[go: up one dir, main page]

JPH10214819A - Electrode plate for plasma etching - Google Patents

Electrode plate for plasma etching

Info

Publication number
JPH10214819A
JPH10214819A JP1385097A JP1385097A JPH10214819A JP H10214819 A JPH10214819 A JP H10214819A JP 1385097 A JP1385097 A JP 1385097A JP 1385097 A JP1385097 A JP 1385097A JP H10214819 A JPH10214819 A JP H10214819A
Authority
JP
Japan
Prior art keywords
electrode plate
glassy carbon
particles
plasma etching
lattice constant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1385097A
Other languages
Japanese (ja)
Inventor
Toru Fujiwara
徹 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP1385097A priority Critical patent/JPH10214819A/en
Publication of JPH10214819A publication Critical patent/JPH10214819A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain an electrode plate for plasma etching with reduced production of particles by using glassy carbon having a lattice constant in a specific range regarding a specific plane of an included crystal. SOLUTION: The glassy carbon has a structure where graphite crystals dispersedly exists in an amorphous matrix. Fluorocarbon polymer is generated by entrance of fluorine between the graphite crystal layers, and the polymer becomes particles. However, the production of particles can be reduced by forming an electrode plate 10 for plasma etching with glassy carbon having the lattice constant in the range of 3.450Å to 4.500Å regarding the (002) plane of the graphite crystal. The electrode plate 10 is formed by processing the glassy carbon into a disk having a diameter of 200mm and a thickness of 300mm, forming 1,700 pieces through holes 12 each having a diameter of 0.8mm in the disk, forming an attachment hole 14, then, mirror-processing the surfaces of the disk, thereafter, performing purification processing by using chlorine gas.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プラズマエッチン
グを行なうための装置(プラズマエッチャー)に用いら
れる電極板に関し、特に、パーティクルの発生が少ない
ガラス状カーボンからなるプラズマエッチング用電極板
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode plate used for an apparatus (plasma etcher) for performing plasma etching, and more particularly to an electrode plate for plasma etching made of glassy carbon which generates little particles.

【0002】[0002]

【従来の技術】半導体集積回路の製造においてウェハま
たはウェハ表面上に形成された薄膜の全面または特定し
た場所を必要な厚さだけ食刻するため反応性ガスプラズ
マを利用したドライエッチング装置では、エッチング室
内等に電極板が装着されている。このプラズマエッチン
グ装置に用いられる電極板の材料には、(1)使用され
るエッチングガスと電極材料との反応物が揮発性である
こと、(2)電極材料が不純物の汚染源とならないこ
と、(3)電極自体がエッチングされていくとき均一に
エッチングされること、(4)電極材料がパーティクル
の発生源とならないこと等の特性が要求される。特に、
パーティクルがウェハ上に付着した場合、その部分がエ
ッチングに対して保護されてしまい、エッチングが不均
一となる結果、製品不良を生じさせてしまう。したがっ
て、パーティクルの発生源とならない電極材料を得るこ
とは、重要な課題である。
2. Description of the Related Art In the manufacture of a semiconductor integrated circuit, a dry etching apparatus using a reactive gas plasma for etching a whole surface or a specified place of a wafer or a thin film formed on the surface of the wafer to a required thickness is used. An electrode plate is mounted in a room or the like. The material of the electrode plate used in the plasma etching apparatus includes (1) that a reaction product of an etching gas to be used and the electrode material is volatile; (2) that the electrode material does not become a contamination source of impurities; Characteristics such as 3) uniform etching when the electrode itself is etched, and (4) characteristics that the electrode material does not become a source of particles are required. Especially,
When particles adhere to the wafer, the portion is protected from etching, and the etching becomes non-uniform, resulting in a product defect. Therefore, obtaining an electrode material that does not become a source of particles is an important issue.

