JPH10239675A - Manufacturing method of liquid crystal display device - Google Patents

Abstract

(57) [Problem] To provide a method of manufacturing a liquid crystal display device which is thin, bright, and free from color shift. A release layer (11) which is separated by irradiation of illumination light is formed on a heat-resistant substrate (10) having heat resistance, and a thin film element layer (12) provided with a thin film element is formed on the release layer (11). In response to this, irradiation light is irradiated from the heat resistant substrate 10 side to cause peeling of the peeling layer 11, and the peeled thin film element layer 12 is formed into a first thinner than the heat resistant substrate 10.
A liquid crystal device is formed by adhering a guest-host liquid crystal layer between the first transparent substrate 14 and the second transparent substrate 20 on which no thin film element is provided.
Then, a color liquid crystal display device is manufactured by laminating and bonding a plurality of the guest host liquid crystal devices having different colors.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display device using a liquid crystal, and more particularly to a method of manufacturing a color liquid crystal display device which is thin, bright, and does not cause color shift.

[0002]

2. Description of the Related Art Various systems have been proposed in the past in order to provide a reflection type color liquid crystal display device capable of displaying a bright color image with low power consumption. Among them, literature (SID
96DIGEST, pp. 103-106) is expected to be the most excellent color display image quality (brightness, color purity, contrast ratio) because it does not use a polarizing plate or a color filter layer for darkening the display surface. ing.

In the above method, cyan, magenta,
Prepare a plurality of guest-host liquid crystal cells each containing a dichroic dye showing each primary color of yellow, stack these liquid crystal cells, and observe the pixels corresponding to each primary color in all cells when observed from a vertical direction Are aligned and bonded so that they overlap. Thereafter, if each guest-host liquid crystal cell is driven independently, the three primary colors are combined and color display is performed.

[0004]

However, when manufacturing a display device using guest-host liquid crystal cells of cyan, magenta, and yellow colors, when each cell is overlapped to constitute a liquid crystal display device for color display, the color shift is reduced. Could have occurred.

In order to form an element such as a TFT on a transparent electrode substrate constituting a guest-host liquid crystal cell, the substrate must be 400
It must be placed in a high temperature atmosphere of at least ℃. To withstand this high temperature, it is necessary to use thick glass for the substrate. For this reason, when a guest-host liquid crystal cell of each primary color using this thick glass substrate is overlaid to manufacture a liquid crystal display device for color display, the glass substrate enters between the guest-host liquid crystal layers, so that the distance between the guest-host liquid crystal layers is reduced. Becomes larger.

When the liquid crystal display device for color display is observed from a completely vertical direction, the pixels corresponding to the respective primary colors appear to be overlapped, so that an appropriate color display is performed. However, when observed from a slightly deviated direction, the positions where the primary colors can be seen also differ. For this reason, a color shift occurs in the color display.

In order to provide a high quality color display,
It is necessary to manufacture a display device in which color shift does not occur depending on the viewing angle.

In addition, as long as an element such as a TFT is formed using a glass substrate, the driving substrate provided with the element always has a constant thickness. This hinders the manufacture of light, thin film display devices.

Therefore, the present invention provides a thin, bright,
An object of the present invention is to provide a method for manufacturing a color liquid crystal display device in which color shift does not occur.

[0010]

According to a first aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, comprising the steps of: (a) forming a release layer on a heat-resistant substrate having heat resistance, which is separated by irradiation of illumination light; A forming step, (b) a thin film element forming step of forming a thin film element layer provided with a thin film element on the peeling layer formed by the peeling layer forming step, and (c) a thin film formed by the thin film element forming step Element layer, a thin substrate forming step of forming a thin substrate thinner than the heat-resistant substrate, (d)
Irradiation separation step of irradiating the release layer with irradiation light from the heat-resistant substrate side to cause the release layer to separate, and separating the thin film element layer on which the thin substrate is formed, (e)
A liquid crystal device manufacturing step of manufacturing a guest-host liquid crystal device including a dichroic dye driven by the thin film element of the separated thin film element layer.

