JPH1079464A - Semiconductor device - Google Patents

Abstract

(57) Abstract: In a semiconductor device using a heat spreader, an electrical connection between an inner lead and a semiconductor chip can be easily and reliably performed, and a gap between the inner lead and the heat spreader at the time of use is provided. The purpose is to prevent short-circuits from occurring. The heat spreader supports a semiconductor chip, a support bar of a lead frame supporting the heat spreader, an inner lead of a lead frame connected to the semiconductor chip, and an insulating material connecting the inner leads to each other. The tape is made of a tape 18 and a sealing means, and the tape of the insulating material connects the inner leads at a position more outward than the inner end of the inner lead, and the tape of the insulating material is at a position outside the heat spreader. The inner end of the inner lead is located in a region including the heat spreader.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device such as a plastic IC of a low heat resistance type.

[0002]

2. Description of the Related Art Conventional low heat resistance type plastic I
In C, a semiconductor chip is mounted on a heat spreader and sealed with a resin in order to release heat in the semiconductor package. For example, in a conventional semiconductor device 1 shown in FIG. 10, a semiconductor chip (not shown) is supported by a heat spreader 2, and the semiconductor chip is wire-bonded to inner leads 3 of a lead frame.

Prior to wire bonding the inner leads 3 to the semiconductor chip, a tape (double-sided tape) 4 having a three-layer structure is attached to four sides of the surface of the heat spreader 2 as shown in FIG. The inner end of the inner lead 3 is adhered to the upper surface of the tape 4. Therefore, all the inner leads 3 are connected to each other by the tape 4 and are held at predetermined positions on the heat spreader 2. Therefore, wire bonding can be performed thereafter.

[0004] As shown in FIG.
May be arranged to connect the inner lead 3 at a position closer to the outside than the inner end of the inner lead 3.
Also in this case, all the inner leads 3 are connected to each other by the tape 4 and are held at predetermined positions on the heat spreader 2. Therefore, wire bonding can be performed thereafter.

[0005]

When wire bonding is performed between the inner lead 3 and the semiconductor chip while the tape 4 is interposed between the heat spreader 2 and the inner lead 3, the tape is 4
Gas is generated from the wire, making it difficult to perform wire bonding.
To improve it, it is necessary to perform special cleaning.

[0006] As shown in FIG.
When the inner end of the inner lead 3 extends inward of the tape 4, the inner end of the inner lead 3 is connected to the heat spreader 2 as shown by an arrow A during wire bonding and subsequent resin sealing. Tend to be pushed towards. For this reason, the inner end of the inner lead 3 easily comes into contact with the heat spreader 2. The heat spreader 2 is made of a material having a high thermal conductivity such as copper and is usually an electric conductor. Therefore, when the inner end of the inner lead 3 comes into contact with the heat spreader 2, there is a risk of short-circuit.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device using a heat spreader which can easily and surely make an electrical connection between an inner lead and a semiconductor chip, and which can be used between the inner lead and the heat spreader during use. An object of the present invention is to provide a semiconductor device in which a short circuit does not occur.

[0008]

A semiconductor device according to the present invention is connected to a semiconductor chip, a heat spreader supporting the semiconductor chip, a support bar of a lead frame supporting the heat spreader, and the semiconductor chip. The inner lead of the lead frame, a tape of an insulating material for connecting the inner leads to each other, and sealing means for sealing the heat spreader and the semiconductor chip, wherein the tape of the insulating material is a part of the inner lead. The inner lead is connected at a position more outward than the end, and the tape of the insulating material is located outside the heat spreader, and the inner end of the inner lead is in a region including the heat spreader. It is characterized by the following.

In the above configuration, the insulating tape connecting the plurality of inner leads is located outside the heat spreader, and the inner end of the inner lead is located in a region covered by the heat spreader. Therefore, the inner end of the inner lead and the semiconductor chip are electrically connected by wire bonding or the like.
The insulating tape does not adversely affect the wire bonding property.

