JPH10333322A - Photosensitive electrically conductive paste and production of electrode for plasma display - Google Patents
Photosensitive electrically conductive paste and production of electrode for plasma displayInfo
- Publication number
- JPH10333322A JPH10333322A JP13701397A JP13701397A JPH10333322A JP H10333322 A JPH10333322 A JP H10333322A JP 13701397 A JP13701397 A JP 13701397A JP 13701397 A JP13701397 A JP 13701397A JP H10333322 A JPH10333322 A JP H10333322A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- weight
- metal
- conductive paste
- fine particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 9
- 229910052742 iron Inorganic materials 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010419 fine particle Substances 0.000 claims description 52
- 239000011521 glass Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 13
- 229910044991 metal oxide Inorganic materials 0.000 claims description 9
- 150000004706 metal oxides Chemical class 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 230000009477 glass transition Effects 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 2
- 230000000638 stimulation Effects 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 abstract description 5
- 239000002923 metal particle Substances 0.000 abstract description 5
- 230000007794 irritation Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 23
- 238000010304 firing Methods 0.000 description 23
- -1 aromatic diazo compounds Chemical class 0.000 description 20
- 239000000975 dye Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 239000007864 aqueous solution Substances 0.000 description 10
- 238000011161 development Methods 0.000 description 9
- 230000018109 developmental process Effects 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 7
- 238000007792 addition Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000003999 initiator Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical group CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 150000002923 oximes Chemical class 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000000987 azo dye Substances 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- MWGATWIBSKHFMR-UHFFFAOYSA-N 2-anilinoethanol Chemical compound OCCNC1=CC=CC=C1 MWGATWIBSKHFMR-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
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- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
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- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
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- 125000003277 amino group Chemical group 0.000 description 2
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- 239000012298 atmosphere Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 2
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 2
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- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 239000006089 photosensitive glass Substances 0.000 description 2
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- 239000011148 porous material Substances 0.000 description 2
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 2
- 229910001950 potassium oxide Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
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- 150000003852 triazoles Chemical class 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000001018 xanthene dye Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Glass Compositions (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイの電極作製およびそれに用いる感光性ペーストに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the preparation of electrodes for a plasma display and a photosensitive paste used therefor.
【0002】[0002]
【従来の技術】プラズマディスプレイパネル(PDP)
は液晶パネルに比べて高速の表示が可能であり、かつ大
型化が容易であることから、OA機器および広報表示装
置などの分野に浸透している。また、高品位テレビジョ
ンの分野などでの進展が非常に期待されている。2. Description of the Related Art Plasma display panels (PDPs)
Since they can display at a higher speed than a liquid crystal panel and can be easily made larger, they have permeated OA equipment and public information display devices. Further, progress in the field of high-definition television is highly expected.
【0003】このような用途の拡大にともなって、繊細
で多数の表示セルを有するカラーPDPが注目されてい
る。PDPは、前面板と背面板の2枚のガラス基板の間
に作られた僅かな隙間を放電空間とし、アノードおよび
カソード電極間にプラズマ放電を生じさせ、放電空間内
に封入されているガスから発生した紫外線を、放電空間
内に設けた蛍光体にあてて発光させることにより表示を
行うものである。この場合、電極は前面板と背面板にそ
れぞれストライプ状に配置され、複数本の電極が平行に
あり、前面板の電極と背面板の電極は僅かの間隙を介し
て対抗し、かつ互いに直行するように形成される。PD
Pの中で、蛍光体によるカラー表示に適した3電極構造
の面放電型PDPは、互いに平行に隣接した一対の表示
電極からなる複数の電極対と、各電極対と直行する複数
のアドレス電極とを有する。ただし、背面板には光のク
ロストークを防ぎ、放電空間を確保するための隔壁が、
電極間のスペースに形成される。With the expansion of such applications, attention has been paid to color PDPs having delicate and many display cells. PDPs use a small gap formed between two glass substrates, a front panel and a rear panel, as a discharge space to generate a plasma discharge between an anode and a cathode electrode. The display is performed by causing the generated ultraviolet light to be emitted to a phosphor provided in the discharge space to emit light. In this case, the electrodes are arranged in stripes on the front plate and the back plate respectively, a plurality of electrodes are parallel, the electrodes on the front plate and the electrodes on the back plate oppose each other with a slight gap, and are perpendicular to each other. It is formed as follows. PD
Among the P, a surface discharge type PDP having a three-electrode structure suitable for color display using a phosphor includes a plurality of pairs of display electrodes adjacent to each other in parallel and a plurality of address electrodes orthogonal to each pair of electrodes. And However, the rear plate has barriers to prevent light crosstalk and secure discharge space.
It is formed in the space between the electrodes.
【0004】上記の電極のうち前面板の電極には、表示
画面のコントラストを向上させるために黒色化する技術
が要求されている。例えば、特開昭61−176035
号公報、特開平4−272634号公報では、黒色化し
た銀ペーストをガラス基板に印刷法でパターン形成する
方法が提案されている。印刷法では、電極パターンに対
応する印刷マスクを用いてガラス基板上に銀ペーストな
どの導電ペーストを印刷した後焼成して電極パターンが
完成する。しかしながら、スクリーン印刷法ではマスク
パターン精度、スクイーズ硬さ、印刷速度、分散性の最
適化を図っても電極パターンの幅を60μm以下に細く
することができず、ファインパターン化には限界があっ
た。また、スクリーン印刷法では、印刷マスクの精度
は、マスク製版の精度に依存するので印刷マスクが大き
くなるとマスクパターンの寸法誤差が大きくなってしま
う。このため30インチ以上の大面積のPDPの場合
に、高精細のPDP作製がますます技術的に困難となっ
ている。[0004] Among the above-mentioned electrodes, for the electrodes on the front plate, there is a demand for a technique for blackening to improve the contrast of the display screen. For example, JP-A-61-176035
In Japanese Patent Application Laid-Open No. Hei 4-272634, a method is proposed in which a blackened silver paste is patterned on a glass substrate by a printing method. In the printing method, a conductive paste such as a silver paste is printed on a glass substrate using a print mask corresponding to the electrode pattern, and then fired to complete the electrode pattern. However, in the screen printing method, even if the mask pattern accuracy, squeeze hardness, printing speed, and dispersibility are optimized, the width of the electrode pattern cannot be reduced to 60 μm or less, and there is a limit in forming a fine pattern. . Further, in the screen printing method, since the accuracy of the print mask depends on the accuracy of the mask plate making, the size error of the mask pattern increases when the size of the print mask increases. Therefore, in the case of a PDP having a large area of 30 inches or more, it is increasingly technically difficult to produce a high-definition PDP.
【0005】また、この銀ペーストの黒色化には、銀に
鉄、クロム、ニッケル、ルテニウムなどの金属酸化物を
銀と等量以上混合する方法が採られている。しかし、こ
の方法では電極の抵抗値がかなり上がってしまうため、
電極の厚膜化や、黒電極と通常の白い電極との2層構造
化が必須となってくる。電極の厚膜化では電極の上に印
刷する誘電体層の表面平坦性が保証できなくなり、2層
構造では工程が複雑になるという問題があった。In order to blacken the silver paste, a method is used in which silver is mixed with a metal oxide such as iron, chromium, nickel, ruthenium or the like in an equal amount or more with silver. However, this method significantly increases the resistance of the electrodes,
It is necessary to increase the thickness of the electrode and to form a two-layer structure of a black electrode and a normal white electrode. When the thickness of the electrode is increased, the surface flatness of the dielectric layer printed on the electrode cannot be guaranteed, and the two-layer structure has a problem that the process becomes complicated.
【0006】[0006]
【発明が解決しようとする課題】本発明は、抵抗値が低
く、かつ、黒色度の高いプラズマディスプレイまたはプ
ラズマアドレス液晶ディスプレイ用の黒色の電極を形成
することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to form a black electrode for a plasma display or a plasma addressed liquid crystal display having a low resistance value and a high blackness.
【0007】[0007]
【課題を解決するための手段】本発明の目的は、導電性
の金属微粒子と感光性化合物を含有する有機成分からな
る感光性導電ペーストであって、導電性の金属微粒子中
にRu、Cr、Fe、Co、Mn、Cuの群から選ばれ
た少なくとも1種の金属またはその酸化物を0.5〜5
重量%含有し、かつ、このペーストを基板に5〜30μ
mの厚みで塗布し、焼成した時の色の刺激値Yが1〜3
0の範囲であることを特徴とする感光性導電ペーストに
よって達成される。An object of the present invention is to provide a photosensitive conductive paste comprising conductive metal fine particles and an organic component containing a photosensitive compound, wherein Ru, Cr, and the like are contained in the conductive metal fine particles. At least one metal selected from the group consisting of Fe, Co, Mn, and Cu or an oxide thereof at 0.5 to 5
% Of the paste and 5 to 30 μm of this paste on the substrate.
m, and the color stimulus value Y when fired is 1-3
This is achieved by a photosensitive conductive paste characterized by being in the range of 0.
【0008】また、本発明の目的は、Ru、Cr、F
e、Co、Mn、Cuの群から選ばれた少なくとも1種
の金属またはその酸化物を0.5〜5重量%含有する導
電性の金属を含む導電ペーストを基板上に塗布し、焼成
して、厚み5〜30μm、色の刺激値Yが1〜30の電
極を形成することを特徴とするプラズマディスプレイ用
電極の製造方法よって達成される。Another object of the present invention is to provide Ru, Cr, F
e, a conductive paste containing a conductive metal containing 0.5 to 5% by weight of at least one metal selected from the group consisting of Co, Mn, and Cu or an oxide thereof is applied to the substrate and fired. And a thickness of 5 to 30 μm, and a color stimulus value Y of 1 to 30 is formed.
【0009】[0009]
【発明の実施の形態】本発明の電極は、抵抗値が低く、
かつ、表示画面のコントラストを向上させるために十分
なほど黒色化するために、厚み5〜30μmで、色の刺
激値Yが1〜30であることが重要である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The electrode of the present invention has a low resistance value,
In addition, it is important that the color stimulus value Y is 1 to 30 with a thickness of 5 to 30 μm so that the display screen is sufficiently blackened to improve the contrast of the display screen.
【0010】光源色の3刺激値刺XYZおよびそれらか
ら求められる色度座標x、y、zは、JIS(日本工業
規格)Z 8722の6.2(測定値の付記事項)、J
ISZ 8717の8.2(測定値の付記事項の表示)
の6.2(測定値の付記事項)、JIS Z 8701
(色の表示方法−XYZ表色系及びXYZ表色系)に規
定される方法で求めることができる。The tristimulus value XYZ of the light source color and the chromaticity coordinates x, y, z obtained therefrom are described in 6.2 of JIS (Japanese Industrial Standards) Z 8722 (additional item of measured value), J
8.2 of ISZ 8717 (Display of annex to measured values)
6.2 (Additions to the measured values), JIS Z8701
(Color display method-XYZ color system and XYZ color system).
【0011】本発明は感光性導電ペースト中のAg、A
l、Ni、Au、Pd、Ptなどの導電性の金属微粒子
(金属群A)中に、Ru、Cr、Fe、Co、Mn、C
uなどの金属(金属群B)またはその金属酸化物を添
加、または被覆させることにより金属微粒子の黒色化を
はかり、黒色電極パターンを形成可能にすることを特徴
とする。The present invention relates to a method for producing Ag, A in a photosensitive conductive paste.
1, Ru, Cr, Fe, Co, Mn, and C in conductive fine metal particles (metal group A) such as 1, Ni, Au, Pd, and Pt.
By adding or coating a metal such as u (metal group B) or a metal oxide thereof, the metal fine particles are blackened, and a black electrode pattern can be formed.