【0003】特開昭62−252942号公報は、プラ
ズマエッチング用電極板の材料として、高純度のガラス
状カーボンを用いることを開示する。同公報は、液状の
フラン系樹脂、フェノール系樹脂またはこれらの混合樹
脂、もしくはこれら液状樹脂に同一種類の硬化樹脂微粉
を添加混合したものを均一肉厚の平板状に成形硬化し、
次いで樹脂板を不活性雰囲気下に800℃程度の温度で
焼成炭化し、さらに必要に応じて3000℃までの温度
で黒鉛化処理し、このようにして得られたガラス状カー
ボンを高純度処理した後、電極板に使用することを記載
している。同公報は、製造されたガラス状カーボンから
なるプラズマエッチング用電極は、黒鉛とは異なる3次
元網目状ガラス構造の均質緻密組織を呈しており、高純
度、高精度、高化学的安定性などの適合物性を具備して
いる旨記載する。
Japanese Patent Application Laid-Open No. 62-252942 discloses the use of high-purity glassy carbon as a material for an electrode plate for plasma etching. The publication discloses a liquid furan-based resin, a phenol-based resin or a mixed resin thereof, or a mixture obtained by adding and mixing the same type of hardened resin fine powder to these liquid resins, forming and curing into a flat plate having a uniform thickness,
Next, the resin plate was calcined and carbonized at a temperature of about 800 ° C. in an inert atmosphere, and if necessary, graphitized at a temperature of up to 3000 ° C., and the glassy carbon thus obtained was subjected to a high-purity treatment. Later, it is described that it is used for an electrode plate. The publication discloses that the manufactured electrode for plasma etching made of glassy carbon has a homogeneous dense structure having a three-dimensional network glass structure different from graphite, and has high purity, high accuracy, high chemical stability, etc. Describe that it has compatible physical properties.

【0004】特開平3−119723号公報は、最大気
孔径1μm以下、平均気孔径0.7μm以下で気孔率が
1%以下の組織特性を有する高純度ガラス状カーボンか
らなるプラズマエッチング用電極板を開示する。同公報
の技術では、平均気孔径を0.7μm以下、最大気孔径
を1μm以下とし、気孔率を1%以下とすることによっ
て、発生するパーティクルの数を抑制しようとしてい
る。また、特開平6−128762号公報は、ガラス状
カーボン電極板の面粗さをRmax10μm以下に加工
することで発生するパーティクルの低減を図ろうとして
いる。
Japanese Patent Application Laid-Open No. 3-119723 discloses an electrode plate for plasma etching made of high-purity glassy carbon having a maximum pore diameter of 1 μm or less, an average pore diameter of 0.7 μm or less, and a porosity of 1% or less. Disclose. In the technique disclosed in the publication, the number of generated particles is controlled by setting the average pore diameter to 0.7 μm or less, the maximum pore diameter to 1 μm or less, and the porosity to 1% or less. Japanese Patent Application Laid-Open No. 6-128762 attempts to reduce particles generated by processing the glassy carbon electrode plate to have a surface roughness of Rmax 10 μm or less.

【0005】これらの従来の技術におけるパーティクル
の低減対策は、いずれも、ガラス状カーボン電極板から
炭素粒子が脱離することによりパーティクルが発生する
ことを前提としたものである。しかし、本発明者は、検
討の結果、このような前提の下に改善を行なっても、パ
ーティクルの発生の低減について十分な効果が得られな
かった。
[0005] All of these conventional techniques for reducing particles are based on the premise that particles are generated by detachment of carbon particles from a glassy carbon electrode plate. However, as a result of the study, the present inventor did not achieve a sufficient effect in reducing the generation of particles even if the improvement was made under such a premise.

【0006】[0006]

【発明が解決しようとする課題】本発明の目的は、パー
ティクルの発生がより少ないプラズマエッチング用電極
板を提供することである。
SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrode plate for plasma etching which generates less particles.

