JPH1051142A - Method for manufacturing multi-layer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacture a high-reliability multi-layer wiring board safely at a low cost, which has a high heat resistance and excellent adhesion between an interlayer insulating layer and a plated conductive layer. SOLUTION: According to this method, a plurality of wiring pattern layers 2 and an interlayer insulating layer 3 are provided at least on one surface of a substrate 1, a via hole 5 is provided for electrically connecting the wiring patterns 2 at a predetermined position of the interlayer insulating layer 3, and then a multi-layer wiring board is produced. At this time, in providing a via hole 5, the surface of the interlayer insulating layer 3 is roughened, a film pattern having a resistance against sandblasting is formed on the interlayer insulating layer 3, next, sandblasting treatment is given for selectively removing the interlayer insulating layer 3, a via hole 5 is formed, a film having the resistance against sandblasting is removed, thereafter, non-electrolytic plate treatment is applied, and a conductive layer is provided inside the via hole 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board, and more particularly, to a via hole for selectively removing an interlayer insulating layer to electrically connect a plurality of conductive patterns to each other. The present invention relates to a method for manufacturing a build-up type multilayer wiring board having the following.

[0002]

2. Description of the Related Art In recent years, with the advance of electronic technology, higher densities and higher speed of arithmetic functions have been advanced for electronic devices such as computers. There is no exception in multilayer wiring boards, and multilayer wiring boards capable of high-density wiring and high-density mounting are required, and in order to electrically connect an upper wiring pattern and a lower wiring pattern as such a multilayer wiring board. There is known a multilayer wiring board formed by a build-up method having via holes.

Conventionally, in a multilayer wiring board by this build-up method, a lower wiring pattern 22 made of a conductive substance is provided on a substrate 21 as shown in FIGS. 2 and 3, for example.
A ceramic paste composition having an insulating property is pattern-printed thereon by a screen printing method or the like, or a photosensitive resin layer (interlayer insulating layer) 23 is provided thereon. Then, the interlayer insulating layer 23 is exposed, developed, and etched by photolithography. And selectively removed to form via holes 25, and then subject the via holes 25 to electroless plating.
A conductive layer 26 is provided in the
5, a conductive layer 26 is integrally provided on the interlayer insulating layer 23,
Thereafter, an upper wiring pattern (not shown) is formed, and the upper wiring pattern and the lower wiring pattern 22 are electrically connected to each other.

However, in the case of a multilayer wiring board manufactured by the above-mentioned conventional method, a high-precision multilayer wiring board using a ceramic material as an interlayer insulating layer cannot be obtained. As shown in FIG. 2, the side wall of the via hole has a vertical rectangular cross-sectional shape, or side etching 30 by a developer tends to appear during photolithography as shown in FIG. In any of these cases, the via hole 2 is formed by electroless plating or the like.
In the case where the conductive layer 26 is provided in the inside 5 or on the interlayer insulating layer 23, as shown in FIGS. In order to prevent this, it is conceivable to increase the amount of electroless plating in order to prevent a short circuit. However, an increase in the weight of the substrate cannot be avoided, and it has been difficult to obtain a high-density, high-definition multilayer wiring board. The problem with the conventional method is that it lacks the heat resistance and high reliability that can replace ceramic materials.When used in ultra-high density multilayer wiring boards that directly attach semiconductor device chips to wiring boards,
The temperature rose to 100 ° C. or higher, and partially to about 150 ° C., and the interlayer insulating layer was deteriorated and decomposed, which was not practical.

Therefore, in order to form a highly reliable multilayer wiring board with a small amount of electroless plating, resin particles soluble in the oxidizing agent are contained in the photosensitive resin layer which is hardly soluble in the oxidizing agent. A technique in which the surface of an interlayer insulating layer is roughened by eluting soluble resin particles with an oxidizing agent to improve the adhesion between the interlayer insulating layer and the conductive layer is described in, for example, JP-A-6-215623. Have been. However, the method described in JP-A-6-215623 uses a strong acid such as chromic acid as an oxidizing agent for the surface roughening treatment of the interlayer insulating layer, and is therefore not preferable from the viewpoint of affecting the human body and the base material.

Further, in consideration of recent environmental considerations, a photosensitive resin which can use a dilute aqueous alkali solution as a developing solution has been required. For example, in Japanese Patent Application Laid-Open No. Hei 6-196856, a carboxyl group is contained in the photosensitive resin. Although those which can be developed by introducing a dilute alkaline aqueous solution have been proposed, these have a tendency to lower the insulation resistance value and heat resistance, and in some cases, have a problem of causing a short circuit, and have a high reliability. There is a problem that it is difficult to form a multilayer wiring board. When the above-mentioned photosensitive resin is used as the interlayer insulating layer, the temperature limit is about 140 ° C., and it is difficult to obtain a material having a large peel strength. There were problems such as peeling and chipping due to damage to the layer.

