JPH11115102A - Packaging film and packaging bag using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a charge-preventing effect and prevent the contamination of the interior of a packaging bag as much as possible when the bag is unsealed, by forming a charge-preventing electrically conductive layer between synthetic resin layers, thereby preparing a laminated film having a structure of at least three layers, in which the conductive layer is not exposed on the surface of the laminated film, and forming the packaging bag by using the laminated film. SOLUTION: A polyethylene resin 5 melted under heating is extruded in the form of a film and, with the aid of these films thus extruded, a nylon film 2 is contact- bonded to an electrically conductive layer 3 and the conductive layer 3 is contact- bonded to a polyethylene film 4, thereby forming a packaging film 1. By this method, a charge-preventing effect can be sufficiently obtained, and attraction of dirt, etc., by static electricity can be effectively prevented. Even in the case where work of packing a containing bag with contents and work of unsealing it to take the contents out of the packaging bag are performed, an electrically conductive material contained in the conductive layer does not enter the inside of the packaging bag, so that the interior of the packaging bag is not contaminated and, accordingly, high cleanness can be reliably maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging film provided with an antistatic conductive layer which is preferably used as a packaging material for packaging electronic parts such as silicone wafers and semiconductors, and a packaging using the same. More specifically, the bag is excellent in antistatic effect, and can prevent contamination of the inside of the packaging bag when opened by adsorption of dust and the like due to static electricity as much as possible to maintain high cleanliness. The present invention relates to a film and a packaging bag using the same.

[0002]

2. Description of the Related Art Conventionally, when static electricity is generated in a packaging bag,
Dust is easily adsorbed to the packaging bag, and therefore, a packaging film subjected to various antistatic treatments to prevent generation of static electricity is known.

[0003] Such packaging films include, for example, nylon films, polyester films and the like.
An antistatic agent made by dispersing a coating film or carbon fiber in which a coating film is formed by applying an antistatic agent such as a polyacrylic acid derivative or polyoxyethylene to the surface of a synthetic resin film composed of at least two layers. Antistatic agents such as quaternary ammonium salts, phosphate salts of esters of fatty acids and polyhydric alcohols and sulfonates are dispersed and kneaded in a packaging film provided with a film for use or a synthetic resin such as polypropylene or polyethylene. There is known a packaging film obtained by laminating a synthetic resin film on the surface of a synthetic resin film.

[0004]

However, in the case of a packaging bag using the above-mentioned packaging film, an antistatic effect inside the packaging bag is imparted, but the degree of cleanness inside the packaging bag cannot be sufficiently maintained. There is a problem.

[0005] That is, a packaging bag using a packaging film coated with the above antistatic agent or a packaging film provided with an antistatic film in which carbon fibers are dispersed in a synthetic resin is used for transportation, opening and packaging. The antistatic agent and the antistatic film may be scraped off at the time of work or the like, which may result in insufficient antistatic effect. When the package is opened and the contents are opened and the contents are taken out and taken out in this environment, the antistatic agent in the air and a part of the above film enter into the package and the package There is a problem that the inside of the bag is contaminated.

In a packaging bag comprising a packaging film in which the above-mentioned antistatic agent has been kneaded and laminated on the surface of a synthetic resin film, the antistatic agent exudes to the surface, and the exuded antistatic agent is applied to the packaging bag. There is a problem in that the material gets into the inside and adheres to the content, thereby contaminating the content.

In particular, when the contents of the packaging bag are electronic parts such as silicon wafers and semiconductors, it is required to maintain the inside of the packaging bag with a high degree of cleanliness. It is desired to develop a packaging bag having an improved antistatic effect.

The present invention has been made in view of the above circumstances, and provides sufficient antistatic properties, and prevents contamination of the inside of a packaging bag as much as possible upon opening, thereby maintaining a high degree of cleanliness. And a packaging bag using the same.

[0009]

Means for Solving the Problems and Embodiments of the Invention The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, formed a conductive layer for preventing static electricity between synthetic resin layers, By producing a laminated film having a three-layer structure or more that is not exposed on the surface and forming a packaging bag using the laminated film, a sufficient antistatic effect is obtained, and adsorption of dust and the like due to static electricity is effectively prevented. In addition, even if the contents are sealed in the packaging bag, or the contents are opened and the contents are taken out of the packaging bag, the conductive material contained in the conductive layer enters the packaging bag and the inside of the packaging bag is contaminated. The present inventors have found that a high degree of cleanliness can be reliably maintained without being performed, and have completed the present invention.

