JPH1064637A - Surface mount connector - Google Patents
Surface mount connectorInfo
- Publication number
- JPH1064637A JPH1064637A JP8214825A JP21482596A JPH1064637A JP H1064637 A JPH1064637 A JP H1064637A JP 8214825 A JP8214825 A JP 8214825A JP 21482596 A JP21482596 A JP 21482596A JP H1064637 A JPH1064637 A JP H1064637A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- contact
- surface mount
- mount connector
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は表面実装コネクタに
関し、特にリード部品を装着する表面実装コネクタに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount connector, and more particularly to a surface mount connector for mounting lead components.
【0002】[0002]
【従来の技術】従来、電子機器の回路部品は、大半が表
面実装に対応した電極形状を有し、プリント基板への自
動実装とリフロー半田付けとが可能である。しかし、こ
れらの回路部品のうちの一部の回路部品は耐熱性が悪
い,値段が高い等の理由からこの自動実装とリフロー半
田付けとを使用せず、表面実装に対応できない電極形状
を持つリード電極を有するリード部品を使用し、図5に
示すように、リード部品6をプリント基板9のスルーホ
ールへ挿入したり、図6に示すように、リード部品11
をプリント基板9へ横たえたりした後に手作業で半田付
けを行っている。2. Description of the Related Art Conventionally, most circuit components of electronic devices have electrode shapes corresponding to surface mounting, and can be automatically mounted on a printed circuit board and reflow soldered. However, some of these circuit components do not use this automatic mounting and reflow soldering because of poor heat resistance and high price, and lead with an electrode shape that cannot be used for surface mounting. Using a lead component having electrodes, the lead component 6 is inserted into a through hole of the printed circuit board 9 as shown in FIG. 5, or the lead component 11 is inserted as shown in FIG.
Is laid on the printed circuit board 9 and then soldered manually.
【0003】[0003]
【発明が解決しようとする課題】上述した、電子機器の
回路部品のうちの一部の回路部品は自動実装とリフロー
半田付けとを使用せず、表面実装に対応できない電極形
状を持つリードを有するリード部品を使用し、このリー
ド部品をプリント基板上に置き手作業で半田付けを行っ
ている。このため、プリント基板へのリード部品の搭載
に対し電気的に接続不良を起こす恐れがあり、信頼性に
欠けるという問題がある。Some of the above-mentioned circuit components of electronic equipment do not use automatic mounting and reflow soldering, and have leads having electrode shapes that cannot be used for surface mounting. Lead components are used, and the lead components are placed on a printed circuit board and soldered manually. For this reason, there is a possibility that electrical connection failure may occur when mounting the lead component on the printed circuit board, and there is a problem that reliability is lacking.
【0004】本発明の目的はこのような従来の欠点を除
去するため、プリント基板へのリード部品の搭載に対し
電気的に接続不良を起こす恐れがなく、信頼性に欠けな
い表面実装コネクタを提供することにある。[0004] An object of the present invention is to provide a surface mount connector which does not have a risk of causing electrical connection failure when mounting lead components on a printed circuit board and which does not lack reliability in order to eliminate such conventional disadvantages. Is to do.
【0005】[0005]
【課題を解決するための手段】本発明の表面実装コネク
タは、リード部品の複数のリードをそれぞれ挿入したと
きに前記複数のリードとそれぞれ接触し前記複数のリー
ドをそれぞれ保持する複数のコンタクト部と、前記複数
のコンタクト部とそれぞれ接続しプリント基板の表面に
それぞれ当接するようにした複数の電極と、前記複数の
コンタクト部と前記複数の電極とを具備する本体と、を
備えて構成されている。A surface mount connector according to the present invention comprises a plurality of contact portions which respectively contact the plurality of leads when the plurality of leads of the lead component are inserted and hold the plurality of leads. A plurality of electrodes that are respectively connected to the plurality of contact portions so as to contact the surface of the printed circuit board, respectively, and a main body including the plurality of contact portions and the plurality of electrodes. .
【0006】また、本発明の表面実装コネクタの前記複
数のコンタクト部のそれぞれのコンタクト部は、前記リ
ード部品のリードを挿入したときにバネ圧力により前記
リードと接触しこのリードを保持するようにしている。Further, the respective contact portions of the plurality of contact portions of the surface mount connector of the present invention come into contact with and hold the leads by spring pressure when the leads of the lead component are inserted. I have.
【0007】[0007]
【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【0008】図1は、本発明の表面実装コネクタの一つ
の実施の形態を示す斜視図である。FIG. 1 is a perspective view showing one embodiment of the surface mount connector of the present invention.
【0009】図1に示す本実施の形態は、リード部品6
の複数のリード7(以後、例えば2つのリード7として
記述する。)をそれぞれ挿入したときにこれら2つのリ
ード7とそれぞれ接触しこれら2つのリード7をそれぞ
れ保持する複数のコンタクト部2(以後、例えば2つの
コンタクト部2として記述する。)と、この2つのコン
タクト部2とそれぞれ接続し表面実装コネクタ1をプリ
ント基板9に搭載したときにこのプリント基板9の表面
にそれぞれ当接するようにした複数の電極3(以後、例
えば2つの電極3として記述する。)と、これらの2つ
のコンタクト部2と2つの電極3とを具備する本体4と
により構成されている。The present embodiment shown in FIG.
When a plurality of leads 7 (hereinafter, referred to as, for example, two leads 7) are respectively inserted, a plurality of contact portions 2 (hereinafter, referred to as two leads 7) that respectively contact the two leads 7 and hold the two leads 7 respectively. For example, two contact portions 2 are described.) And a plurality of contact portions 2 that are respectively connected to the two contact portions 2 so as to abut on the surface of the printed board 9 when the surface mount connector 1 is mounted on the printed board 9. (Hereinafter, referred to as, for example, two electrodes 3), and a main body 4 including the two contact portions 2 and the two electrodes 3.
【0010】次に、本実施の形態の表面実装コネクタを
図2及び図3を参照して説明する。Next, the surface mount connector of the present embodiment will be described with reference to FIGS.
【0011】図2は、図1に示す本実施の形態のXY断
面図であり、バネ5を有する2つのコンタクト部2が2
つの電極3とそれぞれ接続し、それぞれの電極3は、そ
れぞれ本体4下部にまでおよんでいることを示してい
る。FIG. 2 is an XY sectional view of the present embodiment shown in FIG.
Each of the electrodes 3 is connected to each other, and each of the electrodes 3 extends to a lower portion of the main body 4.
【0012】図3は、図1に示す本実施の形態にリード
部品を取り付けプリント基板に搭載したときの断面図で
あり、表面実装コネクタ1が穴のあいたプリント基板9
上に乗せられ、プリント基板9のパターン10と表面実
装コネクタ1の電極3とが例えばクリーム半田等の半田
8にて半田付けされ、この表面実装コネクタ1にリード
部品6のリード7が挿入されこのリード7がコンタクト
部2の具備するバネ5のバネ圧力によりコンタクト部2
と接触し保持されているようすを示している。このと
き、リード部品6のリード7はプリント基板9の面に対
し垂直に挿入される。また、この表面実装コネクタ1
は、例えばクリーム半田等の半田8を印刷したプリント
基板9上へ自動搭載機等により実装されリフロー炉等へ
通されることによりプリント基板9へ半田付けされる。FIG. 3 is a cross-sectional view of the embodiment shown in FIG. 1 when lead components are mounted and mounted on a printed circuit board.
The pattern 10 of the printed circuit board 9 and the electrode 3 of the surface mount connector 1 are soldered with solder 8 such as cream solder, for example, and the lead 7 of the lead component 6 is inserted into the surface mount connector 1. The lead 7 is connected to the contact portion 2 by the spring pressure of the spring 5 of the contact portion 2.
3 shows a state in which it is in contact with and held. At this time, the lead 7 of the lead component 6 is inserted perpendicularly to the surface of the printed circuit board 9. In addition, this surface mount connector 1
Is mounted on a printed board 9 on which solder 8 such as cream solder is printed by an automatic mounting machine or the like, and is passed through a reflow furnace or the like, and is soldered to the printed board 9.
【0013】図1において、本体4に具備した2つのコ
ンタクト部2のそれぞれのコンタクト部2は、図2に示
すようにそれぞれバネ5を具備し、図3に示ように例え
ば2つのリード7を有するリード部品6のそれぞれのリ
ード7をこれらのコンタクト部2にそれぞれ挿入したと
きにバネ5の圧力により挿入したリード7と接触しこれ
らのリード7を保持する。本体4に具備した2つの電極
3のそれぞれの電極3は、2つのコンタクト部2にそれ
ぞれ接続され、図2に示すように本体4の下部にまでお
よんでいる。そして、これらの電極3は、図3に示すよ
うにプリント基板9に半田付けされる。In FIG. 1, each contact portion 2 of the two contact portions 2 provided in the main body 4 has a spring 5 as shown in FIG. 2, and has, for example, two leads 7 as shown in FIG. When each lead 7 of the lead component 6 is inserted into each of the contact portions 2, the lead 7 comes into contact with the inserted lead 7 by the pressure of the spring 5 and holds the lead 7. The respective electrodes 3 of the two electrodes 3 provided on the main body 4 are connected to the two contact portions 2 respectively, and extend to the lower part of the main body 4 as shown in FIG. These electrodes 3 are soldered to a printed circuit board 9 as shown in FIG.
【0014】以上説明では、リード部品6のリード7を
プリント基板9の面に対し垂直に挿入するように形成し
た表面実装コネクタ1を記載したが、図4に示すように
リード部品11のリード12をプリント基板9の面に対
し平行に挿入するようにするときには表面実装コネクタ
1のコンタクト部2を本体4の側面に具備するようにし
ても良い。In the above description, the surface mount connector 1 formed so that the lead 7 of the lead component 6 is inserted perpendicular to the surface of the printed circuit board 9 has been described. However, as shown in FIG. May be provided parallel to the surface of the printed circuit board 9, the contact portion 2 of the surface mount connector 1 may be provided on the side surface of the main body 4.
【0015】[0015]
【発明の効果】以上説明したように、本発明の表面実装
コネクタによれば、リード部品の複数のリードとそれぞ
れ接触しこれらをそれぞれ保持する複数のコンタクト部
と、この複数のコンタクト部とそれぞれ接続しプリント
基板の表面にそれぞれ当接するようにした複数の電極
と、複数のコンタクト部と複数の電極とを具備する本体
とを備えているので、この表面実装コネクタを例えば自
動搭載機によりプリント基板に実装しリフロー炉に通し
た後に、この表面実装コネクタにリード部品を搭載する
ことによって手作業による半田付けなしにリード部品を
プリント基板に搭載できるため、電気的に接続不良を起
こす恐れがなく、信頼性のあるプリント基板へのリード
部品の搭載ができる。As described above, according to the surface mount connector of the present invention, a plurality of contact portions which come into contact with and hold the plurality of leads of the lead component, respectively, and are respectively connected to the plurality of contact portions. Since it has a plurality of electrodes each of which comes into contact with the surface of the printed circuit board, and a main body having a plurality of contact portions and a plurality of electrodes, the surface mount connector can be attached to the printed circuit board by, for example, an automatic mounting machine. After mounting and passing through a reflow furnace, the lead components can be mounted on the printed circuit board without manual soldering by mounting the lead components on this surface mount connector. Lead components can be mounted on flexible printed circuit boards.
【図1】本発明の表面実装コネクタの一つの実施の形態
を示す斜視図である。FIG. 1 is a perspective view showing one embodiment of a surface mount connector of the present invention.
【図2】図1に示す本実施の形態のXY断面図である。FIG. 2 is an XY cross-sectional view of the embodiment shown in FIG.
【図3】図1に示す本実施の形態にリード部品を取り付
けプリント基板に搭載したときの断面図である。FIG. 3 is a cross-sectional view when a lead component is mounted on a printed circuit board in the embodiment shown in FIG. 1;
【図4】リードをプリント基板の面に対し平行に挿入す
るようにした表面実装コネクタの斜視図である。FIG. 4 is a perspective view of a surface mount connector in which leads are inserted in parallel with a surface of a printed circuit board.
【図5】従来のプリント基板へのリード部品の搭載図で
ある。FIG. 5 is a view showing mounting of lead components on a conventional printed circuit board.
【図6】従来のプリント基板への他のリード部品の搭載
図である。FIG. 6 is a mounting diagram of another lead component on a conventional printed circuit board.
1 表面実装コネクタ 2 コンタクト部 3 電極 4 本体 5 バネ 6 リード部品 7 リード 8 半田 9 プリント基板 10 パターン 11 リード部品 12 リード DESCRIPTION OF SYMBOLS 1 Surface mount connector 2 Contact part 3 Electrode 4 Main body 5 Spring 6 Lead component 7 Lead 8 Solder 9 Printed circuit board 10 Pattern 11 Lead component 12 Lead
Claims (4)
入したときに前記複数のリードとそれぞれ接触し前記複
数のリードをそれぞれ保持する複数のコンタクト部と、 前記複数のコンタクト部とそれぞれ接続しプリント基板
の表面にそれぞれ当接するようにした複数の電極と、 前記複数のコンタクト部と前記複数の電極とを具備する
本体と、 を備えたことを特徴とする表面実装コネクタ。A plurality of contact portions that respectively contact the plurality of leads when the plurality of leads of the lead component are inserted and respectively hold the plurality of leads; and a printed circuit board connected to the plurality of contact portions, respectively. A surface-mounted connector comprising: a plurality of electrodes each of which comes into contact with a surface of the device; and a main body including the plurality of contact portions and the plurality of electrodes.
ンタクト部は、前記リード部品のリードを挿入したとき
にバネ圧力により前記リードと接触しこのリードを保持
するようにしたことを特徴とする請求項1記載の表面実
装コネクタ。2. The contact portion of each of the plurality of contact portions, wherein when the lead of the lead component is inserted, the contact comes into contact with the lead by spring pressure and holds the lead. 2. The surface mount connector according to 1.
ンタクト部は、前記表面実装コネクタを前記プリント基
板に搭載したときに前記複数の電極と当接した前記プリ
ント基板の面に対し前記リードを垂直に挿入するように
形成したことを特徴とする請求項1又は2記載の表面実
装コネクタ。3. The contact section of each of the plurality of contact sections, wherein the lead is perpendicular to a surface of the printed circuit board which is in contact with the plurality of electrodes when the surface mount connector is mounted on the printed circuit board. The surface mount connector according to claim 1, wherein the surface mount connector is formed so as to be inserted.
ンタクト部は、前記表面実装コネクタを前記プリント基
板に搭載したときに前記複数の電極と当接した前記プリ
ント基板の面に対し前記リードを平行に挿入するように
形成したことを特徴とする請求項1又は2記載の表面実
装コネクタ。4. A contact portion of each of the plurality of contact portions, wherein the lead is arranged in parallel with a surface of the printed circuit board that contacts the plurality of electrodes when the surface mount connector is mounted on the printed circuit board. The surface mount connector according to claim 1, wherein the surface mount connector is formed so as to be inserted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8214825A JPH1064637A (en) | 1996-08-14 | 1996-08-14 | Surface mount connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8214825A JPH1064637A (en) | 1996-08-14 | 1996-08-14 | Surface mount connector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1064637A true JPH1064637A (en) | 1998-03-06 |
Family
ID=16662163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8214825A Pending JPH1064637A (en) | 1996-08-14 | 1996-08-14 | Surface mount connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1064637A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009031211A1 (en) * | 2007-09-05 | 2009-03-12 | Bosch Corporation | High mounting density circuit board |
-
1996
- 1996-08-14 JP JP8214825A patent/JPH1064637A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009031211A1 (en) * | 2007-09-05 | 2009-03-12 | Bosch Corporation | High mounting density circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19990518 |