【0007】[0007]

【課題を解決するための手段】本発明者は、パーティク
ルの発生原因について鋭意検討した結果、エッチングの
ための反応ガスとして使用されるトリフルオロメタン
(CHF3 )等のフッ素系ガスとガラス状カーボン電極
板との反応によって生成する炭化フッ素系高分子がパー
ティクルの発生に大きく寄与していることを突き止め
た。そして本発明者は、フッ素系反応ガスとの反応によ
って炭化フッ素系高分子を発生させにくいガラス状カー
ボン電極板を得るべく、鋭意研究を行なった結果、ガラ
ス状カーボンにおける黒鉛層状構造部分の格子定数d
002 がパーティクル発生の程度と関係することを見出
し、該格子定数の大きさを3.450Å〜4.500Å
の範囲にすればパーティクルの発生をより低減できるこ
とを突き止め、本発明を完成させるに至った。
The inventors of the present invention have conducted intensive studies on the causes of the generation of particles and found that a fluorine-based gas such as trifluoromethane (CHF 3 ) used as a reaction gas for etching and a glassy carbon electrode. They found that the fluorocarbon polymer generated by the reaction with the plate greatly contributed to the generation of particles. The present inventor has conducted intensive studies in order to obtain a glassy carbon electrode plate in which a fluorocarbon polymer is unlikely to be generated by reaction with a fluorine-based reaction gas. As a result, the lattice constant of the graphite layered structure in the glassy carbon was determined. d
002 is related to the degree of particle generation, and the magnitude of the lattice constant is set to 3.450 ° to 4.500 °.
It has been found out that the generation of particles can be further reduced if the ratio is within the range described above, and the present invention has been completed.

【0008】すなわち本発明のプラズマエッチング用電
極板は、含有される結晶の(002)面に関する格子定
数d002 が3.450Å〜4.500Åの範囲であるガ
ラス状カーボンからなることを特徴とする。
That is, the electrode plate for plasma etching of the present invention is characterized in that the crystal constant is made of glassy carbon having a lattice constant d 002 with respect to the (002) plane in the range of 3.450 to 4.500 °. .

【0009】格子定数d002 は、たとえば日本学術振興
会第117委員会で制定した方法により測定することが
できる。具体的には、電極板を構成するガラス状カーボ
ン材料を基準物質(シリコン)とともに所定の粒度まで
粉砕し、得られた混合粉末についてX線回折法により
(002)面に関する回折ピークを求め、得られたピー
クからの算定値を基準物質から求められた算定値により
補正して格子定数d002を求めることができる。
The lattice constant d 002 can be measured, for example, by a method established by the 117th Committee of the Japan Society for the Promotion of Science. Specifically, a glassy carbon material constituting an electrode plate is ground together with a reference substance (silicon) to a predetermined particle size, and the obtained mixed powder is subjected to an X-ray diffraction method to obtain a diffraction peak relating to the (002) plane. The lattice constant d 002 can be obtained by correcting the calculated value from the obtained peak with the calculated value obtained from the reference material.

【0010】[0010]

【発明の実施の形態】プラズマエッチャーの電極板にカ
ーボン材料が適用される理由は、プラズマエッチングの
ための反応性ガスを構成する元素(フッ素)と炭素とが
反応してできる生成物CF4 が揮発性であるためであ
る。しかし、炭素とフッ素の反応によって生成する反応
物の形態は、反応される炭素の結晶性によって異なって
くる。炭素が黒鉛相(高結晶性)の場合には、炭素とフ
ッ素の反応によって炭化フッ素系高分子も生成するよう
になる。ガラス状カーボンは、一般に微細な黒鉛結晶子
を含んでおり、非晶質のマトリックス中に黒鉛層状結晶
子が点在した構造を有している。この黒鉛層状結晶子の
層間にフッ素が侵入し、(CF)n や(CF2 n等の
炭化フッ素系高分子が形成され、この高分子がパーティ
クルとなることが見出された。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The reason why a carbon material is applied to an electrode plate of a plasma etcher is that a product CF 4 formed by a reaction between carbon and an element (fluorine) constituting a reactive gas for plasma etching is used. This is because it is volatile. However, the form of the reactant produced by the reaction between carbon and fluorine depends on the crystallinity of the carbon to be reacted. When carbon is a graphite phase (highly crystalline), a reaction between carbon and fluorine also produces a fluorocarbon polymer. Glassy carbon generally contains fine graphite crystallites, and has a structure in which graphite layered crystallites are scattered in an amorphous matrix. It has been found that fluorine penetrates between the layers of the graphite layered crystallites to form a fluorocarbon polymer such as (CF) n or (CF 2 ) n, and that this polymer becomes a particle.

