Au layer 2
0 are sequentially formed.

The front panel 9 and the rear panel 1 as described above are mechanically joined via the intermediate panel 7 by a seal portion 10 made of frit glass as shown in the sectional view of FIG. The anode electrode (not shown) of the front panel 9 is connected to the protruding electrode of the upper internal terminal electrode 6a of the intermediate panel 7 connected to the lead line and the internal wiring (not shown) of the lower part of the intermediate panel 7 via the internal wiring (not shown). It is electrically connected to the terminal electrode 6b. Furthermore, it is connected to the internal terminal electrode 16 on the peripheral edge of the back panel 1 via the protruding electrode, and the external terminal 5 on the outer peripheral portion via a wiring circuit (not shown) inside the rear panel.
Is electrically connected to With such a configuration, power can be supplied to the anode electrode from outside the container.

As shown in FIG. 2, a field emission type cathode substrate 8 in which a gate electrode and an emitter array (not shown in detail) are formed is provided in a concave portion of the back panel 1. Since the intermediate panel 7 is provided on the periphery of the back panel 1, one of the projecting electrodes 11 a provided below the intermediate panel 7 is connected to the cathode array substrate 8.
The other end is connected to a drive wiring take-out portion drawn out, and the other end is connected to an internal terminal 15 provided on a peripheral portion of the back panel 1. Since the internal terminal 15 is connected to the external terminal 3 on the outer peripheral portion via the wiring circuit 4 inside the rear panel 1, this configuration enables the cathode substrate to be driven from outside the container.

The above-mentioned vacuum-tight container was manufactured by the following method.

In manufacturing the front panel 9, first,
An ITO transparent electrode 12 having a thickness of 300 nm is formed on a soda lime substrate having a thickness of 2 mm by sputtering, and then a 3 μm-thick Zn: Zn film is formed thereon by screen printing.
An O phosphor film 13 was formed. A lead line is formed from the ITO transparent electrode 12 at the end of the substrate, and A
A u-plated film (not shown) was provided.

The back panel 1 is formed by laminating a green sheet mainly composed of alumina powder having an average particle diameter of 1 μm using a high melting point metal material mainly composed of W as a conductive material.
The substrate and the wiring portion were formed by simultaneous firing at 100 ° C. In the first layer corresponding to the lowermost layer as a green sheet before firing, an area corresponding to the internal wiring was formed by screen printing in advance. In the second layer corresponding to the outermost peripheral portion, a sheet is formed by punching the outer shape into a frame shape, and one side of the sheet is removed corresponding to the cutout portion 14, and then punched into a region corresponding to the through hole. Drilled holes. A conductive material was filled in the through-hole, and a terminal electrode pattern and a protruding electrode were formed by printing.

The first and two layers thus obtained were laminated, and a protruding electrode was formed by printing in regions corresponding to the terminal electrodes 3 and 5 on the outer periphery, and then fired at 1100 ° C. The fired rear panel 1 is immersed in a plating bath, and a Cu layer and Au
By laminating the layers, an integrated back panel 1 having a concave portion was formed.

The portion corresponding to the T-shaped jig 2 was also formed by molding and firing an alumina green sheet.

The intermediate panel 7 is formed by molding a green sheet mainly composed of alumina powder having an average particle diameter of 1 μm using a high melting point metal material mainly composed of W as a conductive material.
The substrate and the wiring portion were formed by simultaneous firing at 100 ° C. As a green sheet before firing, print the wiring by screen printing on a sheet whose outer shape is punched out in a frame shape, punch holes in the area corresponding to the through holes and fill with conductive material, and also print the projecting electrodes by printing. Formed.
After baking this sheet at 1100 ° C., it was immersed in a plating bath, and a Cu layer and an Au layer were laminated on the internal terminal electrodes as shown in FIG. 7 to form a frame-shaped intermediate panel 7.

After the front panel 9, the rear panel 1, the intermediate panel 9 and the T-shaped jig 2 are formed as described above,
According to the process shown in FIG. 8, the vacuum-tight container of this example was manufactured. First, as shown in FIG.
In addition, a field emission type cathode substrate 8 having a gate electrode and an emitter array formed therein was placed in a concave portion of the back panel 1 in which the wiring circuit 4 and the like were formed. A frit glass 10 containing lead oxide as a main component was applied by a dispenser to a peripheral portion of the back panel 1 excluding the cutout portion 14 with a width of about 20 μm.

Next, as shown in FIG. 8 (b), the rear panel 1 has an end portion of the driving wiring extended to the end portion of the cathode substrate 8 and an inner terminal electrode 11 of the intermediate panel 7 on the rear panel 1 side. The intermediate panel 7 was joined with the projection electrode 11a aligned. Protruding electrode 1 formed on intermediate panel 7
1a was connected to the driving wiring end of the cathode substrate 8 through the 10 layers of frit glass.

Subsequently, a frit glass 1 containing lead oxide as a main component is dispensed on a peripheral portion of the intermediate panel 7 by a dispenser.
0 was applied with a width of about 20 μm. The protruding electrode 6a on the front panel 9 side of the intermediate panel 7 and the Au pattern of the lead wiring drawn from the anode electrode of the front panel 9 are aligned as shown in FIG. Joined.