In addition, a heat-curable heat-resistant epoxy resin kneaded with an inorganic filler is used as an interlayer insulating layer.
A method of forming a via hole using a high-power laser such as a G laser or an excimer laser was also considered, but the apparatus was expensive, and the shape of the formed via hole became rectangular, so that a conductive layer was formed in the via hole. In some cases, poor conduction may occur, and the side wall of the via hole becomes smooth, resulting in poor adhesion of the conductive layer.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide excellent adhesion between an interlayer insulating layer and a plated conductive layer, high heat resistance, and environmental protection. Another object of the present invention is to provide an inexpensive and highly reliable method for manufacturing a multilayer wiring board.

[0009]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, the interlayer insulating layer has been selectively removed by sandblasting instead of the conventional photolithographic method. By forming a via hole, a strong adhesion strength can be obtained when a conductive layer is provided in the via hole by plating or the like, whereby an interlayer insulating layer or a conductive layer can be formed thin, and lightweight and reliable. It has been found that a multi-layer wiring board having a high level of resistance can be provided, and the present invention has been completed.

That is, the present invention has a plurality of wiring patterns and an interlayer insulating layer on at least one surface of a substrate,
In the method for manufacturing a multilayer wiring board, wherein via holes for electrically connecting the wiring patterns to each other are provided at predetermined positions of the interlayer insulating layer, the surface of the interlayer insulating layer is roughened when the via holes are provided. After that, a film having sandblast resistance is formed on the interlayer insulating layer by patterning,
Next, the interlayer insulating layer is selectively removed by performing a sand blasting process to form a via hole, and a film having a sand blast resistance is removed, and then a conductive film is formed in the via hole by performing an electroless plating process. An object of the present invention is to provide a method for producing a multilayer wiring board, characterized by providing layers.

[0011] The present invention also has a plurality of wiring patterns and an interlayer insulating layer on at least one surface of a substrate, wherein the wiring patterns are electrically connected to each other at predetermined positions of the interlayer insulating layer. In the method for manufacturing a multilayer wiring board provided with a conductive portion, the conductive portion is formed in a mortar shape in cross section,
Thereafter, a method of manufacturing a multilayer wiring board is provided, wherein a conductive material is buried in the conductive portion.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a method for manufacturing a multilayer wiring board according to the present invention will be described below with reference to FIG.

FIG. 1 is a process diagram illustrating a method for manufacturing a multilayer wiring board according to the present invention.

First, as shown in FIG. 1A, a wiring pattern 2 having a thickness of about 1 to 200 μm is formed on a substrate 1, and an interlayer insulating layer 3 is further provided thereon.

The substrate 1 is made of a glass-epoxy resin laminate,
Glass cloth-bismaleimide triazine resin laminate,
Insulating substrates such as glass cloth-polyimide laminate, paper-phenol resin laminate, paper-cresol resin laminate, paper-phenol novolak epoxy resin laminate, and paper-cresol novolak epoxy resin laminate are used. It is not limited to.

The wiring pattern 2 is made of, for example, Cu, Al, A
g, Au, Fe, Ni, Ti, etc.
It is provided by a known means. In the present invention, inexpensive Cu and Al, which have some elasticity and are not easily etched during sandblasting, can be preferably used.

The interlayer insulating layer 3 is formed by thoroughly dissolving, dispersing and kneading a material for forming an insulating layer with a three-roll mill, a ball mill, a sand mill or the like, and then performing screen printing, a bar coater, a roll coater, a reverse coater, a curtain on a substrate. It is applied to a dry film thickness of about 10 to 100 μm using a flow coater or the like. After application, after drying in a room temperature or hot air heater or an infrared heater, irradiate active energy rays with an ultra-high pressure mercury lamp, a chemical lamp or the like, or at a temperature of about 120 to 200 ° C. in a hot air heater or an infrared heater. It is provided on the substrate 1 by being cured by heating.

As a material for forming the interlayer insulating layer 3, a composition containing a binder resin, a heat or photopolymerization initiator or a crosslinking agent, and a heat or photopolymerizable monomer is generally used. When a group which can be polymerized or cross-linked by light or heat is present in the binder resin, the composition may be a composition excluding the monomer.