【0012】この際に用いる黒色化する金属として、R
u、Cr、Fe、Co、Mn、Cu、Niの金属または
その酸化物の内、少なくとも1種、好ましくは3種以上
を含むことによって、黒色化が可能になる。特に、Ru
の酸化物をそれぞれ0.5〜5重量%含有することによ
って、黒色パターンを形成できる。また黒色に着色する
ために、金属群Aの金属微粒子に金属群Bの金属または
金属酸化物を被覆してもよい。The blackening metal used at this time is R
By including at least one, and preferably three or more of the metals of u, Cr, Fe, Co, Mn, Cu, and Ni or oxides thereof, blackening is possible. In particular, Ru
The black pattern can be formed by containing 0.5 to 5% by weight of each of the above oxides. In order to color black, the metal fine particles of the metal group A may be coated with a metal or a metal oxide of the metal group B.
【0013】金属群Aの金属微粒子表面に金属群Bの金
属または金属酸化物を化学メッキしたのち、400〜5
00℃で30分〜数時間焼成することにより、微粒子の
黒色化が可能となる。具体的には、所望の金属塩または
金属錯体の水溶液に金属群Aの微粒子を分散させてお
き、この分散剤に還元剤を添加して、水溶液に溶解して
いた金属を析出させ、その後焼成することにより析出し
た金属を酸化し、黒色とする。After the metal or metal oxide of metal group B is chemically plated on the surface of the fine metal particles of metal group A, 400 to 5
By baking at 00 ° C. for 30 minutes to several hours, blackening of the fine particles becomes possible. Specifically, the fine particles of the metal group A are dispersed in an aqueous solution of a desired metal salt or metal complex, and a reducing agent is added to the dispersant to precipitate the metal dissolved in the aqueous solution, followed by firing. By doing so, the precipitated metal is oxidized to black.
【0014】焼成することによって、金属酸化物の添加
量が少ない場合は、金属群Aの微粒子表面に金属酸化物
の粉末が均一に、点々と付着する。添加量が多い場合は
均一に被覆され、薄膜が形成される。この際、用いる金
属微粒子としては、平均粒径が0.5〜5μmであるこ
とが被覆の容易さから好ましい。When the amount of the metal oxide added is small by firing, the metal oxide powder adheres uniformly and to the surface of the fine particles of the metal group A. When the amount of addition is large, it is uniformly coated and a thin film is formed. At this time, the metal fine particles used preferably have an average particle size of 0.5 to 5 μm from the viewpoint of ease of coating.
【0015】用いる金属塩または金属錯体は上記金属群
Bの塩または錯体であり、水溶性であれば特に限定しな
いが、たとえばハロゲン化物、シアン化物、硫酸塩、硝
酸塩、アンミン錯体、ニトロシル錯体、カルボニル錯
体、アクア錯体が好ましい。特に、たとえばRuの場
合、2RuCl2(OH)・7NH3・3H2O、RuO2
(NH3)2(OH)2、Na2RuO4、K2RuO4、R
b2RuO4、Cs2RuO4、(NH4)2RuO4、Mg2
RuO4、Ca2RuO4、Sr2RuO4、Ba2Ru
O4、Ag2RuO4、Ru(NO)Cl2・H2O、Ru
(NO)Br2・H2O、Ru(NO)I3が好ましい。The metal salt or metal complex to be used is a salt or complex of the above-mentioned metal group B, and is not particularly limited as long as it is water-soluble. For example, halide, cyanide, sulfate, nitrate, ammine complex, nitrosyl complex, carbonyl complex Complexes and aqua complexes are preferred. In particular, for example, in the case of Ru, 2RuCl 2 (OH) .7NH 3 .3H 2 O, RuO 2
(NH 3 ) 2 (OH) 2 , Na 2 RuO 4 , K 2 RuO 4 , R
b 2 RuO 4, Cs 2 RuO 4, (NH 4) 2 RuO 4, Mg 2
RuO 4 , Ca 2 RuO 4 , Sr 2 RuO 4 , Ba 2 Ru
O 4 , Ag 2 RuO 4 , Ru (NO) Cl 2 .H 2 O, Ru
(NO) Br 2 .H 2 O and Ru (NO) I 3 are preferred.
【0016】被覆する金属群Bの金属または金属酸化物
は、金属群Aの微粒子量の0.5〜5重量%であること
が、黒色度、パターン形成性、抵抗値、および焼結性の
点で優れていることから重要である。0.5重量%より
小さいと、白色に近づきY値が30以上になるため、コ
ントラスト向上に効果がない。5重量%より大きいと、
焼結性が低下し抵抗値が大きくなるので好ましくない。
また、黒色度が強くなりすぎて、紫外線が下部まで到達
しなくなり、パターン形成性が低下するので好ましくな
い。The metal or metal oxide of the metal group B to be coated is 0.5 to 5% by weight based on the amount of the fine particles of the metal group A, and the blackness, the pattern forming property, the resistance value and the sintering property are determined. This is important because it is excellent in terms of point. If it is less than 0.5% by weight, the color becomes closer to white and the Y value becomes 30 or more, so that there is no effect in improving the contrast. If it is greater than 5% by weight,
It is not preferable because the sinterability decreases and the resistance value increases.
Further, the blackness becomes too strong, so that the ultraviolet rays do not reach the lower portion, and the pattern formability decreases, which is not preferable.
【0017】金属群Aの導電性金属微粒子は理論抵抗値
の小さいものが良く、Ag、Al、Ni、Au、Pd、
Ptなどが用いられるが、コスト面からAg、Al、N
iを用いることが好ましい。It is preferable that the conductive metal fine particles of the metal group A have a small theoretical resistance value, such as Ag, Al, Ni, Au, Pd,
Pt or the like is used, but Ag, Al, N
It is preferable to use i.
【0018】本発明で用いられる導電性金属微粒子の形
状は、特に限定はないが、より緻密な導体膜を形成した
方が抵抗が低くなるのでタップ密度の大きな粒状または
球状の粒子が好ましい。これらのタップ密度は2g/c
m3以上であることが望ましい。金属微粒子の平均粒子
径は、作製しようとするパターンの形状を考慮して選ば
れるが、0.1〜5μmのものがパターン形成性を良好
に保ち、電極表面を平滑にかつラインエッジをストレー
トにするために好ましく用いられる。0.1μm以下で
は粒子と粒子の間隙が入り組んでいるため、露光した光
がガラス基板まで到達せずパターン形成が不可能にな
る。また5μm以上ではパターン形成が可能ではある
が、粒子が粗すぎて電極膜の平坦性が保てず、さらには
粒子間の距離が離れるため焼成後に断線するという問題
が発生する。より好ましい粒径としては1.5〜3μm
である。The shape of the conductive metal fine particles used in the present invention is not particularly limited. However, it is preferable to form granular or spherical particles having a large tap density since a denser conductive film has a lower resistance. These tap densities are 2g / c
Desirably, it is at least m 3 . The average particle size of the metal fine particles is selected in consideration of the shape of the pattern to be produced, but those having a diameter of 0.1 to 5 μm maintain good pattern formability, and have a smooth electrode surface and straight line edges. It is preferably used for When the thickness is 0.1 μm or less, since the gap between the particles is intricate, the exposed light does not reach the glass substrate, and pattern formation becomes impossible. If the thickness is 5 μm or more, a pattern can be formed, but the particles are too coarse to maintain the flatness of the electrode film, and furthermore, the distance between the particles is so large that there is a problem of disconnection after firing. A more preferred particle size is 1.5 to 3 μm
It is.
【0019】感光性導電ペースト中には、基板との接着
性を高めるためにガラス微粒子(ガラスフリット)を1
0重量%以下の範囲で添加することができる。ガラス微
粒子を添加しなくても電極パターンは基板に密着してい
るが、接着力が弱く振動、衝撃等で剥離しやすくなる。
特に、ガラス基板などの低温焼成基板では600℃以下
で焼成するため金属微粒子は完全に焼結せず、密着力が
不足する。ガラス微粒子には焼結助剤として効果があ
り、また、電極と基板界面での接着力を高める効果もあ
る。しかし、ガラス微粒子の添加量が10重量%を越え
ると、接着力がすでに十分で変化しないのに対し、抵抗
値のみが上昇するので好ましくない。10重量%以下で
は接着力はガラス微粒子の添加量に比例して強くなり、
比抵抗値もガラス微粒子を添加しないときの5倍以下で
あり実用に耐えうる。より好ましくは0.5〜3重量%
である。The photosensitive conductive paste contains one or more glass fine particles (glass frit) in order to enhance the adhesion to the substrate.
It can be added in a range of 0% by weight or less. Even without the addition of glass particles, the electrode pattern is in close contact with the substrate, but has a weak adhesive force and is easily peeled off by vibration, impact, or the like.
In particular, a low-temperature fired substrate such as a glass substrate is fired at a temperature of 600 ° C. or lower, so that the metal fine particles do not sinter completely, resulting in insufficient adhesion. The glass fine particles have an effect as a sintering aid, and also have an effect of increasing the adhesive force at the interface between the electrode and the substrate. However, if the addition amount of the glass fine particles exceeds 10% by weight, the adhesive force is already sufficient and does not change, but only the resistance value increases, which is not preferable. At less than 10% by weight, the adhesive strength increases in proportion to the amount of the added glass particles,
The specific resistance value is also 5 times or less that when no glass fine particles are added, and can be practically used. More preferably 0.5 to 3% by weight
It is.
【0020】ガラス微粒子の熱軟化点は焼成温度以下で
ある必要がある。上記の効果を発揮するためには焼成温
度より0〜100℃低いと最適である。ガラス基板上で
の焼成温度は540〜620℃であるので、ガラス微粒
子の熱軟化点は470〜600℃が好ましい。熱軟化点
が600℃以上であるとガラス微粒子は溶融しないので
添加する効果がみられない。470℃以下ではガラス微
粒子が早く軟化するためガラス微粒子が基板界面に分離
し、焼結助剤としての効果が失われるので好ましくな
い。より好ましくは500〜550℃である。The thermal softening point of the glass particles must be lower than the firing temperature. In order to exhibit the above effects, it is optimal that the temperature is lower by 0 to 100 ° C. than the firing temperature. Since the firing temperature on the glass substrate is 540 to 620 ° C, the thermal softening point of the glass fine particles is preferably 470 to 600 ° C. When the heat softening point is 600 ° C. or higher, the glass fine particles do not melt, so that the effect of addition is not observed. When the temperature is 470 ° C. or lower, the glass fine particles soften quickly, so that the glass fine particles are separated at the interface of the substrate, and the effect as a sintering aid is lost. More preferably, it is 500 to 550 ° C.
【0021】ガラス微粒子は平均粒径が金属微粒子と同
じか、もしくはやや小さいものが良く、0.1〜5μm
が好ましい。平均粒径が5μmより大きい場合、金属微
粒子より大きな微粒子が電極の導通を妨げ、ライン抵抗
の上昇、ひいては電極ラインの断線をも引き起こすので
好ましくない。0.1μmより小さいと焼成時に流動
し、基板界面に集まるので好ましくない。好ましくは
0.5〜1.5μmである。The average particle diameter of the glass fine particles is preferably the same as or slightly smaller than that of the metal fine particles.
Is preferred. If the average particle size is larger than 5 μm, the fine particles larger than the metal fine particles undesirably hinder the conduction of the electrodes, increase the line resistance, and eventually cause the disconnection of the electrode lines. If it is smaller than 0.1 μm, it flows during firing and gathers at the interface of the substrate, which is not preferable. Preferably it is 0.5 to 1.5 μm.