As described above, the front panel 9 and the intermediate panel 7
After bonding the rear panel 1 and the rear panel 1, the frit glass 10 was fired at 400 ° C. to obtain a structure as shown in FIG. After firing, this container and a T-shaped jig 2 in which a frit glass 17 containing lead oxide as a main component was previously applied to a desired region were placed in a vacuum exhaust chamber and evacuated to 10 ^-7 Torr. T-shaped jig 2
Was inserted into the cutout portion 14. Next, 40
The temperature was raised to 0 ° C., and the frit glass 17 applied to the seal portion of the T-shaped jig 2 was fired. Thereafter, the temperature in the exhaust chamber was lowered, and the container was taken out of the exhaust chamber, thereby forming a vacuum-tight container hermetically sealed to a high vacuum.

In the vacuum-tight container obtained in the above steps, a power supply line to the anode electrode and a signal line for driving the cathode are connected to the external terminals 3 and 5 in a region corresponding to the lower back panel 1 respectively. Then, the front panel 9
In the translucent region, light emission of the phosphor 13 due to field emission from the cathode substrate 8 was confirmed. No degradation of the display element was observed even after 1000 hours of continuous light emission, and the inside of the container was kept at a high vacuum, confirming that highly efficient light emission was possible.

The vacuum-tight container of the present embodiment is not limited to the above-described example, and various changes can be made. For example, although the protruding electrodes are provided on the side surface of the rear panel 1 as external terminals, the connecting pins 21 may be provided on the rear panel 1 as external terminals as shown in FIG. FIG. 10 is a perspective view of the back panel used here. The back panel having the external take-out pins 21 integrated as described above is provided with a connecting pin mainly composed of a high melting point metal between the first layer and the second layer when the back panel green sheet is integrally fired. 21
Can be formed by sintering.

The external terminals can be provided not only on the side surface of the back panel 1 but also on the back surface. In particular,
As shown in FIG. 11, a bump array 22 in which external terminals are collected on the lowermost layer of the rear panel may be formed by laying out internal wiring by making the rear panel green sheet into multiple layers.

The back panel 1 can be manufactured using not only the above-mentioned materials but also glass such as Pyrex glass, soda lime glass, and plate glass, a resin such as benzocyclobutene and polyimide, and glass epoxy.

The rear panel 1 does not necessarily have to have a concave portion as described above, but preferably has a concave portion for the following reasons. In other words, the positioning when mounting the cathode substrate is simple, and the terminal electrodes formed on the concave portion and the terminals on the cathode substrate are close to the same plane, so that the projecting electrodes formed on the intermediate panel are collectively used. The point that can be connected.

The vacuum-tight container of this embodiment has a back panel 1
Can be mounted on a motherboard on which a drive circuit is arranged by inserting the connection pins 21 provided on the motherboard or connecting the bump array 22 with solder or the like. FIG.
2 is a ball grid array 24 on the lowermost layer of the back panel.
FED (Field Emitte)
An example is shown in which an r Display element 23 is mounted on a motherboard 25 together with a driving circuit 26 to form a large-area display element. A plan view of the display element shown in FIG. 12 is as shown in FIG. 13, and as shown in FIG.
6 and the FED element 23 are connected by a lead wiring 27.

In the above-described example, the protruding electrodes provided on the intermediate panel 7 were used in order to electrically connect the cathode substrate 8 and the internal terminal electrodes 15 of the rear panel 1.
As shown in FIG. 4, after the cathode substrate 8 is housed in the concave portion of the rear panel 1, the lead-out portion of the driving wiring at the end of the cathode substrate 8 and the internal terminal electrode 15 of the rear panel 1 are directly connected by wire bonding 18. Thereby, these electrical connections may be ensured.

In the above-described example, when the container is evacuated, a notch is provided in the back panel 1 in advance, the container is placed in an exhaust chamber and evacuated to a vacuum, and then the T-shaped jig 2 is sealed with a sealing material 17. Although the high vacuum inside the container is maintained by wearing, the gas may be exhausted using an exhaust pipe. FIG. 15 shows a perspective view of a vacuum-tight container formed by a method using the exhaust pipe 29, and FIG. 16 shows a perspective view of the intermediate panel 7 used here. The intermediate panel shown in FIG. 16 can be manufactured as follows. That is, an insertion hole for an exhaust pipe is provided in advance when the intermediate panel 7 is fired, and after the intermediate panel 7 is fired, the exhaust pipe 29 of a hollow glass is inserted to fire the frit glass 31 of the sealing portion, and the exhaust pipe 29 is fixed.
FIG. 17 is a cross-sectional view taken along the line CC ′ in FIG. As shown in the drawing, a hollow glass exhaust pipe 29 is inserted into an insertion hole formed at a predetermined position of the intermediate panel 7,
It is fixed by frit glass 31.

The front panel 9 and the back panel 1 are operated in the same manner as described above, except that the intermediate panel thus obtained is used.
And the frit glass seal portion 10 at the joint between the panels is fired. After that, it is connected to a vacuum exhaust device through the exhaust pipe 29, and the inside of the container is evacuated to 10 ^-7 Torr, and then the exhaust pipe end 30 is sealed with a gas burner to maintain a high vacuum in the container. Thereby, the vacuum airtight container of the present embodiment can be manufactured.

