JPH10242709A - Dielectric duplexer - Google Patents

Abstract

(57) Abstract: A branch circuit connected to an antenna terminal is formed inside a dielectric block to reduce the number of components, reduce the size, and facilitate circuit design. SOLUTION: A resonator block is constituted by a first dielectric substrate 11 having a concave groove and a flat second dielectric substrate 12 among three dielectric substrates. Conductive patterns 16 and 17 are formed on a third dielectric substrate 13 of a flat plate and on the joint surface thereof with an insulating material such as glass 18 interposed therebetween. The conductor pattern is formed between two dielectric filters or dielectric resonators in the block, and can obtain an inductance for coupling a branch circuit and a resonator connected to the antenna terminal. It becomes easy to form a conductor pattern for inductance and a pattern for various wirings, and design becomes easy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a dielectric duplexer, and more particularly to a dielectric duplexer in which dielectric filters on a receiving side and a transmitting side are integrally formed in a dielectric block.

[0002]

2. Description of the Related Art Dielectric resonators (filters) and multilayer LC filters have come to be used as filters available in the hundreds of MHz band for mobile communication equipment and the like. Coaxial T
EM resonance type dielectric filters are widely used as filters and duplexers because high Q is obtained.

There are two types of dielectric filters: one that connects a plurality of dielectric resonators alone, and one that forms a plurality of resonators integrally by forming a plurality of through holes in a dielectric block. Further, a structure in which a dielectric substrate having a groove formed thereon is bonded is also employed. The dielectric filter is used as a transmission filter and a reception filter, and a dielectric duplexer having one end connected to an antenna terminal is used.

[0004] In a dielectric duplexer, it is necessary to couple an input from an antenna terminal to a dielectric filter on the receiving side and to couple an output of the dielectric filter on the transmitting side to the antenna. For this purpose, a branch circuit is interposed between the antenna terminal and the dielectric filter, and the characteristics such as impedance are adjusted and connected to the dielectric filter. In some cases, a configuration for connecting the resonators with an inductance is required.

[0005]

The branch circuit is composed of a strip-shaped conductor pattern or a coaxial cable printed on a dielectric substrate. Therefore, it is necessary to form a conductor pattern on a dielectric substrate different from the dielectric constituting the dielectric filter, or to connect a cable between the antenna terminal and the resonator. Therefore, the number of parts is increased, which is a major obstacle to miniaturization. The inductance is obtained by an external air-core coil or a meandering conductor pattern on a dielectric substrate.

An object of the present invention is to provide a dielectric duplexer in which the number of parts is reduced, the size is reduced, and a dielectric filter for transmission and reception is completely integrated.

[0007]

According to the present invention, a dielectric substrate is bonded to form a dielectric block, in which not only a dielectric filter for transmission / reception but also an insulating material is provided on the bonding surface of the dielectric substrate. The above-mentioned problem is solved by forming a conductor pattern which is connected by a connection.

That is, a first dielectric substrate having a plurality of parallel grooves, a second dielectric substrate adhered to the surface of the first dielectric substrate on which the grooves are formed, A third dielectric substrate bonded to a surface of the dielectric substrate opposite to a surface bonded to the first dielectric substrate, wherein a surface of the groove of the first dielectric substrate and a second dielectric substrate are bonded. The inner conductor on the surface of the body substrate facing the concave groove, the outer conductor on the non-bonded surface of the first dielectric substrate and the third dielectric substrate and the end surface where the concave groove does not open,
Two dielectric filters with a short-circuit conductor on one end face where the concave groove opens are provided in the dielectric block, and the bonding surfaces of the second dielectric substrate and the third dielectric substrate are bonded with an adhesive made of an insulating material. Then, the conductor patterns formed on the surfaces of the second dielectric substrate and the third dielectric substrate are connected to each other through openings formed in the insulating material.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION On the bonding surface of a second dielectric substrate and a third dielectric substrate, one end extends to an open end surface, branches on the way, and one ends toward a receiving-side dielectric filter, and the other ends. Form a conductor pattern extending in the direction of the transmission-side dielectric filter, and are directly connected to the inner conductor of the dielectric resonator at the end and the capacitive or impedance matching point. Adhesion of the dielectric substrate is performed using glass or the like, but before that, a conductor pattern for inductance formation or wiring is formed on the adhesion surface of both dielectric substrates, and after bonding, necessary parts are connected to terminals. Connect to electrodes.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are perspective views showing an embodiment of the present invention. FIG. 1 shows a state before assembling, and FIG. 2 shows a state after assembling. The dielectric block 10 is formed by three dielectric substrates made of a ceramic material having a relatively high dielectric constant of about 90. This dielectric block is formed by bonding a dielectric substrate 11 having a groove and flat dielectric substrates 12 and 13. An inner conductor 14 is formed in a through hole of the dielectric block 10, and an outer conductor 15 is formed on a surface parallel to a direction in which the through hole extends. Although not shown, a conductor film is also formed on one of the end faces where the through-holes are opened, and serves as a short-circuit conductor. In this example, the side provided with three grooves serves as a dielectric filter on the receiving side, and the side provided with two grooves serves as a dielectric filter on the transmitting side.

In the dielectric filter according to the present invention,
Conductive films are formed on the surfaces of the dielectric substrate 12 and the dielectric substrate 13 to be bonded to each other. Center conductor pattern 16
a constitutes a branch circuit which is branched and connected to a conductor pattern for obtaining coupling with the resonators inside the two dielectric filters. In this example, the conductor pattern 17a is connected to the conductor pattern 17a through a through hole formed in the glass layer 18, and the conductor pattern 17a is connected to the antenna terminal 19a.

The conductor pattern 16b is drawn in a strip line form from a conductor film facing the inner conductor of the resonator at the end of the dielectric filter on the transmission side, and is passed through a through hole formed in the glass layer 18 to form the conductor pattern 17b. To form an inductance in this part. This conductor pattern
17b is connected to the input terminal 19t on the transmission side. Similarly, an output terminal 19r on the receiving side connected to the conductor pattern on the bonding surface is also formed.

As described above, the antenna terminal electrode 19a, the transmitting terminal electrode 19t, and the receiving terminal electrode 19r are formed on the open end face from which the conductor pattern 17 is drawn out, and are connected to the conductor pattern on the bonding surface. If these terminal electrodes are formed so as to extend to the surface adjacent to the open end face, the degree of freedom in designing at the time of mounting is increased.

A dielectric substrate 11 having a groove formed therein, a dielectric substrate 12 having conductor patterns 16 and 17 formed thereon, and a dielectric substrate 13
Is bonded by glass or the like as described above. As described above, since the conductor pattern connected to the terminal electrode is drawn out to the end face of the substrate, it is exposed to the end face even after bonding, and is electrically connected to the terminal electrode applied and baked here.

The conductor pattern formed on the bonding surface between the second dielectric substrate and the third dielectric substrate is not limited to the above example, and a conductor pattern for inductance formation or wiring may be formed. The capacitor can be formed via an insulating material as needed. Conductor patterns for inductance are formed on both the second dielectric substrate and the third dielectric substrate, and connected through openings in the glass for bonding, so that the inductance can be increased, making it possible to design circuits. Also becomes easier. In the case of a wiring conductor pattern, cross wiring is possible via a glass layer. The insulating layer serving as an adhesive may be formed of an insulating material other than glass.

[0017]

According to the present invention, a branch circuit, an inductance electrode for coupling between resonators, and the like can be formed by the conductor pattern on the bonding surface of the dielectric substrate, and the number of parts is small and the manufacture is easy. A dielectric duplexer can be realized. And a small and highly reliable dielectric duplexer can be obtained. Design of inductance and impedance becomes easy.

In addition, since the conductor pattern can be confined in the dielectric, it is possible to obtain an effective long line length, facilitate matching of characteristics, and connect various elements integrally. Is also possible.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an embodiment of the present invention.

[Explanation of symbols]

 10: Dielectric block 11, 12, 13: Dielectric substrate 16, 17: Conductive pattern 18: Glass layer 19: Terminal electrode

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Meiji Miyashita 828 Hinohara, Tamagawa-mura, Hiki-gun, Hiki-gun, Saitama

Claims (4)

[Claims] A first dielectric substrate having a plurality of parallel grooves; a second dielectric substrate adhered to the surface of the first dielectric substrate having the grooves formed therein; A third dielectric substrate bonded to a surface of the dielectric substrate opposite to a surface bonded to the first dielectric substrate, wherein a surface of the groove of the first dielectric substrate and a second dielectric substrate are bonded. An inner conductor on a surface of the body substrate facing the concave groove, an outer conductor on an unbonded surface of the first dielectric substrate and the third dielectric substrate, and an end surface on which the concave groove does not open, and an end surface on which the concave groove opens. Two dielectric filters with short-circuit conductors are provided in a dielectric block, and the bonding surfaces of the second dielectric substrate and the third dielectric substrate are bonded with an adhesive made of an insulating material, and formed on the insulating material. The conductor pattern formed on the surface of the second dielectric substrate and the third dielectric substrate was connected through the formed opening. Dielectric duplexer. 2. A first dielectric substrate having a plurality of parallel grooves, a second dielectric substrate adhered to the grooved surface of the first dielectric substrate, and a second dielectric substrate. A third dielectric substrate bonded to a surface of the dielectric substrate opposite to a surface bonded to the first dielectric substrate, wherein a surface of the groove of the first dielectric substrate and a second dielectric substrate are bonded. An inner conductor on a surface of the body substrate facing the concave groove, an outer conductor on an unbonded surface of the first dielectric substrate and the third dielectric substrate, and an end surface on which the concave groove does not open, and an end surface on which the concave groove opens. Two dielectric filters with short-circuit conductors are provided in a dielectric block, and the bonding surfaces of the second dielectric substrate and the third dielectric substrate are bonded with an adhesive made of an insulating material, and formed on the insulating material. The conductor pattern formed on the surface of the second dielectric substrate and the third dielectric substrate is connected through the opening, A dielectric duplexer in which one end of the conductor pattern is connected to the antenna terminal and the other end is branched and coupled to the resonator at the inner end. 3. A first dielectric substrate having a plurality of parallel grooves, a second dielectric substrate adhered to the grooved surface of the first dielectric substrate, and a second dielectric substrate. A third dielectric substrate bonded to a surface of the dielectric substrate opposite to a surface bonded to the first dielectric substrate, wherein a surface of the groove of the first dielectric substrate and a second dielectric substrate are bonded. An inner conductor on a surface of the body substrate facing the concave groove, an outer conductor on an unbonded surface of the first dielectric substrate and the third dielectric substrate, and an end surface on which the concave groove does not open, and an end surface on which the concave groove opens. Two dielectric filters with short-circuit conductors are provided in a dielectric block, and the bonding surfaces of the second dielectric substrate and the third dielectric substrate are bonded with an adhesive made of an insulating material, and formed on the insulating material. The conductor pattern formed on the surface of the second dielectric substrate and the third dielectric substrate is connected through the opening, A dielectric duplexer in which one end of the conductor pattern is connected to an input / output terminal and the other end is coupled to an outer end resonator. 4. The dielectric duplexer according to claim 1, wherein the insulating material is glass.