JPH10233029A - Optical pickup device and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] The present invention enables a laser element and a photodetector to be mounted with high accuracy, and also makes the manufacturing process simpler. A heat sink is mounted on a light-transmitting glass substrate on which a wiring pattern is formed, and a laser element is bonded to a vertical surface of the heat sink, and a laser beam output from the laser element is provided. Through the glass substrate 10 and the hologram element 19
The laser beam reflected from the surface of the optical disc 20 is diffracted by the hologram element 19, passes through the glass substrate 10, and is incident on the light detection surface of the first light detection element 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup device for reading information on an optical disk by irradiating a laser beam output from a laser element onto an object such as an optical disk and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the spread of optical recording media such as CDs and LDs has been remarkable, and accordingly, the importance of optical pickup devices has increased. Recently, DVD
High-capacity and high-density recording media have also appeared, and higher-precision optical pickup devices have been required than ever before, and high-precision laser pickup devices and photo-detection device mounting accuracy in such optical pickup devices have been required. Has been requested.

[0003] These optical recording media are not only used for reproducing sound and moving images, but also for the RO of personal computers.
It is also used as M, etc., and is incorporated in various devices, and there is a demand for a smaller and thinner optical pickup device.

FIG. 6 is a configuration diagram of such an optical pickup device. The wiring board 1 has a wiring pattern formed on ceramic or the like. In the center of the wiring board 1, C
A heat sink 2 made of u or the like is mounted.

The vertical surface of the heat sink 2 has AlN
A submount substrate 3 formed of, for example, SiC or the like is bonded, and a laser element 4 such as a semiconductor laser is mounted on the submount substrate 3. The heat generated during the operation of the laser element 4 is radiated through the heat sink 2.

The mounting accuracy of the laser element 4 is required to be ± 100 μm in the XY directions with respect to the outer shape standard of the wiring board 1, for example, since the mounting accuracy in the device is required.

This is not only the mounting accuracy of the laser element 4 but also the integrated accuracy of the outer shape of the wiring board 1 and the outer shape and mounting accuracy of the heat sink 2. Advanced manufacturing technology is required.

A first light detecting element 5 is joined to the upper surface of the heat sink 2. This first light detection element 5
It receives laser light output upward from the laser element 4 and reflected on the optical disk surface.

The laser element 4 and the first light detecting element 5
Since the relative mounting position is related to the accuracy of reading information from the optical disk, a considerably high accuracy is required. For example, it is ± 40 μm in the Z direction and ± 10 μm in the Y direction.

[0010] The accuracy in the Z direction is the same as the mounting accuracy of the laser element 4 and the external accuracy of the wiring board 1 and the heat sink 2.
In order to integrate all of the outer shape and mounting accuracy of the device, an advanced manufacturing technique for the wiring board 1 and the heat sink 2 is required.
Further, the accuracy of ± 10 μm in the Y direction is difficult with a normal die bonder.

The laser element 4 in the heat sink 2
The second photodetecting element 6 is mounted on the lower surface of the photodetector. The second light detection element 6 monitors the laser light output downward from the laser element 4. The second light detecting element 6 is mounted on an inclined surface of about 10 ° with respect to the horizontal in order to prevent the laser light from being reflected upward.

The laser element 4 and the second light detecting element 6
Is lower than that of the first photodetector 5 and is about ± 70 μm in the XY directions. After each of the laser element 4, the first light detection element 5, and the second light detection element 6 is mounted on the surface of the heat sink 2, these elements are electrically connected to the wiring board 1 by a wire bonding method or the like. Connection is made. In this case, the laser element 4 is arranged perpendicular to the wiring board 1, and usually wire bonding is performed via the relay pin 7 or the like.

[0013]

As described above, the mounting surfaces of the laser element 4, the first light detecting element 5, and the second light detecting element 6 are all different from each other. For this reason, when mounting these elements, it is necessary to rotate the stage jig for fixing the wiring board 1 or to use a dedicated stage jig for each element.

Although each element must be arranged with high precision, it is difficult for the current die bonder to achieve the above-mentioned precision, and high-precision components such as the wiring board 1 and the heat sink 2 are also required. Required and the manufacturing process is difficult.

On the other hand, in the wire bonding step, the second photodetecting element 6 is mounted on an inclined surface of about 10 ° with respect to the wiring board 1, so that the first (1st)
Between the bonding and the second (2nd) bonding,
It is necessary to take measures such as tilting the stage for fixing the wiring board 1 by 10 °.

In the first light detecting element 5, the heat sink 2
Because it is mounted on the upper surface, the step is about 2 mm,
The loop distance of the wire bonding is also about 2 mm.
Therefore, if the step is large and the loop distance is short, stable wire bonding is difficult.

[0017] Even in the wire bonding of each element to the wiring board 1, three-dimensional wire bonding is required, and the process becomes complicated. Therefore, an object of the present invention is to provide an optical pickup device and a method of manufacturing the same that can mount a laser element and a photodetector with high accuracy and can simplify the manufacturing process.

[0018]

According to the first aspect, a substrate having a light-transmitting portion, a laser element for outputting a laser beam to an object through the substrate, and a laser beam reflected from the object are provided. An optical pickup device includes: a diffractive element that diffracts light; and a photodetector that receives diffracted light from the diffractive element via the substrate.

According to the second aspect, a substrate on which a wiring pattern is formed, a heat sink mounted on the substrate,
A laser element is provided on the vertical surface of the heat sink and outputs laser light to an object via the substrate, a diffraction element diffracts reflected laser light from the object, and is mounted on the substrate and diffracted by the diffraction element. And a photodetector that receives the diffracted light via a substrate.

According to a third aspect, in the optical pickup device according to the first or second aspect, the substrate is a translucent glass substrate. According to the fourth aspect, in the optical pickup device according to the first or second aspect, each through hole is formed in the substrate on each optical path of the laser light output from the laser element and the diffracted light from the diffraction element. I have.

According to a fifth aspect of the present invention, in the optical pickup device according to the second aspect, the substrate is a translucent glass substrate, and a through-hole through which laser light and diffracted light pass is formed on the glass substrate. The formed light-shielding insulating substrate is adhered, and the wiring pattern is formed on the substrate via the insulating substrate.

According to a sixth aspect of the present invention, in the optical pickup device of the second aspect, the heat sink is provided with a reflecting surface that obliquely reflects the monitoring laser light output from the laser element with respect to the substrate. Along with the board,
A monitoring light detecting element for receiving the monitoring laser light is mounted.

According to the seventh aspect, in the optical pickup device according to the first or second aspect, the diffraction element is a hologram element. According to claim 8, a first step of bonding the laser element to the heat sink, a second step of mounting the bonded heat sink of the laser element on a flat substrate having a transparent portion, A third step of mounting the light detecting element at a predetermined position, and diffracting the reflected laser light from the object on the optical path of the laser light output from the laser element and transmitted through the substrate to irradiate the object. And a fourth step of providing a diffractive element for propagating the diffracted light to the light detecting element side.

According to a ninth aspect, in the method for manufacturing an optical pickup device according to the eighth aspect, the heat sink includes:
A reflection surface that obliquely reflects the monitor laser light output from the laser element with respect to the substrate is formed,
The substrate is provided with a monitoring light detecting element for receiving the monitoring laser light.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION

(1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of the optical pickup device as viewed from a side, and FIG. 2 is an enlarged view of the vicinity of a heat sink.

The glass substrate 10 is, for example, 10 mm × 5 m
The wiring pattern 11 is formed on the surface thereof. Note that this wiring pattern 1
1 can be formed of a thin film, a thick film, or the like.

A heat sink 12 is mounted on the glass substrate 10. This heat sink 12 is made of Cu
For example, it is formed in a cubic shape having a size of about 3 mm × 3 mm × 3 mm, and a laser light reflecting surface 13 is formed on an upper portion thereof.

