JPH11121519A - Device and method for mounting conductive ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and method for mounting a conductive ball which can be mounted correctly on a substrate of a work, in which chips mounted on the substrate are encapsulated by a resin-encapsulating body. SOLUTION: A resin-encapsulating body 4 formed on a lower face of a substrate 2 is engaged with a recess 23 of a receiving pedestal 22. An elastic material 24 is coated in the recess 23. A mounting head 30 which is vacuum-sucked with a conductive ball 5 is dropped, and a projection 32 is made to land on the substrate. Then, the resin-encapsulating body 4 is engaged firmly with the recess part 23, and a position of the substrate 2 is fixed and becomes completely leveled. Then, a vacuum-sucked state of the conductive ball 5 is cancelled, the conductive ball 5 is mounted on the substrate 2, and the mounting head 30 is lifted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus and method for mounting conductive balls on a work formed by sealing a chip mounted on a substrate with a resin sealing body.

[0002]

2. Description of the Related Art As a method for forming bumps (protruding electrodes) on an electronic component, a method using a conductive ball such as a solder ball is known. In this method, a conductive ball provided in a conductive ball supply unit is vacuum-adsorbed to a lower surface of a mounting head, picked up, and mounted on an electronic component. It has the advantage of high productivity because it can be mounted on components.

[0003]

The conductive ball must be mounted at a predetermined position on the electronic component without displacement, and therefore, the electronic component must be correctly positioned at the positioning portion. Meanwhile, in recent years, a work has been proposed in which a chip is mounted on a substrate made of a synthetic resin film or the like and the chip is sealed with a resin sealing body as an electronic component. In such a work (electronic component), the resin-sealed body is placed on the lower side, and conductive balls are mounted on the upper substrate. Since it is difficult to position the conductive balls correctly, and in particular, the substrate is liable to be inclined without being horizontal, the mounting position accuracy of the conductive balls tends to be deviated.

Accordingly, the present invention provides a conductive ball mounting apparatus and a mounting method capable of correctly mounting conductive balls on a work substrate formed by sealing a chip mounted on a substrate with a resin sealing body. With the goal.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a conductive ball mounting apparatus for mounting conductive balls on a work formed by sealing a chip mounted on a substrate with a resin sealing body. A mounting head that supplies a ball supply section, a work positioning section, and a conductive ball provided in the conductive ball supply section by vacuum suction to a lower surface, picks up the picked-up ball, and mounts the conductive ball on the work board positioned at the positioning section. The positioning portion includes a receiving table having a concave portion for supporting the resin sealing body from below, and the concave portion is formed of an elastic material, and the mounting head lands on the substrate and the resin It has a plurality of projections for pressing the sealing body against the recess.

Preferably, the pedestal is formed by mounting an elastic material on the surface of the recess. The method of mounting a conductive ball according to the present invention includes a step of vacuum-adsorbing and picking up a conductive ball provided on a conductive ball supply unit on a lower surface of a mounting head, and a step of positioning the mounting head on a positioning unit. Moving the mounting head downward and landing a plurality of projections protruding from the lower surface of the mounting head on the upper surface of the substrate, and supporting the resin sealing body from below. Mounting the conductive ball on the upper surface of the substrate after pressing the conductive ball against the concave portion made of the material.

According to each of the above constructions, by lowering the mounting head and pressing the protrusion against the substrate, the resin sealing body is pressed against the concave portion to position the work at a predetermined position and to place the substrate in a horizontal posture. The conductive balls can be mounted correctly. In this case, by forming the concave portion with an elastic material, variations in the shape and size of the resin sealing body can be absorbed, and the conductive ball can be mounted more reliably in a horizontal posture.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 is a front view of a conductive ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a semi-finished product of the work, and FIG. 3 is a view of a work provided in the conductive ball mounting apparatus. FIG. 4 is a perspective view of a positioning pedestal, FIG. 4 is a vertically inverted perspective view of a mounting head of the conductive ball mounting apparatus,
FIG. 5 is an explanatory view of a method of mounting the conductive balls, and FIG. 6 is a sectional view of a completed product of the work.