【0022】本発明の感光性ペーストのうち有機成分に
関する詳細を以下に説明する。プラズマディスプレイや
プラズマアドレス液晶ディスプレイの電極に用いる場
合、有機成分はペーストの40重量%以下にすることが
好ましい。40重量%以上になると、焼成収縮率が大き
くなり、電極が断線する原因となるので好ましくない。
また、金属微粒子感の隙間が大きくなるので抵抗が大き
くなるので好ましくない。The details regarding the organic component of the photosensitive paste of the present invention will be described below. When used for an electrode of a plasma display or a plasma addressed liquid crystal display, it is preferable that the organic component is 40% by weight or less of the paste. When the content is 40% by weight or more, the firing shrinkage rate becomes large, which causes disconnection of the electrode, which is not preferable.
In addition, since the gap between the metallic fine particles is increased, the resistance is increased, which is not preferable.
【0023】ガラス微粒子としては、次のような酸化物
を含む組成物であることが好ましい。酸化珪素はガラス
中に、3〜60重量%の範囲で配合することが好まし
い。3重量%未満の場合はガラス層の緻密性、強度や安
定性が低下し、また熱膨張係数が所望の値から外れ、ガ
ラス基板とのミスマッチが起こりやすい。また60重量
%以下にすることによって、熱軟化点が低くなり、ガラ
ス基板への十分な焼き付けが可能となる。The glass fine particles are preferably a composition containing the following oxides. It is preferable that silicon oxide is blended in the glass in a range of 3 to 60% by weight. If the content is less than 3% by weight, the denseness, strength and stability of the glass layer are reduced, and the coefficient of thermal expansion deviates from desired values, so that a mismatch with the glass substrate is likely to occur. By setting the content to 60% by weight or less, the thermal softening point is lowered, and sufficient baking on a glass substrate becomes possible.
【0024】酸化ホウ素はガラス中に、5〜50重量%
の範囲で配合することによって、電気絶縁性、強度、熱
膨張係数、絶縁層の緻密性などの電気、機械および熱的
特性を向上することができる。50重量%を越えるとガ
ラスの安定性が低下する。Boron oxide is 5 to 50% by weight in the glass.
The electrical, mechanical and thermal properties such as electrical insulation, strength, coefficient of thermal expansion, and denseness of the insulating layer can be improved by blending in the range. If it exceeds 50% by weight, the stability of the glass will decrease.
【0025】酸化リチウム、酸化ナトリウム、酸化カリ
ウムのうち少なくとも1種類を3〜20重量%含むガラ
ス粉末を用いることによっても得ることができるが、リ
チウム、ナトリウム、カリウム等のアルカリ金属の酸化
物は添加量としては、20重量%以下、好ましくは、1
5重量%以下にすることによって、ペーストの安定性を
向上することができる。また、ガラス転移点、ガラス軟
化点を下げることができることから、低温焼成が可能と
なる。It can be obtained by using a glass powder containing 3 to 20% by weight of at least one of lithium oxide, sodium oxide and potassium oxide, but an oxide of an alkali metal such as lithium, sodium and potassium is added. The amount is 20% by weight or less, preferably 1% by weight.
By setting the content to 5% by weight or less, the stability of the paste can be improved. Further, since the glass transition point and the glass softening point can be lowered, low-temperature firing becomes possible.
【0026】酸化ビスマス、酸化鉛、酸化亜鉛のうち少
なくとも1種類をガラス中に、5〜50重量%含むガラ
ス粉末を用いることによって、ガラス基板上に低温焼成
で隔壁が形成できる感光性ガラスペーストを得ることが
できる。50重量%を越えるとガラスの耐熱温度が低く
なり過ぎてガラス基板上への焼き付けが難しくなる。特
に、酸化ビスマスを5〜50重量%含有するガラスを用
いることは、ペーストのポットライフが長いなどの利点
がある。By using a glass powder containing at least one of bismuth oxide, lead oxide and zinc oxide in a glass in an amount of 5 to 50% by weight, a photosensitive glass paste capable of forming partition walls on a glass substrate by low-temperature firing can be obtained. Obtainable. If it exceeds 50% by weight, the heat-resistant temperature of the glass becomes too low, and it is difficult to bake the glass on a glass substrate. In particular, using glass containing 5 to 50% by weight of bismuth oxide has advantages such as a long pot life of the paste.
【0027】の組成を含むものを50重量%以上含有す
ることが好ましい。It is preferable to contain 50% by weight or more containing the above composition.
【0028】また、酸化鉛、酸化ビスマス、酸化亜鉛の
ような金属酸化物と酸化リチウム、酸化ナトリウム、酸
化カリウムのようなアルカリ金属酸化物の両方を含有す
るガラスによって、より低いアルカリ含有量で熱軟化温
度や線熱膨張係数のコントロールが容易になる。In addition, a glass containing both a metal oxide such as lead oxide, bismuth oxide and zinc oxide and an alkali metal oxide such as lithium oxide, sodium oxide and potassium oxide enables a thermal treatment at a lower alkali content. Control of softening temperature and linear thermal expansion coefficient becomes easy.
【0029】また、ガラス微粒子中に、酸化アルミニウ
ム、酸化バリウム、酸化カルシウム、酸化マグネシウ
ム、酸化亜鉛、酸化ジルコニウムなど、特に酸化アルミ
ニウム、酸化バリウム、酸化亜鉛を添加することによ
り、硬度や加工性を改良することができるが、熱軟化
点、熱膨張係数の制御の点からは、その含有量は40重
量%以下が好ましく、より好ましくは25重量%以下で
ある。感光性導電ペーストに用いる無機微粒子の量は、
無機微粒子と有機成分の和に対して60〜95重量%で
あるのが好ましい。The hardness and workability are improved by adding aluminum oxide, barium oxide, calcium oxide, magnesium oxide, zinc oxide, zirconium oxide, etc., particularly aluminum oxide, barium oxide and zinc oxide to the glass fine particles. However, from the viewpoint of controlling the thermal softening point and the coefficient of thermal expansion, the content is preferably 40% by weight or less, more preferably 25% by weight or less. The amount of the inorganic fine particles used in the photosensitive conductive paste,
It is preferably 60 to 95% by weight based on the sum of the inorganic fine particles and the organic component.
【0030】60重量%より小さいと、焼成時の収縮率
が大きくなり、隔壁の断線、剥がれの原因となるため、
好ましくない。また、焼成時に多くの有機成分が焼失す
ることにより、空孔が発生しやすく、好ましくない。さ
らにパターン太り、現像時の残膜の発生が起こりやす
い。95重量%より大きいと、基板にペーストを塗布、
乾燥した時点で空孔が発生し、パターン形成性ができな
くなる。If it is less than 60% by weight, the shrinkage during firing becomes large, which causes disconnection and peeling of the partition walls.
Not preferred. In addition, many organic components are burned off during firing, so that voids are easily generated, which is not preferable. Further, the pattern is likely to be thickened and a residual film is likely to occur during development. If it is greater than 95% by weight, apply the paste to the substrate,
At the time of drying, voids are generated, and the pattern forming property cannot be obtained.
【0031】プラズマディスプレイの電極に用いる場合
は、ガラス転移点、熱軟化点の低いガラス基板上にパタ
ーン形成する。When used for an electrode of a plasma display, a pattern is formed on a glass substrate having a low glass transition point and a low thermal softening point.
【0032】有機成分は、感光性モノマー、感光性オリ
ゴマー、感光性ポリマーのうち少なくとも1種類から選
ばれる感光性成分を含有し、さらに必要に応じて、バイ
ンダー、光重合開始剤、紫外線吸収剤、増感剤、増感助
剤、重合禁止剤、可塑剤、増粘剤、有機溶媒、酸化防止
剤、分散剤、消泡剤、有機あるいは無機の沈殿防止剤な
どの添加剤成分を加えることも行われる。The organic component contains a photosensitive component selected from at least one of a photosensitive monomer, a photosensitive oligomer, and a photosensitive polymer, and further includes a binder, a photopolymerization initiator, an ultraviolet absorber, if necessary. Additive components such as sensitizers, sensitization aids, polymerization inhibitors, plasticizers, thickeners, organic solvents, antioxidants, dispersants, defoamers, and organic or inorganic suspending agents may also be added. Done.
【0033】感光性成分としては、光不溶化型のものと
光可溶化型のものがあり、光不溶化型のものとして、 (A)分子内に不飽和基などを1つ以上有する官能性の
モノマー、オリゴマー、ポリマーを含有するもの (B)芳香族ジアゾ化合物、芳香族アジド化合物、有機
ハロゲン化合物などの感光性化合物を含有するもの (C)ジアゾ系アミンとホルムアルデヒドとの縮合物な
どいわゆるジアゾ樹脂といわれるもの等がある。The photosensitive component includes a photo-insolubilizing type and a photo-solubilizing type. The photo-insolubilizing type includes: (A) a functional monomer having at least one unsaturated group or the like in the molecule. (B) those containing photosensitive compounds such as aromatic diazo compounds, aromatic azide compounds, and organic halogen compounds. (C) So-called diazo resins such as condensates of diazo amines and formaldehyde. And others.
【0034】また、光可溶型のものとしては、 (D)ジアゾ化合物の無機塩や有機酸とのコンプレック
ス、キノンジアゾ類を含有するもの (E)キノンジアゾ類を適当なポリマーバインダーと結
合させた、例えばフェノール、ノボラック樹脂のナフト
キノン−1,2−ジアジド−5−スルフォン酸エステル
等がある。Examples of the photo-soluble type include: (D) a complex of a diazo compound with an inorganic salt or an organic acid, and a compound containing a quinone diazo compound; and (E) a quinone diazo compound combined with an appropriate polymer binder. For example, phenol, naphthoquinone-1,2-diazide-5-sulfonic acid ester of a novolak resin, and the like.
【0035】本発明において用いる感光性成分は、上記
のすべてのものを用いることができる。感光性ペースト
として、無機粉末と混合して簡便に用いることができる
感光性成分は、(A)のものが好ましい。As the photosensitive component used in the present invention, all of the above can be used. As the photosensitive component which can be easily used as a photosensitive paste by mixing with an inorganic powder, the photosensitive component (A) is preferable.