Further, in order to obtain a high vacuum in the container, FIG.
As shown in FIG. 8, it is also possible to insert a sheet-like getter material 32 below the cathode substrate 8. As shown in FIG. 19, the back panel used here has a green sheet for the back panel in a multilayer structure and has two recesses, and a recess for further installing the getter material 32 under the installation portion of the cathode substrate 8 is formed. Form. On the surface of the concave portion, a heater electrode 33 is formed in advance at the stage of a green sheet, and an internal electrode is routed to provide an electrode extraction end 34 outside the rear panel 1. After the back panel 1 is integrally fired, the getter material 32 is inserted into the lowermost concave portion, and the cathode substrate 8 is placed thereon, leaving a gap 35 thereon.

FIG. 20 is a plan view of the back panel 8 having the getter material 32. In the figure, A _c represents an installation area of the cathode substrate, A _g represents an installation area of the getter material. Installation area A _g of the getter material, as shown,
Wider than installation area A _c of the cathode substrate, the cathode substrate 8
The getter member 32 at the lower part can efficiently absorb gas which may be generated when the field emission is performed. Getter material 32 inserted in a vacuum-tight container
Is heated by energizing the heater electrode 33 by external power supply, so that the getter material 32 can be activated.

With such a structure, in addition to the effect of activating the getter material 32 at the time of evacuation of the inside of the container and improving the evacuation efficiency, the activation of the getter material 32 is periodically performed even after airtightness. The reliability of high vacuum holding can be further improved.

In the vacuum-tight container of this embodiment, since the first and second wiring circuits are provided inside the rear panel, it is possible to supply power from the outside to the anode electrode through the internal wiring circuits. Besides, the cathode substrate can be driven via these wiring circuits.

Since there is no need to provide a wiring take-out portion penetrating the frit glass seal portion in this manner, cracks due to the difference in the coefficient of thermal expansion between the wiring metal and the frit glass are completely avoided, and the efficiency is improved. A field emission device can be obtained.

In addition, since the driving wires of the cathode array substrate are electrically connected to the external terminals via the internal terminals provided on the rear panel, fine projections are required even when the cathode array wiring is miniaturized. By forming an array of electrodes, highly reliable fine connection can be achieved.
Therefore, it is possible to cope with higher definition of the cathode array.

(Embodiment 2) FIG. 21 is a perspective view schematically showing an example of the structure of a vacuum-tight container according to a second embodiment. FIG. 21 is a cross-sectional view of the vacuum-tight container taken along the line DD 'shown in FIG. Is shown in FIG.

As shown in the figure, the vacuum-tight container of this embodiment is basically provided with a plurality of cathode array substrates 48, a window frame-shaped intermediate panel 47, and a front panel 49 on a rear panel 41 in that order. Configuration. Back panel 41
Are provided with external terminals 43 and 45 respectively connected to the internal wiring.

As shown in FIG. 22, the front panel 29
In this configuration, a transparent electrode 52 and an anode electrode made of a phosphor 53 are provided on a translucent glass substrate.

FIG. 23 shows the structure of the back panel 41 used in the vacuum-tight container of this embodiment. The back panel 41
It has a plurality of recesses for accommodating the cathode array substrate 48, and has an array internal terminal electrode 5
5 and an internal terminal electrode 56 for an anode electrode. The terminal electrode here can be formed by, for example, laminating a Cu layer and an Au layer on the W electrode. As shown in the cross-sectional view of FIG. 22, the array internal terminal electrode 55 is connected to an external terminal formed on the outer peripheral portion through a wiring circuit 44 including a through hole filled with a conductive material and an internal wiring. 43 and is electrically connected. The internal terminal electrode 56 for the anode electrode is also
It is electrically connected to an external terminal 45 formed on an outer peripheral portion via an internal wiring circuit (not shown).

A notch 54 for exhaust is provided in advance on one side of the peripheral portion of the back panel 41, and a T-shaped jig 42 corresponding to the notch 54 is joined via an adhesive. After the evacuation is completed, the inside of the T-shaped jig 42 can be maintained at a vacuum by sealing the jig 42. In addition, an internal cutout portion 57 is provided on a predetermined side separating the adjacent concave portions, and the internal cutout portion 57 enables efficient exhaust in each concave portion. FIG. 24 shows an example of the T-shaped jig 42. In FIG. 24, reference numeral 58 denotes a cutout sealing material.

FIG. 25 is a perspective view showing an intermediate panel 47 used for the vacuum-tight container of this embodiment. FIG.
FIG. 25A shows a configuration viewed from the front panel 9 side, and FIG.
(B) has shown the structure of the intermediate panel 47 seen from the back panel 41 side.

As shown in FIGS. 25 (a) and 25 (b), internal terminals 46a and 46b corresponding to the lead wiring of the cathode substrate are formed on the upper and lower surfaces of the intermediate panel 47, respectively. Further, as shown in FIG. 25B, on the rear panel 41 side of the intermediate panel 47, an internal terminal electrode 51 corresponding to the lead wiring of the cathode substrate is provided. Internal terminal electrodes 46a, 46b on the upper and lower main surfaces,
Reference numeral 51 is electrically connected via a wiring circuit (not shown) including a through hole formed inside the intermediate panel 47 and a routing wiring.

