JPH10325581A - Clean room - Google Patents

Abstract

(57) [Summary] A section into which high-purity air is introduced in a clean room for semiconductor manufacturing or the like having a plurality of sections into which air of different cleanliness is introduced on a common free access floor. Return air is not contaminated in the underfloor chamber. Also, it is possible to easily transfer pipes and wiring within the free access floor. A floor plate 12a on the laminar flow type clean room 2 side of the free access floor 1 is provided with no opening on the plate surface, and a floor plate 12b on the turbulent flow type clean room 3 side is provided with an opening on the plate surface. Install. Laminar flow clean room 2
A predetermined space is opened on the floor plate 12a of the
A perforated floor plate 6 with 1 is installed. As a result, the space between the perforated floor plate 6 and the floor plate 12a is defined as the underfloor chamber 7 on the laminar flow type clean room 2 side. The underfloor chamber on the side of the turbulent clean room 3 is inside the free access floor 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clean room having a plurality of sections into which air of different cleanliness is introduced on a common free access floor.

[0002]

2. Description of the Related Art In a recent semiconductor manufacturing plant, for example, as shown in FIG. 3, a turbulent clean room 3 and a laminar clean room 2 having different cleanliness are arranged adjacent to each other, and the manufacturing apparatus S is further cleaned. It is installed in a turbulent-type clean room 3 having a low cleanliness, and its front surface (the surface on the side of the entrance for taking in and out of parts and products) faces the laminar-flow-type clean room 2 having higher cleanliness. On the ceiling of each of the clean rooms 2 and 3, a fan filter unit F including an air filter a and a fan f according to cleanliness is installed.

The two clean rooms 2 and 3 are formed on a common free access floor 1 composed of a concrete slab 11 and a floor plate 12b having an opening in a plate surface. ,
3 underfloor chamber. In the free access floor 1, wirings 4 and pipes 5 for supplying power, water and the like to each of the clean rooms 2 and 3 are arranged.

In order to prevent the return air of the turbulent clean room 3 from entering the laminar clean room 2, the partition plate 8 is provided so that the laminar clean room 2 and the turbulent clean room 3 have different ceilings. Chambers 9a and 9b and underfloor chambers 7 and 17 are formed, and these are connected by separate return air ducts 10A and 10B, respectively.

[0005]

Therefore, in such a conventional clean room, the wiring and piping in the free access floor are arranged so as to penetrate the partition plate, and the wiring and piping are relocated due to a layout change or the like. In such a case, it is necessary to change the penetration position of the partition plate, so that the operation becomes complicated. Particularly in the clean room for semiconductor manufacturing, the technology in the semiconductor industry advances rapidly and manufacturing equipment is frequently replaced, so there are many opportunities for layout changes, and it is easier to relocate wiring and piping on the free access floor. Was sought.

Further, the partition plate is often fixed to the floor plate with a sealing material or the like without any gap in order to surely separate the underfloor chamber, and it takes time to transfer the partition plate itself. Furthermore, since the return air from the laminar flow type clean room passes through the free access floor where the pipes and wiring are provided, the return air may be contaminated here.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems of the prior art, and has a plurality of sections into which air of different cleanliness is introduced on a common free access floor. Provide a clean room that prevents return air from the section where high-purity air is introduced from being contaminated in the underfloor chamber, and that can easily cope with the relocation of piping and wiring on the free access floor. The task is to

[0008]

In order to solve the above problems, the invention according to claim 1 is directed to a clean room having a plurality of sections into which air of different cleanliness is introduced on a common free access floor. A separate ceiling chamber and return air duct are provided for the section where the low-purity air is introduced and the section where the high-purity air is introduced, and the section where the low-purity air is introduced is a free access floor. The floorboards are made of floorboards with openings on the board surface and the inside of the free access floor is used as an underfloor chamber, and the section where high clean air is introduced is made up of the floorboards on the free access floor with no openings on the board surface. Then, a perforated floor plate having an opening on the plate surface is arranged by opening a predetermined space above the floor plate, and a space between the perforated floor plate and the floor plate of the free access floor is defined as an underfloor chamber for the partition. Providing a clean room, characterized in that the.

That is, the underfloor chamber of the section into which low-purity air is introduced is on a free access floor where wiring and piping are provided, but the underfloor chamber of the section into which high-purity air is introduced is free access. Because it is formed above the floor instead of in the floor, the return air in this section is not contaminated by piping and wiring in the free access floor. Also,
Since there is no need to separate the inside of the free access floor with a partition plate, it is possible to easily transfer piping and wiring within the free access floor.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram showing a clean room corresponding to one embodiment of the present invention.

In this clean room, a laminar flow type clean room (division) 2 and a turbulent flow type clean room (division) 3 having different cleanliness are provided adjacent to each other on a common free access floor 1. The cleanliness of the laminar flow type clean room 2 is set higher than that of the turbulent flow type clean room 3, and a fan filter unit F having an air filter a and a fan f corresponding to the cleanliness is provided on the ceiling of each of the clean rooms 2 and 3. is set up.

A semiconductor manufacturing apparatus S is installed in the turbulent flow type clean room 3 on the boundary side with the laminar flow type clean room 2, and the manufacturing apparatus S is installed from the laminar flow type clean room 2 side.
Products and parts are taken in and out of the facility.

The free access floor 1 is a double floor composed of a concrete slab 11 and a floor plate 12 arranged on the concrete slab 11 at a predetermined interval, in which wiring 4 and piping 5 are arranged. .

