JPH10233315A - Surface mount coil and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase inductance of a surface mount coil. SOLUTION: A surface mount coil is comprised of a coil substrate 1 made of insulating material or semiconductor material, a chip coil 8 provided with a multilayer coil 5 which is formed on the coil substrate 1 through intermediate layers 3a, 3b and 9, and has thin-film coil conductors 2a and 2b which are wound around the magnetic core 9 made of film magnetic material and a mounting substrate 10 provided with a solder electrode 11a on the underside or the side of a substrate of insulating material, connecting terminal means 12a and 12b such as connecting electrode or pad on the top and leads 13a and 13b for connecting the connecting terminal means 12a and 12b and the solder electrode 11a. The chip coil 8 is placed on the mounting substrate 10. The multilayer coil 5 is electrically connected to the connecting terminal means 12a and 12b. The chip coil 8 is coated with molding material formed on the mounting substrate 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-shaped coil unit having a thin-film coil used for a high-frequency circuit or a transformer, and more particularly to a surface-mount type coil unit.

[0002]

2. Description of the Related Art Conventionally, as a high frequency coil used for a chip inductor or a transformer, a chip coil having a thin film coil formed by laminating a film coil conductor on a coil substrate via an insulating layer is known. For example, JP-A-5-823
No. 49 is known. And
With respect to such a chip-shaped coil, no special means is disclosed as a means for connecting to other members in an electronic circuit such as a high-frequency circuit. Therefore, it is difficult to manufacture a circuit using such a coil by applying a surface mounting method suitable for mass production.

On the other hand, as a film coil suitable for surface mounting, those having the configurations shown in FIGS. 15 and 16 are conventionally known. FIG. 15 is a perspective view showing a structure of a surface mount type coil in which a planar coil is formed on a planar surface of an insulating substrate, and FIG. 16 is a diagram in which a three-dimensional coil is formed on a cylindrical surface of an insulating base member. FIG. 3 is a perspective view showing a surface-mounted coil formed. In the surface-mounted coil shown in FIG. 15, both ends of a spiral coil electrode 82 formed on the upper surface of the insulating substrate 80 by printing or other known techniques are formed by wiring 83 formed by a known wiring technique. It is connected to a solder electrode 84 provided on the back surface of the insulating substrate 80. Next, in the surface mount type coil shown in FIG.
6 and a cylindrical coil forming portion 87, the screw-shaped separation band 88 is removed by laser processing from the conductive film formed on the cylindrical surface of the coil forming portion, and the three-dimensional coil 89 is formed on the cylindrical surface. Are formed, and both ends of the three-dimensional coil are connected by wires 83 to solder electrodes 84 provided on the lower surface of the mounting portion.

[0004] The surface mount type coil shown in FIG.
6 can also be easily mounted by placing it on the motherboard and soldering the solder electrodes to the corresponding mounting electrodes on the motherboard. However, in the case of the surface mount type coil shown in FIG. 16, the number of turns of the planar coil could not be increased due to the single layer and the problem of accuracy of coil formation such as printing, and the upper limit of the number of turns was small. Also, in the case of the surface mount type coil shown in FIG. 16, the upper limit of the number of windings was similarly small due to restrictions on the accuracy of laser processing. Therefore, in either case, the inductance is not sufficiently large, and it has been difficult to sufficiently fulfill a mechanism as an inductor or a transformer used in a high-frequency circuit or the like.

[0005]

As described above, in the circuit member using the conventional film-shaped coil, the number of windings is not sufficient for the surface mount type, and the above-mentioned problem in characteristics is not satisfied. there were. In addition, the chip-shaped coil (the type described in the above publication) has a problem that mounting suitable for mass production cannot be performed by surface mounting as it is. The present invention has been made to solve the problems in the conventional plate-like film coil unit as a problem. One of the objects of the present invention is to increase the number of turns of the film coil provided in the various film coil units including the chip coil in a small plane dimension. Another object of the present invention is to increase the number of coil windings,
An object of the present invention is to provide a surface-mounted film coil having a sufficiently large inductance. Still another object of the present invention is to provide a manufacturing method for manufacturing such a surface-mount type film-shaped coil at a high production efficiency by so-called multiple production.

[0006]

According to a first aspect of the present invention, there is provided a coil substrate made of an insulating material or a semiconductor material and a multi-layered structure formed on the coil substrate with an intervening layer interposed therebetween. In a chip coil provided with a laminated coil having a thin-film coil conductor, the intervening layer has an insulating layer and a film-shaped magnetic core made of a magnetic material, and the thin-film coil conductor is composed of upper and lower two layers. The conductor has a plurality of separation electrodes separated from each other and arranged along a straight line or a curve, and at least a part of each of the upper separation electrodes has an individual separation electrode adjacent to the lower layer at both ends. A coil axis parallel to the plate surface of the coil substrate and the coil axis, which is arranged at a position overlapping with the end of the corresponding separation electrode, is connected to each other vertically through a through hole provided in the insulating layer, and The laminated coil multiple times times wound around Jo magnetic core characterized in that it is configured.

[0007] As a second means for solving the above problems, the present invention provides a laminate comprising a coil substrate made of an insulating material or a semiconductor material and a thin-film coil conductor formed in multiple layers on the coil substrate via an intervening layer. In a chip-shaped coil provided with a coil, the intervening layer is an insulating layer, and the thin-film coil conductor of each layer has a partially open loop shape, and is formed near at least one end of the loop. And the thin film coil conductors which are in a vertical relationship with each other are arranged at positions overlapping each other, are connected to each other vertically through through holes provided in the insulating layer, and at least one of the thin film coil conductors of each layer A film core made of a magnetic material is provided in or near a space surrounded by the coil, and a plurality of times around a coil axis perpendicular to the film core and the plate surface of the coil substrate as a whole. The laminated coil winding is characterized in that it is configured.

As a third means for solving the above-mentioned problems, the present invention provides a laminated substrate having a coil substrate made of an insulating material or a semiconductor material and a thin-film coil conductor formed in multiple layers on the coil substrate via an intervening layer. In a chip-shaped coil provided with a coil, the intervening layer is an insulating layer, and the thin-film coil conductors of each layer are alternately stacked in a left-handed spiral shape and a right-handed spiral shape. At least at one end, the thin-film coil conductors that are in a vertical relationship with each other are arranged at positions overlapping each other, are connected to each other vertically through through holes provided in the insulating layer, and the spiral-shaped thin film of each layer A film core made of a magnetic material is provided in or near a space inside at least one thin film coil conductor among the coil conductors, and the film core and the coil as a whole are provided. The laminated coil multiple times times wound around a vertical coil axis to the plate surface of the substrate is characterized in that it is configured.

As a fourth means for solving the above problems, a surface mount type coil according to the present invention is formed of a coil substrate made of an insulating material or a semiconductor material and a multilayer formed on the coil substrate via an intervening layer. A chip-shaped coil provided with a laminated coil having a thin-film coil conductor wound around a film-shaped magnetic core made of a material, and a solder electrode provided on a lower surface or a side surface of a substrate made of an insulating material, and a connection electrode, a pad, and the like on the upper surface Is provided with a connection board provided with a lead wire for connecting the connection terminal means and the solder electrode, and the chip-shaped coil is disposed on the mounting board, and the laminated coil is provided. Electrically connected to the connection terminal means,
The chip-shaped coil may be covered with a mold member formed on the mounting substrate.

According to a fifth aspect of the present invention, there is provided a surface-mounted coil according to the fourth aspect, wherein the chip-shaped coil is a chip-shaped coil according to any one of the first to third means. It is characterized by being.

According to a sixth aspect of the present invention, there is provided a surface mount type coil according to the fourth or fifth aspect, wherein the surface mount type coil is formed by mounting the chip coil on the mold. A magnetic shield cover that covers the outside of the member is provided.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a surface mount type coil according to any one of the fourth to sixth aspects, wherein a plurality of sets of the solder electrodes are provided. Arranging a plurality of chip-shaped coils on an aggregate substrate of the mounting substrate provided with connection electrodes and connection terminal means, and electrically connecting the laminated coil to the corresponding connection terminal means; Forming a mold member for covering the plurality of chip-shaped coils thereon and dividing the plurality of chip-shaped coils formed on the collective substrate into one or more chip-shaped coils. Features.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

(Embodiment 1) Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a top view showing a chip coil according to a first preferred embodiment of the present invention.
FIG. 2A is a sectional view taken along the line AA in FIG. 1, and FIG.
It is a BB cross section of the figure. In FIG. 1, illustration of a protective film and an insulating layer described later is omitted. 1 and 2, reference numeral 1 denotes a coil substrate made of an insulating material, 2a is oriented on the coil substrate 1 in the longitudinal direction of the drawing in FIG. 1, and a plurality of strip-shaped patterns 2a1 separated from each other are arranged in the longitudinal direction. This is a lower thin-film coil conductor made of a thin film of a conductive material such as a metal formed in a shape that is arranged at equal or substantially equal intervals in a direction orthogonal to (horizontal direction on the paper).

Reference numeral 3a denotes a lower insulating layer formed on the lower thin-film coil conductor 2a. Reference numeral 9 denotes a magnetic material such as pure iron formed on the lower insulating layer 3a. Is a band-shaped film core extending in the lateral direction of the drawing of FIG. 1 at a position overlapping with the central portion of each of these patterns with a width shorter than the length of the pattern, and 3b is an upper portion formed on the film core 9. An insulating layer, 2b being the upper insulating layer 3b
The upper portion made of a thin film of a conductive material such as a metal formed in a shape in which a plurality of scale patterns 2b1 facing obliquely on the paper surface of FIG. 1 and separated from each other are arranged in a horizontal direction on the paper surface in FIG. It is a thin-film coil conductor. Each of the strip patterns 2b1 of the upper thin-film coil conductor 2b has one end overlapping the one end of the strip pattern 2a1 of the lower thin-film coil conductor 2a, and the other end thereof adjacent to the strip pattern 2a1.
It is formed with a size and an arrangement so as to overlap with the other end of a1. As a result, a laminated coil 5 having a flat coil shape wound a plurality of times around the coil core 2c parallel to the plate surface of the coil substrate 1 and the film core 9 as a whole is formed. be able to.

That is, in the lower insulating layer 3a and the upper insulating layer 3b, the strip pattern 2a1 of the lower thin-film coil conductor 2a and the strip pattern 2b of the upper thin-film coil conductor 2b
1 are provided with through-holes 4 in the overlapping portions, and when the upper thin-film coil conductor 2b is formed, the conductive material is filled in the through-holes 4, and in this portion, conduction with the lower thin-film coil conductor 2a is achieved. Is made. On the other hand, the film core 9 is covered with the lower insulating layer 3a and the upper insulating layer 3b at a position away from the through-hole, and electrical continuity with the lower thin-film coil conductor 2a and the upper thin-film coil conductor 2b is established. It has been cut off.
In this way, the coil substrate 1 is sandwiched between the film cores 9.
Is formed a plurality of times around the parallel coil core 2c. The coil substrate 1 has an elongated pattern 2a1 at the end of the lower thin-film coil conductor 2a.
Alternatively, a coil terminal 5a made of a conductive material connected to the end-shaped pattern 2b1 of the upper thin-film coil conductor 2a is formed. The coil terminal 5a may be a bonding pad or the like. An insulating protective film 7 is formed on the upper thin-film coil conductor 2a so as to cover the coil substrate 1 and leave the outer end of the coil terminal 5a and cover the other portions. It is configured.

The chip-shaped coil 8 of the present embodiment having the above-described structure.
A plurality of sets of electrodes, an insulating layer, and a film core are formed on the collective substrate of the coil substrate 1 by known film forming techniques such as vapor deposition, sputtering, and CVD used in the manufacture of an integrated circuit, and photolithography. After forming a plurality of coils by sequentially performing patterning such as patterning, and separating them into individual chip-shaped coils by cutting, notching, or the like, high production efficiency can be realized.

For example, a conductive thin film made of metal or the like is formed on the collective substrate of the coil substrate 1 by vapor deposition, sputtering, or the like, and a plurality of lower thin-film coil conductors 2a and coil terminals 5a are formed by photolithography. Next, vapor deposition or CVD (Chemical Vapor D)
An insulating film made of silicon dioxide, silicon nitride, or the like is formed by deposition, and the through holes 4 are provided by photolithography to form a plurality of sets of the lower insulating layers 3a. Next, a magnetic material film was attached thereon by vapor deposition or the like, a plurality of film cores 9 were formed by photolithography, and a plurality of upper insulating layers 3b were formed thereon in the same manner as the lower insulating layer 3a. Thereafter, a conductive thin film such as a metal is attached thereon, and a plurality of upper thin-film coil conductors 2b are formed by photolithography. Next, after forming an insulating film thereon or forming a polyimide film by a spinner in the same manner as above, a plurality of the protective films 7 are formed by patterning by photolithography. After forming the components of the plural sets of chip-shaped coils in this manner, the individual chip-shaped coils are formed by the above division. Thus, for the chip-shaped coil of the present embodiment, the thin-film coil conductor, the insulating layer and the through-hole,
When forming the film core 9 and the like, thin film deposition, sputtering, C
By performing patterning by VD or the like and photolithography, the pattern accuracy can be increased and the pattern can be miniaturized, so that it is easy to manufacture a chip coil having a small number of turns and a large number of turns. Further, since the chip-shaped coil of this embodiment has the film-shaped magnetic core 9 along the coil core 2c, the inductance can be effectively increased.

FIG. 3 is a top view showing a modification of this embodiment. In this example, a coil core 2 parallel to the plate surface of the substrate 1 is used.
c and the film-shaped magnetic core 9 have a zigzag shape. The other points are the same as those of the embodiment shown in FIG. 1, and the reference numerals are also the same. Although not shown, as another modified example, there is a coil core having an arc shape or a spiral shape. According to such a modification, the number of turns in the chip-shaped coil can be further increased.

(Embodiment 2) Next, an embodiment of the present invention will be described with reference to the drawings for a second embodiment. FIG. 4 is a perspective view showing the structure of the surface mount type coil of the present embodiment,
FIG. 5 is a partial cross-sectional view of the surface-mounted coil shown in FIG. 4, including a cross-sectional view taken along the line CC of the chip-shaped coil shown in FIG. This embodiment relates to a surface mount type coil using the chip-shaped coil of the first embodiment. 4 and 5, reference numeral 10 denotes a mounting board provided with an insulating plate, 11a and 11b are a pair of solder electrodes provided on the lower surface of the mounting board 10, and 12a and 12b are mounting boards 1
0, a pair of connection electrodes 13a and 1
Reference numeral 3b denotes a lead line connecting the solder electrode 11a to the connection electrode 12a and a lead line connecting the solder electrode 11b to the connection electrode 12ba. The lead lines 13a and 13b are wirings that conduct between the upper surface and the lower surface through the wiring on the side surface of the mounting substrate 10 provided by a known wiring technique as described later.

A coil terminal 5a provided on the coil substrate 1 of the chip-shaped coil 8 of the first embodiment shown in FIG. 1 is attached to the connection electrodes 12a and 12b on the mounting substrate 10 by a conductive adhesive such as solder. 15 are connected. Further, the chip coil 8 and the conductive adhesive 15 are covered and protected by a mold member 17 made of an insulating resin formed on the mounting substrate 10. As shown in FIGS. 4 and 5, in the surface mount type coil of this embodiment, the solder electrodes 11a and 11b
a, 13b and the coil terminals 5a at both ends of the laminated coil 5 in which the lower thin film coil conductor 2a and the upper thin film coil conductor 2ba are laminated via the insulating layer 3 and the film core 9.
(See FIG. 1). Thus, a coil unit including the surface mounting means is configured. The laminated coil 5 is covered with a protective film 7, and further covered with a mold member 17. After the laminated coil 5 is formed, the protective film 7 is for the purpose of preventing deterioration due to outside air and adhesion of dust, and the like, and the mold member 17 is for preventing destruction by an external force.