FIG. 26 shows one side of a cross section taken along line EE 'of the intermediate panel 47 shown in FIG. 25B. FIG. 27 shows internal terminal electrodes provided on the rear panel 41 side of the intermediate panel 47. 51 shows an enlarged view of 51. In these drawings, the intermediate panel 47 is shown in a direction arranged on the rear panel 41. As shown in FIG.
Are two projecting electrodes 51a at both ends and a wiring 5 connecting them.
1b are formed. As shown in the enlarged view of FIG. 27, the terminal electrode 51 is composed of a wiring 51b containing W as a main component and a protruding electrode 51a.
And an Au layer 6 are sequentially formed.

The front panel 49 and the rear panel 41 as described above are mechanically joined via the intermediate panel 47 by the sealing portion 50 of frit glass as shown in the sectional view of FIG. The anode electrode (not shown) of the front panel 49 is connected to the protruding electrode of the upper internal terminal electrode 46a of the intermediate panel 47 connected to the lead wire and the internal wiring (not shown) of the lower part of the intermediate panel 47. It is electrically connected to the terminal electrode 46b. Furthermore, it is connected to the internal terminal electrode 56 provided on the peripheral portion of the rear panel 41 via the protruding electrode, and is electrically connected to the external terminal 45 on the outer peripheral portion via a wiring circuit (not shown) inside the rear panel. Have been. With such a configuration, power can be supplied to the anode electrode from outside the container.

Further, as shown in FIG.
A field emission type cathode substrate 48 in which a gate electrode and an emitter array (not shown in detail) are formed is provided in each of the recesses. Since the intermediate panel 47 is provided on the peripheral portion of the back panel 41, one of the protruding electrodes 51 a provided on the lower side of the intermediate panel 47 is driven by the driving electrode drawn to the end of each cathode array substrate 48. And the other is connected to the rear panel 4
1 is connected to the internal terminal 55 on the periphery. Internal terminal 55
Is connected to the external terminal 43 in the outer peripheral portion via the wiring circuit 44 inside the rear panel 41, so that a plurality of cathode substrates can be driven collectively from the outside of the container.

The above-mentioned vacuum airtight container was manufactured by the following method.

In manufacturing the front panel 49, first, an ITO transparent electrode 52 having a thickness of 300 nm is formed on a soda lime substrate having a thickness of 2 mm by sputtering, and then a 3 μm-thick film is formed thereon by screen printing. Zn: Z
An nO phosphor film 53 was formed. A lead line was formed from the ITO transparent electrode 52 to a position corresponding to the protruding electrode of the internal terminal electrode 46a of the intermediate panel 47, and an Au plating film (not shown) was provided at an end of the lead line.

The back panel 41 is formed by laminating a green sheet mainly composed of alumina powder having an average particle diameter of 1 μm using a high melting point metal material mainly composed of W as a conductive material.
The substrate and the wiring portion were formed by simultaneous firing at 1100 ° C. In the first layer corresponding to the lowermost layer as a green sheet before firing, an area corresponding to the internal wiring was formed by screen printing in advance. In the second layer corresponding to the outermost peripheral portion, a sheet is formed by punching the outer shape into a window frame shape, and one side of the outer periphery is partially deleted corresponding to the cutout portion 54, and the inner side is formed as the inner side. After deletion corresponding to the notch 57, a region corresponding to a through hole was punched with a punch. A conductive material was filled in the through-hole, and a terminal electrode pattern and a protruding electrode were formed by printing.

The first and two layers thus obtained were laminated, and a projection electrode was formed by printing in a region corresponding to the terminal electrodes 43 and 45 on the outer peripheral portion, and then fired at 1100 ° C. The fired back panel 41 was immersed in a plating bath, and a Cu layer and an Au layer were laminated on the W electrode to form an integrated back panel 41 having a plurality of recesses.

The part corresponding to the T-shaped jig 42 is also
It was formed by molding and firing an alumina green sheet.

The intermediate panel 47 is made of a refractory metal material containing W as a main component as a conductive material, and has an average particle size of 1 μm.
Green sheet mainly composed of alumina powder,
The substrate and the wiring portion were formed by simultaneous firing at 1100 ° C. As a green sheet before sintering, wiring is printed by screen printing on a sheet punched in a window frame shape having a plurality of holes, a hole is punched in a region corresponding to a through hole, and a conductive material is filled. Protruding electrodes were formed by printing. After baking this sheet at 1100 ° C., it was immersed in a plating bath, and a Cu layer and Au were placed on the internal terminal electrodes.
The layers were laminated as shown in FIG. 27 to form a window frame-shaped intermediate panel 47.

After forming the front panel 49, the rear panel 41, the intermediate panel 47 and the T-shaped jig 42 as described above, the vacuum-tight container of this embodiment was manufactured according to the process shown in FIG. First, as shown in FIG. 28A, the field emission cathode substrates 48 were respectively housed in a plurality of recesses of the rear panel 41 in which the external terminals 43 and the wiring circuits 44 were formed. A frit glass 50 containing lead oxide as a main component was applied by a dispenser to a peripheral portion of the rear panel 41 except for the cutout portion 54 and the internal cutout portion 57 with a width of about 20 μm.