FIG. 2 is a sectional view showing a portion near the free access floor 1 at a boundary position between the laminar flow type clean room 2 and the turbulent flow type clean room 3. As shown in this figure, the floor plate 12a installed on the laminar flow type clean room 2 side of the free access floor 1 has no opening in the plate surface,
The floor plate 12b installed on the side of the turbulent clean room 3 has an opening in the plate surface. On the floor plate 12a of the laminar flow clean room 2, a perforated floor plate 6 having a predetermined space and an opening 61 on the plate surface is provided.

Thus, the space between the perforated floor plate 6 and the floor plate 12a becomes the underfloor chamber 7 on the laminar flow type clean room 2 side. The underfloor chamber on the side of the turbulent clean room 3 is inside the free access floor 1.

In the ceiling, a partition plate 8 is provided at the boundary between the laminar flow type clean room 2 and the turbulent flow type clean room 3,
Separate ceiling chambers 9a, 9b are formed. The ceiling chamber 9a on the laminar flow type clean room 2 side and the underfloor chamber 7 are connected by a return air duct 10A extending in the vertical direction, and the ceiling chamber 9a on the turbulence type clean room 3 side.
b and the free access floor 1 are connected by a return air duct 10B extending in the vertical direction.

Therefore, the return air from the turbulent flow type clean room 3 enters the ceiling chamber 9b through the return air duct 10B from the free access floor 1 where the wiring 4 and the pipe 5 are arranged. Return air enters the ceiling chamber 9a through the return air duct 10A from within the underfloor chamber 7 where the wiring 4 and the pipe 5 are not arranged.

As a result, the return air of the laminar flow type clean room 2 is not contaminated by the pipe 4 or the wiring 5. The underfloor chamber 7 of the laminar flow type clean room 2 and the underfloor chamber (free access floor) 1 of the turbulent flow type clean room 3
Since it is separated by the wall material K separating the two clean rooms 2 and 3, low clean air from the free access floor 1 does not enter the underfloor chamber 7 of the laminar flow type clean room 2. As a result, the life of the air filter of the laminar flow type clean room 2 can be extended. In addition, the effect of preventing contamination at the molecular level is high.

Since the inside of the free access floor 1 is not used as the underfloor chamber of the laminar flow type clean room 2, it is not necessary to finish the inside of the free access floor 1 to a strict specification according to the cleanliness of the laminar flow type clean room 2. As a result, the cost of the entire clean room is reduced.

Further, since there is no partition plate in the free access floor 1, the transfer of the pipes 5 and the wirings 4 accompanying the movement of the manufacturing apparatus S can be simplified. In this embodiment, since the heavy manufacturing apparatus S is not installed in the laminar flow type clean room 2, the underfloor chamber 7 is provided in advance on the floor plate 12 a having no opening of the laminar flow type clean room 2 and on the perforated floor plate 6. The legs 6a are easily formed by arranging the fixed members side by side. In addition, when a heavy manufacturing apparatus S or the like is installed in the laminar flow type clean room 2, it can be easily coped with by removing the member from the installation position.

Further, in this embodiment, the fan filter unit F is installed on the ceiling of the clean rooms 2 and 3. However, the clean room of the present invention is not limited to this. The air filter and the fan may be provided in the return air duct by providing only a ventilation hole in the ceiling.

[0022]

As described above, according to the clean room of the present invention, the underfloor chamber of the section into which the high-purity air is introduced is formed not above the free access floor but above it. The return air of the compartment can easily be prevented from being contaminated in the underfloor chamber. As a result, it is possible to prolong the life of the air filter in the section into which the highly clean air is introduced. Further, the cost of the entire clean room can be reduced. Furthermore, from the viewpoint of controlling the contamination at the molecular level, which has recently become a problem, the air in the high-purity area can be easily separated from the air in other areas, so that the effect of preventing contamination is high.

Further, since there is no need to fix the partition plate in the free access floor, the transfer of piping and wiring can be simplified. As a result, this clean room is particularly suitable for applications where the layout is frequently changed, such as a clean room for semiconductor manufacturing.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a clean room corresponding to one embodiment of the present invention.

FIG. 2 is a sectional view showing a portion near a free access floor at a boundary position between a laminar flow type clean room and a turbulent flow type clean room in FIG. 1;

FIG. 3 is a schematic configuration diagram illustrating an example of a conventional clean room.

[Description of Signs] 1 Free access floor (underfloor chamber of turbulent clean room) 2 Laminar flow clean room (compartment where high clean air is introduced) 3 Turbulent clean room (low clean air is introduced) 4) Wiring 5 Piping 6 Perforated floor plate 7 Underfloor chamber of laminar flow clean room 8 Partition plate 9a Ceiling chamber of laminar flow clean room 9b Ceiling chamber of turbulent clean room 10A Return air duct of laminar flow clean room 10B Turbulent flow Return air duct for clean room 11 Concrete slab 12 Floor plate for free access floor 12a Floor plate without opening 12b Floor plate with opening

Claims (1)

[Claims] In a clean room provided with a plurality of sections into which air of different cleanliness is introduced on a common free access floor, a section into which low-purity air is introduced and a section through which high-purity air are introduced. Separate ceiling chambers and return air ducts are provided for each section, and sections where low-purity air is introduced are constructed from floor boards with open openings on the floor of the free access floor, and the floor inside the free access floor is below the floor. The section where the air with high cleanliness is introduced is a chamber where the floor plate of the free access floor is made of a floor plate with no opening on the plate surface, and a predetermined space is opened above this floor plate to open a hole with an opening on the plate surface. A clean room in which a floor panel is arranged, and a space between the perforated floor panel and the floor panel of the free access floor is used as an underfloor chamber for the partition.