According to this embodiment, the mounting substrate 1
By appropriately selecting the dimensions of the mold member 17 and the mold member 17, it is strong against external force and suitable for automation handling.
Further, it is possible to provide a surface-mount type coil in which the soldering of the mounting is easy by the solder electrode on the lower surface. In other words, the chip-shaped coil itself has a large number of turns and a high production efficiency, but as it is, the mechanical strength is not sufficient, the handling is poor, and it is not impossible to mount it. Easy to wake up. By adopting the surface mounting type as in the present embodiment, a thin film coil unit that can make use of the advantages of the chip-shaped coil and that can be mounted reliably and easily is realized.

Next, in the surface mount type coil of the present embodiment, if necessary, a magnetic shield means can be added as described below. FIG. 6 shows a state in which a magnetic shield cover 19 made of a magnetic material or a conductive material is attached so as to surround the mold member 17 of the surface-mount type coil of this embodiment. As shown in FIG. 6, the magnetic shield cover 19 has a square cap shape, a pair of side walls protrudes, and the protruding portions 19a sandwich and engage a pair of end surfaces of the coil substrate 1, and are mounted and fixed by press fitting or bonding. . The magnetic shield cover 19 blocks external electromagnetic waves or magnetic fields from the chip-shaped coil, thereby preventing noise.

Next, a method of manufacturing the surface mount type coil of this embodiment will be described. FIG. 7A is a top view illustrating the method for manufacturing the surface-mounted coil of the present embodiment, and FIG. 7B is a cross-sectional view taken along the line AA of FIG. In the drawing, reference numeral 20 denotes an aggregate substrate having an insulating base material which is separated and becomes the mounting substrate 10;
A plurality of sets of wiring sets including a, 11b, connection electrodes 12a, 12b, and lead lines 13a, 13b are provided at predetermined intervals in a matrix. 6 is the collective board 2
The through-holes 13a and 13b are provided on the inner wall of the through-hole 13a. The chip-shaped coils 8 shown in FIGS. 1 and 2 are respectively provided at positions corresponding to the respective wiring sets on the upper surface of the aggregate substrate 20.
And the coil conductor terminal 5a is connected to the connection electrodes 12a, 1
2b is connected by a conductive adhesive such as solder (not shown).

Next, a continuous body of the mold member 17 covering the chip-shaped coils 8 in the vertical direction is formed on the collective substrate 20 using a molding die or the like. Next, a cutting slit is formed along the vertical cutting line p and the horizontal cutting line q in the collective substrate 20 at a position where the through hole 6 is cut by the cutter, and the substrate is divided into individual surface mounts as shown in FIG. Form a mold coil. In this way, in this embodiment, a surface-mount type coil can be manufactured with high productivity. That is, in the manufacture of a chip-shaped coil, as described above, a large number of pieces can be formed, and in the manufacture of a surface-mount type coil using the same, a large number of pieces can be formed, so that the productivity as a whole can be significantly increased. .

FIG. 8 is a top view showing a modification of the method of manufacturing the surface mount type coil according to this embodiment. FIG. 8A shows an assembly of surface-mounted coils formed on the assembly board 20,
FIG. 8 (b) shows a strip-shaped continuum of the surface-mounted coil separated by cutting the assembly. In FIG. 8A,
The through holes 6 for conduction are provided at the four corners of the matrix of each wiring set arranged in a matrix on the collective substrate 20, and the notches 6 b are provided at intermediate positions in the vertical direction of the through holes 6. I have. The wiring structure of the collective substrate 20 is the same as that of the collective substrate shown in FIG. After forming a component to be a surface-mounted coil on the collective substrate 20 in the same manner as in the embodiment shown in FIG. 7, a cutting line q in the horizontal direction is formed at a position where the through hole 6 is cut by a cutter.
Fig. 8
A strip-shaped continuous body of the surface mount type coil formed by connecting the notch hole 6b as shown in FIG.

At the time of mounting, one or a plurality of required surface mount type coils are cut and used. That is, depending on the state of the inductance required for the circuit, the wiring of the motherboard is formed such that a plurality of surface mount coils are electrically connected to each other or separated from each other and connected to other circuit elements. , Mounting of a plurality of surface mount coils can be performed.

(Embodiment 3) As a third embodiment which is one of the other embodiments of the present invention, another chip coil and a surface mount type coil using this chip coil will be described with reference to the drawings. It will be described using FIG. 9 is a perspective view showing a chip-shaped coil in the present embodiment, FIG. 10A is a cross-sectional view taken along a line AA in FIG. 9, and FIG.
It is sectional drawing. In FIG. 9, FIG. 10 (a) and FIG.
The illustration of the insulating layer 3 and the protective film 7 shown in FIG. 9 and 10, reference numeral 1 denotes an insulating coil substrate, and reference numeral 5a denotes a coil terminal made of a conductive material provided on the upper surface of the coil substrate 1. Reference numerals 2e, 2f, and 2g denote thin-film coil conductors made of conductive thin films such as first-, second-, and third-layer metals, respectively.

The first-layer thin-film coil conductor 2e surrounds a rectangular space, is provided with a slit 22a in a part thereof, is non-closed, and has a substantially rectangular loop having a connecting portion 2h extending outward at an unwinding portion. It has a shape of a pattern. The second-layer thin-film coil conductor 2f surrounds a similar rectangular space, and has a slit 22b provided in a part thereof to form a non-closed, substantially rectangular loop-shaped pattern. The third-layer thin-film coil conductor 2g surrounds the same space, and partially has a slit 22c.
Is provided, and is a non-closed type, and has a substantially square loop-shaped pattern shape having an outwardly extending connecting portion 2j at an end portion of the winding. The first-layer thin-film coil conductor 2e is formed on the coil substrate 1 on which the coil terminals 5a are provided in advance. The connection portion 2h of the thin-film coil conductor 2e is formed so as to partially overlap the coil terminal 5a, and conduction is achieved. Reference numerals 9a, 9b and 9c are provided separately from the thin-film coil conductors in spaces respectively surrounded by the first-layer thin-film coil conductor 2e, the second-layer thin-film coil conductor 2f and the third-layer thin-film coil conductor 2g. The first, second, and third layers of the film-shaped magnetic core are made of a magnetic material.
The first layered film core 9 a is provided on the coil substrate 1.

Reference numeral 3a denotes a lower insulating layer formed on the first-layer thin-film coil conductor 2e and the first-layer film core 9a, and the second-layer thin-film coil conductor is formed on the lower insulating layer 3a. A film core 9b of the second layer and the second layer is formed.
Reference numeral 3b denotes an upper insulating layer formed on the second-layer thin-film coil conductor 2f and the second-layer film core 9b, and the third-layer thin-film coil conductors 2g and 3b are formed on the upper insulating layer 3b. The film core 9c of the layer is formed. Lower insulating layer 3
In a, a position where the thin-film coil conductor 2e and the thin-film coil conductor 2f overlap in a plane, near the clockwise end position of the thin-film coil conductor 2e, and close to the clockwise start position of the thin-film coil conductor 2f. A through hole 4a is provided at the position. Then, the second-layer thin-film coil conductor 2f
Is formed, the conductive material is filled in the through-hole 4a, and in this portion, the first-layer thin-film coil conductor 2e is formed.
Is conducted. The upper insulating layer 3b is also provided with a through-hole 4b having a similar function. In the through-hole 4b, the third layer of the thin-film coil conductor 2 is formed.
g and the second-layer thin-film coil conductor 2f are electrically connected.

Thus, the film cores 9a, 9a
The laminated coil 5 is formed as a three-dimensional thin-film coil wound approximately three times clockwise around the space where b and 9c exist. On this laminated coil 5, a third layer thin film coil conductor 2
A protective film 7 covering the whole of the coil substrate 1 except for the end of the connection portion 2j and the end of the coil terminal 5a is formed. The surface of the connection part 2j is plated with gold or the like, and the connection pad terminal 5 for wire bonding is provided.
b. Thus, the chip-shaped coil 8 is configured. As described above, since the chip-shaped coil 8 of the present embodiment has the laminated coil 5 wound multiple times around the film-shaped magnetic core 9, the inductance is effectively increased.

In the chip coil 8 of this embodiment,
As the material of the magnetic core 9, any of a conductive magnetic material such as pure iron and a non-conductive magnetic material such as ferrite can be used. When manufacturing the chip-shaped coil of this embodiment using a conductive magnetic material as the material of the film-shaped core 9, the thin-film coil conductor 2 and the film-shaped core 9 are placed on the coil substrate 1 or the insulating layer 3. Using the same conductive magnetic material, evaporation,
It can be formed simultaneously by photolithography following sputtering or the like. Therefore, by the same method as shown in the first embodiment shown in FIG. 1, the vapor deposition, sputtering, CVD,
It can be manufactured by using a technique such as photolithography. Therefore, it is possible to manufacture a large number of small products with high productivity.

When the chip-shaped coil of this embodiment is manufactured by using a magnetic material having no conductivity as the material of the film-shaped magnetic core 9, the conductive material is placed on the coil substrate 1 or the same insulating layer 3. The thin film coil conductor can be formed separately and sequentially by photolithography following deposition and sputtering of a non-conductive magnetic material and the photolithography subsequent to deposition and sputtering and the like. Therefore, by using the same technology as described above, it is possible to manufacture a large number of small products with high productivity.

FIG. 11 is a sectional view showing a modified example of the chip-shaped coil shown in FIGS. 9 and 10, and corresponds to FIG. 10B. In FIG. 11, reference numerals 3a and 3b denote a lower edge layer and an upper insulating layer formed on the first and second thin film coil conductors 2e and 2f, respectively. 2g is a third-layer thin-film coil conductor formed on the upper insulating layer 3b. The shapes of the first-layer, second-layer and third-layer thin-film coil conductors 2e, 2f and 2g are the same as those of the chip-shaped coil shown in FIG. 9, and are connected to the third-layer thin-film coil conductor 2g. Unit 2j is included. A lower protective film 7a made of polyimide is formed so as to leave the connection portion 2j on the third layer thin film coil conductor 2g. Each of the insulating layers 3a and 3b and the lower protective film 7a is provided with a magnetic core hole 4a in a space surrounded by each of the thin film coil conductors. Then, the lower insulating layer 3a and the upper insulating layer 3b
Are further provided with through holes (not shown) for conducting the thin film coil conductors 2e and 2f and 2f and 2g, respectively. The magnetic core hole 4a is filled with a film-shaped magnetic core 9 made of a magnetic material. An upper protection film 7b made of polyimide is formed on the film core 9 and the lower protection film 7a so as to leave the connection portion 2j.

The other points are the same as those of the chip coil of FIG. In this example, after each thin film coil conductor, each insulating layer having the magnetic core hole 4a and the like and the lower protective film 7a are alternately laminated and formed, the film core is formed by photolithography following deposition of a magnetic material, sputtering and the like. 9 is formed in the magnetic core hole 4a. As described above, the chip-shaped coil 8 of the present example includes the laminated coil 5 wound a plurality of times around the film-shaped magnetic core 9, and thus the inductance is effectively increased similarly to the chip-shaped coil illustrated in FIG. ing. In addition, since the multi-cavity technology can be applied in the same manner as in the case of an integrated circuit, a small product can be manufactured with high productivity.

FIG. 12 is a perspective view showing a surface mount type coil of this embodiment using the chip coil 8 shown in FIGS. 9 and 10 or the chip coil 8 shown in FIG. In FIG. 12, reference numeral 10 denotes a mounting board made of an insulating material,
11a and 11b are a pair of solder electrodes provided on the lower surface of the mounting substrate 10, 12 is a connecting electrode provided on the upper surface of the mounting substrate 10, and 25 is a connecting pad for wire bonding. 5b is the pad terminal exposed on the upper surface of the chip coil 8. Reference numerals 13a and 13c denote lead lines for connecting the solder electrode 11a to the connection electrode 12 and the solder electrode 11b to the connection pad 25, respectively. The lead-out lines 13a and 16c are wirings in which the upper surface and the lower surface are connected via the wiring on the side surface of the mounting board 10 provided by the known wiring technology described above. On the mounting substrate 10, the coil terminals 5a provided on the coil substrate 1 of the chip-shaped coil shown in FIG. 9A are connected to the connection electrodes 12 by a conductive adhesive 15 such as solder.

On the other hand, the pad terminals 5b and the mounting substrate 10
Are connected to the connection pads 25 provided by the wire 27 by wire bonding. Further, the chip coil 8, the conductive adhesive 15, the wires 27 and the connection pads 25 are covered and protected by a molding member 17 formed on the mounting substrate 10 and made of an insulating resin. The surface mount type coil of the present embodiment having such a configuration can be easily and reliably mounted similarly to the surface mount type coil of the second embodiment shown in FIG.
Similarly, efficient production can be achieved by multi-cavity production.

Example 4 As a fourth example of another embodiment of the present invention, another chip coil will be described with reference to the drawings. FIG. 13 is a cross-sectional view taken along a line 2 parallel to the plate surface of a coil substrate (not shown) showing the shapes of the thin-film coil conductor and the film-shaped magnetic core of the chip-shaped coil of this embodiment. In FIG. 13, reference numeral 9 denotes a film core, 2m denotes an odd-numbered layer thin-film coil conductor, and 2n denotes an even-numbered layer thin-film coil conductor. The odd-numbered thin-film coil conductor 2m has a left-handed spiral shape, and the even-numbered thin-film coil conductor 2n has a right-handed spiral shape, all of which are separated from and surround the film-shaped magnetic core 9. Have been. The thin-film coil conductors 2m and the thin-film coil conductors 2n are alternately stacked via an insulating layer in the same manner as described above. Then, at one or both of the inner end B and the outer end A, they are connected to each other via through holes provided in the insulating layer.

For example, the first-layer thin-film coil conductors 2m and 2m
The thin-film coil conductors 2n of the layer are connected at inner ends Bm and Bn. As a result, the current flowing from the outer end Am of the first-layer thin-film coil conductor 2m is wound a plurality of times in the clockwise direction, passes through the inner end Bm, and is turned clockwise a plurality of times from the inner end Bn of the second-layer coil 2n. It is wound and flows out from its outer end An. Further, when the coil 2m of the third layer is stacked, the current flowing from the outer end An of the second layer is equal to the outer end A of the coil 2m of the third layer.
The wire is wound a plurality of times in the clockwise direction through m and flows out from the inner end Bm. In this way, a laminated coil having a plurality of turns in each layer and being additionally wound a plurality of times in the same direction around the film core 9 is formed as a whole. For the same reason as described above, the chip-shaped coil of this embodiment can effectively increase the inductance and can manufacture a small-sized coil with high productivity.

(Example 5) As a fifth example of another embodiment of the present invention, another chip coil will be described with reference to the drawings. FIG. 14 is a cross-sectional view showing a part of the configuration of a monolithic integrated circuit having a laminated coil as the present embodiment. The chip-shaped coil of this embodiment has a laminated coil formed together with other components as one component of a monolithic integrated circuit formed on a single semiconductor chip. In FIG. 12, reference numeral 30 denotes a semiconductor substrate mainly made of n-type silicon. 32, 3
Reference numerals 4 and 36 denote a laminated coil, a MOSFET, and a capacitor provided on the semiconductor substrate 30, respectively, which are integrally formed.

The laminated coil 32 has the same structure as the laminated coil 5 in the chip-shaped coil of the first embodiment shown in FIGS. Here, 2a is a lower thin-film coil conductor of Al, 3a is a lower insulating layer of SiO2 formed on the lower thin-film coil conductor 2a, 9 is pure iron formed on the lower insulating layer 3a. 3b is a film-shaped magnetic core made of a magnetic material such as
An upper insulating layer of iO2, and 2b is an upper thin-film coil conductor of Al formed on the upper insulating layer 3b. 4 is a through hole provided in the lower insulating layer 3a and the upper insulating layer 3b.

