JPH10270214A - Laminated junction body of nonlinear resistor - Google Patents
Laminated junction body of nonlinear resistorInfo
- Publication number
- JPH10270214A JPH10270214A JP9077449A JP7744997A JPH10270214A JP H10270214 A JPH10270214 A JP H10270214A JP 9077449 A JP9077449 A JP 9077449A JP 7744997 A JP7744997 A JP 7744997A JP H10270214 A JPH10270214 A JP H10270214A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- joined body
- conductive
- bonding
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 76
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 9
- 239000010931 gold Substances 0.000 claims abstract description 5
- 239000011787 zinc oxide Substances 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000004332 silver Substances 0.000 claims abstract description 4
- 238000005304 joining Methods 0.000 claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 5
- 239000010951 brass Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 1
- 239000011810 insulating material Substances 0.000 abstract description 4
- -1 etc. Substances 0.000 abstract 1
- 239000005368 silicate glass Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、避雷器、サージア
ブソーバ等に用いられる非直線抵抗体、すなわち、酸化
亜鉛を主成分とした焼結体からなる素子を積層してなる
非直線抵抗体の積層接合体に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-linear resistor used for lightning arresters, surge absorbers and the like, that is, a non-linear resistor laminated by stacking elements made of a sintered body mainly composed of zinc oxide. It relates to a joined body.
【0002】[0002]
【従来の技術】一般に、電力系統においては、正常な電
圧に重畳される過電圧を除去し、電力系統や電気機器を
保護するため、避雷器やサージアブソーバなどの過電圧
保護装置が用いられている。そして、この過電圧保護装
置には正常な電圧ではほぼ絶縁特性を示し、過電圧が印
加されると低抵抗値となる特性を有する非直線抵抗体が
多用されている。2. Description of the Related Art Generally, in an electric power system, an overvoltage protection device such as a lightning arrester or a surge absorber is used to remove an overvoltage superimposed on a normal voltage and protect the electric power system and electric equipment. The overvoltage protection device is often made of a non-linear resistor having a characteristic of substantially exhibiting an insulating property at a normal voltage and having a low resistance value when an overvoltage is applied.
【0003】非直線抵抗体には、一般に、酸化亜鉛を主
成分とした素子が用いられる。この素子は、酸化亜鉛
に、非直線特性を得るために添加物として酸化ビスマ
ス、酸化アンチモン、二酸化マンガン、酸化ニッケル等
の少なくとも一種類以上の金属酸化物を加えて、混合、
造粒、及び成形して焼結した焼結体である。そして、一
般的には、個々の素子の側面に絶縁層、両端面にアーク
溶射等によりアルミニウムなどの電極が形成されて、非
直線抵抗体が構成されている。In general, an element containing zinc oxide as a main component is used as a nonlinear resistor. This element is obtained by adding at least one kind of metal oxide such as bismuth oxide, antimony oxide, manganese dioxide, nickel oxide, etc. to zinc oxide as an additive to obtain nonlinear characteristics, mixing,
It is a sintered body that has been granulated, molded and sintered. In general, an insulating layer is formed on the side surface of each element, and electrodes such as aluminum are formed on both end surfaces by arc spraying or the like, thereby forming a non-linear resistor.
【0004】このような構成を有する非直線抵抗体は、
大型形状のものが製造されにくいため、系統電圧に応じ
た必要枚数だけ複数積層され、この積層状態で、避雷器
やサージアブソーバ等に使用される。しかしながら、非
直線抵抗体を多数積層する場合、それらを固定するため
に絶縁体からなる支持棒を用いる必要があるため、碍管
の径が大きくなり、コストがかかるという問題があっ
た。A nonlinear resistor having such a configuration is:
Since it is difficult to manufacture a large-sized one, a required number of such layers are laminated according to the system voltage, and the laminated state is used for an arrester, a surge absorber and the like. However, when a large number of non-linear resistors are stacked, it is necessary to use a support rod made of an insulator to fix them, so that there is a problem that the diameter of the porcelain tube becomes large and the cost increases.
【0005】このため、非直線抵抗体の一体化が求めら
れており、導電接合技術が開発されている。例えば、電
極間を金属リングとエポキシ系の導電性接着剤を用いて
接合する技術が、特開平7−211520号公報に開示
されている。すなわち、この技術によれば、素子の両端
面にアルミニウム等の電極を設け、素子間、及び素子と
端子金属との間の接合材料として、エポキシ系導電性接
着剤及び接着剤はみ出し防止用の金属リングを用い、素
子と端子金属とを一体化して構成する。Therefore, integration of the non-linear resistor is required, and a conductive bonding technique has been developed. For example, Japanese Patent Application Laid-Open No. 7-212520 discloses a technique for joining electrodes using a metal ring and an epoxy-based conductive adhesive. That is, according to this technique, electrodes such as aluminum are provided on both end surfaces of the element, and as a bonding material between the elements and between the element and the terminal metal, an epoxy-based conductive adhesive and a metal for preventing the adhesive from protruding. The element and the terminal metal are integrated by using a ring.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、上述し
た特開平7−211520号公報に開示されている導電
接合技術を用いた積層接合体では、素子と電極との間で
接合強度が低く、かつ、接合部分の構造が複雑であるた
め、信頼性が低いという問題があった。However, in the laminated joined body using the conductive joining technique disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 7-21520, the joining strength between the element and the electrode is low, and There is a problem that reliability is low due to the complicated structure of the joining portion.
【0007】本発明の目的は、以上のような従来の課題
を解決し、接合強度が高く、かつ、耐電圧特性に優れた
非直線抵抗体の積層接合体を提供することにある。An object of the present invention is to solve the above-mentioned conventional problems and to provide a laminated joined body of non-linear resistors having high joining strength and excellent withstand voltage characteristics.
【0008】[0008]
【課題を解決するための手段】請求項1記載の発明によ
る非直線抵抗体の積層接合体は、酸化亜鉛を主成分とし
た焼結体からなる素子を積層してなる非直線抵抗体の積
層接合体において、前記素子と素子との間が一層の導電
接合材料によって接合され、前記導電接合材料による接
合時の熱処理温度が200℃〜600℃の範囲内である
ことを特徴としている。According to a first aspect of the present invention, there is provided a laminated joined body of non-linear resistors according to the first aspect of the present invention. In the joined body, the element and the element are joined with one layer of a conductive joining material, and a heat treatment temperature at the time of joining with the conductive joining material is in a range of 200 ° C to 600 ° C.
【0009】請求項1記載の発明によれば、素子間に溶
射電極を形成せずに導電接合材料によって一層の接合構
造とすることにより、接合強度を高くすることができ、
その接合温度を200℃〜600℃の範囲内とすること
により、接合強度を高くすると共に抵抗比を良好な値に
することができる。このため、接合強度が高く、かつ、
耐電圧特性に優れた非直線抵抗体の積層接合体が得られ
る。According to the first aspect of the present invention, the bonding strength can be increased by forming a single-layer structure using a conductive bonding material without forming a sprayed electrode between the elements.
By setting the joining temperature in the range of 200 ° C. to 600 ° C., the joining strength can be increased and the resistance ratio can be set to a good value. For this reason, the joining strength is high, and
A laminated joined body of non-linear resistors having excellent withstand voltage characteristics can be obtained.
【0010】請求項2記載の発明による非直線抵抗体の
積層接合体は、請求項1記載の発明において、前記素子
及び前記導電接合材料からなる側面全体が、絶縁層によ
ってコーティングされていることを特徴としている。According to a second aspect of the present invention, there is provided a laminated joined body of non-linear resistors according to the first aspect of the present invention, wherein the entire side surface comprising the element and the conductive joining material is coated with an insulating layer. Features.
【0011】請求項2記載の発明によれば、素子のみで
なく導電接合材料の側面にも絶縁層が形成されているた
め、耐電圧特性を高めることができる。According to the second aspect of the present invention, since the insulating layer is formed not only on the element but also on the side surface of the conductive bonding material, the withstand voltage characteristics can be improved.
【0012】請求項3記載の発明による非直線抵抗体の
積層接合体は、請求項1または2記載の発明において、
前記導電接合材料が、金及び銀を含む導電金属材料から
選択された導電金属材料と、ガラス材料とから構成され
ており、前記導電金属材料の含有率が80wt%〜98
wt%の範囲内であることを特徴としている。According to a third aspect of the present invention, there is provided a laminated joined body of non-linear resistors according to the first or second aspect.
The conductive bonding material is composed of a conductive metal material selected from conductive metal materials including gold and silver, and a glass material, and the content of the conductive metal material is 80 wt% to 98 wt%.
It is characterized by being within the range of wt%.
【0013】請求項3記載の発明によれば、導電金属材
料の含有率が最適な値であるため、絶縁成分が多すぎる
ために抵抗比が上昇したり、ガラス成分が少なすぎるた
めに接合強度が低下したりすることがなく、優れた特性
の積層接合体が得られる。According to the third aspect of the present invention, since the content of the conductive metal material is an optimum value, the resistance ratio increases because the insulating component is too large, and the bonding strength because the glass component is too small. , And a laminated joined body having excellent characteristics can be obtained.
【0014】請求項4記載の発明による非直線抵抗体の
積層接合体は、請求項1乃至3のいずれか1項記載の発
明において、前記素子の直径をR1とし、前記導電接合
材料の直径をR2とした場合に、これらの比R2/R1
が、 0.9<R2/R1≦1 の範囲内にあることを特徴としている。According to a fourth aspect of the present invention, there is provided the laminated junction of the non-linear resistor according to any one of the first to third aspects, wherein the diameter of the element is R1, and the diameter of the conductive bonding material is R1. When R2, these ratios R2 / R1
Is in the range of 0.9 <R2 / R1 ≦ 1.
【0015】請求項4記載の発明によれば、接着面積及
び通電面積が小さいために接合強度が低下し、かつ、抵
抗比が上昇したり、導電接合材料が素子をはみ出すこと
によってその部分が閃絡の起点となることにより、耐電
圧特性が低下したりすることがなく、優れた特性の積層
接合体が得られる。According to the fourth aspect of the present invention, since the bonding area and the current-carrying area are small, the bonding strength is reduced, and the resistance ratio is increased. By becoming the starting point of the entanglement, a withstand voltage characteristic does not decrease and a laminated joined body having excellent characteristics can be obtained.
【0016】請求項5記載の発明による非直線抵抗体の
積層接合体は、請求項1乃至4のいずれか1項記載の発
明において、端部に位置する前記素子に端子金属が導電
接合材料により接合されてなることを特徴としている。According to a fifth aspect of the present invention, there is provided the laminated junction of the nonlinear resistor according to any one of the first to fourth aspects, wherein the terminal metal is made of a conductive bonding material in the element located at the end. It is characterized by being joined.
【0017】請求項5記載の発明によれば、積層接合体
の端部に端子金属を導電接合材料によって接合し、一体
化することにより、この非直線抵抗体を採用した避雷器
を小型縮小化することができると共に、信頼性の高い非
直線抵抗体が得られる。According to the fifth aspect of the present invention, the terminal metal is joined to the end of the laminated joined body by a conductive joining material and integrated, thereby reducing the size of the lightning arrester employing the non-linear resistor. And a highly reliable non-linear resistor can be obtained.
【0018】請求項6記載の発明による非直線抵抗体の
積層接合体は、請求項5記載の発明において、前記素子
と前記端子金属とを接合する前記導電接合材料の該素子
及び該端子金属の接合時の熱処理温度が、200℃〜6
00℃の範囲内であることを特徴としている。According to a sixth aspect of the present invention, there is provided the laminated junction body of the non-linear resistor according to the fifth aspect of the invention, wherein the conductive bonding material for bonding the element and the terminal metal includes the element and the terminal metal. The heat treatment temperature at the time of joining is 200 ° C.-6
It is characterized by being within the range of 00 ° C.
【0019】請求項7記載の発明による非直線抵抗体の
積層接合体は、請求項5または6記載の発明において、
前記端子金属の材料が、アルミニウムまたは黄銅の中か
ら選択された材料であることを特徴としている。According to a seventh aspect of the present invention, there is provided the laminated joined body of non-linear resistors according to the fifth aspect of the present invention.
The material of the terminal metal is a material selected from aluminum or brass.
【0020】請求項8記載の発明による非直線抵抗体の
積層接合体は、請求項5乃至7のいずれか1項記載の発
明において、前記素子と前記端子金属とを接合する前記
導電接合材料が、ハンダを含むことを特徴としている。According to an eighth aspect of the present invention, in the laminated junction of the nonlinear resistor according to any one of the fifth to seventh aspects, the conductive bonding material for bonding the element and the terminal metal is used. , And solder.
【0021】請求項6乃至8記載の発明によれば、いず
れも、素子と端子金属との接合強度を高くすることがで
きる。そのため、優れた特性の積層接合体が得られる。According to the inventions described in claims 6 to 8, the bonding strength between the element and the terminal metal can be increased. Therefore, a laminated joined body having excellent characteristics can be obtained.
【0022】[0022]
【実施例】以下に、本発明による非直線抵抗体とその製
造方法を適用した具体的な複数の実施例について、図面
を参照して説明する。 [1.第1の実施例] [1−1.構成]本発明による第1の実施例として、請
求項1〜請求項4記載の発明を適用した実施例を、図1
〜図3を参照して説明する。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a non-linear resistor according to an embodiment of the present invention; [1. First Embodiment] [1-1. Configuration] As a first embodiment of the present invention, an embodiment to which the inventions of claims 1 to 4 are applied is shown in FIG.
This will be described with reference to FIG.
【0023】まず、酸化亜鉛(ZnO)に、二酸化マン
ガン(MnO2 )、二酸化ケイ素(SiO2 )、及び酸
化クロム(Cr2 O3 )をそれぞれ0.5mol%添加
すると共に、酸化ビスマス(Bi2 O3 )、酸化アンチ
モン(Sb2 O3 )、及び酸化ニッケル(NiO)をそ
れぞれ1mol%添加して原料とした。次いで、この原
料を水と分散剤の有機バインダー類と共に混合装置に入
れ混合し、この混合物をスプレードライヤー等で噴霧造
粒した。そして、これらの造粒粉を金型に入れ加圧し、
直径40mm、厚さ30mmの円板に成形した後、この
成形体を1200℃で焼成した。First, manganese dioxide (MnO 2 ), silicon dioxide (SiO 2 ), and chromium oxide (Cr 2 O 3 ) are added to zinc oxide (ZnO) in an amount of 0.5 mol%, and bismuth oxide (Bi 2 O 3), antimony oxide (Sb 2 O 3), and as a raw material nickel oxide a (NiO) was added 1 mol%, respectively. Next, this raw material was put into a mixing device together with water and organic binders of a dispersant and mixed, and the mixture was spray-granulated by a spray drier or the like. And put these granulated powders in a mold and pressurize,
After being formed into a disk having a diameter of 40 mm and a thickness of 30 mm, the formed body was fired at 1200 ° C.
【0024】次に、図1に示すように、焼結体である素
子1の上下面を研磨した後、研磨面に導電金属材料、例
えば銀(Ag)もしくは金(Au)等の導電性金属と、
例えばケイ酸(SiO2 )ガラス等のガラスとからなる
導電性の接合材2を塗布し、加圧しながら熱処理するこ
とによって素子1と素子1の間を接合した。そして、側
面全体に絶縁物を塗布して所定の温度で焼き付けること
により絶縁層3を形成し、非直線抵抗体の積層接合体を
作製した。Next, as shown in FIG. 1, after the upper and lower surfaces of the sintered element 1 are polished, a conductive metal material, for example, a conductive metal such as silver (Ag) or gold (Au) is applied to the polished surface. When,
For example, a conductive bonding material 2 made of glass such as silicate (SiO 2 ) glass was applied, and the element 1 was bonded by performing heat treatment while applying pressure. Then, an insulating material was applied to the entire side surface and baked at a predetermined temperature to form an insulating layer 3, thereby producing a laminated joined body of non-linear resistors.
【0025】また、図2に示すように、接合材2を塗布
する前に、素子1の研磨面に例えばアルミニウム製の溶
射電極4を形成して、非直線抵抗体の積層接合体を作製
した。Further, as shown in FIG. 2, before the bonding material 2 is applied, a sprayed electrode 4 made of, for example, aluminum is formed on the polished surface of the element 1 to produce a laminated bonded body of non-linear resistors. .
【0026】更に、図3に示すように、素子1を接合す
る前に、各素子1の側面に絶縁物を塗布して所定の温度
で焼き付けることにより、絶縁層3を形成した。その
後、素子1間に接合材2を塗布し、加圧しながら焼き付
けを行い、非直線抵抗体の積層接合体を作製した。Further, as shown in FIG. 3, before joining the devices 1, an insulating material was applied to the side surfaces of each device 1 and baked at a predetermined temperature to form an insulating layer 3. Thereafter, a bonding material 2 was applied between the elements 1 and baked while applying pressure to produce a laminated bonded body of non-linear resistors.
【0027】この場合、本実施例では、以上のような非
直線抵抗体の製造工程のうち、接合材2の金属量や接合
時の焼き付け温度、及び電極径比等の積層接合体の製造
条件を変化させることにより、複数種類の非直線抵抗体
を作製した。なお、電極径比は、図1に示す接合材2の
直径R2/素子1の直径R1で表す。また、ここでは、
接合材2の金属量は95〜99wt%の範囲で変化さ
せ、接合時の焼き付け温度は100〜700℃の範囲で
変化させた。In this case, in the present embodiment, the manufacturing conditions of the laminated joined body such as the amount of metal of the joining material 2, the baking temperature at the time of joining, the electrode diameter ratio, etc. in the above-described steps of producing the nonlinear resistor. By changing, a plurality of types of non-linear resistors were produced. Note that the electrode diameter ratio is represented by the diameter R2 of the bonding material 2 / the diameter R1 of the element 1 shown in FIG. Also, here
The metal amount of the joining material 2 was changed in the range of 95 to 99 wt%, and the baking temperature at the time of joining was changed in the range of 100 to 700 ° C.
【0028】[1−2.積層接合体の特性試験]以上の
ように作製した複数種類の非直線抵抗体に対して、積層
接合体の特性、すなわち接合強度、抵抗比、及び耐電圧
を求める試験を行った。[1-2. Characteristics Test of Laminated Joint] A test for determining the characteristics of the laminated joined body, that is, the bonding strength, the resistance ratio, and the withstand voltage, was performed on the plurality of types of nonlinear resistors manufactured as described above.
【0029】各製造条件のもとで作製された非直線抵抗
体の積層接合体の全てに対し、一種類につき各10個の
試料を用意する。ここで、接合強度は、接合体に剪断荷
重かけたときの剪断接合強度の平均値であり、抵抗比
は、素子1単体に1mAの電流を流した時の抵抗率に対
する接合体に1mAの電流を流した時の抵抗率の比の平
均値である。また、耐電圧は、接合体に、4×10μs
のインパルス電流を約5kV/cmから約1kV/cm
ずつ上げて印加した後冷却するという印加と冷却を繰り
返す試験を行い、その結果閃絡しなかった電界強度の最
大値の平均値である。For each of the laminated joined bodies of non-linear resistors manufactured under the respective manufacturing conditions, ten samples of each kind are prepared. Here, the bonding strength is an average value of the shear bonding strength when a shear load is applied to the bonded body, and the resistance ratio is a current of 1 mA applied to the bonded body with respect to a resistivity when a current of 1 mA flows through the element 1 alone. Is the average value of the ratio of the resistivity when flowing. The withstand voltage is 4 × 10 μs
Of about 5 kV / cm to about 1 kV / cm
This test is an average of the maximum values of the electric field intensities that were not flashed as a result of conducting a test in which the application and the cooling were repeated by increasing and applying the voltage and then cooling.
【0030】表1に、各積層接合体(接合体No.1〜
No.16)について、その製造条件と、接合強度、抵
抗比、及び耐電圧試験の結果を示す。すなわち、接合体
No.1、No.3〜No.7、及びNo.9〜No.
