JPH10256709A - Method of cleaning probe for electrically inspecting board, and cleaning apparatus and tool thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform surely with only one cleaning work the cleaning of the contamination matters stuck on the end portion of the contact pin of a probe for inspecting electrically boards which is used in an equipment for board testings including an in-circuit testing. SOLUTION: For cleaning a probe 4 for inspecting electrically boards, which is used in an equipment for board testings including an in-circuit testing, the end portion of a contact pin 5 of the probe 4 for inspecting electrically boards is stuck into an elastic body sheet 1 molded by distributing therein fine metal oxides 2 of a predetermined wt.%. Thereby, the contamination matters including solder fluxes F stuck on the end portion are captured surely in the elastic body sheet 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method and a cleaning tool for a probe for inspecting a board for electrical inspection. For example, an electronic component such as an IC, a resistor, and a capacitor is mounted on a printed wiring board and then subjected to a soldering process. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical inspection probe of a test apparatus for testing an electrical mounting state of a board, and relates to a technique for removing dirt at a tip portion of a contact pin that directly contacts a conductive pattern on the board. .

[0002]

2. Description of the Related Art Conventionally, as a mounting technique of a printed wiring board, a method generally called SMT has been used in which a cream solder is printed and reflow soldering is performed, and a method of soldering an electric component by a solder reflow bath is used. However, in each case, Freon or 1.1.1 trichloroethane was used to wash and remove the solder flux used at the time of soldering from the solder surface of the component.

However, it has been found that the cause of environmental pollution in recent years has been the use of these fluorocarbons or 1.1.1 trichloroethane, and as a result, it has become impossible to use them. Then, the physical properties of the flux are improved, the corrosiveness is improved, and the flux is not required to be cleaned.

[0004] Alternatively, manufacturers are actively promoting the use of a cleaning agent that does not cause environmental pollution or the cleaning and removal of the flux by washing with water.

However, when a cleaning agent or water washing is used, it is considered that the treatment of the washing water may cause new environmental pollution, and it is presently considered that it is best to eliminate the flux from the viewpoint of cost reduction. Have been.

However, in the case where the flux is not cleaned as described above, the flux adheres to the tip of the contact pin to be inspected at the time of the electrical inspection after soldering, and gradually grows, thereby causing a conduction failure at the time of the inspection. It has been known.

FIG. 12 is a flow chart of mounting a printed wiring board, showing steps from mounting electronic components on a printed circuit board 30 to shipping.

In FIG. 1, a printed circuit board 30 is prepared in step S1, and the process proceeds to step S2 to print cream solder. Thereafter, the process proceeds to step S3, where electronic components mounted on the surface are mounted by a chip mounter device or the like, and reflow soldering is performed in step S4. Thereafter, the in-circuit test in the next step S5 is performed without cleaning the flux generated by the soldering, and only the substrates that pass this test are subjected to the subsequent step S5.
The board is tested by the function test of No. 6 and the board that passes this test is shipped (step S7).

After step S1, step S8 is executed.
After mounting the electronic component by inserting it into the mounting portion including the through hole for mounting the component, soldering of the electrical component by the solder reflow solder in step S9 is performed, and the in-circuit in the next step S10 is performed. A test is performed, and only the board that passes this test is tested in the subsequent function test in step S11, and the board that passes this test is shipped (step S7).

FIG. 13 is an external perspective view of the in-circuit tester of the above-described steps S5 and S10, in which a main part of a conventional board electrical inspection probe is cut away. FIG. 14 is an enlarged view of a main part of FIG.

In FIGS. 13 and 14, a plurality of probes 4
Is configured so that the contact pin 5 is positioned with respect to the solder fillet portion at the tip of the QFP lead mounted on the printed wiring board 30, and the contact pin 5 is moved up and down so that the contact pin 5 is a QFP of a QFP which is an IC package. The in-circuit test after mounting (steps S5 and S10 in FIG. 12) is performed by contacting the solder fillet at the tip of the lead to secure electrical conduction.

With the recent increase in mounting density, it becomes difficult to secure a space for providing a test pad for dropping the contact pin 5 of the test probe 4, and the solder fillet portion or the chip at the tip of the lead of the QFP package is difficult to secure. A contact pin 5 for inspection is used in a solder fillet portion or the like of a soldering land portion (not shown in the drawing) of a component, and in a limited portion where a thick flux F remains during solder reflow.
Need to be dropped. For this reason, as shown in FIG. 14, the flux F adheres to the tip of the contact pin 5 for inspection more than before, and as a result, conduction failure at the time of in-circuit inspection is more likely to occur.

The characteristic point of the occurrence of such a conduction failure is that when the conduction failure occurs for the first time, the second time,
When the contact pin 5 is dropped again for the third time, the flux F may fall off, but it is unstable and cannot be adopted. For this reason, once a conduction failure occurs, not a test for an original soldering failure or an element failure, but an erroneous one which should be originally determined to be a non-defective product is also determined to be defective.

As a result, the efficiency of the production line is greatly reduced. Therefore, when a defect which seems to be contaminated at the tip of the contact pin 5 occurs frequently, the upper plate 10 provided with the inspection probe 4 is normally rotated about 180 degrees in the direction of arrow K to contact the contact pin 5. After turning the 5 upward, the operation of cleaning the flux F adhering to the tip of the contact pin in the vicinity of the portion considered to be a defective portion with a brush or the like, and performing the inspection again. Also,
Similarly, the contact pins 5 provided on the lower plate 11 are cleaned with a brush or the like to remove the flux F attached to the tips of the contact pins near the defective portions.

[0015]

However, when cleaning is performed with a brush in this way, the cleaning method varies depending on the operator and cannot be uniformly cleaned, so that the contaminants caused by the cleaning are always removed. There was no guarantee that it was uncertain.

[0016] Therefore, after the cleaning with the brush, the inspection is performed again and reconfirmed. If the conduction failure recurs, the cleaning must be performed again, which is very troublesome.

On the other hand, in recent years, the circuit scale of a printed wiring board has become large, and it is not uncommon that the number of contact pins 5 of the probe 4 of the inspection machine exceeds 1000 or 2000 or more. Even when brush cleaning is performed, there is a problem that it takes much time and effort.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and has been made in order to clean contaminants adhering to tip portions of contact pins of a board electrical inspection probe used in a board testing apparatus including an in-circuit test. It is an object of the present invention to provide a method, a cleaning device, and a cleaning tool for a probe for electrical inspection of a board, which can surely perform a single cleaning operation.

[0019]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, the probe for substrate electrical inspection and the cleaning tool are used in a substrate testing apparatus including an in-circuit test, and a tip portion of a contact pin of the probe for substrate electrical inspection is cleaned with a fine metal oxide by a predetermined amount. By inserting into the elastic sheet formed by dispersing at a weight%, the contaminant including the solder flux attached at the front end portion is reliably caught in the elastic sheet and then pulled out. And

In order to obtain a restoring force after the insertion, the elastic sheet has a rubber hardness of 20 to 80 degrees (Hs).
It is molded from an industrial rubber material containing the silicone elastomer (A), and is characterized in that it can be used repeatedly.

The metal oxide has a particle size of 10 to 40.
Aluminum oxide or magnesium oxide in the range of micrometers, and the predetermined weight percent is 40-70.
It is characterized by being.

The elastic sheet may have a rubber hardness of 20 to 20.
By molding from an industrial rubber material containing an 80 degree (Hs A) silicone elastomer, a restoring force after the piercing is obtained, and the metal oxide has a particle size of 10 to 40.
It is characterized by using aluminum oxide or magnesium oxide in the range of micrometers and setting the weight% to 40 to 70, and using the remaining industrial rubber material to enable repeated use.

Further, the present invention is characterized in that one or a combination of silicone rubber, styrene rubber, butadiene rubber, ethylene rubber, urethane rubber, butyl rubber and ethylene propylene rubber is used as the industrial rubber material.

Further, the thickness of the elastic sheet is preferably set to 1 mm or less so that a crack portion at a tip end portion of the contact pin does not enter and a step portion is not buried. .

Further, by using a double-sided sheet body in which the elastic sheet is attached to both sides of a base sheet serving as a base, the contaminants adhering at the tip end portions of the contact pins can be removed by the double-sided sheet body. It is characterized by catching from both sides.

In addition, by using a one-sided sheet body in which the elastic sheet is adhered to one side of a base sheet serving as a base, the contaminants adhering at the distal end portions of the contact pins can be removed from the one-sided sheet body. It is characterized by being captured from one side.

Further, the base sheet is formed of a resin plate containing a conductive material containing carbon, a good electric conductor including a glass epoxy substrate, and the adhesive layer for attaching has conductivity. I have.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. First, FIG. 1 shows an essential part of a board electrical inspection probe of an inspection jig in an in-circuit test machine. FIG. 3 is an external perspective view cut away.

FIG. 2 is an enlarged view of a main part of FIG.

1 and 2, a plurality of probes 4 are provided on an upper plate 10, and a solder fillet 3 at the tip of a QFP lead 32 mounted on a printed wiring board 30.
3 is configured such that the contact pin 5 is located. Similarly, the lower plate 11 has a plurality of probes 4.
(Not shown) is provided, and the contact pins 5 are configured so as to be positioned with respect to the solder fillet portion at the tip of the lead of the electronic component mounted on the back surface of the electronic component.

The upper plate 10 and the lower plate 11 thus configured
Are moved in the direction of arrow D along the guides 20, respectively, so that the urging force generated when the coil spring built in the probe 4 is appropriately compressed causes the flux to be cleaned without being cleaned. To ensure that the sharp end of the contact pin 5 comes into contact with the solder fillet 33 at the end of the QFP lead 32 of the IC package so as to break through the residual flux F. Thus, the in-circuit test after mounting (steps S5 and S10 in FIG. 12) is performed. The printed wiring board 30 is positioned by guide pins, and each probe 4 is positioned on each solder fillet 33.

The above is the schematic configuration of the in-line circuit tester.

Next, the structure of the cleaning sheet, which is an elastic sheet, which is the most significant feature of the present invention, will be described.

FIG. 3 is a sectional view of the cleaning sheet 1. In this drawing, the cleaning sheet 1 is formed into a sheet from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale).
Thickness t so that only the tip of
(1 mm). Further, the area is the same as the area of the printed wiring board 30 or has an area covering at least the entire arrangement position of the probe 4.
The cleaning sheet 1 is set to have a rubber hardness of 20 to 80 degrees in order to obtain a restoring force after piercing only the tip of the contact pin 5.

The cleaning sheet 1 is a metal oxide having a random shape as shown in FIG.
Aluminum oxide or magnesium oxide in the range of 0 to 40 μm is uniformly dispersed in the rubber molding portion 3 in an amount of 40 to 70% by weight. By molding in this way, repeated use is enabled.

Next, FIG. 4 to FIG. 6 show the in-circuit tester described in FIG.
FIG. 4 is an operation explanatory view showing a state in which a cleaning sheet 1 is set. That is, the flux F attached to the tip of the contact pin 5 is cleaned by appropriately setting the cleaning sheet 1 instead of the printed board. Therefore, the use of the cleaning sheet 1 eliminates the necessity of the conventional cleaning with a brush. In addition, since it can be handled in the same manner as the printed circuit board 30, there is the greatest advantage that the test process is not affected at all.

In FIG. 4, the contact pin 5 of the probe 4 is provided with a slit portion 5b and a step portion 5a as shown in the figure. For example, after the 50th test, the flux F adheres as shown in the figure. doing.

Then, the upper plate 10 and the lower plate 11 are moved in the direction of arrow D1, and as shown in FIG.
The flux F at the tip of the pin is captured by the metal oxide particles 2 from the front and back sides, for example, of the silicone rubber sheet. Thereafter, as shown in FIG. 6, the upper plate 10 and the lower plate 11 are moved in the direction of arrow D2 to complete the cleaning and leave the flux F in the sheet 1.

The metal oxide particles 2 are made of MgO and have a particle size of 3
It is about 0 μm. As a material of the metal oxide, Al2
Abrasives such as O3 and the like are effective. In addition, the thickness t of the sheet 1 is set to 0.45 mm when used for a single-sided printed wiring board, and is set to 0.9 mm when used for a double-sided printed wiring board. Since it is thicker than the depth of the slot 5b at the tip and thinner than the height from the tip of the contact pin to the step 5a, there is no problem even if there is a slight difference from the thickness of the substrate 30 to be inspected.

Since the substrate 30 to be inspected is a double-sided mounting substrate, the contact pins 5 are provided on the upper and lower sides. The contact pins are lowered as in the case of the electrical inspection, and the leading end of the contact pins is slotted into the cleaning sheet. By piercing the contact pin 5b and further piercing the contact pin, raising the contact pin makes it possible to remove the flux attached to the tip.

After piercing the contact pins, the puncture marks are closed by the elasticity of the sheet 1 and the same effect can be obtained even when the sheet 1 is used again until the sheet 1 is chipped. Also, sheet 1
The material used is one or a combination of silicone rubber, styrene rubber, butadiene rubber, ethylene rubber, urethane rubber, butyl rubber, and ethylene propylene rubber.

On the other hand, if the sheet 1 is chipped,
By slightly shifting the piercing position, the same effect can be obtained again, and repetitive use is possible, so that the economy is excellent.

According to the results of experiments on the correlation between the presence / absence of cleaning, the frequency of cleaning, and the erroneous determination rate described above, the erroneous determination rate was 23% when no cleaning was performed, and cleaning with the sheet 1 was performed by 1%.
When the test was performed once for each test of zero substrates, the erroneous determination rate was 0%.

In the following, when the cleaning with the sheet 1 is performed once for each test of the 20 substrates, the erroneous determination rate is 0% and 30%.
When the test is performed once for each of the substrates, the erroneous determination rate is 0%,
The erroneous determination rate is 0 when the test is performed once for each test of 50 substrates.
%, When the cleaning with the sheet 1 is performed once for each test of 60 substrates, the erroneous determination rate becomes 1%, and the sheet 1
It was found that the erroneous determination rate was 12% when cleaning was performed once every 70 substrates by the test.

From the above results, when cleaning is performed regularly,
By performing cleaning once every 50 substrate inspections, it is possible to prevent erroneous determination in the inspection process. Next, FIG. 7 shows a state in which the cleaning sheet 1 is set on an inspection jig, the tip of the contact pin 5 is pierced and cleaned, and then the contact pin 5 is raised. FIG. 3 is a diagram illustrating a state in which a cleaning sheet is adhered to a pressing unit.

In this drawing, although it is possible to reduce the erroneous determination rate of the electrical inspection by cleaning the contact pins, the cleaning sheet itself has a thickness of 0.45 to 0.9.
If it is as thin as mm and has low tackiness, it will be difficult to handle.

More specifically, at the end of cleaning, the surface 1a of the cleaning sheet 1 adheres to the holding portion 12 of the printed wiring board provided on the upper plate 10 provided with the contact pins of the inspection device, and the work is to be removed every time. Occurs.

Therefore, handling is facilitated by using the silicone rubber sheet, which is the cleaning sheet 1, on the front and back surfaces, or on one surface, on the base material serving as a base sheet having a certain degree of hardness.

FIG. 8 is a cross-sectional view of the double-sided sheet body 100 in which the sheet 1 is attached to both sides of the base sheet 7 serving as a base. To catch from. The double-sided sheet body 100 has a hardness of about 60 ° and an adhesive on both sides of a base sheet 7 made of a plastic plate or the like having a thickness of 1.2 mm, in which the above-mentioned sheet 1 having a thickness of 0.45 mm becomes a conductive adhesive layer. 6 are attached to each.

The double-sided sheet body 100 thus configured
Using the sheet member 1 as shown in FIGS.
00 is set on the inspection device, and the tip of the contact pin 5 is stabbed and cleaned.

The particle size of MgO as the metal oxide body is 30.
μm, a hardness of 35 ° using silicone rubber, and a base sheet 7 serving as a base material having a thickness of 1.2 °.
mm, and the material hardness of the plastic plate is 70 to 80 °. The material of the base sheet 7 may be a glass epoxy substrate or a hard rubber substrate having a hardness of 40 ° or more. If the cleaning sheet 1 is an insulator and is likely to be charged with static electricity, the base sheet 7 is made of a conductive material or a base material corresponding to a material in which a conductive material such as carbon or Ni particles is dispersed. It is preferable to secure a path for discharging static electricity.

It is necessary to change the thickness of the base sheet 7 depending on the thickness of the substrate to be inspected. However, since the thickness of the silicone rubber sheet 1 is 0.45 mm, which is larger than the slit depth at the tip of the contact pin, the thickness of the substrate to be inspected is changed. There is no problem if there is a slight difference from the thickness.

Further, since the substrate to be inspected is a double-sided mounting substrate, contact pins 5 are provided on the upper and lower sides. Therefore, the cleaning sheet 1 is formed on both the front and back surfaces of the double-sided sheet body 100 by a base made of a glass epoxy base material. Sheet 7
A silicone rubber sheet is stuck on both sides with an adhesive or double-sided tape.

In the above configuration, in order to ensure the electrical contact state of the inspection device, the double-sided sheet member 100 is set in place of the substrate, and the contact pins 5 are lowered as in the normal inspection. The tip of the pin is pierced to clean the flux F at the tip of the pin.

At this time, even if the pin adheres to the side that holds the printed circuit board because it is adhered to a hard base material, it is not necessary to peel off the adhered portion when the pin is lifted up when lifting the pin. The work can be performed efficiently.

Further, in order to adhere to the member for holding the printed wiring board to be inspected by fixing the upper pin of the probe 4 for electrical inspection with the adhesiveness of the cleaning sheet 1, the cleaning sheet body is placed on the pressing member side of the substrate. The cleaning sheet body according to the present invention may also be provided with a push pin for facilitating the removal of the cleaning sheet body by providing a push pin for facilitating automatic peeling, and after the cleaning is completed, the push pin pushes the cleaning sheet body and peels the cleaning sheet body from the inspection device side. It is also effective as a method for making it easier to use.

In the case of the automatic inspection process, the sheet body 100 is inserted for every several substrates in the cassette in which the substrate to be inspected is inserted, and the tip of the contact pin 5 is cleaned without any manual operation. It is possible to improve the operation rate.

As described above, the elastic sheet containing 40 to 70% by weight of the metal oxide particles 2, for example, Al203, MgO, etc. is set in the inspection apparatus, and the contact pins are lowered in the same manner as in the normal inspection. By piercing the contact pins into the elastic sheet, it is possible to simultaneously clean dirt such as flux F adhered to the tips of the plurality of contact pins, thereby improving the work efficiency, which is a conventional manual cleaning operation using a brush or the like. Work with many deterministic elements can be eliminated, and work can be performed reliably.

As a result, it is possible to periodically clean the contact pins which had been cleaned for the first time since the occurrence of a contact failure because of the time required for the conventional work. As a result, the erroneous determination that has reduced the efficiency of the conventional inspection is eliminated, and the rectification rate of the process is improved, and the cost can be reduced.

The cleaning sheet may be made of a glass epoxy substrate or a plastic plate having an appropriate thickness in accordance with the thickness of the substrate on which the electric component is mounted and the arrangement of the contact pins of the inspection device (either upper or lower or upper and lower).
Attaching to both sides or one side of a rubber plate of moderate hardness, setting it in the inspection device, pulling down the contact pins in the same way as normal inspection, and piercing the contact pins in the cleaning sheet body, it is possible to clean the tip of multiple contact pins. It can be performed simultaneously, and the work efficiency is further improved because the cleaning sheet is not sticked to the printed circuit board of the inspection device compared to the work using only the cleaning sheet, making it easier to clean the contact pins, which conventionally took time. It is possible to do.

Further, in the case of the automatic inspection process of the automatic line, the cleaning sheet body of the present invention is inserted into the cassette containing the inspection substrate every several substrates, and the tip of the contact pin is cleaned without any manual operation, and the inspection process is performed directly. It is possible to improve the rate.

[0062]

As described above, according to the present invention,
Cleaning of electrical probe for board electrical inspection that can reliably clean contaminants attached to the tip of the contact pin of the electrical probe for board electrical inspection used in board testing equipment including in-circuit testing in a single cleaning operation A method and a cleaning tool can be provided, which is particularly effective for eliminating the need for cleaning flux.

[0063]

[Brief description of the drawings]

FIG. 1 is an external perspective view of a board inspection jig.

FIG. 2 is an enlarged perspective view of an essential part of FIG. 1;

FIG. 3 is a cross-sectional view of the cleaning sheet 1.

FIG. 4 is an operation explanatory view showing a state in which the tip of a contact pin 5 is cleaned by a cleaning sheet 1.

FIG. 5 is an operation explanatory view showing a state in which the tip of a contact pin 5 is cleaned with a cleaning sheet 1;

FIG. 6 is an operation explanatory view showing a state where the tip of the contact pin 5 is cleaned by the cleaning sheet 1.

FIG. 7 is a diagram illustrating the operation of the cleaning sheet 1.

FIG. 8 is a cross-sectional view of the double-sided sheet member 100.

FIG. 9 is an operation explanatory view showing a state where the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 10 is an operation explanatory view showing a state in which the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 11 is an operation explanatory view showing a state in which the tip of the contact pin 5 is cleaned by the double-sided sheet member 100.

FIG. 12 is a flowchart of mounting a printed wiring board.

FIG. 13 is an external perspective view of a conventional board inspection jig.

FIG. 14 is an enlarged perspective view of an essential part of FIG. 13;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning sheet 2 Metal oxide particle 3 Rubber molding part 4 Probe 5 Contact pin

Claims (18)