Reference numerals 41, 42 and 43 denote MOSFEs, respectively.
T34 p + source, SiO2 gate insulating layer, p +
, And 45, 46 and 47 are a source electrode, a gate electrode and a drain electrode of Al, respectively. These elements constitute a known p-MOSFET. Reference numerals 51, 52, and 53 denote a p + lower electrode constituting the capacitor 36, a capacitor insulating layer of SiO2,
1 is an upper electrode. Reference numeral 56 denotes an insulating protective film made of polyimide which covers each of the above components.

Hereinafter, the manufacturing process of the monolithic integrated circuit of this embodiment will be briefly described. In FIG. 14, first, p + ions are implanted into an n-type silicon substrate,
The source 41 and the drain 43 of the SFET 34 and the lower electrode 51 of the capacitor 36 are formed. Next, the lower thin-film coil conductor 2a of the laminated coil 32 is formed by sputtering and etching the Al film. Next, MOSFE
A T2 SiO2 gate insulating layer 42 is formed by vapor deposition and etching. In this process, many parts of the silicon substrate 30 are simultaneously covered with the insulating layer SiO2 except for the space for the lead-out electrode, that is, the lower insulating layer 3a of the laminated coil 32, the capacitor insulating layer 52 of the capacitor 36, and the like at this time. It is formed.

Subsequently, by sputtering and etching an Al film on the insulating layer, the source electrode 45, the gate electrode 46, the drain electrode 47 of the MOSFET 34, the upper electrode 53 of the capacitor 36, a connection pad base electrode (not shown), Other wiring is formed. Next, a film-shaped iron core 9 of the laminated coil 32 is formed by sputtering and etching a magnetic material film such as pure iron, and then the upper insulating layer 3b of SiO2 and the Al of the laminated coil 32 are formed in the same manner as described above. Is formed by sequentially laminating the upper thin-film coil 2b and its lead wire (not shown). Next, a protective film 56 of a polyimide resin is applied thereon by a spinner, including the above-described components and other components including an active element and a passive element (not shown) formed simultaneously on the semiconductor substrate 30, and etching is performed. To remove the connection pad (not shown). Thereafter, Au is plated on the Al film underlying the connection pads to form connection pads.

As described above, in the monolithic integrated circuit according to the present embodiment, a laminated coil having a large number of turns and a large inductance is integrated with a MOSFET, a capacitor and other active or passive elements on a chip of the common semiconductor substrate 30. Can be created by a common process. Therefore, a receiving circuit, an oscillating circuit, a high-frequency measuring circuit, and the like that require an inductor element can be configured to be extremely small with one chip. For this reason, characteristically, it is difficult to pick up external noise, and a circuit unit excellent in sensitivity and reliability can be provided. Further, in terms of manufacturing, since a separate joining operation for connecting the coils is not required, and a circuit unit can be formed by taking a large number of pieces, production efficiency is extremely increased. In addition, in order to attach the monolithic integrated circuit of this embodiment to a general circuit board, the connection pads are bonded by wire bonding.
It is connected to a lead frame or a mounting board for surface mounting as described above via a wire, and if necessary, a protective member is coated, and the mounting member is formed and mounted.

In this embodiment, the laminated coil of the first embodiment shown in FIG. 1 is used as an inductor element in a monolithic integrated circuit. However, the present invention is not limited to this, and the present invention is not limited to this. A monolithic integrated circuit is constructed using the laminated coil in the chip coil of the third embodiment shown in the drawing or the laminated coil similar to the laminated coil in the chip coil of the fourth embodiment shown in FIG. You can also.

[0046]

As described above, according to the present invention,
(1) It is possible to provide a chip-shaped coil having a small plane dimension, a large number of windings, and an effectively increased inductance. (2) It is possible to provide a monolithic integrated circuit chip having a small planar dimension having a laminated coil having a small planar dimension, a large number of windings, and an effectively increased inductance. (3) It is possible to provide a surface mount type coil in which the number of coil turns is large and the inductance is effectively increased. (4) It is possible to provide a manufacturing method of manufacturing such a chip-shaped coil, a chip of a monolithic integrated circuit, and a surface-mount type coil at a high production efficiency by so-called multi-piece manufacturing.

[Brief description of the drawings]

FIG. 1 is a top view showing a chip-shaped coil of the present invention.

FIG. 2 is a cross-sectional view of FIG.
(B) is BB sectional drawing.

FIG. 3 is a top view showing a modification of the chip coil of the present invention shown in FIG.

FIG. 4 is a perspective view showing a surface-mount type coil of the present invention using the chip-shaped coil shown in FIG.

FIG. 5 is a partial cross-sectional view of the surface mount type coil shown in FIG.

FIG. 6 is a perspective view showing a surface mount type coil of the present invention.

7A and 7B are diagrams showing a method for manufacturing a surface-mounted coil according to the present invention, wherein FIG. 7A is a top view and FIG. 7B is a cross-sectional view taken along line AA of FIG.

8A and 8B are top views showing a method of manufacturing a surface-mount type coil according to the present invention, wherein FIG. 8A is a diagram showing a state before cutting of an aggregate substrate, and FIG. 8B is a diagram showing a state after cutting.

