JPH11121060A - Multi-pin connector between printed circuit boards - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce stress to a soldered part and visually confirm the soldered state by attaching a plurality of conductor pins having stress reliefs to a resin insulator and by soldering the conductor pins to a wiring pattern on the printed circuit board. SOLUTION: Z-shaped conductor pins 3 having stress reliefs 2 are attached to a resin insulator 1, the conductor pins 3 are soldered to a wiring pattern on the printed circuit board 4 so as to conduct, and so, the opposite printed circuit boards are electrically connected to each other. The utilization of this structure can ease the stress generated in the soldering part caused by the difference in the thermal expansion coefficient between the insulator 1 and the conductor pins 3 to avoid the risk of nonconductive state and the soldered part of the conductor pins 3 are exposed so that the soldered state can be visually confirmed and high reliability can be secured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection between facing printed wiring boards in a device mounted on a satellite, which reduces a thermal stress applied to a soldered portion and enables a visual confirmation of a soldered state. The present invention relates to a multi-pin connector between printed wiring boards that achieves high reliability.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 3 and 4, a plurality of straight conductive pins 6 are attached to a resin insulator 5 and these conductive pins are connected to the printed wiring board 4 as shown in FIGS. Was soldered to the wiring pattern of No. 1 to establish electrical continuity.

[0003]

The above-described conventional structure has the following problems to be solved. The first problem is that a temperature cycle is applied from a low temperature to a high temperature due to the space environment, so that a stress is applied to a soldered portion due to a difference in a thermal expansion coefficient between the insulator and the conductor pin, which damages the soldered portion and disconnects the conduction. There is a risk that

A second problem is that since the printed wiring board and the insulator are brought into close contact with each other, the soldering state of the insulator cannot be confirmed, and it is difficult to ensure high reliability.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a multi-pin connector between printed wiring boards which can reduce the stress applied to a soldering portion and check the soldering state.

[0006]

According to the present invention, a Z-shaped conductor pin provided with a stress relief is attached to a resin insulator, and the conductor pin is soldered to a wiring pattern of a printed wiring board to establish conduction. A multi-pin connector between printed wiring boards is obtained.

In the present invention, the stress generated in the soldered portion due to the difference in the thermal expansion coefficient between the insulator and the conductor pin is reduced, and the risk of disconnection is avoided.
By exposing the soldering portion of the conductor pin, the soldering state of the printed wiring board surface can be confirmed, and high reliability can be secured.

[0008]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention. FIG. 2 is a partial sectional view of the embodiment shown in FIG. In the figure, a Z-shaped conductor pin 3 provided with a stress relief 2 is attached to a resin insulator 1, and the conductor pin 3 is soldered to a wiring pattern of a printed wiring board 4 to establish conduction.

By using this structure, the stress generated in the soldered portion due to the difference in the thermal expansion coefficient between the insulator 1 and the conductor pin 3 is reduced, and the risk of disconnection is avoided. By exposing the soldering portion, the state of soldering on the surface of the printed wiring board can be confirmed, and high reliability can be secured.

[0011]

A first effect of the present invention is that the risk of disconnection between the insulator and the conductor pin can be avoided. The reason for this is that the Z-shaped conductive pin absorbs thermal stress and relieves the stress generated in the soldered portion.

The second effect is that excellent reliability can be obtained. The reason is that the soldering state of the printed wiring board surface can be visually checked by exposing the soldered portion of the conductor pin.

[Brief description of the drawings]

FIG. 1 is a perspective view of an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of the embodiment of FIG.

FIG. 3 is a perspective view of a conventional technique.

FIG. 4 is a partial cross-sectional view of the prior art of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin insulator 2 Stress relief 3 Conducting pin 4 Printed wiring board

Claims (2)

[Claims] When electrically connecting printed circuit boards facing each other, a plurality of conductor pins having stress relief are attached to a resin insulator, and the conductor pins are soldered to a wiring pattern of the printed circuit board. Multi-pin connector between printed wiring boards that provides continuity. 2. In a spacecraft mounted on a satellite, when electrically connecting printed circuit boards facing each other, a plurality of conductive pins attached to a resin insulator are formed in a Z-shape, and wiring between the conductive pins and the printed circuit board is performed. A multi-pin connector between printed wiring boards that allows visual confirmation of the soldered state of the pattern.