On the vertical surface of the heat sink 12, Al
A laser element 15 is mounted via a submount substrate 14 made of N, SiC, or the like. The size of the submount substrate 14 is, for example, 1 mm × 1 mm ×
It is about 0.25 mm.

The laser element 15 is, for example, a semiconductor laser and has a size of about 0.6 mm × 0.3 mm × 0.1 mm. The mounting accuracy of the laser element 15 is ± 100 μm with respect to the XY directions of the glass substrate 10. However, since the heat sink 12 can be positioned and mounted on the glass substrate 10 after connecting the laser element 15 to the heat sink 12, Even if the accuracy of the heat sink 10 and the heat sink 12 is slightly poor, the accuracy can be kept within ± 100 μm.

The heat generated from the laser element 15 is
Heat is radiated from the upper surface of the heat sink 12 to the housing. The heat sink 12 has a laser element 1 as shown in FIG.
The flexible substrate 16 is adhered to the same surface as the mounting surface of No. 5. The flexible substrate 16 is mounted on the glass substrate 10 after the heat sink 12 is mounted on the glass substrate 10.
Electrical connection can be easily made by soldering.

The flexible substrate 16 is electrically connected to the wiring pattern 11 and wire-bonded between the submount substrate 14 and the laser device 15.

By performing this wire bonding step before mounting the heat sink 12 on the glass substrate 10, bonding can be performed on the same surface. Meanwhile, the first
The light detecting element 17 is mounted on the glass substrate 10 with its light detecting surface facing the glass substrate 10. The first light detecting element 17 is directly mounted on the glass substrate 10 via a bump 18 by, for example, a flip chip mounting method. The size of the first light detection element 17 is, for example, about 1.5 mm × 1.2 mm × 0.4 mm.

A hologram element 19 is arranged on the optical path of the laser light Q output from the laser element 15. The hologram element 19 is output from the laser element 15, the glass substrate 10 passes through the hologram element 19 is applied to the optical disk 20, and diffracts the reflected laser beam from the optical disk 20, the diffracted light Q _a first The light is propagated to the first light detection element 17 side.

The hologram element 19 is fixed to the glass substrate 10 by a hologram holder 21. Here, the laser element 15 and the first light detection element 1
The position relative to the hologram element 19 depends on the characteristics of the hologram element 19, but if the distance between the laser emission point of the laser element 15 and the center of the light receiving section of the first light detection element 17 is about 2 mm, the XY position is determined by the flip chip bonder. A relative accuracy of about ± 5 μm can be obtained in the direction.

The accuracy of ± 40 μm in the Z direction is determined by the flatness of the glass substrate 10. Even if the size of the glass substrate 10 is large, it is about 10 mm × 5 mm, so that the flatness of ± 40 μm can be sufficiently provided. be able to.

Further, on the glass substrate 10, a second light detecting element 22 is mounted. This second light detecting element 22
Has a size of, for example, about 0.8 mm × 0.8 mm × 0.3 mm, and is mounted on the glass substrate 10 such that the light detection surface is on the upper surface.

[0037] Therefore, the second light detecting element 22 is output from the rear of the laser element 15, which is intended to monitor the laser light Q _b reflected by the laser light reflecting surface 13 of the heat sink 12. Note that the heat sink 12 is C
Using those subjected to Au plating made of u, the amount of laser light reflected Q _b can be taken sufficiently as a laser light reflecting surface 13.

Here, the relative position between the second light detecting element 22 and the laser element 15 is determined by the relationship between the laser reflected light Q _b from the laser light reflecting surface 13 and the light receiving portion edge (XY) of the second light detecting element 22. Direction) is determined by the positional accuracy of ± 70 μm and the reflection angle of the laser beam.

Further, since the second light detecting element 22 is disposed apart from the laser element 15, the second light detecting element 22
The laser reflected light from the laser device does not interfere with the laser light Q output from the laser element 15.

Next, a method of manufacturing the optical pickup device configured as described above will be described with reference to a manufacturing flowchart shown in FIG. First, there are a submount process, a heat sink process, and a glass substrate process. In the submount process, the laser element 15 is attached to the submount substrate 14 by AuSn solder or the like so that N2 + 10%
It is heated to about 280 ° C. in an H2 atmosphere and joined.

In the heat sink process, the flexible substrate 16 is bonded onto the heat sink 12 with an epoxy resin or the like. Then, the submount substrate 14 to which the laser element 15 is bonded is bonded to the heat sink 12 by heating at about 200 ° C. in an N 2 + 10% H 2 atmosphere using eutectic solder or the like, and the submount substrate 14 is bonded by wire bonding. Upper laser element 15 and flexible substrate 1
6 is electrically connected. At this time, since the bonding surface of the laser device 15 on the submount substrate 14 and the bonding surface of the flexible substrate 16 are parallel,
Easy bonding.

On the other hand, in the glass substrate process, a wiring pattern 11 is formed on the glass substrate 10 by electroless Au plating or the like. Then, the sub-mount substrate 1 on which the laser element 15 has been bonded in the previous step is placed on the glass substrate 10.
The heat sink 12 to which the heat sink 4 is bonded is mounted using a die bonder or the like. In this case, when electrical connection (for example, grounding) of the heat sink 12 is required, the paste is softened at about 150 ° C. using an Ag paste, an isotropic conductive paste, or the like.

The first photodetector 17 has bumps formed on its connection pads by plating or wire bonding.
8 are formed. Next, the first light detection element 17
It is mounted face down on the glass substrate 10. Paste, anisotropic conductive paste, or the like is used for electrical connection in this mounting, and the paste is softened at about 150 ° C.

At this time, the mounting accuracy of the laser element 15 with respect to the light emitting point is ± 40 μm in the Z direction and ± 10 μm in the Y direction.
m, but can be mounted sufficiently using a high-precision flip chip bonder.

Subsequently, the second photodetector 22 is mounted face-up on the glass substrate 10 using an Ag paste or the like. At this time, the mounting accuracy of the laser element 15 with respect to the light emitting point is ± 70 μm in the X and Y directions, and a die bonder can be sufficiently mounted. The curing temperature of the Ag paste is about 150 ° C.

Next, the second photodetector 22 is electrically connected to the wiring pattern 11 of the glass substrate 10 by wire bonding. In this wire bonding step, since an angle of about 10 ° does not occur between the second light detection element 22 and the glass substrate 10, bonding can be easily performed. That is, conventionally, the second light detecting element 22
Are inclined at about 10 °, but it is not necessary to take such a complicated structure, and even when the connection with the wiring pattern 11 is performed by the wire bonding method, the stage does not need to be inclined. Easy connection by the method.

Finally, a hologram element 19 for diffracting the reflected laser light from the optical disk 20 is provided on the hologram holder 21 on the optical path of the laser light Q output from the laser element 15.

With such a configuration of the optical pickup device, when the laser beam Q is output from the laser element 15,
The laser beam Q passes through the glass substrate 10 and then passes through the hologram element 19 and irradiates the surface of the optical disc 20.

[0049] Then, the reflected laser light from the surface of the optical disk 20 is again incident on the hologram element 19 is transmitted through the glass substrate 10 light detection surface of first light-detecting element 17 as diffracted light Q _a, where Incident on.

As described above, the information recorded on the optical disk 20 can be read by detecting the reflected laser light from the surface of the optical disk 20 with the first light detecting element 17.

The laser light Q on the glass substrate 10
This optical path is refracted, but there is no problem if an optical design is performed in consideration of the refraction characteristics of the glass substrate 10. On the other hand, the laser light Q _b output from behind the laser element 15
Is reflected by the laser light reflecting surface 13 of the heat sink 12,
The light enters the light receiving surface of the second light detecting element 22. Thereby, the laser output of the laser element 15 can be monitored.