FIG. 9 is a perspective view showing a chip-shaped coil of the present invention.

10 is a cross-sectional view of FIG. 9, (a) is a cross-sectional view taken along line AA, and (b) is a cross-sectional view taken along line BB.

FIG. 11 is a sectional view showing a chip-shaped coil of the present invention.

FIG. 12 is a perspective view showing a surface-mounted coil of the present invention using the chip-shaped coil shown in FIG. 9 or FIG.

FIG. 13 is a sectional view showing a thin-film coil conductor and a film-shaped magnetic core in the chip-shaped coil of the present invention.

FIG. 14 is a cross-sectional view showing a monolithic integrated circuit as a chip-shaped coil of the present invention.

FIG. 15 is a perspective view showing a conventional surface mount coil.

FIG. 16 is a perspective view showing a conventional surface mount type coil.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 coil substrate 2 thin film coil conductor 3 insulating layer 4, 6 through hole 4 a magnetic core hole 5, 32 laminated coil 5 a coil terminal 5 b pad terminal 7 protective film 8 chip coil 9 film core 10 mounting substrate 11 solder electrode 12 connection electrode 13 Lead wire 15 Conductive adhesive 17 Mold member 19 Magnetic shield cover 20 Collective substrate 25 Connection pad 27 Wire 30 Semiconductor substrate 34 MOSFET 36 Capacitor

Claims (7)

[Claims] 1. A chip-shaped coil comprising a laminated coil having a coil substrate made of an insulating material or a semiconductor material and a thin-film coil conductor formed in multiple layers on the coil substrate with an intervening layer interposed therebetween, Has a film-shaped core made of an insulating layer and a magnetic material, the thin-film coil conductor is composed of two upper and lower layers, and the thin-film coil conductors of each layer are separated from each other by a plurality of separated electrodes arranged along a straight line or a curved line. With respect to at least a part of each of the separation electrodes in the upper layer, the individual separation electrodes are arranged at both ends thereof at positions overlapping the ends of the separation electrodes adjacent to each other in the lower layer, and provided on the insulating layer. The laminated coil is connected to each other vertically through a through hole, and is configured to be wound a plurality of times around the film axis and the coil axis parallel to the plate surface of the coil substrate as a whole. Chip coil. 2. A chip-shaped coil comprising a laminated coil having a coil substrate made of an insulating material or a semiconductor material and a thin-film coil conductor formed in multiple layers on the coil substrate with an intervening layer interposed therebetween, Is an insulating layer, the thin-film coil conductor of each layer forms a partially open loop shape,
In the vicinity of at least one end of the loop, the thin-film coil conductors that are in a vertical relationship with each other are arranged at positions where they overlap with each other, and are connected to each other vertically through through holes provided in the insulating layer. A film core made of a magnetic material is provided in or near a space surrounded by at least one thin film coil conductor among the thin film coil conductors, and as a whole, around a coil axis perpendicular to the film core and the plate surface of the coil substrate. A chip-shaped coil, wherein the laminated coil is wound a plurality of times. 3. A chip-shaped coil comprising a laminated coil having a coil substrate made of an insulating material or a semiconductor material and a thin-film coil conductor formed in multiple layers on the coil substrate with an intervening layer interposed therebetween, Is an insulating layer, and the thin-film coil conductors of each layer are alternately laminated with a left-handed spiral shape and a right-handed spiral shape, and at least at one end of the spiral shape, they are in a vertical relationship with each other. A space inside the at least one thin-film coil conductor among the spiral-shaped thin-film coil conductors of each layer, wherein the thin-film coil conductors are arranged at positions where the thin-film coil conductors overlap with each other and are connected to each other vertically through through holes provided in the insulating layer; Alternatively, a film core made of a magnetic material is provided in the vicinity thereof, and a plurality of turns are wound around a coil axis perpendicular to the film core and the plate surface of the coil substrate as a whole. A chip-shaped coil comprising the laminated coil. 4. A laminate comprising: a coil substrate made of an insulating material or a semiconductor material; and a thin film coil conductor formed on the coil substrate with a plurality of layers interposed therebetween and wound around a film core made of a magnetic material. A solder electrode is provided on a lower surface or a side surface of a substrate made of a chip coil having a coil and an insulating material, and connection terminal means such as connection electrodes and pads are provided on an upper surface, and the connection terminal means is connected to the solder electrode. A mounting board provided with a lead wire, wherein the chip-shaped coil is disposed on the mounting board, the laminated coil is electrically connected to the connection terminal means, and the chip-shaped coil is mounted on the mounting board. A surface-mounted coil having a configuration covered by a mold member formed thereon. 5. The surface mount coil according to claim 4, wherein the chip coil is the chip coil according to any one of claims 1 to 3. 6. The surface mount type coil according to claim 4, further comprising a magnetic shield cover for covering the chip-shaped coil from outside the mold member. 7. A plurality of said chip-shaped coils are arranged on a collective substrate of said mounting board provided with a plurality of sets of said solder electrodes, connection electrodes and connection terminal means, and said connection terminal means corresponding to the laminated coil. Electrically connecting the plurality of chip-shaped coils to the collective substrate; and forming a mold member covering the plurality of chip-shaped coils on the collective substrate; 7. The method for manufacturing a surface-mounted coil according to claim 4, further comprising the step of: forming a chip-shaped coil.