JPH1024688A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card, the lowering of the appearance of which due to the leaving of bubbles between layers at the lamination of resin plates is suppressed and the physical strength of which is improved. SOLUTION: The surface of a NON-contact IC module 6, which is produced by molding a semiconductor element and the like with resin, is roughened by being provided with fine unevenness having the average roughness of 1.5-2.5μm. In a blanked hole 5, which has the same phase as the non-contact IC module 6 and is bored on a core 2, the non-contact module 6 is filled. Under the state just mentioned above, the upper and lower sides of the core 2 are joiningly covered with over-sheets 3 and 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC card having a built-in IC module.

[0002]

2. Description of the Related Art In recent years, from the viewpoints of efficiency of information processing and security, IC cards equipped with semiconductor elements for recording and processing data have become widespread. Such an IC
The card incorporates a contact type that transmits and receives data by connecting the external terminal of the card and the terminal of the external processing device, an antenna coil that transmits and receives data by electromagnetic waves, and a semiconductor element for data processing. There is a non-contact type in which reading and writing with an external processing device can be realized by a so-called wireless system. Recently, the driving power of the IC circuit is supplied by electromagnetic induction, and the demand for a non-contact type IC card without a built-in battery is increasing.

In a conventional non-contact type IC card, for example, as shown in FIG. 5, a punching hole 5 for embedding an IC module 6 in a core sheet 2 or a recess for embedding is formed. One or both sides of the core sheet 2 are laminated with the oversheets 3 and 4 by adhesion or fusion while the IC module is mounted in the hole or the concave portion.

[0004]

However, in a non-contact type IC module, for example, electronic components such as a semiconductor element and a capacitor and an antenna for receiving power and transmitting and receiving data are molded in a sheet shape with epoxy resin or the like.
Since it has a relatively large disc shape with a diameter of about 2 to 4 cm, it is necessary to use an IC when bonding or fusing the oversheet.
Air bubbles may remain between the module and the overseat. Due to these bubbles, there has been a problem that the adhesive strength is reduced and the appearance of the card is poor.

[0005] Further, when the non-contact IC module molded with epoxy resin as described above is press-laminated with an oversheet such as PVC and fused, the epoxy resin is poorly adhered to PVC or the like. In some cases, and the physical strength is reduced.

An object of the present invention is to provide an IC card in which the strength of the bonding surface between an IC module and a resin sheet is improved in view of the above-mentioned problems of the prior art.

[0007]

In order to achieve the above object, in an IC card having a structure for joining the surface of an IC module to a resin sheet, a part or all of the surface of the IC module joined to the resin sheet is provided. An IC card characterized by having a roughened surface.

In the IC card of the present invention, the surface of the IC module to be joined to the resin sheet is roughened. for that reason,
At the time of joining such as press lamination, the unevenness of the roughened surface serves as an escape path for air between the IC module and the resin sheet, so that air bubbles hardly remain in the joining area, the joining strength is improved, and the appearance defect is also unlikely to occur. .

In addition, since the surface of the IC module is roughened, the bonding strength with the resin sheet is improved by the increase in the surface area due to the unevenness or the so-called anchoring effect of the unevenness of the rough surface. IC with difficult epoxy resin
Even if a module is formed, peeling of the IC module and the resin sheet is less likely to occur.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below, but needless to say, the present invention is not limited to the following embodiments. First Embodiment FIG. 1 is a sectional view showing a first embodiment of an IC card according to the present invention, and FIG. 2 is a view for explaining a method of manufacturing the IC card.

The IC card 1a shown in FIG. 1 is a non-contact type IC card, and has a laminated structure in which both surfaces of a resin core 2 are covered with resin oversheets 3, 4.
The core 2 is provided with a module hole 5, and a non-contact IC module 6 having a diameter of about 2 cm and a coil, an IC, etc. sealed with, for example, epoxy resin is accommodated in the module hole 5. The core 2 and the overseats 3, 4
For example, the IC module 6 and the oversheets 3 and 4 are similarly joined by fusion or adhesion. The thickness of each of the oversheets 3 and 4 is, for example, about 100 μm, and the thickness of the core 2 is about 560 μm. The total of the three layers is 760 μm, which is the standard for IC cards.

In this embodiment, the IC module 6
Both surfaces are provided with fine irregularities to form a rough surface 7 (a shaded region in FIG. 2). The degree of surface roughening is such that the average surface roughness is 1 to 5 μm, preferably 1.5 to 2.5 μm.
About μm is good. As a method of surface roughening, for example, a method in which electronic components such as an IC circuit and an antenna are molded with resin is provided with fine irregularities in advance, and the irregularities are transferred to a sealing resin. After resin sealing is performed, a method of sandblasting the surface of the sealing resin or roughening the surface with a file or the like can be employed. The part to be roughened is preferably the entire part to be joined to the resin, and is good on both sides as in this embodiment, but may be one side or a part of one side.

Since the surface of the IC module 6 is roughened as described above, the bonding strength between the IC module 6 and the oversheets 3 and 4 is improved. IC module 6
Since the surface of the IC module 6 is roughened, for example, when an oversheet made of vinyl chloride is heat-sealed by press lamination, irregularities on the surface of the IC module 6 may be reduced.
And the overseats 3 and 4 serve as an escape route for air, and air bubbles can be prevented from remaining between the IC module 6 and the overseats 3 and 4 as much as possible. In addition, at the time of heat fusion or bonding, the resin enters the unevenness of the IC module 6, and the bonding strength increases due to an increase in the bonding area and a so-called anchor effect. Therefore, the IC card 1a of the present embodiment does not easily cause peeling or poor appearance at the IC module embedded portion, and has high reliability.

Next, a method of manufacturing the IC card shown in FIG. 1 will be described with reference to FIG. An oversheet 3 larger than the outer diameter of the IC card 1a, a core 2 in which a module hole 5 is punched or the like, and an oversheet 4 are prepared.
These are, for example, glass epoxy, polyimide, PV
It is manufactured using a resin such as C (polyvinyl chloride), ABS (acrylonitrile-butadiene-styrene copolymer), and PET (polyethylene terephthalate).

The non-contact IC module 6 is formed by molding a substrate on which an IC circuit using a semiconductor element or the like and other electronic parts are mounted and an antenna for receiving power and transmitting and receiving data with resin. At this time, an epoxy resin or the like is used for molding. The thickness is about the same as the core 2. The surface of the IC module 6 is previously roughened as described above.

Next, the core 2 is placed on the lower oversheet 4, the non-contact IC module 6 is loaded into the module hole 5 of the core 2, the oversheet 3 is further covered, and these are fused by hot pressing. The core 2 is sandwiched between the oversheets 3 and 4 to form a laminate. Alternatively, these can be joined with an adhesive using an epoxy-based adhesive or the like. Thereafter, these laminates are punched into a predetermined shape of an IC card, and a non-contact type I
C-do 1a is completed.

In the above embodiment, in order to accommodate the non-contact IC module 6, the module sheet hole 5 is formed in the core sheet 2.
However, a space for accommodating the IC module can be formed by forming a concave portion instead of such a through hole. Second Embodiment FIG. 3 is a sectional view of an IC card according to the present embodiment, and FIG.
Indicates a manufacturing method thereof. The IC card 1b has a structure in which the non-contact IC module 8 itself constitutes a core, and both sides of the IC module 8 are covered with oversheets 3 and 4. Such an IC module is applied, for example, to an IC module that needs to have a large antenna area.

Also in this embodiment, the IC module 8
In this embodiment, fine irregularities are provided on both surfaces of the IC module 8, and both surfaces of the IC module 8 are rough surfaces. The method of roughening and the degree of the rough surface are the same as those of the first embodiment. However, in this embodiment, the surface roughening effect is more remarkable than in the first embodiment because the surface area of the IC module is large. Conventionally, when an oversheet is heat-sealed to an IC module having the size of an IC card, air bubbles are likely to remain and appearance defects are likely to occur. Further, vinyl chloride or polyethylene terephthalate constituting the oversheets 3 and 4 has a low bonding strength of heat fusion with an epoxy resin or adhesion using an adhesive, and may be peeled off. By this, the bonding strength is improved. According to the present invention, these problems can be solved. As a result, the yield of IC cards is improved and the reliability is also improved.

Next, an embodiment of the IC card manufacturing method will be described. A non-contact IC module 8 is formed by molding a substrate on which an IC circuit using a semiconductor element or the like and other electronic components are mounted and an antenna for transmitting and receiving data and receiving power are molded into a sheet by molding with epoxy resin or the like.
And this is used as a core. The thickness of the core 2 is about 560 μm, which is the same as that of the core 2 in the first embodiment.

Regarding the non-contact type IC module 8, the IC
The surface of the non-contact IC module 8 can be formed by providing fine irregularities in advance in a mold for molding electronic components such as circuits and an antenna with resin, or by performing sandblasting on the sheet surface to roughen the surface. Fine irregularities are provided in the hatched area in FIG. 4).

Next, each sheet is fused by hot pressing in a state where both sides of the non-contact IC module 8 are sandwiched between the oversheets 3 and 4 and then punched into a predetermined shape to form a non-contact type IC module. The card 1b is completed. In this lamination, an adhesive may be used.

In the above description, an IC card having a three-layer structure has been described. However, it is needless to say that the present invention can be applied to a multilayer structure having more layers.
I with built-in contact IC module in addition to module
It can be applied to a C card, and the bonding method may be, for example, an adhesive other than the above-mentioned fusion bonding and bonding with an adhesive.
In addition, various changes can be made without departing from the gist of the present invention.

[0023]

The IC card of the present invention has a good bonding strength between the built-in IC module and the resin sheet bonded thereto. Further, at the time of bonding, air bubbles hardly remain, and poor appearance can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of a non-contact type IC card according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a manufacturing process of a method for manufacturing a non-contact type IC card according to the first embodiment of the present invention.

FIG. 3 is a sectional view of a non-contact type IC card according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a manufacturing process of a method for manufacturing a non-contact type IC card according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of an example of a conventional non-contact type IC card.

[Explanation of symbols]

1a: IC card, 1b: IC card, 2: core, 3 ...
Oversheet, 4 ... Oversheet, 5 ... Module hole, 6 ... Non-contact IC module, 7 ... Rough surface, 8 ... Non-contact IC module

Claims (1)

[Claims] 1. An IC card having a structure for joining a surface of a non-contact IC module and a resin sheet, wherein part or all of the surface of the IC module joined to the resin sheet is roughened. IC card.