JPH10321826A - Solid-state image-pickup device with built-in optical low-pass filter and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state image-pickup device having a built-in optical low-pass filter which is capable of promoting size reduction in video cameras and pocket cameras. SOLUTION: To the inside of a package 2 having connecting pins 1, a solid- state image-pickup device 4 is fixed via the medium of a conductive resin 3. To the upper surface of the solid-state image-pickup device 4, a Pyrex (R) glass board 12 is fixed via the medium of gap materials 10 applied in the periphery of a chip where aluminum wiring pads do not exist, and an air layer 14 is formed between the solid-state image-pickup device 4 and the Pyrex (R) glass board 12. By heating at a temperature of 130-240 deg.C and forming an optical lens array 13, after applying a phenol novolak resin to a film thickness of 1.5-3.0 μm to the underside of the Pyrex (R) glass board 12 and patterning it into the shape of a desired phase lattice by exposure and development, an optical low-pass filter 11 is constituted. A quartz glass board 6 is fixed to the opening end of the package 2 by using an adhesive agent 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a solid-state imaging device having a built-in optical low-pass filter and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in a video camera or a pocket camera, as shown in FIG. 7, a solid-state image pickup device 23 is fixed inside a package 21 having connection pins 20 by using a conductive resin 22, and then the package is mounted. The solid-state imaging device 23 is sealed in the package 21 by fixing the quartz glass substrate 25 to the opening end of the substrate 21 using an adhesive 24. Then, the phosphoric acid glass substrate 26 is
A quartz low-pass filter 28 with a built-in infrared cut filter sandwiched by 7 is disposed outside the quartz glass substrate 25 at a distance.

[0003]

However, in the above-mentioned conventional configuration, a thick bonded crystal filter (a crystal low-pass filter 28 with a built-in external line cut filter) is used as an optical low-pass filter. Must be arranged outside the quartz glass substrate 25. Therefore, an extra space for installing an optical low-pass filter is required, and there is a problem that it is not possible to meet the demand for space saving of a video camera and a pocket camera, which are being miniaturized.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and an object of the present invention is to provide a solid-state imaging device with a built-in optical low-pass filter capable of promoting the miniaturization of video cameras and pocket cameras, and a method of manufacturing the same. The purpose is to provide.

[0005]

In order to achieve the above object, a solid-state imaging device incorporating an optical low-pass filter according to the present invention comprises a package, a solid-state imaging device fixed inside the package, and the solid-state imaging device. A first transparent substrate fixed in parallel with the solid-state imaging device via a substance having a predetermined thickness on the imaging device and having a refractive index of less than 1.5, and formed on a lower surface of the transparent substrate; The refractive index is 1.
It is characterized by comprising five or more optical lens arrays, and a second transparent substrate for sealing an opening end of the package. According to the configuration of the solid-state imaging device with a built-in optical low-pass filter, the solid-state imaging device and the optical low-pass filter including the first transparent substrate and the optical lens array formed on the lower surface of the first transparent substrate include: Since it is incorporated in a package in an integrally formed state, it is possible to protect the optical low-pass filter and promote the miniaturization of the video camera and the pocket camera by saving space. In addition, since the optical low-pass filter is incorporated in the package, the optical low-pass filter is less likely to be scratched or dusty, and the number of failures of the video camera and the pocket camera is reduced, so that reliability can be improved.

Further, in the configuration of the solid-state imaging device incorporating an optical low-pass filter of the present invention, it is preferable that the optical lens array is patterned in a phase grating shape. According to this preferred example, the thickness of the optical lens array can be reduced, and the thickness of the optical low-pass filter can be reduced. As a result, the solid-state imaging device and the optical low-pass filter can be easily incorporated in the package.

Further, in the configuration of the solid-state imaging device incorporating an optical low-pass filter according to the present invention, the refractive index is 1.5.
Preferably, less than substance is air. In the configuration of the solid-state imaging device with a built-in optical low-pass filter according to the present invention, it is preferable that the substance having a refractive index of less than 1.5 is a cyan dye-containing filter. According to this preferred example, since the cyan dye-containing filter has a property of absorbing infrared rays and transmitting visible light, it is possible to realize an optical low-pass filter built-in solid-state imaging device having an infrared cut filter function.

