JPH10259368A - Adhesive for wood - Google Patents
Adhesive for woodInfo
- Publication number
- JPH10259368A JPH10259368A JP6454697A JP6454697A JPH10259368A JP H10259368 A JPH10259368 A JP H10259368A JP 6454697 A JP6454697 A JP 6454697A JP 6454697 A JP6454697 A JP 6454697A JP H10259368 A JPH10259368 A JP H10259368A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- phenol
- formalin
- phenolic resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 42
- 239000000853 adhesive Substances 0.000 title claims abstract description 41
- 239000002023 wood Substances 0.000 title description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 58
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000005011 phenolic resin Substances 0.000 claims abstract description 30
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 20
- 229960001755 resorcinol Drugs 0.000 claims abstract description 20
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 6
- 150000002989 phenols Chemical class 0.000 claims description 3
- 150000001299 aldehydes Chemical class 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000011120 plywood Substances 0.000 abstract description 15
- 229920003987 resole Polymers 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 235000011121 sodium hydroxide Nutrition 0.000 description 4
- 239000011122 softwood Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 229920003180 amino resin Polymers 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000004067 bulking agent Substances 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 239000011121 hardwood Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 241000218652 Larix Species 0.000 description 1
- 235000005590 Larix decidua Nutrition 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005354 coacervation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は木材用フェノール樹
脂接着剤に関し、詳しくは速硬化であり、低ホルマリン
臭化されたフェノール系接着剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenolic resin adhesive for wood, and more particularly, to a phenolic adhesive which is a fast-curing, low-formalin bromide.
【０００２】[0002]
【従来の技術】近年、広葉樹資源の入手難から、合板材
料として針葉樹資源の使用が考えられている。しかし、
メラミン・ホルムアルデヒド樹脂、ユリア・ホルムアル
デヒド樹脂で代表されるアミノ系樹脂接着剤を接着剤と
したものでは、接着性、耐久性、安定性などの点で不十
分であり、針葉樹を原料とした製品の信頼性を高めてい
くためには接着性、耐久性、安定性に優れたフェノール
樹脂系接着剤を用いるのが良いとされている。2. Description of the Related Art In recent years, the use of softwood resources as a plywood material has been considered due to the difficulty in obtaining hardwood resources. But,
The use of amino resin adhesives represented by melamine / formaldehyde resins and urea / formaldehyde resins as adhesives is insufficient in terms of adhesiveness, durability, stability, etc. It is said that it is better to use a phenolic resin-based adhesive excellent in adhesiveness, durability and stability in order to increase reliability.
【０００３】フェノール樹脂接着剤は、アミノ系樹脂接
着剤と比較して、合板等の製品化のための熱圧締（プレ
ス）に際し、高温、長時間を要し、これがために作業性
の低下、プレス後の製品の厚み減り、表面劣化の原因と
なっている。[0003] Compared with amino-based resin adhesives, phenolic resin adhesives require a high temperature and a long time when hot pressing (pressing) for commercialization of plywood or the like, which leads to a reduction in workability. This causes a reduction in the thickness of the product after pressing and surface deterioration.
【０００４】また、ホルマリンの室内汚染による健康被
害の問題がクローズアップされ、合板に対する放散ホル
マリン臭の規格として、「Ｆ−１」グレード（放散ホル
マリン量：０．５ｐｐｍ以下）が要求されている。Further, the problem of health damage due to indoor contamination of formalin has been highlighted, and "F-1" grade (amount of emitted formalin: 0.5 ppm or less) is required as a standard for emission of formalin on plywood.
【０００５】一方、フェノール樹脂系接着剤の低温速硬
化の方法としては、フェノールに対するホルムアルデヒ
ドのモル比を２．５〜３．０にし、レゾルシンを添加す
れば、ある程度効果の得られることは知られているが、
この手法では、生産した合板等の放散ホルマリン量は１
０ｐｐｍを越え、且つ、配合接着剤の可使時間が極めて
短く実用的ではない。On the other hand, as a method for rapidly curing a phenol resin-based adhesive at a low temperature, it is known that a certain effect can be obtained by setting the molar ratio of formaldehyde to phenol to 2.5 to 3.0 and adding resorcin. But
In this method, the amount of emitted formalin such as plywood is 1
It exceeds 0 ppm and the pot life of the compounded adhesive is extremely short, which is not practical.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、従来の広葉
樹材料に対するアミノ系接着剤の生産性を維持しつつ、
針葉樹単板に対する優れた接着性を発現し、合板及びボ
ードから発するホルマリン臭を低減する速硬化性で低ホ
ルマリン臭のレゾール型フェノール樹脂接着剤を提供す
ることにある。SUMMARY OF THE INVENTION The present invention provides an amino-based adhesive for a conventional hardwood material while maintaining productivity.
An object of the present invention is to provide a fast-setting, low-formalin odor resol-type phenolic resin adhesive that exhibits excellent adhesiveness to softwood veneers and reduces formalin odor emitted from plywood and boards.
【０００７】本発明者らは、レゾルシンの添加はレゾー
ル型フェノール樹脂の硬化が促進されるが、一方、レゾ
ルシンの混合後すぐにホルマリンと反応が起こり、可使
時間を短縮させ、かつ合板等のホルマリンキャッチャー
剤として有効に作用していないと考え、レゾルシンがそ
の混合後すぐに反応に寄与しない様に、レゾルシンをコ
アセルベーション法などの方法によってマイクロカプセ
ル化し、フェノール樹脂系接着剤に添加すれば、硬化促
進及びホルマリンキャッチャーとして有効と考え本発明
に至ったものである。The present inventors have found that the addition of resorcin promotes the curing of the resole-type phenolic resin, while the reaction with formalin occurs immediately after the resorcinol is mixed, shortening the pot life and shortening the time required for plywood and the like. Considering that it does not act effectively as a formalin catcher agent, resorcinol is microencapsulated by a method such as coacervation method and added to a phenolic resin adhesive so that resorcinol does not immediately contribute to the reaction after mixing. The present invention is considered to be effective as a curing accelerator and formalin catcher and has led to the present invention.
【０００８】[0008]
【課題を解決するための手段】本発明は、塩基性触媒の
存在下にフェノール類とアルデヒド類を縮合させて得ら
れるレゾール型フェノール樹脂にマイクロカプセル化し
たレゾルシンを配合してなることを特徴とする速硬化性
フェノール樹脂接着剤である。本発明に使用するレゾー
ル型フェノール樹脂において、フェノールに対するホル
ムアルデヒドのモル比（Ｆ／Ｐモル比）は１．６〜３．
０が好ましく、更に好ましくは、２．２〜３．０であ
る。このフェノール樹脂接着剤にマイクロカプセル化レ
ゾルシンをレゾルシン換算で１〜１０重量部、好ましく
は３〜５重量部添加する。このことにより、アミノ樹脂
系接着剤と同等の加熱条件で成形でき、且つ、アミノ樹
脂系接着剤では十分な耐久性が得られない針葉樹単板を
使用しても、同等以上の接着性能を有することを見出し
本発明を完成するに至った。The present invention is characterized in that resorcinol microencapsulated is blended with a resole-type phenolic resin obtained by condensing phenols and aldehydes in the presence of a basic catalyst. Fast-curing phenolic resin adhesive. In the resol type phenol resin used in the present invention, the molar ratio of formaldehyde to phenol (F / P molar ratio) is 1.6 to 3.
0 is preferred, and more preferably 2.2 to 3.0. Microencapsulated resorcinol is added to the phenolic resin adhesive in an amount of 1 to 10 parts by weight, preferably 3 to 5 parts by weight in terms of resorcinol. By this, it can be molded under the same heating conditions as the amino resin-based adhesive, and even when using a softwood veneer that does not provide sufficient durability with the amino resin-based adhesive, it has an adhesion performance equal to or more than that. This led to the completion of the present invention.
【０００９】すなわち、本発明は、好ましくはＦ／Ｐモ
ル比が１．６〜３．０、硬化性を向上させるためにさら
に好ましくは２．２〜３．０の範囲で、苛性ソーダ等の
塩基性触媒を用いて縮合反応せしめ、粘度が１００〜８
００ｃｐｓのレゾール型フェノール樹脂系接着剤を得
る。Ｆ／Ｐモル比が１．６未満ではマイクロカプセル化
レゾルシンと反応する遊離のホルムアルデヒドがないか
少ないので、速硬化性に対する効果が小さく、モル比が
３．０を越えると、マイクロカプセル化レゾルシンを添
加しても、放散ホルマリン量の水準が「Ｆ―１」グレー
ドとはならない。That is, in the present invention, the F / P molar ratio is preferably in the range of 1.6 to 3.0, and more preferably in the range of 2.2 to 3.0 in order to improve the curability. The condensation reaction is carried out using a neutral catalyst, and the viscosity is 100 to 8
A 00 cps resol type phenol resin adhesive is obtained. When the F / P molar ratio is less than 1.6, there is no or little free formaldehyde that reacts with the microencapsulated resorcinol, and the effect on the rapid curing property is small. When the molar ratio exceeds 3.0, the microencapsulated resorcinol is not used. Even if added, the level of the amount of emitted formalin does not become "F-1" grade.
【００１０】フェノール樹脂に使用するフェノール類と
してはフェノール、クレゾール、キシレノール等が使用
可能である。As phenols used in the phenol resin, phenol, cresol, xylenol and the like can be used.
【００１１】本発明に使用されるフェノール樹脂系接着
剤は、ホルムアルデヒドとフェノールとの反応させたフ
ェノール樹脂を主体としたものであるが、タンニン、リ
グニン、ボリビニルブチラール、エチレングリコール、
ジエチレングリコールなどで一部変性した変性樹脂を用
いたものであってもよい。The phenolic resin-based adhesive used in the present invention is mainly composed of a phenolic resin obtained by reacting formaldehyde and phenol. Tannin, lignin, polyvinyl butyral, ethylene glycol,
A modified resin partially modified with diethylene glycol or the like may be used.
【００１２】塩基性触媒として苛性ソーダを使用する場
合、その触媒量は特に規定されないが、水溶性を良好と
するため、苛性ソーダ／フェノールのモル比が０．１以
上が望ましく、さらに０．５を越えないことが望まし
い。このモル比が０．５を越えると接着剤層の耐水性が
低下するために好ましくない。When caustic soda is used as the basic catalyst, the amount of the catalyst is not particularly limited, but the molar ratio of caustic soda / phenol is preferably 0.1 or more, and more than 0.5, in order to improve the water solubility. Desirably not. If this molar ratio exceeds 0.5, the water resistance of the adhesive layer is undesirably reduced.
【００１３】上記のようにして得たフェノール樹脂系接
着剤１００重量部に対して、レゾルシン換算で１〜１０
重量部のマイクロカプセル化レゾルシンを添加し配合樹
脂を得るが、添加量がレゾルシン換算で１０重量部を越
えると初期粘度が高く作業性が低下する。１重量部未満
では添加効果は十分に得られない。With respect to 100 parts by weight of the phenolic resin-based adhesive thus obtained, 1 to 10 in terms of resorcinol
A mixed resin is obtained by adding parts by weight of microencapsulated resorcinol, but if the added amount exceeds 10 parts by weight in terms of resorcinol, the initial viscosity is high and workability is reduced. If it is less than 1 part by weight, the effect of addition cannot be sufficiently obtained.
【００１４】本発明の接着剤組成物には、充填剤、増量
剤、水、硬化促進剤などを必要に応じて添加混合するこ
とも可能である。The adhesive composition of the present invention may contain a filler, a bulking agent, water, a curing accelerator, and the like, if necessary.
【００１５】[0015]
【実施例】次に、本発明を実施例に基づき説明する。Next, the present invention will be described based on embodiments.
【００１６】接着剤製造例１ フェノール９４．１重量部と３７％ホルマリン２４３．
２重量部（Ｆ／Ｐモル比＝３．０）及び３０％苛性ソー
ダ４７重量部とを仕込み、還流条件下で４０分反応さ
せ、さらに粘度が１００〜３００ｃｐｓとなるまで８５
℃にて反応させレゾール型フェノール樹脂接着剤を得
た。Adhesive Production Example 1 94.1 parts by weight of phenol and 37% formalin
2 parts by weight (F / P molar ratio = 3.0) and 47 parts by weight of 30% caustic soda were charged, reacted under reflux conditions for 40 minutes, and further reacted until the viscosity became 100 to 300 cps.
The reaction was carried out at ℃ to obtain a resol type phenol resin adhesive.
【００１７】接着剤製造例２ フェノール９４．１重量部と３７％ホルマリン２４３．
２重量部（Ｆ／Ｐモル比＝３．０）及び３０％苛性ソー
ダ４７重量部とを仕込み、還流条件下で４０分反応さ
せ、さらに粘度が６００〜８００ｃｐｓとなるまで８５
℃にて反応させレゾール型フェノール樹脂接着剤を得
た。Adhesive preparation example 2 94.1 parts by weight of phenol and 37% formalin
2 parts by weight (F / P molar ratio = 3.0) and 47 parts by weight of 30% caustic soda were charged, reacted under reflux conditions for 40 minutes, and further reacted until the viscosity became 600 to 800 cps.
The reaction was carried out at ℃ to obtain a resol type phenol resin adhesive.
【００１８】これらの例において、レジン固形分はいず
れも４２〜５０％となる様に調整した。このようにして
得たフェノール樹脂を下記の配合組成で接着剤糊液を調
整し、常態及び特類の接着力と放散ホルマリン量の評価
を実施した。In these examples, the resin solid content was adjusted to be 42 to 50%. The adhesive paste liquid of the phenolic resin thus obtained was adjusted according to the following composition, and normal and special adhesive strength and the amount of diffused formalin were evaluated.
【００１９】実施例１ 接着剤製造例１で得られたフェノール樹脂接着剤１００
重量部にマイクロカプセル化レゾルシンをレゾルシン分
で５重量部添加し増量剤として小麦粉１０重量部を配合
し糊液を得、１．８ｍｍ厚のカラマツの単板を５ｐｌｙ
にて合板を作製した。成形条件は糊塗工量：２８ｇ／平
方尺、冷圧条件：１０ｋｇ／ｃｍ2 、加熱条件：１０ｋ
ｇ／ｃｍ2 ，１２０℃，２５秒／ｍｍ厚で実施した。Example 1 The phenolic resin adhesive 100 obtained in Adhesive Production Example 1
5 parts by weight of microencapsulated resorcinol is added to parts by weight, and 10 parts by weight of flour is added as a bulking agent to obtain a size liquid, and a larch veneer having a thickness of 1.8 mm is 5 ply.
A plywood was prepared by The molding conditions were as follows: glue coating amount: 28 g / square scale, cold pressure condition: 10 kg / cm 2 , heating condition: 10 k
g / cm 2 , 120 ° C., 25 seconds / mm thickness.
【００２０】実施例２ 接着剤製造例２で得られたフェノール樹脂接着剤を使用
する以外は実施例１と同様にして合板を作製した。Example 2 A plywood was prepared in the same manner as in Example 1 except that the phenolic resin adhesive obtained in Adhesive Production Example 2 was used.
【００２１】比較例１ 実施例１において、マイクロカプセル化レゾルシンを添
加しない以外は全て実施例と同等にして合板を得た。Comparative Example 1 Plywood was obtained in the same manner as in Example 1 except that microencapsulated resorcin was not added.
【００２２】比較例２ 実施例１において、マイクロカプセル化レゾルシンの代
わりに、レゾルシン単体を添加する以外は全て実施例と
同様にし合板を得た。Comparative Example 2 A plywood was obtained in the same manner as in Example 1 except that resorcin alone was added instead of microencapsulated resorcin.
【００２３】比較例３ ホルマリンと尿素のモル比が１．４の尿素系接着剤を１
００重量部、小麦粉を１０重量部配合して糊液を得、実
施例と同様にし合板を得た。Comparative Example 3 A urea-based adhesive having a formalin / urea molar ratio of 1.4 was added to 1
00 parts by weight and 10 parts by weight of flour were blended to obtain a size liquid, and a plywood was obtained in the same manner as in the example.
【００２４】表１に接着剤糊料の配合を、表２に接着力
及び放散ホルマリン量を示す。Table 1 shows the composition of the adhesive paste, and Table 2 shows the adhesive strength and the amount of diffused formalin.
【表１】 [Table 1]
【００２５】[0025]
【表２】 [Table 2]
【００２６】[0026]
【発明の効果】本発明の木材用フェノール樹脂接着剤
は、保存性が良好で速硬化性であり、合板等の製造時及
び合板等の製品からの放散ホルマリン量が小さく、更に
針葉樹材を使用しても良好な接着性能を得ることができ
る。EFFECT OF THE INVENTION The phenolic resin adhesive for wood of the present invention has good preservability and is quick-curing, has a small amount of formalin released from plywood and the like and from products such as plywood, and uses softwood. Even with this, good adhesive performance can be obtained.
Claims (3)
ルデヒド類を縮合させて得られるレゾール型フェノール
樹脂にマイクロカプセル化したレゾルシンを配合してな
ることを特徴とする速硬化性フェノール樹脂接着剤。1. A fast-curing phenolic resin adhesive characterized by blending resorcin microencapsulated with a resole-type phenolic resin obtained by condensing phenols and aldehydes in the presence of a basic catalyst. .
フェノールとホルムアルデヒドのモル比が、フェノール
１モルに対してホルムアルデヒド１．６〜３．０モルで
ある請求項１記載の速硬化性フェノール樹脂接着剤。2. The quick-curing phenolic resin adhesive according to claim 1, wherein the molar ratio of phenol to formaldehyde for obtaining said resol-type phenol is 1.6 to 3.0 mol of formaldehyde to 1 mol of phenol. .
が前記レゾール型フェノール樹脂１００重量部に対し１
〜１０重量部である請求項１又は２記載の速硬化性フェ
ノール樹脂接着剤。3. The amount of the microencapsulated resorcinol is 1 to 100 parts by weight of the resole-type phenol resin.
3. The fast-curing phenolic resin adhesive according to claim 1, wherein the amount is from 10 to 10 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6454697A JPH10259368A (en) | 1997-03-18 | 1997-03-18 | Adhesive for wood |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6454697A JPH10259368A (en) | 1997-03-18 | 1997-03-18 | Adhesive for wood |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10259368A true JPH10259368A (en) | 1998-09-29 |
Family
ID=13261338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6454697A Pending JPH10259368A (en) | 1997-03-18 | 1997-03-18 | Adhesive for wood |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10259368A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8399597B2 (en) | 2007-09-21 | 2013-03-19 | Saint-Gobain Abrasives, Inc. | Phenolic resin formulation and coatings for abrasive products |
| JP2016190968A (en) * | 2015-03-31 | 2016-11-10 | 住友ベークライト株式会社 | Resol type phenolic resin for friction material and method for producing the same, adhesive for friction material and wet type friction plate |
-
1997
- 1997-03-18 JP JP6454697A patent/JPH10259368A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8399597B2 (en) | 2007-09-21 | 2013-03-19 | Saint-Gobain Abrasives, Inc. | Phenolic resin formulation and coatings for abrasive products |
| JP2016190968A (en) * | 2015-03-31 | 2016-11-10 | 住友ベークライト株式会社 | Resol type phenolic resin for friction material and method for producing the same, adhesive for friction material and wet type friction plate |
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