Examples of the binder resin include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, and benzyl acrylate. , Benzyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2
-Hydroxypropyl methacrylate, ethylene glycol monomethyl ether monoacrylate, ethylene glycol monomethyl ether methacrylate, ethylene glycol monoethyl ether acrylate, ethylene glycol monoethyl ether methacrylate, glycerol monoacrylate, glycerol monomethacrylate, dimethylaminoethyl acrylate, dimethyl methacrylate Aminoethyl ester, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, acrylamide, methacrylamide,
Acrylonitrile, those obtained by copolymerizing monomers selected from methacrylonitrile and the like, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate,
Pentaerythritol tetramethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, cardo epoxy diacrylate, cardo epoxy dimethacrylate, bisphenol A type epoxy resin, bisphenol F type epoxy resin , Bisphenol S type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, epoxidized resin by condensation of phenols with aromatic aldehyde having phenolic hydroxyl group, urea resin, melamine resin, tris- (2, Triazine resins such as 3-diepoxypropyl) isocyanurate, Dow Chemical Co., Ltd.
Resin, phenol resin, novolak resin, polyamide, polyimide and the like.
Above all, epoxy resins, phenolic resins, novolak resins, polyamides, and polyimides do not deteriorate or decompose even at a high temperature of about 150 to 200 ° C., have a tensile strength exceeding 1 kg in peel strength, and have heat resistance and chemical resistance. It is preferably used because of its excellent properties.

When the above monomers are copolymerized, acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, angelic acid, tiglic acid, 2-ethylacrylic acid, 3-propylacrylic acid, 3-isopropylacrylic acid Monohydroxyethyl succinate acrylate, monohydroxyethyl phthalate phthalate, monohydroxyethyl acrylate dihydrophthalate, monohydroxyethyl acrylate tetrahydrophthalate,
It can be copolymerized with a monomer having a carboxyl group such as hexahydrophthalic acid monohydroxyethyl acrylate, acrylic acid dimer, acrylic acid trimer, but the heat resistance, chemical resistance, insulation resistance value, etc. of the obtained resin decrease. Sometimes.

Examples of the heat or photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone,
2-dimethoxy-1,2-diphenylethan-1-one, 2-methyl-1- [4- (methylthio) phenyl]
-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-hydroxy-2-methyl-1-phenylpropane-1 -One, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 1-
[4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2,
4-diethylthioxanthone, 2-chlorothioquinton, 2,4-dimethylthioxanthone, 3,3-dimethyl-4-methoxybenzophenone, benzophenone,
-Chloro-4-propoxythioxanthone, 1- (4-
Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl)-
2-hydroxy-2-methylpropan-1-one, 4-
Benzoyl-4'-methyldimethyl sulfide, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, butyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate , 4-dimethylaminobenzoic acid-
2-isoamyl, 2,2-diethoxyacetophenone,
Benzyldimethyl ketal, benzyl-β-methoxyethyl acetal, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, methyl o-benzoylbenzoate, bis (4-dimethylaminophenyl) ketone, 4,4′-bisdiethylaminobenzophenone, 4,4′-dichlorobenzophenone, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether,
Benzoin-n-butyl ether, benzoin isobutyl ether, benzoin butyl ether, p-dimethylaminoacetophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzosuberone , Α, α-dichloro-4-phenoxyacetophenone, pentyl-4-dimethylaminobenzoate and the like. These heat or photopolymerization initiators are used in an amount of 0.1 to 4 in 100 parts by weight of a resin and a monomer having a property of being cured by heat or actinic light in the interlayer insulating layer.
It can be contained in the range of 0 parts by weight.

As the crosslinking agent, dicyandiamide;
2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1)]-
Ethyl-s-triazine, 2,4-diamino-6
[2'-ethyl-4-methylimidazolyl- (1)]-
Ethyl-s-triazine / isocyanuric acid adduct, 2-
Imidazole compounds such as methyl-imidazole, 1-phenyl-2-methyl-imidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; 2,4
-Diamino-6-vinyl-s-triazine-isocyanuric acid adduct, 2-vinyl-4,6-diamino-s-triazine, 2-methoxyethyl-4,6-diamine-s-
Triazine compounds such as triazine and 2-o-cyanophenyl-4,6-diamino-s-triazine;
4-dichlorophenyl) -1,1′-dimethylurea;
1,1′-isophorone-bis (3-methyl-3-hydroxyethylurea), 1,1′-tolylene-bis (3,
Urea compounds such as 3-dimethylurea); aromatic amine compounds such as 4,4′-diamino-diphenylmethane; triphenylsulfonium hexafluorophosphate;
Triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylselenium hexafluorophosphate, triphenylselenium hexafluoroantimonate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluorophosphate, 2,4-cyclopentadiene -1-yl-
Photo-cationic polymerization catalysts such as [(1-methylethyl) -benzene] -Fe-hexafluorophosphate (“Irgacure 261”; manufactured by Ciba-Geigy Corporation) and the like can be mentioned. Among them, dicyandiamide, 2,4-diamino-6- [2′-methylimidazolyl- (1)]-ethyl-s-triazine, 2-ethyl-4-methylimidazole, 1,1′-isophorone-bis ( 3-methyl-3-hydroxyethylurea), 1,
1′-tolylene-bis (3,3-dimethylurea), 3
-(3,4-Dichlorophenyl) -1,1′-dimethylurea and a commercial product of a cationic photopolymerization catalyst (“SP-1
50 "and" SP-170 "; both are Asahi Denka Co., Ltd.
), Etc.) are preferably used.

The heat or photopolymerizable monomer includes:
For example, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, ethylene glycol monomethyl ether acrylate, ethylene glycol monomethyl ether methacrylate, ethylene glycol monoethyl ether acrylate, ethylene glycol monoethyl ether methacrylate, glycerol acrylate, glycerol methacrylate, acrylamide, methacryl Acid amide, acrylonitrile, methacrylonitrile, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-
Monofunctional monomers such as ethylhexyl acrylate, 2-ethylhexyl methacrylate, benzyl acrylate, and benzyl methacrylate; and ethylene glycol diacrylate, ethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, and tetraethylene Glycol dimethacrylate, butylene glycol dimethacrylate, propylene glycol diacrylate, propylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate,
Tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate,
Multifunctional such as dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, cardo epoxy diacrylate, etc. Monomers can be used. When these heat or photopolymerizable monomers are added, the solid content of the photosensitive resin is 10%.
It is preferable to mix up to 50 parts by weight in 0 parts by weight.

Furthermore, dimensional stability, chemical resistance, heat resistance,
Silica, alumina, mica,
An inorganic filler such as talc or a heat-resistant organic coloring pigment such as phthalocyanine green may be added so that via holes formed after sandblasting can be easily identified.

The particle size of the filler is 0.01 to 500 μm.
m is selected within a range of about m, but when forming a conductive layer after sandblasting, a plurality of fillers having different particle sizes and shapes within the above-described particle size range to increase the adhesion strength between the interlayer insulating layer and the conductive layer. Is preferably contained selectively.

When the interlayer insulating layer 3 is applied by screen printing, dip coater, roll coater, spin coater, curtain coater, spray coater, etc., a leveling agent, an antifoaming agent, a solvent and the like are contained for uniform coating. It may be something.

As the solvent, methyl ethyl ketone,
Acetone, methyl isobutyl ketone, diethyl ketone,
Cyclohexanone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol monobenzyl ether, ethylene glycol monophenyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, Dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, 3-methoxybutyl acetate, 4-methoxybutyl acetate, 2-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-ethyl-3 -Methoxybutyl acetate, 2-
Ethoxybutyl acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, and the like, among which propylene glycol monomethyl ether,
Solvents such as propylene glycol monoethyl ether, propylene glycol monopropyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, and propylene glycol monomethyl ether acetate are highly safe for the human body and are applied. It is preferably used because it has good properties.

Further, a sulfur-containing organic compound can be added as a catalyst poison to the composition for forming the interlayer insulating layer 3.
Such sulfur-containing organic compounds include 2-mercaptobenzothiazole, dibenzothiazyl disulfide, N
-Tert-butyl-2-benzothiazolylsulfenamide, tetramethylthiuram disulfide and the like. By containing these catalyst poisons, a via hole is formed in the interlayer insulating layer 3 as described later, and then when the conductive layer is provided in the via hole by electroless plating, the conductive layer is formed on the interlayer insulating layer. Can be prevented from adhering.

Next, as shown in FIG. 1B, the surface of the interlayer insulating layer 3 is roughened. The method of surface roughening is not particularly limited, and conventionally known mechanical polishing, chemical polishing,
Alternatively, it can be performed by a combination of mechanical polishing and chemical polishing. As a mechanical polishing method, for example, a method of performing brushing polishing on the surface of the interlayer insulating layer 3 using a scotch bright or a brass brush, or a sand blasting treatment described later is exemplified. As a chemical polishing method, for example, when the material of the interlayer insulating layer 3 is an epoxy resin, a method of performing a surface treatment by performing an etching treatment in a potassium permanganate solution and the like can be given.

Next, as shown in FIG. 1C, a coating 4 having sandblast resistance is provided on the roughened interlayer insulating layer 3.

In providing the coating 4 having sand blast resistance, a method of printing a required pattern by screen printing, a bar coater, a roll coater, a reverse coater, a curtain flow coater, or the like, and a method in which a photosensitive resin having sand blast resistance is subjected to interlayer insulation. A method of obtaining a required pattern by photolithography after coating or applying a dry film to the layer 3 is given. When a photosensitive resin is used, after application or attachment, exposure is performed with an active energy ray through a negative mask using an ultra-high pressure mercury lamp, a chemical lamp, or the like, and development is performed using a spray gun, an immersion method, or the like. The developer is preferably water or an aqueous alkali solution. Examples of the alkali component used in the developer include hydroxides, carbonates, bicarbonates, phosphates, pyrophosphates of alkali metals such as lithium, sodium and potassium. , Benzylamine, primary amines such as butylamine, dimethylamine, secondary amines such as dibenzylamine, diethanolamine, tertiary amines such as trimethylamine, triethylamine and triethanolamine, cyclic amines such as morpholine, piperazine and pyridine , Ethylenediamine, polyamines such as hexamethylenediamine, tetraethylammonium hydroxide, trimethylbenzylammonium hydroxide, trimethylphenylbenzylammonium hydroxide, ammonium hydroxides such as choline, trimethyls Tetraalkylphosphonium hydroxide, diethyl methyl sulfonium hydroxide, sulfonium hydroxide such as dimethyl benzyl sulfonium hydroxide, other these buffers and the like.

The coating having the above sandblast resistance is as follows:
The material is not particularly limited as long as it can serve as a protective film for sandblasting. In particular, for example, unsaturated polyesters and unsaturated monomers as described in JP-A-55-103554 and light A photosensitive resin composition comprising a polymerization initiator;
No. 754, containing a photosensitive resin composition comprising polyvinyl alcohol and a diazo resin, a urethane (meth) acrylate oligomer, a water-soluble cellulose resin, a photopolymerization initiator, and a (meth) acrylate monomer. Can be mentioned,
Above all, a photosensitive resin containing a urethane (meth) acrylate oligomer, a water-soluble cellulose resin, a photopolymerization initiator, and a (meth) acrylate monomer is preferably used because of its excellent adhesion and flexibility to an interlayer insulating layer. it can. Further, the photosensitive resin used for forming the coating having the sandblast resistance may be in a dry film form.

After providing the coating 4 having sandblast resistance, for example, sandblasting is performed, and as shown in FIG. 1D, the interlayer insulating layer 3 is selectively removed to form a mortar-shaped via hole 5 in cross section. Form.

As the blast material used in the sand blasting process, fine particles having a particle size of about 0.1 to 150 μm, such as glass beads, alumina, silica, silicon carbide, and zirconium oxide, are used, and the blast pressure is 0.5 to 5 kg / cm ² . Sandblasting is performed by spraying in the range. The coating 4 having sandblast resistance has higher elasticity and flexibility than ordinary photosensitive resin, and has high wear resistance due to sandblasting, so that the coating 4 is worn before the sculpture of the desired depth is completed. Not at all.

According to the present invention, by making the shape of the via hole 5 into a mortar shape, unlike the conventional photolithographic method, the occurrence of side etching can be prevented, and the conductive material can be formed in a subsequent electroless plating process. The layer can be efficiently attached to the via hole side wall, the peel strength can be greatly improved, and a highly reliable multilayer wiring board in which disconnection and cracks are less likely to occur can be manufactured. Further, there is no need to use an oxidizing agent of a strong acid such as chromium or an acid, etc., which is environmentally safe.

After the sandblasting treatment, as shown in FIG. 1 (e), the sandblast-resistant coating film 4 is peeled off and removed with an aqueous solution of sodium hydroxide, potassium hydroxide, or an organic amine having a pH of about 12 to 14. You.

Next, as shown in FIG. 1F, an electroless plating process is performed to form a conductive layer 7 in the via hole 5. Examples of the composition of the electroless plating solution include copper sulfate / formaldehyde / EDTA / sodium hydroxide, and the like, and the substrate can be formed by immersing the substrate for about 10 minutes to 10 hours. Alternatively, the conductive paste composition can be formed by applying or filling a required portion by a screen printing method or the like.

When the catalyst poison is added to the interlayer insulating layer 3, the conductive layer 7 is formed only in the via hole 5, as shown in FIG.

Thereafter, an upper wiring pattern is newly formed on the interlayer insulating layer 3, and an interlayer insulating layer, a via hole, and a conductive layer are further formed thereon (all of which are not shown), thereby forming a multilayer wiring pattern. A plate can be formed.

In the present invention, the surface of the interlayer insulating layer 3 is roughened in advance, so that the thickness of the interlayer insulating layer 3 is made uniform, and the adhesion to the conductive layer 7 provided on this layer is finally achieved. The effect is excellent, the peel strength between the two can be increased, and the reliability of the product quality can be enhanced. This surface roughening can be performed by a puff process, a brush process, a belt sander process, or the like.
In a), the surface is preferably roughened in the range of 0.1 to 10 μm.

Further, if the surface roughening of the interlayer insulating layer 3 is performed, for example, after forming the via hole 5 and then peeling off the sandblast-resistant coating 4 from the interlayer insulating layer 3, the influence of the surface roughening treatment is reduced. The edge of the receiving via hole 5 may be chipped or deformed. However, in the present invention, since the roughening treatment of the interlayer insulating layer 3 has been completed before the formation of the via hole 5, such a problem does not occur. Absent.

Furthermore, if the surface of the interlayer insulating layer 3 is roughened, for example, after the via hole 5 is formed and the coating 4 having the anti-sandblasting property is peeled off from the interlayer insulating layer 3, sandblasting is performed on the interlayer insulating layer 3. Since the blast material is dissipated by the treatment, a cleaning step for removing the dissipated blast material is required before the conductive layer 7 is formed. In the present invention, after the surface of the interlayer insulating layer 3 is roughened, the blast material is removed. Even if the coating 4 having sandblast resistance is provided thereon in a dissipated state, the blast material is also peeled off when the coating 4 is peeled off. There is no particular need to provide them, and the process can be simplified.

In the above description, the sand blasting process is described with a via hole as an example for electrically connecting the wiring patterns of a plurality of layers to each other. As long as it forms a conductive portion for electrically connecting with each other, it is not particularly limited to a via hole, and for example, a groove-shaped one or a through hole (through hole) may be used.
Sandblasting can be performed in the same manner as in the via hole.

Further, a conductive material may be buried in the conductive portion formed by the sand blasting process by electrolytic plating or the like. In this case, the adhesion between the conductive material and the conductive portion is improved by the sand blasting process. Peel strength can be increased.

[0045]

Next, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.

(Examples 1 to 3 and Comparative Examples 1 to 3) As components for forming an interlayer insulating layer, each component was kneaded using a three-roll mill according to the composition shown in Table 1, and an ink-like composition was prepared. I got This ink-like composition was dried on a glass-epoxy resin laminated substrate having a thickness of 1 mm on which a copper wiring pattern had been formed in advance by using a 100-mesh / inch polyester screen to have a thickness of 50 μm after drying.
After screen printing, the coatings were cured by heating at 150 ° C. for 50 minutes for Examples 1 and 2, and for Example 3, the coating was pre-dried at 80 ° C. for 50 minutes, and an ultra-high pressure mercury lamp exposure machine “HTE102S” ( The whole surface was irradiated with ultraviolet rays at an exposure amount of 500 mJ / cm ² by using Hitec Co., Ltd., and further heated and cured at 150 ° C. for 50 minutes.

[0047]

[Table 1] Table 1 In addition, the brand name in Table 1 shows each following composition. -"N-673": o-cresol novolak type epoxy resin (manufactured by DIC Corporation)-"Epicoat 828": bisphenol A type epoxy resin (manufactured by Shell Chemical Co., Ltd.)-"TEPIC-SP": triglycidyl ether Isocyanurate (manufactured by Nissan Chemical Co., Ltd.) "TCR1025": triphenylmethane type epoxy acrylate anhydride adduct (acid value 100, diethylene glycol monomethyl ether acetate 25% by weight, swazole 1500 (described later) 10% by weight (Manufactured by Nippon Kayaku Co., Ltd.) "DPHA": dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd.) "TMPTA": trimethylolpropane triacrylate (manufactured by Nippon Kayaku Co., Ltd.) DICY ": dicyandiamide (epoxy curing agent) (manufactured by Nippon Carbide Co., Ltd.) "2MZ.A": 2-methylimidazole azine (epoxy curing agent) (manufactured by Shikoku Chemicals Co., Ltd.) "Irgacure 907": 2-methyl- [4- (methylthio)] phenyl-2-morpholino- 1-propane (manufactured by Ciba Geigy Corporation) "Kayacure DTEX": diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd.) "DPM": dipropylene glycol monomethyl ether (manufactured by Dow Chemical Company, Ltd.) "Swazol 1500": Solvent naphtha (Maruzen Petrochemical Co., Ltd.) "Diglycol acetate": Diethylene glycol monoethyl ether acetate (Daicel Chemical Co., Ltd.) "PGMAc": Propylene glycol monomethyl ether acetate (Dow Chemical)・ KS-66: Silicone oil・ Shin-Etsu Chemical Co., Ltd. ・ Modaflow: Leveling agent (Monsanto Co., Ltd.) ・ Lionol Green 2YS: Color pigment (Toyo Ink Mfg. Co., Ltd.) ・ Micro Ace P-4: Talc (Inorganic filler) (Nippon Talc Co., Ltd.) "Aerosil # 200": finely divided silica (Nippon Aerosil Co., Ltd.) "Barium sulfate B-31": Inorganic filler (Sakai Chemical Co., Ltd.) Surface average roughness (Ra) = 4μ by puffing
m, the interlayer insulating layer was roughened.

A photosensitive dry film “ORDYL BF-603” (Tokyo Ohka Kogyo Co., Ltd.) is formed on the roughened interlayer insulating layer as a film having sandblast resistance.
Was thermocompressed at 70 ° C. Then, through the required mask pattern, the above-mentioned ultra-high pressure mercury lamp exposure machine “HTE1
02S "(manufactured by Hitec Co., Ltd.)
irradiating ultraviolet radiation at an exposure amount of cm ^2, 30 ℃, 40 seconds at a 0.2% aqueous solution of sodium carbonate, 1.2 kg / cm ²
Spray development at a spray pressure of

Thereafter, the sand blast machine “SC-20”
2 "(manufactured by Fuji Seisakusho), sand blasting was performed at a blast pressure of 2.5 kg / cm ² for 6 minutes using silicon carbide having a particle size of 25 μm as an abrasive, and a 45 wt. By spraying at 2 ° C. for 2 minutes, the coating having sandblast resistance was peeled off.

After the film having the sandblast resistance is peeled off, the obtained substrate is subjected to desmearing according to the SHIPLEY circuposit 200 MLB process, and then the electroless plating solution “SHIPLEY positposit 250” (manufactured by Shipley Co., Ltd.) To form a conductive layer having a thickness of 25 μm.

In Comparative Examples 1 to 3, the film thickness after drying was 50 μm on a glass-epoxy resin laminated substrate having a thickness of 1 mm.
m after screen printing to 80 m
The substrate was pre-dried for 5 minutes and irradiated with ultraviolet light through a mask pattern at an exposure amount of 500 mJcm ² using an ultra-high pressure mercury lamp exposure machine “HTE102S” (manufactured by Hitec Co., Ltd.). Next, at 30 ° C., 1% aqueous solution of sodium carbonate for 40 seconds,
After spray-developing at a spray pressure of 1.2 kg / cm ² , the substrate was irradiated with ultraviolet rays of 5 J / cm ² and cured by heating at 150 ° C. for 50 minutes using the above-mentioned ultra-high pressure mercury lamp exposure machine. The electroless plating solution was immersed in the electroless plating solution to form a conductive layer having a thickness of 25 μm.

The obtained substrate was evaluated for via hole shape, undercut, insulation resistance, solder heat resistance, insulation resistance, peel strength, and surface hardness. Table 2 shows the results. <Evaluation method>: [Via hole shape] The substrate was cut, and the cross-sectional shape of the via hole was observed. [Undercut] With respect to the via hole of the cut substrate, the state of the via hole at the interface between the interlayer insulating layer and the wiring pattern was observed. [Solder Heat Resistance] After applying the flux, the photosensitive resin layer was repeatedly immersed in a 260 ° C. solder bath for 10 seconds five times, and the state was observed and evaluated according to the following criteria. (Evaluation Criteria) Good: No change was observed even after performing the solder bath five times. Poor: After the solder bath was performed once, peeling occurred in a part of the cured photosensitive resin layer. [Insulation resistance value] The obtained substrate was heated at 85 ° C, 90% humidity, and D
After exposure for 1000 hours under the condition of C100V, "High Resistance Meter" 43
39A "(manufactured by Hewlett-Packard Co., Ltd.).

> 10 ¹² : Insulation resistance value exceeding 1 × 10 ¹² Ω · cm <10 ¹¹ : Insulation resistance value less than 1 × 10 ¹¹ Ω · cm [Peel strength] According to JIS H 8646 It was measured.

[0054]

[Table 2] Table 2 Example 4 In Example 1, 10 parts by weight of 2-mercaptobenzothiazole was further added as a catalyst poison as a component for forming an interlayer insulating layer, and the mixture was kneaded using a three-roll mill to prepare an ink-like composition. Obtained. Using a 100 mesh / inch polyester screen, this ink-like composition was applied onto a glass-epoxy resin laminated substrate having a thickness of 1 mm on which a copper wiring pattern had been formed in advance so that the film thickness after drying was 25 μm. After the screen printing, via holes were formed in required portions of the interlayer insulating layer in the same manner as in Example 1 except that the sandblasting time was 3 minutes. Next, the obtained substrate is SHIPLEY.
After performing a desmear process according to the circuposit 200 MLB process, the electroless plating solution “SHIPL”
EY Cupoite 250 "(made by Shipley Co., Ltd.)
Electroless plating was performed by immersion for a time, and a conductive layer having a thickness of 25 μm could be filled and formed in the via hole portion. No copper adhesion or discoloration due to electroless plating was observed on the surface of the interlayer insulating layer, and an extremely flat surface was obtained.

Example 5 In Example 1, the ink-like composition was applied to a 1 mm-thick glass-epoxy resin laminated substrate on which a copper wiring pattern was formed in advance using a 100-mesh / inch polyester screen. After screen printing so that the film thickness after drying is 20 μm,
After heating and curing at 150 ° C. for 50 minutes to form an interlayer insulating layer, the interlayer insulating layer was roughened by puffing. Next, a photosensitive dry film “ORDYL BF-603” (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was thermally pressed at 70 ° C. as a coating having sandblast resistance. Then 2
Using a mask pattern capable of reproducing a line width of 0 μm pattern / 20 μm space, the above-mentioned ultra-high pressure mercury lamp exposure apparatus “HTE102S” (manufactured by Hitec Co., Ltd.)
Irradiate with ultraviolet light at an exposure of 00 mJ / cm ² ,
1.2k in 0.2% sodium carbonate aqueous solution for 40 seconds
Spray development was performed at a spray pressure of g / cm ² .

Thereafter, the coating having sand blast resistance was peeled off by spraying with a 4% by weight aqueous solution of sodium hydroxide at 50 ° C. for 1 minute.

After the film having the sandblast resistance is peeled off, the obtained substrate is subjected to desmearing according to the SHIPLEY circuposit 200 MLB process, and then the electroless plating solution “SHIPLEY CUPOSITE 250” (manufactured by Shipley Co., Ltd.) To form a conductive layer having a thickness of 5 μm. No chipping or peeling was observed in the interlayer insulating layer, and no conduction failure or short circuit due to disconnection was observed in the conduction portion.

Comparative Example 4 In Comparative Example 1, the ink-like composition was applied to a 1 mm thick glass-epoxy resin laminated substrate on which a copper wiring pattern had been formed in advance using a 100 mesh / inch polyester screen. After screen printing so that the film thickness after drying is 20 μm,
The coating film is preliminarily dried at 80 ° C. for 50 minutes, and the above-mentioned ultra-high pressure mercury lamp exposure machine “HTE102” is applied through a mask pattern capable of reproducing a line width of 20 μm pattern / 20 μm space.
S "(manufactured by Hi-Tech Co., Ltd.)
Ultraviolet light was irradiated at an exposure amount of ² . Next, 1.2 kg / cm ² at 30 ° C., 1% aqueous solution of sodium carbonate for 40 seconds.
Was spray-developed with the above spray pressure, but partial chipping was observed in the interlayer insulating layer. After irradiating with UV light of ² J / cm ² using the above-mentioned ultra-high pressure mercury lamp exposure machine, it is heated and cured at 150 ° C. for 50 minutes, and the obtained substrate is immersed in the above-mentioned electroless plating solution for 1 hour to be electroless. Although plating was performed to form a conductive layer having a thickness of 5 μm, short-circuiting was partially observed at portions other than the conductive portion.

[0059]

As described above in detail, according to the method of the present invention, it is possible to form a via hole shape particularly suitable for electroless plating, and to obtain the adhesion between the interlayer insulating layer and the conductive layer. This is advantageous in that a multilayer wiring board having excellent heat resistance, high heat resistance, and high reliability can be provided at low cost and environmentally safe.

[Brief description of the drawings]

FIG. 1 is a process explanatory view of a method for manufacturing a multilayer wiring board of the present invention.

FIG. 2 is an explanatory view showing a conventional method for manufacturing a multilayer wiring board.

FIG. 3 is an explanatory view showing a conventional method for manufacturing a multilayer wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 21 Substrate 2, 22 Wiring pattern 3, 23 Interlayer insulating layer 4 Coating with sandblast resistance 5, 25 Via hole 7, 26 Conductive layer 30 Side etching

Continuation of front page (72) Inventor Taisuke Shiroyama 150 Nakamurako, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture

Claims (8)

[Claims] 1. A semiconductor device comprising: a plurality of wiring patterns and an interlayer insulating layer on at least one surface of a substrate; and a via hole for electrically connecting the wiring patterns to each other at a predetermined position in the interlayer insulating layer. In the method for manufacturing a multilayer wiring board provided, in providing the via hole, after roughening the surface of the interlayer insulating layer, a film having a sandblast-resistant property is formed on the interlayer insulating layer by patterning, and then sandblasting is performed. After forming a via hole by selectively removing the interlayer insulating layer by applying, removing a film having anti-sandblasting properties, and then providing an electroless plating process to provide a conductive layer in the via hole A method for producing a multilayer wiring board. 2. The method for manufacturing a multilayer wiring board according to claim 1, wherein the surface of the interlayer insulating layer is roughened in a range of surface average roughness (Ra) = 0.1 to 10 μm. 3. The method for producing a multilayer wiring board according to claim 1, wherein the coating having sandblast resistance is a photosensitive resin. 4. A photosensitive resin containing a urethane (meth) acrylate oligomer, a water-soluble cellulose resin, a photopolymerization initiator, and a (meth) acrylate monomer, wherein the coating having sandblast resistance is used. The method for producing a multilayer wiring board according to any one of the above. 5. The method for producing a multilayer wiring board according to claim 1, wherein the interlayer insulating layer contains a sulfur-containing organic compound. 6. The method according to claim 1, wherein the interlayer insulating layer is at least one selected from an epoxy resin, a phenol resin, a novolak resin, a polyamide, and a polyimide. . 7. A substrate having a plurality of wiring patterns and an interlayer insulating layer on at least one surface of a substrate, and a conductive portion for electrically connecting the wiring patterns to each other at a predetermined position of the interlayer insulating layer. In the method for manufacturing a multilayer wiring board provided, when the conductive portion is provided, after roughening the surface of the interlayer insulating layer, a film having sandblast resistance is pattern-formed on the interlayer insulating layer, and then the interlayer insulating layer is formed. Is selectively removed to form a conductive portion in a mortar shape in cross section, and then a film having sand blast resistance is removed, and then the conductive portion is filled with a conductive material. Method. 8. The method for producing a multilayer wiring board according to claim 7, wherein the means for forming the conductive portion into a mortar shape in cross section is sandblasting.