Further, in the configuration of the solid-state imaging device incorporating an optical low-pass filter according to the present invention, the refractive index is 1.5.
Preferably, less than a substance is a cyan pigment filter.
According to this preferred example, since the cyan pigment filter has a property of absorbing infrared rays and transmitting visible light,
A solid-state imaging device with a built-in optical low-pass filter having an infrared cut filter function can be realized.

In the configuration of the solid-state image pickup device having a built-in optical low-pass filter according to the present invention, it is preferable that the material of the optical lens array is a phenolic novolak resin.

[0010] In the configuration of the solid-state imaging device incorporating an optical low-pass filter according to the present invention, the first transparent substrate is preferably a Pyrex glass substrate. Also,
In the configuration of the solid-state imaging device with a built-in optical low-pass filter of the present invention, it is preferable that the first transparent substrate is a phosphate glass substrate. According to this preferred example, since the phosphate glass has a property of absorbing infrared light and transmitting visible light, a solid-state imaging device with an optical low-pass filter having an infrared cut filter function can be realized.

In the configuration of the solid-state image pickup device with built-in optical low-pass filter according to the present invention, the solid-state image pickup device and the first transparent substrate are interposed via a gap member made of a spherical spacer and a thermosetting resin. It is preferably fixed. According to this preferred example, only by thermosetting the thermosetting resin, the solid-state imaging device and the first transparent substrate having the optical lens array on the lower surface thereof are arranged in parallel to each other while maintaining a desired distance. It can be fixed in the state of being put.

Further, in the configuration of the solid-state image pickup device with a built-in optical low-pass filter according to the present invention, the solid-state image pickup device and the first transparent substrate are fixed via a gap material made of only an ultraviolet curable resin. Is preferred.

Further, in the configuration of the solid-state image pickup device having a built-in optical low-pass filter according to the present invention, the second transparent substrate is formed of a laminated substrate, and at least one of the substrates constituting the laminated substrate is a phosphate glass substrate. Is preferred. According to this preferred example, since the phosphate glass has a property of absorbing infrared light and transmitting visible light, a solid-state imaging device with an optical low-pass filter having an infrared cut filter function can be realized.

Further, a method of manufacturing a solid-state imaging device with a built-in optical low-pass filter according to the present invention includes a package, a solid-state imaging device fixed inside the package, and a predetermined thickness on the solid-state imaging device. And the refractive index is 1.5
A first transparent substrate fixed in parallel with the solid-state imaging device via less than a substance, an optical lens array having a refractive index of 1.5 or more formed on the lower surface of the transparent substrate, and A method of manufacturing a solid-state imaging device with a built-in optical low-pass filter, comprising: a second transparent substrate that seals an opening end; wherein, when an optical lens array is formed on a lower surface of the first transparent substrate, the first A phenolic novolak resin is applied to a transparent substrate, and patterned into a desired phase grating shape by exposure and development.
By heating at the above temperature, an elliptical optical lens array is formed on the first transparent substrate. According to the method of manufacturing a solid-state imaging device with a built-in optical low-pass filter, the optical lens array can be patterned in a phase grating shape to reduce the thickness of the optical low-pass filter. The low pass filter and the low pass filter can be easily incorporated in the package.

In the method of manufacturing a solid-state image pickup device with a built-in optical low-pass filter according to the present invention, the gap member for maintaining a predetermined distance between the solid-state image pickup device and the first transparent substrate is provided by the solid-state image pickup device. It is preferable to form it on the periphery of the chip where the aluminum wiring pad does not exist on the upper surface of the imaging device. In this case, it is preferable to use a gap material made of a spherical spacer and a thermosetting resin as the gap material. In this case, it is preferable to use a gap material made of only an ultraviolet curable resin as the gap material. In this case, it is preferable to irradiate the ultraviolet-curable resin with ultraviolet rays while maintaining the distance between the solid-state imaging device and the first transparent substrate mechanically constant.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described more specifically with reference to embodiments. <First Embodiment> FIG. 1 is a cross-sectional view showing a solid-state imaging device with a built-in optical low-pass filter according to a first embodiment of the present invention.