Next, as shown in FIG. 28 (b), the rear panel 41 is provided with an end of the driving wiring drawn out to the end of each cathode substrate 48 and the rear panel 4 of the intermediate panel 47.
The intermediate panel 47 was joined by aligning the protruding electrodes 51a of the first-side internal terminal electrodes 51. The protruding electrodes 51a formed on the intermediate panel 47 penetrated the frit glass 50 layer and were connected to the driving wiring end of each cathode substrate 48.

Subsequently, a frit glass 50 containing lead oxide as a main component was applied to a peripheral portion of the intermediate panel 47 by a dispenser with a width of about 20 μm. This intermediate panel 47
Of the projection electrode 46a on the front panel 49 side of the
Of the lead-out wiring drawn from the anode electrode of No. 9
The pattern was aligned with the pattern as shown in FIG. 28 (c), and the front panel 49 was joined.

After the front panel 49, the intermediate panel 47 and the rear panel 41 were joined as described above, the frit glass 50 was fired at 400 ° C. to obtain a structure as shown in FIG. After the firing, the container and a frit glass 58 containing lead oxide as a main component were previously applied to a desired region.
The jig 42 is set in the evacuation chamber, and 10 ^-7 Torr
exhaust to r, and by operating with a manipulator, T
The jig 42 was inserted into the cutout 54. Next, the temperature in the exhaust chamber was increased to 400 ° C., and the frit glass 58 applied to the seal portion of the T-shaped jig 42 was fired. Thereafter, the temperature in the exhaust chamber was lowered, and the container was taken out of the exhaust chamber, thereby forming a vacuum-tight container hermetically sealed to a high vacuum.

With respect to the vacuum-tight container obtained in the above steps, the external terminals 4 in the area corresponding to the lower rear panel 41
When a power supply line to the anode electrode and a signal line for driving the cathode were respectively connected to 3 and 45, light emission of the phosphor 53 due to field emission from the cathode substrate 48 was confirmed in the translucent region of the front panel 49. Was. 10
No degradation of the display element was observed even after continuous light emission for 00 hours.
The inside of the container was kept in a high vacuum, and it was confirmed that highly efficient light emission was possible.

The vacuum-tight container of the present embodiment is not limited to the above-described example, and various changes can be made. For example, although the protruding electrodes are provided on the side surface of the rear panel 41 as external terminals, the connecting pins 62 may be provided on the rear panel 41 as external terminals as shown in FIG. FIG. 30 is a perspective view of the back panel used here. The back panel having the external take-out pins 62 integrated as described above is provided with connection pins mainly composed of a high melting point metal between the first layer and the second layer when the back panel green sheet is integrally fired. 62 can be formed by inserting and sintering.

The external terminals can be provided not only on the side surface of the back panel 41 but also on the back surface. More specifically, as shown in FIG. 31, a bump array 63 may be formed in which the rear panel green sheets are multi-layered, the internal wiring is routed, and external terminals are collected on the lowermost layer of the rear panel.

The back panel 41 can be manufactured using not only the above-mentioned materials but also glass such as Pyrex glass, soda lime glass, and plate glass, a resin such as benzocyclobutene and polyimide, and glass epoxy.

The rear panel 41 does not necessarily have to have a concave portion as described above, but preferably has a concave portion from the following points. In other words, the positioning when mounting the cathode substrate is simple, and the terminal electrodes formed on the concave portion and the terminals on the cathode substrate are close to the same plane, so that the projecting electrodes formed on the intermediate panel are collectively used. The point that can be connected.

The vacuum-tight container of the present embodiment has a rear panel 4
By inserting the connection pins 62 provided in 1 or connecting the bump array 63 with solder or the like, it can be mounted on a motherboard on which a drive circuit is arranged. FIG. 32 shows a ball grid array 6 on the lowermost layer of the back panel.
5 shows an example in which a large-area display element is formed by mounting the FED array element 64 on which a drive circuit 67 is formed on a motherboard 66 together with a drive circuit 67. The plan view of the display element shown in FIG.
As shown in FIG. 33, the driving circuit 67 and the FED array element 64 are connected by a lead-out wiring 68 as shown.

Further, in the above-described example, the projection electrode 51a provided on the rear panel side of the intermediate panel 47 is used as a configuration for electrically connecting the cathode substrate 48 and the internal terminal electrodes of the rear panel 41. After the cathode substrate 48 is housed in the concave portion of the rear panel 41 as shown in 34, the lead-out portion of the drive wiring at the end of the cathode substrate 48 and the internal terminal electrode of the rear panel 41 are directly connected by wire bonding 69. Thus, these electrical connections may be ensured.

In the above example, 2 ×
Although two FED array elements are shown, the present invention is not limited to this. By changing the structure of the rear panel and the intermediate panel, etc., it is easy to expand to m × n as shown in FIG. 35, and an FED array element containing an arbitrary number of cathode substrates can be easily manufactured. Can be manufactured.