【0011】本発明者は、この黒鉛層状結晶子の格子定
数d002 (層間距離または面間隔)が3.450Åより
小さい場合、侵入したフッ素と黒鉛層状結晶子の炭素と
の反応が進みやすく、パーティクルが相対的に多く発生
することを見出す一方、この格子定数を3.450Å以
上とし、3.450Å〜4.500Åの範囲に設定した
ガラス状カーボンによってプラズマエッチング用電極板
を形成することにより、パーティクルの発生を低減させ
ることに成功した。一方、この格子定数が4.500Å
を超えるガラス状カーボンは、電気抵抗が過大になり電
極板として使用できなかった。
The inventor of the present invention has found that when the lattice constant d 002 (interlayer distance or spacing) of the graphite layered crystallites is smaller than 3.450 °, the reaction between the invading fluorine and the carbon of the graphite layered crystallites proceeds easily. While it is found that particles are generated in a relatively large amount, the lattice constant is set to 3.450 ° or more, and the electrode plate for plasma etching is formed by glassy carbon set in the range of 3.450 ° to 4.500 °, We succeeded in reducing the generation of particles. On the other hand, this lattice constant is 4.500 °
When the glassy carbon content exceeds the limit, the electrical resistance becomes excessively large and cannot be used as an electrode plate.

【0012】ガラス状カーボンを製造するための原料樹
脂には、フェノール樹脂およびフラン樹脂等を好ましく
用いることができる。フェノール樹脂を出発原料として
用いる場合、フェノール樹脂を成形・硬化した後、ガラ
ス状カーボンを得るために焼成を行なう温度を、150
0℃〜2000℃とすることが好ましい。また、フラン
樹脂を出発原料として用いる場合は、鋳込成形・硬化し
た後、フェノール樹脂の場合と同様に1500℃〜20
00℃で焼成することが好ましい。従来の技術のように
800℃程度の低い温度では、格子定数が相対的に高く
なりすぎて、電極板として機能しないものが得られやす
い。また、3000℃に近い温度まで焼成温度を上昇さ
せると、d002 は相対的に小さくなりすぎて、上述した
高分子のパーティクルが発生しやすいガラス状カーボン
が得られるようになる。
As a raw material resin for producing glassy carbon, a phenol resin, a furan resin or the like can be preferably used. When a phenol resin is used as a starting material, the temperature at which the phenol resin is molded and cured, and then fired to obtain glassy carbon, is set at 150 ° C.
The temperature is preferably from 0 ° C to 2000 ° C. When a furan resin is used as a starting material, it is cast-molded and cured, and then, similarly to the case of a phenol resin, at 1500 ° C. to 20 ° C.
Firing at 00 ° C. is preferred. At a temperature as low as about 800 ° C. as in the prior art, the lattice constant becomes relatively too high, and a material that does not function as an electrode plate is likely to be obtained. When the firing temperature is raised to a temperature close to 3000 ° C., d 002 becomes relatively too small, and glassy carbon in which the above-described polymer particles are easily generated can be obtained.