As shown in FIG. 1, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. A Pyrex glass substrate 12 is fixed to the upper surface of the solid-state imaging device 4 via a gap material 10 provided around the chip where no aluminum wiring pad exists. This allows
An air layer (refractive index: 1.0) 14 having a thickness of 30 to 80 μm is formed between the solid-state imaging device 4 and the Pyrex glass substrate 12. Here, the gap material 10 has a diameter of 30.
It is made of a mixture of a ceramic spacer 10a of .about.80 .mu.m and a thermosetting resin 10b such as acrylate. An optical lens array 13 is formed on the lower surface of the Pyrex glass substrate 12, thereby forming an optical low-pass filter 11. A quartz glass substrate 6 is fixed to the opening end of the package 2 via an adhesive 5 such as epoxy.

Hereinafter, a method for manufacturing the solid-state imaging device having the above-described structure and having a built-in optical low-pass filter will be described. First, inside the package 2 having the connection pins 1,
A conductive resin (silver paste) 3 is applied, and the solid-state imaging device 4 is mounted on the conductive resin 3. Then, the solid-state imaging device 4 is fixed inside the package 2 by thermosetting the conductive resin 3 at a temperature of 150 ° C. A Pyrex glass substrate 12 is coated with a phenolic novolak resin having a refractive index of 1.56 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. By heating at a temperature of ° C., an elliptical optical lens array 13 is formed on a Pyrex glass substrate 12, and an optical low-pass filter 11 is prepared in advance. As described above, since the optical lens array 13 is formed by patterning into a phase grating shape, the thickness of the optical lens array 13 can be reduced, and as a result, the film thickness of the optical low-pass filter 11 is reduced. be able to. Then, 30-80μ in diameter
The gap material 10 obtained by mixing the m spacers 10a and the thermosetting resin (acrylate) 10b is applied to the periphery of the chip on the upper surface of the solid-state imaging device 4 where there is no aluminum wiring pad. Then, the optical low-pass filter 11 is placed on the gap material 10 with the optical lens array 13 facing downward, and the gap material 10 is thermally cured at a temperature of 120 ° C. Thereby, the solid-state imaging device 4
And a Pyrex glass substrate 12 having an optical lens array 13 on its lower surface are fixed in a state where they are arranged in parallel with each other via an air layer 14 having a thickness of 30 to 80 μm. Next, an adhesive (epoxy) 5 is applied to the open end of the package 2 and the quartz glass 6 is placed thereon.
The adhesive 5 is thermally cured at a temperature of. As a result, the solid-state imaging device 4 and the optical low-pass filter 11 are incorporated in the package 2 in an integrally formed state.

By adopting the above configuration,
By making the film thickness of the optical low-pass filter 11 thin, the solid-state imaging device 4 and the optical low-pass filter 11 can be easily incorporated in the package 2. As a result, protection of the optical low-pass filter 11 can be achieved, and the size of the video camera and the pocket camera can be promoted by saving space. In addition, since the optical low-pass filter 11 is incorporated in the package 2, the optical low-pass filter 11 is less likely to be scratched or dusty, and the number of failures of the video camera and the pocket camera is reduced. Can be.

In the present embodiment, the ceramic spacer 10 is used as the spacer in the gap material 10, but it is not necessarily limited to this.
A spacer made of another material can be used as long as it is spherical and has a certain strength and uniformity.

<Second Embodiment> FIG. 2 shows a second embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to the embodiment.

