JPH10275667A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect the electrical characteristics of a semiconductor device at low cost by arranging a plurality of contact pins so that one end is fit to an electrode pitch of the semiconductor device and the other end is fit to the pitch of an electrical connection terminal of an outside connection body. SOLUTION: An IC package 13 is mounted on one end 1a of a lead (contact pin) 1, and an outside connecting body is connected to the other end 1b. The IC package 13 has electrodes arranged longitudinally and laterally in matrix the pitch of electrodes is 0.5 mm, and the number of electrodes is 16×16, in total, 256. In the outside connecting body, the pitch between connecting terminals is 1.27 mm and the number of connection terminals is 256. When the electrical characteristics of the IC package 13 are inspected with an IC socket, the IC package 13 is pushed down with a pressing plate 9 pressed by energized force of a spring 10, and each connection pad is pressed against each corresponding end 1a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an I / O device used for inspecting electrical characteristics of a semiconductor device such as an LSI and a bare chip.
Regarding C socket.

[0002]

2. Description of the Related Art As the density of semiconductor elements has increased, a ball grid array (B) has been used as a semiconductor element in which solder balls for connection are arranged in an array or matrix as electrodes.
GA: Ball Grid Array, Pin Grid Array (PGA:
Pin Grid Array (LGA) or Land Grid Array without solder balls (LGA: Land Grid Array)
The demand for such IC packages is rapidly increasing.

[0003] In these IC packages, the pitch between electrodes is changed from 1.0 mm to 0.8 mm as the density of semiconductor elements increases.
→ It tends to be as small as 0.5 mm. In general, a burn-in test is performed on a semiconductor device after manufacturing. In the burn-in test, a semiconductor element is mounted on an IC socket and heated under predetermined conditions to test electrical characteristics.

Conventionally, IC sockets are embedded in a synthetic resin such that contact pins that contact the electrodes of the semiconductor element are equal in pitch between the electrodes of the semiconductor element. One end of the contact pin contacts the electrode of the semiconductor element, and the other end of the leg extending outside the socket is inserted and connected to a printed circuit board and connected to an external tester or the like. This printed circuit board is a wiring board and has a function of enlarging and converting a fine pitch of contact pins set equal to a pitch between electrodes of a semiconductor element into a pitch between connection terminals with an external tester or the like. For example, the pitch of the contact pins is changed from 1.0 mm to a pitch of 1.27 between the connection terminals of the external tester.
mm or 2.54 mm, or when the electrode arrangement of the semiconductor element is in a matrix form, the arrangement of the contact pins is enlarged in a matrix form, or the arrangement itself is converted.

[0005]

By the way, as the pitch between the electrodes of the semiconductor element becomes narrower and the two-dimensionally advanced electrode arrangement becomes a matrix, the pitch of the contact pins in the IC socket is enlarged and converted. In this case, the printed circuit board used in the above-mentioned method must use a multilayer printed circuit board having 4 to 8 layers or 10 layers.

[0006] However, when the printed circuit board is multi-layered, the manufacturing cost is increased, so that the cost required for the burn-in test of the semiconductor element is also increased.
The present invention has been made in view of the above points, and has as its object to provide an IC socket capable of inexpensively inspecting electrical characteristics of a semiconductor element without using an expensive multilayer printed circuit board. .

[0007]

According to the present invention, in order to achieve the above object, an IC having a plurality of contact pins is provided.
A socket, wherein the plurality of contact pins are arranged in a matrix in accordance with the electrode pitch of the semiconductor element to which one end is attached and the pitch of the electrical connection terminals of the external connection body to which the other end is connected. That is the configuration.

Preferably, the plurality of contact pins include a plurality of lead frames having a plurality of leads arranged in parallel in a single plane, and each lead frame has one end of the plurality of leads. The other ends of the plurality of leads are adjusted to the electrode pitch of the semiconductor element to be mounted, respectively, to the pitch of the electrical connection terminals of the external connection body to be connected, and one end of the plurality of leads is connected to the other. An end side is bent substantially in parallel to the single surface via a step portion, and a plurality of the contact pins are stacked to form the plurality of contact pins.

Preferably, in each of the lead frames, a spring portion formed in an arc shape is formed at one end of the plurality of leads, and the plurality of leads are formed of an electrically insulating synthetic resin in the vicinity of the spring portion. And a first fixing portion fixed in the arrangement direction is provided. More preferably,
Each of the lead frames is provided with a second fixing portion in which the other ends of the plurality of leads are fixed in an arrangement direction with an electrically insulating synthetic resin.

[0010] Preferably, the plurality of contact pins have, on one end side where the semiconductor element is mounted, an eye plate for positioning each contact pin. Also preferably,
By the first fixing portion or the second fixing portion, the pitch of both ends of the lead when a plurality of the lead frames are stacked, the pitch of the electrode of the semiconductor element and the pitch of the electrical connection terminal of the external connection body, respectively. Match.

[0011]

According to the first aspect, the IC socket is directly connected to a terminal of an external connector such as an external tester for performing a burn-in test. Therefore, it is not necessary to use an expensive multilayer printed circuit board for pitch conversion. At this time, in the IC socket, when the arrangement of one ends of the plurality of contact pins on the semiconductor element side is two-dimensional, the pitch of the arrangement of the other ends of the plurality of contact pins on the external connector side is not necessarily two-dimensional. It does not need to be enlarged, and may be one-dimensionally enlarged.

According to the second aspect of the invention, when the lead frame is bent, the height of the step portion is appropriately changed, so that the other end on the side of the external connection body of the lead in the direction orthogonal to the arrangement direction of the lead. The pitch can be set by the stacking interval of the lead frame. At this time,
The pitch of the leads in the arrangement direction can be arbitrarily determined when the lead frame is formed.

Therefore, in the IC socket according to the second invention, the pitch of the plurality of contact pins is enlarged and converted from the electrode pitch of the semiconductor element to the pitch of the electrical connection terminals of the external connection body. Use of an inexpensive printed circuit board such as a laminated board is sufficient. According to the third aspect, in the plurality of contact pins in each lead frame, the vicinity of the spring portion is fixed with the synthetic resin, so that each contact pin is independent of the arrangement position with respect to the electrode of the semiconductor element. Apply a constant spring pressure.

According to the fourth aspect of the present invention, since the other end of the plurality of contact pins in each lead frame, which is the side of the external connector, is fixed with the synthetic resin, the pitch of the plurality of contact pins on the side of the external connector is reduced. It is kept constant. According to the fifth aspect, the pitch of the plurality of contact pins on the semiconductor element side is kept constant by the eye plate.

According to the sixth aspect, the electrode pitch of the semiconductor element and the pitch of the electrical connection terminals of the external connection body are determined at the time of manufacturing the lead frame, so that the IC socket can be easily assembled.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
This will be described in detail with reference to FIGS. First, in the IC socket according to the first embodiment, as shown in FIG. 2, an IC package 13 is mounted on one end 1a of a lead (contact pin) 1, and an external connector is connected on the other end 1b. . Here, in the IC package 13, the electrodes are arranged vertically and horizontally in a matrix, and the pitch between the electrodes in the length and width is 0.5 mm.
And the number of electrodes is 16 × 16, for a total of 256 electrodes. The external connection body has a pitch between connection terminals of 1.27 mm and the number of connection terminals is 16 × 16, that is, 256 in total.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIGS. 1A to 1C are diagrams showing a process of manufacturing a socket body used for the IC socket of the present embodiment. The steps are as follows. 1) Using a beryllium copper alloy plate having a thickness of 0.1 mm, 16 lead frames 2 having 16 leads 1 arranged in parallel in a single plane were prepared by etching. 1
(A)). As an etchant, for example, a ferric chloride solution or the like was used. Both ends 1a and 1b of the 16 leads 1 are connected to the adjacent leads 1 by a frame 3 to form a lead frame 2.

The direction in which the leads 1 of the lead frame 2 are arranged is the X direction, and the direction perpendicular to the surface of the lead frame 2 is the Y direction. The pitch (X direction) of one end 1a of the lead 1 (0.1 mm in width, which comes into contact with the IC package) is 0.5 mm,
The pitch (X direction) of the other end 1b of the lead 1 (connected to the external connection body) is enlarged to 1.27 mm. In order to improve the electrical contact between both ends 1a and 1b of the lead 1, for example, a Ni plating of about 3 μm thickness is formed on a base and about 0.3 μm is formed thereon.
An Au plating having a thickness of m is applied.

The lead 1 does not need to have both ends 1a and 1b connected by the frame 3, but at least one end 1a.
Alternatively, the other end 1b may be connected. 2) Then,
As shown in FIG. 1B, two insulating tapes 4a and 4b were applied in the X direction of the lead frame 2, and the lead 1 was fixed. Thereafter, a position P at a predetermined distance from the tip of the one end 1a.
The lead frame 2 is bent at a right angle in the Y direction at 1 and then the lead frame 2 is bent at a right angle in the opposite direction at a position P2 at a predetermined distance from the position P1, thereby forming a step 2c, and both sides of the step 2c. The arrangement surfaces 2a and 2b of the leads 1 in Example 2 were made parallel.

Next, the leg on the other end 1b side of the lead 1 was molded and fixed with an electrically insulating resin 5, and the frame 3 was cut off. The lead frame 2 in such a state is bent at the bending position P.
1, P2 was shifted, and eight sheets and one set of two sets were prepared, that is, 16 sheets in total. In addition, as shown in FIG. 1C, the bending positions P1 and P2 are set at one end 1 in a state where the lead frames 2 are stacked.
The interval between a and 1a is 0.5 mm, and the interval between the other ends 1b and 1b is 1.
It was set to be 27 mm. 3) Next, FIG.
As shown in the figure, the 16 lead frames 2 were stacked at a predetermined interval to form a socket body 8 to obtain an IC socket. FIG. 1 (c) shows the symmetrically stacked 1
It is sectional drawing which looked at one side and eight sheets of six lead frames 2 from the X direction.

At this time, the stacking of the plurality of lead frames 2 was performed as follows. That is, a thermosetting and electrically insulating resin having 256 holes 0.2a in diameter and having a pitch of 0.5mm vertically and horizontally (pitch of connection pads (electrodes) of an IC package) and 16 × 16 = 256 is provided. Was prepared.
Then, first, the resin 5 is fitted into the fixed frame 7 and the lead 1
Is positioned and fixed to the fixed frame 7 on the other end 1b side.

Next, the eye plate 6 was arranged at one end side where the IC package 13 was mounted, one end 1a of the lead 1 was inserted into the hole 6a and positioned, and 16 lead frames 2 were fixed. Here, one end 1a of the lead 1 is connected to the IC package 13
For example, if the positioning can be properly performed with respect to each connection pad (electrode) of the semiconductor element, the eye plate 6 is not necessarily required.

FIG. 2 shows that the IC socket is connected to a pressing plate 9,
FIG. 5 is a cross-sectional view of a case having an outer frame 11 and a lid 12 incorporated in the case. When inspecting the electrical characteristics of the IC package 13 using this IC socket, the IC package 13 is pushed down by the pressing plate 9 pressed by the urging force of the spring 10, and each connection pad (electrode) is connected to the corresponding lead. 1
To one end 1a. Here, in FIG. 2, the resin 5 for fixing the leg on the other end 1b side of the lead 1 is omitted.

In the above embodiment, if the tip of one end 1a of the lead 1 is formed sharp, the IC package 1
The contact resistance with the connection pad (electrode) 3 is small, which is preferable for measuring the electrical characteristics of the IC package 13. When one end 1a of the lead 1 is partially curved in the X direction or the Y direction, the one end 1a has a spring property,
Damage to the connection pads (electrodes) of the C package 13 is reduced.

Next, an IC according to a second embodiment of the present invention
As a socket, electrode pitch 0.5mm, number of electrodes 16 ×
16, an IC socket mounted with a total of 256 IC packages (μBGA) and expanded and converted to a total of 256 connection terminals with a connection terminal pitch of 1.27 mm and a terminal number of 16 × 16 based on FIGS. 3 to 14 explain. IC socket 20
Has a plurality of contact pins 21 arranged in a matrix as shown in FIGS. 3 to 5 and is used by being fixed to a case 30.

As shown in FIG. 6, the contact pins 21 have 16 leads 22 arranged in parallel in a single plane.
and a plurality of lead frames 22 having a. The lead frame 22 has 16 leads 22a, both ends of which are connected by a frame 22b. One end of the lead 22a has a spring portion 22c formed in an arc shape and an insertion hole 22d.
Are formed. 16
One end of the lead 22a is at an electrode pitch (= 0.5 mm) of an IC package to be mounted, and the other end is at a pitch of connection terminals (= 1.27 mm) of an external tester to be connected.
Each is formed together. Lead frame 22
As shown in FIG. 7, an electrically insulating synthetic resin such as a liquid crystal polymer (LCP), a polyphenylene sulfide (PPS), a polyether ketone (PEEK), and a polybutylene terephthalate (PBT) are provided near the spring portion 22c.
Alternatively, a first fixing portion 23 fixed in the arrangement direction of the leads 22a with a heat-resistant synthetic resin such as polyamideimide (PAI) is provided, and a second fixing portion fixed in the arrangement direction with the synthetic resin on the other end side. 24 are provided.

As shown in FIG. 7, the first fixing portion 23 is formed in a concave shape in which the spring portion 22c is opened.
2 and a bolt hole 23a is formed on both sides. The first fixing portion 23 stacks a plurality of lead frames 22, and fixes the plurality of lead frames 22 with the bolts 25 inserted into the bolt holes 23 a to form the IC socket 20.

The second fixing portion 24 is provided on the other end of the lead 22a, and has pin holes 24a on both sides.
The lead frame 22 is formed by bending one end and the other end of the 16 leads 22a substantially in parallel to the single surface via the step 22f, as in the first embodiment.
16 × 1 stacked 16 and arranged in a matrix
6. A total of 256 contact pins 21 are formed.

Here, the lead frame 22 was manufactured as follows. First, a lead frame 22 shown in FIG. 6 was produced by etching using a beryllium copper alloy plate having a thickness of 0.1 mm. As an etchant, for example, a ferric chloride solution or the like was used. Lead frame 22
Is about 3 μm thick Ni plating on the base, and about 0.3 μm
An m-thick Pd-25Ni plating was applied. The lead frame 22 may be plated with Au or Pd instead of Pd-25Ni. Also, the lead frame 22
The electrical connection between the leads 22a may be prevented by applying an electrically insulating paint except for both ends of the leads 22a or attaching an insulating tape.

Here, as shown in FIG. 6, a plurality of lead frames 22 are connected in the arrangement direction of the leads 22a by a frame 22b, and are separated by a thin half-etched portion 22g as shown in FIG. . Next, as shown in FIG.
The first fixing portion 23 is attached to the lead 22a near the spring portion 22c.
Are provided on the other end side, and the two frames 22b are twisted off.

Next, the lead frame 22 is bent at a right angle with respect to the single surface at the first fixing portion 23 on one end side, similarly to the first embodiment described above, and further bent at the second fixing portion 24 side. To form a step 22f (see FIG. 5). As a result, both ends of the lead frame 22a of the lead frame 22 were bent substantially in parallel via the step 22f. At this time, since a plurality of lead frames 22 are stacked, in the second lead frame 22,
For the first lead frame 22, the first fixing portion 23
Side bending position away from the spring portion 22c,
The bending position on the fixed part 24 side was set to a position further away by the pitch of the connection terminals (= 1.27 mm) in the external tester.

By changing the bending positions of the leads 22a in this manner, the contact pins 21 between the first lead frame 22 and the second lead frame 22 are changed.
Indicates that the pitch at one end is 0.5 between the electrodes of the IC package.
mm and the pitch of the other end can be the same as the pitch of the connection terminals of the external tester (= 1.27 mm).

Such a change in the bending position of the lead 22a was successively repeated for the third and subsequent lead frames 22 to produce a total of 16 lead frames 22. These 16 lead frames 22 are stacked by being superimposed on the first fixing portion 23, clamping plates 26 and 27 are arranged on both sides of the first fixing portion 23, and fixed by the bolt 25 inserted into the bolt hole 23 a. An IC socket 20 was obtained.

The IC socket 2 assembled in this manner
3 is inserted into an opening 30a formed in the center of the case 30, and is fixed to the case 30 by pins 31 and 32, as shown in FIGS. At this time, the pin 31 is
And abuts on the lower end of the first fixing portion 23, and the pin 32
The pin hole 24 of the second fixing portion 24 extends through the case 30.
a.

The IC socket 20 is connected to the spring portion 22c of the lead frame 22,
As shown in FIG. 4, at one end side, the pitch (= 0.5 mm) equal to the pitch between the electrodes of the IC package 40,
A perforated plate 33 having a total of 256 3 × 16 through holes of 16 × 16 is attached. As a result, the pitch of one end of the plurality of contact pins 21 is
The pitch is maintained at the same pitch as the electrodes of the C package 40.
Here, the eye plate 33 has an IC package 40 (FIG. 5) in the center.
(Refer to FIG. 3).

Here, FIG.
In order to show the C socket 20, the lid 34 shown in FIGS. In FIG. 5, the lid 34 is opened and closed about a hinge pin 34a, and is locked by a projection 30b provided on a wall surface of the case 30 by a hook 34b.
Then, the IC package 40 is used by the IC socket 20.
When inspecting, as shown in FIG. 5, the IC package 40 is arranged in the positioning groove 33a of the eye plate 33, and the lid 34 is closed. At the same time, the case 30 is placed on an external tester (not shown), and the other end of the contact pin 21 is brought into direct contact with the connection terminal of the external tester.

Then, as shown in FIG. 5, the pressure plate 35 incorporated in the lid 34 pushes down the IC package 40 together with the eye plate 33 by the spring force from the first spring 36 disposed between the pressure plate 35 and the lid 34. At this time, the eye plate 33 is pressed by the second spring 37 disposed between the case plate 30 and the pressure plate 35.
Biased in the direction. Therefore, the IC socket 20
One end of each contact pin 21 protrudes from the hole of the eye plate 33 and comes into contact with a corresponding electrode (not shown) of the IC package 40. As a result, the IC socket 20 is connected to the connection terminals where the respective electrodes of the IC package 40 are located outside.
Inspection of the electrical characteristics of the IC package 40, for example, a burn-in test can be performed at low cost without using an expensive multilayer printed circuit board.

At this time, the IC socket 20 is connected to the lead 22a of each lead frame 22 which becomes the contact pin 21.
And a spring portion 22c formed in an arc shape.
Therefore, in the IC socket 20, the contact pins 21 are always in contact with the electrodes of the IC package 40 at a constant contact pressure, and the lower position of the eye plate 33 is regulated by the stopper 22e of the lead frame 22, so that the maximum contact The pressure is also fixed.

Here, it is needless to say that the lead frame 22 forming the plurality of contact pins 21 is not limited to the above-described embodiment. For example, FIG.
As in the lead frame 42 shown in (b), an arc-shaped spring portion 42c may be formed so as to protrude in a direction perpendicular to the arrangement surface of the leads 42a. At this time, the lead frame 42 includes the first fixing portion 43 and the second fixing portion 4.
4 are provided, and when a plurality of layers are stacked, as shown in FIG. 9, the layers are stacked so that the direction of the spring portion 42c is different from the center line Lc as a boundary. In this case, since the left and right spring portions 42c do not interfere with each other and are symmetrical in the left and right lead frames, a plurality of lead frames are required to be bent (16
There is an advantage that only half (8) of the sheets are required.

Here, in the following description, the first fixing portion 43 and the second fixing portion 44 are given only reference numerals in the drawing, and the description is omitted. On the other hand, the lead frame 4 shown in FIG.
As shown in FIG. 5, the spring portions 45c formed in an arc shape may be formed so as to alternately project in a direction perpendicular to the arrangement surface of the leads 45a. By doing so, the lead frame 4
No. 5 has the advantage that the arc of the spring portion 45c can be enlarged, and a small spring constant can be obtained.

Further, like a lead frame 46 shown in FIG.
Although it is formed in the arrangement surface on one end side of a, an arc-shaped spring portion 46d is also formed on the external tester side on the other end side of the lead 46a. In this case, the lead frame 46
The lead 46a can be brought into contact with an external connection terminal with an appropriate contact pressure.

Further, like a lead frame 47 shown in FIGS. 12A to 12C, a spring portion 47c formed in an arc shape is used.
Are formed by alternately protruding in a direction perpendicular to the arrangement surface of the leads 47a. The distal end side of the leads 47a and the first fixing portion 43 are arranged in the arrangement surface of the leads 47a, and The spring portion 47c is formed parallel to the arrangement surface of the lead 47a at a position protruding vertically from the arrangement surface. In this way, the lead frame 47 can form the spring portion 47c into a larger arc even if bending is taken into consideration.

On the other hand, as in a lead frame 48 shown in FIG. 13, conduction between a lead 48a provided with an arc-shaped spring portion 48c and an electrode of a semiconductor element (not shown) such as an IC package is measured in the thickness direction. This may be performed via an anisotropic conductive film 49 having only the electrical conductivity and not having the electrical conductivity in the longitudinal direction (the horizontal direction in the drawing). By doing so, the lead frame 48 does not need to individually connect the leads 48a to the electrodes of the semiconductor element (not shown), and the usability of the IC socket is improved.

As such an anisotropic conductive film 49, for example, fine particles such as conductive metal or graphite, or a linear conductor can be mixed with synthetic resin such as silicone rubber or thermoplastic elastomer having elasticity. An embedded material, a material obtained by alternately laminating a rubber-like sheet having conductivity and a rubber-like sheet having electrical insulation, and the like can be used. Also,
As in the lead frame 50 shown in FIG. 14, the pitch of both ends of the lead 50a when a plurality of the leads 50a are stacked by the first fixing portion 43 or the second fixing portion 44 can be set to the electrode pitch of the semiconductor element or the electrical connection of the external connection body. You may make it match with the pitch of a connection terminal. Such a lead frame 5
When 0 is used, the electrode pitch of the semiconductor element and the pitch of the electrical connection terminals of the external connection body can be determined at the time of manufacturing the lead frame 50, and the IC socket can be easily assembled.

At this time, the lead frame 50 is provided with a predetermined margin in the length of the lead 50a between the first fixing part 43 and the second fixing part 44, as shown in FIG. You can leave it to the natural bend of 50a,
Lead 50a between first fixing portion 43 and second fixing portion 44
May be bent obliquely in advance. In the lead frame 22 according to the second embodiment, 16 leads 2
2a is the electrode pitch of the mounted IC package (= 0.
5 mm), and the other end was matched to the pitch (= 1.27 mm) of the connection terminals of the external tester to be connected. However, in the lead frame 22, the pitch of the leads 22a is not limited to these, and it goes without saying that the leads 22a may be formed at an arbitrary pitch in accordance with the pitch of the electrodes in the semiconductor element to be inspected.

[0046]

According to the first invention, the IC socket is
For example, it is directly connected to a terminal of an external connector such as an external tester for performing a burn-in test. Therefore, it is possible to provide an IC socket capable of inexpensively testing the electrical characteristics of a semiconductor element without using an expensive multilayer printed board for pitch conversion.

According to the second aspect, when the lead frame is bent, the height of the step portion is appropriately changed, so that the other end on the side of the external connection body of the lead in the direction orthogonal to the arrangement direction of the lead. The pitch can be set by the stacking interval of the lead frame. For this reason,
In the IC socket according to the second invention, the pitch of the plurality of contact pins is enlarged and converted from the electrode pitch of the semiconductor element to the pitch of the electrical connection terminals of the external connection body. This can be achieved by using a simple printed circuit board.

According to the third aspect, in the plurality of contact pins in each lead frame, the vicinity of the spring portion is fixed with the synthetic resin, so that each contact pin is connected to the electrode of the semiconductor element independently of the arrangement position. , A constant spring pressure can be applied. According to the fourth invention, in the plurality of contact pins in each lead frame,
Since the other end side which is the external connection body side was fixed with synthetic resin,
The plurality of contact pins can maintain a constant pitch on the external connector side.

According to the fifth aspect of the present invention, the pitch of the plurality of contact pins on the semiconductor element side can be kept constant by the blind plate. According to the sixth aspect, the electrode pitch of the semiconductor element and the pitch of the electrical connection terminals of the external connection body are determined at the time of manufacturing the lead frame, and the IC socket can be easily assembled.

[Brief description of the drawings]

FIGS. 1 (a) to 1 (c) illustrate a first embodiment of an IC socket of the present invention and are process diagrams for manufacturing a socket body used for the IC socket.

FIG. 2 shows a case where the above-mentioned IC socket is incorporated in a case,
FIG. 4 is a cross-sectional view showing a state when measuring the electrical characteristics of the package.

FIG. 3 is a plan view illustrating a second embodiment of the IC socket of the present invention, in a state where the IC socket is inserted into a case.

FIG. 4 is a sectional front view of the IC socket of FIG. 3;

FIG. 5 is a sectional side view of the IC socket of FIG. 3;

FIG. 6 is a front view showing a configuration of a lead frame used in the IC socket of FIG. 3;

FIG. 7 is a front view in which first and second fixing portions are provided on the lead frame of FIG. 6;

FIGS. 8A and 8B are a side view and a perspective view, respectively, showing a modification of the lead frame used in the IC socket according to the second embodiment.

FIG. 9 is a side view showing a state in which the lead frames of FIG. 8 are stacked.

FIG. 10 is a perspective view showing another modification of the lead frame.

FIG. 11 is a front view showing still another modified example of the lead frame.

FIG. 12 is a plan view (a), a side view (b), and a front view (c) showing another modification of the lead frame.

FIG. 13 is a front view showing still another modified example of the lead frame.

FIG. 14 is a side view showing another modified example of the lead frame.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead 1a, 1b End part 2 Lead frame 2a, 2b Frame surface 2c Step part 3 Frame 4a, 4b Tape 5 Resin 6th board 6a Hole 7 Fixed frame 8 Socket main body 9 Press plate 10 Spring 11 Outer frame body 12 Lid body 13 IC package 20 IC socket 21 Contact pin 22 Lead frame 22a Lead 22c Spring part 22f Step part 23 First fixing part 24 Second fixing part 30 Case 31, 32 pin 33 Eye plate 34 Cover 35 Pressure plate 40 IC package 42 Lead Frame 43 First fixing portion 44 Second fixing portion 45 to 48 Lead frame 49 Anisotropic conductive film 50 Lead frame

 ──────────────────────────────────────────────────続 き Continued on front page (72) Inventor Kazuto Ono 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Inside Furukawa Electric Co., Ltd.

Claims (6)

[Claims] 1. An IC socket having a plurality of contact pins, wherein said plurality of contact pins are electrically connected to an electrode pitch of a semiconductor element to which one end is mounted and to an external connection body to which the other end is connected. Characterized by being arranged in a matrix in accordance with the pitch of
C socket. 2. The method according to claim 1, wherein the plurality of contact pins include a plurality of lead frames having a plurality of leads arranged in parallel in a single plane, and each lead frame has one end of the plurality of leads mounted thereon. The other end of the plurality of leads is adjusted to the pitch of the electrical connection terminals of the external connection body to be connected to the electrode pitch of the semiconductor element, and one end and the other end of the plurality of leads. 2. The IC socket according to claim 1, wherein a side of the IC socket is bent substantially in parallel with the single surface via a step portion, and a plurality of the pins are stacked to form the plurality of contact pins. 3. 3. Each of the lead frames has a spring portion formed in an arc shape on one end side of the plurality of leads,
3. The IC socket according to claim 2, wherein the plurality of leads are provided with a first fixing portion in which the vicinity of the spring portion is fixed in an arrangement direction with an electrically insulating synthetic resin. 4. The IC socket according to claim 3, wherein each of the lead frames is provided with a second fixing portion in which the other ends of the plurality of leads are fixed with an electrically insulating synthetic resin in the arrangement direction. 5. The I of any one of claims 2 to 4, wherein a plurality of contact pins are provided on one end side of the semiconductor device, on which the contact pins are positioned.
C socket. 6. A pitch between both ends of a lead when a plurality of the lead frames are stacked by the first fixing portion or the second fixing portion, the electrode pitch of the semiconductor element and the electrical connection terminal of the external connection body. The IC socket according to any one of claims 2 to 5, wherein the IC socket is adjusted to the pitch of (i).