JPH1058489A - Resin molding machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automate separate recovery of a molding from an unnecessary resin and to improve its efficiency by providing a mechanism for gate-breaking the molding by a loading member and a mechanism for separating the unnecessary resin from the molding after gate breaking to recover it in a molding removing means. SOLUTION: A rack for holding a plurality of wire diodes (moldings) is aligned and supplied to a loading frame 4 set to a material-to-be-molded supply side. A molding on the frame 4 discharged to a discharge side of a removing unit from a mold 1 is gate-broken by a gate-breaking mechanism 24. A wire diode after molding and unnecessary resin are separated and recovered by an unnecessary resin separating mechanism 25. The wire diode is chucked by a molding containing mechanism 26, and contained. Thus, the diode placed on the frame 4 is recovered by a rack unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus which gate-breaks a molded product from a loading member discharged to a molded product discharge side and separates and collects unnecessary resin and the molded product.

[0002]

2. Description of the Related Art Conventionally, in a resin molding apparatus for carrying a molded article between an upper mold and a lower mold that can be moved and separated, closing the mold and performing resin molding, a wire rod is used as the molded article. For example, when resin molding is performed using a large amount of electronic components such as wire diodes, the wire diodes are aligned and mounted on a loading frame, and the loading frame is used as a molding die of a single plunger type production molding apparatus, for example. It was carried in and resin molding was performed. After the resin molding, remove the mold and loading frame, remove unnecessary resin such as molded product culls and molded product runners by hand, or gently knock down the molded product side with a jig to perform gate break and mold Product and unnecessary resin were separated.

Further, in order to save the trouble of gate breaking by the above manual work, the present applicant has disclosed in Japanese Patent Application Laid-Open No. 60-22451.
As disclosed in Japanese Patent Laid-Open No. 7, there is proposed a transfer molding machine that gate-breaks a molded product and a molded product runner by ejecting an ejector pin simultaneously with opening of a mold. In this transfer molding machine, a molded wire diode and an unnecessary resin such as a molded product runner and a molded product cull on a loading frame are gate-breaked and are unloaded from the mold in a state where they are merely mounted. Thereafter, the loading frame was placed on a table, and unnecessary resin was manually removed. In addition, the wire diode as a molded product is subjected to a vertical bur
Thin burrs and wire burrs were removed.

[0004]

However, in the conventional production molding apparatus, since a gate break between a molded product and an unnecessary resin is performed manually, it is necessary to gate break a large amount of wire diodes.
Since the loading frame is also exposed to high heat, it takes time to work, and dust is also scattered, so workability is low.

[0005] In addition, when gate break in a mold is performed by an ejector pin, the height of the mold is increased, which is not preferable because the entire apparatus becomes large. That is, when performing production molding, since the height of the mold itself is high, gate break in the mold is possible.However, an auto molding machine handles handling such as separation of a molded product and unnecessary resin after the gate break. Considering this, the height of the mold cannot be made too high. In addition, unnecessary resin placed on the loading frame after the gate break in the mold flaps during transportation of the frame, and may interfere with the wire diode when it is separated from the wire diode and may be ejected from the mounting portion. Therefore, the resin molding process must be stopped. In addition, molded products after gate break can be aligned by collecting them manually, but if they are knocked down with a jig or the like, they will be collected separately without being aligned and handled when moving to the subsequent blasting process etc. hard.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and to efficiently and orderly perform gate break of a molded product placed on a loading member and separation and recovery of the molded product from unnecessary resin. An object of the present invention is to provide a resin molding device having a gate break mechanism for a molded product.

[0007]

The present invention has the following arrangement to achieve the above object. That is, a molding die for mounting a molded article and performing resin molding, tablet supply means for supplying a resin tablet to the molding die, a loading member for aligning and placing the molded article, and the loading member. A moving mechanism for moving the molded article from the molded article supply side to the molded article discharge side via the mold, and a molded article which supplies the molded article to the loading member located on the molded article supply side. Supply means, and a molded article taking-out means for separating the molded article from unnecessary resin from the loading member discharged to the molded article discharge side and taking out the molded article, wherein the molded article taking-out means gates the molded article from the loading member. A gate break mechanism, and an unnecessary resin collecting mechanism that separates and collects unnecessary resin from a molded product after the gate break. That.