As shown in FIG. 2, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. A Pyrex glass substrate 12 is fixed on the upper surface of the solid-state imaging device 4 via an ultraviolet curable resin (gap material) 15 such as a modified acrylate provided on the periphery of the chip where there is no aluminum wiring pad. Thereby, the air layer 14 is provided between the solid-state imaging device 4 and the Pyrex glass substrate 12.
Are formed. An optical lens array 13 is formed on the lower surface of the Pyrex glass substrate 12, thereby forming an optical low-pass filter 11. A quartz glass substrate 6 is fixed to the opening end of the package 2 via an adhesive 5 such as epoxy.

Hereinafter, a method of manufacturing the solid-state imaging device having the above-described structure and having a built-in optical low-pass filter will be described. First, inside the package 2 having the connection pins 1,
A conductive resin (silver paste) 3 is applied, and the solid-state imaging device 4 is mounted on the conductive resin 3. Then, the solid-state imaging device 4 is fixed inside the package 2 by thermosetting the conductive resin 3 at a temperature of 150 ° C. A Pyrex glass substrate 12 is coated with a phenolic novolak resin having a refractive index of 1.56 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. By heating at a temperature of ° C., an elliptical optical lens array 13 is formed on a Pyrex glass substrate 12, and an optical low-pass filter 11 is prepared in advance. Next, an ultraviolet curable resin (modified acrylate) 15 is applied to the periphery of the chip on the upper surface of the solid-state imaging device 4 where there is no aluminum wiring pad. Then, the optical low-pass filter 11 is placed on the ultraviolet curable resin 15 with the optical lens array 13 facing downward, and the distance between the solid-state imaging device 4 and the optical low-pass filter 11 is mechanically fixed ( 30-80μ
The ultraviolet-curable resin 15 is cured by irradiating the ultraviolet-curable resin 15 with ultraviolet rays in the state held in m). Accordingly, the solid-state imaging device 4 and the Pyrex glass substrate 12 having the optical lens array 13 on the lower surface thereof
Are fixed in a state where they are arranged in parallel with each other via an air layer 14 having a thickness of 30 to 80 μm. Next, an adhesive (epoxy) 5 is applied to the opening end of the package 2 and the quartz glass substrate 6 is placed, and then the adhesive 5 is thermally cured at a temperature of 170 ° C. As a result, the solid-state imaging device 4 and the optical low-pass filter 11 are incorporated in the package 2 in an integrally formed state.

By adopting the above configuration,
As in the case of the first embodiment, the optical low-pass filter 11 can be protected, and the size of the video camera and the pocket camera can be reduced by saving space.

In the present embodiment, an ultraviolet curable resin is used as the gap material. However, the present invention is not limited to this. For example, when a far ultraviolet curable resin is used as the gap material. Even so, a solid-state imaging device with a built-in optical low-pass filter having the same function can be realized.

<Third Embodiment> FIG. 3 shows a third embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to the embodiment.

As shown in FIG. 3, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. A Pyrex glass substrate 12 is fixed on the upper surface of the solid-state imaging device 4 via an ultraviolet curable resin (gap material) 15 such as a modified acrylate provided on the periphery of the chip where there is no aluminum wiring pad. Thereby, the air layer 1 is located between the solid-state imaging device 4 and the Pyrex glass substrate 12.
4 are formed. An optical lens array 13 is formed on the lower surface of the Pyrex glass substrate 12, thereby forming an optical low-pass filter 11. A quartz glass substrate 6 with a phosphate glass substrate 16 sandwiched therebetween is fixed to the opening end of the package 2 via an adhesive 5 such as epoxy. Hereinafter, a method of manufacturing the solid-state imaging device having the above-described configuration and having a built-in optical low-pass filter will be described.