Before describing the conductive ball mounting apparatus, the structure of a completed work 1 manufactured using the conductive ball mounting apparatus will be described with reference to FIG.
Reference numeral 2 denotes a substrate, which is made of a synthetic resin film or the like. A chip 3 is mounted on the surface of the substrate 2, and the chip 3 is sealed with a resin sealing body 4. Reference numeral 5 a denotes a bump formed on the surface of the substrate 2, and is electrically connected to a pad on the surface of the chip 3 via a wire 6. The conductive ball mounting apparatus mounts the conductive balls for forming the bumps 5 a on the holes 7 of the substrate 2.

Next, a device for mounting a conductive ball will be described. In FIG. 1, reference numeral 10 denotes a conductive ball supply unit. The conductive ball supply unit 10 is configured by placing a container 12 containing the conductive balls 5 on a base 11.

Reference numeral 20 denotes a work positioning portion. The work positioning unit 20 is configured by placing a receiving table 22 of the work 1 on a movable table 21. FIG.
FIG. 1 shows a perspective view of a semi-finished product of a work 1 supplied to the work. The substrate 2 is in the form of a long film and has a lower surface as shown in FIG.
The resin sealing body 4 for sealing the chip 3 and the wire 6 shown in FIG. The resin sealing body 4 is formed by potting, and its shape and size vary. A large number of holes 7 are formed in a matrix in the substrate 2.
The conductive ball 5 is mounted on the hole 7. Reference numeral 8 denotes a pin hole for feeding the substrate 2 to the receiving table 22 at a pitch. This substrate 2 is cut along the broken line a in a later step, and the work 1 shown in FIG. 6 is completed.

In FIG. 3, a concave portion 2 is provided on the upper surface of the receiving table 22.
3 is formed, and a sheet-like elastic material 24 is mounted on the surface of the concave portion 23 (see also FIG. 5A). The elastic member 24 is rubber or soft resin, and is formed by a coating means or the like. The recess 23 is formed in the resin sealing body 4
Is elastically supported from below.

In FIG. 1, reference numeral 30 denotes a mounting head.
As shown in FIG. 4, on the lower surface of the mounting head 30, a large number of suction holes 31 for vacuum suction of the conductive balls 5 are formed in a matrix. These suction holes 31 are opened at positions corresponding to the holes 7 of the substrate 2 shown in FIG. Further, a plurality of pin-shaped projections 32 (four at the corners of the lower surface in this example) protrude from the lower surface of the mounting head 30. The protrusion lengths of these projections 32 are exactly the same.

In FIG. 1, the mounting head 30 is connected to a vacuum suction means 34 via a tube 33. When the vacuum suction means 34 is operated, the conductive balls 52 are vacuum-sucked into the suction holes 31 and the vacuum Release the suction state. The mounting head 30 is held by the vertical movement means 35, and performs vertical movement when the vertical movement means 35 drives. The vertical movement means 35 is mounted on the moving table 36 and moves in the horizontal direction along the moving table 36. Arrow A indicates the movement locus of the mounting head 30.

The conductive ball mounting apparatus has the above-described configuration, and the operation will be described next. In FIG.
The mounting head 30 moves up and down with respect to the container 12 and vacuum-adsorbs and picks up the conductive balls 5 in the suction holes 31. Next, when the moving table 36 is driven, the mounting head 30 moves above the receiving table 22. FIG. 5A shows the state at this time. The resin sealing body 4 on the lower surface of the substrate 2 is fitted into the concave portion 23 of the receiving table 22. However, since the shape and size of the resin sealing body 4 vary, the resin sealing body 4 Does not fit properly, so work 1
The attitude is not fixed. Next, the mounting head 30 descends, and the projection 32 lands on the upper surface of the substrate 2. FIG. 5B shows the state at this time. Then, the substrate 2 becomes the protrusion 32
The resin sealing body 4 is firmly fitted into the concave portion 23, the work 1 is positioned at a predetermined position, the posture thereof is determined, and the substrate 2 is completely horizontal. Further, in this case, since the elastic material 24 is attached to the concave portion 23, the variation in the shape and the size of the resin sealing
Absorbed in 4. Further, the lower end of the projection 32 projects below the lower surface of the conductive ball 5, and therefore the projection 3
In a state in which the conductive balls 5 land on the substrate 2, the conductive balls 5
It is located slightly above the upper surface of the.