【0036】感光性モノマーとしては、炭素−炭素不飽
和結合を含有する化合物で、その具体的な例として、メ
チルアクリレート、エチルアクリレート、n−プロピル
アクリレート、イソプロピルアクリレート、n−ブチル
アクリレート、sec−ブチルアクリレート、sec−
ブチルアクリレート、イソ−ブチルアクリレート、te
rt−ブチルアクリレート、n−ペンチルアクリレー
ト、アリルアクリレート、ベンジルアクリレート、ブト
キシエチルアクリレート、ブトキシトリエチレングリコ
ールアクリレート、シクロヘキシルアクリレート、ジシ
クロペンタニルアクリレート、ジシクロペンテニルアク
リレート、2−エチルヘキシルアクリレート、グリセロ
ールアクリレート、グリシジルアクリレート、ヘプタデ
カフロロデシルアクリレート、2−ヒドロキシエチルア
クリレート、イソボニルアクリレート、2−ヒドロキシ
プロピルアクリレート、イソデキシルアクリレート、イ
ソオクチルアクリレート、ラウリルアクリレート、2−
メトキシエチルアクリレート、メトキシエチレングリコ
ールアクリレート、メトキシジエチレングリコールアク
リレート、オクタフロロペンチルアクリレート、フェノ
キシエチルアクリレート、ステアリルアクリレート、ト
リフロロエチルアクリレート、アリル化シクロヘキシル
ジアクリレート、1,4−ブタンジオールジアクリレー
ト、1,3−ブチレングリコールジアクリレート、エチ
レングリコールジアクリレート、ジエチレングリコール
ジアクリレート、トリエチレングリコールジアクリレー
ト、ポリエチレングリコールジアクリレート、ジペンタ
エリスリトールヘキサアクリレート、ジペンタエリスリ
トールモノヒドロキシペンタアクリレート、ジトリメチ
ロールプロパンテトラアクリレート、グリセロールジア
クリレート、メトキシ化シクロヘキシルジアクリレー
ト、ネオペンチルグリコールジアクリレート、プロピレ
ングリコールジアクリレート、ポリプロピレングリコー
ルジアクリレート、トリグリセロールジアクリレート、
トリメチロールプロパントリアクリレート、アクリルア
ミド、アミノエチルアクリレート、フェニルアクリレー
ト、フェノキシエチルアクリレート、ベンジルアクリレ
ート、1−ナフチルアクリレート、2−ナフチルアクリ
レート、ビスフェノールAジアクリレート、ビスフェノ
ールA−エチレンオキサイド付加物のジアクリレート、
ビスフェノールA−プロピレンオキサイド付加物のジア
クリレート、チオフェノールアクリレート、ベンジルメ
ルカプタンアクリレート等のアクリレート、また、これ
らの芳香環の水素原子のうち、1〜5個を塩素または臭
素原子に置換したモノマー、もしくは、スチレン、p−
メチルスチレン、o−メチルスチレン、m−メチルスチ
レン、塩素化スチレン、臭素化スチレン、α−メチルス
チレン、塩素化α−メチルスチレン、臭素化α−メチル
スチレン、クロロメチルスチレン、ヒドロキシメチルス
チレン、カルボシキメチルスチレン、ビニルナフタレ
ン、ビニルアントラセン、ビニルカルバゾール、およ
び、上記化合物の分子内のアクリレートを一部もしくは
すべてをメタクリレートに変えたもの、γ−メタクリロ
キシプロピルトリメトキシシラン、1−ビニル−2−ピ
ロリドンなどが挙げられる。本発明ではこれらを1種ま
たは2種以上使用することができる。The photosensitive monomer is a compound containing a carbon-carbon unsaturated bond, and specific examples thereof include methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, and sec-butyl. Acrylate, sec-
Butyl acrylate, iso-butyl acrylate, te
rt-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, glycerol acrylate, glycidyl acrylate Heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobonyl acrylate, 2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-
Methoxyethyl acrylate, methoxyethylene glycol acrylate, methoxydiethylene glycol acrylate, octafluoropentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene Glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate, dipentaerythritol monohydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxide Shi of cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, triglycerol diacrylate,
Trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzyl acrylate, 1-naphthyl acrylate, 2-naphthyl acrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct,
Diacrylates of bisphenol A-propylene oxide adducts, acrylates such as thiophenol acrylate and benzyl mercaptan acrylate, and monomers in which 1 to 5 hydrogen atoms of these aromatic rings have been substituted with chlorine or bromine atoms, or Styrene, p-
Methylstyrene, o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α-methylstyrene, brominated α-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxy Methyl styrene, vinyl naphthalene, vinyl anthracene, vinyl carbazole, and those obtained by changing some or all of the acrylate in the molecule of the above compound to methacrylate, γ-methacryloxypropyltrimethoxysilane, 1-vinyl-2-pyrrolidone, etc. Is mentioned. In the present invention, one or more of these can be used.
【0037】これら以外に、不飽和カルボン酸等の不飽
和酸を加えることによって、感光後の現像性を向上する
ことができる。不飽和カルボン酸の具体的な例として
は、アクリル酸、メタアクリル酸、イタコン酸、クロト
ン酸、マレイン酸、フマル酸、ビニル酢酸、またはこれ
らの酸無水物などがあげられる。In addition to these, the developability after exposure can be improved by adding an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.
【0038】これらモノマーの含有率は、ガラス粉末と
感光性成分の和に対して、5〜30重量%が好ましい。
これ以外の範囲では、パターンの形成性の悪化、硬化後
の硬度不足が発生するため好ましくない。The content of these monomers is preferably 5 to 30% by weight based on the sum of the glass powder and the photosensitive component.
Outside of this range, the pattern formability deteriorates and the hardness becomes insufficient after curing.
【0039】バインダーとしては、ポリビニルアルコー
ル、ポリビニルブチラール、メタクリル酸エステル重合
体、アクリル酸エステル重合体、アクリル酸エステル−
メタクリル酸エステル共重合体、α−メチルスチレン重
合体、ブチルメタクリレート樹脂などがあげられる。As the binder, polyvinyl alcohol, polyvinyl butyral, methacrylate polymer, acrylate polymer, acrylate ester
Examples include methacrylate copolymers, α-methylstyrene polymers, and butyl methacrylate resins.
【0040】また、前述の炭素−炭素二重結合を有する
化合物のうち少なくとも1種類を重合して得られたオリ
ゴマーやポリマーを用いることができる。重合する際
に、これら光反応性モノマーの含有率が、10重量%以
上、さらに好ましくは35重量%以上になるように、他
の感光性のモノマーと共重合することができる。An oligomer or polymer obtained by polymerizing at least one of the compounds having a carbon-carbon double bond described above can be used. During the polymerization, the copolymer may be copolymerized with another photosensitive monomer so that the content of the photoreactive monomer is 10% by weight or more, more preferably 35% by weight or more.
【0041】共重合するモノマーとしては、不飽和カル
ボン酸等の不飽和酸を共重合することによって、感光後
の現像性を向上することができる。不飽和カルボン酸の
具体的な例としては、アクリル酸、メタアクリル酸、イ
タコン酸、クロトン酸、マレイン酸、フマル酸、ビニル
酢酸、またはこれらの酸無水物などがあげられる。As a monomer to be copolymerized, the developability after exposure can be improved by copolymerizing an unsaturated acid such as an unsaturated carboxylic acid. Specific examples of the unsaturated carboxylic acid include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid, and acid anhydrides thereof.
【0042】こうして得られた側鎖にカルボキシル基等
の酸性基を有するポリマーもしくはオリゴマーの酸価
(AV)は50〜180、さらには70〜140の範囲
が好ましい。酸価が50未満であると、現像許容幅が狭
くなる。また、酸価が180を越えると未露光部の現像
液に対する溶解性が低下するようになるため現像液濃度
を濃くすると露光部まで剥がれが発生し、高精細なパタ
ーンが得られにくい。The acid value (AV) of the thus obtained polymer or oligomer having an acidic group such as a carboxyl group in the side chain is preferably 50 to 180, more preferably 70 to 140. When the acid value is less than 50, the allowable development width becomes narrow. On the other hand, if the acid value exceeds 180, the solubility of the unexposed portion in the developing solution decreases, so that if the developing solution concentration is increased, peeling occurs up to the exposed portion, making it difficult to obtain a high-definition pattern.
【0043】以上示した、ポリマーもしくはオリゴマー
に対して、光反応性基を側鎖または分子末端に付加させ
ることによって、感光性を持つ感光性ポリマーや感光性
オリゴマーとして用いることができる。好ましい光反応
性基は、エチレン性不飽和基を有するものである。エチ
レン性不飽和基としては、ビニル基、アリル基、アクリ
ル基、メタクリル基などがあげられる。By adding a photoreactive group to the polymer or oligomer described above to a side chain or a molecular terminal, the polymer or oligomer can be used as a photosensitive polymer or photosensitive oligomer having photosensitivity. Preferred photoreactive groups are those having an ethylenically unsaturated group. Examples of the ethylenically unsaturated group include a vinyl group, an allyl group, an acryl group, and a methacryl group.
【0044】このような側鎖をオリゴマーやポリマーに
付加させる方法は、ポリマー中のメルカプト基、アミノ
基、水酸基やカルボキシル基に対して、グリシジル基や
イソシアネート基を有するエチレン性不飽和化合物やア
クリル酸クロライド、メタクリル酸クロライドまたはア
リルクロライドを付加反応させて作る方法がある。A method for adding such a side chain to an oligomer or a polymer is to use an ethylenically unsaturated compound having a glycidyl group or an isocyanate group, an acrylic acid, or a mercapto group, an amino group, a hydroxyl group or a carboxyl group in the polymer. There is a method in which chloride, methacrylic chloride or allyl chloride is added to make an addition reaction.
【0045】グリシジル基を有するエチレン性不飽和化
合物としては、アクリル酸グリシジル、メタクリル酸グ
リシジル、アリルグリシジルエーテル、エチルアクリル
酸グリシジル、クロトニルグリシジルエーテル、クロト
ン酸グリシジルエーテル、イソクロトン酸グリシジルエ
ーテルなどがあげられる。Examples of the ethylenically unsaturated compound having a glycidyl group include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, glycidyl ethyl acrylate, crotonyl glycidyl ether, glycidyl crotonate, and glycidyl ether isocrotonic acid. .
【0046】イソシアネート基を有するエチレン性不飽
和化合物としては、(メタ)アクリロイルイソシアネー
ト、(メタ)アクリロイルエチルイソシアネート等があ
る。Examples of the ethylenically unsaturated compound having an isocyanate group include (meth) acryloyl isocyanate and (meth) acryloylethyl isocyanate.
【0047】また、グリシジル基やイソシアネート基を
有するエチレン性不飽和化合物やアクリル酸クロライ
ド、メタクリル酸クロライドまたはアリルクロライド
は、ポリマー中のメルカプト基、アミノ基、水酸基やカ
ルボキシル基に対して0.05〜1モル当量付加させる
ことが好ましい。The ethylenically unsaturated compound having a glycidyl group or an isocyanate group, acrylic acid chloride, methacrylic acid chloride or allyl chloride is used in an amount of 0.05 to 0.05 to the mercapto group, amino group, hydroxyl group and carboxyl group in the polymer. It is preferable to add one molar equivalent.
【0048】感光性ガラスペースト中の感光性ポリマ
ー、感光性オリゴマーおよびバインダーからなるポリマ
ー成分の量としては、パターン形成性、焼成後の収縮率
の点で優れていることから、金属微粒子と感光性成分の
和に対して、5〜30重量%であることが好ましい。こ
の範囲外では、パターン形成が不可能もしくは、形成し
たパターンの焼結性が悪くなるため好ましくない。The amount of the polymer component comprising the photosensitive polymer, the photosensitive oligomer and the binder in the photosensitive glass paste is excellent in terms of pattern formability and shrinkage after baking. It is preferably 5 to 30% by weight based on the sum of the components. Outside this range, it is not preferable because pattern formation is impossible or sinterability of the formed pattern deteriorates.
【0049】光重合開始剤としての具体的な例として、
ベンゾフェノン、o−ベンゾイル安息香酸メチル、4,
4−ビス(ジメチルアミン)ベンゾフェノン、4,4−
ビス(ジエチルアミノ)ベンゾフェノン、4,4−ジク
ロロベンゾフェノン、4−ベンゾイル−4−メチルジフ
ェニルケトン、ジベンジルケトン、フルオレノン、2,
2−ジエトキシアセトフェノン、2,2−ジメトキシ−
2−フェニル−2−フェニルアセトフェノン、2−ヒド
ロキシ−2−メチルプロピオフェノン、p−t−ブチル
ジクロロアセトフェノン、チオキサントン、2−メチル
チオキサントン、2−クロロチオキサントン、2−イソ
プロピルチオキサントン、ジエチルチオキサントン、ベ
ンジル、ベンジルジメチルケタノール、ベンジルメトキ
シエチルアセタール、ベンゾイン、ベンゾインメチルエ
ーテル、ベンゾインブチルエーテル、アントラキノン、
2−t−ブチルアントラキノン、2−アミルアントラキ
ノン、β−クロルアントラキノン、アントロン、ベンズ
アントロン、ジベンゾスベロン、メチレンアントロン、
4−アジドベンザルアセトフェノン、2,6−ビス(p
−アジドベンジリデン)シクロヘキサノン、2,6−ビ
ス(p−アジドベンジリデン)−4−メチルシクロヘキ
サノン、2−フェニル−1,2−ブタジオン−2−(o
−メトキシカルボニル)オキシム、1−フェニル−プロ
パンジオン−2−(o−エトキシカルボニル)オキシ
ム、1,3−ジフェニル−プロパントリオン−2−(o
−エトキシカルボニル)オキシム、1−フェニル−3−
エトキシ−プロパントリオン−2−(o−ベンゾイル)
オキシム、ミヒラーケトン、2−メチル−[4−(メチ
ルチオ)フェニル]−2−モルフォリノ−1−プロパノ
ン、ナフタレンスルホニルクロライド、キノリンスルホ
ニルクロライド、N−フェニルチオアクリドン、4,4
−アゾビスイソブチロニトリル、ジフェニルジスルフィ
ド、ベンズチアゾールジスルフィド、トリフェニルホル
フィン、カンファーキノン、四臭素化炭素、トリブロモ
フェニルスルホン、過酸化ベンゾインおよびエオシン、
メチレンブルーなどの光還元性の色素とアスコルビン
酸、トリエタノールアミンなどの還元剤の組合せなどが
あげられる。本発明ではこれらを1種または2種以上使
用することができる。As specific examples of the photopolymerization initiator,
Benzophenone, methyl o-benzoylbenzoate, 4,
4-bis (dimethylamine) benzophenone, 4,4-
Bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenylketone, dibenzylketone, fluorenone, 2,
2-diethoxyacetophenone, 2,2-dimethoxy-
2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyl, Benzyl dimethyl ketanol, benzyl methoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, anthraquinone,
2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzosuberone, methyleneanthrone,
4-azidobenzalacetophenone, 2,6-bis (p
-Azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butadione-2- (o
-Methoxycarbonyl) oxime, 1-phenyl-propanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (o
-Ethoxycarbonyl) oxime, 1-phenyl-3-
Ethoxy-propanetrione-2- (o-benzoyl)
Oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone, naphthalenesulfonyl chloride, quinoline sulfonyl chloride, N-phenylthioacridone, 4,4
-Azobisisobutyronitrile, diphenyl disulfide, benzothiazole disulfide, triphenylphorphine, camphorquinone, carbon tetrabromide, tribromophenylsulfone, benzoin peroxide and eosin,
Examples include a combination of a photoreducing dye such as methylene blue and a reducing agent such as ascorbic acid and triethanolamine. In the present invention, one or more of these can be used.
【0050】光重合開始剤は、感光性成分に対し、0.
05〜30重量%の範囲で添加され、より好ましくは、
5〜20重量%である。重合開始剤の量が少なすぎる
と、光感度が不良となり、光重合開始剤の量が多すぎれ
ば、露光部の残存率が小さくなりすぎるおそれがある。The photopolymerization initiator is used in an amount of 0.
In the range of 0.5 to 30% by weight, more preferably
5 to 20% by weight. If the amount of the polymerization initiator is too small, the photosensitivity becomes poor, and if the amount of the photopolymerization initiator is too large, the residual ratio of the exposed portion may be too small.
【0051】紫外線吸収剤を添加することも有効であ
る。紫外線吸収効果の高い化合物を添加することによっ
て高アスペクト比、高精細、高解像度が得られる。紫外
線吸収剤としては有機系染料からなるもの、中でも35
0〜450nmの波長範囲で高UV吸収係数を有する有
機系染料が好ましく用いられる。具体的には、アゾ系染
料、アミノケトン系染料、キサンテン系染料、キノリン
系染料、アミノケトン系染料、アントラキノン系、ベン
ゾフェノン系、ジフェニルシアノアクリレート系、トリ
アジン系、p−アミノ安息香酸系染料などが使用でき
る。有機系染料は吸光剤として添加した場合にも、焼成
後の絶縁膜中に残存しないで吸光剤による絶縁膜特性の
低下を少なくできるので好ましい。これらの中でもアゾ
系およびベンゾフェノン系染料が好ましい。It is also effective to add an ultraviolet absorber. By adding a compound having a high ultraviolet absorption effect, a high aspect ratio, high definition, and high resolution can be obtained. UV absorbers composed of organic dyes, especially 35
Organic dyes having a high UV absorption coefficient in the wavelength range of 0 to 450 nm are preferably used. Specifically, azo dyes, aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, anthraquinones, benzophenones, diphenylcyanoacrylates, triazines, p-aminobenzoic acid dyes and the like can be used. . Even when the organic dye is added as a light absorbing agent, it is preferable because deterioration of the insulating film characteristics due to the light absorbing agent can be reduced without remaining in the insulating film after firing. Among these, azo dyes and benzophenone dyes are preferred.
【0052】有機染料の添加量は金属微粒子に対して0
〜0.5重量部が好ましい。染料を添加しなくともパタ
ーンは形成できるが光の散乱による非露光部の硬化が進
むため0.01〜0.05重量%添加することが好まし
い。特に本発明で用いられる金属微粒子は黒色であるの
で微粒子自身の吸収が大きく、添加する染料は少量でよ
い。0.5重量%を越えると紫外線を吸収しすぎるため
にペーストの表層しか硬化せず、パターン形成ができな
くなる。The amount of the organic dye added is 0 to the metal fine particles.
~ 0.5 parts by weight is preferred. Although a pattern can be formed without adding a dye, it is preferable to add 0.01 to 0.05% by weight because curing of an unexposed portion proceeds due to light scattering. In particular, since the metal fine particles used in the present invention are black, the absorption of the fine particles themselves is large, and the amount of the dye to be added may be small. If it exceeds 0.5% by weight, the ultraviolet ray is absorbed too much, so that only the surface layer of the paste is cured, and the pattern cannot be formed.
【0053】有機染料からなる紫外線吸光剤の添加方法
の一例を上げると、有機染料を予め有機溶媒に溶解した
溶液を作製し、それをペースト作製時に混練する方法以
外に、該有機溶媒中に金属微粒子を混合後、乾燥する方
法があげられる。この方法によって金属微粒子の個々の
粒子表面に有機の膜をコートしたいわゆるカプセル状の
粉末が作製でき、これを使用する。As an example of the method of adding the ultraviolet light absorbing agent composed of an organic dye, a method in which a solution in which an organic dye is dissolved in an organic solvent in advance and a method of kneading the solution at the time of preparing the paste may be used. After mixing the fine particles, a method of drying the fine particles can be used. By this method, a so-called capsule-like powder in which the surface of each of the metal fine particles is coated with an organic film can be produced and used.
【0054】本発明において、無機粉末に含まれるF
e、Mn、Co、Naや微量に存在するPb、Cd、M
gなどの金属および酸化物がペースト中に含有する感光
性成分と反応してペーストが短時間でゲル化し、塗布で
きなくなる場合がある。このような反応を防止するため
に安定化剤を添加してゲル化を防止することが好まし
い。用いる安定化剤としては、トリアゾール化合物が好
ましく用いられる。トリアゾール化合物としては、ベン
ゾトリアゾール誘導体が好ましく用いられる。この中で
も特にベンゾトリアゾールが有効に作用する。本発明に
おいて使用されるベンゾトリアゾールによるガラスフリ
ットの表面処理の一例を上げると、無機粉末に対して所
定の量のベンゾトリアゾールを酢酸メチル、酢酸エチ
ル、エチルアルコール、メチルアルコールなどの有機溶
媒に溶解した後、これら粉末が十分に浸すことができる
ように溶液中に1〜24時間浸積する。浸積後、好まし
くは20〜30℃下で自然乾燥して溶媒を蒸発させてト
リアゾール処理を行った粉末を作製する。使用される安
定化剤の割合(安定化剤/無機粉末)は0.05〜5重
量%が好ましい。In the present invention, F contained in the inorganic powder
e, Mn, Co, Na and trace amounts of Pb, Cd, M
In some cases, a metal such as g and an oxide react with a photosensitive component contained in the paste to cause the paste to gel in a short time, making application impossible. In order to prevent such a reaction, it is preferable to add a stabilizer to prevent gelation. As the stabilizer used, a triazole compound is preferably used. As the triazole compound, a benzotriazole derivative is preferably used. Among them, benzotriazole works particularly effectively. As an example of the surface treatment of the glass frit with benzotriazole used in the present invention, a predetermined amount of benzotriazole with respect to the inorganic powder was dissolved in an organic solvent such as methyl acetate, ethyl acetate, ethyl alcohol and methyl alcohol. Thereafter, the powder is immersed in the solution for 1 to 24 hours so that it can be sufficiently immersed. After immersion, preferably, the powder is naturally dried at 20 to 30 ° C., and the solvent is evaporated to prepare a powder which has been subjected to a triazole treatment. The ratio of the stabilizer used (stabilizer / inorganic powder) is preferably 0.05 to 5% by weight.
【0055】増感剤は、感度を向上させるために添加さ
れる。増感剤の具体例としては、2,4−ジエチルチオ
キサントン、イソプロピルチオキサントン、2,3−ビ
ス(4−ジエチルアミノベンザル)シクロペンタノン、
2,6−ビス(4−ジメチルアミニベンザル)シクロヘ
キサノン、2,6−ビス(4−ジメチルアミノベンザ
ル)−4−メチルシクロヘキサノン、ミヒラーケトン、
4,4−ビス(ジエチルアミノ)−ベンゾフェノン、
4,4−ビス(ジメチルアミノ)カルコン、4,4−ビ
ス(ジエチルアミノ)カルコン、p−ジメチルアミノシ
ンナミリデンインダノン、p−ジメチルアミノベンジリ
デンインダノン、2−(p−ジメチルアミノフェニルビ
ニレン)−イソナフトチアゾール、1,3−ビス(4−
ジメチルアミノベンザル)アセトン、1,3−カルボニ
ル−ビス(4−ジエチルアミノベンザル)アセトン、
3,3−カルボニル−ビス(7−ジエチルアミノクマリ
ン)、N−フェニル−N−エチルエタノールアミン、N
−フェニルエタノールアミン、N−トリルジエタノール
アミン、N−フェニルエタノールアミン、ジメチルアミ
ノ安息香酸イソアミル、ジエチルアミノ安息香酸イソア
ミル、3−フェニル−5−ベンゾイルチオテトラゾー
ル、1−フェニル−5−エトキシカルボニルチオテトラ
ゾールなどがあげられる。A sensitizer is added to improve the sensitivity. Specific examples of the sensitizer include 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone,
2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone,
4,4-bis (diethylamino) -benzophenone,
4,4-bis (dimethylamino) chalcone, 4,4-bis (diethylamino) chalcone, p-dimethylaminocinnamylidene indanone, p-dimethylaminobenzylidene indanone, 2- (p-dimethylaminophenylvinylene)- Isonaphthothiazole, 1,3-bis (4-
Dimethylaminobenzal) acetone, 1,3-carbonyl-bis (4-diethylaminobenzal) acetone,
3,3-carbonyl-bis (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N
-Phenylethanolamine, N-tolyldiethanolamine, N-phenylethanolamine, isoamyl dimethylaminobenzoate, isoamyl diethylaminobenzoate, 3-phenyl-5-benzoylthiotetrazole, 1-phenyl-5-ethoxycarbonylthiotetrazole and the like. Can be
【0056】本発明ではこれらを1種または2種以上使
用することができる。なお、増感剤の中には光重合開始
剤としても使用できるものがある。増感剤を本発明の感
光性ペーストに添加する場合、その添加量は感光性成分
に対して通常0.05〜10重量%、より好ましくは
0.1〜10重量%である。増感剤の量が少なすぎれば
光感度を向上させる効果が発揮されず、増感剤の量が多
すぎれば露光部の残存率が小さくなりすぎるおそれがあ
る。In the present invention, one or more of these can be used. Some sensitizers can also be used as photopolymerization initiators. When a sensitizer is added to the photosensitive paste of the present invention, the amount is usually 0.05 to 10% by weight, more preferably 0.1 to 10% by weight, based on the photosensitive component. If the amount of the sensitizer is too small, the effect of improving the photosensitivity is not exhibited, and if the amount of the sensitizer is too large, the residual ratio of the exposed portion may be too small.
