JPH10304154A - Image sensor, image sensor chip, and led print head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the pitch between photodetectors in an area nearby the joint of image sensor chips by a simple means and to improve the quality of a read image when the photodetector pitch of the image sensor is reduced so that a high-density image can be read. SOLUTION: This image sensor has image sensor chips 1 arrayed at specific pitch intervals. The image sensor chips 1 are provided with photodetector arrays N1 and N2 in parallel by arranging photodetectors 11 in arrays, and those photodetectors 11 in the photodetector arrays N1 and N2 shift in position from each other along their arrays. End edge parts 10a and 10b of lengthwise end parts of the respective image sensor chips 1 positioned at joints 95 of the image sensor chips 1 are made oblique so that a photodetector 11b of a different photodector array N2 is positioned between two photodectors 11a and 11c of one photodector array N1 positioned across the joint 95.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor used for reading an image in a facsimile apparatus and various scanner apparatuses, an image sensor chip constituting the image sensor, and a photosensitive apparatus in an electrophotographic recording type printer apparatus. The present invention relates to an LED print head used for performing optical writing on a body.

[0002]

2. Description of the Related Art Generally, an image sensor has a structure in which a plurality of image sensor chips are arranged in a line on a predetermined printed circuit board. In each of the plurality of image senna chips, a plurality of light receiving elements (photoelectric conversion elements) are integrally formed, and are arranged in a row at a predetermined pitch. Light can be received by a plurality of light receiving elements. For example, a document of A4 width is converted to 200 dpi (8 dots / m
When reading at a reading density of m), 1,728 light receiving elements are arranged at a pitch of 125 μm. For example, 96 light receiving elements are integrally formed in one image sensor chip. Therefore, in this case,
A total of 18 image sensor chips are arranged on the printed wiring board.

[0003]

However, FIG.
As shown in FIG.
Has merely arranged a plurality of light receiving elements 19 in a row at a predetermined interval La on a chip-shaped silicon substrate 10e having a rectangular shape in a plan view. For this reason, conventionally, the following inconvenience has occurred.

That is, the image sensor chip 1e
In the case of manufacturing, even if it is attempted to reduce the interval between the plurality of light receiving elements 19 in order to increase the image reading density,
The image sensor chip 1e includes a silicon substrate 10e.
Since the light receiving element 19 is formed into a chip and then cut into chips, it is not possible to reduce the dimension Lb between the edge 18 at the longitudinal end and the light receiving element 19 (19a) in the vicinity thereof. It was difficult. For this reason, when the plurality of image sensor chips 1e are arranged in a line, the two light receiving elements 19a, 1 in the region near the joint located so as to sandwich the joint 90 between the image sensor chips 1e, 1e.
9a is equal to the pitch L between the light receiving elements in another region.
a, and the pitch between the light receiving elements may become non-uniform as a whole. Such non-uniformity of the pitch between the light receiving elements is a cause of deteriorating the quality of the read image and is not preferable. Conventionally, even when the pitch between light receiving elements is somewhat non-uniform, when reading an image at a general reading density of, for example, about 200 dpi,
The deterioration of the quality of the read image was not so noticeable. However, when a high-density type image sensor exceeding, for example, 300 dpi is manufactured and image reading is performed with high precision, the quality of the read image has considerably deteriorated.

As a means for solving the above-mentioned problem, for example, as shown in FIG. 11, a plurality of image sensor chips 1e and 1f are arranged in two rows in parallel.
Means may be considered in which each light receiving element 19b of the second row of image sensor chips 1f is uniformly displaced by a predetermined dimension Ld with respect to each light receiving element 19 of the first row of image sensor chips 1e. However, in such a means, it is necessary to mount the image sensor chips 1e and 1f in two rows at a predetermined position on the printed wiring board, so that an error occurs in the mounting position of the image sensor chips 1e and 1f. For this reason, the positioning accuracy of the light receiving elements 19 and 19b cannot be improved. Further, the image sensor chips 1e, 1
f makes the mounting operation of the image sensor chip 1 complicated.
The wiring pattern of the printed wiring board for mounting e and 1f is also complicated. Therefore, the means shown in FIG. 11 causes the manufacturing cost of the entire image sensor to be extremely high, and is not preferable as a means for solving the above-mentioned problems occurring in the conventional image sensor.

[0006] Conventionally, the same problem as the above-described image sensor has occurred in the technical field of the LED print head. That is, an LED print head is generally configured by arranging a plurality of LED array chips in which LED light-emitting elements are built on a silicon substrate in a line. The pitch interval between the LED light emitting elements in the area near the joint between the array chips is different from that in the other area.
The pitch between the light emitting elements was larger than the pitch between the light emitting elements, and the pitch between the LED light emitting elements was non-uniform as a whole. For this reason, conventionally, when the optical writing density on the photoreceptor using the LED print head is increased, the unevenness of the pitch between the LED light emitting elements is remarkable, and the quality of the printed image deteriorates. Was occurring.

The present invention has been conceived in view of such circumstances, and a simple means for reducing the pitch between light receiving elements of an image sensor so as to enable high-density image reading. Accordingly, an object of the present invention is to make it possible to reduce the pitch between light receiving elements located in a region near a joint between image sensor chips, thereby improving the quality of a read image read at high density. Further, the present invention provides a simple means for reducing the pitch between LED light emitting elements of an LED print head so that high-density optical writing is possible in an electrophotographic recording type printer device or the like.
LEDs located near the joints between array chips
Another object is to make it possible to reduce the pitch between the light emitting elements and to improve the quality of a printed image printed at high density.

[0008]

DISCLOSURE OF THE INVENTION In order to solve the above problems, the present invention employs the following technical means.

According to a first aspect of the present invention, there is provided an image sensor. This image sensor is an image sensor in which a plurality of image sensor chips in which a plurality of light receiving elements are arranged in a row at a predetermined pitch interval are arranged in a row in the longitudinal direction thereof. The sensor chip is provided with a plurality of light receiving element rows in parallel by arranging the plurality of light receiving elements in a plurality of rows, and the light receiving elements of the plurality of light receiving element rows are positioned with respect to each other in the row direction. One light receiving element row, which is shifted and has a longitudinal edge of each of the image sensor chips positioned at a joint between the plurality of image sensor chips, sandwiching the joint. The light receiving elements of the other light receiving element rows are formed obliquely so as to be located between the two light receiving elements.

In the present invention, a plurality of light receiving element rows are provided in parallel on each image sensor chip, and the light receiving elements of the plurality of light receiving element rows are displaced from each other in the column direction. If the image of one line of the original is read by the light receiving elements of the plurality of light receiving element rows, the positional deviation of the light receiving elements of the plurality of light receiving element rows in the column direction can be substantially reduced. The original image can be read at a high density as the interval pitch. On the other hand, in the present invention, the image sensor chips located at the joint between the plurality of image sensor chips arranged in a row are formed at an oblique end edge of the longitudinal end of each image sensor chip, whereby Since the light receiving elements of the other light receiving element row are arranged between two light receiving elements of one light receiving element row positioned so as to sandwich the joint, the light receiving element is located in a so-called seam vicinity area of the image sensor chip. It is also possible to set the substantial pitch between the plurality of light receiving elements to the same dimension as the substantial pitch between the light receiving elements in other regions. That is, according to the present invention, even when the dimension from the edge of the image sensor chip to the light receiving element located in the vicinity thereof cannot be reduced so much, the light receiving elements are provided in a plurality of rows in parallel, Due to the synergistic effect of the edge portion of the sensor chip being formed obliquely, light receiving elements of another light receiving element row can be arranged between two light receiving elements of one light receiving element row, It is possible to substantially reduce the pitch between the light receiving elements in the region near the joint between the image sensor chips. As a result, in the present invention, even when the pitch between the light receiving elements is reduced so that the image can be read at a high density, it is easy to make the pitch between the light receiving elements of the plurality of light receiving elements the same. This can provide a special effect that the quality of the read image can be improved.

Further, in the present invention, a plurality of image sensor chips may be arranged in one row, and it is not necessary to provide the plurality of image sensor chips in a plurality of rows on a desired printed wiring board or the like. Therefore, complication of the mounting operation of the image sensor chip can be appropriately avoided, and the manufacturing cost of the image sensor can be reduced. Further, in the present invention, although a plurality of light receiving element rows are provided on the image sensor chip, the formation of the plurality of light receiving element rows can be performed with high precision by a semiconductor manufacturing process. Therefore, unlike the case where the image sensor chips are arranged in a plurality of rows on a printed wiring board or the like, the positional accuracy of the light receiving element can be easily increased.

[0012] In a preferred embodiment of the present invention, the positional deviation between the light receiving elements of the plurality of light receiving element rows in the row direction is determined by dividing the pitch between the light receiving elements in each light receiving element row by the number of the light receiving element rows. The configuration may be substantially the same as the divided value. It should be noted that substantially the same in the present invention,
When manufacturing an image sensor, it is practically unavoidable that some dimensional error occurs in the arrangement of the light receiving elements, so that it is intended to allow such a dimensional error, and in the present invention, the same applies hereinafter. .

According to such a configuration, for example, when a total of two light receiving element rows are provided, the positional deviation dimension in the column direction between the light receiving elements of the two light receiving element rows is determined in each light receiving element row. 1/2 of the pitch between light receiving elements,
When the light receiving elements in the two light receiving element rows are viewed in total, it is assumed that the light receiving elements are arranged at equal intervals at a half pitch between the light receiving elements in each light receiving element row. It becomes the same. When a total of three light receiving element rows are provided, the light receiving elements are arranged at regular intervals of 1/3 of the pitch between the light receiving elements in each light receiving element row. Therefore, according to the above configuration, the light receiving elements of the plurality of light receiving element rows can be arranged at equal intervals in the column direction, which is further advantageous in improving the quality of the read image.

In another preferred embodiment of the present invention,
The distance between the plurality of light receiving element rows may be substantially the same as a value which is an integral multiple of the positional deviation dimension of the plurality of light receiving element rows in the column direction.

According to such a configuration, when reading the image while feeding the original in the sub-scanning direction,
Control for making the reading density in the main scanning direction and the reading density in the sub-scanning direction the same can be easily performed. That is, according to the configuration, when the document is fed in the sub-scanning direction, when the document is pitch-fed with the same size as the positional deviation dimension of the light receiving elements of the plurality of light receiving element rows in the row direction, A predetermined one-line image of a document read by the light receiving elements of one light receiving element row can be appropriately read by the light receiving elements of the other light receiving element rows, and the image of the same line can be read by a plurality of light receiving element rows. Can be properly read by each of the. Here, the feed pitch interval of the document in the sub-scanning direction is the same as the substantial reading interval in the main scanning direction. Therefore, according to the above configuration, the reading density in the main scanning direction and the reading density in the sub-scanning direction can be simply made the same simply by setting the document feed pitch to the same size as the positional deviation dimension of the light receiving element in the column direction. Can be

In another preferred embodiment of the present invention,
Among the plurality of light receiving elements, a light receiving element near an oblique edge of the image sensor chip has a configuration in which a side edge is formed obliquely along the edge of the image sensor chip. can do.

According to such a configuration, the light receiving element located near the oblique edge of the image sensor chip is
The light receiving element can be arranged substantially in the same manner as the light receiving element is arranged closer to the edge of the image sensor chip, as much as the side edge is formed obliquely. Therefore, it is more advantageous in reducing the pitch between the light receiving elements in the region near the joint of the image sensor chip.

According to a second aspect of the present invention, there is provided an image sensor chip. The image sensor chip is an image sensor chip in which a plurality of light receiving elements are arranged in a row on a chip-shaped substrate at a predetermined pitch interval, and a plurality of light receiving elements are arranged in a plurality of rows. While the light receiving element rows are provided in parallel, the light receiving elements of the plurality of light receiving element rows are displaced from each other in the column direction, and the edge of the longitudinal end of the chip-shaped substrate is The light receiving elements are characterized by being formed obliquely along the arrangement direction of the light receiving elements positioned at the end of each light receiving element row among the plurality of light receiving elements.

In the image sensor chip provided by the second aspect of the present invention, when a plurality of the image sensor chips are arranged in a row, they are formed in a predetermined oblique shape at the longitudinal end of the chip-shaped substrate. If the edge portions are approached or brought into contact with each other, the light-receiving elements of another light-receiving element row are interposed between two light-receiving elements of one light-receiving element row positioned so as to sandwich these edge portions. It becomes possible to arrange appropriately. Therefore, it is useful for manufacturing the image sensor provided by the first aspect of the present invention.

According to a third aspect of the present invention, there is provided an LED printhead. This LED print head is an LED print head in which a plurality of LED array chips in which a plurality of LED light emitting elements are arranged in a row at a predetermined pitch interval are arranged in a row in a longitudinal direction thereof. The plural LED array chips include the plural L
A plurality of light emitting element rows are provided in parallel by disposing the ED light emitting elements in a plurality of rows, and the LED light emitting elements of the plurality of light emitting element rows are displaced from each other in the row direction, and An edge of a longitudinal end of each of the LED array chips located at a joint between the plurality of LED array chips is two LED light emitting elements of one light emitting element row located so as to sandwich the joint. It is characterized in that it is formed obliquely so that the LED light emitting elements of another light emitting element row are located between them.

In the present invention, a plurality of light emitting element rows are provided in parallel on each LED array chip, and the LED light emitting elements of the plurality of light emitting element rows are displaced from each other in the row direction. Therefore, one line of image data is stored in each LED of the plurality of light emitting element rows.
When light is written on a predetermined photosensitive member by the light emitting element, a desired image is printed at a high density by setting the positional deviation dimension of the plurality of light emitting element rows in the column direction as a substantial pitch between the LED light emitting elements. It is possible to do. On the other hand, in the present invention, each of the LEs located at the joint between the plurality of LED array chips
Since the edge of the longitudinal end of the D array chip is formed obliquely, another light emitting element is located between two LED light emitting elements of one light emitting element row positioned so as to sandwich the joint. Since the LED light emitting elements in a row are arranged, a substantial pitch between the plurality of LED light emitting elements located in a so-called seam vicinity area of the LED array chip is substantially changed to a substantial LED light emitting area in another area. It is also possible to set the same size as the pitch between light emitting elements. That is, in the present invention, even when the dimension from the edge portion of the LED array chip to the LED light emitting element located in the vicinity cannot be so small, the LED light emitting elements are provided in a plurality of rows in parallel, Due to the synergistic effect that the edge of the LED array chip is formed obliquely, LED light emitting elements of another light emitting element row are arranged between two LED light emitting elements of one light emitting element row. This makes it possible to substantially reduce the pitch between the LED light emitting elements in the region near the joint between the LED array chips. As a result, according to the present invention, even when the pitch between the LED light emitting elements is reduced so that an image can be printed at a high density, the pitch between the LED light emitting elements at each position of the plurality of LED light emitting elements is made to be the same. Can be easily performed, and a special effect that the quality of the printed image can be improved can be obtained.

Further, in the present invention, a plurality of LED array chips may be arranged in one row, and it is not necessary to provide a plurality of LED array chips in a plurality of rows. Therefore, it is possible to appropriately avoid complication of the mounting work of the LED array chip, and it is possible to reduce the manufacturing cost of the LED print head. Furthermore, in the present invention, although a plurality of light emitting element arrays are provided on the LED array chip, the formation of the plurality of light emitting element arrays can be performed with high precision by a semiconductor manufacturing process. Therefore, unlike the case where the LED array chips are arranged in a plurality of rows, the positional accuracy of the LED light emitting elements can be easily increased.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 is a sectional view showing an example of an image sensor according to the present invention.

The image sensor A is configured as a so-called contact type line image sensor. The basic configuration of the other parts is the same as that of the conventional image sensor except for the configuration related to the image sensor chip 1. . That is, this image sensor A is one in which a cover glass 21 forming an image reading surface 22 is mounted on the upper surface of a case 20 having an upper surface opening, and a plurality of cases 20 below the cover glass 21 A printed wiring board 24, a prism 25, and a rod lens array 26 having the image sensor chip 1 and the LED 23 mounted on the surface are provided. The plurality of LEDs 23 emit light in a linear or band shape. The prism 25 guides the light emitted from the plurality of LEDs 23 to a predetermined image reading area of the document K which is brought into contact with the image reading surface 22 and transferred by the platen roller 3. The rod lens array 26 focuses the light reflected from the document K at an erect equal size, and the light focused by the rod lens array 26 is a plurality of light receiving elements (described later) of the image sensor chip 1. 11, the image of the document K is read line by line.

FIG. 2 is a partially omitted plan view showing the image sensor chip 1.

The image sensor chip 1 has a plurality of light receiving elements 11 (phototransistors) on an upper surface of a chip-shaped silicon substrate 10 formed in a substantially parallelogram in plan view.
It is made in one. Of course, on the silicon substrate 10, a control circuit for serially outputting the read image signals output from the plurality of light receiving elements 11 at a predetermined timing, and the read image signals from the plurality of light receiving elements 11 are printed. A pad portion for wire bonding for transmitting to a predetermined wiring portion (not shown) on the wiring board 24 and other various wiring patterns are provided. However, since these basic configurations are already known, their illustration and description are omitted.

The plurality of light receiving elements 11 are disposed at a predetermined distance L
The first light receiving element row N1 and the second light receiving element row N2 are provided in parallel with each other with two rows arranged at two intervals. The pitch L between the light receiving elements in each of the first light receiving element row N1 and the second light receiving element row N2 is the same. On the other hand, the two light receiving element rows N1,
The light-receiving elements 11 of N2 are provided at regular intervals in the column direction and are displaced from each other.
1 are staggered. The displacement L1 in the column direction of the light receiving elements 11 is set to a half of the pitch L between the light receiving elements in each light receiving element row. As described later, the dimension L1 is a substantial pitch between the light receiving elements in the main scanning direction, and when the reading density in the main scanning direction is, for example, 300 dpi, the pitch L1
Is about 84 μm. Further, the first light receiving element row N
The distance L2 between the first light-receiving element row N2 and the second light-receiving element row N2 is a value that is an integral multiple of the displacement dimension L1, and is the same as, for example, twice the dimension L1. The dimensions are the same as the pitch L between the light receiving elements.

The edge portions 10a and 10b at both ends in the longitudinal direction of the silicon substrate 10 are formed obliquely substantially parallel to each other. More specifically, the left edge 10a is
Light receiving element 11 located at the left end of first light receiving element row N1
(11a) and the light receiving element 11 (11b) located at the left end of the second light receiving element row N2 are oblique along the arrangement direction. Similarly, the right edge 10b is arranged in the direction of arrangement of the rightmost light receiving element 11 (11c) of the first light receiving element row N1 and the rightmost light receiving element 11 (11d) of the second light receiving element row N2. It is diagonal along. The above image sensor chip 1
As shown in FIG. 3, after a plurality of light receiving elements 11 and various circuits constituting the image sensor chip 1 and various wiring patterns and a wiring pattern are formed on the surface of the silicon wafer 4, a dicing process ( When performing cutting by a cutter), a vertical cutting line a2 may be inclined with respect to a horizontal cutting line a1 for forming and separating the image sensor chip 1. By such a working process, the image sensor chip 1 in which the edge portions 10a and 10b of the longitudinal direction end portions are formed in an inclined shape can be easily manufactured.

FIG. 4 is a partially omitted plan view showing a state in which a plurality of the image sensor chips 1 are arranged in a line.

As shown in FIG. 1, a plurality of image sensor chips 1 are formed with oblique edge portions 10a, 10b.
They are aligned in a longitudinal direction so that they are close to or in contact with each other. In this case, paying attention to the two image sensor chips 1 and 1 indicated by solid lines in the figure, the joint between the edge portions 10a and 10b in the first light receiving element row N1 of the two image sensor chips 1 and 1 is shown. 95
Light receiving elements 11 (11a) and 11 (11c) sandwiching
The light receiving elements 11 (11b) near the edge of the second light receiving element row N2 of one image sensor chip 1 are arranged between them.

In the image sensor A having the above structure,
In the region near the joint 95 between the image sensor chips 1 and 1, the two light receiving elements 11 of the first light receiving element row N1 are arranged.
One light receiving element 11b of the second light receiving element row N2 is arranged between the light receiving elements 11a, 11c, and the distance between the three light receiving elements 11a, 11c, 11b in the area near the joint 95 is: It is set to be the same as the displacement L1 of the light receiving element 11 in other areas. That is, according to the present invention, each image sensor chip 1 is provided with two light receiving element rows N1 and N2, and the edge portions 10a and 10b of the image sensor chip 1 are formed in a predetermined oblique shape. 1 edge 10a, 1
0b to the predetermined light receiving elements 11a and 11c,
Even if it is larger than the displacement L1 of the light receiving element, the dimension between each of the three light receiving elements 11a, 11c and 11b is set to the displacement L1 of the light receiving element. Accordingly, the light receiving elements 11 can be arranged at equal intervals over the entire length region of the plurality of image sensor chips 1 in the longitudinal direction. Therefore, the image of the document K can be read at regular intervals in the main scanning direction, and the quality of the read image can be improved.

In the image sensor A,
The image on the same line of the original K is
1 and the second light receiving element row N2, the position deviation dimension L1 of the light receiving elements of these two light receiving element rows N1 and N2 becomes equal to that of the image sensor A.
, The distance between the light receiving elements in the main scanning direction is substantially equal, and the interval of the displacement L1 can be taken as the image reading density in the main scanning direction. Therefore, while the pitch L between the light receiving elements in each of the two light receiving element rows N1 and N2 is relatively large, the reading density in the main scanning direction can actually be doubled. . As a result, in order to increase the image reading density, the image sensor chip 1 is increased by the amount that the distance between the light receiving elements 11 adjacent to each other can be increased.
Manufacturing is facilitated.

Further, if the distance L2 between the two light receiving element rows N1 and N2 is an integral multiple (for example, twice) of the substantial light receiving element pitch L1 of the image sensor A, the original K is placed on the platen roller. 3, when the paper is fed in the sub-scanning direction, the paper feed pitch is set to the pitch L1.
Is set to the same size as
Reading can be sequentially performed by the respective light receiving elements 11 of the two light receiving element rows N1 and N2. In this case, the image reading density in the sub-scanning direction is the same as the image reading density in the main scanning direction. Therefore, the reading density of the image of the document K in the sub-scanning direction and the reading density in the main scanning direction can be easily equalized.

When reading the image of the document K,
The image of the document K can be read simultaneously by the light receiving elements 11 of the first light receiving element row N1 and the second light receiving element row N2. That is, as shown in FIG. 5, when the rod lens array 26 that converges the image of the original K into an erect equal-magnification is used, the first light receiving element row N1 is moved from the original reading line P1 located immediately above it. The reflected light can be received. In this case, the second light receiving element row N2 can receive the reflected light from the original reading line P2 located immediately above the second light receiving element row N2. Therefore, there is no problem that the reading speed of the document image in the sub-scanning direction is reduced due to the arrangement of the light receiving elements 11 in two rows. In the image sensor A, after the image of the predetermined image reading line P2 is read by the second light receiving element row N2, the image reading line P2 is transferred to the position of the image reading line P1 shown in FIG. As a result, the image is read again by the first light receiving element row N1.

FIGS. 6 and 7 are plan views of a main part showing another example of the image sensor chip according to the present invention.

In the configuration shown in FIG. 6, a first light receiving element row N1, a second light receiving element row N2, and a third light receiving element row N3 are provided on the surface of the silicon substrate 10, and a total of three The light receiving elements 11 of the light receiving element rows N1 to N3 are 1/1/3 of the pitch L between the light receiving elements in each light receiving element row.
3 are equally displaced in the column direction by a dimension L3. According to such a configuration, the substantial reading density in the main scanning direction can be set to three times the density of the light receiving elements in each light receiving element row, which is further advantageous in increasing the image reading density. . Thus, in the present invention,
The specific number of light receiving element rows is not limited to two, but may be three or more. The number of light receiving element rows is an item that can be appropriately selected according to various conditions such as an image reading density required when an image sensor is manufactured.

In the configuration shown in FIG. 7, the plurality of light receiving elements 11e closest to the oblique edge 10b of the silicon substrate 10 are formed in a parallelogram shape in plan view, and are arranged in the short direction of the silicon substrate 10. Two extending side edges 12,12
a is oblique along the edge 10b. According to such a configuration, the light receiving element 11e is substantially moved closer to the edge 10b while securing the dimensional interval L4 between the side edge 12 of the light receiving element 11e and the edge 10b of the silicon substrate 10. A configuration similar to the biased configuration can be adopted. Therefore, in order to reduce the substantial pitch between the light receiving elements in the so-called joint vicinity area of the image sensor chip,
This is advantageous. In the configuration shown in FIG. 7, the two side edges 12, 12a of the light receiving element 11e are formed obliquely. However, the present invention is not limited to this, and for example, the side edge 10b of the silicon substrate 10 is formed. Side edge 1 located at
Only 2 may be oblique.

In the above-described embodiment, the edge portions 10a, 10b at both ends in the longitudinal direction of the image sensor chip 1 are provided.
Are formed obliquely, other image sensor chips can be appropriately arranged on both sides of the image sensor chip 1, but the present invention is not limited to this. That is, in the present invention, when a plurality of image sensor chips are arranged in a row, the image sensor chip located at the end in the longitudinal direction of the row is:
Since the other image sensor chip is connected to only one side, in this case, only one of the two longitudinal end portions of the image sensor chip may be formed obliquely. Absent.

In addition, an image sensor according to the present invention,
And the specific configuration of each part of the image sensor chip,
Various design changes are possible. The specific dimensions of each part such as the pitch between light receiving elements and the specific values of the inclination angle of the edge of the longitudinal end of the image sensor chip are not particularly limited.

FIG. 8 is a sectional view showing an example of the LED print head according to the present invention. FIG. 9 shows the L shown in FIG.
FIG. 2 is a partially omitted plan view showing an example of an LED array chip used in an ED print head.

The LED print head B is for performing optical writing (exposure) on the photosensitive member 7 in an electrophotographic recording type printer or the like. The basic configuration is the same as the configuration of the existing LED print head.
In other words, this LED print head B has a plurality of LEs.
The printed wiring board 55 on which the D array chip 6 and the plurality of drive ICs 53 are respectively arranged in a row is mounted on the heat sink 5
1 and the holder 5 using the attachment 54.
It is positioned and held below 0. The holder 50 holds a lens array 52. The plurality of driving ICs 53 are connected to the plurality of LED array chips 6.
For controlling the driving (light emission) of an LED light emitting element 61 described later provided in
53 and the LED array chip 6 are electrically connected via a wire W. The drive IC 53 is also electrically connected to a predetermined wiring portion of the printed wiring board 55 via a wire W. The lens array 52 is for converging light emitted from the LED light emitting elements 61 of the plurality of LED array chips 6 and irradiating the light on the surface of the photoconductor 7.

As shown in FIG. 9, the LED array chip 6 has a plurality of LED light emitting elements 61 on an upper surface of a chip-shaped silicon substrate 60 formed in a substantially parallelogram shape in plan view.
It is made in one. The above silicon substrate 6
A pad portion for connecting to the driving IC 53 via the wire W and a wiring pattern therefor are provided on the surface of the drive IC 53, but since the configuration is the same as that of the conventional device, the illustration and description will be omitted for convenience. Omitted.

The configuration of the LED array chip 6 is different from that of the image sensor chip 1 in which the light receiving element is formed on the silicon substrate in that the LED light emitting element 61 is formed on the silicon substrate. But multiple LEDs
The basic configuration regarding the arrangement of the light emitting elements 61 and the shape of the silicon substrate is the same as the arrangement of the light receiving elements and the shape of the silicon substrate in the image sensor chip 1 described above.
That is, in the LED array chip 6, a plurality of LED light emitting elements 61 are arranged in two rows in parallel.
And a second light emitting element row n2. Each of the first light-emitting element row n1 and the second light-emitting element row n2 has a plurality of LED light-emitting elements 61 arranged in a row at a constant pitch in the longitudinal direction of the silicon substrate 60. L of two light emitting element rows n1 and n2
The ED light emitting elements 11 are displaced in the column direction, and the displacement L6 is 1/2 of the pitch L5 between the light emitting elements in each light emitting element row. The distance L7 between the two light emitting element columns n1 and n2 is equal to the displacement L
It is an integral multiple of 6. Further, the edge portions 60a at both ends in the longitudinal direction of the silicon substrate 60 are oblique along the arrangement direction of the two LED light emitting elements 61a and 61b closest to the edge portion 60a. Edge 60b
Are the two LEDs closest to this edge 60b
It is oblique along the arrangement direction of the light emitting elements 61c and 61d.

As shown in FIG. 9, a plurality of the LED array chips 6 are arranged in a line. In this case, the edge 60a of one LED array chip 6 and the other LED array chip 6 are arranged. The chips 6 are arranged so that the edge portions 60b are close to or in contact with each other. By arranging the plurality of LED array chips 6 in this way, the two LED light emitting elements 61a and 61c of the first light emitting element row n1 located in the vicinity of the joint 95A between these LED array chips 6 and 6 Between the LEDs of the second light emitting element row n2
The light emitting element 61b is provided. Therefore,
In the area near the joint 95A between the LED array chips 6 and 6, the pitch between the LED light emitting elements 61 can be made equal to the pitch L6 in the other areas. Of course, in this LED print head B,
A substantial pitch between the LED light emitting elements in the entire LED light emitting elements 61 of the two light emitting element rows n1 and n2 is a dimension L6.
Thus, optical writing on the photoconductor 7 can be performed at a high density. Further, by setting the distance L7 between the two light emitting element columns n1 and n2 to be an integral multiple of the displacement L6 of the LED light emitting elements 61 in the column direction, the light emitting element rows n1 and n
2, the writing density in the column direction of the LED light emitting elements and the writing density in the direction perpendicular to the writing direction (paper feed direction) can be easily matched.