As described above, in the first embodiment, the light-transmitting glass substrate 1 on which the wiring pattern is formed
The heat sink 12 is mounted on the
The laser device 15 is bonded to the vertical surface of
The laser light Q output from the optical disk 20 passes through the glass substrate 10 and the hologram element 19 and irradiates the surface of the optical disk 20 with the laser light Q reflected from the surface of the optical disk 20.
Since the light is diffracted by the hologram element 19 and transmitted through the glass substrate 10 to be incident on the light detection surface of the first light detection element 17, a laser element or a light detection element can be mounted with high accuracy.
In addition, the manufacturing process can be simplified.

That is, the heat sink 12 is connected to the glass substrate 1 after the laser element 15 is connected to the heat sink 12.
0, the mounting accuracy of the laser element 15 is set to ± 100 with respect to the XY direction of the glass substrate 10 even if the accuracy of the glass substrate 10 and the heat sink 12 is slightly poor.
Accuracy of μm can be achieved.

The laser element 15 and the first light detecting element 1
If the distance from the laser emitting point of the laser element 15 to the center of the light receiving section of the first light detecting element 17 is about 2 mm, the flip chip bonder sets the relative position to ± 7 in the XY directions.
A relative accuracy of about 5 μm can be obtained.

Further, since the accuracy in the Z direction of 0 ± 40 μm is about 10 mm × 5 mm even if the substrate size of the glass substrate 10 is large, a flatness of ± 40 μm can be sufficiently obtained.

The mounting accuracy of the laser element 15 with respect to the light emitting point is ± 40 μm in the Z direction and ± 10 μm in the Y direction. However, if a high-precision flip chip bonder is used, it can be mounted sufficiently. The mounting accuracy with respect to the light emitting point is ± 70 μm in the X and Y directions, and a die bonder can be mounted sufficiently.

As described above, since the laser element 15 is mounted on the glass substrate 10 after being connected to the heat sink 12, a high-precision optical pickup device can be obtained, and mounting on the flat glass substrate 10 can be achieved. , The manufacturing process can be simplified. (2) Hereinafter, a second embodiment of the present invention will be described. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 4 is a structural view of the optical pickup device as viewed from the side. On the non-light-transmitting insulating substrate 30, a through-hole 31 for passing the laser light Q output from the laser element 15 and the diffracted light Q _a from the hologram element 19 are provided.
Is formed in the through hole 32 for letting through.

As the non-light-transmitting insulating substrate 30, a resin substrate, a ceramic substrate, a metal core substrate, or the like is used. A heat sink 12 is mounted on the non-light-transmitting insulating substrate 30 and a laser light reflecting surface 13
Are formed. A laser element 15 is mounted on a vertical surface of the heat sink 12 via a submount substrate 14.

The mounting accuracy of the laser element 15 is ± 100 μm with respect to the XY direction of the non-light-transmitting insulating substrate 30. However, after the laser element 15 is connected to the heat sink 12, Since the positioning and mounting can be performed on the non-light-transmitting insulating substrate 30 and the heat sink 12, the accuracy can be kept within ± 100 μm even if the accuracy of the heat sink 12 is slightly low.

The first light detecting element 17 is mounted on the non-light-transmitting insulating substrate 30 with its light detecting surface facing the non-light-transmitting insulating substrate 30. On the optical path of the laser light Q output from the laser element 15, the hologram element 19 is fixedly arranged on the non-light-transmitting insulating substrate 30 by the hologram holder 21.

Here, the relative position between the laser element 15 and the first light detecting element 17 is such that the distance between the laser emission point of the laser element 15 and the light receiving center of the first light detecting element 17 is about 2 mm. With the flip chip bonder, a relative accuracy of about ± 5 μm can be obtained in the XY directions.

The accuracy of ± 40 μm in the Z direction is determined by the flatness of the non-light-transmitting insulating substrate 30. Even if the size of the non-light-transmitting insulating substrate 30 is large, it is 10 mm × 5 m
m, a flatness of ± 40 μm can be sufficiently obtained.

Further, on the non-light-transmitting insulating substrate 30, the second
Are mounted. The relative position between the second light detecting element 22 and the laser element 15 is determined by the value of the laser reflected light Q _b from the laser light reflecting surface 13 to the second light detecting element 2.
Position accuracy of light-receiving part edge (XY direction) at 2 ± 70 μm
And the reflection angle of the laser beam.

As described above, according to the second embodiment, the same effect as that of the first embodiment can be obtained, that is, a laser element and a photodetector can be mounted with high accuracy, and the manufacturing process thereof is simpler. Can be. (3) Hereinafter, a third embodiment of the present invention will be described. The same parts as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 5 is a structural view of the optical pickup device as viewed from the side. An insulating substrate 40 on which a circuit pattern is formed is mounted on the glass substrate 10. The insulating substrate 40 has a through hole 41 for passing the laser light Q output from the laser element 15 and a hologram element 19.
Through holes 42 are formed for passing the diffracted light Q _a from.

The insulating substrate 40 is, for example, a resin substrate,
A rigid substrate such as a ceramic substrate or a metal core substrate, or a flexible substrate such as a TAB tape or a flexible substrate may be used.

On the insulating substrate 40, a heat sink 1
2 is mounted thereon, and a laser light reflecting surface 13 is formed on the upper surface thereof. On the vertical surface of the heat sink 12,
A laser element 15 is mounted via a submount substrate 14.

The mounting accuracy of the laser element 15 is ±± with respect to the XY directions of the insulating substrate 40, as in the above embodiment.
Although the heat sink 12 is 100 μm,
5 can be positioned and mounted on the insulating substrate 40 after being connected to the heat sink 12, so that the accuracy of the insulating substrate 40 and the heat sink 12 can be kept within ± 100 μm even if the accuracy is a little poor.

The first light detecting element 17 is mounted on the insulating substrate 40 with its light detecting surface facing the insulating substrate 40. A hologram element 19 is fixedly arranged on the glass substrate 10 by a hologram holder 21 on the optical path of the laser light Q output from the laser element 15.

Here, the relative position between the laser element 15 and the first light detecting element 17 is, as in the above-described embodiment, between the laser emission point of the laser element 15 and the light receiving section center of the first light detecting element 17. If the distance is about 2 mm, relative accuracy of about ± 5 μm can be obtained in the XY directions by the flip chip bonder.

Also, the accuracy in the Z direction ± 40 μm is
Although determined by the flatness of 0, even if the substrate size of the glass substrate 10 is large, the flatness of ± 40 μm can be sufficiently obtained because it is about 10 mm × 5 mm.

The second light detecting element 22 is mounted on the insulating substrate 40. The relative position between the second light detecting element 22 and the laser element 15 is determined by the positional accuracy of the laser reflected light Q _b from the laser light reflecting surface 13 to the light receiving portion edge (XY direction) at the second light detecting element 22. It is determined by ± 70 μm and the reflection angle of the laser beam.

As described above, according to the third embodiment, the same effects as those of the first embodiment can be obtained, that is, a laser element and a photodetector can be mounted with high accuracy, and the manufacturing process can be simplified. Can be.

The present invention is not limited to the first to third embodiments, but may be modified as follows. For example, as the substrate, a light-transmitting glass substrate 10
Although the through holes 31 and 32 are formed in the non-light-transmitting insulating substrate 30, the non-light-transmitting insulating substrate 30 and the glass substrate may be combined.

[0076]

As described in detail above, claims 1 to 5 of the present invention.
According to 7, it is possible to provide an optical pickup device in which a laser element and a photodetector can be mounted with high accuracy and the manufacturing process thereof can be further simplified.