In this case, the heat spreader may have an elastically deformable arm portion provided at a position where the heat spreader can contact the tape of the insulating material.
The elastically deformable arm may be configured to extend outward from the heat spreader and protrude from the surface of the heat spreader toward the semiconductor chip.
By doing so, the inner leads are lifted away from the heat spreader except during wire bonding, and do not come into contact with the heat spreader, thereby preventing short circuit.

Further, the present invention relates to a heat spreader for supporting a semiconductor chip, wherein the heat spreader has a substantially rectangular main body, and is elastically deformable extending outward from the main body and protruding toward a surface on which the semiconductor chip is to be supported. The present invention provides a heat spreader characterized by comprising a simple arm portion. This configuration is suitable as a heat spreader for the semiconductor device.

[0012]

1 to 6, a semiconductor device 10 according to the present invention includes a semiconductor chip 12, a heat spreader 14 supporting the semiconductor chip 12, a lead frame 16, and an insulating tape 18. Consists of
The lead frame 16 has a support bar 20 and inner leads 22.

The heat spreader 14 is made of a metal plate such as copper having excellent heat conductivity, and has a substantially rectangular main body portion 24 and extends outward from the main body portion 24 as shown in FIGS. And an elastically deformable arm portion 26 protruding toward the front side on which the semiconductor chip 12 is to be supported.
That is, the arm portion 26 is bent toward the surface on which the semiconductor chip 12 is to be supported. In FIG. 5, a notch 28 is provided in the main body portion 24 located at the base of each arm portion 26 to increase the length of each arm portion 26 to increase elasticity. The arm portions 26 are connected by flaps 30 extending parallel to each side of the main body portion 24.

As shown in FIG. 1, a lead frame 1
6, the support bar 20 is fixed to the heat spreader 14 and supports the heat spreader 14 in a predetermined positional relationship, where the inner end of the inner lead 22 is in a region including (the main body portion 24 of) the heat spreader 14. .
In other words, the inner end of the inner lead 22 is in a region where the inner lead 22 can come into contact with the surface of (the main body 24 of) the heat spreader 14.

The insulating tape 18 is located on the flap 30 of the heat spreader 14. That is, the tape 18 of the insulating material is used as the main part 2 of the heat spreader 14 (
It is located outside of 4). Accordingly, the insulating tape 18 connects the plurality of inner leads 22 to each other at a position closer to the outside than the inner ends of the inner leads 22 of the lead frame 16.

As shown in FIG. 2, an insulating tape 1
8 has only one surface as an adhesive layer, and the insulating tape 18 is adhered to the inner leads 22. The insulating tape 18 does not adhere to the flap 30 of the heat spreader 14 when it contacts the other side. The other surface of the insulating tape 18 is slightly separated from the surface of the flap 30 of the heat spreader 14.

As shown in FIG. 3, after all the inner leads 22 on each side of the heat spreader 14 are integrated by the insulating tape 18, wire bonding is performed to bond the inner leads 22 to the semiconductor chip 12. They are electrically connected by wires 32.

When performing wire bonding, a portion near the inner end of the inner lead 22 is pressed down by a jig (not shown). Then, the flap 30 of the heat spreader 14 is pushed down by the inner lead 22 via the insulating tape 18, the arm portion 26 of the heat spreader 14 is elastically deformed, and the flap 30 of the heat spreader 14 is pushed down. To be allowed. The inner end of the inner lead 22 comes into contact with the surface of (the main body portion 24 of) the heat spreader 14.

In this way, the insulating tape 18 is not on the heat spreader 14 (the main body portion 24), and the inner end of the inner lead 22 is on the heat spreader 14 (the main body portion 24). In this state, wire bonding can be performed without being affected by the insulating tape 18.

Next, when the jig is removed, the arm portion 26 of the heat spreader 14 elastically returns to the initial shape,
The inner leads 22, the insulating tape 18, and the (the main body portion 24) of the heat spreader 14 have the positional relationship shown in FIG. Here, the insulating tape 18 is slightly separated from the flap 30 of the heat spreader 14, and the inner end of the inner lead 22 is separated from (the main body portion 24 of) the heat spreader 14.