[Claims] 1. A method for cleaning a board electrical inspection probe used in a board test apparatus including an in-circuit test, wherein a tip portion of a contact pin of the board electrical inspection probe is weighed with a fine metal oxide by a predetermined weight. %, The contaminant including the solder flux adhered at the front end portion is securely caught in the elastic sheet by being pierced into the elastic sheet which is formed by dispersing in%, and then pulled out. How to clean the board electrical inspection probe. 2. The elastic sheet is formed from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale) in order to obtain a restoring force after the piercing, and is used repeatedly. 2. The method according to claim 1, wherein the probe is enabled. 3. The method according to claim 1, wherein the metal oxide is aluminum oxide or magnesium oxide having a particle size in a range of 10 to 40 μm, and the predetermined weight% is 40 to 70. How to clean the board electrical inspection probe. 4. The rubber sheet having a rubber hardness of 20 to 80.
(Hs Shore A scale) by molding from an industrial rubber material containing a silicone elastomer to obtain the restoring force after the piercing, and the metal oxide has an aluminum oxide having a particle size in the range of 10 to 40 μm. Or use magnesium oxide, and add 40% by weight.
To 70, and the rest to the industrial rubber material,
2. The method of claim 1, wherein the probe is used repeatedly. 5. The industrial rubber material includes silicone rubber, styrene rubber, butadiene rubber, ethylene rubber,
5. The method according to claim 1, wherein one or a combination of urethane rubber, butyl rubber, and ethylene propylene rubber is used. 6. The thickness of the elastic sheet is preferably set to 1 mm or less so that a crack portion at a tip end portion of the contact pin does not enter and a step portion is not buried. A method for cleaning a board electrical inspection probe according to any one of claims 1 to 5. 7. Use of a double-sided sheet body in which the elastic sheet is attached to both sides of a base sheet serving as a base allows the contaminants adhering at the distal end portion of the contact pin to be removed from the double-sided sheet body. 7. The method according to claim 1, wherein the probe is caught from both sides. 8. Using a one-sided sheet body in which the elastic sheet is attached to one side of a base sheet serving as a base, the contaminants adhering at the tip end portions of the contact pins are removed from the one-sided sheet body. 7. The method according to claim 1, wherein the probe is captured from one side. 9. The method according to claim 1, wherein the base sheet is made of a resin plate containing a conductive material containing carbon, a material electric conductor including a glass epoxy substrate, and the adhesive layer for attachment has conductivity. The method for cleaning a probe for electrical inspection of a board according to claim 7. 10. A cleaning tool for a board electrical inspection probe used in a board testing apparatus including an in-circuit test, wherein a tip portion of a contact pin of the board electrical inspection probe is weighed with a fine metal oxide by a predetermined weight. %, The contaminant including the solder flux adhered at the front end portion is securely caught in the elastic sheet by being pierced into the elastic sheet which is formed by dispersing in%, and then pulled out. Cleaning tool for board electrical inspection probe. 11. The elastic sheet is formed from an industrial rubber material containing a silicone elastomer having a rubber hardness of 20 to 80 degrees (Hs Shore A scale) in order to obtain a restoring force after the piercing. The cleaning tool for a board electrical inspection probe according to claim 9, wherein the cleaning tool is enabled. 12. The method according to claim 9, wherein the metal oxide is aluminum oxide or magnesium oxide having a particle size in a range of 10 to 40 μm, and the predetermined weight percentage is 40 to 70. Cleaning tool for board electrical inspection probe. 13. The elastic sheet is provided with a rubber hardness of 20-8.
By molding from an industrial rubber material containing a 0 degree (Hs A) silicone elastomer, a restoring force after the piercing is obtained, and the metal oxide has a particle size of 10 to 40 μm, such as aluminum oxide or aluminum oxide. The cleaning tool for a probe for electrical inspection of a board according to claim 9, wherein magnesium oxide is used, the weight% is set to 40 to 70, and the remainder is made of the industrial rubber material so that the board can be repeatedly used. . 14. The industrial rubber material according to claim 13, wherein one or a combination of silicone rubber, styrene rubber, butadiene rubber, ethylene rubber, urethane rubber, butyl rubber, and ethylene propylene rubber is used. Cleaning tool for board electrical inspection probe. 15. A thickness of the elastic sheet is preferably set to 1 mm or less so that a crack portion at a tip end portion of the contact pin enters and a step portion is not buried. A cleaning tool for a board electrical inspection probe according to any one of claims 9 to 14. 16. Using a double-sided sheet body in which the elastic sheet is attached to both sides of a base sheet serving as a base, the contaminants adhering at the distal end portions of the contact pins are removed from the double-sided sheet body. 16. The image pickup device according to claim 9, wherein the device is configured to be captured from both sides.
The cleaning tool for a board electrical inspection probe according to any one of the above. 17. Using a one-sided sheet body in which the elastic sheet is adhered to one side of a base sheet serving as a base, the contaminants attached at the tip end portion of the contact pin are removed from the one-sided sheet body. 17. The device according to claim 9, wherein the device is configured to be captured from one side.
The cleaning tool for a board electrical inspection probe according to any one of the above. 18. The method according to claim 18, wherein the base sheet is made of a resin plate containing a conductive material containing carbon, a good electrical conductor containing a glass epoxy substrate, and the adhesive layer for attaching has conductivity. A cleaning tool for a board electrical inspection probe according to any one of claims 16 and 17.