[0008] The gate break mechanism comprises a molding member having an unnecessary resin pressing member for contacting and pressing the unnecessary resin, and an abutting member capable of contacting the molded product when the molded product is pushed up. Molding comprising: an upper pressing means capable of moving toward and away from the article; a positioning member for positioning the molded article on the loading member to prevent displacement; and a push-up member for pushing up unnecessary resin to cause a gate break. And a lower pressing means that can move toward and away from the product. Further, the gate break mechanism presses the unnecessary resin from above by the unnecessary resin pressing member of the upper pressing means, rotates the molded product while positioning the molded product by the positioning member of the lower pressing means, and pushes up the unnecessary resin by the push-up member. Then, the unnecessary resin and the molded part may be separated by rotating the molded product so as to rotate in the opposite direction so that the unnecessary resin and the resin sealing portion are relatively close to each other to perform a gate break. good. Further, the unnecessary resin collecting mechanism chucks and lifts the unnecessary resin after the gate break, moves the loading member on which the molded product is placed, and releases the chuck to collect the unnecessary resin in the unnecessary resin collecting unit. Is preferred. Further, the molded product take-out means may include a molded product storage mechanism for holding and storing the molded product from the loading member after collecting the unnecessary resin. In addition, a loading frame is used as the loading member, and the moving mechanism moves the loading frame arranged on the molded article supply side to the molding article supply side again via the mold and the molded article discharge side. A circling movement mechanism may be used.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, a resin molding apparatus provided with a gate break mechanism for a molded product for resin-molding a wire diode as a molded product will be described. 1 is a top view showing the entire configuration of the resin molding apparatus, FIG. 2 is a front view of the gate break mechanism, FIG. 3 is a partially enlarged explanatory view of the gate break mechanism, and FIG. 4 is a view above the upper pressing mechanism of the gate break mechanism. 5, FIG. 5 is a front view of an upper pressing mechanism of the gate breaking mechanism, FIG. 6 is a top view of a lower pressing mechanism of the gate breaking mechanism, and FIG. 7 is a side view in the Y direction of the lower pressing mechanism of FIG. 8 is a side view in the X direction of the lower pressing mechanism in FIG. 6, FIG. 9 is a top view and a front view showing the entire configuration of the molded product taking-out section, FIG. 10 is an explanatory view showing the configuration of the unnecessary resin collecting section, FIG. FIG. 11 is a partially enlarged explanatory view of an unnecessary resin collecting unit in FIG. 10.

First, the overall structure of a resin molding apparatus having a gate break mechanism for a molded product will be described with reference to FIG. Reference numeral 1 denotes a molding die, which carries out resin molding by placing a wire material such as a wire diode 2 in which a semiconductor element is bonded to a wire and moving the upper die toward and away from the wire. In this embodiment, cavities are formed on both sides of the pot at a total of 12 places, 6 places on one side.

Reference numeral 3 denotes a tablet holder as tablet supply means for supplying a resin tablet to the lower mold. The tablet holder 3 is a device in which resin tablets aligned and held at intervals corresponding to the pots formed in the lower mold 1 are manually or automatically loaded into a molding die to load the resin tablets into each pot. is there. From the preheated state, the resin tablet is pressed by the plunger, and the molten resin is filled into the cavity through the respective resin paths, and the resin molding is performed.

Reference numeral 4 denotes a loading frame as a loading member on which the wire diodes 2 are arranged and mounted. The loading frame 4 has a total of 12 mounting portions for mounting the wire diodes 2 on both sides of the pot corresponding to the cavity of the mold 1. As the loading frame 4, a lightweight and highly portable metal plate such as an aluminum plate is preferably used, and the loading frame 4 is moved around by a loading frame rotation moving mechanism 5 as a moving mechanism described later. The loading frame orbiting moving mechanism 5 makes the orbital movement from the supply side of the molded article to the supply side of the molded article again via the molding die 1 and the discharge side of the molded article while the plurality of loading frames 4 are placed.

Reference numeral 6 denotes a wire feeding mechanism, which feeds a plurality of wire diodes 2 to a loading frame 4 set on the molding material supply side in a row for each rack holding a plurality of wire diodes 2.
Reference numeral 7 denotes a molded product take-out part as a molded product take-out means, a gate break mechanism 24 for gate-breaking the molded product on the loading frame 4 discharged from the mold 1 to the molded product discharge side, and a wire after molding. An unnecessary resin separation mechanism 25 that separates the diode 2 from the unnecessary resin and separates and collects the unnecessary resin, and a molded article storage mechanism 26 that chucks and stores the wire diode 2 are provided. After the gate break by the gate break mechanism 24, the unnecessary resin is collected by the unnecessary resin separating mechanism 25 from the molded product on the loading frame 4, and the wire diode 2 mounted on the loading frame 4 is removed by the molded product storage mechanism 26. Collected in rack units.

Next, the structure of each part of the resin molding apparatus provided with the gate break mechanism for the molded product will be specifically described.

(Loading Frame) As shown in FIG. 2, the loading frame 4 has a stacking plate 4c having support portions 4a and 4b formed with a plurality of concavities and convexities formed on both sides in the longitudinal direction so as to be adjacent to each other. There are a total of twelve cards, six on each side. Each loading plate 4c is placed and fixed on a base plate 4d. On each loading plate 4c, a wire diode 2 in which a wire lead is joined to a semiconductor element such as a diode is mounted with both ends of the wire supported by the support portions 4a and 4b and aligned in rack units in the longitudinal direction. . Further, wire guides 4e and 4f serving as stoppers are provided on both sides of the support portions 4a and 4b in a longitudinal direction in parallel with the support portions 4a and 4b, respectively, so as to prevent rattling of the wire diode 2 in the longitudinal direction. ing.

(Loading Frame Revolving Movement Mechanism) As shown in FIG. 1, a first, second, and a second belt conveying means are provided on a molded article supply side and a molded article discharge side of a mold.
Third, fourth, fifth belt conveying devices 8a, 8b, 8c, 8
d, 8e are provided. The first to fifth belt conveying devices 8a to 8e are arranged vertically and horizontally as shown in FIG. 1 so as to circulate the loading frame 4 from the molded article supply side to the molded article discharge side. 9 and transported. An endless belt is preferably used as the belt 9 and a belt drive motor 10
The loading frame 4 placed on the belt 9 is linearly moved in the vertical and horizontal directions by being rotationally driven by a, 10b, 10c, 10d, and 10e.

Numerals 11 and 12 denote elevator mechanisms as elevating means, which place the loading frame 4 on an elevation table and elevate it. The above elevator mechanism 1
As shown in FIG. 1, reference numerals 1 and 12 are provided on the left and right sides of the resin molding apparatus, respectively, corresponding to a molded article supply side and a molded article discharge side. When the empty loading frame 4 after recovering the molded product is transferred from the fourth belt conveying device 8d to the elevating position H, the elevator mechanism 11 ascends from the device bottom to the device upper portion and moves to the standby position I by a moving cylinder described later. Move. Then, at the standby position I, the delivery of the loading frame 4 to the fifth belt transport means 8e is performed, and the loading frame 4 is transported toward the molded article supply position A. The elevator mechanism 12 lowers the loaded frame 4 from the top of the apparatus to the bottom of the apparatus after collecting the molded product, and transfers the loaded frame 4 from the elevating position G to the fourth belt transport device 8d.

Reference numerals 13 and 14 denote moving cylinders as moving means, which are provided on the left and right sides of the resin molding apparatus, respectively, corresponding to a molded article supply side and a molded article discharge side. The moving cylinder 13 moves the loading frame 4 raised by the elevator mechanism 11 from the elevating position H to the standby position I, and transfers it to the fifth belt conveying device 8e. The moving cylinder 14 moves the loading frame 4 from the molded product storage position F to the elevating position G, and performs delivery to the elevator mechanism 12.

Reference numerals 15 and 16 denote inloaders and unloaders as transport means. After the loading frame 4 to which the wire diode 2 has been supplied from the wire supply mechanism 6 at the molded article supply position A is moved to the chuck position B by the first belt conveying device 8a, the in-loader 15 is moved.
And is carried into the molding position C on the lower mold 1. The hand 16a of the unloader 16 (see FIG. 5) chucks the loading frame 4 on which the molded product after resin molding is placed, and carries the molded product from the molding position C to the molded product removal position D. A second belt transport device 8b is provided at the molded product take-out position D, and the loading frame 4 is placed on the second belt transport device 8b and transported to the unnecessary resin collecting position E. A cleaning device 16b is provided at the end of the unloader 16 on the side of the mold, and cleans the surface of the mold to remove dust, unnecessary resin, and the like when moving in and out of the mold 1.

The above-mentioned loading frame orbit moving mechanism 5
Is equipped with three loading frames 4,
A plurality of sheets are on standby on the molded product supply side and the molded product discharge side, and the supply operation of molded products, molding operation, removal operation of molded products, recovery operation of unnecessary resin, storage operation of molded products, etc. are on standby. The system is designed to minimize the time.

(Wire Supply Mechanism) In FIG. 1, the wire supply mechanism 6 is equipped with a magazine supply / discharge mechanism 19 for supplying / discharging a magazine 18 accommodating a plurality of racks 17 holding a predetermined amount of wire diodes. The above rack 1
7 is provided with a number of wire diodes which are supplied to one side cavity and molded by resin, and for example, about 500 to 600 wire diodes are supplied in rack units. The magazine 18 is supplied by a magazine supply / discharge mechanism 19 that is pushed up toward the near side by an elevation mechanism that moves up and down in the vertical direction with respect to the paper surface.
7 are taken out and sequentially aligned and held on the rack holder 20. Reference numeral 21 denotes a slide chuck as a molded article transfer means, which chucks the wire diodes held by the rack holder 20 in units of racks and aligns them on the loading frame 4 set at the molded article supply position A. To transfer.

The empty rack 17 is ejected to the outside of the apparatus by being chucked by a hand (not shown) and mounted on the conveyor belt 22. When the magazine 18 becomes empty, it can be moved to the discharge position by the magazine supply / discharge mechanism 19 and taken out.

Reference numeral 23 denotes a dummy wire supply device serving as dummy supply means, and supplies a dummy wire to a defective portion of the wire diode arranged and mounted on the loading frame 4. The above dummy wire supply device 23
Is configured to be able to scan on the loading frame 4 in the X and Y directions. When a sensor detects a defective portion of the wire diode, the dummy wire supplied to the hopper is supplied one by one. The dummy wire is supplied by the dummy wire supply device 22 to prevent the resin from leaking from the defective portion of the wire diode.

In FIG. 1, the loading frame 4 transferred to the second belt transporting device 8 b at the molded product removal position D by the unloader 16 is subjected to gate break by the gate break mechanism 24. The gate break mechanism 24 performs a gate break by rotating the wire diode 2 placed on the loading frame 4 to perform cull, runner,
Unnecessary resin with integrated gate and wire diode 2
And separated. Then, the second belt conveying device 8b
Is transported to the unnecessary resin collecting mechanism 25 as unnecessary resin collecting means provided at the unnecessary resin collecting position E. The unnecessary resin collecting mechanism 25 chucks the unnecessary resin by hand and holds the unnecessary resin on the upper side. Then, the loading frame 4 on which the wire diode 2 is mounted is moved to the molded article storage position F by the third belt conveying device 8c. It is conveyed to the provided molded article storage mechanism 26. After that, the unnecessary resin chucked by the hand of the unnecessary resin collecting mechanism 25 is released from the chuck, dropped onto the conveyor 28 via the chute 27 provided below, is conveyed, and is collected by the scrap box 29 (FIG. 9).