Accordingly, the present invention provides a packaging film comprising a laminated film having a three-layer structure or more having a conductive layer sandwiched between synthetic resin layers, and a packaging bag using the packaging film. I will provide a.

Hereinafter, the present invention will be described in more detail.
As described above, the packaging film of the present invention is a packaging film composed of a laminated film having a three-layer structure or more having a conductive layer sandwiched between synthetic resin layers, and in particular, electronic components such as silicon wafers and semiconductors. Is preferably used as a packaging bag material for a packaging bag having the content of

The conductive layer may be any conductive layer having sufficient conductivity to exhibit an antistatic effect. Examples of the conductive layer include carbon black, carbon fiber, copper fiber, copper, aluminum, A film layer in which a known conductive material such as a metal powder such as aluminum oxide, tin oxide, titanium oxide, and TIO (titanium indium oxide) is dispersed in a synthetic resin such as a polyethylene resin or a polypropylene resin, and the conductive material is dispersed therein. And so on. Among these, it is preferable to form a conductive layer by dispersing carbon fibers in a polyethylene resin from the viewpoint of compatibility between the synthetic resin and the conductive material and workability. In this case, the dispersion amount of the carbon fiber is 0.1 to 100 parts by weight of the polyethylene resin.
Preferred is 5 to 5 parts by weight, especially 2 to 3 parts by weight. The carbon fiber has a length of 1 to 20 mm, particularly 4 to 10 mm, a diameter of 3 to 15 μm, and particularly 5 to 10 μm.
m are preferably used. In addition, as a method of manufacturing the carbon fiber-dispersed polyethylene resin film as described above, a known paper making method or the like can be adopted.

The thickness of the conductive layer is not particularly limited, but is 10 to 100 μm, particularly 20 to 100 μm.
The thickness is preferably 60 μm, and if it exceeds 100 μm, the thickness of the entire packaging film becomes large, which may deteriorate the handleability of the packaging film.
If the thickness is less than μm, the antistatic effect inside the packaging bag may not be sufficiently obtained.

The synthetic resin layer provided on both sides of the conductive layer may have a single-layer structure or a multilayer structure having two or more layers. For example, a polyethylene resin, a nylon resin, a polypropylene resin, Examples include a polyvinyl alcohol (PVA) resin, a polyester resin, and the like, or a combination thereof. Among these, although not particularly limited, the packaging bag is constituted from the viewpoint of keeping the cleanness in the packaging bag at a high level, which is one of the objects of the present invention, and from the viewpoint of heat sealing properties. In the case, the synthetic resin layer on the side in contact with the contents is polyethylene resin,
A polypropylene resin or the like is preferably used, while a nylon film, a polyester film, a polyvinyl alcohol film, or the like is preferably used for the outer synthetic resin layer in terms of strength, cleanliness, and the like.

The thickness of the synthetic resin layer is not particularly limited, but is 10 to 40 μm, particularly 12 μm.
When the thickness exceeds 40 μm, the thickness of the entire packaging film becomes large and the handling property may be deteriorated. When the thickness is less than 10 μm, there may be a problem that the gas barrier property and strength are reduced.

As a method of forming the packaging film,
A known method can be used, and is appropriately selected depending on the materials used for the synthetic resin layer and the conductive layer. Specifically, when the conductive layer is a film layer, an adhesive is applied to the synthetic resin layer and the conductive layer film is laminated, or a polyethylene resin heated and melted between the synthetic resin layer and the conductive layer. An extrusion lamination method in which the two films are pressed together through the method can be employed.

The use, form and the like of the packaging bag made of the packaging film are not particularly limited, but, in particular, as described above, a silicone wafer,
It is suitably adopted as a packaging bag containing electronic components such as semiconductors as contents. For example, as shown in FIG.
As shown in FIG. 3, a three-sided bag 10 in which both side edges and a lower end of both sides 1 and 11 are heat-sealed, and a front sheet portion 12 and a rear sheet portion 13 opposed to each other, as shown in FIG.
2 and 13 are connected by a pair of gussets 14 and 14 at both side edges, respectively, and the lower end portions of the front seat portion 12, the rear seat portion 13 and the both gusset portions 14 and 14 are adhered to the bottom portion 15 The gusset bag 20 on which is formed can be suitably used as a packaging bag for electronic components.