In the above-described example, when the container is evacuated, a notch is provided in the back panel 41, the container is placed in an exhaust chamber, and the container is evacuated to a vacuum.
2 is sealed with a sealing material 48 to maintain a high vacuum in the container, but exhaust may be performed using an exhaust pipe. FIG. 36 shows a perspective view of a vacuum-tight container formed by a method using the exhaust pipe 70, and FIG. 37 shows a perspective view of the intermediate panel 47 used here. The intermediate panel shown in FIG. 37 can be manufactured as follows. That is, when the intermediate panel 47 is baked, an insertion hole for an exhaust pipe is provided in advance, and after the intermediate panel 47 is baked, the hollow glass exhaust pipe 70 is inserted to sinter the frit glass 72 of the sealing portion, and the exhaust pipe is baked. 70 is fixed. FIG. 38 is a cross-sectional view taken along line FF ′ of FIG. As shown in the figure, a hollow glass exhaust pipe 70 is inserted into an insertion hole formed at a predetermined position of the intermediate panel 47, and is fixed by a frit glass 72.

Except for using the thus obtained intermediate panel, it is joined to the front panel 49 and the back panel 41 in the same manner as described above, and the frit glass seal portion 50 at the joint between the panels is fired. Thereafter, the vessel is connected to a vacuum exhaust device via an exhaust pipe 70, and the inside of the container is evacuated to 10 ^-7 Torr, and then the exhaust pipe end 71 is sealed with a gas burner to maintain a high vacuum in the container. Thus, the vacuum-tight container of the present embodiment can be manufactured.

In the vacuum-tight container of this embodiment, the first and second wiring circuits are provided inside the back panel, so that power can be supplied from the outside to the anode electrode through the internal wiring circuits. In addition to the above, it is possible to drive a plurality of cathode substrates collectively via these wiring circuits.

Since there is no need to provide a wiring take-out portion penetrating the frit glass seal portion in this manner, cracks due to the difference in the coefficient of thermal expansion between the wiring metal and the frit glass are completely avoided, and the reliability is improved. And a field emission device with a large screen and a high screen height can be obtained.

Further, since the driving wires of the cathode array substrate are electrically connected to the external terminals via the internal terminals provided on the rear panel, fine projections can be formed even when the cathode array wiring is miniaturized. By forming an array of electrodes, highly reliable fine connection can be achieved.
Therefore, it is possible to cope with higher definition of the cathode array.

In addition, when an intermediate panel is provided in the present embodiment, the intermediate panel can maintain a constant gap between the anode electrode on the front panel and the cathode substrate on the rear panel. Therefore, no spacer is required, and the step of spraying the spacer can be omitted.

The vacuum-tight container of the present invention as described above
It can be suitably used for a power element. In FIG. 39,
An outline of the structure of one example and a driving circuit are shown. In FIG. 39, a region G surrounded by a dotted line represents a region inside the vacuum-tight container of the present invention, and a region H outside the dotted line represents a region outside the vacuum-tight container.

In the drawing, reference numeral 81 denotes a cold cathode (emitter) having a conical or quadrangular pyramid-shaped projection, and this cold cathode 81 is formed of a diamond thin film. An oxide film 82 and a platinum control electrode 84 are sequentially formed on the surface of the cold cathode 81 except for the tips of the protrusions. Platinum control electrode (gate) 8
Above 4, an electron capture electrode (anode) made of Mo
Reference numerals 86 are disposed so as to face each other, and an insulating spacer layer 85 made of quartz glass is inserted between the electron capture electrode 86 made of Mo and the platinum control electrode 84. Although the back panel and the front panel are not shown, the back panel is disposed below the cold cathode 81, and the front panel is the electron capture electrode 86.
It is provided above. Also, the cold cathode 81, the oxide film 8
2, and a portion including the control electrode 84 corresponds to a cathode substrate.

In such a micro cold cathode tube, the control electrode 84 is connected to the control electrode / cold cathode power supply 8 via a switch.
7, a main circuit load 88 and a main circuit power supply 89 are connected to the electron capture electrode 86. The diamond cold cathode 81 is connected to a common ground of the respective power sources 87 and 89. Here, the polarities of the power supplies 87 and 89 are as shown in the figure, and a positive voltage is applied to the control electrode 84 and a positive voltage is applied to the electron capture electrode 86.

Usually, a plurality of emitters 81 shown in FIG. 39 are arranged on an array, but they may be realized as a single unit. In the case of a plurality of arrangements, a plurality of emitters 81 are provided on a Cu substrate (not shown) functioning as a heat sink, and the emitters 81 and the opposing anode electrodes are housed in a package for vacuum sealing. When a single emitter is used, it can be realized by forming the above-described insulating spacer layer 85 with a vacuum sealing material.

Further, by combining the vacuum-tight container of the present invention with a cathode substrate formed by a transfer molding method as described in US Pat. No. 5,499,938, a large-screen image display device can be manufactured. it can.

[0090]

As described above, according to the present invention,
Provided are a vacuum-tight container having high efficiency and high reliability, and a display element and a power element using the same, in which a crack is prevented from occurring in a frit glass seal portion in contact with a wiring portion to prevent a leak.