The loading frame 4 conveyed to the molded product storage position F is lifted above the frame mounting surface by the elevating mechanism (not shown), and is stored in the molded product storage mechanism 26 which has been waiting above. By the hand 26a, for example, every 12 chase is chucked every 1 chase and lifted upward. Then, the molded product storage mechanism 26 is moved to the storage position corresponding to the discharge jig 30, and the wire diodes 2 are released in the chuck for each chase and sequentially aligned and stored in the discharge jig 30. When one chase is stored, the storage hand 26a becomes 9
The operation of rotating by 0 degree and accommodating one chase of the wire diode 2 in the next ejection jig 30 is repeated. The discharge jig 30 containing the wire diode 2 is sequentially discharged out of the apparatus, and the next discharge jig 30 moves to the storage position. Then, the empty discharge jigs 30 are sequentially supplied, and the plurality of discharge jigs 30 sequentially move around and move to the wire diode 2.
Collect. The wire diode 2 collected and collected in the discharge jig 30 is subjected to deburring of a resin portion by a blast device.

Next, the configuration of each part of the molded product take-out section will be described in more detail. First, the gate break mechanism 24 includes an upper pressing mechanism 31 (see FIGS. 2 to 5) that can move toward and away from the molded product from above, and a lower pressing mechanism 32 (see FIG. 6 to 8).

First, referring to FIG. 2 to FIG.
1 will be described. The upper pressing mechanism 31 is shown in FIG.
Are mounted on an unloader 16 which can move between a molding position C and a molded product take-out position D shown in FIG. 4 and 5, reference numeral 33 denotes a base frame, which is provided on the lower surface side of the unloader 16 shown in FIG. A vertically moving cylinder 34 is attached to the lower center of the base frame 33. The tip of the cylinder rod of the vertically moving cylinder 34 is connected to a support plate 35 supported substantially parallel to the base frame 33. A coil spring 34a is attached to the tip of the cylinder rod (see FIG. 2) to synchronize the loading frame with the hand at the time of mold ejection. The upper ends of the guide rods 36 are fixed to both sides in the longitudinal direction of the base frame 33, and the lower ends of the guide rods 36 pass through the support plate 35. As shown in FIG. 4, the guide rods 36 are provided at four positions, and guide the vertical movement of the support plate 35. On the upper surface of the base frame 33, chuck cylinders 37, 37 are provided on both sides, and the tip ends of these cylinder rods are the hands 16a, 16a of the unloader 16.
Are respectively connected to arms 38, 38 that open and close.

In FIGS. 2 and 5, upper ends of a plurality of holding rods 39 are fixed to the lower surface side of the support plate 35, and the lower ends of the holding rods 39 are not located at positions facing the unnecessary resin. A cull holding block 40 as a resin holding member is connected. A coil spring 41 is inserted around the holding rod 39 and between the support plate 35 and the cull holding block 40, and presses the cull holding block 40 when the support plate 35 moves down. On the lower surface side of the cull holding block 40, a holding pin 40a is provided at a position facing the molded cull 56 (see FIG. 11) in the unnecessary resin. The holding pin 40a is stopped from falling and is provided so as to protrude from the lower surface of the cull holding block 40 by its own weight. Therefore,
When the support plate 35 moves down, the cull holding block 40 also moves, and the holding pin 40a presses the molded cull 56 by its own weight.

On the lower surface of the support plate 35, a mounting plate 58 is supported via a rod 57 along the longitudinal direction of the wire diode 2. This mounting plate 5
8, a mounting block 42 having a step on the lower surface in a direction orthogonal to the longitudinal direction is provided corresponding to each cavity, and the step of the mounting block 42 serves as an abutting member. Butt rods 43a, 4
3b is fixed by screwing. The abutment rods 43a and 43b are provided over the alignment range of the wire diodes 2 mounted on the loading frame 4, as shown in FIG. As shown in FIG. 3, when the wire diode 2 is pushed up from below the loading frame 4 by the lower pressing mechanism 32, the wire diode 2 rotates with one end as a reference, and the resin sealing portion 2 a and the lead are formed. Butting rods 43a and 43b
Are supported with a step so as to abut at the same time.

On the lower surface of the support plate 35, upper ends of a plurality of guide rods 44 are fixed.
When the support plate 35 moves down, the lower end of the lower end abuts against the upper surface of the loading frame 4 to regulate the lowering position of the striking rods 43a and 43b.
The movement range of the support plate 35 is detected by a sensor 35a provided on the support plate 35, and abutting hands 35b, 35b are vertically provided on both sides of the support plate 35. The striking hands 35b, 35b strike the loading frame 4 when the support plate 35 moves down to reach the lowermost position, and the striking rod 35b takes into account the turning operation of the wire diode 2 at the time of gate break. The movement range is regulated so that a predetermined clearance is secured between the wire diodes 43a and 43b.

