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JPH1052753A - Joined body between al metal and dissimilar material, and its manufacture - Google Patents

Joined body between al metal and dissimilar material, and its manufacture

Info

Publication number
JPH1052753A
JPH1052753A JP12306597A JP12306597A JPH1052753A JP H1052753 A JPH1052753 A JP H1052753A JP 12306597 A JP12306597 A JP 12306597A JP 12306597 A JP12306597 A JP 12306597A JP H1052753 A JPH1052753 A JP H1052753A
Authority
JP
Japan
Prior art keywords
layer
based metal
joined
metal
joined body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12306597A
Other languages
Japanese (ja)
Inventor
Hiroki Fujimoto
広樹 藤本
Masaya Ito
正也 伊藤
Tomoo Tanaka
智雄 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP12306597A priority Critical patent/JPH1052753A/en
Publication of JPH1052753A publication Critical patent/JPH1052753A/en
Pending legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a joined body and its method joining a dissimilar material of a metal or ceramic or the like to an Al metal with high strength and moreover capable of manufacturing at a low cost. SOLUTION: A brazing filler metal foil or brazing filler metal plate having a higher melting point than an Al metal body to be joined is inserted between the dissimilar material body to be joined and Ti metal plate to execute a brazing process. Next, another brazing filler metal foil or brazing filler metal plate having a lower melting point than the Al metal body to be joined is inserted between the Ti metal plate and the Al metal body to be joined to braze both. By this way, the joined body, wherein the dissimilar material body to be joined and the Ti metal plate are mutually joined via the brazing filler metal layer, Ti metal plate and another brazing filler metal layer, is obtained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明が属する技術分野】本発明は、Al系金属と異種
材料との接合体及び接合方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joined body of an Al-based metal and a dissimilar material and a joining method.

【0002】[0002]

【従来の技術】AlあるいはAl合金等のAl系金属は
耐食性に優れて熱伝導性が高く、しかも軽量である利点
を有していることから種々の分野で利用が進んでいる。
この場合、Al系金属同士を接合したり、Al系金属部
材とAl以外を主成分とする異種金属部材とを接合して
複合化することも行われている。このようなAl系金属
部材と異種金属部材との接合体としては、Al系の低融
点ろう材を用いて接合したものが知られている。また、
そのような低融点ろう材としては、2成分系ろう材とし
てAl−Si系(例えばJISBA4045)、3成分
系のろう材としてAl−Cu−Si系(例えばJISB
A4145)、Al−Si−Ge系及びAl−Si−M
g系等が使用されている。
2. Description of the Related Art Al-based metals such as Al and Al alloys have advantages of being excellent in corrosion resistance, high thermal conductivity, and being lightweight, and thus have been used in various fields.
In this case, Al-based metals are joined to each other, or an Al-based metal member and a dissimilar metal member mainly containing other than Al are joined to form a composite. As such a joined body of an Al-based metal member and a dissimilar metal member, a joined body using an Al-based low melting point brazing material is known. Also,
As such a low-melting brazing material, Al-Si-based (for example, JISBA4045) as a two-component brazing material, and Al-Cu-Si-based (for example, JISB) as a three-component brazing material.
A4145), Al-Si-Ge system and Al-Si-M
A g-type or the like is used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上述し
た接合体のうち、異種金属部材中にFe、Ni及びCo
の一種以上が含有されていると、接合の際にこれがAl
系金属部材中のAl成分と反応して脆弱な金属間化合物
が形成され、接合強度が低下する問題がある。一方、A
l系金属部材に対しては、金属部材のみでなくセラミッ
ク部材を接合する要望も高まっている。この場合、接合
に使用するろう材としては、セラミックとの反応性に優
れたTi等の活性金属を含有する例えば貴金属ベースの
ろう材を使用するのが本来望ましいのであるが、Al系
金属は低融点であるためそれらのろう材は使用できない
ので、止むなく前述のAl系低融点ろう材が用いられて
いた。しかしながら、該Al系低融点ろう材はセラミッ
クとの反応性が悪く、結局は十分な接合強度が達成でき
ない問題がある。また、接合に先立って、セラミック部
材の被接合面に対し蒸着やスパッタ等によりメタライズ
層を形成してから接合を行う方法もあるが、この場合は
蒸着装置やスパッタ装置等の特殊な処理装置が必要とな
り、また工数も増大して製造コストの高騰を招く欠点が
ある。
However, among the above-mentioned joined bodies, Fe, Ni and Co are contained in the dissimilar metal members.
If one or more of
There is a problem that a brittle intermetallic compound is formed by reacting with the Al component in the system metal member, and the bonding strength is reduced. On the other hand, A
There has been a growing demand for not only metal members but also ceramic members to be bonded to l-system metal members. In this case, as a brazing material used for joining, it is originally desirable to use, for example, a noble metal-based brazing material containing an active metal such as Ti, which has excellent reactivity with ceramics. Since these brazing materials cannot be used because of their melting points, the aforementioned Al-based low-melting brazing materials have been used without fail. However, the Al-based low melting point brazing material has poor reactivity with ceramics, and eventually has a problem that sufficient bonding strength cannot be achieved. Prior to joining, there is also a method in which a metallized layer is formed on the surface to be joined of the ceramic member by vapor deposition, sputtering, or the like, and then the joining is performed. In this case, a special processing apparatus such as a vapor deposition apparatus or a sputtering apparatus is used. However, there is a disadvantage that the number of steps is increased and the manufacturing cost is increased.

【0004】本発明の課題は、Al系金属に対し金属あ
るいはセラミック等の異種材料が高強度で接合されてし
かも安価に製造できる接合体と、そのための接合方法と
を提供することにある。
An object of the present invention is to provide a joined body in which a different material such as metal or ceramic is joined to an Al-based metal with high strength and which can be manufactured at low cost, and a joining method therefor.

【0005】[0005]

【課題を解決するための手段及び作用・効果】上述の課
題を解決するために本発明の接合体の第一の構成は、A
lを主体に構成されたAl系金属被接合体と、Fe,N
i及びCoの1種以上を主成分とする金属からなる異種
材料被接合体とが金属系接合層を介して互いに接合され
るとともに、金属系接合層が、Al系金属被接合体中の
Al成分と、異種材料被接合体中のFe,Ni及びCo
成分の1種以上とが、それらAl系金属被接合体と異種
材料被接合体との間での成分拡散に基づき反応すること
を抑制する拡散バリア層を含むことを特徴とする。
Means for Solving the Problems and Action / Effects In order to solve the above-mentioned problems, the first structure of the joined body of the present invention is as follows.
Al-based metal joined body mainly composed of
A dissimilar material bonded body made of a metal containing at least one of i and Co as a main component is bonded to each other via a metal-based bonding layer, and the metal-based bonding layer is formed of Al in the Al-based metal bonded body. And Fe, Ni and Co in the dissimilar material joined body
One or more of the components include a diffusion barrier layer that suppresses a reaction based on component diffusion between the Al-based metal bonded body and the dissimilar material bonded body.

【0006】Alを主体とするAl系金属被接合体と、
Fe,Ni,Coの一種以上を含む金属からなる異種材
料被接合体との接合体においては、その接合の際に、A
lとFe,Ni,Coとが拡散し合い、その接合界面に
脆弱なAl−Fe系、Al−Ni系あるいはAl−Co
系といった脆弱な金属間化合物が形成されるので、接合
強度は低い。しかし、上記本発明の第一の構成に係る接
合体においては、その金属系接合層に拡散バリア層が含
まれており、この拡散バリア層がAlとFe、Niない
しCoとの拡散及びそれによる反応を妨げるので上記脆
弱な金属間化合物の生成が抑制され、ひいては高強度の
接合体を得ることができる。
An Al-based metal joined body mainly composed of Al;
In a joined body with a dissimilar material joined body made of a metal containing at least one of Fe, Ni, and Co, A
1 and Fe, Ni, Co diffuse into each other, and the fragile Al-Fe, Al-Ni, or Al-Co
Since a brittle intermetallic compound such as a system is formed, the bonding strength is low. However, in the bonded body according to the first configuration of the present invention, the metal-based bonding layer includes a diffusion barrier layer, and the diffusion barrier layer diffuses Al and Fe, Ni or Co, and the diffusion barrier layer includes the diffusion barrier layer. Since the reaction is hindered, the formation of the fragile intermetallic compound is suppressed, and a high-strength joined body can be obtained.

【0007】また、上記第一の構成の接合体を得るため
の本発明の接合方法は、下記の工程を含むことを特徴と
する。 拡散バリア用金属層形成工程:異種材料被接合体の接
合面に対し、Al系金属被接合体中のAl成分と、異種
材料被接合体中のFe,Ni及びCo成分の1種以上と
が、それらAl系金属被接合体と異種材料被接合体との
間での双方向ないし一方向の成分拡散に基づき反応する
ことを抑制するための拡散バリア層となるべき拡散バリ
ア用金属層を形成する。 接合工程:その形成された拡散バリア用金属層に対
し、Al系金属被接合体を、異種材料被接合体とは反対
側から直接又は他層を介して間接的に接合する。
[0007] A joining method of the present invention for obtaining the joined body having the first configuration is characterized by including the following steps. Diffusion barrier metal layer forming step: The Al component in the Al-based metal bonded object and one or more of the Fe, Ni, and Co components in the heterogeneous material bonded object are bonded to the bonding surface of the different material bonded object. Forming a diffusion barrier metal layer to be a diffusion barrier layer for suppressing a reaction based on bidirectional or one-way component diffusion between the Al-based metal bonded body and the dissimilar material bonded body. I do. Bonding step: The Al-based metal bonded body is bonded to the formed diffusion barrier metal layer directly or indirectly via another layer from the side opposite to the heterogeneous material bonded body.

【0008】これにより、上記本発明の第一の構成に係
る接合体を能率的に製造することが可能となる。ここ
で、上記方法においては拡散バリア用金属層は、接合後
において拡散バリア層となる。
Thus, it is possible to efficiently manufacture the joined body according to the first configuration of the present invention. Here, in the above method, the diffusion barrier metal layer becomes a diffusion barrier layer after bonding.