According to a second aspect of the present invention, in the method of manufacturing a liquid crystal display device, the thin film element forming step includes a step of forming the thin film element itself and a step of forming a resin layer on the thin film element.

According to a third aspect of the present invention, in the liquid crystal display device manufacturing method, the liquid crystal device manufacturing step includes the steps of: (a) bonding the thin film element layer on which the thin substrate is formed and the transparent substrate with a predetermined gap. And (b) filling a gap between the thin film element layer and the transparent substrate bonded in the bonding step with a liquid mixture of a liquid crystal and a dichroic dye.

According to a fourth aspect of the present invention, in the method of manufacturing a liquid crystal display device, guest host liquid crystal devices corresponding to a plurality of primary colors are manufactured by the liquid crystal device manufacturing process, and the plurality of guest host liquid crystal devices are further bonded. And a liquid crystal display device manufacturing process for manufacturing a liquid crystal display device.

According to the above invention, when a thin film element layer requiring a high forming temperature is formed, the thin film element is formed on a heat-resistant substrate, and then is replaced with a transparent substrate having a smaller thickness than the heat-resistant substrate. . Between this thin transparent substrate and another transparent substrate, a guest-host liquid crystal layer composed of a liquid crystal and a dichroic dye for each primary color such as cyan, magenta, or yellow is sandwiched and bonded. A thin guest-host liquid crystal device can be manufactured for each primary color.

In this way, when the guest-host liquid crystal devices of the respective primary colors are further laminated to form a liquid crystal display device for color display, the devices are separated by a thinner transparent substrate. Even if the liquid crystal display device is observed from an oblique direction, no color shift occurs because the distance between the devices is short. In addition, since the transparent substrate can be made thinner, it can be made thinner and lighter, and the amount of reflected light can be increased, and a bright color display can be performed.

[0016]

Next, a preferred embodiment of the present invention will be described with reference to the drawings.

<Embodiment> FIGS. 1 to 3 show sectional views of the layer structure in each step of the manufacturing method of this embodiment. To summarize the manufacturing method of the present embodiment, first, after a transistor thin film layer is formed on a heat-resistant substrate via a release layer, the release layer is separated to separate the transistor thin film layer. The liquid crystal display device is formed after the substrate is replaced with a thin transparent substrate. Hereinafter, this will be described in detail.

Release Layer Forming Step (FIG. 1A): First, a release layer 11 is formed on a glass substrate 10. In order to form a thin film transistor which is a thin film element, a high-temperature atmosphere of at least 400 ° C. is required. It is desired that the substrate 10 as a base on which the transistor is formed be made of a material that can withstand such high temperatures, does not undergo physical and chemical denaturation, and has some degree of mechanical strength as well as deformation. The light transmittance is preferably 10% or more. This is because if the light transmittance is too low, the attenuation of the irradiation light described later increases. However, since this substrate is reused after separation, there is no need to consider the price. Examples of such a material include quartz glass, soda glass, heat-resistant glass and the like. The substrate thickness is 0.1 mm to 5 mm.
mm, preferably about 0.5 mm to 1.5 mm. If the substrate is too thick, the attenuation of irradiation light for peeling increases, and if it is too thin, sufficient mechanical strength cannot be maintained.

The peeling layer causes peeling in the layer or at the interface by irradiation light such as laser light. That is, by irradiating light of a certain intensity, the bonding force between atoms or molecules of a constituent substance is lost or reduced, ablation or the like is caused, and peeling is caused. The following can be considered as the composition of the release layer 11.

1) Amorphous silicon (a-Si) containing about 2 to 10 at% of hydrogen 2) Silicon oxide or silicate compound, titanium oxide or titanate compound, zirconium oxide or zirconate compound, lanthanum oxide or lanthanic acid Various oxide ceramics such as compounds, or dielectrics or semiconductors 3) Titanium zirconate (PZT), PLZT, PLLZ
Ceramics or dielectrics such as T and PBZT 4) Nitride ceramics such as silicon nitride, aluminum nitride and titanium nitride 5) -CH2-, -CO-, -CONH-, -NH-
6) Al, Li, Ti, Mn, In, Sn, Y, L
The thickness of a, Ce, Nd, Pr, Gd or Sm, or the alloy release layer 11 containing at least one of them is usually about 1 nm to 10 μm, more preferably about 40 nm to 1 μm. If the film thickness is too thin, the uniformity of the formed film thickness is lost, and if the film thickness is too thick, it is necessary to increase the power of irradiation light required for peeling, or the peeling layer after peeling. This is because it takes time to remove the residue.

The release layer 11 is preferably formed by a CVD method, in particular, a low pressure CVD or a plasma CVD. In addition, MOCVD, ECR-CVD, evaporation, molecular beam evaporation, sputtering, ion plating,
Various vapor deposition methods such as PVD method, electroplating, immersion plating, electroless plating, Langmuir-Blodgett method,
It can be applied to coating methods such as spin coating, spray coating and roll coating, various printing methods, transfer methods, ink jet methods, powder jet methods and the like. Two or more of these methods may be combined.

Although not shown in FIGS. 1 to 3, an insulating layer such as silicon oxide may be provided on the release layer 11.
The insulating layer performs heat insulation when the irradiation light is irradiated to the peeling layer 11.

Formation of a thin film element (transistor thin film) layer (FIG. 1)
(b)): After forming the release layer 11, the thin film transistor (TF)
T) 121 is formed. One thin film transistor is formed for each pixel. The drain is a transparent electrode 12
2 are formed. One pixel element 120 is constituted by one thin film transistor 121 and one transparent electrode 122.
The layer on which the pixel element 120 is formed is referred to as the transistor thin film layer 12.
And Since the glass substrate 10 has sufficient heat resistance, a transistor thin film can be formed at a high temperature.

Note that instead of the thin film transistor, MI
An active element sufficient to drive a liquid crystal display device such as M can be applied. The thin film element is a heat-resistant glass substrate 10
Since it is formed above, any element that can be formed by a normal film forming method can be applied. The transparent electrode 122 is required to be a material having a certain degree of light transmittance.
Such a material includes an ITO film. The film thickness is
In order to ensure conductivity sufficient for display driving without impairing light transmittance, for example, it is set to about 900 °.

The transparent electrode 122 is formed by using a known pattern forming technique such as resist coating, masking, exposure, development and etching.

Resin Layer Forming Step (FIG. 1C): A resin layer 13 is formed on the transistor thin film layer 12. This resin layer is used for absorbing the irregularities of the transistor thin film layer 12 and for making the surface of the plastic substrate 14 capable of bonding, in order to facilitate the bonding of the plastic substrate 14. As the composition of the resin layer 13, the transistor thin film layer is already provided, and the resin layer 13 is not exposed to a high temperature.
Any material may be used as long as it has insulating properties and good light transmittance. For example, a 2P monomer resin or the like can be used. Further, if a resin material having hot-melt adhesiveness is used as the resin layer 13, the next step of bonding the plastic substrate becomes easier.

Plastic substrate bonding step (FIG. 1 (d)):
A plastic substrate 14 is attached to the surface of the resin layer 13. This substrate 14 is one of the substrates that sandwiches the guest host liquid crystal layer of the display device. Since the formation of the transistor thin film layer 12 has already been completed, a substrate as thin as possible can be used. That is, there is a problem in terms of composition and mechanical strength in forming a transistor thin film layer, and a substrate that cannot be used can be used here. In addition, instead of a plastic substrate,
Even if the composition is glass or the like, it can be bonded to a material having a thickness as small as possible, or a flexible plastic film or the like. For example, a plastic film has a heat resistance of about 200 degrees, but can be used satisfactorily.

This substrate must of course have good light transmittance. The film thickness is 5 μm to 0.4
mm is preferable. When the film thickness is too large, the light transmittance is deteriorated, and it is impossible to prevent the color shift as the object of the present invention. When the film thickness is too thin, the minimum mechanical strength required in the manufacturing process cannot be secured. Because.

Peeling Step (FIG. 2A): After the plastic substrate 14 is bonded, the glass substrate 10 is irradiated with a laser beam 40 or the like. The laser light 40 passes through the substrate 10 and irradiates the peeling layer 11. Thus, the bonding force between atoms or molecules at the interface with the substrate or in the layer thereof is reduced or eliminated. At the time of irradiation with the laser beam 40, it is presumed that the composition of the peeling layer 11 undergoes ablation, and that a phase change such as release of gas inside the peeling layer, melting and evaporation by the laser beam 40 has occurred.

As the irradiation light, any light may be used as long as it can cause the peeling layer 11 to peel efficiently. In particular, the wavelength of 248 nm or 30
Excimer laser of 8 nm
r) Preferably, light is used. The energy density of the irradiated laser light is 10 in the case of the excimer laser light.
~ 5000mJ / cm2, irradiation time is 1 ~ 1000ns
ec, preferably about 10 to 100 nsec. If the energy density is too low or too short, sufficient ablation cannot be generated, and if the energy density is too high or the irradiation time is too long, not only the peeling layer but also the transistor thin film layer 12 is adversely affected. Or destroy it.

Incidentally, in order to irradiate the entire area of the peeling layer 11, the irradiation light may be irradiated a plurality of times or may be irradiated more than once to the same location. Further, the type, wavelength, and the like of the laser beam in the irradiation light may be different.

Since the residue of the peeling layer 11 adheres to the glass substrate 10 and the transistor thin film layer 12 separated by the peeling of the peeling layer 11, it is removed by a method such as cleaning, etching, ashing, or polishing. . The separated glass substrate 10 is recycled.

Substrate bonding (adhesion) step (FIG. 2B):
The plastic substrate 14 bonded to the transistor thin film layer 12 is bonded to another plastic substrate 20 provided with the transparent electrode 21 with a predetermined gap. For bonding, an adhesive such as an epoxy resin is used.
This adhesive not only bonds the two substrates but also maintains the thickness of the guest-host liquid crystal layer to be formed later, as well as moisture, air bubbles,
In addition, the peripheral seal portion 33 serves to prevent various contaminants from entering.

Guest-host liquid crystal injection step (FIG. 2)
(C)): A guest-host liquid crystal for each primary color, which is a mixture of a dichroic dye such as cyan, magenta, and yellow, and a liquid crystal material, is prepared, and is provided in the gap between the two substrates bonded in the bonding step. The guest-host liquid crystal 34A is injected to form a guest-host liquid crystal device of each color. Guest host liquid crystal device bonding process (Fig. 3 (a) (b)):
By the above steps, the magenta liquid crystal device 61, the cyan liquid crystal device 62, and the yellow liquid crystal device 63
After forming, these are bonded together. This bonding is performed using an adhesive 70 such as an acrylic resin or an epoxy resin.
Performed by At the time of bonding, when viewed from a direction perpendicular to the layer surface of the liquid crystal device, the bonding is performed with care so that the pixel elements 120 provided for each liquid crystal device and having the same address are arranged on the same straight line. Thereafter, a white reflector 100 is placed on the lowermost surface of the bonded liquid crystal device.
(A white paper, a white cloth, magnesium oxide, aluminum oxide, or a light scattering plate is preferably disposed on a mirror surface made of aluminum, silver, or the like).

Through the above steps, a liquid crystal display device 60 as shown in FIG. 3B is completed. The transparent electrode 21 of each liquid crystal device is electrically connected to the liquid crystal display device 60 as a common electrode, and the thin film transistor 1 of each liquid crystal device is connected.
If the control output terminals of each primary color of each pixel are connected to the gate 21, liquid crystal display can be performed.

FIG. 4 is a cross-sectional view of a guest-host liquid crystal device manufactured by the manufacturing method of the present embodiment, and the display principle will be described. Regarding the common members, the same reference numerals as those in the previous drawings are used. Reference numeral 14 denotes a thin substrate formed by the above-described method and having a transparent electrode 122 and a thin film transistor 121 on the inner surface. A plastic substrate 20 also has a transparent electrode 21 on the inner surface. 3
Reference numeral 4A denotes a guest host liquid crystal layer of cyan, magenta, yellow, or the like, which is a mixture containing at least liquid crystal molecules 98 and a dichroic dye 99. Here, the region 55 is a region where no voltage (V0) (that is, the potential difference is zero), and the region 54 is a region where the voltage (V1) is applied.
First, in the non-voltage region 55, most of the liquid crystal molecules 98 except for the vicinity of the substrate have a helical structure, and the major axes of the liquid crystal molecules are oriented substantially parallel to the surfaces of the substrates 14 and 20. Accordingly, the dichroic dye 99 also takes a substantially parallel orientation according to the guest-host effect. As a result, the incident light 51 is absorbed by the dichroic dye 99. Here, the dichroic dye 9
When 9 is cyan, only the light having the wavelength of cyan is transmitted, and the other light is absorbed. The transmitted cyan wavelength light is reflected by the white reflector 100 disposed below and returns to the front surface. Accordingly, a cyan appearance is obtained in the area 55. Similarly, when the dichroic dye 99 is yellow, an appearance of yellow is obtained, and when the dichroic dye 99 is magenta, an appearance of magenta is obtained.

On the other hand, in the voltage application area 54, the voltage V1 is applied. Here, the dielectric anisotropy of the liquid crystal molecules 98 (△
If ε) is made positive, the liquid crystal molecules 98 are
Orientation is substantially perpendicular to the 20 plane. Accordingly, the dichroic dye 99 is also oriented substantially vertically by the guest-host effect, so that the light absorption of the incident light 50 is almost lost and the incident light 5
0 directly reaches the white reflector 100, is reflected there, and returns to the front surface, so that a substantially white appearance is obtained. In this manner, by changing the direction of the dichroic dye depending on the presence or absence of a voltage, the color of the dye and white can be switched and displayed.

The above is the principle of operation of the guest-host liquid crystal device. For further details, such as the alignment of liquid crystal molecules near the substrate surface and the method of helical liquid crystal molecule alignment in the middle, refer to the literature (Liquid Crystal Device Handbook, Japan). Japan Society for the Promotion of Science, 142nd Committee, published by Nikkan Kogyo Shimbun, p.315
329).

Although the guest-host liquid crystal layer 34A is made of a mixture of the liquid crystal material 98 and the dichroic dye 99 here, about 0.1 to 3% so that the liquid crystal molecules take a helical orientation when no voltage is applied. Cholesteric liquid crystal should be added. Furthermore, an appropriate amount of a monomer of the photocurable resin is also added,
If the light-cured material after the injection of the guest host liquid crystal is used as the guest host liquid crystal layer 34A, the display drive voltage can be reduced, and the effect of suppressing the occurrence of the hysteresis phenomenon at the time of switching between 0N and OFF is also obtained.

FIG. 5 is a sectional view for explaining the principle of operation of a reflection type color liquid crystal display device in which guest-host liquid crystal devices of respective colors manufactured by the manufacturing method of this embodiment are stacked.

In the figure, two pixel elements 120 of each liquid crystal device in the liquid crystal display device 60 are enlarged. Transparent electrode 122 of each liquid crystal device in region 54
A predetermined voltage V1 is applied between the transparent electrodes 21. In the voltage application region 54, the liquid crystal molecules are aligned substantially perpendicular to the substrate surface as described above. For this reason, the dichroic dye is also oriented substantially vertically. Therefore, the incident light 58 passes through all the liquid crystal devices without being absorbed by the dichroic dye, reaches the white reflector 100 on the lowermost surface, is reflected there, and becomes the reflected light 56 again on the front surface. Come back. Therefore, the display surface of the liquid crystal display device 60 looks bright (white) in this region 54.

On the other hand, the potential difference between the transparent electrode 122 and the transparent electrode 21 of each liquid crystal device in the region 55 is set to no voltage V0 (that is, the potential difference is zero). Since no voltage is applied, the liquid crystal molecules and the dichroic dye have a helical structure as described above, and are oriented substantially horizontally on the layer surface. For this reason, the incident light 57 absorbs the wavelength light corresponding to each dye by the dichroic dye of each liquid crystal device. (The green light 53 is absorbed by the guest host liquid crystal device 61 containing the magenta dichroic dye, and the red light 52 is absorbed by the guest host liquid crystal device 6 containing the cyan dichroic dye.
2 and the blue light 51 is absorbed by the guest-host liquid crystal device 63 containing a yellow dichroic dye. Therefore, all the primary color lights (51, 52, 53) are absorbed, and in this state, the display surface of the liquid crystal display device 60 looks dark (black).

Magenta guest host liquid crystal device 6
When only 1 is set to no-voltage V0 and a voltage V1 is applied to the other guest-host liquid crystal devices 62 and 63, only the magenta color is transmitted and the other color wavelength light is absorbed, so that the display appearance of the magenta color is exhibited. Similarly, when only the cyan guest-host liquid crystal device 62 is set to the non-voltage V0 and the voltage V1 is applied to the other guest-host liquid crystal devices 61 and 63, only the cyan color is transmitted and other color wavelength light is absorbed. Therefore, it exhibits a cyan display appearance. Similarly, only the yellow guest host liquid crystal device 63 is set to no voltage V0,
The voltage V1 is applied to the other guest host liquid crystal devices 61 and 62.
Is applied, only the yellow color is transmitted, and light of other color wavelengths is absorbed, so that a yellow display appearance is exhibited. That is, if the presence or absence of the drive voltage is controlled for each liquid crystal device, color display can be performed.

At this time, since the thickness of the substrate of each liquid crystal device constituting the liquid crystal display device 60 is made thinner than before, the film thickness of the entire liquid crystal display device becomes thinner and the liquid crystal layer between the guest host liquid crystal layers is formed. Since the substrate is thin, the distance between the layers is narrow. For this reason, not only is it bright, but even when observed from a direction slightly deviated from the vertical direction,
Color shift is less likely to occur. When actually used as a display device, color shift hardly occurs even around the screen where the viewing angle is shallow.

As described above, according to the present embodiment,
After a transistor thin film is formed on a glass substrate, it is peeled off, a thin plastic substrate is bonded instead, and a guest-host liquid crystal device for each color is stacked using this to manufacture a liquid crystal display device. It is possible to provide a color liquid crystal display device that is bright and hardly causes color shift.

<Modifications> The present invention can be applied variously without being limited to the above embodiment. For example, in the above embodiment, the liquid crystal display device using the guest host liquid crystal has been described, but the present invention can be applied to other liquid crystal display devices.

That is, according to the present invention, a thin-film element is formed on a heat-resistant substrate and then peeled off to form a thin substrate having a small thickness. Therefore, a driving element manufactured by another manufacturing method is provided. It is possible to manufacture a drive substrate having a smaller thickness as compared with a substrate that has been thinned. Therefore, if a liquid crystal display device having a known liquid crystal display mechanism driven by the driving substrate is manufactured, a lighter and thinner liquid crystal display device than the conventional one can be provided.

In particular, according to the present invention, it is possible to provide a method of manufacturing a liquid crystal display device which is effective in manufacturing a film display device.

[0049]

According to the method of manufacturing a liquid crystal display device of the present invention, a release layer is formed on a heat-resistant substrate having heat resistance, and a thin-film element layer provided with a thin-film element is formed on the release layer. After forming a thinner and thinner substrate on the thin-film element layer, the irradiation layer is irradiated from the heat-resistant substrate side to cause peeling of the peeling layer. Can be used as a base for the thin film element layer.

Therefore, a liquid crystal display device thinner than a conventional display device can be manufactured. In addition, the color liquid crystal display device which is bright and in particular, does not cause a color shift of a color liquid crystal display device in which a plurality of primary color liquid crystal devices are overlapped.

In the method of manufacturing a liquid crystal display device according to the present invention, since a resin layer is formed on a thin film element, it is easy to bond the thin film element to a thin film substrate after the thin film element is formed, and a liquid crystal display device thinner than the conventional one is manufactured. it can. This is advantageous when manufacturing a liquid crystal display device in the form of a film.

As described above, according to the method of manufacturing a liquid crystal display device of the present invention, a color liquid crystal display device is manufactured by laminating a plurality of thin guest guest liquid crystal devices of primary colors.
As a whole, a liquid crystal display device thinner than the conventional one can be manufactured. As a result, a color liquid crystal display device that is thin, light, bright, and in particular can provide a beautiful color display image that does not cause color shift can be realized.

[Brief description of the drawings]

FIG. 1 is a sectional view (first half) of a manufacturing process of a liquid crystal device according to an embodiment.

FIG. 2 is a sectional view (second half) of a manufacturing process of the liquid crystal device according to the embodiment.

FIG. 3 is a cross-sectional view illustrating a manufacturing process of the liquid crystal device according to the embodiment.

FIG. 4 is an explanatory view of the operation principle of the guest-host liquid crystal device of the embodiment.

FIG. 5 is an explanatory view of the operation principle of the liquid crystal display device of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Glass substrate 11 ... Release layer 12 ... Transistor thin film layer (thin film element layer) 13 ... Resin layer 14 ... Plastic substrate (transparent substrate) 20 ... Plastic substrate (transparent substrate) 30: liquid crystal + dichroic dye mixture liquid 34A: guest-host liquid crystal layer

Claims (4)

[Claims] An exfoliation layer forming step of forming an exfoliation layer which is exfoliated by irradiation of illumination light on a heat resistant substrate having heat resistance, and a thin film element is provided on the exfoliation layer formed in the exfoliation layer forming step. A thin film element forming step of forming a thin film element layer, and the thin film element layer formed by the thin film element forming step,
A thin substrate forming step of forming a thin substrate having a thickness smaller than the heat-resistant substrate, and the peeling layer is irradiated with irradiation light from the heat-resistant substrate side to cause peeling of the peeling layer; An irradiation separation step of separating the formed thin film element layer; and a liquid crystal device manufacturing step of manufacturing a guest-host liquid crystal device containing a dichroic dye driven by the thin film element of the separated thin film element layer. A method for manufacturing a liquid crystal display device, comprising: 2. The liquid crystal display device according to claim 1, wherein the thin film element forming step includes a step of forming the thin film element itself and a step of forming a resin layer on the thin film element. Manufacturing method. 3. The method of manufacturing a liquid crystal device according to claim 1, wherein the thin film element layer on which the thin substrate is formed and a transparent substrate are:
A bonding step of bonding at a predetermined gap; and a filling step of filling a gap between the thin-film element layer and the transparent substrate bonded in the bonding step with a liquid mixture of a liquid crystal and a dichroic dye. The method for manufacturing a liquid crystal display device according to claim 1, wherein: 4. A liquid crystal display device in which, in the liquid crystal device forming step, a guest host liquid crystal device corresponding to each of a plurality of primary colors is manufactured, and each of the plurality of guest host liquid crystal devices is bonded to manufacture a liquid crystal display device. The method for manufacturing a liquid crystal display device according to claim 3, further comprising a manufacturing process.