Then, when the vacuum suction state of the conductive balls 5 is released, the conductive balls 5 fall from the suction holes 31 into the holes 7. Next, the mounting head 30 rises and returns above the container 12 for the next operation. Thus, the conductive balls 5
Is completed. By repeating the above operation while feeding the work 1 on the pedestal 22 at a pitch, the substrate 2
The conductive balls 5 are mounted one after another on the top.

The work 1 on which the conductive balls 5 are mounted as described above is sent to a heating device (not shown) and heated. Then, the conductive balls 5 on the holes 7 are melted and solidified to form bumps 5a shown in FIG. Next, when the substrate 2 is cut along the broken line a (FIG. 2), the work 1 shown in FIG. 6 is completed. The present invention is not limited to the above embodiment. For example, the pedestal 22 may be formed of an elastic material, and in this case, the elastic material 24 does not need to be specially mounted in the recess 23.

[0018]

As described above, according to the present invention, by lowering the mounting head and pressing the projection against the substrate, the resin sealing body is pressed against the concave portion to position the work at a predetermined position and to position the substrate. It can be placed horizontally and the conductive balls can be mounted correctly. In addition, by mounting the elastic material in the concave portion, variations in the shape and size of the resin sealing body can be further absorbed, and the conductive ball can be mounted in a more secure horizontal posture.

[Brief description of the drawings]

FIG. 1 is a front view of a conductive ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a semi-finished product of a work according to an embodiment of the present invention.

FIG. 3 is a perspective view of a work positioning pedestal provided in the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 4 is an upside down perspective view of a mounting head of the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 5 is an explanatory diagram of a method for mounting a conductive ball according to an embodiment of the present invention.

FIG. 6 is a sectional view of a finished product of a work according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Work 2 Substrate 3 Chip 4 Resin sealing body 5 Conductive ball 5a Bump 7 Hole 10 Conductive ball supply part 20 Work positioning part 22 Receiving stand 23 Depression 24 Elastic material 30 Mounting head 31 Suction hole 32 Protrusion 36 Movement table

Claims (3)

[Claims] A conductive ball mounting apparatus for mounting a conductive ball on a work formed by sealing a chip mounted on a substrate with a resin sealing body, comprising: a conductive ball supply unit; A positioning unit, and a mounting head for vacuum-adsorbing and picking up the conductive ball provided on the conductive ball supply unit on the lower surface and mounting the picked-up ball on the substrate of the work positioned in the positioning unit, wherein the positioning unit includes: A pedestal having a concave portion for supporting the resin sealing body from below, and forming the concave portion with an elastic material, and the mounting head lands on the substrate to place the resin sealing body in the concave portion. A mounting device for a conductive ball, comprising a plurality of projections for pressing. 2. The conductive ball mounting apparatus according to claim 1, wherein said receiving table is formed by mounting an elastic material on a surface of said concave portion. 3. A method for mounting a conductive ball on a work in which a chip mounted on a substrate is sealed with a resin sealing body, wherein the conductive ball is provided in a conductive ball supply unit. A step of vacuum-adsorbing and picking up a conductive ball on the lower surface of the mounting head, and a step of relatively moving the mounting head above the work positioned at the positioning portion;
The mounting head is lowered to land a plurality of protrusions projecting from the lower surface of the mounting head on the upper surface of the substrate, and the resin sealing body is pressed against a concave portion made of an elastic material which supports the resin sealing body from below. Mounting a conductive ball on the upper surface of the substrate;
A method for mounting a conductive ball, comprising: