JPH10338841A - Anisotropically conductive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an anisotropically conductive film improved in workability, the level of a crosslinking density and durability by dispersing conductive particles in an adhesive prepared by mixing an ethylene/ethyl acrylate copolymer as the principal component with a hydrocarbon resin as a tackifier in a specified ratio and pressing the mixture in the direction of thickness to impart thereto conductivity in the direction of thickness. SOLUTION: This film is prepared by dispersing conductive particles in an adhesive. The adhesive used is a heat- or photo-curable adhesive based on an ethylene/ethyl acrylate copolymer having a melt index (MFR) of 1-3,000. The content of the ethylene/ethyl acrylate of the copolymer is desirably 5-50 wt.%. The hydrocarbon resin added for the purpose of improving processability, laminatability, etc., may be any of natural and synthetic resins and is used in an amount of 1-200 pts.wt. per 100 pts.wt. copolymer. The conductive particles used are powders of metals such as copper or silver or resin powders coated therewith and are used in an amount of 0.1-15 vol.% based on the copolymer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of interposing circuits between opposing circuits, applying pressure and heating between the circuits to connect the circuits via conductive particles, and bonding and fixing the circuits. The present invention relates to an anisotropic conductive film that provides conductivity only in the thickness direction and is used for the purpose.

[0002]

2. Description of the Related Art Anisotropic conductive films are used for flexible printed circuit (FPC).
And TAB and IT formed on the glass substrate of the liquid crystal panel
It is used when an anisotropic conductive film is formed between various terminals, such as when connecting to an O terminal, thereby bonding and electrically connecting the terminals.

[0003] Anisotropic conductive films are generally obtained by dispersing conductive particles in an adhesive mainly composed of an epoxy or phenolic resin and a curing agent. One-component thermosetting type is becoming mainstream. In addition, in order to obtain stable connection reliability even under high temperature and high humidity, the bonding strength of the anisotropic conductive film is enhanced by various methods.

However, conventional anisotropic conductive films using epoxy or phenolic resins have poor moisture resistance and heat resistance, and have a problem in long-term durability.

An object of the present invention is to provide an anisotropic conductive film which has improved the above circumstances, has good workability, has a high crosslinking density, and has excellent durability.

[0006]

Means for Solving the Problems and Embodiments of the Invention In order to achieve the above object, the present invention comprises a method in which conductive particles are dispersed in an adhesive, and the pressure is applied in the thickness direction to thereby increase the thickness in the thickness direction. In the anisotropic conductive film provided with conductivity, the adhesive is mainly composed of an ethylene-ethyl acrylate copolymer, and a hydrocarbon resin is used as a tackifier in an amount of 200 parts by weight based on 100 parts by weight of the copolymer. Provided is an anisotropic conductive film, which is a heat or light curable adhesive containing not more than parts by weight.

[0007] The anisotropic conductive film of the present invention is a heat or light curable adhesive containing the above copolymer as a main component and a carbon number resin as an adhesive, and therefore has the following features. (1) Even after being held at a high temperature for a long time, the properties of the anisotropic conductive film are effectively exhibited and the durability is excellent. (2) Good repairability. (3) Good transparency. (4) Stable and high adhesiveness is exhibited as compared with conventional products. (5) By using a film made of the transparent polymer as a raw material, light transmittance at the time of electrode positioning is good,
Workability is good. (6) Conventional products such as epoxy resins required heating at 150 ° C. or higher, but according to the present invention, they can be cured and bonded at 130 ° C. or lower, and can be UV-curable. Further, curing adhesion at a lower temperature is also possible. (7) The conventionally used epoxy-based and phenol-based anisotropic conductive films have no tackiness, and the film is difficult to temporarily fix to the electrode due to the adhesive force, is easily peeled off, and has poor workability. Since the anisotropic conductive film has an extremely high adhesive strength at the time of temporary fixing, workability is good.

Hereinafter, the present invention will be described in more detail.
The anisotropic conductive film of the present invention is obtained by dispersing conductive particles in an adhesive. In this case, the adhesive preferably has a melt index (MFR) of 1 to 3.
A thermo- or photo-curable adhesive having an ethylene-ethyl acrylate copolymer as a main component and having a molecular weight of 000, more preferably 1 to 1000, and still more preferably 1 to 800 is used. Thereby, before the curing, the tackiness is increased, the workability is improved, and the cured product has an increased three-dimensional crosslink density, exhibits strong adhesive strength, and has improved moisture and heat resistance.