【0009】なお、拡散バリア用金属層は、例えば蒸着
法、蒸着、スパッタ等の気相成膜法や、化学メッキ等に
より形成することができる。また、所定の組成の金属か
らなる金属板を異種材料被接合体の接合面にろう付けに
より接合して形成することもできる。一方、拡散バリア
用金属層に対するAl系金属被接合体の接合方法として
は例えばろう付を採用できる。この場合、接合に用いる
ろう材としては各種Al合金ろうを使用することがで
き、例えばAl−Si系(JIS:BA4343、BA
4045等)、Al−Cu−Si系(JIS:BA41
45等)、Al−Cu−Mg系(JIS:BA400
3、BA4004、BA4005、BA4N04等)、
さらにはAl−Mg系、Al−Si−Ge系、Al−S
i−Mg系、Al−Si−Cu−Zn系、Al−Ge−
Si−Cu−Mg系等のろう材を使用できる。なお、ろ
う付け接合に代えて、ろう材を使用しない拡散接合や摩
擦圧接、爆発圧接、抵抗溶接、ホットプレス等を採用し
てもよい。
The diffusion barrier metal layer can be formed by, for example, vapor deposition, vapor deposition such as sputtering, or chemical plating. In addition, a metal plate made of a metal having a predetermined composition can be formed by brazing to a bonding surface of a dissimilar material bonded body by brazing. On the other hand, as a method for joining the Al-based metal article to the diffusion barrier metal layer, for example, brazing can be adopted. In this case, various types of Al alloy brazing can be used as the brazing material used for joining, for example, Al-Si based (JIS: BA4343, BA
4045 etc.), Al-Cu-Si type (JIS: BA41)
45), an Al-Cu-Mg type (JIS: BA400)
3, BA4004, BA4005, BA4N04, etc.),
Further, Al-Mg, Al-Si-Ge, Al-S
i-Mg system, Al-Si-Cu-Zn system, Al-Ge-
A brazing material such as Si-Cu-Mg can be used. Note that, instead of brazing, diffusion bonding using no brazing material, friction welding, explosive welding, resistance welding, hot pressing, or the like may be employed.

【0010】上記本発明の第一の構成に係る接合体にお
いて、異種材料被接合体の材質としては、具体的には、
クロムモリブデン鋼、ステンレス鋼、Ni基耐熱合金
(例えば商標名:インコネル)、Fe−Ni−Co合金
(例えばコバール)、Fe−Ni合金(例えば42アロ
イ)、さらにはWC−Co、TiN−Co、WC−Ni
等の焼結金属等が挙げられる。
[0010] In the joined body according to the first configuration of the present invention, the material of the joined body of different materials may be, specifically,
Chromium molybdenum steel, stainless steel, Ni-base heat-resistant alloy (for example, brand name: Inconel), Fe-Ni-Co alloy (for example, Kovar), Fe-Ni alloy (for example, 42 alloy), WC-Co, TiN-Co, WC-Ni
And the like.

【0011】一方、Al系金属被接合体の材質として
は、純Al(不可避不純物を含む場合がある)あるいは
各種Al合金を使用することができる。具体的には、工
業用純Al(JIS:1050、1060、1080、
1100等)、鋳造用Al合金(JIS:AC1A、A
C1B、AC2A、AC2B、AC3A、AC4A、A
C4B、AC4C、AC4CH、AC4D、AC5A、
AC7A、AC7B、AC8A、AC8B、AC8C、
AC9A、AC9B等)、ダイキャスト用Al合金(J
IS:ADC1、ADC3、ADC5、ADC6、AD
C10、ADC12等)、Al−Cu−Mg系展伸用合
金(JIS:2014、2017、2024等)、Al
−Mn系展伸用合金(JIS:3003、3004
等)、Al−Si系展伸用合金(JIS:4032、4
043等)、Al−Mg系展伸用合金(JIS:500
5、5052、5083、5086等)、Al−Mg−
Si系展伸用合金(JIS:6061、6063等)、
Al−Zn−Mg−Cu系あるいはAl−Zn−Mg系
展伸用合金(JIS:7075、7N01等)、さらに
はAl−Li系合金等が例示できる。
On the other hand, as the material of the Al-based metal joined body, pure Al (which may contain unavoidable impurities) or various Al alloys can be used. Specifically, industrial pure Al (JIS: 1050, 1060, 1080,
1100 etc.), Al alloy for casting (JIS: AC1A, A
C1B, AC2A, AC2B, AC3A, AC4A, A
C4B, AC4C, AC4CH, AC4D, AC5A,
AC7A, AC7B, AC8A, AC8B, AC8C,
AC9A, AC9B, etc.), Al alloy for die casting (J
IS: ADC1, ADC3, ADC5, ADC6, AD
C10, ADC12, etc.), Al-Cu-Mg wrought alloy (JIS: 2014, 2017, 2024, etc.), Al
-Mn-based wrought alloy (JIS: 3003, 3004
Etc.), Al-Si based wrought alloys (JIS: 4032, 4
043 etc.), Al-Mg based wrought alloy (JIS: 500
5, 5052, 5083, 5086, etc.), Al-Mg-
Si-based wrought alloys (JIS: 6061, 6063, etc.),
Al-Zn-Mg-Cu-based or Al-Zn-Mg-based alloys for spreading (JIS: 7075, 7N01, etc.), and further, Al-Li-based alloys and the like can be exemplified.

【0012】また、Al系金属基質にAl23等のセラ
ミック粒子を分散させたAl系分散強化型複合材料、同
じくAl系金属基質をカーボン、SiC、Al23等に
よる前駆体系繊維、B/W、B4C/B/W、SiC/
B/W、SiC/C等のCVD系繊維、W、Mo、鋼等
の金属繊維、SiC、Si34、Al23、グラファイ
ト、チタン酸カリウム等のひげ結晶(ウィスカー)繊維
等の強化繊維体で強化した繊維強化型複合材料を使用す
ることもできる。
Also, an Al-based dispersion-reinforced composite material in which ceramic particles such as Al 2 O 3 are dispersed in an Al-based metal substrate, and a precursor fiber made of carbon, SiC, Al 2 O 3, etc. B / W, B 4 C / B / W, SiC /
B / W, CVD fibers such as SiC / C, metal fibers such as W, Mo, steel, whisker fibers such as SiC, Si 3 N 4 , Al 2 O 3 , graphite, potassium titanate, etc. A fiber-reinforced composite material reinforced with a reinforcing fiber body can also be used.

【0013】次に、拡散バリア層は、例えばTi,Pd
及びPtの少なくともいずれかを含有するものとして構
成できる。具体的には、拡散バリア層は、Tiを主成分
とする層、Pdを主成分とする層及びPtを主成分とす
る層のうち少なくとも一層からなるものとして構成する
ことができる。この場合、例えばTi,Pd,Ptの単
層のみでもよいが、それらの層を複数層組み合わせても
よい。例えばTi層とPd層、Ti層とPt層、Pd層
とPt層の2層や、Ti層とPd層とPt層の3層のよ
うに、異なる種類の層を積層してもよいし、例えばTi
層とPd層とTi層の3層や、Ti層とPd層とTi層
とPt層の4層(あるいははそれ以上の多層)など、同
種の層を複数層含ませて組み合わせてもよい。また、T
i,Pd,Ptに変えて、それらを主成分とする合金を
用いてもよい。
Next, the diffusion barrier layer is made of, for example, Ti, Pd.
And Pt. Specifically, the diffusion barrier layer can be configured as at least one of a layer mainly composed of Ti, a layer mainly composed of Pd, and a layer mainly composed of Pt. In this case, for example, only a single layer of Ti, Pd, and Pt may be used, or a plurality of these layers may be combined. For example, different types of layers may be stacked, such as a Ti layer and a Pd layer, a Ti layer and a Pt layer, a Pd layer and a Pt layer, or a Ti layer, a Pd layer, and a Pt layer. For example, Ti
A plurality of layers of the same type, such as three layers of a layer, a Pd layer, and a Ti layer, or four layers (or more layers) of a Ti layer, a Pd layer, a Ti layer, and a Pt layer may be included and combined. Also, T
Instead of i, Pd, and Pt, an alloy containing them as a main component may be used.

【0014】また、拡散バリア層は、Ti,Pd及びP
tの少なくともいずれかを主成分とするものとして構成
してもよい。この場合、拡散バリア層が、例えば2種又
は3種の異なる物質からなる合金層として存在してもよ
く、あるいは、2種又は3種以上の異なる物質からなる
混合層(例えばある物質の中に僅かに他の物質が混在し
ている層)として存在してもよい。いずれにしろ、T
i,Pd及びPtの少なくともいずれかを主成分とする
ものとして拡散バリア層を構成することにより、Al系
金属被接合体中のAl成分と、異種材料被接合体中のF
e,Ni及びCo成分の1種以上との拡散及びそれによ
る反応を効果的に抑制することが可能となる。
The diffusion barrier layer is made of Ti, Pd and P.
You may comprise as what has at least any one of t as a main component. In this case, the diffusion barrier layer may be present, for example, as an alloy layer of two or three different substances, or a mixed layer of two or more different substances (eg, (A layer in which other substances are slightly mixed). In any case, T
By forming the diffusion barrier layer containing at least one of i, Pd, and Pt as a main component, the Al component in the Al-based metal bonded body and the F component in the heterogenous bonded body are separated.
It becomes possible to effectively suppress the diffusion with one or more of the e, Ni and Co components and the reaction caused thereby.

【0015】なお、上記成分の拡散ないし反応抑制効果
は拡散バリア層の厚さが増大するに伴い高められ、それ
によって接合界面に前述の脆弱な金属間化合物が形成さ
れにくくなるので、接合体の強度はより高められる傾向
にある。この場合、拡散バリア層の厚さが2μm以上の
範囲において少なくとも、接合体の強度を必要十分な値
に確保することが可能となる。拡散バリア層の厚さは、
より望ましくは5μm以上とするのがよい。一方、拡散
バリア層の厚さが10μmを超えた場合は、それ以上の
バリア層の厚さ増大に伴う接合強度の向上はもはや期待
できなくなるので、拡散バリア層の厚さは10μm以下
の範囲で調整することが望ましいといえる。
[0015] The effect of suppressing the diffusion or reaction of the above components is enhanced as the thickness of the diffusion barrier layer is increased, whereby the above-mentioned fragile intermetallic compound is less likely to be formed at the joint interface. Strength tends to be higher. In this case, when the thickness of the diffusion barrier layer is 2 μm or more, at least the strength of the joined body can be secured to a necessary and sufficient value. The thickness of the diffusion barrier layer is
More preferably, the thickness is 5 μm or more. On the other hand, if the thickness of the diffusion barrier layer exceeds 10 μm, it is no longer possible to expect an increase in bonding strength with a further increase in the thickness of the barrier layer. Therefore, the thickness of the diffusion barrier layer is limited to a range of 10 μm or less. It can be said that adjustment is desirable.

【0016】なお、ここでいう拡散バリア層の厚さと
は、図1に示すように、Al系金属被接合体と異種材料
被接合体との間において、拡散バリア層の一方の側に隣
接している層をA層、他方の側に隣接している層をB層
とし、それらA層ないしB層との間で拡散を生じている
部分C及びDを除いた残余の部分の厚さをいう(従っ
て、当然ながら接合後の厚さである)。また、拡散バリ
ア層、その両側の拡散を生じている部分、Al系金属被
接合体及び異種材料被接合体は、公知の方法、例えば電
子プローブ・マイクロ・アナライザ(EPMA:あるい
はこれと走査電子顕微鏡観察像との組み合わせ)、エネ
ルギー分散型X線分析(EDX)、波長分散分光法(W
DS)、オージェ電子分光法(AES)等により識別で
き、それに基づいて拡散バリア層の厚みも容易に測定す
ることができる。
The thickness of the diffusion barrier layer referred to herein is, as shown in FIG. 1, between the Al-based metal bonded body and the dissimilar material bonded body on one side of the diffusion barrier layer. A layer is defined as an A layer, and a layer adjacent to the other side is defined as a B layer. The thickness of the remaining portion excluding the portions C and D which cause diffusion between the A layer and the B layer is defined as (Hence the thickness after joining, of course). In addition, the diffusion barrier layer, the portions where diffusion occurs on both sides thereof, the Al-based metal bonded body, and the foreign material bonded body can be formed by a known method, for example, an electron probe microanalyzer (EPMA: or a scanning electron microscope). Combination with observation image), energy dispersive X-ray analysis (EDX), wavelength dispersive spectroscopy (W
DS), Auger electron spectroscopy (AES), and the like, based on which the thickness of the diffusion barrier layer can be easily measured.

【0017】なお、上記第一の構成の接合体において
は、Al系金属被接合体と異種材料被接合体との間に、
熱残留応力を緩和する緩衝層を設けてもよい。この場
合、緩衝層は、Al系金属被接合体と拡散バリア層との
間及び拡散バリア層と異種材料被接合体との間の、少な
くともいずれかに配置することができる。
In the joined body having the first configuration, the Al-based metal joined body and the dissimilar material joined body are provided between
A buffer layer for reducing thermal residual stress may be provided. In this case, the buffer layer can be arranged at least between the Al-based metal bonded body and the diffusion barrier layer and between the diffusion barrier layer and the heterogenous bonded body.

【0018】次に、本発明の接合体の第二の構成は、A
lを主体に構成されたAl系金属被接合体と、それとは
異なる材質で構成された異種材料被接合体とが、金属系
接合層を介して互いに接合されるとともに、その金属系
接合層が、Ti又はTi合金で構成されてAl系金属被
接合体の側に配置されるTi系金属層と、そのTi系金
属層(例えばTi系金属板)と異種材料被接合体との間
に形成されてそれらを互いに接合するろう材層とを含む
ことを特徴とする。
Next, the second structure of the joined body of the present invention is as follows.
1 and a dissimilar material joined body made of a different material are joined to each other via a metal-based joining layer, and the metal-based joining layer is , A Ti-based metal layer composed of Ti or a Ti alloy and arranged on the Al-based metal bonded body side, and formed between the Ti-based metal layer (for example, a Ti-based metal plate) and a bonded body of a different material. And a brazing material layer for joining them to each other.

【0019】上記構成によれば、異種材料被接合体にろ
う接されたTi系金属層により、Al系金属被接合体と
該異種材料被接合体とを強固に接合することができる。
異種材料被接合体は、金属で構成されていてもセラミッ
クで構成されていてもいずれでもよい。例えば異種材料
が金属の場合、従来の接合体の構成では接合界面に脆弱
な金属間化合物が形成されて接含強度が確保できない場
合があったが、上述のようにAl系金属被接合体と異種
材料被接合体との間にTi系金属層をろう付により介在
させ、そのTi系金属層を介してそれらを接合すること
により、Al系金属と異種材料との反応を妨げることが
でき、ひいては上記金属間化合物の形成が抑えられた高
強度の接合体が実現する。また、異種材料がセラミック
の場合も、Ti系金属層とろう材層との介在により接合
強度が高められた接合体を得ることができる。
According to the above structure, the Al-based metal bonded body and the hetero-material bonded body can be firmly bonded by the Ti-based metal layer brazed to the heterogenous bonded body.
The dissimilar material joined body may be made of metal or ceramic. For example, when the dissimilar material is metal, in the structure of the conventional bonded body, a fragile intermetallic compound may be formed at the bonding interface and the bonding strength may not be secured. A reaction between the Al-based metal and the dissimilar material can be hindered by interposing the Ti-based metal layer between the dissimilar material joined body by brazing and joining them through the Ti-based metal layer, As a result, a high-strength joined body in which the formation of the intermetallic compound is suppressed is realized. Also, when the dissimilar material is ceramic, it is possible to obtain a joined body having enhanced joining strength due to the interposition of the Ti-based metal layer and the brazing material layer.

【0020】また、上述のような接合体を得るための本
発明の接合方法は、下記の工程を含むことを特徴とす
る。 ろう付け工程:異種材料被接合体の被接合面にTi系
金属層をろう材により予めろう付け接合する。 接合工程:そのろう付けされたTi系金属層に対しA
l系金属被接合体を、異種材料被接合体とは反対側から
直接又は他層を介して間接的に接合する。
Further, the joining method of the present invention for obtaining the above-mentioned joined body is characterized by including the following steps. Brazing step: A Ti-based metal layer is previously brazed and joined to a surface to be joined of a dissimilar material joined body with a brazing material. Joining step: A for the brazed Ti-based metal layer
The 1-based metal bonded body is bonded directly from the opposite side to the heterogeneous material bonded body or indirectly through another layer.

【0021】該方法によれば、Al系金属被接合体の接
合に先立って、異種材料被接合体に対しTi系金属層が
ろう付けされるので、該Al系金属の融点に関係なくそ
のろう付け温度を自由に設定することができる。従っ
て、接合強度向上の観点から高融点のろう材を使用する
ことも可能となり、例えば異種材料がセラミックの場合
は、セラミックの接合に適した高融点ろう材(後述)を
用いてTi系金属層をこれに接合することができる。そ
して、Ti系金属層が異種材料被接合体に接合されてし
まえば、該Ti系金属層に対してはAl系金属被接合体
を後述する方法により比較的低温で高強度に接合するこ
とが可能であるため、結果として蒸着装置やスパッタ装
置などの特殊な装置を用いたメタライズ処理等も不要と
なり、高強度の接合体を安価に製造することが可能とな
る。
According to the method, since the Ti-based metal layer is brazed to the dissimilar material to be joined before the joining of the Al-based metal to-be-joined object, the Ti-based metal layer is brazed regardless of the melting point of the Al-based metal. The attachment temperature can be set freely. Therefore, it is possible to use a high melting point brazing material from the viewpoint of improving the bonding strength. For example, when the dissimilar material is ceramic, a Ti-based metal layer is formed using a high melting point brazing material (described later) suitable for ceramic bonding. Can be joined to this. Once the Ti-based metal layer has been bonded to the dissimilar material bonded body, the Al-based metal bonded body can be bonded to the Ti-based metal layer at a relatively low temperature and high strength by a method described later. Since it is possible, as a result, a metallizing process using a special device such as a vapor deposition device or a sputtering device is not required, and a high-strength bonded body can be manufactured at low cost.

【0022】このように、異種材料被接合体がセラミッ
クで構成されている場合に例示されるように、Ti系金
属層を異種材料被接合体と接合するろう材層は、Al系
金属被接合体よりも融点の高い材質で構成することがで
きる。
As described above, the brazing material layer for joining the Ti-based metal layer to the dissimilar material to be bonded is made of an Al-based metal to be joined, as exemplified in the case where the dissimilar material to be joined is made of ceramic. It can be made of a material having a higher melting point than the body.

【0023】上記本発明の第二の構成の接合体において
異種材料被接合体を金属材料で構成する場合、その材質
としては、軟鋼やステンレス鋼を始めとする各種鉄系材
料の他、Cu、Ni、Co、Be及びZrのいずれかを
主成分とする金属(単体金属及び合金の双方を含む)
等、各種使用できる。特に、Fe、Ni及びCoを含有
する材質を使用した場合、Ti系金属層は前述の第一の
構成と同様に、Al系金属被接合体中のAl成分と、異
種材料被接合体中のFe,Ni及びCo成分の1種以上
とが、それらAl系金属被接合体と異種材料被接合体と
の間での成分拡散に基づき反応することを抑制する拡散
バリア層として機能する。これにより、従来問題となっ
ていたそれら成分とAlとの金属間化合物の形成がTi
系金属層の介在により効果的に阻止されるので、高強度
の接合体を得る上での波及効果が特に大きい。
In the joined body of the second structure of the present invention, when the joined body of different materials is made of a metal material, the material may be various iron-based materials such as mild steel and stainless steel, Cu, Metals containing any of Ni, Co, Be and Zr as main components (including both simple metals and alloys)
Etc. can be used. In particular, when a material containing Fe, Ni and Co is used, the Ti-based metal layer has an Al component in the Al-based metal bonded body and a One or more of the Fe, Ni, and Co components function as a diffusion barrier layer that suppresses a reaction based on component diffusion between the Al-based metal bonded body and the dissimilar material bonded body. As a result, the formation of an intermetallic compound between these components and Al, which has been a problem in the past, is reduced to Ti
Since it is effectively prevented by the interposition of the system metal layer, the ripple effect in obtaining a high-strength joined body is particularly large.

【0024】なお、Fe,Ni及びCoの1種以上を主
成分とする金属としては第一の構成と同様に、クロムモ
リブデン鋼、ステンレス鋼、Ni基耐熱合金(例えば商
標名:インコネル)、Fe−Ni−Co合金(例えばコ
バール)、Fe−Ni合金(例えば42アロイ)、さら
にはWC−Co、TiN−Co、WC−Ni等の焼結金
属等が挙げられる。また、異種材料被接合体をセラミッ
クで構成する場合は、その材質としてAl23、ZrO
2、Si34、AlN、SiC、TiC等、各種使用で
きる。
As the metal containing at least one of Fe, Ni and Co as the main component, chromium molybdenum steel, stainless steel, Ni-base heat-resistant alloy (for example, trade name: Inconel), Fe -Ni-Co alloy (e.g., Kovar), Fe-Ni alloy (e.g., 42 alloy), and sintered metals such as WC-Co, TiN-Co, and WC-Ni. Further, when the dissimilar material joined body is made of ceramic, the material may be Al 2 O 3 , ZrO.
2 , various types such as Si 3 N 4 , AlN, SiC, TiC and the like can be used.

【0025】一方、Al系金属被接合体の材質として
は、前述の第一の構成の接合体と同様のものが使用でき
るので、説明を省略する。
On the other hand, as the material of the Al-based metal bonded body, the same material as that of the bonded body having the above-described first configuration can be used, and the description is omitted.

【0026】次に、Ti系金属層はTiを主成分として
構成されていればよく、例えば工業用純Ti(例えばJ
IS H4600)、Ti−Pd合金(例えばJIS
H4605)、Ti−6Al−4V合金(例えばJIS
H4607、組成は重量%:以下、本明細書では組成
値はすべて重量%で表すものとして、「重量%」の表示
は省略する)、及びその他の各種Ti合金を使用するこ
とができる。なお、Ti系金属層の厚さは、0.1mm以
上とするのがよい。厚さが0.1mm未満になると、ろう
接時に熱応力等でTi系金属層が反り、後にAl系金属
被接合体を接合したときの接合強度が低下する場合があ
る。なお、Ti系金属層の厚さは、望ましくは0.2mm
以上に設定するのがよい。ここで、図1を援用して示す
ように、Ti系金属層の厚さも第一の構成における拡散
バリア層と同様に、Al系金属被接合体と異種材料被接
合体との間において、Ti系金属層の一方の側に隣接し
ている層をA層、他方の側に隣接している層をB層と
し、それらA層ないしB層との間で拡散を生じている部
分を除いた残余の部分の厚さをいう。すなわち、この場
合も、接合後の厚さを意味するものとなる。
Next, the Ti-based metal layer only needs to be composed mainly of Ti, for example, industrial pure Ti (for example, J
IS H4600), Ti-Pd alloy (for example, JIS
H4605), Ti-6Al-4V alloy (for example, JIS
H4607, composition is% by weight: Hereinafter, in the present specification, all the composition values are represented by% by weight, and the indication of "% by weight" is omitted), and various other Ti alloys can be used. Note that the thickness of the Ti-based metal layer is preferably 0.1 mm or more. If the thickness is less than 0.1 mm, the Ti-based metal layer may warp due to thermal stress or the like during brazing, and the bonding strength when the Al-based metal workpiece is later bonded may be reduced. The thickness of the Ti-based metal layer is preferably 0.2 mm
It is better to set above. Here, as shown in FIG. 1, the thickness of the Ti-based metal layer is the same as that of the diffusion barrier layer in the first configuration. A layer adjacent to one side of the base metal layer is referred to as an A layer, and a layer adjacent to the other side is referred to as a B layer, and a portion where diffusion occurs between the A layer and the B layer is removed. It refers to the thickness of the remaining part. That is, also in this case, it means the thickness after bonding.

【0027】また、異種材料被接合体にTi系金属層を
ろう付けするためのろう材としては、Ag系、Ni系、
Cu系、Ag−Cu系、Ni−Cu系等の各種ろう材、
及びこれらのろう材組成にTi、Zr、Hf等の活性金
属成分を加えた活性ろう材を使用することができる。後
者の場合、活性金属成分は、異種材料表面とろう材との
濡れ性を高める役割を果たし、結果として異種材料被接
合体とTi系金属層との接合強度がさらに高められる。
一方、活性金属成分を含有しない前者のろう材を使用し
た場合でも、ろう付処理の際にTi系金属層中のTi成
分がろう材の溶融により生じた液相中に溶出・拡散する
ことがある。この場合、その拡散したTi成分が活性金
属成分として機能し、異種材料被接合体とTi系金属層
との接合強度が同様に高められる場合がある。
Further, as a brazing material for brazing a Ti-based metal layer to an object to be joined of different materials, Ag-based, Ni-based,
Various brazing materials such as Cu-based, Ag-Cu-based, Ni-Cu-based,
An active brazing material obtained by adding an active metal component such as Ti, Zr, or Hf to the composition of these brazing materials can be used. In the latter case, the active metal component plays a role in increasing the wettability between the surface of the dissimilar material and the brazing material, and as a result, the joining strength between the joined body of the dissimilar material and the Ti-based metal layer is further increased.
On the other hand, even when the former brazing material containing no active metal component is used, the Ti component in the Ti-based metal layer can be eluted and diffused into the liquid phase generated by the melting of the brazing material during the brazing process. is there. In this case, the diffused Ti component functions as an active metal component, and the bonding strength between the dissimilar material-joined body and the Ti-based metal layer may be similarly increased.

【0028】異種材料被接合体がセラミックスで構成さ
れる場合には、接合後のろう材層が例えばTiを含有す
るものとなっていれば、セラミックスとろう材との濡れ
性を高める上で望ましいといえる。この場合、含有され
るTi成分は、上記Ti系金属層に由来するもの、活性
ろう材に始めから含有されているTi成分に由来するも
の、及びその双方からなるもののいずれかとなる。な
お、ろう材層中のTi成分は、公知の方法、例えば電子
プローブ・マイクロ・アナライザ(EPMA:あるいは
走査電子顕微鏡観察像との組み合わせ)エネルギー分散
型X線分析(EDX)、波長分散分光法(WDS)、オ
ージェ電子分光法(AES)等により特定することがで
きる。なお、ろう材層中にTi系金属層に由来するTi
成分が含有される場合は、ろう材層とTi系金属層との
境界付近においてその接合方向(すなわち厚さ方向)
に、Ti系金属層側からろう材層側に向けてTi成分含
有量が漸減する遷移領域が形成されることがある。
In the case where the dissimilar material to be joined is made of ceramics, it is desirable that the brazing material layer after joining contains, for example, Ti in order to enhance the wettability between the ceramics and the brazing material. It can be said that. In this case, the contained Ti component is one derived from the Ti-based metal layer, one derived from the Ti component originally contained in the active brazing material, or one composed of both. The Ti component in the brazing material layer can be determined by a known method, for example, an electron probe microanalyzer (EPMA: or a combination with an image observed by a scanning electron microscope), energy dispersive X-ray analysis (EDX), and wavelength dispersive spectroscopy (EDX). WDS), Auger electron spectroscopy (AES) and the like. It should be noted that Ti derived from the Ti-based metal layer is contained in the brazing material layer.
If a component is contained, the joining direction (ie, thickness direction) near the boundary between the brazing material layer and the Ti-based metal layer
In some cases, a transition region where the Ti component content gradually decreases from the Ti-based metal layer side toward the brazing material layer side may be formed.

【0029】次に、異種材料被接合体にろう付けされた
Ti系金属層に対しては、Al系金属被接合体を別のろ
う材層を介してろう付け接合することができる。この場
合、その別のろう材の材質としては、Al系金属被接合
体よりも低融点のものを使用できる。具体的には、例え
ばAl−Si系(JIS:BA4343、BA4045
等)、Al−Cu−Si系(JIS:BA4145
等)、Al−Cu−Mg系(JIS:BA4003、B
A4004、BA4005、BA4N04等)、さらに
はAl−Mg系、Al−Si−Ge系、Al−Si−M
g系、Al−Si−Cu−Zn系、Al−Ge−Si−
Cu−Mg系等の各種Al系ろう材を用いることができ
る。
Next, with respect to the Ti-based metal layer brazed to the dissimilar material joined object, the Al-based metal joined object can be brazed and joined via another brazing material layer. In this case, as the material of the other brazing material, a material having a lower melting point than the Al-based metal joined body can be used. Specifically, for example, for example, an Al-Si system (JIS: BA4343, BA4045)
Etc.), Al-Cu-Si system (JIS: BA4145)
Etc.), Al-Cu-Mg type (JIS: BA4003, B
A4004, BA4005, BA4N04, etc.), Al-Mg, Al-Si-Ge, Al-Si-M
g-based, Al-Si-Cu-Zn-based, Al-Ge-Si-
Various Al-based brazing materials such as Cu-Mg-based materials can be used.

【0030】前述の通り、従来の接合体においては、A
l系金属部材に対しセラミック部材を接合する場合に、
本来高融点のろう材を使用したいところをAl系金属部
材の融点による制約から、止むなくAl系低融点ろう材
を用いなければならず、結果として十分な接合強度が達
成できなかった。しかしながら、上述のようにTi系金
属層と異種材料被接合体とのろう付け接合と、そのTi
系金属層に対するAl系金属被接合体のろう付け接合と
をこの順序で逐次的に施すようにし、前者においては高
融点のろう材を、後者においては低融点のろう材を使用
することでそのような問題が解決され、強度に優れた接
合体を容易に得ることが可能となった。
As described above, in the conventional joined body, A
When joining a ceramic member to an l-based metal member,
Where a high melting point brazing material is originally desired to be used, Al-based low melting point brazing material must be used unavoidably due to the limitation of the melting point of the Al-based metal member, and as a result, sufficient bonding strength cannot be achieved. However, as described above, the brazing bonding between the Ti-based metal layer and the object to be bonded of the dissimilar material,
And the brazing of the Al-based metal article to the base metal layer is sequentially performed in this order, and in the former, a high melting point brazing material is used, and in the latter, a low melting point brazing material is used. Such a problem was solved, and it became possible to easily obtain a joined body having excellent strength.