First, a conductive resin (silver paste) 3 is applied to the inside of a package 2 having connection pins 1, and a solid-state imaging device 4 is mounted on the conductive resin 3. And 15
By thermosetting the conductive resin 3 at a temperature of 0 ° C.,
The solid-state imaging device 4 is fixed inside the package 2. A Pyrex glass substrate 12 is coated with a phenolic novolak resin having a refractive index of 1.56 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. By heating at a temperature of ° C., an elliptical optical lens array 13 is formed on a Pyrex glass substrate 12, and an optical low-pass filter 11 is prepared in advance. Next, an ultraviolet curable resin (modified acrylate) 15 is applied to the periphery of the chip on the upper surface of the solid-state imaging device 4 where there is no aluminum wiring pad. Then, the optical low-pass filter 11 is
The optical lens array 13 is placed on the ultraviolet curable resin 15 with the optical lens array 13 facing downward, and the distance between the solid-state imaging device 4 and the optical low-pass filter 11 is mechanically fixed (30 to 80).
In this state, the ultraviolet curable resin 15 is irradiated with ultraviolet rays to cure the ultraviolet curable resin 15. Thereby, the solid-state imaging device 4 and the Pyrex glass substrate 1 having the optical lens array 13 on the lower surface thereof
2 are fixed in a state where they are arranged in parallel with each other via an air layer 14 having a thickness of 30 to 80 μm. Further, by sandwiching the phosphate glass substrate 16 between the quartz glass substrates 6, a laminated substrate 30 having high moisture resistance and having an infrared cut filter function is manufactured in advance. Then
An adhesive (epoxy) 5 is applied to the opening end of the package 2 and the laminated substrate 30 is placed, and then the adhesive 5 is thermally cured at a temperature of 170 ° C. As a result, the solid-state imaging device 4 and the optical low-pass filter 11 are incorporated in the package 2 in an integrally formed state.

By adopting the above configuration,
As in the case of the first embodiment, the optical low-pass filter 11 can be protected, and the size of the video camera and the pocket camera can be reduced by saving space. Further, since the open end of the package 2 is sealed by the laminated substrate 30 having an infrared cut filter function in which the phosphate glass substrate 16 is interposed between the quartz glass substrates 6, a built-in optical low-pass filter having an infrared cut filter function is provided. A solid-state imaging device can be realized.

<Fourth Embodiment> FIG. 4 shows a fourth embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to the embodiment.

As shown in FIG. 4, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. On the upper surface of the solid-state imaging device 4, the phosphate glass substrate 1 is interposed via an ultraviolet curable resin (gap material) 15 such as modified acrylate provided on the periphery of the chip where there is no aluminum wiring pad.
7 is fixed. Thus, an air space 14 is formed between the solid-state imaging device 4 and the phosphate glass 17.
An optical lens array 13 is formed on the lower surface of the phosphate glass substrate 17 so that the optical low-pass filter 1 is formed.
1 is configured. A quartz glass substrate 6 is fixed to the opening end of the package 2 via an adhesive 5 such as epoxy.

Hereinafter, a method of manufacturing the solid-state imaging device having the above-described configuration and having a built-in optical low-pass filter will be described. First, inside the package 2 having the connection pins 1,
A conductive resin (silver paste) 3 is applied, and the solid-state imaging device 4 is mounted on the conductive resin 3. Then, the solid-state imaging device 4 is fixed inside the package 2 by thermosetting the conductive resin 3 at a temperature of 150 ° C. Further, a phenolic novolak resin having a refractive index of 1.56 is applied to the phosphate glass substrate 17 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. C., the elliptical optical lens array 13 is formed on the phosphate glass substrate 17.
Is formed, and an optical low-pass filter 11 having an infrared cut filter function is manufactured in advance. Next, an ultraviolet curable resin (modified acrylate) 15 is applied to the periphery of the chip on the upper surface of the solid-state imaging device 4 where there is no aluminum wiring pad. Then, the optical low-pass filter 11 is placed on the ultraviolet curable resin 15 with the optical lens array 13 facing downward, and the distance between the solid-state imaging device 4 and the optical low-pass filter 11 is mechanically fixed ( The ultraviolet-curable resin 15 is cured by irradiating the ultraviolet-curable resin 15 with ultraviolet rays while keeping the thickness at 30 to 80 μm). Thereby, the solid-state imaging device 4 and
A phosphor glass substrate 17 having an optical lens array 13 on its lower surface is fixed in a state of being arranged in parallel with each other via an air layer 14 having a thickness of 30 to 80 μm. Next, an adhesive (epoxy) 5 is applied to the open end of the package 2,
After placing the quartz glass substrate 6, the adhesive 5 is thermally cured at a temperature of 170 ° C. Thus, the solid-state imaging device 4 and the optical low-pass filter 11 having an infrared cut filter function are incorporated in the package 2 in a state of being integrally formed.

By adopting the above configuration,
As in the case of the first embodiment, the optical low-pass filter 11 can be protected, and the size of the video camera and the pocket camera can be reduced by saving space. Further, since the phosphate glass substrate 17 is used as the first transparent substrate, a solid-state imaging device with an optical low-pass filter having an infrared cut filter function can be realized.

<Fifth Embodiment> FIG. 5 shows a fifth embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to the embodiment.

As shown in FIG. 5, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. A Pyrex glass substrate 12 is fixed to the upper surface of the solid-state imaging device 4 via a cyan dye-containing filter (refractive index: 1.44) 18 having a thickness of 5 to 20 μm. An optical lens array 13 is formed on the lower surface of the Pyrex glass substrate 12, thereby forming an optical low-pass filter 11. A quartz glass 6 is fixed to an opening end of the package 2 via an adhesive 5 such as epoxy.

Hereinafter, a method of manufacturing the solid-state imaging device having the above-described configuration and having a built-in optical low-pass filter will be described. First, inside the package 2 having the connection pins 1,
A conductive resin (silver paste) 3 is applied, and the solid-state imaging device 4 is mounted on the conductive resin 3. Then, the solid-state imaging device 4 is fixed inside the package 2 by thermosetting the conductive resin 3 at a temperature of 150 ° C. Next, a cyan dye-containing filter 18 having an infrared cut filter function is applied to the entire surface of the solid-state imaging device 4, and the aluminum wiring pad is exposed by exposure and development. A Pyrex glass substrate 12 is coated with a phenolic novolak resin having a refractive index of 1.56 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. By heating at a temperature of ° C., an elliptical optical lens array 13 is formed on a Pyrex glass substrate 12, and an optical low-pass filter 11 is prepared in advance. Next, the optical low-pass filter 11 is placed on the cyan dye-containing filter 18 with the optical lens array 13 facing downward, and the cyan dye-containing filter 18 is thermally cured at a temperature of 180 ° C. 4 and a Pyrex glass substrate 12 having an optical lens array 13 on its lower surface are fixed in a state where they are arranged in parallel with each other via a cyan dye-containing filter 18 having a thickness of 5 to 20 μm. Thereby, the optical low-pass filter 11 having the infrared cut filter function is formed directly on the solid-state imaging device 4. Then
An adhesive (epoxy) 5 is applied to the opening end of the package 2 and the quartz glass substrate 6 is placed, and then the adhesive 5 is thermally cured at a temperature of 170 ° C. Thereby, the solid-state imaging device 4
And an optical low-pass filter 11 having an infrared cut filter function are incorporated in the package 2 in an integrally formed state.

By adopting the above configuration,
As in the case of the first embodiment, the optical low-pass filter 11 can be protected, and the size of the video camera and the pocket camera can be reduced by saving space. In addition, since the cyan dye-containing filter 18 was used as a substance having a refractive index of less than 1.5,
A solid-state imaging device with a built-in optical low-pass filter having an infrared cut filter function can be realized.

In this embodiment, the cyan dye-containing filter 18 is used as a substance having an infrared cut filter function. However, the present invention is not limited to this. The filter 18 absorbs infrared rays and transmits visible light. Any filter containing a dye to be used may be used.

<Sixth Embodiment> FIG. 6 shows a sixth embodiment of the present invention.
FIG. 4 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to the embodiment.

As shown in FIG. 6, a solid-state imaging device 4 is fixed inside a package 2 having connection pins 1 via a conductive resin 3 such as a silver paste. The Pyrex glass substrate 12 is fixed on the upper surface of the solid-state imaging device 4 via a cyan pigment filter (refractive index: 1.48) 19 having a thickness of 5 to 20 μm. Pyrex glass substrate 1
An optical lens array 13 is formed on the lower surface of the optical disk 2, thereby forming an optical low-pass filter 11. At the opening end of the package 2, an adhesive 5 such as epoxy
The quartz glass 6 is fixed via the.