Next, the structure of the lower pressing mechanism 32 will be described.
This will be described with reference to FIGS. The lower pressing mechanism 32
It is provided below the molded product take-out position D shown in FIG. In FIG. 8, reference numeral 45 denotes a base plate, and U-shaped support bases 46, 46 are provided above the base plate 45.
Are screwed on both sides, and a support plate 47 is screwed on the support bases 46 and 46 and is supported substantially horizontally. A vertically moving cylinder 48 is fixed on the support plate 47, and the tip of the cylinder rod is connected to a horizontally movable plate 49. At the position corresponding to the resin sealing portion of the wire diode 2 on the horizontal movable plate 49, the standing piece 50 is
A positioning plate 51 as a positioning member and a push-up plate 52 as a push-up member are screwed and attached to both sides of the upright piece 50. As shown in FIG. 7, guide rods 59, 59 are attached to lower portions on both sides of the horizontal movable plate 49 by passing through the support plate, and guide the vertical movement of the horizontal movable plate 49.

The positioning plate 51 is for positioning the wire diode 2 so as to prevent the wire frame 2 from being displaced on the loading frame 4. As shown in FIG. It is formed in a tooth shape. The positioning plate 5
As shown in FIG. 6, 1 is provided corresponding to a lead portion near a resin sealing portion of the wire diode 2. The push-up plate 52 presses the molded product runner 60 (see FIG. 11) among the unnecessary resin to cause a gate break, and as shown in FIG.
The projections are formed at a pitch wider than the pitch of the unevenness 1 and the height of the projections is also low. As shown in FIGS. 3 and 6, the push-up plate 52 is provided corresponding to the molding runner 60 on the opposite side of the positioning plate 51 via the resin sealing portion 2a of the wire diode 2.

As shown in FIG. 8, both sides of the horizontal movable plate 49 are supported by support portions 53a, 53a fixed to the upper ends of the guide rods 53, 53, and stoppers are provided at the lower ends of the guide rods 53, 53. 53b, 53b are provided. When the vertical moving cylinder 48 is operated to move the horizontal movable plate 49 upward, stoppers 53b, 53b provided at the lower ends of the guide rods 53, 53 are used.
Abuts against the rod guide 54 to regulate the upward movement position.

The gate break operation by the gate break mechanism 24 will be described. As shown in FIG.
When the vertical movement cylinder 34 of the upper pressing mechanism 31 is operated to lower the support plate 35 with respect to the loading frame 4 chucked by the hand 16a of the unloader 16 and transferred to the molded product removal position D, the pressing rod 3
The cull holding block 40 connected via 9 also moves down, and the holding pin 40a abuts on the cull and holds it down.
The cull holding block 40 includes a butting rod 43.
The operation is stopped in a state where a predetermined clearance is secured between the a and 43b and the wire diode 2.

Next, the vertically moving cylinder 4 of the lower pressing mechanism 32
8, the horizontal movable plate 49 is moved upward, and as shown in FIG. 3, the positioning plate 51 and the push-up plate 52 enter from both sides of the resin sealing portion of the wire diode 2 positioned on the loading frame 4. . At this time, the wire diode 2 is rotated counterclockwise around the wire guide 4f as a fulcrum, with the convex portion of the positioning plate 51 entering between the leads and guiding the lead portion 2b by the concave portion. That is, the butting rod 43b first strikes the lead portion 2b to rotate the wire diode 2 in the counterclockwise direction, and then the resin sealing portion 2a is tilted so as to strike the butting rod 43a. In addition, the unnecessary resin is removed from the push-up plate 52.
Of the resin sealing portion 2
The molded product runner 60 is rotated in the opposite direction (clockwise) so as to relatively approach the molded product gate with respect to a. Resin sealing portion 2a of wire diode 2
By rotating the runner 60 and the runner 60 of the unnecessary resin relatively in the opposite direction, stress can be concentrated on the tip of the gate of the cast, and the gate break can be performed smoothly. After the gate break, the vertical movement cylinder 48 is moved downward to move the positioning plate 51 and the push-up plate 52.
Is retracted below the loading frame 4 and the vertical cylinder 34 is moved upward to retract the cull holding block 40 above the loading frame 4 to complete the gate break.

Next, the configuration of the unnecessary resin separating mechanism 25 will be described with reference to FIGS. As shown in FIG. 9A, after the gate of the molded product is broken, the loading frame 4 is transported from the molded product removal position D to the unnecessary resin collecting position E by the second belt transport device 8b. FIG.
As shown in (b), at the unnecessary resin collecting position E, an unnecessary resin chuck portion 55 for chucking only the unnecessary resin is provided above the loading frame 4, and below the loading frame 4, A chute 27 for collecting unnecessary resin is provided. The above shoot 27
A conveyer 28 for conveying unnecessary resin is provided at the lower part of the box, and the unnecessary resin dropped via the chute 27 is placed on the conveyor 28 and conveyed to a scrap box 29 for storage.

The configuration of the unnecessary resin chuck portion 55 will be described with reference to FIGS. Note that FIG.
Moves the unnecessary resin chuck portion 55 shown in FIG.
It is the elements on larger scale which looked at from the direction. Reference numeral 55a denotes a base plate, on which a vertically moving cylinder (air cylinder) 55b is fixed. The tip of the cylinder rod of the vertically moving cylinder 55b is connected to the support plate 55c. In addition, the base plate 5
Guide rods 55i, 55i are inserted into both sides of 5a, and the lower ends thereof are connected to the support plate 55c.