In the present invention, at least a part of the front panel is formed of a light-transmitting substrate and a phosphor is laminated as an anode electrode, mainly for the purpose of application to a display element. However, application to a power conversion element is also possible. It is possible. Specifically, by replacing the front panel with a ceramic substrate on which an anode electrode layer is formed, a high-efficiency power conversion element array holding a high vacuum can be realized with the same configuration as the present invention. Has great industrial value.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a vacuum airtight container of (Example 1).

FIG. 2 is a cross-sectional view showing an example of a vacuum-tight container of (Example 1).

FIG. 3 is a perspective view showing an example of a back panel used in the vacuum airtight container of (Example 1).

FIG. 4 is a view showing a T-shaped jig used for the vacuum airtight container of (Example 1).

FIG. 5 is a perspective view showing an example of an intermediate panel used in the vacuum airtight container of (Example 1).

FIG. 6 is a cross-sectional view of an intermediate panel used for the vacuum airtight container of (Example 1).

FIG. 7 is an enlarged view showing a terminal electrode portion of the intermediate panel shown in FIG. 6;

FIG. 8 is a cross-sectional view illustrating an example of a manufacturing process of the vacuum-tight container of the present embodiment.

FIG. 9 is a sectional view illustrating another example of the vacuum-tight container of the present embodiment.

FIG. 10 is a perspective view showing a back panel used for the vacuum airtight container shown in FIG. 9;

FIG. 11 is a sectional view showing another example of the vacuum-tight container of the present embodiment.

FIG. 12 is a cross-sectional view illustrating an example of a large-area display to which the vacuum-tight container according to the present embodiment is applied.

FIG. 13 is a plan view illustrating an example of a large-area display to which the vacuum-tight container according to the present embodiment is applied.

FIG. 14 is a sectional view illustrating another example of the vacuum-tight container of the present embodiment.

FIG. 15 is a perspective view illustrating another example of the vacuum airtight container of the present embodiment.

FIG. 16 is a perspective view showing an intermediate panel used in the vacuum airtight container shown in FIG.

FIG. 17 is a sectional view of the intermediate panel shown in FIG. 16;

FIG. 18 is a sectional view showing another example of the vacuum airtight container of the present embodiment.

FIG. 19 is a perspective view showing a back panel used for the vacuum airtight container shown in FIG. 18;

20 is a plan view schematically showing the configuration of the back panel shown in FIG.

FIG. 21 is a perspective view showing an example of a vacuum airtight container of (Example 2).

FIG. 22 is a perspective view showing an example of a vacuum airtight container of (Example 2).

FIG. 23 is a perspective view showing an example of a back panel used for the vacuum airtight container of (Example 2).

FIG. 24 shows T used for the vacuum-tight container of (Example 2).
The figure which shows a character-shaped jig.

FIG. 25 is a perspective view showing an example of an intermediate panel used in the vacuum airtight container of (Example 2).

FIG. 26 is a cross-sectional view of an intermediate panel used for the vacuum airtight container of (Example 2).

FIG. 27 is an enlarged view showing a terminal electrode portion of the intermediate panel shown in FIG. 26;

FIG. 28 is a sectional view illustrating an example of a manufacturing process of the vacuum-tight container of the present embodiment.

FIG. 29 is a sectional view showing another example of the vacuum-tight container of the present embodiment.

FIG. 30 is a perspective view showing a back panel used for the vacuum-tight container shown in FIG. 29;

FIG. 31 is a sectional view showing another example of the vacuum-tight container of the present embodiment.

FIG. 32 is a cross-sectional view illustrating an example of a large-area display to which the vacuum-tight container according to the present embodiment is applied.

FIG. 33 is a plan view illustrating an example of a large-area display to which the vacuum-tight container according to the present embodiment is applied.

FIG. 34 is a sectional view showing another example of the vacuum-tight container of the present embodiment.

FIG. 35 is a plan view schematically showing the configuration of another example of the vacuum airtight container of the present embodiment.

FIG. 36 is a perspective view showing another example of the vacuum airtight container of the present embodiment.

FIG. 37 is a perspective view showing an intermediate panel used in the vacuum airtight container shown in FIG. 36.

FIG. 38 is a sectional view of the intermediate panel shown in FIG. 37.

FIG. 39 is a view schematically showing a power element and a drive circuit of the present invention.

FIG. 40 is a sectional view showing a conventional vacuum airtight container.

FIG. 41 is a partially enlarged view of an anode electrode and a cathode array substrate in a conventional vacuum-tight container.

FIG. 42 is a sectional view showing a sealing portion in a conventional vacuum-tight container.

FIG. 43 is a plan view showing the configuration of a conventional vacuum-tight container.

FIG. 44 is a sectional view showing the configuration of a conventional vacuum-tight container.

FIG. 45 is a plan view schematically showing the electrical connection of each electrode on a cathode substrate of a conventional vacuum-tight container.