Then, as shown in FIG. 4, the resin 34 is packaged. If the resin 34 is packaged in a state where the inner end of the inner lead 22 is surely separated from (the main body portion 24 of) the heat spreader 14,
Even in the completed package, the inner ends of the inner leads 22 are separated from (the main body portion 24 of) the heat spreader 14. Therefore, during use, the inner lead 22 does not short-circuit to the heat spreader 14 which is a conductor such as copper.

FIGS. 7 and 8 show the heat spreader 14.
It is a figure showing other examples of. This heat spreader 14
Is composed of a substantially rectangular main body portion 24 and an elastically deformable arm portion 26 extending outward from the main body portion 24 and protruding to the surface side on which the semiconductor chip 12 is to be supported.
Also in this example, the arm portion 26 is bent toward the surface on which the semiconductor chip 12 is to be supported. Also, each arm part 2
A notch 28 is provided in the main body portion 24 located at the root of 6,
The length of each arm portion 26 is increased to increase elasticity. However, the flap 30 at the tip of the arm portion 26 is shorter than that of FIG.
6 is not connected.

FIG. 9 is a view showing still another example of the heat spreader 14. As shown in FIG. This heat spreader 14
Is composed of a substantially rectangular main body portion 24 and an elastically deformable arm portion 26 extending outward from the main body portion 24 and protruding to the surface side on which the semiconductor chip 12 is to be supported.
In this example, the arm portion 26 is not formed by bending the front side of the semiconductor chip 12 to be supported.
It is formed in a projection shape by crushing using a punch.

[0024]

As described above, according to the present invention,
Electrical connection between the inner lead and the semiconductor chip can be made easily and reliably, and short-circuit between the inner lead and the heat spreader can be prevented during use.

[Brief description of the drawings]

FIG. 1 is a diagram showing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a relationship between an inner lead and a heat spreader of the semiconductor device of FIG. 1;

FIG. 3 is a view showing a state where wire bonding of the semiconductor device of FIG. 1 is performed.

FIG. 4 is a diagram illustrating a process of packaging a resin of the semiconductor device of FIG. 1;

FIG. 5 is a plan view of the heat spreader of FIG. 1;

FIG. 6 is a cross-sectional view of the heat spreader of FIG. 5 taken along line VI-VI.

FIG. 7 is a plan view showing another example of the heat spreader.

8 is a cross-sectional view of the heat spreader of FIG. 7 taken along line VIII-VIII.

FIG. 9 is a sectional view showing still another example of the heat spreader.

FIG. 10 is a diagram showing a conventional semiconductor device.

11 is a diagram showing a relationship between an inner lead and a heat spreader of the semiconductor device of FIG.

FIG. 12 is a diagram showing another relationship between a conventional inner lead and a heat spreader.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor 12 ... Semiconductor chip 14 ... Heat spreader 16 ... Lead frame 18 ... Tape 20 ... Support bar 22 ... Inner lead 24 ... Body part 26 ... Arm part

Claims (4)

[Claims] A semiconductor chip; a heat spreader supporting the semiconductor chip; a support bar of a lead frame supporting the heat spreader; an inner lead of a lead frame connected to the semiconductor chip; An insulating tape connected to each other, and sealing means for sealing the heat spreader and the semiconductor chip, wherein the insulating tape is located at a position more outward than an inner end of the inner lead. A semiconductor device connecting the leads, wherein the tape of the insulating material is located outside the heat spreader, and the inner end of the inner lead is in a region including the heat spreader. 2. The semiconductor device according to claim 1, wherein the heat spreader has an elastically deformable arm portion provided at a position where the heat spreader can contact the tape of the insulating material. 3. The semiconductor device according to claim 2, wherein the elastically deformable arm extends outward from the heat spreader and projects toward the semiconductor chip from a surface of the heat spreader. 4. A heat spreader for supporting a semiconductor chip, comprising: a substantially rectangular main body portion; and an elastically deformable arm portion extending outward from the main body portion and projecting to a surface side on which the semiconductor chip is to be supported. A heat spreader comprising: