JPH10294277A - Heat treatment equipment and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly perform ventilation and heat evacuation for a heat treatment chamber after heat treatment, by providing a control means which evacuate the gas in the heat treatment chamber by a gas evacuating means under the condition that an open/close means is opening a gas flow inlet. SOLUTION: A shutter 5 is brought down to open a substrate passing port 4, a substrate 1 is carried into a heat treatment chamber 2 and placed on a hot plate 3 by a substrate transfer arm, and the shutter 5 is lifted to close the substrate passing port 4. Then, the substrate 1 is heated by the hot plate 3 and heat treatment is performed. After heat treatment, the shutter 5 is brought down to open the substrate passing port 4, and at the same time, an electromagnetic valve 8 is opened to eject the gas in the heat treatment chamber 2 to the atmosphere through a tube path 7 by operation of a blower 9. At that time, the gas in the heat treatment chamber 2 is quickly ejected through the tube path 7, and fresh outside air enters through the substrate passing port 4. Thus, ventilation and heat evacuation can be quickly performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heat treatment apparatus and a heat treatment method for heating and processing a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel, or a mask substrate for a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art For example, in a photolithography process at the time of manufacturing a glass substrate for a liquid crystal display panel, a substrate is conveyed to a heat treatment chamber which is sealed from the outside in order to dry a resist applied to the substrate surface. Is heated by a substrate heating means such as a hot plate to heat-treat the substrate.

[0003] In a heat treatment apparatus for performing such heat treatment, a configuration in which gas in the heat treatment chamber is exhausted to the outside for the purpose of ventilation and heat exhaustion in the heat treatment chamber has been conventionally adopted. That is, in a conventional heat treatment apparatus, as described in, for example, JP-A-7-29869, a substrate accommodated in a heat treatment chamber is heated by a hot plate, and the substrate is placed around the hot plate. The above-described ventilation and heat exhaust of the heat treatment chamber are performed by constantly sucking the gas in the heat treatment chamber through a slit-shaped suction hole formed so as to surround the heat treatment chamber and releasing the gas into the atmosphere.

[0004]

In such a conventional heat treatment apparatus, when the size of the substrate to be heat-treated becomes large, there arises a problem that the temperature distribution characteristic of the substrate to be heat-treated is deteriorated. That is, in the above-described conventional heat treatment apparatus, particularly when a large-sized substrate is heat-treated, the temperature of the substrate decreases near the edge of the substrate close to the slit-shaped suction port, while the temperature near the center of the substrate decreases. The temperature of the substrate will increase. For this reason, it is impossible to uniformly heat-treat the entire surface of the substrate, and there has been a problem that the yield of products manufactured from the substrate after the heat treatment is reduced.

[0005] This is considered to be because the exhaust flow velocity of the gas near the center of the substrate becomes small and the atmosphere in the vicinity stagnates, and the atmosphere is not sufficiently replaced even after a lapse of time. In other words, the atmosphere is replaced almost without stagnation near the edge of the substrate, whereas the gas is stagnated near the center of the substrate and the atmosphere is not replaced. The temperature rises.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can uniformly heat-treat a substrate.
It is another object of the present invention to provide a heat treatment apparatus and a heat treatment method capable of quickly performing ventilation and heat exhaust in a heat treatment chamber.

[0007]

According to a first aspect of the present invention, there is provided a heat treatment chamber for accommodating a substrate to be heat-treated, substrate heating means disposed in the heat treatment chamber, and disposed in the heat treatment chamber; A gas inlet for allowing a gas to flow into the heat treatment chamber, an opening / closing means for opening / closing the gas inlet, an exhaust means for exhausting the gas in the heat treatment chamber, and the opening / closing means comprising the gas inlet Control means for exhausting the gas in the heat treatment chamber by the gas exhaust means in a state in which the gas is opened.

According to a second aspect of the present invention, in the first aspect of the present invention, the gas inlet is provided with a substrate passage formed at one end of the heat treatment chamber for loading or unloading a substrate into or from the heat treatment chamber. And the opening and closing means comprises a shutter for opening and closing the substrate passage opening,
Further, the gas exhaust means includes a gas exhaust port formed at an end of the heat treatment chamber opposite to the substrate passage port.

According to a third aspect of the present invention, there is provided a heat treatment chamber for accommodating a substrate to be heat-treated, a substrate heating means disposed in the heat treatment chamber, and a gas disposed in the heat treatment chamber. A gas inlet for inflow, and a processing chamber provided at a position opposed to the gas inlet across at least a part of the substrate when viewed from a main surface side of the substrate housed in the heat treatment chamber; And a gas outlet for exhausting gas from the heat treatment chamber.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the gas outlet is provided at a central portion of the substrate as viewed from a main surface side of the substrate accommodated in the heat treatment chamber. It is disposed at a position facing the gas inlet with the sandwiched therebetween.

According to a fifth aspect of the present invention, in the third aspect of the present invention, the gas inlet is provided at one end of the heat treatment chamber for loading or unloading a substrate into or from the heat treatment chamber. It is composed of the formed substrate passage opening.

According to a sixth aspect of the present invention, in the third aspect of the present invention, the heat treatment chamber has a substrate passage at one end thereof for loading or unloading a substrate. The gas inlet is disposed at an end opposite to the substrate passage.

According to a seventh aspect of the present invention, there is provided a substrate transfer step of opening a shutter of a substrate passage opening in a heat treatment chamber and carrying a substrate into or out of the heat treatment chamber, and closing the shutter to move a substrate into the heat treatment chamber. A heating step of heating by a substrate heating means disposed in the heat treatment chamber, wherein the gas in the heat treatment chamber is ventilated by exhaust means for exhausting the gas in the heat treatment chamber when the shutter is opened in the substrate transfer step. It is characterized by doing.

According to an eighth aspect of the present invention, there is provided a heat treatment method for heating a substrate accommodated in a heat treatment chamber by a heating means disposed in the heat treatment chamber. A gas is caused to flow into the heat treatment chamber, and the gas is disposed in the processing chamber at a position facing the gas inlet with at least a part of the substrate interposed therebetween when viewed from the main surface side of the substrate housed in the heat treatment chamber. The gas in the heat treatment chamber is ventilated by exhausting the gas in the heat treatment chamber from the provided gas discharge port.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan sectional view showing a main part thereof.

This heat treatment apparatus heats and processes a substrate 1 on which a resist is applied. The heat treatment chamber 2 accommodates a substrate 1 to be heat treated, and a hot plate 3 provided in the heat treatment chamber 2 A substrate passage opening 4 formed at one end of the heat treatment chamber 2, a shutter 5 for opening and closing the substrate passage opening 4, and an end opposite to the substrate passage opening 4 in the heat treatment chamber 2. A gas outlet 6 and a pipe 7 that connects the gas outlet 6 and the blower 9 to each other through a solenoid valve 8 are provided.

The hot plate 3 has a heater inside, and heats the substrate 1 placed on the surface thereof while being held by suction or separated by a minute distance (proximity gap). Inside the hot plate 3, a lift pin (not shown) for raising and lowering the substrate 1 and transferring it to a substrate transfer arm (not shown) is provided.

The shutter 5 is moved up and down by the drive of a motor 10 to be described later, so that the substrate 1 is carried into the heat treatment chamber 2 through the substrate passage port 4 by a substrate transfer arm (not shown), or The substrate passage opening 4 is opened when the substrate 1 is carried out of the heat treatment chamber 2 through the opening 4, and the substrate passage opening 4 is closed in an airtight state when the substrate 1 is heated by the hot plate 3 and heat-treated. It is configured as follows.

The gas discharge port 6 is for exhausting the gas in the heat treatment chamber 2. When the solenoid valve 8 is opened, the gas present in the heat treatment chamber 2 is passed through the pipe 7 by the action of the blower 9. Through the atmosphere. In the case where heating the substrate 1 evaporates an organic solvent or the like in the resist into the heat treatment chamber 2 to generate a harmful gas, the gas in the heat treatment chamber 2 is removed from the atmosphere through a gas processing apparatus. Release into.

FIG. 3 is a block diagram showing a main electrical configuration of the heat treatment apparatus.

This heat treatment apparatus includes a ROM 21 and a RAM 2
2 and a control unit 20 including a CPU 23. The control unit 20 is electrically connected to the above-described solenoid valve 8 and the motor 10 via the interface 24. The solenoid valve 8 and the motor 10 are configured to execute an operation described later according to a command from the control unit 20. ing.

Next, the operation of the above-described heat treatment apparatus will be described.

First, the shutter 5 is lowered from the position indicated by the solid line in FIG. 1 to the position indicated by the two-dot chain line by driving the motor 10, and the substrate passage opening 4 is opened. Then, the substrate 1 is loaded into the heat treatment chamber 2 through the substrate passage port 4 by a substrate transfer arm (not shown), and the hot plate 3
After being placed on the upper side, the shutter 5 is raised again, and the substrate passage opening 4 is closed.

By maintaining this state for a predetermined time,
The substrate 1 is heated by the hot plate 3 to heat-treat the substrate 1. At this time, since the substrate 1 is heated by the hot plate 3 in the enclosed space formed by the heat treatment chamber 2 and the shutter 5, the substrate 1 is uniformly heated over its entire surface. Therefore, unlike the related art, the temperature does not decrease near the edge of the substrate 1 and does not increase near the center.

When the necessary heat treatment for the substrate 1 is completed,
The shutter 5 is lowered by driving the motor 10, and the substrate passage 4 is opened. At the same time, the solenoid valve 8 is opened, and the gas present in the heat treatment chamber 2 is released to the atmosphere through the pipe 7 by the action of the blower 9. At this time, since the substrate passage port 4 is open, the gas in the heat treatment chamber 2 is quickly discharged through the pipe 7, and fresh outside air enters the heat treatment chamber 2 from the substrate passage port 4. . Therefore,
Ventilation of evaporative components from the resist solution present in the heat treatment chamber 2 and heat exhaust in the heat treatment chamber 2 are quickly performed.

At this time, since the exhaust direction of the gas is determined to be constant, the stagnation of the atmosphere near the substrate 1 is prevented, and the ventilation of the evaporation component from the resist solution present in the heat treatment chamber 2 and the heat treatment chamber 2 can be carried out particularly quickly. Further, it is not necessary to consider the balance of each exhaust as in the case of exhausting from a plurality of locations in the heat treatment chamber, and the exhaust mechanism can be simplified.

In particular, the substrate passing port 4 functioning as a gas inlet for flowing gas into the heat treatment chamber 2 and the gas discharge port 6 for discharging gas from the heat treatment chamber 2 are mounted on the hot plate 3. Since the substrates 1 are placed opposite to each other with the central portion of the substrate 1 interposed therebetween when viewed from the main surface side of the substrate 1, the stagnation of the atmosphere in the central portion of the substrate 1 can be prevented, and the central portion of the substrate 1 can be prevented. It is possible to effectively prevent the phenomenon that the temperature is higher than that near the edge.

In this embodiment, in particular, a relatively large-sized substrate passage opening 4 formed at one end of the heat treatment chamber 2 and an end opposite to the substrate passage opening 4 in the heat treatment chamber 2. Since the gas in the heat treatment chamber 2 is ventilated by using the gas discharge port 6 formed in the heat treatment chamber 2, all the gas existing in the heat treatment chamber 2 at the end of the heat treatment of the substrate 1 is removed in about several seconds. It is possible to exhaust from inside.

In parallel with the above-mentioned ventilation operation, the substrate 1 subjected to the heat treatment is carried out of the heat treatment chamber 2 through the substrate passage port 4 by a substrate transfer arm (not shown), and the substrate to be subjected to the next heat treatment is carried out. 1 is carried into the heat treatment room.
Then, the shutter 5 is closed, and the heat treatment of the substrate 1 is continued by repeating the above operation.

In the above-described embodiment, the heat treatment of the substrate 1 is completed, the shutter 5 is opened, the solenoid valve 8 is opened at the same time, and the ventilation operation is executed in parallel with the unloading and loading operations of the substrate 1. I explained the case,
If the shutter 5 is open, the ventilation operation can be performed at any time before the substrate 1 is carried out, before the substrate 1 is carried out, and before the substrate 1 is carried in, or after the substrate 1 is carried in.

Next, another embodiment of the present invention will be described. FIG. 4 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a second embodiment of the present invention. The same members as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description is omitted.

In the first embodiment described above, the substrate passage 4 for carrying the substrate 1 into or out of the heat treatment chamber 2 is provided.
Is used as a gas inlet for flowing gas into the heat treatment chamber 2, and the center of the substrate 1 when viewed from the substrate passing port 4 and the main surface side of the substrate 1 placed on the hot plate 3. A gas discharge port 6 for discharging a gas from the heat treatment chamber 2 is provided at a position opposed to each other with the portion interposed therebetween. On the other hand, in the second embodiment, a gas discharge port 46 for discharging gas from the heat treatment chamber 2 is disposed at an end of the heat treatment chamber 2 on the substrate passage port 4 side, and the gas discharge port 46 is connected to the hot port. A gas inlet 44 for allowing gas to flow into the heat treatment chamber 2 is provided at a position opposed to the central portion of the substrate 1 when viewed from the main surface side of the substrate 1 placed on the plate 3. This is different from the first embodiment described above.

That is, in the substrate processing apparatus according to the second embodiment, a gas discharge port 46 for discharging gas from the heat treatment chamber 2 is provided above the substrate passage port 4 and the shutter 5 on the side wall of the heat treatment chamber 2. Is formed. The gas outlet 46 is connected to the solenoid valve 8 and the blower 9 through the pipe 7 in the same manner as in the first embodiment.
On the other hand, on the side wall of the heat treatment chamber 2 opposite to the substrate passage opening 4 and the shutter 5, a gas inlet 44 for allowing gas to flow into the heat treatment chamber 2 is formed. The gas inlet 44 is connected to a solenoid valve 48 via a pipe line 47.

When the heat treatment of the substrate 1 is performed by the heat treatment apparatus according to the second embodiment, the shutter 5 is driven by the motor 10 shown in FIG. The substrate is lowered from the position indicated by the solid line to the position indicated by the two-dot chain line to open the substrate passage opening 4. Then, by a substrate transfer arm (not shown),
After the substrate 1 is carried into the heat treatment chamber 2 via the substrate passage 4 and placed on the hot plate 3, the shutter 5 is raised again and the substrate passage 4 is closed.

By maintaining this state for a predetermined time,
The substrate 1 is heated by the hot plate 3 to heat-treat the substrate 1. At this time, since the substrate 1 is heated by the hot plate 3 in the enclosed space formed by the heat treatment chamber 2 and the shutter 5, the substrate 1 is uniformly heated over its entire surface. Therefore, unlike the related art, the temperature does not decrease near the edge of the substrate 1 and does not increase near the center.

When the necessary heat treatment for the substrate 1 is completed,
The shutter 5 is lowered by driving the motor 10, and the substrate passage 4 is opened. At the same time, by opening the electromagnetic valve 48, the gas inlet 44 is communicated with the atmosphere via the pipe 47. Further, the electromagnetic valve 8 is opened, and the gas present in the heat treatment chamber 2 is caused to flow by the action of the blower 9 from the gas discharge port 46 formed above the substrate passage port 4 to the pipeline 7.
Release to the atmosphere through. Thereby, the gas in the heat treatment chamber 2 is quickly discharged through the pipe 7 and
Fresh outside air enters the inside through the gas inlet 44. Therefore, ventilation of evaporative components and the like from the resist solution present in the heat treatment chamber 2 and heat exhaust in the heat treatment chamber 2 are quickly performed.

At this time, as in the case of the first embodiment, since the gas exhaust direction is determined to be constant, the stagnation of the atmosphere near the substrate 1 is prevented, and the resist solution existing in the heat treatment chamber 2 is removed. In particular, the ventilation of the evaporation component and the heat exhaust in the heat treatment chamber 2 can be performed particularly quickly. Further, it is not necessary to consider the balance of each exhaust as in the case of exhausting from a plurality of locations in the heat treatment chamber, and the exhaust mechanism can be simplified.

The gas inlet 44 for flowing gas into the heat treatment chamber 2 and the gas discharge port 46 for discharging gas from the heat treatment chamber 2 are connected to the substrate 1 placed on the hot plate 3. Since they are arranged facing each other across the central portion of the substrate 1 when viewed from the main surface side, the stagnation of the atmosphere in the central portion of the substrate 1 can be prevented, and the temperature of the central portion of the substrate 1 becomes close to the edge. It is possible to effectively prevent the phenomenon of being higher than the above.

Furthermore, in this embodiment, since the outside air flows from the back side of the heat treatment chamber 2, that is, from the opposite side of the substrate passage 4, the substrate passage 4 in the substrate processing chamber 2 is formed.
Excessive temperature drop in the vicinity can be prevented.

In the substrate processing apparatus according to the second embodiment, instead of performing the ventilation operation after the heat treatment on the substrate 1 is completed, the ventilation operation is performed in parallel with the heat treatment on the substrate 1. Is also good. That is, in the process of performing the heat treatment on the substrate 1, the solenoid valve 48 is opened and the solenoid valve 8 is opened, the blower 9 is operated with a weak driving force, and the gas existing in the heat treatment chamber 2 is removed. The gas is gradually discharged from the discharge port 46 to the atmosphere via the pipe 7. As a result, the gas in the heat treatment chamber 2 is gradually discharged through the pipe 7, and fresh outside air enters the heat treatment chamber 2 from the gas inlet 44. Therefore,
Ventilation of the evaporated components from the resist solution present in the heat treatment chamber 2 and heat exhaustion in the heat treatment chamber 2 can be performed in parallel with the heat treatment operation.

Next, still another embodiment of the present invention will be described. FIG. 5 is a schematic plan sectional view showing the configuration of the heat treatment apparatus according to the third embodiment of the present invention. In addition,
The same members as those in the first or second embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

In the substrate processing apparatus according to the third embodiment, as shown in FIG. 5, a gas exhaust for exhausting gas from the heat treatment chamber 2 is provided on a side wall of the heat treatment chamber 2 on a side orthogonal to the substrate passage opening 4. An outlet 56 is provided, and the gas outlet 56 and the substrate 1 placed on the hot plate 3 are placed.
A gas inlet 54 for allowing gas to flow into the heat treatment chamber 2 is provided at a position facing the center of the substrate 1 when viewed from the main surface of the substrate 1. And this gas outlet 5
6 is connected to the solenoid valve 8 and the blower 9 through the pipe 7 in the same manner as in the above-described embodiment, and the gas inlet 54 is connected to the solenoid valve 58 through the pipe 57. .

In the heat treatment apparatus according to the third embodiment, as in the substrate processing apparatus according to the above-described first and second embodiments, the gas exhaust direction is determined to be a fixed direction. It is possible to particularly quickly execute the ventilation of the evaporation component and the like from the resist solution existing in the heat treatment and the heat exhaust in the heat treatment chamber 2, and simplify the exhaust mechanism without having to consider the balance of each exhaust. It becomes possible. The gas inlet 44 for allowing gas to flow into the heat treatment chamber 2 and the gas outlet 46 for discharging gas from the heat treatment chamber 2 are provided on the main surface side of the substrate 1 placed on the hot plate 3. When viewed from the side, they are arranged to face each other with the central portion of the substrate 1 interposed therebetween, so that it is possible to effectively prevent the phenomenon that the temperature of the central portion of the substrate 1 becomes higher than that near the edge. Become.

Next, still another embodiment of the present invention will be described. FIG. 6 is a schematic plan sectional view showing a configuration of a heat treatment apparatus according to a fourth embodiment of the present invention. In addition,
The same members as those in the above-described first to third embodiments are denoted by the same reference numerals, and detailed description is omitted.

In the substrate processing apparatus according to the fourth embodiment, as shown in FIG. 6, the substrate 1 is viewed from the main surface side of the substrate 1 placed on the substrate passage port 4 and the hot plate 3. A gas discharge port 66 for discharging gas from the heat treatment chamber 2 is disposed at a position opposed to the central portion of the heat treatment chamber 2, and the substrate passage port 4 on a side wall of the heat treatment chamber 2 on a side orthogonal to the substrate passage port 4. A pair of gas inlets 64 for allowing gas to flow into the heat treatment chamber 2 are disposed at positions close to the heat treatment chamber 2 so as to face each other. And the gas outlet 6
6 is connected to the electromagnetic valve 8 and the blower 9 via the pipe 7 in the same manner as in the above-described embodiments, and the gas inlet 64 is connected to the electromagnetic valve 68 via the pipe 67. I have.

In the heat treatment apparatus according to the fourth embodiment, similarly to the substrate processing apparatus according to the first to third embodiments, the substrate 1 can be uniformly heat-treated. Ventilation and heat exhaust can be performed quickly.

Next, still another embodiment of the present invention will be described. FIG. 7 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a fifth embodiment of the present invention. In addition,
The same members as those in the above-described first to fourth embodiments are denoted by the same reference numerals, and detailed description is omitted.

In the substrate processing apparatus according to the fifth embodiment, as shown in FIG. 7, the substrate 1 is viewed from the main surface side of the substrate 1 placed on the substrate passage port 4 and the hot plate 3. A gas outlet 76 for discharging gas from the heat treatment chamber 2 is disposed at a position facing the center of the heat treatment chamber 2, and above the substrate 1 placed on the hot plate 3 in the heat treatment chamber 2, A plurality of gas inlets 74 for allowing gas to flow into the heat treatment chamber 2 are arranged in a lattice shape in plan view. The gas outlet 76 is connected to the solenoid valve 8 and the blower 9 through the pipe 7 similarly to the above-described embodiments.
The gas inlet 74 is connected to a solenoid valve 78 via a pipe 77. In addition, the gas discharge port 76 is the closest to the substrate passage port 4 among the plurality of gas inflow ports 74 in the side sectional view of FIG. 7 when viewed from the main surface side of the substrate 1 placed on the hot plate 3. Close gas inlet 7
4 can be said to be disposed at a position facing the substrate 1 with the central portion of the substrate 1 interposed therebetween.

In the heat treatment apparatus according to the fifth embodiment, as in the substrate processing apparatuses according to the first to fourth embodiments, the substrate 1 can be uniformly heat-treated. Ventilation and heat exhaust can be performed quickly.

In the second to fifth embodiments described above, the gas inlets 44, 54, 64, 74 for allowing outside air to flow into the heat treatment chamber 2 are connected to the pipes 47, 57, 6, 6.
7, 77 and the solenoid valves 48, 58, 68, 78 communicate with the atmosphere, but the pipes 47, 57, 67, 77
A filter or the like may be provided inside, and the inside and outside of the heat treatment chamber 2 may be connected to each other through the filter or the like. By adopting such a configuration, it is possible to prevent particles in the atmosphere from entering the heat treatment chamber 2.

In each of the above-described embodiments, the case where the electromagnetic valve 8 and the blower 9 are used as the exhaust means has been described. However, instead of the electromagnetic valve 8, another valve such as an air valve or the like may be used. A damper having an opening and closing function may be used, and a factory exhaust or a vacuum pump may be used instead of the blower 9.

In each of the above-described embodiments, a case has been described in which the present invention is applied to a heat treatment apparatus for heating and processing a substrate 1 coated with a resist. The present invention can be applied to various heat treatment apparatuses that need to accommodate a substrate in a heat treatment chamber, process the substrate in a high temperature state, and perform heat exhaust or the like, such as an apparatus for applying a HMDS to the surface of a substrate.

Further, in the above-described embodiment,
In each case, the case where the rectangular substrate 1 is heated and processed by the rectangular hot plate 3 has been described. For example, a substantially circular substrate such as a semiconductor wafer is heated and processed by the substantially circular hot plate. Is also good.

[0054]

According to the first aspect of the present invention, since the opening / closing means is provided with the control means for exhausting the gas in the heat treatment chamber by the gas exhaust means when the gas inlet is opened, the entire surface of the substrate is made uniform. After the heating and the heat treatment, the gas in the heat treatment chamber is quickly exhausted, and the ventilation and the heat exhaust in the heat treatment chamber can be quickly performed.

According to the second aspect of the present invention, since the substrate passage is used as the gas inlet and the shutter is used as the opening / closing means, the structure of the heat treatment apparatus can be simplified. In addition, since the substrate passage is formed at one end of the heat treatment chamber and the gas discharge port is formed at the end opposite to the substrate passage in the heat treatment chamber, all the gas existing in the heat treatment chamber at the end of the heat treatment of the substrate. The gas can be exhausted from the heat treatment chamber particularly quickly.

According to the third aspect of the present invention, the substrate is disposed at a position facing the gas inlet with at least a part of the substrate interposed therebetween when viewed from the main surface side of the substrate accommodated in the heat treatment chamber, Since a gas outlet for exhausting gas from the heat treatment chamber is provided, the gas can be exhausted in a certain direction, and uniform heating over the entire surface of the substrate and rapid ventilation and heat exhaust in the heat treatment chamber are performed. It becomes possible.

According to the fourth aspect of the present invention, the position where the gas exhaust port faces the gas inlet with the central portion of the substrate therebetween when viewed from the main surface side of the substrate accommodated in the heat treatment chamber. , The stagnation of the atmosphere in the center of the substrate can be reliably prevented, and the substrate can be more uniformly heat-treated.

According to the fifth aspect of the present invention, since the gas inlet is constituted by the substrate passage opening formed at one end of the heat treatment chamber for loading or unloading the substrate into or out of the heat treatment chamber, The configuration can be simplified, and the gas can be quickly flowed into the heat treatment chamber.

According to the sixth aspect of the present invention, the heat treatment chamber has at one end thereof a substrate passage for loading or unloading a substrate, and the gas inlet is formed at an end opposite to the substrate passage. Since it is provided, it is possible to alleviate a decrease in temperature on the substrate passage opening side in the heat treatment chamber.

According to the seventh aspect of the present invention, when the shutter is opened in the substrate transfer step, the gas in the heat treatment chamber is ventilated by the exhaust means for exhausting the gas in the heat treatment chamber, so that the entire surface of the substrate is uniformly heated. And heat-treated,
It is possible to quickly exhaust the gas in the heat treatment chamber and quickly perform ventilation and heat exhaust in the heat treatment chamber.

According to the eighth aspect of the present invention, a gas flows into the heat treatment chamber from the gas inlet provided in the heat treatment chamber, and the gas flows from the main surface side of the substrate accommodated in the heat treatment chamber in the processing chamber. Since the gas in the heat treatment chamber is exhausted from the gas outlet arranged at a position facing the gas inlet with at least a part of the substrate interposed therebetween in the state in which the substrate is seen, the gas can be exhausted in a certain direction. In addition, uniform heating over the entire surface of the substrate and rapid ventilation and heat exhaustion in the heat treatment chamber can be performed.

[Brief description of the drawings]

FIG. 1 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan sectional view showing a main part of the heat treatment apparatus according to the first embodiment of the present invention.

FIG. 3 is a block diagram showing a main electrical configuration of a heat treatment apparatus according to the present invention.

FIG. 4 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a second embodiment of the present invention.

FIG. 5 is a schematic plan sectional view showing a configuration of a heat treatment apparatus according to a third embodiment of the present invention.

FIG. 6 is a schematic plan sectional view showing a configuration of a heat treatment apparatus according to a fourth embodiment of the present invention.

FIG. 7 is a schematic side sectional view showing a configuration of a heat treatment apparatus according to a fifth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Heat treatment room 3 Hot plate 4 Substrate passage 5 Shutter 6 Gas discharge port 7 Pipe line 8 Solenoid valve 9 Blower 10 Motor 20 Control part 44, 54, 64, 74 Gas inlet 46, 56, 66, 76 Gas discharge Exit

Claims (8)

[Claims] 1. A heat treatment chamber for accommodating a substrate to be heat-treated, a substrate heating means disposed in the heat treatment chamber, and a gas inlet disposed in the heat treatment chamber for flowing gas into the heat treatment chamber. Opening / closing means for opening / closing the gas inlet; exhaust means for exhausting gas in the heat treatment chamber; and the gas exhaust means in the heat treatment chamber with the opening / closing means opening the gas inlet. And a control means for exhausting the gas. 2. The heat treatment apparatus according to claim 1, wherein the gas inlet comprises a substrate passage formed at one end of the heat treatment chamber for carrying a substrate into or out of the heat treatment chamber. A heat treatment apparatus, wherein the opening / closing means comprises a shutter for opening / closing the substrate passage opening, and the gas exhaust means further comprises a gas discharge port formed at an end of the heat treatment chamber opposite to the substrate passage opening. 3. A heat treatment chamber for accommodating a substrate to be heat-treated, a substrate heating means disposed in the heat treatment chamber, and a gas inlet disposed in the heat treatment chamber for flowing gas into the heat treatment chamber. And disposed in the processing chamber at a position facing the gas inlet with at least a part of the substrate interposed therebetween when viewed from the main surface side of the substrate housed in the heat treatment chamber, A heat treatment apparatus, comprising: a gas outlet for exhausting gas. 4. The heat treatment apparatus according to claim 3, wherein the gas outlet is the gas inlet with a central portion of the substrate interposed therebetween when viewed from a main surface side of the substrate accommodated in the heat treatment chamber. A heat treatment apparatus disposed at a position facing the above. 5. The heat treatment apparatus according to claim 3, wherein said gas inlet is a substrate passage opening formed at one end of said heat treatment chamber for carrying a substrate into or out of said heat treatment chamber. Heat treatment device composed of: 6. The heat treatment apparatus according to claim 3, wherein the heat treatment chamber has a substrate passage at one end thereof for carrying in or out a substrate, and the gas inlet is provided with the gas inlet. A heat treatment apparatus provided at the end opposite to the substrate passage port. 7. A substrate transfer step of opening and closing a shutter of a substrate passage opening in a heat treatment chamber to load or unload a substrate into and from the heat treatment chamber, and heating the substrate disposed in the heat treatment chamber by closing the shutter. A heating step of heating by means, wherein at the time of opening the shutter in the substrate transfer step,
A heat treatment method, wherein the gas in the heat treatment chamber is ventilated by exhaust means for exhausting the gas in the heat treatment chamber. 8. A heat treatment method for heating a substrate accommodated in a heat treatment chamber by a heating means disposed in the heat treatment chamber, wherein a gas flows into the heat treatment chamber from a gas inlet provided in the heat treatment chamber. And in the processing chamber,
The gas in the heat treatment chamber is exhausted from a gas outlet disposed at a position facing the gas inlet with at least a part of the substrate interposed therebetween as viewed from the main surface side of the substrate accommodated in the heat treatment chamber. Thereby ventilating the gas in the heat treatment chamber.