[0018]

EXAMPLES The present invention will now be described specifically with reference to examples and comparative examples, but the present invention is not limited to the following examples. Example 1 A 30 μm-thick carbon fiber-dispersed polyethylene conductive film (Mishima Paper: 100 parts by weight of polyethylene resin mixed with 2 parts by weight of carbon fiber) was used as a conductive layer and shown in FIG. A packaging film 1 having a structure of nylon film 2 / conductive layer 3 / polyethylene film 4 was constructed. This film is formed by extruding a heated and melted polyethylene resin 5 into a film (thickness: 15 μm) to press-fit the 25 μm-thick nylon film 2 and the conductive layer 3, and the conductive layer 3 and the 40 μm thick And an extrusion lamination method in which the polyethylene film 4 was pressed.

[Comparative Example 1] Using the same polyethylene film (thickness: 40 μm) and nylon film (thickness: 25 μm) as in the above example, the polyethylene resin melted by heating was extruded into a film shape (thickness: 15 μm). The two films were pressed together by the same extrusion lamination method as in the examples to form a nylon / polyethylene film packaging film.

Comparative Example 2 The same conductive film (thickness 30 μm) and nylon film (thickness 25
μm) and a polyethylene film (thickness: 40 μm), and the polyethylene resin melted by heating was extruded into a film shape (thickness: 15 μm). A film / polyethylene film packaging film was constructed.

The surface resistivity and charged voltage decay time (antistatic) of the packaging films of the above Examples and Comparative Examples were measured to evaluate each of the packaging films. The following methods were used for these measurements. Table 1 shows the results. Surface resistivity The surface resistivity of each packaging film was measured according to JIS K6911. The surface resistivity was calculated automatically using a super insulation resistance meter 4329A (manufactured by Yokogawa Hewlett-Packard Co., Ltd.). Charge decay time The charge decay time shown in Table 1 was measured using a static honestometer (manufactured by Shisido Electrostatics).

[0022]

[Table 1]

As a result of Table 1, the packaging film of the example is
It was confirmed that a sufficient antistatic effect was obtained. When the ash of the cigarette was brought close to the polyethylene film side of each packaging film, almost no ash was attached to the packaging film of the example, but the ash was attached to the packaging film of Comparative Example 1 by static electricity. Large amounts adhered to the film surface.

Further, the three-sided bag shown in FIG. 2 is constructed by using the packaging films of the present embodiment and the comparative example, and the electronic parts are wrapped and sealed therein. After a period of time, the device was opened and an electronic component was taken out to conduct a use experiment, and the contamination state at that time was evaluated. As a result, with respect to the three-sided bag using the packaging film of the example, the inside of the packaging bag was not contaminated at the time of opening, and the cleanness could be kept at a high level. However, the packaging film of Comparative Example 1 was used. In the three-sided bag, adhesion of dust due to static electricity is observed inside the bag. In the three-sided bag using the packaging film of Comparative Example 2, a part of the conductive film is peeled off. It was confirmed that some parts were contaminated.

[0025]

As described above, according to the packaging film of the present invention and the packaging bag using the same, a sufficient antistatic effect can be obtained, and further, the inside of the packaging bag is contaminated when opened. Can be prevented as much as possible, and the degree of cleanness in the packaging bag can be maintained at a high level.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing an example of the packaging film of the present invention.

FIG. 2 is a perspective view showing an example of the packaging bag of the present invention.

FIG. 3 is a perspective view showing another example of the packaging bag of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Packaging film 2 Synthetic resin film 3 Conductive layer 4 Synthetic resin film 10 Packaging bag (three-sided bag) 20 Packaging bag (Gazette bag)

Claims (4)

[Claims] 1. A packaging film comprising a laminated film having a three-layer structure or more having a conductive layer sandwiched between synthetic resin layers. 2. The packaging film according to claim 1, wherein the conductive layer is a film layer obtained by dispersing a conductive material in a synthetic resin. 3. A packaging bag comprising the packaging film according to claim 1 or 2. 4. The packaging bag according to claim 3, which is a packaging bag for electronic parts.