In this case, the content of ethyl acrylate in the ethylene-ethyl acrylate copolymer is preferably 5 to 50% by weight, particularly preferably 10 to 45% by weight. When the content of ethyl acrylate is lower than 5%, a sufficient degree of crosslinking cannot be obtained when crosslinking and curing at a high temperature. On the other hand, when the content exceeds 50% by weight, the softening temperature of the resin is lowered, and storage becomes difficult, which is a practical problem. It is.

[0010] To the anisotropic conductive film of the present invention, a hydrocarbon resin is added as a tackifier to the adhesive for the purpose of improving workability and bonding. In this case, the hydrocarbon resin to be added may be either a natural resin type or a synthetic resin type. Rosin, rosin derivatives, and terpene resins are preferably used in the natural resin system. For rosin, gum-based resins, tall oil-based resins, and wood-based resins can be used. As rosin derivatives, rosin is hydrogenated, heterogeneous,
Polymerized, esterified, metal-chlorinated ones can be used. As the terpene-based resin, terpene-based resins such as α-pinene and β-pinene, as well as terpene phenol resins can be used. Further, dammar, koval, and shellac may be used as other natural resins. On the other hand, in the case of synthetic resins, petroleum resins, phenol resins, and xylene resins are preferably used. As the petroleum resin, aliphatic petroleum resin, aromatic petroleum resin, alicyclic petroleum resin, copolymer petroleum resin, hydrogenated petroleum resin, pure monomer petroleum resin, and cumarone indene resin can be used. As the phenolic resin, an alkylphenol resin and a modified phenol resin can be used. As the xylene-based resin, a xylene resin or a modified xylene resin can be used.

The amount of the hydrocarbon resin is 200 parts by weight or less based on 100 parts by weight of the copolymer.
The amount is preferably 200 parts by weight, more preferably 5 to 150 parts by weight.

As the conductive particles used in the present invention, various kinds of conductive particles can be used as long as they are electrically good conductors. For example, metal powder such as copper, silver, and nickel, resin or ceramic powder coated with such a metal can be used. There is no particular limitation on the shape, and any shape such as a scale shape, a tree shape, a granular shape, and a pellet shape can be adopted.

In the present invention, the compounding amount of the conductive particles is
The content is preferably 0.1 to 15% by volume with respect to the copolymer, and the average particle size is preferably 0.1 to 100 μm. In this way, by defining the blending amount and the particle size, the conductive particles are condensed between adjacent circuits and short circuit is prevented.

For curing the anisotropic conductive film of the present invention, an organic peroxide or a photosensitizer can be used. When the curable adhesive is a thermosetting adhesive, Usually, when an organic peroxide is used and the curable adhesive is a photocurable adhesive, a photosensitizer is usually used.

As the organic peroxide added for curing the anisotropic conductive film of the present invention, any organic peroxide which can be decomposed at a temperature of 70 ° C. or more to generate radicals can be used. The decomposition temperature with a half-life of 10 hours is preferably 50 ° C. or higher, and is selected in consideration of the film formation temperature, preparation conditions, curing (bonding) temperature, heat resistance of the adherend, and storage stability.

Examples of usable organic peroxides include, for example, 2,5-dimethylhexane-2,5-dihydroperoxide and 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne- 3, di-t-butyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane,
Dicumyl peroxide, α, α′-bis (t-butylperoxyisopropyl) benzene, n-butyl-4,
4′-bis (t-butylperoxy) valerate, 1,
1-bis (t-butylperoxy) cyclohexane,
1,1-bis (t-butylperoxy) -3,3,5-
Trimethylcyclohexane, t-butylperoxybenzoate, benzoyl peroxide, t-butylperoxyacetate, methylethylketone peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, butylhydroperoxide, p-
Menthane hydroperoxide, p-chlorobenzoyl peroxide, hydroxyheptyl peroxide, chlorohexanone peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, cumyl peroxy octoate, succinic acid peroxide, acetyl peroxide Oxide, t-butylperoxy (2-ethylhexanoate), m-toluoyl peroxide, t-butylperoxyisobutyrate, 2,4-dichlorobenzoyl peroxide and the like. As organic peroxides,
At least one of these is used alone or as a mixture, and usually 0.1 to 1 part by weight based on 100 parts by weight of the copolymer.
0 parts by weight are used.

As the photosensitizer (photopolymerization initiator) added for curing the anisotropic conductive film of the present invention, a radical photopolymerization initiator is suitably used. Among the radical photopolymerization initiators, benzophenone, methyl o-benzoylbenzoate, 4-benzoyl-4′-methyldiphenylsulfide, isopropylthioxanthone, diethylthioxanthone, ethyl 4- (diethylamino) benzoate and the like are examples of hydrogen abstraction initiators. Can be used. Further, among the radical photopolymerization initiators, benzoin ether, benzoyl propyl ether, benzyl dimethyl ketal, and α-hydroxyalkylphenone are used as intramolecular cleavage initiators as 2-hydroxy-2-methyl- as α-hydroxyalkylphenone type.
1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, alkylphenylglyoxylate, diethoxyacetophenone, and 2-methyl-1- [4
-(Methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1-
(4-morpholinophenyl) butanone-1 and acylphosphine oxide are used. As the photosensitizer, at least one of them is used alone or in combination, and usually 0.1 to 10 parts by weight is added to 100 parts by weight of the copolymer.

It is preferable to add a silane coupling agent as an adhesion promoter to the anisotropic conductive film of the present invention. Examples of the silane coupling agent include vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy. Propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, vinyltrichlorosilane, γ-mercaptopropyltrimethoxysilane,
One or a mixture of two or more of γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane and the like are used. The addition amount of these silane coupling agents depends on the amount of the copolymer 100
Usually, 0.01 to 5 parts by weight with respect to parts by weight is sufficient.

The anisotropic conductive film of the present invention may further contain an epoxy group-containing compound as an adhesion promoter. Examples of the epoxy group-containing compound include triglycidyl tris (2-hydroxyethyl) isocyanurate,
Neopentyl glycol diglycidyl ether, 1,6
-Hexanediol diglycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, phenol (EO)
₅ glycidyl ether, pt-butylphenyl glycidyl ether, diglycidyl adipic ester, diglycidyl phthalate, glycidyl methacrylate, butyl glycidyl ether and the like. Also,
The same effect can be obtained by alloying a polymer containing an epoxy group. These epoxy group-containing compounds are used as one kind or as a mixture of two or more kinds, and the addition amount is usually 0.1 to 20 parts by weight based on 100 parts by weight of the copolymer.

In order to improve and control the physical properties (mechanical strength, adhesiveness, optical properties, heat resistance, moisture resistance, weather resistance, crosslinking speed, etc.) of the anisotropic conductive film of the present invention, And a compound having an acryloxy group, a methacryloxy group or an allyl group.

Acrylic or methacrylic acid derivatives such as esters and amides are the most common compounds for this purpose, and the ester residues include alkyl such as methyl, ethyl, dodecyl, stearyl, lauryl. In addition to the groups, cyclohexyl, tetrahydrofurfuryl, aminoethyl, 2-hydroxyethyl, 3-hydroxypropyl, 3-chloro-2-
And a hydroxypropyl group. Further, esters with polyfunctional alcohols such as ethylene glycol, triethylene glycol, polypropylene glycol, polyethylene glycol, trimethylolpropane, and pentaerythritol are also used. As the amide, diacetone acrylamide is typical. Examples of the polyfunctional crosslinking assistant include acrylic acid or methacrylic acid ester such as trimethylolpropane, pentaerythritol and glycerin, and compounds having an allyl group include triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, and diallyl isophthalate. , Diallyl maleate and the like. These compounds are used as one kind or a mixture of two or more kinds in an amount of usually 0.01 to 50 parts by weight, preferably 0.5 to 30 parts by weight, based on 100 parts by weight of the copolymer. If the amount is more than 50 parts by weight, workability and film formability during preparation of the adhesive may be reduced.

In addition to the above additives, an antioxidant, an ultraviolet absorber, a dye, a processing aid and the like may be used in the present invention as long as the object of the present invention is not hindered.

In order to obtain the anisotropic conductive film of the present invention, the above-mentioned crosslinking agent (organic peroxide and / or photosensitizer) which generates a radical by heat or light and, if necessary, a crosslinking aid An agent, a silane coupling agent and an epoxy group-containing compound are added to the above-mentioned copolymer as a main component, and further, conductive particles are blended.

The anisotropic conductive film of the present invention is prepared by uniformly mixing the above-mentioned copolymer with the above-mentioned additives and conductive particles, kneading the mixture with an extruder, a roll or the like, then calender roll, T-die extrusion, inflation. A film can be formed in a predetermined shape by a film forming method such as the above. At the time of film formation, embossing may be performed for the purpose of preventing blocking, facilitating pressure bonding with an adherend, and the like.

Further, each constituent component is a member (separator)
Can be uniformly dissolved in a solvent that has no effect on the surface, uniformly applied to the surface of the member (separator), and temporarily adhered to another adherend (polyimide, copper foil, etc.), and then cured by heat or light. it can.

The curing conditions for the anisotropic conductive film of the present invention depend on the type of organic peroxide used in the case of thermal curing, but are usually 70 to 170 ° C., preferably 7 to 170 ° C.
0 to 150 ° C., usually for 10 seconds to 120 minutes, preferably 2
0 seconds to 60 minutes.

In the case of photocuring using a photosensitizer,
Many light sources that emit light in the ultraviolet to visible range can be adopted as the light source, for example, ultra-high pressure, high pressure, low pressure mercury lamp, chemical lamp, xenon lamp, halogen lamp, mercury halogen lamp, carbon arc lamp, incandescent lamp, laser light, etc. Can be The irradiation time cannot be determined unconditionally depending on the type of lamp and the intensity of the light source, but is about several tens of seconds to several tens of minutes.

Further, in order to accelerate the curing, the laminated body is
It may be heated to 0 to 120 ° C. and irradiated with ultraviolet rays.

In this case, conductivity is generated in the pressing direction (film thickness direction) by the pressing at the time of the above-mentioned bonding, and this pressing force is appropriately selected and is usually 5 to 50 kg / cm ² , especially 10 to 50 kg / cm ² .
It is preferable to set the pressure to 30 kg / cm ² .

The anisotropic conductive film of the present invention has a conductivity of 10 Ω or less, particularly 5 Ω or less in the film thickness direction, and has a surface resistance of 10 ⁶ Ω or more, particularly 10 ⁹ Ω or more. Is preferred.

Further, the anisotropic conductive film of the present invention can be made of, for example, an FPC or TAB and an IT film on a liquid crystal panel glass substrate.
Used for the same applications as conventional anisotropic conductive films, such as used for connection between various terminals, such as connection with O-terminals. A crosslinked structure is formed during curing, and high adhesiveness, especially with metal Excellent adhesiveness, and excellent durability and heat resistance.

[0032]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

Example 1 Ethylene-ethyl acrylate copolymer (A709, manufactured by DuPont-Mitsui Polychemicals, Inc.)
Ethyl acrylate content 35% by weight) toluene 30
% Of a terpene resin (Alcon P-70 manufactured by Arakawa Chemical Co., Ltd.) and 1,1-bis (t) were added to 100 parts by weight of an ethylene-ethyl acrylate copolymer.
-Butylperoxy) -3,3,5-trimethylcyclohexane and 4 parts by weight of glycidyl methacrylate.
5 parts by weight, 0.5 parts by weight of Toshiba Silicone's γ-aminopropyltriethoxysilane TSL8331 were added,
Mix well. Further, 4% by volume of a spherical gold-plated resin particle AU205 (particle size: 5.0 μm) manufactured by Sekisui Fine Chemical Co., Ltd. was mixed with the ethylene-ethyl acrylate copolymer, and the mixture was applied to a separator, polyethylene terephthalate, using a comma coater. Thus, a film having a width of 2 mm and a thickness of 15 μm was obtained.