On the support plate 55c, chuck hands 55d are vertically provided at six positions corresponding to the unnecessary resin placed on the loading frame 4. The chuck hand 55d is configured to open and close the hand by a chuck cylinder (air cylinder) 55e supported by the support plate 55c. As shown in FIG. 11, the chuck hand 55d is configured to chuck the molded product cull 56 of the unnecessary resin from both sides. The chuck hands 55d are connected with a horizontal connecting plate 55f at predetermined intervals in the horizontal direction, and are connected to the horizontal connecting plate 55f and the support plate 55c by a rod 55g. Positioning blocks 55h are provided vertically on both ends of the support plate 55c. When the vertical movement cylinder 55b operates and the support plate 55c moves downward, the positioning block 55h is engaged with the loading frame 4 so that the chuck hands 55d are positioned on both sides of the unnecessary resin molded product cull 56. Stop.

The unnecessary resin separation / collection operation of the unnecessary resin separation mechanism 25 will be described. After the gate break of the molded product, the loading frame 4 is moved to the second belt conveying device 8b.
As a result, the molded product is transported from the removal position D to the unnecessary resin collection position E. First, the vertical movement cylinder 55b of the unnecessary resin chuck portion 55 is operated to lower the support plate 55c, and the butting hand 55h engages with the loading frame 4 and stops. At this time, each chuck hand 55d is arranged on both sides of the molded product cull 56. Next, each of the chuck cylinders 55e is operated to operate the chuck hand 55d.
The molded product culls 56 are chucked.

Next, the vertically moving cylinder 55b is operated to move the support plate 55c upward, so that the molded product gate after the gate break and the wire diode 2 are securely separated, and the molded product cull 56 is moved by the chuck hand 55d. Retract upward while holding the chuck. Then, the loading frame 4 on which only the wire diodes 2 are placed is transported from the unnecessary resin collecting position E to the molded product storage position F by the third belt transport device 8c shown in FIG. At this time, the opening of the chute 27 is exposed below the unnecessary resin collecting position E.

Next, the chuck cylinder 55e is operated to release the chuck of the molded product cull 56 by the chuck hand 55d and the unnecessary resin is dropped into the chute 27. The unnecessary resin that has dropped onto the hopper 56 is shown in FIG.
As shown in (a), it is conveyed to a scrap box 29 by a conveyor 28 and collected.

(Circumferential Moving Operation of Loading Frame) Next, the circular moving operation of the loading frame in the loading frame circular moving mechanism 5 will be described with reference to FIG. A plurality of loading frames 4 are set in the loading frame revolving mechanism 5, and the revolving operation of any one of the loading frames 4 will be described.

The loading frame 4 waiting at the standby position I operates the fifth belt drive motor 10e, and
The article is conveyed to the molded article supply position A by the belt conveying device 8e. At the molded article supply position A, the wire diode 2 held by the rack 17 transferred from the magazine 18 of the wire supply mechanism 6 to the rack holder 20 is chucked by the slide chuck 21 for each rack, and the stacking plate 4c. It is placed on the upper support parts 4a, 4b. In the present embodiment, since the die is a 12-piece mold, the supply operation for 12 racks is performed, and the supply operation of the wire diode 2 to the loading frame 4 is completed.

When the supply of the wire diode 2 is completed, the first belt driving motor 10a is operated, and the loading frame 4 is transported from the workpiece supply position A to the chuck position B by the first belt transport device 8a. At the chuck position B, the loading frame 4 is chucked by the hand of the inloader 15 and is carried into the molding position C on the mold 1 in the mold open state.
Then, the resin is preheated by high-frequency preheating attached to the equipment, and the resin is charged into a mold. The wire diode 2 is carried on the lower mold while being placed on the loading frame 4, and the lower mold is moved upward to close the mold. Then, the molten resin is injected into the cavity by the plunger to perform resin molding. In performing the resin molding process, the fifth loading unit 8e is operated to transport the next loading frame 4 to the molded article supply position A, and the wire rod supply mechanism 6 supplies the wire diodes 2. Will be

When the resin molding is completed, the lower mold is moved downward to open the mold, and the unloader 16 waiting at the molded article take-out position D moves onto the lower mold 1 to move the hand 16a.
To chuck the loading frame 4. Then, while holding the loading frame 4, the loading frame 4 is conveyed again to the molded product removal position D,
The chuck is released and the delivery is performed to the second belt transport device 8b. The cleaning device 16b provided in the unloader 16 collects and removes unnecessary resin and dust when entering the mold.

Next, at the molded product take-out position D, gate break is performed by the gate breaking mechanism 24 to separate the molded product from the unnecessary resin. Then, the second belt drive motor 10b is operated, and the loading frame 4 is moved. Second
It is transported to the unnecessary resin collecting position E while being placed on the belt 9 of the belt transport device 8b. At the unnecessary resin collecting position E, the third belt drive motor 10c is held in a state where only the unnecessary resin on which the cull, runner, and gate placed on the loading frame 4 are integrated is chucked and held by the unnecessary resin separating mechanism 25. Is operated, and the loading frame 4 is transported to the molded article storage position F while being placed on the belt 9 of the third belt transport device 8c. The unnecessary resin chucked by the chuck hand 55d (see FIG. 10) of the unnecessary resin separation mechanism 25 is released from the chuck after the movement of the loading frame 4, and is transferred to the conveyor 28 via the chute 27 (see FIG. 9). It is placed, transported, and collected in the scrap box 29. At this time, the next loading frame 4 on which the molded product is placed is inserted into the unloader 1
6, the molded product is taken out to the take-out position D, and the gate is broken in the same manner. After the gate break, the second belt conveying device 8 b conveys to the unnecessary resin collecting position E to perform the same unnecessary resin collecting operation.