【0031】なお、上記第二の構成の接合体において
も、異種材料被接合体とTi系金属層との間、あるいは
Ti系金属層とAl系金属被接合体との間に熱残留応力
を綬和する緩衝層を設けてもよい。
In the joined body having the second configuration, thermal residual stress is also generated between the joined body of different materials and the Ti-based metal layer or between the Ti-based metal layer and the Al-based metal joined body. You may provide the buffer layer which softens.

【0032】また、Ti系金属層に対するAl系金属被
接合体の接合は、ろう付け以外にも、ろう材を使用しな
い拡散接合や摩擦圧接、さらには爆発圧接等により行っ
てもよい。また、異種材料被接合体が金属材料で構成さ
れている場合には、抵抗溶接による接合も可能である。
The joining of the Al-based metal article to the Ti-based metal layer may be performed by brazing, diffusion welding without using a brazing material, friction welding, or explosion welding. When the dissimilar material joined body is made of a metal material, joining by resistance welding is also possible.

【0033】以上の本発明の第一の構成及び第二の構成
の各接合体においては、Al系金属被接合体を時効析出
硬化型Al合金により構成すれば、接合工程が、例えば
ろう接のための加熱処理など、所定の接合温度に加熱す
る工程を含んでいる場合に、その加熱工程をAl系金属
被接合体の溶体化処理に流用することができる。この場
合、接合後に上記加熱処理温度(すなわち溶体化処理温
度)よりも低温(室温を含む)で所定時間時効処理する
ことにより、Al系金属被接合体が析出硬化して、その
強度を高めることができる。なお、時効析出硬化型Al
合金としては、鋳物あるいはダイキャスト用のもので
は、Al−Cu−Mg系(JIS:AC1A、AC1B
等)、Al−Cu−Mg−Ni系(JIS:AC5A
等)、Al−Cu−Si系(JIS:AC2A、AC2
B等)、Al−Si−Mg系(JIS:AC4A、AC
4C、AC4CH、ADC3等)、Al−Si−Cu系
(JIS:AC4B、ADC10、ADC12等)、A
l−Si−Mg−Cu系(JIS:AC4D等)、Al
−Si−Mg−Ni系(JIS:AC8A、AC8B、
AC8C、AC9A、AC9B等)の各種合金、展伸用
のものでは、Al−Cu−Mg系(JIS:2014、
2017、2024等)、Al−Si−Cu−Mg系
(JIS:4032等)、Al−Mg−Si系(JI
S:6061、6063等)、Al−Zn−Mg−Cu
系あるいはAl−Zn−Mg系(JIS:7075、7
N01等)、及び各種Al−Li系合金等を例示するこ
とができる。
In each of the joined bodies of the first and second constructions of the present invention described above, if the Al-based metal joined body is made of an age-precipitation hardening type Al alloy, the joining process can be performed, for example, by brazing. For example, a heating process for heating to a predetermined joining temperature or the like, the heating process can be applied to the solution treatment of the Al-based metal workpiece. In this case, by performing aging treatment at a lower temperature (including room temperature) than the heat treatment temperature (that is, the solution treatment temperature) for a predetermined time after joining, the Al-based metal joined body is precipitated and hardened, thereby increasing its strength. Can be. In addition, aging precipitation hardening type Al
As the alloy, for casting or die casting, Al-Cu-Mg alloy (JIS: AC1A, AC1B)
Etc.), Al-Cu-Mg-Ni system (JIS: AC5A)
Etc.), Al-Cu-Si system (JIS: AC2A, AC2
B, etc.), Al-Si-Mg type (JIS: AC4A, AC
4C, AC4CH, ADC3, etc.), Al-Si-Cu type (JIS: AC4B, ADC10, ADC12, etc.), A
1-Si-Mg-Cu (JIS: AC4D, etc.), Al
-Si-Mg-Ni-based (JIS: AC8A, AC8B,
In the case of various alloys such as AC8C, AC9A, AC9B, and the like for spreading, Al-Cu-Mg (JIS: 2014,
2017, 2024 etc.), Al-Si-Cu-Mg type (JIS: 4032 etc.), Al-Mg-Si type (JI
S: 6061, 6063, etc.), Al-Zn-Mg-Cu
System or Al-Zn-Mg system (JIS: 7075, 7
N01) and various Al-Li alloys.

【0034】[0034]

【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。図2は、本発明の接合体の第一の構成の一
例を示す模式図である。Al系金属被接合体と異種材料
被接合体との間には、ろう材からなる接合層と拡散バリ
ア層とがAl系金属被接合体側からこの順序で形成され
ている。なお、拡散バリア層の両側(図の上下方向)に
は図1に示すような拡散を生じている部分があるが、図
2においてはこれを省略して描いている。
Embodiments of the present invention will be described below. FIG. 2 is a schematic diagram illustrating an example of the first configuration of the joined body of the present invention. A bonding layer made of a brazing material and a diffusion barrier layer are formed in this order between the Al-based metal bonded body and the dissimilar material bonded body from the Al-based metal bonded body side. It should be noted that there are portions where diffusion occurs as shown in FIG. 1 on both sides (up and down directions in the figure) of the diffusion barrier layer, but this is omitted in FIG.

【0035】Al系金属被接合体は、Alを主成分とす
る金属(すなわち、Al又はAl合金)からなる部材で
あり、異種材料被接合体は、Fe,Ni,Coの一種以
上を含む金属からなる部材である。一方、接合層を構成
するろう材は、例えばAl系の低融点ろう材であり、こ
の接合層によるろう付け接合によって接合体が形成され
る。また、拡散バリア層は、Ti,Pd,Ptのうちの
一種以上を含む層であり、その厚みは例えば2μm以上
とされる。
The Al-based metal joined body is a member made of a metal containing Al as a main component (ie, Al or an Al alloy), and the dissimilar material joined body is a metal containing at least one of Fe, Ni, and Co. It is a member which consists of. On the other hand, the brazing material forming the joining layer is, for example, an Al-based low melting point brazing material, and a joined body is formed by brazing by the joining layer. The diffusion barrier layer is a layer containing one or more of Ti, Pd, and Pt, and has a thickness of, for example, 2 μm or more.

【0036】このような接合体を製造する場合には、ま
ず異種材料被接合体の接合面に、メッキ、蒸着、スパッ
タなどの方法で拡散バリア層となるべきTiなどのメタ
ライズ膜(拡散バリア用金属層)を予め形成し、その形
成された拡散バリア用金属層と、Al系金属被接合体と
の間に、接合層となるろう材からなる箔を挟みこむ。そ
して、その状態でろう材の溶融温度以上に加熱すること
によりろう付けによる接合を行う。なお、ここでは、拡
散バリア層を形成するためにメタライズ膜を用いたが、
異種材料被接合体側に拡散バリア層となるTi等の箔を
配置して挟み込んでもよい。
In the case of manufacturing such a joined body, first, a metallized film (such as a diffusion barrier layer) of Ti or the like to be a diffusion barrier layer is formed on the joining surface of the dissimilar material to be joined by a method such as plating, vapor deposition, or sputtering. A metal layer) is formed in advance, and a foil made of a brazing material serving as a bonding layer is sandwiched between the formed diffusion barrier metal layer and the Al-based metal bonded body. Then, in this state, joining by brazing is performed by heating to a temperature equal to or higher than the melting temperature of the brazing material. Note that, here, a metallized film was used to form the diffusion barrier layer,
A foil such as Ti serving as a diffusion barrier layer may be arranged and sandwiched between the dissimilar materials to be bonded.

【0037】また、図3は緩衝層を備えた接合体の一例
を示している。該構成においては、Al系金属被接合体
とFeを主体とする異種材料被接合体との間に、ろう材
よりなる接合層、Alを主成分とする金属からなる緩衝
層、ろう材よりなる第二の接合層、及び拡散バリア層
が、Al系金属被接合体側からこの順序で形成されてい
る。この接合体は、接合界面に緩衝層を備えているの
で、Al系金属被接合体と異種材料被接合体との間の熱
膨張係数差が大きい場合に有利である。
FIG. 3 shows an example of a joined body provided with a buffer layer. In this configuration, a bonding layer made of a brazing material, a buffer layer made of a metal containing Al as a main component, and a brazing material are provided between the Al-based metal bonded body and the bonded body of a different material mainly composed of Fe. The second bonding layer and the diffusion barrier layer are formed in this order from the Al-based metal bonded body side. Since this joined body is provided with a buffer layer at the joining interface, it is advantageous when the thermal expansion coefficient difference between the Al-based metal joined body and the dissimilar material joined body is large.