【0013】また本発明者は、実験の結果、パーティク
ルの発生を抑制するために、従来提案されていたような
ガラス状カーボンの気孔径や気孔率を低減することより
もむしろガラス状カーボンに含有される結晶の格子定数
002 を所定の範囲に収める方が重要であることを見出
した。すなわち、格子定数d002 が3.450Å〜4.
500Åの範囲であれば、気孔径および気孔率が比較的
高くとも、パーティクルの発生が少ない電極板を提供で
きることが見出された。本発明によれば、プラズマエッ
チング用電極板を構成するガラス状カーボンは、1μm
を超える最大気孔径を有していてもよく、たとえば径が
20μm程度までの最大気孔を有していても格子定数d
002 が3.450Å〜4.500Åの範囲であれば、パ
ーティクルの発生は少ない。また、本発明によれば、電
極板を構成するガラス状カーボンの気孔率も1%を超え
ていてもよく、たとえば15%程度までの気孔率を有し
ていても格子定数d002 が3.450Å〜4.500Å
の範囲であれば、パーティクルの発生は少ない。
Further, as a result of experiments, the present inventor has found that in order to suppress the generation of particles, rather than reducing the pore diameter and porosity of the glassy carbon as conventionally proposed, the glassy carbon is contained in the glassy carbon. It has been found that it is more important to keep the lattice constant d 002 of the crystal to be obtained within a predetermined range. That is, the lattice constant d 002 is 3.450 ° -4.
It has been found that when the temperature is in the range of 500 °, an electrode plate with less generation of particles can be provided even if the pore diameter and porosity are relatively high. According to the present invention, the glassy carbon constituting the electrode plate for plasma etching is 1 μm
May be larger than the maximum pore diameter. For example, even if the maximum pore diameter is up to about 20 μm, the lattice constant d
When 002 is in the range of 3.450 to 4.500 °, the generation of particles is small. Further, according to the present invention, the porosity of the glassy carbon constituting the electrode plate may be more than 1%. For example, even if it has a porosity of about 15%, the lattice constant d 002 is 3. 450Å-4.500Å
Within the range, the generation of particles is small.

【0014】[0014]

【実施例】以下に実施例によって本発明をより詳細に説
明するが、本発明はこの実施例に限定されるものではな
く、他の原料たとえばフラン樹脂等および他の製造方法
により、格子定数d002 の値が3.450Å〜4.50
0Åのガラス状カーボンを製造することによって本発明
の電極板を得ることが可能である。
EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the present invention is limited to these Examples. The value of 002 is 3.450Å4.50
It is possible to obtain the electrode plate of the present invention by producing 0 ° glassy carbon.

【0015】実施例1〜4 出発原料としてフェノール樹脂を用い、これを平均粒径
15μmに粉砕し、200℃においてホットプレス成形
および硬化を行なった。得られた成形体を表1に示すそ
れぞれの温度で焼成を行ないガラス状カーボン素材を得
た。因に、ガラス状カーボン素材の気孔率は0.020
cc/g(約3%)以下であった。得られたそれぞれの
素材を直径200mm、厚さ3mmの円板状に加工し
た。得られた円板に直径0.8mmの貫通孔を1700
個形成し、さらに取付用穴を形成し、外表面をラッピン
グにより鏡面加工した後、塩素ガスにより純化処理を行
なって電極板を作製した。得られた電極板を図1に示
す。プラズマエッチング用電極板10は、円板形状であ
り、周辺部を除く円形の領域には、多数の貫通孔12が
形成されている。またその周辺部には、取付用穴14が
円周上に4個設けられている。
Examples 1 to 4 A phenol resin was used as a starting material, which was pulverized to an average particle size of 15 μm, and hot-pressed and cured at 200 ° C. The obtained molded body was fired at each temperature shown in Table 1 to obtain a glassy carbon material. The porosity of the glassy carbon material is 0.020.
cc / g (about 3%) or less. Each of the obtained raw materials was processed into a disk shape having a diameter of 200 mm and a thickness of 3 mm. A through hole having a diameter of 0.8 mm was formed in the obtained disc by 1700.
An electrode plate was formed by forming individual pieces, further forming a mounting hole, and mirror-finishing the outer surface by lapping, and then purifying with a chlorine gas. The resulting electrode plate is shown in FIG. The electrode plate 10 for plasma etching has a disk shape, and a large number of through holes 12 are formed in a circular region excluding a peripheral portion. In the periphery, four mounting holes 14 are provided on the circumference.