【0057】重合禁止剤は、保存時の熱安定性を向上さ
せるために添加される。重合禁止剤の具体的な例として
は、ヒドロキノン、ヒドロキノンのモノエステル化物、
N−ニトロソジフェニルアミン、フェノチアジン、p−
t−ブチルカテコール、N−フェニルナフチルアミン、
2,6−ジ−t−ブチル−p−メチルフェノール、クロ
ラニール、ピロガロールなどが挙げられる。重合禁止剤
を添加する場合、その添加量は、感光性ペースト中に、
通常、0.001〜1重量%である。The polymerization inhibitor is added to improve the heat stability during storage. Specific examples of the polymerization inhibitor include hydroquinone, monoesterified hydroquinone,
N-nitrosodiphenylamine, phenothiazine, p-
t-butylcatechol, N-phenylnaphthylamine,
2,6-di-t-butyl-p-methylphenol, chloranil, pyrogallol and the like. When adding a polymerization inhibitor, the amount added, in the photosensitive paste,
Usually, it is 0.001 to 1% by weight.
【0058】可塑剤の具体的な例としては、ジブチルフ
タレート、ジオクチルフタレート、ポリエチレングリコ
ール、グリセリンなどがあげられる。Specific examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, glycerin and the like.
【0059】隔壁の空孔を減少させるために、ポリエチ
レングリコール(分子量400〜800)などのアルキ
レングリコール系の消泡剤を添加するのが効果的であ
る。ペースト中の気泡を減少させ、焼成前の隔壁パター
ン中の空孔を減少させることができる。酸化防止剤は、
保存時におけるアクリル系共重合体の酸化を防ぐために
添加される。酸化防止剤の具体的な例として2,6−ジ
−t−ブチル−p−クレゾール、ブチル化ヒドロキシア
ニソール、2,6−ジ−t−4−エチルフェノール、
2,2−メチレン−ビス−(4−メチル−6−t−ブチ
ルフェノール)、2,2−メチレン−ビス−(4−エチ
ル−6−t−ブチルフェノール)、4,4−ビス−(3
−メチル−6−t−ブチルフェノール)、1,1,3−
トリス−(2−メチル−6−t−ブチルフェノール)、
1,1,3−トリス−(2−メチル−4−ヒドロキシ−
t−ブチルフェニル)ブタン、ビス[3,3−ビス−
(4−ヒドロキシ−3−t−ブチルフェニル)ブチリッ
クアシッド]グリコールエステル、ジラウリルチオジプ
ロピオナート、トリフェニルホスファイトなどが挙げら
れる。酸化防止剤を添加する場合、その添加量は通常、
添加量は、ペースト中に、通常、0.001〜1重量%
である。It is effective to add an alkylene glycol-based antifoaming agent such as polyethylene glycol (molecular weight: 400 to 800) to reduce pores in the partition walls. Air bubbles in the paste can be reduced, and pores in the partition pattern before firing can be reduced. Antioxidants,
It is added to prevent oxidation of the acrylic copolymer during storage. Specific examples of antioxidants include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-4-ethylphenol,
2,2-methylene-bis- (4-methyl-6-t-butylphenol), 2,2-methylene-bis- (4-ethyl-6-t-butylphenol), 4,4-bis- (3
-Methyl-6-t-butylphenol), 1,1,3-
Tris- (2-methyl-6-t-butylphenol),
1,1,3-tris- (2-methyl-4-hydroxy-
t-butylphenyl) butane, bis [3,3-bis-
(4-hydroxy-3-t-butylphenyl) butyric acid] glycol ester, dilauryl thiodipropionate, triphenyl phosphite and the like. When adding an antioxidant, the amount added is usually
The addition amount is usually 0.001 to 1% by weight in the paste.
It is.
【0060】本発明の感光性ペーストには、溶液の粘度
を調整したい場合、有機溶媒を加えてもよい。このとき
使用される有機溶媒としては、メチルセロソルブ、エチ
ルセロソルブ、ブチルセロソルブ、メチルエチルケト
ン、ジオキサン、アセトン、シクロヘキサノン、シクロ
ペンタノン、イソブチルアルコール、イソプロピルアル
コール、テトラヒドロフラン、ジメチルスルフォキシ
ド、γ−ブチロラクトン、ブロモベンゼン、クロロベン
ゼン、ジブロモベンゼン、ジクロロベンゼン、ブロモ安
息香酸、クロロ安息香酸などやこれらのうちの1種以上
を含有する有機溶媒混合物が用いられる。To adjust the viscosity of the solution, an organic solvent may be added to the photosensitive paste of the present invention. The organic solvent used at this time includes methyl cellosolve, ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, Chlorobenzene, dibromobenzene, dichlorobenzene, bromobenzoic acid, chlorobenzoic acid, and the like, and an organic solvent mixture containing at least one of these are used.
【0061】感光性ペーストは、通常、無機粉末、紫外
線吸光剤、感光性ポリマー、感光性モノマー、光重合開
始剤、ガラスフリットおよび溶媒等の各種成分を所定の
組成となるように調合した後、3本ローラや混練機で均
質に混合分散し作製する。The photosensitive paste is usually prepared by mixing various components such as an inorganic powder, an ultraviolet absorber, a photosensitive polymer, a photosensitive monomer, a photopolymerization initiator, a glass frit and a solvent so as to have a predetermined composition. The mixture is uniformly mixed and dispersed with three rollers or a kneading machine.
【0062】ペーストの粘度は無機粉末、増粘剤、有機
溶媒、可塑剤および沈殿防止剤などの添加割合によって
適宜調整されるが、その範囲は2000〜20万cps
(センチ・ポイズ)である。例えばガラス基板への塗布
をスクリーン印刷法以外にスピンコート法で行う場合
は、200〜5000cpsが好ましい。スクリーン印
刷法で1回塗布して膜厚10〜20μmを得るには、5
万〜20万cpsが好ましい。The viscosity of the paste is appropriately adjusted by the addition ratio of an inorganic powder, a thickener, an organic solvent, a plasticizer, a suspending agent, etc., but the range is from 2000 to 200,000 cps.
(Centipoise). For example, when applying to a glass substrate by a spin coating method other than the screen printing method, 200 to 5000 cps is preferable. In order to obtain a film thickness of 10 to 20 μm by applying once by the screen printing method, 5
10,000 to 200,000 cps is preferable.
【0063】次に、感光性ペーストを用いてパターン加
工を行う一例について説明するが、本発明はこれに限定
されない。Next, an example of performing pattern processing using a photosensitive paste will be described, but the present invention is not limited to this.
【0064】ガラス基板やセラミックスの基板、もしく
は、ポリマー製フィルムの上に、感光性ペーストを全面
塗布、もしくは部分的に塗布する。塗布方法としては、
スクリーン印刷、バーコーター、ロールコーター、ダイ
コーター、ブレードコーター等の方法を用いることがで
きる。塗布厚みは、塗布回数、スクリーンのメッシュ、
ペーストの粘度を選ぶことによって調整できる。A photosensitive paste is applied to the entire surface or a part of a glass substrate, a ceramic substrate, or a polymer film. As the application method,
Methods such as screen printing, a bar coater, a roll coater, a die coater, and a blade coater can be used. The coating thickness is determined by the number of coatings, screen mesh,
It can be adjusted by choosing the viscosity of the paste.
【0065】ここでペーストを基板上に塗布する場合、
基板と塗布膜との密着性を高めるために基板の表面処理
を行うことができる。表面処理液としてはシランカップ
リング剤、例えばビニルトリクロロシラン、ビニルトリ
メトキシシラン、ビニルトリエトキシシラン、トリス−
(2−メトキシエトキシ)ビニルシラン、γ−グリシド
キシプロピルトリメトキシシラン、γ−(メタクリロキ
シプロピル)トリメトキシシラン、γ(2−アミノエチ
ル)アミノプロピルトリメトキシシラン、γ−クロロプ
ロピルトリメトキシシラン、γ−メルカプトプロピルト
リメトキシシラン、γ−アミノプロピルトリエトキシシ
ランなどあるいは有機金属例えば有機チタン、有機アル
ミニウム、有機ジルコニウムなどである。シランカップ
リング剤あるいは有機金属を有機溶媒、例えばエチレン
グリコールモノメチルエーテル、エチレングリコールモ
ノエチルエーテル、メチルアルコール、エチルアルコー
ル、プロピルアルコール、ブチルアルコールなどで0.
1〜5%の濃度に希釈したものを用いる。次にこの表面
処理液をスピナーなどで基板上に均一に塗布した後に8
0〜140℃で10〜60分間乾燥することによって表
面処理ができるまた、フィルム上に塗布した場合、フィ
ルム上で乾燥を行った後、次の露光工程を行う場合と、
ガラスやセラミックの基板上に張り付けた後、露光工程
を行う方法がある。Here, when applying the paste on the substrate,
Surface treatment of the substrate can be performed to enhance the adhesion between the substrate and the coating film. Examples of the surface treatment liquid include silane coupling agents such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and tris-silane.
(2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ (2-aminoethyl) aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane and the like, or organic metals such as organic titanium, organic aluminum and organic zirconium. The silane coupling agent or the organic metal is dissolved in an organic solvent, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol or the like.
Use the one diluted to a concentration of 1 to 5%. Next, after applying this surface treatment liquid uniformly on the substrate with a spinner or the like, 8
Surface treatment can be performed by drying at 0 to 140 ° C. for 10 to 60 minutes.When applied on a film, after drying on the film, performing the next exposure step,
There is a method in which an exposure step is performed after the film is pasted on a glass or ceramic substrate.
【0066】塗布した後、露光装置を用いて露光を行
う。露光は通常のフォトリソグラフィーで行われるよう
に、フォトマスクを用いてマスク露光する方法が一般的
である。用いるマスクは、感光性有機成分の種類によっ
て、ネガ型もしくはポジ型のどちらかを選定する。After application, exposure is performed using an exposure device. The exposure is generally performed by a mask exposure using a photomask, as is performed by ordinary photolithography. As the mask to be used, either a negative type or a positive type is selected depending on the type of the photosensitive organic component.
【0067】また、フォトマスクを用いずに、赤色や青
色のレーザー光などで直接描画する方法を用いても良
い。Further, a method of directly drawing with a red or blue laser beam without using a photomask may be used.
【0068】露光装置としては、ステッパー露光機、プ
ロキシミティ露光機等を用いることができる。また、大
面積の露光を行う場合は、ガラス基板などの基板上に感
光性ペーストを塗布した後に、搬送しながら露光を行う
ことによって、小さな露光面積の露光機で、大きな面積
を露光することができる。As an exposure device, a stepper exposure device, a proximity exposure device, or the like can be used. In the case of performing a large-area exposure, after applying a photosensitive paste on a substrate such as a glass substrate, and performing the exposure while transporting, it is possible to expose a large area with an exposure machine having a small exposure area. it can.