【0038】次に、図4(a)は、本発明の接合体の第
二の構成の一例を示す模式図である。すなわち、該接合
体においては、異種材料被接合体とTi系金属層として
のTi系金属板とが、ろう材層、Ti系金属板及び別の
ろう材層を介して互いに接合されている。Al系金属被
接合体は第一の構成と同様に、Alを主成分とする金属
(Al又はAl合金)からなる部材であり、異種材料被
接合体は、Fe,Ni,Coの一種以上を含む金属から
なる部材あるいはセラミック部材である。また、Ti金
属板は、工業用純Ti、Ti−Pd合金あるいはTi−
6Al−4V合金等で構成される。さらに、異種材料被
接合体にTi系金属板をろう付けするためのろう材は、
Ag系、Ni系、Cu系、Ag−Cu系、Ni−Cu系
等の各種ろう材、あるいはこれらのろう材組成にTi、
Zr、Hf等の活性金属成分を加えた活性ろう材であ
る。一方、Ti系金属板をAl系金属被接合体にろう付
けする別のろう材は、例えばAl系の低融点ろう材であ
る。なお、拡散バリア層の両側(図の上下方向)には図
1に示すような拡散を生じている部分があるが、図2な
いし図4においてはこれを省略して描いている。
Next, FIG. 4A is a schematic view showing an example of the second structure of the joined body of the present invention. That is, in the joined body, the dissimilar material joined body and the Ti-based metal plate as the Ti-based metal layer are joined to each other via the brazing material layer, the Ti-based metal plate, and another brazing material layer. Similar to the first configuration, the Al-based metal joined body is a member made of a metal containing Al as a main component (Al or an Al alloy), and the dissimilar material joined body includes one or more of Fe, Ni, and Co. And a ceramic member. The Ti metal plate is made of pure Ti for industrial use, Ti-Pd alloy or Ti-
6Al-4V alloy or the like. Furthermore, a brazing material for brazing a Ti-based metal plate to a dissimilar material joined body is as follows:
Various brazing materials such as Ag-based, Ni-based, Cu-based, Ag-Cu-based, Ni-Cu-based, or Ti,
It is an active brazing material to which active metal components such as Zr and Hf are added. On the other hand, another brazing material for brazing a Ti-based metal plate to an Al-based metal workpiece is, for example, an Al-based low melting point brazing material. It should be noted that there are portions where diffusion occurs as shown in FIG. 1 on both sides (up and down directions in the figure) of the diffusion barrier layer, but these are omitted in FIGS. 2 to 4.

【0039】その場合の接合体の製造方法の一例を図5
に模式的に示している。すなわち、同図(a)に示すよ
うに、異種材料被接合体とTi系金属板との間にろう材
箔あるいはろう材板(例えば後述するAl系金属被接合
体よりも高融点のもの)を介挿し、その状態でAl系金
属被接合体の融点よりも高い所定の温度に加熱してろう
付け処理を行う。これにより、同図(b)に示すよう
に、異種材料被接合体とTi系金属板とはろう材層を介
して接合される。そして、Ti系金属板とAl系金属被
接合体との間に、別のろう材箔あるいはろう材板を介挿
し、該Al系金属被接合体の融点よりも低い所定の接合
温度に加熱して両者をろう付けする。
FIG. 5 shows an example of a method of manufacturing the joined body in that case.
Is schematically shown in FIG. That is, as shown in FIG. 1A, a brazing material foil or a brazing material plate (for example, a material having a higher melting point than an Al-based metal material to be described later) is provided between a different material material to be bonded and a Ti-based metal plate. , And in this state, the brazing treatment is performed by heating to a predetermined temperature higher than the melting point of the Al-based metal joined body. Thus, as shown in FIG. 2B, the dissimilar material joined body and the Ti-based metal plate are joined via the brazing material layer. Then, another brazing material foil or brazing material plate is interposed between the Ti-based metal plate and the Al-based metal bonded body, and heated to a predetermined bonding temperature lower than the melting point of the Al-based metal bonded body. And braze them together.

【0040】なお、図4(b)及び(c)に示すよう
に、異種材料被接合体とTi系金属板との間、あるいは
Ti系金属板とAl系金属被接合体との間に熱残留応力
を綬和する緩衝層を設けてもよい。異種材料被接合体が
例えばセラミックの場合は、図4(b)に示すように、
緩衝板をそのセラミック製の異種材料被接合体とTi
系金属板との間に配置する。この場合、緩衝板は、例
えばNiあるいはNi合金等で構成できる。また、この
ような緩衝板をセラミック製の異種材料被接合体に接
合するためのろう材(緩衝板接合用ろう材)として
は、Ag系、Ni系、Cu系、Ag−Cu系、Ni−C
u系等のろう材組成にTi、Zr、Hf等の活性金属成
分を加えた活性ろう材を使用できる。この場合、図6
(a)に示すように、まず異種材料被接合体に緩衝板
とTi系金属板とを、それぞれ緩衝板接合用ろう材層
及び前述のろう材層とを介して接合しておき、これに別
のろう材を用いてAl系金属被接合体を接合するように
する。
As shown in FIGS. 4 (b) and 4 (c), heat is applied between the object to be joined of different materials and the Ti-based metal plate or between the Ti-based metal plate and the Al-based metal object to be joined. A buffer layer for reducing residual stress may be provided. When the dissimilar material to be joined is, for example, ceramic, as shown in FIG.
The cushioning plate is made of a ceramic dissimilar material and Ti
It is arranged between the system metal plate. In this case, the buffer plate can be made of, for example, Ni or a Ni alloy. Further, as a brazing material (brazing material for joining a buffer plate) for joining such a buffer plate to a ceramic-made dissimilar material to-be-joined body, Ag-based, Ni-based, Cu-based, Ag-Cu-based, Ni- C
An active brazing material obtained by adding an active metal component such as Ti, Zr, or Hf to a brazing material composition such as a u-based brazing material can be used. In this case, FIG.
As shown in (a), first, a buffer plate and a Ti-based metal plate are joined to a dissimilar material joined body via a buffer plate joining brazing material layer and the above-mentioned brazing material layer, respectively. The Al-based metal workpiece is joined using another brazing material.

【0041】一方、異種材料被接合体が金属により構成
される場合は、図4(c)に示すように、緩衝板をT
i系金属板とAl系金属被接合体との間に配置する。こ
の場合、緩衝板は、例えばAlを主成分とする金属で
構成できる。また、このような緩衝板をAl系金属被
接合体に接合するためのろう材(緩衝板接合用ろう
材)としては、例えばAl系の低融点ろう材を使用でき
る。この場合、図6(b)に示すように、異種材料被接
合体にTi系金属板を前述のろう材層を介して接合して
おき、これに緩衝板とAl系金属被接合体とを、上記
別のろう材及び緩衝板接合用ろう材を用いて接合する
ようにする。
On the other hand, when the dissimilar material to be joined is made of metal, as shown in FIG.
It is arranged between the i-based metal plate and the Al-based metal workpiece. In this case, the buffer plate can be made of, for example, a metal mainly containing Al. Further, as a brazing material for joining such a buffer plate to an Al-based metal workpiece (a brazing material for joining a buffer plate), for example, an Al-based low melting point brazing material can be used. In this case, as shown in FIG. 6B, a Ti-based metal plate is joined to the dissimilar material to be joined via the brazing material layer described above, and the buffer plate and the Al-based metal to-be-joined are joined to this. And the above-mentioned another brazing material and the brazing material for joining the buffer plate.

【0042】[0042]

【実施例】以下、本発明の実施例について説明する。 (実施例1)図2に示す接合体を、次のような材質を用
いて、表1に示す各種組み合わせでろう付けにより作製
した(試料No.1〜17)。 (1)Al系金属被接合体:Al鋳物(AC2A)、純A
l(Al050)、Al−Cu合金(A2017)、A
I−Zn−Mg合金(A7075)の4種類を用いた。
大きさは、直径10.5mm、長さ20mmである。 (2)異種材料被接合体:Fe−29Ni−17Co、炭
素鋼(S20C;Fe−0.2C)を用いた。大きさ
は、直径10.5mm、長さ20mmである。 (3)接合層:ろう材として、Al−10Si(BA40
45)、Al−27Cu−5Si、Al−14Cu−3
Si−80Znの3種類の低融点ろう材からなる厚さ5
0μmのろう材箔を用いた。 (4)拡散バリア用金属層:各種方法・材質で形成したメ
タライズ層とした。形成方法と厚さ、及び接合後の拡散
バリア層の組成は表1に示す。なお、拡散バリア層の厚
さは、接合後にEPMAにより測定したものであり、各
欄の元素記号の右側にその数値を示す。また、2層から
なるNo.13の拡散バリア層の構成においては、表中
左側に記した層を異種材料被接合体側に、同じく右側に
記した層をAl系金属被接合体側に配置した。また、N
o.14の混在層は、Ti中にAlが20重量%混在し
ている層であり、試No.16の混在層は、Pd中にA
lが20重量%混在している層であことを意味する。
Embodiments of the present invention will be described below. (Example 1) The joined body shown in FIG. 2 was produced by brazing using the following materials in various combinations shown in Table 1 (Sample Nos. 1 to 17). (1) Al-based metal joined body: Al casting (AC2A), pure A
1 (Al050), Al-Cu alloy (A2017), A
Four types of I-Zn-Mg alloy (A7075) were used.
The size is 10.5 mm in diameter and 20 mm in length. (2) Dissimilar materials to be joined: Fe-29Ni-17Co, carbon steel (S20C; Fe-0.2C) was used. The size is 10.5 mm in diameter and 20 mm in length. (3) Bonding layer: Al-10Si (BA40
45), Al-27Cu-5Si, Al-14Cu-3
Thickness 5 made of three low melting point brazing materials of Si-80Zn
A 0 μm brazing material foil was used. (4) Metal layer for diffusion barrier: Metallized layer formed by various methods and materials. Table 1 shows the formation method and thickness, and the composition of the diffusion barrier layer after bonding. The thickness of the diffusion barrier layer was measured by EPMA after bonding, and the numerical value is shown on the right side of the element symbol in each column. In addition, the two-layer No. In the configuration of the 13 diffusion barrier layers, the layer shown on the left side of the table was disposed on the side of the dissimilar material to be bonded, and the layer also shown on the right side was disposed on the side of the Al-based metal to-be-bonded. Also, N
o. The mixed layer of No. 14 is a layer in which 20% by weight of Al is mixed in Ti. The mixed layer of 16 has A in Pd.
1 means a layer in which 20% by weight is mixed.

【0043】[0043]

【表1】 [Table 1]

【0044】そして、得られた接合体の4点曲げ試験を
行ない、その接合強度を測定した。その結果も同じく表
1に記す。なお、比較例(試料No.18〜22)につ
いても同様な実験を行った。ここで、「接合せず」は、
手で取れたものなど4点曲げ試験前に取れたものを意味
している。
Then, a four-point bending test was performed on the obtained joined body to measure its joining strength. The results are also shown in Table 1. In addition, the same experiment was performed about the comparative example (sample No. 18-22). Here, "not joined" means
Means those obtained before the four-point bending test, such as those obtained by hand.