The loading frame 4 conveyed to the molded product storage position F is stored in the storage hand 26 of the molded product storage mechanism 26.
As a result, the wire diode 2 is chucked by one chute, and is sequentially discharged to the discharge jig 30 for each chase. When the collection of all the wire diodes 2 placed on the loading frame 4 is completed, the emptying loading frame 4 is moved to the elevating position G by the moving cylinder 14, and the delivery to the elevator mechanism 12 is performed. . Further, the next loading frame 4 on which the wire diode 2 after the gate break is placed is transported to the molded product storage position F.

The elevator mechanism 1 waiting at the upper part of the apparatus
The loading frame 4 placed on the second elevation table is moved down the elevation table and transferred to a fourth belt transport device 8d provided at the bottom of the device. Then, by operating the fourth belt drive motor 10d, the loading frame 4 placed on the belt 9 of the fourth belt transport device 8d is transported to the elevating position H, and is delivered to the elevator mechanism 11.

Elevator mechanism 1 waiting at the bottom of the device
The loading frame 4 placed on the first elevation table is raised by the elevation table, moved to the standby position I by the moving cylinder 13, and received by the fifth belt transport device 8e provided at the upper part of the device. Passed. Then, after waiting for the supply order by the wire supply mechanism 6, the fifth belt drive motor 10e is operated to be conveyed again to the molded article supply position A by the fifth belt conveyance device 8e, and the same revolving movement operation is repeated.

The orbiting path of the loading frame 4 may be orbited on the same plane. However, as in this embodiment, the work is performed by using the bottom of the apparatus as a moving space via the elevator mechanisms 11 and 12. The space can be used effectively.

According to the above configuration, the unnecessary diode (molded runner) is pushed up while the wire diode 2 is automatically rotated by the gate breaking mechanism 24 without using a manual operation or a jig, so that the wire diode 2 is formed. By rotating the gate, the stress is concentrated on the molded product gate, and the gate break of a plurality of wires used as the molded product can be performed labor-saving and smoothly. In addition, the height of the mold 1 can be reduced as compared with the gate break in the mold, which contributes to downsizing of the apparatus, and the handling of loading / unloading operation of the wire placed on the loading frame 4 to / from the mold 1. Therefore, automation of the resin molding process can be promoted. Further, after the gate break, the molded resin and the unnecessary resin can be separated by the unnecessary resin collecting mechanism 25 and only the unnecessary resin can be automatically collected. Therefore, since a series of operations of gate break, collection of unnecessary resin, and collection of a molded product can be performed automatically, it is possible to contribute to speeding up a resin molding process and shortening a machine cycle.

When a loading frame revolving moving mechanism 5 equipped with a plurality of loading frames 4 is provided, the loading frame 4 is moved from the supply side of the molding product through the mold and the take-out side of the molding product. A series of operations, such as aligning and placing the molded articles, resin molding, gate break and collecting unnecessary resin, and storing molded articles, can be performed while moving around the supply side at a predetermined cycle. Labor can be saved and work efficiency can be improved.

The present invention is not limited to the above embodiment. For example, although a wire diode is used as a molded product, the present invention can be applied to electronic parts of other linear materials. Of course, many more modifications can be made without departing from the spirit.

[0054]

As described above, according to the present invention, the molding member is formed by moving the positioning member and the push-up member of the lower pressing mechanism upward while holding down the unnecessary resin of the molded product by the upper pressing mechanism of the gate break mechanism. By positioning the wire as a reference material and rotating it on one end side and pushing up the unnecessary resin (molded product runner), the molded product is rotated to concentrate stress on the molded product gate and perform a gate break smoothly. be able to. Therefore, the gate break of a plurality of wires as a molded product can be performed with reduced labor without using a manual operation or a jig as in the related art. In addition, since the height of the mold can be reduced compared to the gate break in the mold, it can contribute to downsizing of the device,
Since the handling of the loading / unloading operation of the wire placed on the loading member to the mold is improved, the automation of the resin molding process can be promoted. In addition, after the gate break, the molded resin and the unnecessary resin can be separated by the unnecessary resin collecting mechanism, and only the unnecessary resin can be automatically collected. Therefore, since a series of operations of gate break, collection of unnecessary resin, and collection of a molded product can be performed automatically, it is possible to contribute to speeding up a resin molding process and shortening a machine cycle. In the case where a loading frame revolving movement mechanism equipped with a plurality of loading frames is provided, the loading frame is transferred from the supply side of the molded article to the supply side of the molded article through the mold and the removal side of the molded article at a predetermined cycle. During the orbital movement, a series of operations such as aligning and placing of molded products, resin molding, gate break and collecting unnecessary resin, storing of molded products, etc. can be performed automatically. Work efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a top view showing the overall configuration of a resin molding device.

FIG. 2 is a front view of a gate break mechanism.

FIG. 3 is a partially enlarged explanatory view of a gate break mechanism.