In the LED print head B, two light emitting element rows n1 and n
2 is described as an example, but the present invention is not limited to this. In the present invention, as in the case of the image sensor and the image sensor chip described above,
The number of light emitting element rows of the LED light emitting elements may be three or more. Further, the side edge of the LED light emitting element near the edge of the silicon substrate may be formed obliquely along the edge of the silicon substrate. In addition, the specific configuration of each part of the LED print head according to the invention of the present application is not limited to the above embodiment, and various design changes are possible.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an image sensor according to the present invention.

FIG. 2 is a partially omitted plan view showing the image sensor chip shown in FIG. 1;

FIG. 3 is an explanatory view showing an example of a method for manufacturing the image sensor chip shown in FIG.

FIG. 4 is a partially omitted plan view showing a state where a plurality of image sensor chips shown in FIG. 1 are arranged in a line.

5 is an explanatory diagram showing an image reading operation of the image sensor shown in FIG.

FIG. 6 is a main part plan view showing another example of the image sensor chip according to the present invention.

FIG. 7 is a main part plan view showing another example of the image sensor chip according to the present invention.

FIG. 8 is a sectional view showing an example of an LED print head according to the present invention.

9 is a partially omitted plan view showing an example of an LED array chip used in the LED print head shown in FIG.

FIG. 10 is a plan view of a main part showing an example of a conventional image sensor chip.

FIG. 11 is a plan view of a main part showing another example of a conventional image sensor chip.

[Explanation of symbols]

 Reference Signs List A image sensor B LED print head 1 image sensor chip 6 LED array chip 10 silicon substrate 10a, 10b edge 11 light receiving element 12, 12a side edge N1 first light receiving element row N2 second light receiving element row N3 third Light-receiving element array 61 LED light-emitting element n1 first light-emitting element array n2 second light-emitting element array 60 silicon substrates 60a, 60b edge portions 95, 95A joint

Claims (6)

[Claims] 1. An image sensor in which a plurality of image sensor chips in which a plurality of light receiving elements are arranged in a row at a predetermined pitch interval are arranged in a row in a longitudinal direction thereof. The sensor chip is provided with a plurality of light receiving element rows in parallel by arranging the plurality of light receiving elements in a plurality of rows, and the light receiving elements of the plurality of light receiving element rows are positioned with respect to each other in the row direction. One light receiving element row, which is shifted and has a longitudinal edge of each of the image sensor chips located at a joint between the plurality of image sensor chips, sandwiching the joint. An image sensor characterized by being formed obliquely so that light receiving elements of another light receiving element row are located between the two light receiving elements. 2. A displacement dimension in the column direction between the light receiving elements of the plurality of light receiving element rows is substantially the same as a value obtained by dividing a pitch dimension between light receiving elements in each light receiving element row by the number of the light receiving element rows. The image sensor according to claim 1. 3. The method according to claim 1, wherein a distance between the plurality of light receiving element rows is substantially equal to an integral multiple of a positional deviation dimension of the plurality of light receiving element rows in the column direction. 3. The image sensor according to 2. 4. A light-receiving element in the vicinity of an oblique edge of the image sensor chip among the plurality of light-receiving elements,
4. The image sensor according to claim 1, wherein a side edge thereof is formed obliquely along an edge of the image sensor chip. 5. An image sensor chip in which a plurality of light receiving elements are arranged in a row on a chip-shaped substrate at a predetermined pitch interval, wherein a plurality of light receiving elements are arranged in a plurality of rows. While the element rows are provided in parallel, the light receiving elements of the plurality of light receiving element rows are displaced from each other in the row direction, and the edge of the longitudinal end of the chip-shaped substrate is An image sensor chip, which is formed obliquely along an arrangement direction of light receiving elements positioned at the end of each light receiving element row among the plurality of light receiving elements. 6. An LED print head in which a plurality of LED array chips in which a plurality of LED light emitting elements are arranged in a row at a predetermined pitch interval are arranged in a row in a longitudinal direction thereof. The LED array chip has a plurality of LEDs
A plurality of light emitting element rows are provided in parallel by arranging the light emitting elements in a plurality of rows, and the LED light emitting elements of the plurality of light emitting element rows are displaced from each other in the row direction, and An edge of a longitudinal end of each of the LED array chips located at a joint between the plurality of LED array chips is formed of two LED light emitting elements of one light emitting element row located so as to sandwich the joint. LED of other light emitting element row between
An LED print head, which is formed obliquely so that a light emitting element is located.