【0069】この際使用される活性光源は、たとえば、
可視光線、近紫外線、紫外線、電子線、X線、レーザー
光などが挙げられるが、これらの中で紫外線が好まし
く、その光源としてはたとえば低圧水銀灯、高圧水銀
灯、超高圧水銀灯、ハロゲンランプ、殺菌灯などが使用
できる。これらのなかでも超高圧水銀灯が好適である。
露光条件は塗布厚みによって異なるが、1〜100mW
/cm2 の出力の超高圧水銀灯を用いて0.5〜30分
間露光を行なう。The active light source used at this time is, for example,
Visible light, near-ultraviolet light, ultraviolet light, electron beam, X-ray, laser light, etc. are preferable. Among them, ultraviolet light is preferable. Etc. can be used. Among these, an ultra-high pressure mercury lamp is preferred.
Exposure conditions vary depending on the coating thickness, but 1 to 100 mW
Exposure is performed for 0.5 to 30 minutes using an ultra-high pressure mercury lamp with an output of / cm 2 .
【0070】塗布した感光性ペースト表面に酸素遮蔽膜
を設けることによって、パターン形状を向上することが
できる。酸素遮蔽膜の一例としては、ポリビニルアルコ
ール(PVA)やセルロースなどの膜、あるいは、ポリ
エステルなどのフィルムが上げられる。By providing an oxygen shielding film on the surface of the applied photosensitive paste, the pattern shape can be improved. As an example of the oxygen shielding film, a film of polyvinyl alcohol (PVA) or cellulose, or a film of polyester or the like can be given.
【0071】PVA膜の形成方法は濃度が0.5〜5重
量%の水溶液をスピナーなどの方法で基板上に均一に塗
布した後に70〜90℃で10〜60分間乾燥すること
によって水分を蒸発させて行う。また水溶液中にアルコ
ールを少量添加すると絶縁膜との塗れ性が良くなり蒸発
が容易になるので好ましい。さらに好ましいPVAの溶
液濃度は、1〜3重量%である。この範囲にあると感度
が一層向上する。PVA塗布によって感度が向上するの
は次の理由が推定される。すなわち感光性成分が光反応
する際に、空気中の酸素があると光硬化の感度を妨害す
ると考えられるが、PVAの膜があると余分な酸素を遮
断できるので露光時に感度が向上すると考えられる。The PVA film is formed by uniformly applying an aqueous solution having a concentration of 0.5 to 5% by weight on a substrate by a method such as a spinner, and then drying at 70 to 90 ° C. for 10 to 60 minutes to evaporate water. Let me do it. In addition, it is preferable to add a small amount of alcohol to the aqueous solution because the coatability with the insulating film is improved and the evaporation is facilitated. A more preferred solution concentration of PVA is 1 to 3% by weight. Within this range, the sensitivity is further improved. The reason why the sensitivity is improved by the PVA application is presumed as follows. That is, when the photosensitive component undergoes a photoreaction, the presence of oxygen in the air is considered to hinder the photocuring sensitivity, but the presence of a PVA film is considered to improve the sensitivity during exposure because excess oxygen can be blocked. .
【0072】ポリエステルやポリプロピレン、ポリエチ
レン等の透明なフィルムを用いる場合は、塗布後の感光
性ペーストの上に、これらのフィルムを張り付けて用い
る方法もある。When a transparent film of polyester, polypropylene, polyethylene, or the like is used, there is a method in which the film is attached to the photosensitive paste after application.
【0073】露光後、感光部分と非感光部分の現像液に
対する溶解度差を利用して、現像を行なうが、この場
合、浸漬法、シャワー法、スプレー法、ブラシ法で行な
う。After the exposure, development is carried out utilizing the difference in solubility between the photosensitive portion and the non-photosensitive portion in the developing solution. In this case, the development is carried out by an immersion method, a shower method, a spray method, or a brush method.
【0074】用いる現像液は、感光性ペースト中の有機
成分が溶解可能である有機溶媒を使用できる。また該有
機溶媒にその溶解力が失われない範囲で水を添加しても
よい。感光性ペースト中にカルボキシル基等の酸性基を
持つ化合物が存在する場合、アルカリ水溶液で現像でき
る。アルカリ水溶液として水酸化ナトリウムや炭酸ナト
リウム、水酸化カルシウム水溶液などのような金属アル
カリ水溶液を使用できるが、有機アルカリ水溶液を用い
た方が焼成時にアルカリ成分を除去しやすいので好まし
い。As the developer to be used, an organic solvent in which the organic components in the photosensitive paste can be dissolved can be used. Water may be added to the organic solvent as long as the solvent does not lose its solubility. When a compound having an acidic group such as a carboxyl group is present in the photosensitive paste, development can be performed with an aqueous alkali solution. As the alkaline aqueous solution, a metallic alkaline aqueous solution such as sodium hydroxide, sodium carbonate, calcium hydroxide aqueous solution, etc. can be used, but it is preferable to use an organic alkaline aqueous solution since the alkaline component can be easily removed during firing.
【0075】有機アルカリとしては、アミン化合物を用
いることができる。具体的には、テトラメチルアンモニ
ウムヒドロキサイド、トリメチルベンジルアンモニウム
ヒドロキサイド、モノエタノールアミン、ジエタノール
アミンなどが挙げられる。アルカリ水溶液の濃度は通常
0.01〜10重量%、より好ましくは0.1〜5重量
%である。アルカリ濃度が低すぎると可溶部が除去され
ず、アルカリ濃度が高すぎると、パターン部を剥離さ
せ、また非可溶部を腐食させるおそれがあり好ましくな
い。また、現像時の現像温度は、20〜50℃で行うこ
とが工程管理上好ましい。As the organic alkali, an amine compound can be used. Specific examples include tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine, diethanolamine and the like. The concentration of the alkaline aqueous solution is usually 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. If the alkali concentration is too low, the soluble portion is not removed, and if the alkali concentration is too high, the pattern portion may be peeled off and the non-soluble portion may be corroded, which is not preferable. The development temperature during development is preferably from 20 to 50 ° C. from the viewpoint of process control.
【0076】次に焼成炉にて焼成を行う。焼成雰囲気
や、温度はペーストや基板の種類によって異なるが、空
気中、窒素、水素等の雰囲気中で焼成する。焼成炉とし
ては、バッチ式の焼成炉やベルト式の連続型焼成炉を用
いることができる。Next, firing is performed in a firing furnace. The firing atmosphere and temperature vary depending on the type of the paste and the substrate, but firing is performed in an atmosphere of air, nitrogen, hydrogen, or the like. As the firing furnace, a batch-type firing furnace or a belt-type continuous firing furnace can be used.
【0077】ガラス基板上にパターン加工する場合は、
540〜620℃の温度で10〜60分間保持して焼成
を行う。For pattern processing on a glass substrate,
The calcination is carried out at a temperature of 540 to 620 ° C. for 10 to 60 minutes.
【0078】また、以上の塗布や露光、現像、焼成の各
工程中に、乾燥、予備反応の目的で、50〜300℃加
熱工程を導入しても良い。A heating step at 50 to 300 ° C. may be introduced for the purpose of drying and preliminary reaction during each of the coating, exposure, development and baking steps.
【0079】[0079]
【実施例】以下に、本発明を実施例を用いて、具体的に
説明する。ただし、本発明はこれに限定はされない。な
お、実施例、比較例中の濃度(%)は特にことわらない
限り重量%である。The present invention will be specifically described below with reference to examples. However, the present invention is not limited to this. The concentrations (%) in Examples and Comparative Examples are% by weight unless otherwise specified.
【0080】実施例1 黒色化した導電性金属微粒子として、微粒子表面にRu
O2 を3重量%になるよう均一に被覆した銀を使用し、
金属微粒子および感光性有機成分から成る感光性導電ペ
ーストを作製した。ペーストは感光性の有機成分すべて
を混ぜ溶解した後に、金属微粒子を添加し三本ローラー
などの混練機で混練することによって作製した。なお、
使用した金属微粒子を表1に、ペースト組成を表2に示
した。Example 1 As the black conductive metal fine particles, Ru
Using silver uniformly coated with O 2 to 3% by weight,
A photosensitive conductive paste comprising metal fine particles and a photosensitive organic component was prepared. The paste was prepared by mixing and dissolving all photosensitive organic components, adding fine metal particles, and kneading the mixture with a kneading machine such as a three-roller. In addition,
Table 1 shows the used metal fine particles, and Table 2 shows the paste composition.
【0081】次に、25cm×35cm角のソーダガラ
ス基板にスクリーン印刷機を用いてペーストを印刷し
た。印刷は400メッシュのスクリーンで行い、塗布厚
みを10μmにした。印刷後に溶媒の乾燥を100℃で
30分行った。Next, a paste was printed on a 25 cm × 35 cm square soda glass substrate using a screen printer. Printing was performed on a 400-mesh screen, and the coating thickness was 10 μm. After printing, the solvent was dried at 100 ° C. for 30 minutes.
【0082】露光は50mW/cm2の出力の超高圧水
銀灯で20秒間紫外線露光を行った。露光時に使用した
フォトマスクはネガ型で、光硬化させる部分が光透過す
るクロムマスクである。電極パターンはピッチが140
μm、線幅が40μmのストライプ状の高精細パターン
を使用した。The exposure was carried out using an ultra-high pressure mercury lamp having an output of 50 mW / cm 2 for 20 seconds. The photomask used at the time of exposure is a negative type, and is a chrome mask through which light to be cured is transmitted. The electrode pattern has a pitch of 140
A striped high-definition pattern having a line width of 40 μm was used.
【0083】現像は、30℃のモノエタノールアミン
0.1%水溶液のシャワーで行い、光照射されなかった
部分を除去した。そして、純水のシャワーで現像液を洗
い流し、80℃で20分間乾燥した。The development was carried out in a shower of a 0.1% aqueous solution of monoethanolamine at 30 ° C., and portions not irradiated with light were removed. Then, the developer was washed away with a shower of pure water, and dried at 80 ° C. for 20 minutes.
【0084】焼成は、250℃/時間で昇温し、最高温
度580℃、15分間保持で行った。同じ条件で、パタ
ーン解像度テスト用サンプル、電極膜の黒さ測定用サン
プル、および比抵抗の測定用サンプルを作製し、パター
ン解像度の観察、電極膜の黒さおよび比抵抗の測定を行
った。解像度は電極パターンの電子顕微鏡(SEM)写
真で全体、表面、断面を観察した。電極膜の黒さは、パ
ターン形成をしないベタを焼成したサンプルについて、
スガ試験機(株)製のカラーコンピューター(SM−7
−CH)を用いて、刺激値Yを測定した。比抵抗は専用
パターンを作製して測定・算出をした。The firing was carried out by raising the temperature at 250 ° C./hour and maintaining the maximum temperature at 580 ° C. for 15 minutes. Under the same conditions, a sample for pattern resolution test, a sample for measuring the blackness of the electrode film, and a sample for measuring the specific resistance were prepared, and the pattern resolution was observed, and the blackness and the specific resistance of the electrode film were measured. Regarding the resolution, the whole, surface, and cross section were observed with an electron microscope (SEM) photograph of the electrode pattern. Regarding the blackness of the electrode film,
Color computer (SM-7) manufactured by Suga Test Instruments Co., Ltd.
-CH) was used to measure the stimulus value Y. The specific resistance was measured and calculated by preparing a dedicated pattern.
【0085】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は5.0であり、黒色度は非常
に高かった。また、比抵抗値は、10μΩ/cm2 であ
り、実用に耐えうるものであった。The pattern formability was good, and the cross section of the electrode line was rectangular. The Y value was 5.0, and the blackness was very high. Further, the specific resistance was 10 μΩ / cm 2 , which was practically usable.