Example 2 Ethylene-ethyl acrylate copolymer (A704 manufactured by DuPont-Mitsui Polychemicals, Inc.)
Ethyl acrylate content 25% by weight) toluene 20
A weight% solution was prepared, and 10 parts by weight of a terpene resin (Alcon P-90 manufactured by Arakawa Chemical Co., Ltd.), 8.0 parts by weight of benzoyl peroxide, and glycidyl methacrylate based on 100 parts by weight of an ethylene-ethyl acrylate copolymer. And 0.5 part by weight of γ-aminopropyltriethoxysilane TSL8331 manufactured by Toshiba Silicone Co., Ltd. were added and mixed well. Spherical gold-plated resin particles AU205 (5.0 μm particle size) manufactured by Sekisui Fine Chemical Co., Ltd.
Was mixed with the ethylene-ethyl acrylate copolymer in a volume of 4% by volume, and the mixture was applied on a separator, polyethylene terephthalate, using a comma coater, and the width was 2 m.
m, and a film having a thickness of 15 μm was obtained.

Comparative Example 1 A 20% by weight solution of an epoxy-based thermosetting resin in toluene was prepared, and spherical gold-plated resin particles AU205 (5.0 μm in particle diameter) manufactured by Sekisui Fine Chemical Co., Ltd.
m) was mixed at 4% by volume with respect to the epoxy resin, and the mixture was applied on a separator, polyethylene terephthalate, using a bar coater to obtain a film having a width of 2 mm and a thickness of 15 μm.

Comparative Example 2 A 20% by weight solution of a phenolic thermosetting resin in toluene was prepared, and spherical gold-plated resin particles AU205 (particle size: 5.0, manufactured by Sekisui Fine Chemical Co., Ltd.) were prepared.
μm) was mixed at 4% by volume with respect to the phenolic resin, and the mixture was applied on a separator, polyethylene terephthalate, using a bar coater to obtain a film having a width of 2 mm and a thickness of 15 μm.

A film with a separator was placed on the electrode, and the sample was temporarily fixed by temporary pressure bonding for bonding the sample to the flexible printed circuit board and the transparent electrode glass.
Separate the separator and position it on the monitor.
Heat-press bonding was performed at 0 ° C. for 30 seconds, and the conduction resistance between the flexible printed board and the transparent electrode glass and the lateral insulation resistance were measured. The electrode after the adhesion was peeled off, and the film on the electrode was washed with a general-purpose organic solvent. The results are shown below.

Example 1 (Workability) The tackiness of the film to the electrode was improved because the film was tacky. (Characteristics immediately after bonding) Conduction resistance: 0.5 Ω or less Insulation resistance: 10 ⁹ Ω or more Adhesive force: 2.1 kg / inch or more (Measurement over time (after 85 ° C. × 1000 hours)) Conduction resistance: 1.0 Ω or less Insulation resistance : 10 ⁹ Ω or more Adhesive force: 2.3 kg / inch or more (Repairability) It could be easily washed with a cotton swab with a general-purpose solvent (ethanol). Example 2 (Workability) Since the film was tacky, the temporary fixing property of the film to the electrode was improved. (Characteristics immediately after bonding) Conduction resistance: 0.5 Ω or less Insulation resistance: 10 ⁹ Ω or more Adhesive force: 2.4 kg / inch or more (Measurement over time (after 85 ° C. × 1000 hours)) Conduction resistance: 1.0 Ω or less Insulation resistance : 10 ⁹ Ω or more Adhesive force: 2.5 kg / inch or more (Repairability) It could be easily washed with a cotton swab with a general-purpose solvent (ethanol). Comparative Example 1 (Workability) Since the film had no tackiness, the film was poor in temporary fixing property to the electrode, and it was necessary to firmly temporarily press-bond the film. (Characteristics immediately after bonding) Conduction resistance: 0.5 Ω or less Insulation resistance: 10 ⁹ Ω or more Adhesive force: 1.8 kg / inch or less (Measurement over time (after 85 ° C x 1000 hours)) Conduction resistance: 0.8 Ω or less Insulation resistance : 10 ⁹ Ω or more Adhesive force: 1.5 kg / inch or less (Repairability) It was wiped with a cotton swab several hundred times using a general-purpose solvent (hot toluene). Wiping with ethanol was not possible. Comparative Example 2 (Workability) Since the film had no tackiness, the film was poor in temporary fixing property to the electrode, and it was necessary to perform firm temporary pressure bonding. (Characteristics immediately after bonding) Conduction resistance: 0.5 Ω or less Insulation resistance: 10 ⁹ Ω or more Adhesive force: 1.3 kg / inch or less (Measurement over time (after 85 ° C. × 1000 hours)) Conduction resistance: 0.6 Ω or less Insulation resistance : 10 ⁹ Ω or more Adhesive force: 1.2 kg / inch or less (Repairability) Cleaning with a cotton swab using a general-purpose solvent (hot toluene) required several hundred wipings. Wiping with ethanol was not possible.