Further, according to the third aspect of the present invention, it is possible to provide an optical pickup device capable of obtaining sufficient mounting accuracy even with the flatness of the glass substrate. Further, according to the seventh aspect of the present invention, it is possible to provide an optical pickup device capable of obtaining a sufficient accuracy of the relative position between the laser element and the first light detection element by using the hologram element.

According to the eighth and ninth aspects of the present invention, it is possible to provide a method of manufacturing an optical pickup device in which a laser element and a photodetector can be mounted with high accuracy and the manufacturing process can be simplified.

According to the eighth aspect of the present invention, since the heat sink is positioned and mounted on the light-transmitting substrate after the laser element is connected to the heat sink, the accuracy of the substrate and the heat sink is slightly deteriorated. Also, it is possible to provide a method of manufacturing an optical pickup device that can be set within a predetermined mounting accuracy.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a first embodiment of an optical pickup device according to the present invention.

FIG. 2 is an enlarged view around a heat sink in the device.

FIG. 3 is a manufacturing flowchart of the same device.

FIG. 4 is a configuration diagram showing a second embodiment of the optical pickup device according to the present invention.

FIG. 5 is a configuration diagram showing a third embodiment of the optical pickup device according to the present invention.

FIG. 6 is a configuration diagram of a conventional optical pickup device.

[Explanation of symbols]

 Reference Signs List 10: glass substrate, 12: heat sink, 14: submount substrate, 15: laser element, 17: first light detection element, 19: hologram element, 20: optical disk, 22: second light detection element, 30: non- Light-transmitting insulating substrate, 31, 32, 41, 42 ... through-hole, 40 ... insulating substrate.

Continuation of the front page (72) Inventor Masayuki Arakawa 3-3-9, Shimbashi, Minato-ku, Tokyo Inside Toshiba AV EE Co., Ltd.

Claims (9)

[Claims] A substrate having a light-transmitting portion; a laser element for outputting laser light to an object through the substrate; a diffraction element for diffracting reflected laser light from the object; An optical pickup device, comprising: a photodetector that receives diffracted light via the substrate. 2. A substrate on which a wiring pattern is formed, a heat sink mounted on the substrate, a laser element provided on a vertical surface of the heat sink and outputting laser light to an object via the substrate, A diffraction element that diffracts the reflected laser light from the object, and a light detection element that is mounted on the substrate and receives the diffracted light diffracted by the diffraction element through the substrate. An optical pickup device characterized by the following. 3. The optical pickup device according to claim 1, wherein the substrate is a translucent glass substrate. 4. The substrate according to claim 1, wherein each of the through holes is formed in each of the optical paths of the laser light output from the laser element and the diffracted light from the diffraction element. Optical pickup device. 5. The substrate is a light-transmitting glass substrate, and a light-shielding insulating substrate having a through-hole through which laser light and diffracted light are formed is adhered on the glass substrate, and 3. The optical pickup device according to claim 2, wherein the wiring pattern is formed on the substrate via the insulating substrate. 6. The heat sink is provided with a reflection surface for obliquely reflecting the monitor laser light output from the laser element with respect to the substrate, and the monitor laser light is provided on the substrate. 3. An optical pickup device according to claim 2, further comprising a monitoring light detecting element for receiving the light. 7. The optical pickup device according to claim 1, wherein the diffraction element is a hologram element. 8. A first step of bonding the laser element to a heat sink, a second step of mounting the heat sink to which the laser element is bonded on a flat substrate having a transparent portion, and the substrate A third step of mounting a photodetector at a predetermined position on the upper side, and reflected laser light from the object on an optical path of laser light output from the laser element and transmitted through the substrate to irradiate the object. Providing a diffractive element for diffracting the diffracted light and propagating the diffracted light toward the photodetector. 4. A method for manufacturing an optical pickup device, comprising: 9. The heat sink has a reflection surface that obliquely reflects the monitor laser light output from the laser device with respect to the substrate, and the monitor laser light is provided on the substrate. 9. The method for manufacturing an optical pickup device according to claim 8, further comprising a monitoring light detecting element for receiving light.