JPH10233415A - Application device for soldering flux for conductive ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an application device for soldering flux for a conductive ball which can apply extremely than flux on an electrode of a work piece. SOLUTION: A mask 14 is provided above a transporting channel 12 of a work piece 11. Flux is sprayed with a sprayer 20 above the mask 14, so that the extremely thin flux is applied on the work piece 11 through an opening part 15 of the mask 14. Then, the flux on the top surface of the mask 14 is wiped with a cleaning tape 35 of a cleaning unit 30. The work piece 11 on which the flux is applied is further transported through the transporting channel 12, and a conductive ball is mounted on an electrode with a suction head, and then it is sent to a heating furnace, and the conductive ball is soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying a flux for soldering conductive balls used in a process of manufacturing electronic parts with bumps.

[0002]

2. Description of the Related Art A flip chip or a BGA (Ball G
2. Description of the Related Art As a method for manufacturing an electronic component with a bump such as a lid array, a method using a conductive ball such as a solder ball is known. In this method, after a flux is applied on an electrode of a work such as a chip or a substrate, a conductive ball is mounted on the electrode and heated in a heating furnace to solder the conductive ball on the electrode. . Conventionally, a screen printing method or a transfer pin method has been used as a method of applying a flux on an electrode of a work.

FIG. 5 is a side view of a chip on which a conventional conductive ball is mounted. The electrode 2 is formed on the upper surface of the chip 1. 3 is a resist film. After the flux 4 is applied to the electrodes 2 by a screen printing method, the conductive balls 5 are mounted.

[0004]

Recently, conductive balls 5 have been used.
Are smaller in size, and some have a diameter of about 0.1 mm. When the conductive balls 5 having such a small size are mounted, it is necessary to reduce the amount of application of the flux 4 and apply the flux 4 to the electrode 2 extremely thinly.

However, it is difficult to apply the flux on the electrode 2 very thinly by the conventional flux application method. As a result, there is a problem that the conductive balls 5 flow in the flux 4 when heated in a heating furnace or the like, and are easily separated from the electrodes 2. In FIG. 5, a conductive ball 5 indicated by a chain line flows in the direction of the arrow and is separated from the electrode 2.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an apparatus for applying a flux for soldering a conductive ball, which can apply a very thin flux on an electrode of a work.

[0007]

SUMMARY OF THE INVENTION According to the present invention, there is provided an apparatus for applying a flux for soldering a conductive ball, comprising a work transfer path, a mask disposed above the transfer path, and an opening formed in the mask. A sprayer was provided above the opening to spray the flux from the nozzle in a mist and applied to the work through the opening, and a cleaning unit to wipe off the flux attached to the upper surface of the mask was provided.

[0008]

According to the present invention having the above-described structure, a flux can be ejected from a sprayer to apply a very thin coating on an electrode of a work. The flux ejected from the sprayer adheres to the upper surface of the mask, but the attached flux is wiped off by the cleaning unit to keep the mask clean and prevent the flux from dripping onto the work from the opening. .

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a conductive ball mounting device according to an embodiment of the present invention, FIG. 2 is a side view of the flux coating device, FIG. 3 is a cross-sectional view of a sprayer of the flux coating device, and FIG. FIG. 2 is a side view of a work on which the conductive ball is mounted.

First, the overall structure of the conductive ball mounting device will be described with reference to FIG. Reference numeral 11 denotes a work, which is conveyed rightward along a conveyance path 12. Reference numeral 13 denotes a frame that holds the transport path 12, and A denotes an application area on the upper surface of the work 11 where the flux is applied. A mask 14 is provided above the transport path 12 on the upstream side. At the center of the mask 14, a horizontally long opening 15 is opened in a direction orthogonal to the direction of transport of the work 11, and a sprayer 20 is disposed above the opening 15 (see also FIG. 2). A work detection sensor 16 is provided in front of the mask 14. When the sensor 16 detects the work 11, a detection signal is sent to the control unit 17, and the control unit 17 outputs a drive command to the sprayer 20.

A cleaning unit 30 is provided beside the mask 14. Next, the cleaning unit 30 will be described. In FIG. 1 and FIG.
Denotes a frame, and guide rollers 32, 3
A grounding roller 34 is mounted on the front of the vehicle. A cleaning tape 35 is adjusted between the guide rollers 32 and 33 and the ground roller 34. The cleaning unit 30 performs forward and backward operations and up and down operations by a movable table (not shown). In FIG. 2, arrows a, b, c, and d indicate the forward movement and the vertical movement.
The trajectory of the ground roller 34 moving on the mask 14 is shown.

Next, the structure of the atomizer 20 will be described with reference to FIG. Reference numeral 21 denotes a main body case, which is formed by detachably connecting an upper case 21a and a lower case 21b with a screw portion 22. A nozzle 23 is provided upright at the center of the main body case 21. The lower end 23a of the nozzle 23 is a lower case 21b.
Extends downward.

A flange 24 is formed below the nozzle 23, and the flange 24 is grounded on a seal 25 provided on the bottom surface of the lower case 21b. The nozzle 23 is screwed to the block 26 with a screw portion 27. Collar 24
Between the block and the block 26, an ultrasonic transducer 28 is provided. The ultrasonic transducer 28 is connected to a drive circuit 39 by a cord 29. Therefore, when the ultrasonic vibrator 28 is driven, the nozzle 23 ultrasonically vibrates, and the flux sent to the nozzle 23 is atomized and the lower end 23 a
From the mist (see arrow A).

Next, the structure of the mounting portion of the conductive ball will be described with reference to FIG. Reference numeral 40 denotes a suction head, which is held on a moving table 41. On the lower surface of the suction head 40, a large number of suction holes for vacuum-sucking the conductive balls are formed. A container 42 is provided on the side of the transport path 12, and a large amount of conductive balls 43 are stored in the container 42. The suction head 40 is moved above the container 42, and is moved up and down to pick up the conductive ball 43 by vacuum suction in the suction hole on the lower surface thereof. Next, the suction head 40 moves above the work 11, and performs vertical movement there again to mount the conductive balls 43 on the electrodes of the work 11. 4, reference numeral 11a denotes an electrode on the upper surface of the work 11, reference numeral 18 denotes a resist film, and reference numeral 19 denotes a flux applied by the sprayer 20. In FIG. 1, reference numeral 44 denotes a work detection sensor provided in the transport path 12, and reference numeral 45 denotes a cylinder serving as a stopper for stopping the work 11 at a position where the conductive balls 43 are mounted.

This conductive ball mounting apparatus has the above-described configuration, and the entire operation will be described next. In FIG. 1, a workpiece 11 is transported rightward along a transport path 12. When the sensor 16 detects the work 11, the sprayer 20 starts driving, and sprays the flux 19 from the nozzle 23 in a mist state to apply the flux 19 to the work 11. Then, when the work 11 passes below the opening 15, the sprayer 20 becomes the flux 19
Is stopped, and the process waits until the next work 11 is conveyed. Thus, the flux 19 is applied to the application area A on the upper surface of the work 11.

Next, the work 11 is conveyed rightward and hits the rod of the cylinder 45 and stops. Then, the suction head 40 mounts the conductive balls 43 stored in the container 42 on the electrodes 11a of the work 11 (FIG. 4). Next, work 1
1 is sent to a heating furnace (not shown) and is subjected to a heat treatment, so that the conductive balls 43 are soldered on the electrodes 11a. in this case,
Since the flux 19 is applied to the work 11 very thinly by the sprayer 20, the conductive ball 43 does not flow and separate from the electrode 11a, and is securely soldered on the electrode 11a.

When the application of the flux by the sprayer 20 is completed and the work 11 passes below the mask 14, the cleaning unit 30 in FIG.
Then, the cleaning unit 30 moves to the position above the cleaning tape 35 and wipes off the flux 19 adhered to the upper surface of the mask 14 with the cleaning tape 35. Thereafter, the cleaning unit 30 retreats to the position shown in FIG. 2 and stands by for the next cleaning. Note that the mask 14 prevents the flux 19 ejected from the atomizer 20 from scattering around. In FIG. 1, by making the width of the opening 15 in the longitudinal direction equal to the width of the flux application area A, the flux is applied to the predetermined application area A while the workpiece 11 is continuously transported to the right. it can. If the flux on the mask 14 is not wiped off with the cleaning tape 35, the flux
5 falls onto the work 11 from the edge.

[0018]

According to the present invention, it is possible to spray a flux from a sprayer to apply a very thin coating on an electrode of a work, so that a small-sized conductive ball flows through the flux and separates from the electrode. Can be resolved. Further, the use of the mask prevents the flux spouted from the sprayer from scattering to the surroundings and contaminating the surroundings. The flux ejected from the sprayer adheres to the upper surface of the mask, but the attached flux is wiped off by the cleaning unit to keep the mask clean and prevent the flux from dripping onto the work from the opening. .

[Brief description of the drawings]

FIG. 1 is a plan view of a conductive ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of a flux coating device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a sprayer of the flux application device according to the embodiment of the present invention.

FIG. 4 is a side view of a work on which conductive balls according to one embodiment of the present invention are mounted.

FIG. 5 is a side view of a conventional chip on which conductive balls are mounted.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Work 11a Electrode 12 Transport path 14 Mask 15 Opening 19 Flux 20 Nebulizer 23 Nozzle 28 Ultrasonic vibrator 30 Cleaning unit 35 Cleaning tape 40 Suction head 43 Conductive ball

Claims (1)

[Claims] 1. A work transfer path, a mask disposed above the transfer path, and a nozzle which is disposed above an opening formed in the mask and ejects a flux from a nozzle in a mist form. And a cleaning unit for wiping off the flux adhering to the upper surface of the mask.