【0045】この表1から明らかな様に、本実施例のも
の(試料No.1〜17)は、4点曲げ強度が35MP
a以上の接合強度を有し、好ましい高強度の接合体であ
る。特に、拡散バリア層が2μm以上のもの(試料N
o.5〜17)は、4点曲げ強度が75Mpa以上と大
きく好適であり、さらに拡散バリア層が5μm以上のも
の(試料No.9〜17)は、4点曲げ強度が140M
pa以上と一層大きく極めて好適である。これに対し、
本発明の範囲外にある比較例(試料No.18〜22)
では、接合体を形成できないか、あるいは接合しても手
で簡単に取れるように強度が低く好ましくない。
As is clear from Table 1, the four-point bending strength of this example (Sample Nos. 1 to 17) was 35 MPa.
It is a preferable high-strength bonded body having a bonding strength of a or more. Particularly, when the diffusion barrier layer is 2 μm or more (sample N
o. 5 to 17) have a four-point bending strength of 75 Mpa or more, which is preferable. Further, those having a diffusion barrier layer of 5 μm or more (Sample Nos. 9 to 17) have a four-point bending strength of 140 Mpa.
It is much larger and more preferable. In contrast,
Comparative examples outside the scope of the present invention (Sample Nos. 18 to 22)
In this case, a joined body cannot be formed, or the strength is low so that it can be easily removed by hand even when joined.

【0046】(実施例2)異種材料被接合体(直径1
0.5mm、厚さ20mmの円板状)として、炭素鋼
(JIS S20C、組成:Fe−0.2C)、真鍮
(JIS C2801、組成:Cu−40Zn)、Al
23焼結体及びSi34焼結体の4種類を、また、Ti
系金属板(直径10.5mmの円板状、厚さは表2内に
記載)として、工業用純Ti及びTi合金(Ti−6A
l−4V)の2種類を用意した。また、それらを接合す
るための前記ろう材(直径10.5mm、厚さ20mm
の円板状)としては、上記異種材料との接合性を考慮し
て、Ag−Cu共晶ろう(組成:Ag−28Cu及びA
g−28Cu−4Ti)及びAg−Cu−Tiろう(組
成:Ag−35Cu−2Ti)の3種類を選定した。一
方、A1系金属被接合体(直径10.5mm、厚さ20
mmの円板状)としては、工業用純Al(JIS 10
50)、鋳造用Al合金(JIS AC2A)、展伸用
Al−Cu−Mg合金(JIS 2017)、及びAl
−Zn−Mg−Cu合金(JIS 7075)の3種類
を用意した。さらに、A1系金属被接合体をTi系金属
板に接合するための前記別のろう材としては、低融点ろ
うであるAl−Cu−Si−Zn系ろう(組成:Al−
12Cu−2Si−56Zn)を用いた。
(Example 2) A member to be joined of different materials (diameter 1
Carbon steel (JIS S20C, composition: Fe-0.2C), brass (JIS C2801, composition: Cu-40Zn), Al
4 types of 2 O 3 sintered body and Si 3 N 4 sintered body
As a system metal plate (disc-shaped with a diameter of 10.5 mm, thickness is described in Table 2), industrial pure Ti and Ti alloy (Ti-6A)
1-4V). The brazing material (10.5 mm in diameter, 20 mm in thickness) for joining them
In consideration of the bondability with the above-mentioned different materials, an Ag-Cu eutectic solder (composition: Ag-28Cu and A
g-28Cu-4Ti) and three types of Ag-Cu-Ti brazes (composition: Ag-35Cu-2Ti). On the other hand, an A1-based metal joined body (diameter 10.5 mm, thickness 20
mm disk) is industrial pure Al (JIS 10
50), casting Al alloy (JIS AC2A), wrought Al-Cu-Mg alloy (JIS 2017), and Al
Three kinds of -Zn-Mg-Cu alloy (JIS 7075) were prepared. Further, as another brazing material for joining the A1-based metal joined body to the Ti-based metal plate, an Al-Cu-Si-Zn-based brazing material (composition: Al-
12Cu-2Si-56Zn).

【0047】これらを表1に示す組合せにて、図1に示
す前述の方法により接合した。なお、異種材料被接合体
とTi系金属板との接合は、ろう材としてAg−28C
uを用いたものは温度830℃で、またAg−35Cu
−2Tiを用いたものは温度900℃で、さらにTi系
金属板とAl系金属被接合体との接合は温度520℃
で、それぞれ真空中で行った。こうして得られた接合体
は、外径が9mmとなるように円筒研削し、Al系金属
被接合体の側をクランプして異種材料被接合体側に片持
ち曲げ荷重を付与することにより、その接合強度を評価
した。結果を表2に示す(なお、表中「*」を付与した
ものは比較例であることを示す)。
These were joined in the combinations shown in Table 1 by the method shown in FIG. In addition, the joining between the dissimilar material joined body and the Ti-based metal plate is performed using Ag-28C as a brazing material.
u was used at a temperature of 830 ° C. and Ag-35Cu
-2Ti is 900 ° C., and the joining between the Ti-based metal plate and the Al-based metal workpiece is 520 ° C.
Each was performed in a vacuum. The joined body thus obtained is subjected to cylindrical grinding so as to have an outer diameter of 9 mm, and a cantilever bending load is applied to the side of the Al-based metal joined body to apply a cantilever bending load to the joined side of the dissimilar material joined body. The strength was evaluated. The results are shown in Table 2 (in the table, "*" indicates a comparative example).

【0048】[0048]

【表2】 [Table 2]

【0049】すなわち、実施例の接合体(No.1〜2
8)については、いずれも100MPa以上の高強度を
示していることがわかる。一方、Ti系金属板に代えて
純Ni板あるいはNi−30Mo板等を使用した比較例
(No.29〜36)は、Al系金属被接合体と低融点
ろうとの問で脆弱な金属間化合物が形成されたため低強
度であった。また、比較例33及び34の接合体はTi
系金属板の厚さが薄いため、異種材料被接合体とのろう
接時に熱応力等でTi系金属板が反り、接合強度が同様
に低下した。さらに、Al系金属被接合体と炭素鋼と
を、Ti系金属板を介さずに低融点ろうを用いて直接的
に接合を試みた比較例35においては、炭素鋼と低融点
ろうとが反応して脆弱な金属間化合物が形成され、接合
強度が極端に低下したため強度測定が不能であった。ま
た、炭素鋼に代えてAl23を用いた比較例36におい
ては、Al23と低融点ろうとが反応せず接合体が得ら
れなかった。
That is, the joined bodies (Nos. 1-2 of the examples)
Regarding 8), it can be seen that each of them shows high strength of 100 MPa or more. On the other hand, the comparative examples (Nos. 29 to 36) using a pure Ni plate or a Ni-30Mo plate instead of the Ti-based metal plate show intermetallic compounds fragile due to the problem of the Al-based metal joined body and the low melting point solder. Was formed, so that the strength was low. The joined bodies of Comparative Examples 33 and 34 were made of Ti.
Since the thickness of the system-based metal plate is small, the Ti-based metal plate warps due to thermal stress or the like when brazing to a dissimilar material to-be-joined, and the joining strength is similarly reduced. Further, in Comparative Example 35 in which the Al-based metal joined body and the carbon steel were directly joined using a low-melting brazing without using a Ti-based metal plate, the carbon steel and the low-melting braze reacted. A brittle intermetallic compound was formed, and the bonding strength was extremely reduced, so that the strength could not be measured. In Comparative Example 36 in which Al 2 O 3 was used instead of carbon steel, Al 2 O 3 did not react with the low melting point brazing alloy, and a joined body could not be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の接合体の主要部分を示す模式図。FIG. 1 is a schematic view showing a main part of a joined body of the present invention.

【図2】本発明の第一の構成に係る接合体の一例を示す
模式図。
FIG. 2 is a schematic view showing an example of a joined body according to the first configuration of the present invention.

【図3】図2の接合体の変形例を示す模式図。FIG. 3 is a schematic view showing a modified example of the joined body of FIG. 2;

【図4】本発明の第二の構成に係る接合体を、そのいく
つかの変形例とともに示す模式図。
FIG. 4 is a schematic view showing a joined body according to a second configuration of the present invention together with some modified examples thereof.

【図5】図4(a)の接合体の作製方法を示す概念図。FIG. 5 is a conceptual diagram showing a method for manufacturing the joined body of FIG. 4 (a).

【図6】図4(b)及び(c)の接合体の作製方法を示
す概念図。
FIG. 6 is a conceptual diagram showing a method for manufacturing the joined body of FIGS. 4B and 4C.