【0086】実施例2 黒色化した導電性金属微粒子として、微粒子表面にFe
2O3を1重量%になるよう均一に被覆した銀を使用した
以外は、実施例1と同様にして、作製・評価を行った。Example 2 As blackened conductive metal fine particles, Fe particles
Preparation and evaluation were performed in the same manner as in Example 1 except that silver coated uniformly with 1% by weight of 2 O 3 was used.
【0087】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は10.0であり、黒色度は高
かった。また、比抵抗値は、18μΩ/cm2 であり、
実用に耐えうるものであった。The pattern formability was good, and the cross section of the electrode line was rectangular. The Y value was 10.0 and the blackness was high. The specific resistance value is 18 μΩ / cm 2 ,
It was practical.
【0088】実施例3 黒色化した導電性金属微粒子として、微粒子表面にCu
Oを1重量%になるよう均一に被覆した銀を使用した以
外は、実施例1と同様にして、作製・評価を行った。Example 3 As the black conductive metal fine particles, Cu
Preparation and evaluation were performed in the same manner as in Example 1 except that silver coated uniformly with O to 1% by weight was used.
【0089】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は8.0であり、黒色度は高か
った。また、比抵抗値は、18μΩ/cm2 であり、実
用に耐えうるものであった。The pattern formability was good and the cross section of the electrode line was rectangular. The Y value was 8.0 and the blackness was high. Further, the specific resistance value was 18 μΩ / cm 2 , which was practically usable.
【0090】実施例4 黒色化した導電性金属微粒子として、微粒子表面にMo
O2 を1重量%になるよう均一に被覆した銀を使用した
以外は、実施例1と同様にして、作製・評価を行った。Example 4 As the black conductive metal fine particles, Mo
Preparation and evaluation were performed in the same manner as in Example 1 except that silver coated uniformly with O 2 to 1% by weight was used.
【0091】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は12.0であり、黒色度は高
かった。また、比抵抗値は、20μΩ/cm2 であり、
実用に耐えうるものであった。The pattern formability was good, and the cross section of the electrode line was rectangular. The Y value was 12.0, and the blackness was high. The specific resistance value is 20 μΩ / cm 2 ,
It was practical.
【0092】実施例5 黒色化した導電性金属微粒子として、微粒子表面にRu
O2 を3重量%になるよう均一に被覆したアルミニウム
を使用した以外は、実施例1と同様にして、作製・評価
を行った。Example 5 As blackened conductive metal fine particles, Ru was applied to the surface of the fine particles.
Preparation and evaluation were performed in the same manner as in Example 1 except that aluminum coated uniformly with O 2 at 3% by weight was used.
【0093】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は20.0であり、黒色度は高
かった。また、比抵抗値は、25μΩ/cm2 であり、
実用に耐えうるものであった。The pattern formability was good, and the cross section of the electrode line was rectangular. The Y value was 20.0, and the blackness was high. The specific resistance value is 25 μΩ / cm 2 ,
It was practical.
【0094】実施例6 黒色化した導電性金属微粒子として、微粒子表面にRu
O2 を3重量%になるよう均一に被覆したニッケルを使
用した以外は、実施例1と同様にして、作製・評価を行
った。Example 6 As blackened conductive metal fine particles, Ru was applied to the surface of the fine particles.
Preparation and evaluation were performed in the same manner as in Example 1 except that nickel coated uniformly with O 2 to 3% by weight was used.
【0095】パターン形成性は良好で、電極ラインの断
面は矩形であった。Y値は5.0であり、黒色度は非常
に高かった。また、比抵抗値は、25μΩ/cm2 であ
り、実用に耐えうるものであった。The pattern formability was good, and the cross section of the electrode line was rectangular. The Y value was 5.0, and the blackness was very high. The specific resistance value was 25 μΩ / cm 2 , which was practically usable.
【0096】比較例1 黒色化した導電性金属微粒子として、微粒子表面にRu
O2 を10重量%になるよう均一に被覆した銀を使用し
た以外は、実施例1と同様にして、作製・評価を行っ
た。Comparative Example 1 Ru black conductive metal fine particles
Production and evaluation were performed in the same manner as in Example 1 except that silver coated uniformly with O 2 to 10% by weight was used.
【0097】パターン形成性は良好で、電極ラインの断
面は矩形であった。また、Y値は3.0であり、黒色度
は高かった。しかしながら、抵抗値は、50μΩ/cm
2 であり、実用に耐えうるものでなかった。The pattern formability was good, and the cross section of the electrode line was rectangular. Further, the Y value was 3.0, and the blackness was high. However, the resistance value is 50 μΩ / cm
2 , which was not practical.
【0098】比較例2 黒色化した導電性金属微粒子として、微粒子表面にCu
Oを10重量%になるよう均一に被覆した銀を使用した
以外は、実施例1と同様にして、作製・評価を行った。Comparative Example 2 As blackened conductive metal fine particles, Cu
Production and evaluation were performed in the same manner as in Example 1 except that silver coated uniformly with O to 10% by weight was used.
【0099】パターン形成性は良好で、電極ラインの断
面は矩形であった。また、Y値は3.0であり、黒色度
は高かった。しかしながら、比抵抗値は、100μΩ/
cm2 であり、実用に耐えうるものでなかった。The pattern formability was good, and the cross section of the electrode line was rectangular. Further, the Y value was 3.0, and the blackness was high. However, the specific resistance value is 100 μΩ /
cm 2 , which was not enough for practical use.
【0100】[0100]
【表1】 [Table 1]
【表2】 表中の略称に関して次に示す。[Table 2] The abbreviations in the table are shown below.
【0101】X−4007 :40%のメタアクリル酸
(MAA)、30%のメチルメタアクリレート(MM
A)および30%のスチレン(St)からなる共重合体
のカルボキシル基に対して0.4当量のグリシジルメタ
アクリレート(GMA)を付加反応させた重量平均分子
量43000、酸価95の感光性ポリマー TPA :トリメチロールプロパントリアクリレ
ート MTPMP :2-メチル-1-[4-(メチルチオ)フェニ
ル]-2-モルホリノプロパノン-1 DBP :ジブチルフタレート SiO2 :”アエロジル” スダン :アゾ系染料、C24H20N4O γ-BL :γ−ブチロラクトンX-4007: 40% methacrylic acid (MAA), 30% methyl methacrylate (MM
A) Photopolymer TPA having a weight average molecular weight of 43000 and an acid value of 95 obtained by subjecting a carboxyl group of a copolymer comprising A) and 30% styrene (St) to an addition reaction with 0.4 equivalent of glycidyl methacrylate (GMA). : Trimethylolpropane triacrylate MTPMP: 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1 DBP: dibutyl phthalate SiO 2 : “Aerosil” Sudan: azo dye, C 24 H 20 N 4 O γ-BL: γ-butyrolactone
【表3】 [Table 3]
【0102】[0102]
【発明の効果】本発明の黒色化した感光性導電ペースト
を用いることにより、簡便な方法で抵抗値の低いプラズ
マディスプレイまたはプラズマアドレス液晶ディスプレ
イの黒色の電極を形成することができる。By using the blackened photosensitive conductive paste of the present invention, a black electrode of a plasma display or a plasma addressed liquid crystal display having a low resistance value can be formed by a simple method.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H01J 9/02 H01J 9/02 F ──────────────────────────────────────────────────の Continued on front page (51) Int.Cl. 6 Identification code FI H01J 9/02 H01J 9/02 F
Claims (11)
する有機成分からなる感光性導電ペーストであって、導
電性の金属微粒子中にRu、Cr、Fe、Co、Mn、
Cuの群から選ばれた少なくとも1種の金属またはその
酸化物を0.5〜5重量%含有し、かつ、このペースト
を基板に5〜30μmの厚みで塗布し、焼成した時の色
の刺激値Yが1〜30の範囲であることを特徴とする感
光性導電ペースト。1. A photosensitive conductive paste comprising conductive metal fine particles and an organic component containing a photosensitive compound, wherein Ru, Cr, Fe, Co, Mn,
Stimulation of color when the paste contains 0.5 to 5% by weight of at least one metal selected from the group of Cu or an oxide thereof, and is applied to a substrate with a thickness of 5 to 30 μm and fired. A photosensitive conductive paste, wherein the value Y is in the range of 1 to 30.
から選ばれた少なくとも1種の金属又は金属酸化物が導
電性の金属微粒子表面を被覆していることを特徴とする
請求項1の感光性導電ペースト。2. The method according to claim 1, wherein at least one kind of metal or metal oxide selected from the group consisting of Ru, Cr, Fe, Co, Mn and Cu covers the surface of the conductive metal fine particles. 1. The photosensitive conductive paste of 1.
t、NiおよびAlの群から選ばれた少なくとも1種の
金属を含有することを特徴とする請求項1のペースト。3. The conductive metal of Ag, Au, Pd, P
2. The paste according to claim 1, comprising at least one metal selected from the group consisting of t, Ni and Al.
5μmの範囲であることを特徴とする請求項1の感光性
導電ペースト。4. The conductive metal fine particles have an average particle size of 0.1 to 0.1.
2. The photosensitive conductive paste according to claim 1, wherein the thickness is in a range of 5 [mu] m.
ラス微粒子を含有することを特徴とする請求項1の感光
性導電ペースト。5. The photosensitive conductive paste according to claim 1, wherein the paste contains glass fine particles in a range of 10% by weight or less.
0℃、ガラス軟化点が470〜600℃であることを特
徴とする請求項1の感光性導電ペースト6. A glass powder having a glass transition point of 400 to 50.
2. The photosensitive conductive paste according to claim 1, wherein the glass has a softening point of 470 to 600 [deg.] C.
範囲であることを特徴とする請求項1の感光性導電ペー
スト。7. The photosensitive conductive paste according to claim 1, wherein the average particle size of the glass powder is in the range of 0.1 to 5 μm.
平均分子量500〜10万のオリゴマーもしくはポリマ
ーを10〜90重量%含むことを特徴とする請求項1の
感光性導電ペースト。8. The photosensitive conductive paste according to claim 1, wherein the organic component contains 10 to 90% by weight of an oligomer or polymer having an unsaturated double bond and having a weight average molecular weight of 500 to 100,000.
とする請求項1の感光性導電ペースト。9. The photosensitive conductive paste according to claim 1, which is used for a plasma display.
群から選ばれた少なくとも1種の金属またはその酸化物
を0.5〜5重量%含有する導電性の金属を含む導電ペ
ーストを基板上に塗布し、焼成して、厚み5〜30μ
m、色の刺激値Yが1〜30の電極を形成することを特
徴とするプラズマディスプレイ用電極の製造方法。10. A conductive paste containing a conductive metal containing 0.5 to 5% by weight of at least one metal selected from the group consisting of Ru, Cr, Fe, Co, Mn and Cu or an oxide thereof. Coated on a substrate, baked, thickness 5-30μ
A method for manufacturing an electrode for a plasma display, wherein an electrode having a color stimulus value Y of 1 to 30 is formed.
に塗布し、フォトリソグラフィでパターン形成した後
に、焼成して、厚み5〜30μm、色の刺激値Yが1〜
30の電極を形成することを特徴とするプラズマディス
プレイ用電極の製造方法。11. The photosensitive conductive paste of claim 1 is applied on a substrate, patterned by photolithography, and then baked to have a thickness of 5 to 30 μm and a color stimulus value of 1 to 1.
A method for manufacturing an electrode for a plasma display, comprising forming 30 electrodes.
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JP13701397A JP3520720B2 (en) | 1997-05-27 | 1997-05-27 | Method for producing photosensitive conductive paste and electrode for plasma display |
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JP13701397A JP3520720B2 (en) | 1997-05-27 | 1997-05-27 | Method for producing photosensitive conductive paste and electrode for plasma display |
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