[Explanation of symbols]

 1, 41: rear panel 2, 42: T-shaped jig 3, 43: external terminal for array drive 4, 44: internal wiring 5, 45: external terminal for ITO 6, 46: internal terminal for ITO 6a, 6b, 46a 46b ... internal terminal for ITO 7, 47 ... frame-shaped panel 8, 48 ... cathode substrate 9, 49 ... front panel 10, 50 ... seal part 11, 51 ... internal terminal for array 11a, 51a ... internal terminal for array 11b, 51b: Internal wiring for array 12, 52: ITO electrode 13, 53: Phosphor 14, 54: Notch 15, 55: Internal terminal for array 16, 56: Internal terminal for ITO 17, 58: Seal for notch 18 59, W wiring and bump 19, 60 Cu plating layer 20, 61 Au plating layer 21, 62 Connection pin 22, 63 Connection bump 23, 64 FED element 24, 65 ... ball grid array 25, 66 ... mother board 26, 67 ... drive circuit 27, 68 ... lead-out wiring 28, 69 ... wire bonding connection part 29, 70 ... exhaust pipe 30, 71 ... sealing part 31, 72 ... Exhaust pipe seal part 32 ... getter material 33 ... heater electrode 34 ... electrode extraction end 35 ... gap 57 ... internal notch 81 ... emitter 82 ... oxide film 84 ... platinum control electrode 85 ... insulating spacer layer 86 ... anode electrode 87 ... Anode-emitter power supply 88 ... Main circuit load 89 ... Main circuit power supply 101 ... Back glass panel 102 ... Front glass panel 103 ... Side glass substrate 104 ... Field emission cathode array substrate 105 ... Anode electrode 106 ... Frit seal part 107 ... Wiring take-out Part 111: cathode electrode 112: insulating layer 113 ... Gate electrode 114 Emitter electrode 115 Phosphor 116 Transparent electrode 210 Cathode array 211 Cathode array substrate 212 Frame 213 Emitter electrode line 214 Gate electrode line 220 Support substrate 230 Phosphor substrate 233 Adhesive seal Part 234: Exhaust through hole 236: Solder 240: Spacer 261: Solder layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Katsuyoshi Fukuda 33, Shinisogo-cho, Isogo-ku, Yokohama-shi, Kanagawa Prefecture Inside Toshiba Institute of Industrial Science (72) Inventor Toshimichi Hasegawa 33, Shinisogocho, Isogo-ku, Yokohama-shi, Kanagawa Address Co., Ltd., Toshiba Production Technology Laboratory

Claims (11)

[Claims] A first substrate, a second substrate spaced apart from and opposed to the first substrate, a seal member for sealing the first substrate and the second substrate, An anode electrode formed on a surface of the second substrate facing the first substrate, a gate electrode and an emitter array, the anode electrode being disposed on the first substrate at a distance from the second substrate; A field emission type cathode substrate having: an internal terminal formed inside a seal of the first substrate; an external terminal formed outside a seal of the first substrate; A vacuum-tight container, comprising: a lead wire that is electrically connected to a terminal and is routed through the inside of the first substrate. 2. A first substrate, a second substrate spaced apart from and opposed to the first substrate, and a seal member for sealing the first substrate and the second substrate. An anode electrode formed on a surface of the second substrate facing the first substrate, a gate electrode and an emitter array, the anode electrode being disposed on the first substrate at a distance from the second substrate; A plurality of field emission cathode substrates each having: an internal terminal formed inside a seal of the first substrate; an external terminal formed outside a seal of the first substrate; And an external terminal, wherein the wiring is electrically connected to the external terminal, and the wiring is wired through the inside of the first substrate. 3. The vacuum-tight container according to claim 1, wherein the anode electrode includes a transparent electrode and a phosphor provided on the transparent electrode. 4. The vacuum hermetic container according to claim 1, wherein the inside of the sealing is a vacuum. 5. The first substrate is a back panel, the second substrate is a front panel, and a gap is maintained between the anode electrode and the cathode substrate formed on the front panel. The vacuum-tight container according to any one of claims 1 to 4, further comprising an intermediate panel provided in contact with the back panel. 6. The vacuum-tight container according to claim 5, wherein the intermediate panel has an exhaust port for evacuating the inside of the seal. 7. The vacuum-tight container according to claim 1, wherein the external terminal is provided on a side surface of the first substrate. 8. The vacuum-tight container according to claim 1, wherein the external terminal is provided on a back surface of the first substrate. 9. A vacuum-tight container according to claim 1, a first voltage applying means for applying a positive voltage to the anode electrode, and a first voltage applying means. And a load disposed between the first electrode and the anode electrode; and a second voltage applying means for applying a voltage to the gate electrode of the cathode substrate. 10. A mounting substrate, comprising: a driving circuit arranged on the mounting substrate; and a plurality of FED elements mounted on the mounting substrate and electrically connected to the driving circuit. The FED element includes a first substrate, a second substrate disposed to be spaced from and opposed to the first substrate, a seal member that seals the first substrate and the second substrate, An anode electrode formed on a surface of the second substrate facing the first substrate, a gate electrode and an emitter array disposed on the first substrate at a distance from the second substrate; A field emission type cathode substrate having: an internal terminal formed inside a seal of the first substrate; an external terminal formed outside a seal of the first substrate; Electrically connected to the terminal and through the inside of the first substrate. A display element, comprising: a vacuum-tight container having routing wirings arranged in a line. 11. The first substrate according to claim 10, wherein the first substrate has a cutout portion penetrating from the outside of the seal to the inside of the seal, and the first substrate is sealed by a T-shaped jig fitted into the notch. Display element.