FIG. 4 is a top view of the upper pressing mechanism of the gate break mechanism.

FIG. 5 is a front view of an upper pressing mechanism of the gate break mechanism.

FIG. 6 is a top view of the lower pressing mechanism of the gate break mechanism.

FIG. 7 is a side view of the lower pressing mechanism in FIG. 6 in the Y direction.

FIG. 8 is a side view in the X direction of the lower pressing mechanism of FIG. 6;

FIG. 9 is a top view and a front view showing the entire configuration of a molded product take-out section.

FIG. 10 is an explanatory diagram illustrating a configuration of an unnecessary resin collecting unit.

FIG. 11 is a partially enlarged explanatory view of an unnecessary resin collecting unit in FIG. 10;

[Explanation of symbols]

A Molded article supply position B Chuck position C Molding position D Molded article take-out position E Unnecessary resin collecting position F Molded article storage position G, H Elevating position I Stand-by position 1 Mold die 2 Wire diode 3 Tablet holder 4 Loading frame 4a, Reference numeral 4b Support portion 4c Loading plate 4d Base plate 4e, 4f Wire guide 5 Loading frame orbital moving mechanism 6 Wire rod supply mechanism 7 Molded product take-out section 8a, 8b, 8c, 8d, 8e Belt transport device 9 Belt 10a, 10b, 10c, 10d , 10e Belt drive motor 11, 12 Elevator mechanism 13, 14 Moving cylinder 15 In loader 16 Unloader 16a Hand 16b Cleaning device 17 Rack 18 Magazine 19 Magazine supply / discharge mechanism 20 Rack holder 21 Slide chuck 2 Conveyor belt 23 Dummy wire supply device 24 Gate break mechanism 25 Unnecessary resin recovery mechanism 26 Molded product storage mechanism 26a Storage hand 27 Chute 28 Conveyor 29 Scrap box 30 Discharge jig 31 Upper pressing mechanism 32 Lower pressing mechanism 33 Base frame 34, 48 , 55b Vertically moving cylinders 35, 47, 55c Support plates 34a, 41 Coil springs 35a Sensors 36, 44, 53, 55i, 59 Guide rods 37 Chuck cylinders 38 Arms 39 Holding rods 40 Cal holding blocks 40a Holding pins 42 Mounting blocks 43a, 43b Butt rod 45, 55a Base plate 46 Support table 49 Horizontal movable plate 50 Standing piece 51 Positioning plate 52 Push-up plate 53a Support portion 53b Topper 54 Rod guide 55 Unnecessary resin chuck portion 55d Chuck hand 55e Chuck cylinder 55f Horizontal connecting plate 55g Rod 55h Positioning block 56 Molded product cull 57 Rod 58 Mounting plate 60 Molded product runner

Claims (6)

[Claims] 1. A mold for placing a molded article and performing resin molding, a tablet supply means for supplying a resin tablet to the mold, a loading member for aligning and placing the molded article, A moving mechanism for moving the loading member from the molded article supply side to the molded article discharge side via the mold, and aligning and supplying the molded article to the loading member located on the molded article supply side; A molded article supply means; and a molded article take-out means for separating and removing a molded article from unnecessary resin from the loading member discharged to the molded article discharge side; and wherein the molded article take-out means is a molded article from the loading member. A gate break mechanism for gate breaking, and an unnecessary resin recovery mechanism for separating and recovering the unnecessary resin from the molded product after the gate break. Resin molding apparatus according to claim and. 2. The molding method according to claim 1, wherein the gate breaking mechanism includes: an unnecessary resin pressing member that contacts and presses the unnecessary resin; and an abutting member that can contact the molded product when the molded product is pushed up. Molding comprising: an upper pressing means capable of moving toward and away from the article; a positioning member for positioning the molded article on the loading member to prevent displacement; and a push-up member for pushing up unnecessary resin to cause a gate break. The resin molding apparatus according to claim 1, further comprising: a lower pressing means that can move toward and away from the article. 3. The gate breaking mechanism presses an unnecessary resin from an upper side by an unnecessary resin pressing member of an upper pressing means, rotates the molded product while positioning the molded product by a positioning member of the lower pressing means, and uses a push-up member to rotate the molded product. Pushing up the resin, rotating the molded product so as to rotate in the opposite direction so that the unnecessary resin and the resin sealing portion are relatively close to each other, and performing a gate break to separate the unnecessary resin and the molded product. The resin molding apparatus according to claim 2, wherein: 4. The unnecessary resin collecting mechanism chucks and lifts the unnecessary resin after the gate break, moves the loading member on which the molded product is placed, releases the chuck, and transfers the unnecessary resin to the unnecessary resin collecting unit. The resin molding apparatus according to claim 1, wherein the resin molding apparatus recovers the resin. 5. The molded product taking-out means comprises a molded product storage mechanism for holding and storing a molded product from a loading member after collecting the unnecessary resin. Item 5. The resin molding device according to Item 4. 6. A loading frame is used as the loading member, and the moving mechanism moves the loading frame arranged on the molded article supply side to the molded article supply side again via the mold and the molded article discharge side. 2. A revolving movement mechanism for reciprocating movement.
A resin molding apparatus comprising a gate break mechanism for a molded product according to claim 2, 3, 4, or 5.