Example 3 Ethylene-ethyl acrylate copolymer (A709, manufactured by DuPont-Mitsui Polychemicals, Inc.)
Ethyl acrylate content 35% by weight) toluene 20
A 5% by weight solution was prepared, and 5 parts by weight of a terpene resin (Alcon P-70), 2.0 parts by weight of benzoylpropyl ether, and 10 parts by weight of neopentyl glycol dimethacrylate based on 100 parts by weight of an ethylene-ethyl acrylate copolymer. And 0.5 parts by weight of γ-aminopropyltriethoxysilane TSL8331 manufactured by Toshiba Silicone Co., Ltd. were added and mixed well. AU 205 similar to that of the first embodiment
Was mixed with the ethylene-ethyl acrylate copolymer in a volume of 4% by volume, and the mixture was applied on a separator, polyethylene terephthalate, using a comma coater, and the width was 2 m.
m, and a film having a thickness of 15 μm was obtained.

For bonding the sample to the flexible printed circuit board and the transparent electrode glass, a film with a separator was placed on the electrode and temporarily fixed by temporary pressure bonding.
The separator is peeled off and positioned on the monitor, the conduction resistance between the flexible printed circuit board and the transparent electrode glass,
The lateral insulation resistance was measured. The electrode after the adhesion was peeled off, and the film on the electrode was washed with a general-purpose organic solvent. The results are shown below.

Example 3 (Workability) The tackiness of the film to the electrode was improved because the film was tacky. (Characteristics immediately after bonding) Conduction resistance: 0.5 Ω or less Insulation resistance: 10 ⁹ Ω or more Adhesive force: 3.1 kg / inch or more (Measurement over time (after 85 ° C. × 1000 hours)) Conduction resistance: 1.0 Ω or less Insulation resistance : 10 ⁹ Ω or more Adhesive force: 3.2 kg / inch or more (Repairability) It could be easily washed with a cotton swab with a general-purpose solvent (ethanol).

[0042]

The anisotropic conductive film of the present invention has a high adhesive strength, an excellent temporary fixing property, a good workability, a good repairability, and a thickness even after being held at a high temperature for a long time. Direction conductivity, surface direction insulation, and high adhesive strength.
It has excellent durability.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01R 11/01 H01R 11/01 A H05K 3/32 H05K 3/32 B // G02F 1/1345 G02F 1/1345

Claims (7)

[Claims] 1. An anisotropic conductive film in which conductive particles are dispersed in an adhesive and which is provided with conductivity in the thickness direction by pressing in the thickness direction, wherein the adhesive is ethylene- A heat or photo-curable adhesive containing an ethyl acrylate copolymer as a main component and a hydrocarbon resin as a tackifier in an amount of 200 parts by weight or less based on 100 parts by weight of the copolymer. Anisotropic conductive film. 2. The anisotropic conductive film according to claim 1, wherein the copolymer has an ethyl acrylate content of 5 to 50% by weight. 3. The adhesive according to claim 1, wherein the adhesive contains an organic peroxide or a photosensitizer in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the copolymer. Anisotropic conductive film. 4. The adhesive comprises 0.01 to 5 parts by weight of a silane coupling agent and 0.1 to 20 parts by weight of an epoxy group-containing compound based on 100 parts by weight of the copolymer. The anisotropic conductive film according to claim 1, 2 or 3, wherein 5. The adhesive comprises 0.01 to 50 parts by weight of at least one selected from the group consisting of an acryloxy group-containing compound, a methacryloxy group-containing compound and an allyl group-containing compound, based on 100 parts by weight of the copolymer. The anisotropic conductive film according to any one of claims 1 to 4, wherein a part of the anisotropic conductive film is added. 6. The anisotropic conductive film according to claim 1, wherein the conductive particles are contained in an amount of 0.1 to 15% by volume with respect to the copolymer. . 7. The conductive particles have a particle size of 0.1 to 100.
The anisotropic conductive film according to any one of claims 1 to 6, wherein the thickness is μm.