Claims (14)

【特許請求の範囲】[Claims] 【請求項1】 Alを主体に構成されたAl系金属被接
合体と、Fe,Ni及びCoの1種以上を主成分とする
金属からなる異種材料被接合体とが金属系接合層を介し
て互いに接合されるとともに、 前記金属系接合層は、前記Al系金属被接合体中のAl
成分と、前記異種材料被接合体中のFe,Ni及びCo
成分の1種以上とが、それらAl系金属被接合体と異種
材料被接合体との間での成分拡散に基づき反応すること
を抑制する拡散バリア層を含むことを特徴とするAl系
金属と異種材料との接合体。
1. An Al-based metal bonded body mainly composed of Al and a dissimilar material bonded body made of a metal mainly containing at least one of Fe, Ni and Co via a metal-based bonding layer. And the metal-based bonding layer is formed of Al in the Al-based metal bonded body.
And Fe, Ni, and Co in the dissimilar material joined body.
An Al-based metal, characterized in that the Al-based metal comprises a diffusion barrier layer that suppresses a reaction based on component diffusion between the Al-based metal joined body and the dissimilar material-joined body. Joints with dissimilar materials.
【請求項2】 前記拡散バリア層は、Ti,Pd及びP
tの少なくともいずれかを含有する請求項1記載のAl
系金属と異種材料との接合体。
2. The method according to claim 1, wherein the diffusion barrier layer comprises Ti, Pd and P.
2. The Al according to claim 1, containing at least one of t.
A joined body of a base metal and a different material.
【請求項3】 前記拡散バリア層は、Tiを主成分とす
る層、Pdを主成分とする層及びPtを主成分とする層
のうち少なくとも一層からなるものである請求項2記載
のAl系金属と異種材料との接合体。
3. The Al-based diffusion barrier layer according to claim 2, wherein the diffusion barrier layer comprises at least one of a layer mainly composed of Ti, a layer mainly composed of Pd, and a layer mainly composed of Pt. A joint of metal and dissimilar materials.
【請求項4】 前記拡散バリア層の厚さが2μm以上で
ある請求項1ないし3のいずれかに記載のAl系金属と
異種材料との接合体。
4. The joined body of an Al-based metal and a dissimilar material according to claim 1, wherein the thickness of the diffusion barrier layer is 2 μm or more.
【請求項5】 Alを主体に構成されたAl系金属被接
合体と、それとは異なる材質で構成された異種材料被接
合体とが、金属系接合層を介して互いに接合されるとと
もに、 その金属系接合層が、Ti又はTi合金で構成されて前
記Al系金属被接合体の側に配置されるTi系金属層
と、そのTi系金属層と前記異種材料被接合体との間に
形成されてそれらを互いに接合するろう材層とを含むこ
とを特徴とするAl系金属と異種材料との接合体。
5. An Al-based metal bonded body mainly composed of Al and a dissimilar material bonded body composed of a different material from each other are bonded to each other via a metal-based bonding layer. A metal-based bonding layer is formed of Ti or a Ti alloy, and is formed between the Ti-based metal layer disposed on the Al-based metal bonded body and the Ti-based metal bonded body. A joined body of an Al-based metal and a dissimilar material, characterized in that the joined body includes a brazing material layer that is joined to each other.
【請求項6】 前記異種材料被接合体は、Fe,Ni及
びCoの1種以上を主成分とする金属で構成されてお
り、前記Ti系金属層は前記Al系金属被接合体中のA
l成分と、前記異種材料被接合体中のFe,Ni及びC
o成分の1種以上とが、それらAl系金属被接合体と異
種材料被接合体との間での成分拡散に基づき反応するこ
とを抑制する拡散バリア層として機能するものである請
求項5記載のAl系金属と異種材料との接合体。
6. The dissimilar material bonded object is made of a metal containing at least one of Fe, Ni and Co as a main component, and the Ti-based metal layer is made of A in the Al-based metal bonded object.
l component, and Fe, Ni and C in the dissimilar material joined body.
6. The element according to claim 5, wherein at least one of the o components functions as a diffusion barrier layer that suppresses a reaction based on component diffusion between the Al-based metal joined body and the dissimilar material joined body. Of Al-based metal and dissimilar materials.
【請求項7】 前記異種材料被接合体はセラミックスに
より構成され、前記ろう材層はTiを含有するものであ
る請求項5記載のAl系金属と異種材料との接合体。
7. A joined body of an Al-based metal and a dissimilar material according to claim 5, wherein said dissimilar material joined body is made of ceramics, and said brazing material layer contains Ti.
【請求項8】 前記Ti系金属層を前記異種材料被接合
体と接合する前記ろう材層は、前記Al系金属被接合体
よりも融点の高い材質で構成され、 該Ti系金属層に対し前記Al系金属被接合体は、該A
l系金属被接合体よりも低融点の別のろう材層を介して
接合される請求項5ないし7のいずれかに記載の接合
体。
8. The brazing material layer for joining the Ti-based metal layer to the dissimilar material-joined body is made of a material having a higher melting point than the Al-based metal-joined body. The Al-based metal joined body is
The joined body according to any one of claims 5 to 7, wherein the joined body is joined via another brazing material layer having a lower melting point than the l-based metal joined body.
【請求項9】 前記Al系金属被接合体は、時効析出硬
化型Al合金で構成されている請求項1ないし8のいず
れかに記載の接合体。
9. The joined body according to claim 1, wherein said Al-based metal joined body is made of an aging precipitation hardening type Al alloy.
【請求項10】 Alを主体に構成されたAl系金属被
接合体と、Fe,Ni及びCoの1種以上を主成分とす
る金属からなる異種材料被接合体とを互いに接合する方
法であって、 前記異種材料被接合体の接合面に対し、前記Al系金属
被接合体中のAl成分と、前記異種材料被接合体中のF
e,Ni及びCo成分の1種以上とが、それらAl系金
属被接合体と異種材料被接合体との間での成分拡散に基
づき反応することを抑制するための拡散バリア層となる
べき拡散バリア用金属層を形成する拡散バリア用金属層
形成工程と、 その形成された拡散バリア用金属層に対し、前記Al系
金属被接合体を、前記異種材料被接合体とは反対側から
直接又は他層を介して間接的に接合する接合工程とを含
むことを特徴とするAl系金属と異種材料との接合体の
製造方法。
10. A method for bonding an Al-based metal bonded body mainly composed of Al and a heterogenous bonded body made of a metal mainly containing at least one of Fe, Ni and Co to each other. With respect to the joining surface of the dissimilar material joined object, the Al component in the Al-based metal joined object and the F component in the dissimilar material joined object
Diffusion to be a diffusion barrier layer for suppressing reaction of one or more of e, Ni and Co components based on component diffusion between the Al-based metal bonded body and the heterogeneous material bonded body. A diffusion barrier metal layer forming step of forming a barrier metal layer, and for the formed diffusion barrier metal layer, the Al-based metal bonded body is directly or directly connected to the heterogeneous material bonded body from the opposite side. A method of manufacturing a joined body of an Al-based metal and a dissimilar material, comprising a joining step of indirectly joining via another layer.
【請求項11】 Alを主体に構成されたAl系金属被
接合体と、それとは異なる材質で構成された異種材料被
接合体とを互いに接合する方法であって、 前記異種材料被接合体の被接合面にTi系金属層をろう
材により予めろう付け接合するろう付け工程と、 そのろう付けされたTi系金属層に対し前記Al系金属
被接合体を、前記異種材料被接合体とは反対側から直接
又は他層を介して間接的に接合する接合工程とを含むこ
とを特徴とするAl系金属と異種材料との接合体の製造
方法。
11. A method for joining an Al-based metal joined body mainly composed of Al and a dissimilar material joined body composed of a different material to each other, comprising: A brazing step of pre-brazing and joining the Ti-based metal layer to the surface to be joined with a brazing material, and the above-mentioned Al-based metal joined body with respect to the brazed Ti-based metal layer, A joining step of joining directly from the opposite side or indirectly via another layer, and a method for producing a joined body of an Al-based metal and a dissimilar material.
【請求項12】 前記異種材料被接合体と前記Ti系金
属層との間には、前記ろう付けによりろう材層が形成さ
れるとともに、前記Ti系金属層中のTi成分の一部が
そのろう材層中に拡散し、該ろう材層中においてその拡
散したTi成分を、前記Ti系金属層と前記異種材料被
接合体とを該ろう材層を介して接合するための活性金属
成分として機能させるようにした請求項11記載の接合
体の製造方法。
12. A brazing material layer is formed between the dissimilar material bonded object and the Ti-based metal layer by the brazing, and a part of a Ti component in the Ti-based metal layer is removed. The Ti component diffused in the brazing material layer, and the Ti component diffused in the brazing material layer is used as an active metal component for joining the Ti-based metal layer and the dissimilar material bonded body via the brazing material layer. The method for manufacturing a joined body according to claim 11, wherein the joined body is made to function.
【請求項13】 前記ろう付け工程において、前記Ti
系金属層は前記異種材料被接合体に対して、前記Al系
金属被接合体よりも高融点のろう材により接合され、 前記接合工程において、前記Al系金属被接合体は前記
Ti系金属層に対して、該Al系金属被接合体よりも低
融点のろう材により接合される請求項11又は12に記
載の接合体の製造方法。
13. The method according to claim 13, wherein in the brazing step, the Ti
The system-based metal layer is joined to the dissimilar material-to-be-joined by a brazing material having a higher melting point than the Al-based metal-to-be-joined. The method for manufacturing a joined body according to claim 11 or 12, wherein the joined body is joined with a brazing material having a lower melting point than the Al-based metal joined body.
【請求項14】 前記Al系金属被接合体は時効析出硬
化型Al合金で構成され、前記接合工程において所定の
接合温度に加熱されることにより溶体化処理される請求
項10ないし13のいずれかに記載の接合体の製造方
法。
14. The Al-based metal joined body is made of an aging precipitation hardening type Al alloy, and is subjected to a solution treatment by being heated to a predetermined joining temperature in the joining step. 3. The method for producing a joined body according to item 1.
JP12306597A 1996-05-22 1997-04-25 Joined body between al metal and dissimilar material, and its manufacture Pending JPH1052753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12306597A JPH1052753A (en) 1996-05-22 1997-04-25 Joined body between al metal and dissimilar material, and its manufacture

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-127335 1996-05-22
JP12733596 1996-05-22
JP12306597A JPH1052753A (en) 1996-05-22 1997-04-25 Joined body between al metal and dissimilar material, and its manufacture

Publications (1)

Publication Number Publication Date
JPH1052753A true JPH1052753A (en) 1998-02-24

Family

ID=26460080

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH1052753A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013123754A (en) * 2011-12-16 2013-06-24 Denso Corp Method for producing heat exchanger and heat exchanger produced by the production method
JP2015506839A (en) * 2011-11-25 2015-03-05 プランゼー エスエー Manufacturing method of high temperature resistant joint

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015506839A (en) * 2011-11-25 2015-03-05 プランゼー エスエー Manufacturing method of high temperature resistant joint
JP2013123754A (en) * 2011-12-16 2013-06-24 Denso Corp Method for producing heat exchanger and heat exchanger produced by the production method
US9789564B2 (en) 2011-12-16 2017-10-17 Uacj Corporation Manufacturing method of heat exchanger, and heat exchanger manufactured by such manufacturing method

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