Hereinafter, a method of manufacturing the solid-state imaging device having the above-described configuration and having a built-in optical low-pass filter will be described. First, inside the package 2 having the connection pins 1,
A conductive resin (silver paste) 3 is applied, and the solid-state imaging device 4 is mounted on the conductive resin 3. Then, the solid-state imaging device 4 is fixed inside the package 2 by thermosetting the conductive resin 3 at a temperature of 150 ° C. Next, a cyan pigment filter 19 having an infrared cut filter function
Is applied to the entire surface of the solid-state imaging device 4, and the aluminum wiring pad is exposed by exposure and development. A Pyrex glass substrate 12 is coated with a phenolic novolak resin having a refractive index of 1.56 in a thickness of 1.5 to 3.0 μm, and patterned into a desired phase grating shape by exposure and development. By heating at a temperature of ° C.
An elliptical optical lens array 13 is formed on a Pyrex glass substrate 12, and an optical low-pass filter 11 is manufactured in advance. Then, the optical low-pass filter 11
Is placed on the cyan pigment filter 19 with the optical lens array 13 facing downward, and the cyan pigment filter 19 is thermally cured at a temperature of 200 ° C., so that the solid-state imaging device 4 and the optical lens array 13 are The Pyrex glass substrate 12 on the lower surface is fixed in a state of being arranged in parallel with each other via a cyan pigment filter 19 having a thickness of 5 to 20 μm. Thereby, the optical low-pass filter 11 having the infrared cut filter function is formed directly on the solid-state imaging device 4. Next, an adhesive (epoxy) 5 is applied to the opening end of the package 2 and a quartz glass 6 is placed, and then the adhesive 5 is thermally cured at a temperature of 170 ° C. Thus, the solid-state imaging device 4 and the optical low-pass filter 11 having an infrared cut filter function are incorporated in the package 2 in a state of being integrally formed.

By adopting the above configuration,
As in the case of the first embodiment, the optical low-pass filter 11 can be protected, and the size of the video camera and the pocket camera can be reduced by saving space. In addition, since the cyan pigment filter 19 is used as a substance having a refractive index of less than 1.5, a solid-state imaging device with an optical low-pass filter having an infrared cut filter function can be realized.

In this embodiment, the cyan pigment filter 19 is used as a substance having an infrared cut filter function. However, the present invention is not limited to this. The infrared pigment filter 19 absorbs infrared rays and transmits visible light. Any filter containing a pigment may be used.

In the above embodiment, a phenolic novolak resin having a refractive index of 1.56 is used as the material of the optical lens array 13, but the material is not necessarily limited to this. If a lens material having a refractive index of 1.6 or more is used, a cyan pigment filter having a refractive index of less than 1.6 can be used as an infrared cut filter.

[0045]

As described above, according to the present invention,
Since the solid-state imaging device and the optical low-pass filter including the first transparent substrate and the optical lens array formed on the lower surface of the first transparent substrate are integrally formed in a package, In addition to protecting the target low-pass filter, the size of the video camera and the pocket camera can be reduced by saving space. In addition, since the optical low-pass filter is incorporated in the package, the optical low-pass filter is less likely to be scratched or dusty, and the number of failures of the video camera and the pocket camera is reduced, so that reliability can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a solid-state imaging device with a built-in optical low-pass filter according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a solid-state imaging device with a built-in optical low-pass filter according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a solid-state imaging device with a built-in optical low-pass filter according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a solid-state imaging device with a built-in optical low-pass filter according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing a solid-state imaging device with a built-in optical low-pass filter according to a sixth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a solid-state imaging device according to the related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection pin 2 Package 3 Conductive resin 4 Solid-state imaging device 5 Adhesive 6 Quartz glass substrate 10 Gap material 10a Ceramic spacer 10b Thermosetting resin 11 Optical low-pass filter 12 Pyrex glass substrate 13 Optical lens array 15 UV curable resin 16 Phosphate glass substrate 17 Phosphate glass substrate 18 Cyan dye-containing filter 19 Cyan pigment filter 30 Multilayer substrate