13は、図1に示すように、溶射電極が形成されておら
ず、絶縁層3が全体に形成されている接合体であり、接
合体No.3〜No.7はそれぞれ接合温度が異なって
おり、接合体No.9〜No.13はそれぞれ金属量が
異なっている。また、接合体No.14〜No.16も
同様に、溶射電極が形成されておらず絶縁層3が全体に
形成されている接合体であるが、電極径比(R2/R
1)が他の接合体と異なって、素子1の直径R1より接
合材2の直径R1が小さい場合と大きい場合とが設定さ
れている。Table 1 shows each of the laminated joints (joint Nos. 1 to 4).
No. 16) shows the manufacturing conditions, the bonding strength, the resistance ratio, and the results of the withstand voltage test. That is, the joined body No. 1, No. 3-No. 7, and No. 7 9-No.
Reference numeral 13 denotes a joined body in which the sprayed electrode is not formed and the insulating layer 3 is entirely formed as shown in FIG. 3-No. 7 have different bonding temperatures, and the bonded body No. 7 has a different bonding temperature. 9-No. 13 have different metal contents. In addition, the joined body No. 14-No. Similarly, 16 is a joined body in which the sprayed electrode is not formed and the insulating layer 3 is formed entirely, but the electrode diameter ratio (R2 / R
1) is different from the other bonded bodies, in which the case where the diameter R1 of the bonding material 2 is smaller than the diameter R1 of the element 1 and the case where the diameter R1 is larger are set.
【0031】[0031]
【表1】 更に、接合体No.2は、図2に示すように、溶射電極
4が形成されている接合体であり、接合体No.8は、
図3に示すように、溶射電極4は形成されておらず、絶
縁層3が素子1毎に形成されている接合体である。[Table 1] Furthermore, the joined body No. 2 is a joined body on which the sprayed electrode 4 is formed as shown in FIG. 8 is
As shown in FIG. 3, this is a joined body in which the thermal spray electrode 4 is not formed and the insulating layer 3 is formed for each element 1.
【0032】表1の試験結果から、以下のことが明らか
となった。 (1)接合体No.1及びNo.2の結果から、溶射電
極が形成された接合体の方が形成されていない接合体に
比べて接合強度が低いことが分かった。すなわち、溶射
電極4と素子1の接合強度が低いため、溶射電極4を形
成してから接合すると、積層接合体の接合強度が低下す
る。従って、溶射電極を形成せずに接合材2によって一
層の接合構造とすることにより、接合強度の高い積層接
合体が得られる。From the test results in Table 1, the following became clear. (1) Joint No. 1 and No. 1 From the result of No. 2, it was found that the joint having the sprayed electrode had a lower bonding strength than the joint having no sprayed electrode. That is, since the bonding strength between the thermal spray electrode 4 and the element 1 is low, if the thermal spray electrode 4 is formed and then bonded, the bonding strength of the laminated bonded body is reduced. Therefore, by forming a single-layer joining structure using the joining material 2 without forming a thermal spray electrode, a laminated joint having high joining strength can be obtained.
【0033】(2)接合体No.1及びNo.3〜N
o.7の結果から、接合材2の接合温度が高い程、接合
強度が高いことが分かった。この結果からは、接合温度
を200℃以上とすることにより、優れた接合強度と抵
抗比とが得られることが分かった。なお、表1では示し
ていないが、素子1は650℃以上の熱処理が施される
ことにより、V−I非直線性が低下するという性質を有
している。従って、接合材2の接合温度を200℃〜6
00℃とすることによって、優れた特性の積層接合体が
得られる。(2) Joint No. 1 and No. 1 3 to N
o. 7, it was found that the higher the bonding temperature of the bonding material 2, the higher the bonding strength. From these results, it was found that by setting the bonding temperature to 200 ° C. or higher, excellent bonding strength and excellent resistance ratio were obtained. Although not shown in Table 1, the element 1 has a property that the VI non-linearity is reduced by heat treatment at 650 ° C. or more. Therefore, the joining temperature of the joining material 2 is set to 200 ° C. to 6 ° C.
By setting the temperature to 00 ° C., a laminated joined body having excellent characteristics can be obtained.
【0034】(3)接合体No.1及びNo.8の結果
から、絶縁層3が素子1単体のみに形成されているより
も接合体全体に形成されている方が、耐電圧特性が高い
ことが分かった。接合材2は、耐電圧試験における閃絡
の起点となるため、絶縁層3に覆われている方が耐電圧
特性が高いためである。(3) Joint No. 1 and No. 1 From the result of No. 8, it was found that the withstand voltage characteristics were higher when the insulating layer 3 was formed on the entire joined body than when the insulating layer 3 was formed only on the element 1 alone. This is because the bonding material 2 becomes a starting point of a flashover in a withstand voltage test, and thus the withstand voltage characteristics are higher when covered with the insulating layer 3.
【0035】(4)接合体No.1及びNo.9〜N
o.13の結果から、金属量が70wt%の場合は、接
合材2中の絶縁成分が多くなり過ぎるため抵抗比が上昇
してしまい、99wt%の場合は、ガラス成分が少なす
ぎるため接合強度が低下することが分かった。従って、
接合材2中の金属量を80wt%〜98wt%とし、ガ
ラス成分を20wt%〜2wt%することにより、優れ
た特性の積層接合体が得られる。(4) Joint No. 1 and No. 1 9-N
o. According to the result of No. 13, when the metal amount is 70 wt%, the insulating ratio in the bonding material 2 is too large, and the resistance ratio is increased. When the metal amount is 99 wt%, the bonding strength is lowered because the glass component is too small. I found out. Therefore,
By setting the amount of metal in the bonding material 2 to 80 wt% to 98 wt% and the glass component to 20 wt% to 2 wt%, a laminated bonded body having excellent characteristics can be obtained.
【0036】(5)接合体No.1及びNo.14〜N
o.16の結果から、電極径比(R2/R1)が0.8
の場合は、接着面積及び通電面積が小さいため接合強度
が低下し、かつ、抵抗比が上昇してしまい、電極径比が
1.01の場合は、接合材2が素子1をはみ出している
ため、その部分が閃絡の起点となり易く、耐電圧特性が
低いことが分かった。従って、電極径比を0.9<R2
/R1≦1の範囲とすることにより、優れた特性の積層
接合体が得られる。(5) Joint No. 1 and No. 1 14-N
o. From the result of No. 16, the electrode diameter ratio (R2 / R1) was 0.8.
In the case of, the bonding strength and the resistance ratio are increased because the bonding area and the conducting area are small. When the electrode diameter ratio is 1.01, the bonding material 2 protrudes from the element 1. It was found that the portion was likely to be the starting point of flashover, and the withstand voltage characteristics were low. Therefore, when the electrode diameter ratio is 0.9 <R2
By setting the ratio to / R1 ≦ 1, a laminated joined body having excellent characteristics can be obtained.
【0037】[1−3.作用・効果]以上のように、本
実施例により、溶射電極を形成せずに接合材2によって
一層の接合構造とし、接合材2の接合温度を200℃〜
600℃とし、積層接合体の全体を絶縁層3によって覆
い、接合材2の金属量を80wt%〜98wt%とし、
かつ、電極径比を0.9<R2/R1≦1の範囲とする
ことにより、優れた特性の積層接合体を提供することが
できる。[1-3. Operation / Effect] As described above, according to the present embodiment, a single-layer joining structure is formed by the joining material 2 without forming the sprayed electrode, and the joining temperature of the joining material 2 is set to 200 ° C.
600 ° C., the whole of the laminated joined body is covered with the insulating layer 3, and the metal amount of the joining material 2 is set to 80 wt% to 98 wt%,
In addition, by setting the electrode diameter ratio in the range of 0.9 <R2 / R1 ≦ 1, a laminated joined body having excellent characteristics can be provided.
【0038】[2.第2の実施例]本発明による第2の
実施例として、請求項5〜請求項8記載の発明を適用し
た実施例を、図4を参照して説明する。非直線抵抗体の
積層接合体では、その端部に端子金属が形成されること
により、避雷器等をより小型縮小化することができる。
図4に示す積層接合体には、この端子金属6が設けられ
ている。[2. Second Embodiment] As a second embodiment according to the present invention, an embodiment to which the inventions of claims 5 to 8 are applied will be described with reference to FIG. In the laminated joined body of the non-linear resistors, the terminal metal is formed at the end, so that the lightning arrester or the like can be further reduced in size.
The terminal metal 6 is provided in the laminated joined body shown in FIG.
【0039】まず、上述した第1の実施例と同様の方法
により、図1に示すような積層接合体を作製し、これ
に、端子金属6を接合した。ここでは、第1の実施例に
おいて素子1と素子1との間を接合したように、素子1
と端子金属6との間を接合材5により接合した。このよ
うにして、図4に示す端子金属6付きの積層接合体を作
製した。First, a laminated joined body as shown in FIG. 1 was prepared by the same method as in the first embodiment, and a terminal metal 6 was joined thereto. Here, as in the first embodiment, the element 1 is connected to the element 1 as in the first embodiment.
And the terminal metal 6 were joined by the joining material 5. Thus, a laminated joined body with the terminal metal 6 shown in FIG. 4 was produced.
【0040】第2の実施例では、以上のような非直線抵
抗体の製造工程のうち、接合材5の接合温度、端子金属
6の材料、接合材5の材料といった製造条件を変化させ
ることにより、素子1と端子金属6との接合部分の接合
強度を求める試験を行った。表2に、各積層接合体(接
合体No.17〜No.25)について、その製造条件
と接合強度の試験の結果を示す。すなわち、接合体N
o.17〜No.22は全て端子金属6の材料がアルミ
ニウムであり、かつ、接合材5の材料がハンダであっ
て、接合温度が100℃〜600℃の間でそれぞれ異な
っている。また、接合体No.23及びNo.24は、
接合温度は同じく500℃であって接合材5の材料がハ
ンダであるが、端子金属6が黄銅もしくはSUS403
である。更に、接合体No.25は、端子金属6の材料
がアルミニウムであり、接合材5の材料が金属ガラス材
である。In the second embodiment, the manufacturing conditions such as the bonding temperature of the bonding material 5, the material of the terminal metal 6, and the material of the bonding material 5 are changed in the above-described manufacturing process of the non-linear resistor. Then, a test for determining the bonding strength of the bonding portion between the element 1 and the terminal metal 6 was performed. Table 2 shows the production conditions and the results of the joint strength tests for each of the laminated joints (joint Nos. 17 to 25). That is, the joined body N
o. 17-No. Reference numerals 22 all denote aluminum as the material of the terminal metal 6 and solder as the material of the joining material 5, and the joining temperature differs between 100 ° C and 600 ° C. In addition, the joined body No. 23 and No. 23. 24 is
The joining temperature is also 500 ° C. and the material of the joining material 5 is solder, but the terminal metal 6 is made of brass or SUS403.
It is. Furthermore, the joined body No. Reference numeral 25 indicates that the material of the terminal metal 6 is aluminum and the material of the bonding material 5 is a metallic glass material.
【0041】[0041]
【表2】 表2の試験結果から、以下のことが明らかとなった。す
なわち、接合体No.17の結果から、接合材5の接合
温度が200℃以上とすることにより、接合強度が高い
ことが分かった。また、第1の実施例と同様の理由によ
り、接合材5の接合温度を200℃〜600℃とするこ
とにより、優れた特性の積層接合体が得られる。[Table 2] From the test results in Table 2, the following became clear. That is, the joined body No. From the result of No. 17, it was found that the bonding strength was high when the bonding temperature of the bonding material 5 was 200 ° C or more. Further, for the same reason as in the first embodiment, by setting the joining temperature of the joining material 5 to 200 ° C. to 600 ° C., a laminated joined body having excellent characteristics can be obtained.
【0042】また、接合体No.24の結果から、端子
金属6の材料をSUS403とするよりもアルミニウム
もしくは黄銅とした方が、接合強度が高いことが分かっ
た。また、接合体No.25の結果から、接合材5の材
料を金属ガラス材とするよりもハンダとした方が、接合
強度が高いことが分かった。Further, the conjugate No. From the result of No. 24, it was found that the bonding strength was higher when the material of the terminal metal 6 was aluminum or brass than when the material was SUS403. In addition, the joined body No. From the result of No. 25, it was found that the bonding strength was higher when the material of the bonding material 5 was soldered than when the material was metal glass material.
【0043】なお、表2では示していないが、素子1と
端子金属6の接合材5は、ハンダのみでなくハンダを含
んだ多層構造としても、優れた特性の積層接合体が得ら
れることが確認されている。Although not shown in Table 2, even when the bonding material 5 of the element 1 and the terminal metal 6 has not only solder but also a multilayer structure including solder, a laminated bonded body having excellent characteristics can be obtained. Has been confirmed.
【0044】以上のように、本実施例により、素子1と
端子金属6とを接合する接合材5の接合温度を200℃
〜600℃とし、端子金属6の材料をアルミニウムもし
くは黄銅とし、かつ、接合材5の材料をハンダもしくは
ハンダを含んだ多層構造とすることにより、優れた特性
の積層接合体を提供することができる。As described above, according to the present embodiment, the joining temperature of the joining material 5 for joining the element 1 and the terminal metal 6 is set to 200 ° C.
-600 ° C., the material of the terminal metal 6 is aluminum or brass, and the material of the bonding material 5 is a solder or a multilayer structure including solder, whereby a laminated bonded body having excellent characteristics can be provided. .
【0045】[0045]
【発明の効果】以上のように、本発明によれば、非直線
抵抗体の積層接合体の素子間を一層の導電接合材料によ
り接合し、その接合における熱処理温度を200℃〜6
00℃の範囲内とし、積層接合体の側面全体を絶縁層で
コーティングし、導電接合材料の金属材料の含有率を8
0wt%〜98wt%ととし、かつ、電極径比を0.9
<R2/R1≦1の範囲とすることにより、接合強度が
高く、耐電圧特性に優れた非直線抵抗体の積層接合体を
提供することができる。As described above, according to the present invention, the elements of the laminated joined body of non-linear resistors are joined with one layer of a conductive joining material, and the heat treatment temperature in the joining is set to 200 ° C. to 6 ° C.
The temperature is within the range of 00 ° C., and the entire side surface of the laminated joined body is coated with an insulating layer.
0 wt% to 98 wt%, and the electrode diameter ratio is 0.9.
By setting the range of <R2 / R1 ≦ 1, it is possible to provide a laminated joined body of non-linear resistors having high joining strength and excellent withstand voltage characteristics.
【図1】本発明による非直線抵抗体の積層接合体の一例
を示す断面図FIG. 1 is a cross-sectional view showing an example of a laminated joined body of non-linear resistors according to the present invention.
【図2】本発明による非直線抵抗体の積層接合体の一例
を示す断面図FIG. 2 is a cross-sectional view showing an example of a laminated joined body of non-linear resistors according to the present invention.
【図3】本発明による非直線抵抗体の積層接合体の一例
を示す断面図FIG. 3 is a cross-sectional view showing an example of a laminated joined body of non-linear resistors according to the present invention.
【図4】本発明による非直線抵抗体の積層接合体の一例
を示す断面図FIG. 4 is a cross-sectional view showing an example of a laminated joined body of non-linear resistors according to the present invention.
1…素子 2…接合材 3…絶縁層 4…溶射電極 5…接合材 6…端子金属 DESCRIPTION OF SYMBOLS 1 ... Element 2 ... Bonding material 3 ... Insulating layer 4 ... Sprayed electrode 5 ... Bonding material 6 ... Terminal metal
Claims (8)
素子を積層してなる非直線抵抗体の積層接合体におい
て、 前記素子と素子との間が一層の導電接合材料によって接
合され、前記導電接合材料による接合時の熱処理温度が
200℃〜600℃の範囲内であることを特徴とする非
直線抵抗体の積層接合体。1. A laminated joined body of non-linear resistors formed by laminating elements made of a sintered body containing zinc oxide as a main component, wherein the elements are joined with one layer of a conductive joining material, A laminated joined body of non-linear resistors, wherein a heat treatment temperature at the time of joining with the conductive joining material is in a range of 200 ° C to 600 ° C.
側面全体が、絶縁層によってコーティングされているこ
とを特徴とする請求項1記載の非直線抵抗体の積層接合
体。2. The laminated joined body of non-linear resistors according to claim 1, wherein the entire side surface made of the element and the conductive joining material is coated with an insulating layer.
電金属材料から選択された導電金属材料と、ガラス材料
とから構成されており、前記導電金属材料の含有率が8
0wt%〜98wt%の範囲内であることを特徴とする
請求項1または2記載の非直線抵抗体の積層接合体。3. The conductive bonding material is composed of a conductive metal material selected from conductive metal materials including gold and silver, and a glass material, and the content of the conductive metal material is 8%.
3. The multilayered joined body of non-linear resistors according to claim 1, wherein the content is in a range of 0 wt% to 98 wt%.
合材料の直径をR2とした場合に、これらの比R2/R
1が、 0.9<R2/R1≦1 の範囲内にあることを特徴とする請求項1乃至3のいず
れか1項記載の非直線抵抗体の積層接合体。4. When the diameter of the element is R1 and the diameter of the conductive bonding material is R2, the ratio R2 / R
4. The laminated joined body of non-linear resistors according to claim 1, wherein 1 is in a range of 0.9 <R2 / R1 ≦ 1. 5.
電接合材料により接合されてなることを特徴とする請求
項1乃至4のいずれか1項記載の非直線抵抗体の積層接
合体。5. The multilayered joined body of non-linear resistors according to claim 1, wherein a terminal metal is joined to the element located at the end with a conductive joining material.
記導電接合材料の該素子及び該端子金属の接合時の熱処
理温度が、200℃〜600℃の範囲内であることを特
徴とする請求項5記載の非直線抵抗体の積層接合体。6. The heat treatment temperature of the conductive bonding material for bonding the element and the terminal metal at the time of bonding the element and the terminal metal is in a range of 200 ° C. to 600 ° C. Item 6. A laminated joined body of the nonlinear resistor according to Item 5.
たは黄銅の中から選択された材料であることを特徴とす
る請求項5または6記載の非直線抵抗体の積層接合体。7. The laminated joint according to claim 5, wherein the material of the terminal metal is a material selected from aluminum and brass.
記導電接合材料が、ハンダを含むことを特徴とする請求
項5乃至7のいずれか1項記載の非直線抵抗体の積層接
合体。8. The non-linear resistor laminate assembly according to claim 5, wherein the conductive bonding material for bonding the element and the terminal metal includes solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9077449A JPH10270214A (en) | 1997-03-28 | 1997-03-28 | Laminated junction body of nonlinear resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9077449A JPH10270214A (en) | 1997-03-28 | 1997-03-28 | Laminated junction body of nonlinear resistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10270214A true JPH10270214A (en) | 1998-10-09 |
Family
ID=13634339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9077449A Pending JPH10270214A (en) | 1997-03-28 | 1997-03-28 | Laminated junction body of nonlinear resistor |
Country Status (1)
Country | Link |
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JP (1) | JPH10270214A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1069574A3 (en) * | 1999-07-15 | 2002-08-28 | Kabushiki Kaisha Toshiba | Voltage non-linear resistor unit and arrester unit |
US7362209B2 (en) | 2002-12-03 | 2008-04-22 | National Institute For Materials Science | Zinc oxide resistor and its manufacturing method |
-
1997
- 1997-03-28 JP JP9077449A patent/JPH10270214A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1069574A3 (en) * | 1999-07-15 | 2002-08-28 | Kabushiki Kaisha Toshiba | Voltage non-linear resistor unit and arrester unit |
US7362209B2 (en) | 2002-12-03 | 2008-04-22 | National Institute For Materials Science | Zinc oxide resistor and its manufacturing method |
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