Claims (16)

[Claims] 1. A package, a solid-state imaging device fixed inside the package, and the solid-state imaging device having a predetermined thickness on the solid-state imaging device and having a refractive index of less than 1.5. A first transparent substrate fixed in parallel with the device, and a refractive index formed on the lower surface of the transparent substrate is 1.
A solid-state imaging device with a built-in optical low-pass filter, comprising at least five optical lens arrays and a second transparent substrate for sealing an opening end of the package. 2. The solid-state imaging device according to claim 1, wherein the optical lens array is patterned in a phase grating shape. 3. The solid-state imaging device according to claim 1, wherein the substance having a refractive index of less than 1.5 is air. 4. The solid-state imaging device with a built-in optical low-pass filter according to claim 1, wherein the substance having a refractive index of less than 1.5 is a cyan dye-containing filter. 5. The solid-state imaging device according to claim 1, wherein the substance having a refractive index of less than 1.5 is a cyan pigment filter. 6. The solid-state imaging device according to claim 1, wherein the material of the optical lens array is a phenolic novolak resin. 7. The solid-state imaging device according to claim 1, wherein the first transparent substrate is a Pyrex glass substrate. 8. The solid-state imaging device with a built-in optical low-pass filter according to claim 1, wherein the first transparent substrate is a phosphate glass substrate. 9. The solid-state imaging device according to claim 1, wherein the solid-state imaging device and the first transparent substrate are fixed via a gap material formed of a spherical spacer and a thermosetting resin. . 10. The solid-state imaging device and the first transparent substrate,
2. The solid-state imaging device with a built-in optical low-pass filter according to claim 1, wherein the solid-state imaging device is fixed via a gap material made of only an ultraviolet curable resin. 11. The second transparent substrate comprises a laminated substrate,
2. The solid-state imaging device with a built-in optical low-pass filter according to claim 1, wherein at least one of the substrates constituting the laminated substrate is a phosphate glass substrate. 12. A package, a solid-state imaging device fixed inside the package, and the solid-state imaging device having a predetermined thickness on the solid-state imaging device and having a refractive index of less than 1.5. A first transparent substrate fixed in parallel with the device, an optical lens array having a refractive index of 1.5 or more formed on the lower surface of the transparent substrate, and a second sealing an open end of the package. A method for manufacturing a solid-state imaging device with a built-in optical low-pass filter, comprising: a transparent substrate; wherein a phenolic novolak resin is formed on the first transparent substrate when forming an optical lens array on a lower surface of the first transparent substrate. After coating and patterning into a desired phase grating shape by exposure and development, heating is performed at a temperature of 130 to 240 ° C. to form an elliptical optical lens array on the first transparent substrate. A method of manufacturing a solid-state imaging device with a built-in optical low-pass filter. 13. A gap material for maintaining a predetermined distance between the solid-state imaging device and the first transparent substrate at a peripheral portion of a chip on the top surface of the solid-state imaging device where no aluminum wiring pad exists. Item 13. A method for manufacturing the solid-state imaging device with a built-in optical low-pass filter according to Item 12. 14. A gap material comprising a spherical spacer and a thermosetting resin is used as the gap material.
3. The method for manufacturing a solid-state imaging device with a built-in optical low-pass filter according to item 1. 15. The method for manufacturing a solid-state imaging device with a built-in optical low-pass filter according to claim 13, wherein a gap material made of only an ultraviolet curable resin is used as the gap material. 16. The solid-state imaging device with built-in optical low-pass filter according to claim 15, wherein the ultraviolet-curable resin is irradiated with ultraviolet light while the distance between the solid-state imaging device and the first transparent substrate is kept mechanically constant. Device manufacturing method.