【0016】実施例5 出発原料としてフラン系樹脂を用い、鋳込み成形・硬化
処理を施した後、2000℃で焼成を行なって気孔率
0.095cc/g(約14%)のガラス状カーボン素
材を得た。ガラス状カーボン素材では、最大で約20μ
mの径を有する気孔が認められた。得られたガラス状カ
ーボン素材を実施例1〜4と同様の要領で加工し、プラ
ズマエッチング用電極板を作製した。
Example 5 A furan-based resin was used as a starting material, cast-molded and cured, and then calcined at 2000 ° C. to obtain a glassy carbon material having a porosity of 0.095 cc / g (about 14%). Obtained. For glassy carbon material, up to about 20μ
Pores having a diameter of m were observed. The obtained glassy carbon material was processed in the same manner as in Examples 1 to 4, to produce an electrode plate for plasma etching.

【0017】比較例1〜3 表1に示す温度でそれぞれ成形体を焼成した以外は、実
施例1〜4と同様にして電極板を作製した。
Comparative Examples 1 to 3 Electrode plates were prepared in the same manner as in Examples 1 to 4, except that the compacts were fired at the temperatures shown in Table 1, respectively.

【0018】以上のようにして得られた電極板から試料
片を切取り、ガラス状カーボンについて格子定数d002
を日本学術振興会第117委員会で制定した方法に従っ
て測定した。その結果を表1に示す。また、得られた電
極板をそれぞれプラズマエッチング装置に装着し、CH
3 、CF4 およびArを混合した反応ガスを用いて1
0分間エッチング試験を行なった。エッチングには6イ
ンチシリコンウェハを用いた。10分間のエッチング操
作の後、ウェハ上に存在するパーティクルの数をパーテ
ィクルカウンタで測定した。その結果を表1に示す。
A sample piece was cut from the electrode plate obtained as described above, and the lattice constant d 002 of glassy carbon was measured.
Was measured according to the method established by the 117th Committee of the Japan Society for the Promotion of Science. Table 1 shows the results. Also, each of the obtained electrode plates was mounted on a plasma etching apparatus, and CH
1 using a reaction gas obtained by mixing F 3 , CF 4 and Ar
An etching test was performed for 0 minutes. A 6-inch silicon wafer was used for etching. After the etching operation for 10 minutes, the number of particles existing on the wafer was measured by a particle counter. Table 1 shows the results.

【0019】[0019]

【表1】 [Table 1]

【0020】表1に示すように、結晶の格子定数d002
が本発明の範囲内にある実施例1〜5のパーティクル発
生数は、比較例1および2に比べて大幅に低減してい
る。なお、結晶の格子定数d002 が4.5Åよりも大き
な比較例3では、電極板の電気抵抗値が大きいため試験
を行なうことができなかった。
As shown in Table 1, the lattice constant d 002 of the crystal
However, the number of generated particles in Examples 1 to 5 falling within the scope of the present invention is significantly reduced as compared with Comparative Examples 1 and 2. In Comparative Example 3 in which the lattice constant d 002 of the crystal was larger than 4.5 °, the test could not be performed because the electric resistance of the electrode plate was large.

【0021】[0021]

【発明の効果】以上示してきたように、本発明によれ
ば、パーティクル発生がより少ないプラズマエッチング
用電極板を提供することができる。本発明の電極板は、
半導体装置の製造において安定で均一なエッチング加工
をもたらすことができ、製品不良の抑制に寄与し得るも
のである。
As described above, according to the present invention, it is possible to provide an electrode plate for plasma etching with less generation of particles. The electrode plate of the present invention,
This can provide stable and uniform etching in the manufacture of semiconductor devices, and can contribute to suppressing product defects.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に従うプラズマエッチング用電極板の一
具体例についてその形状を示す平面図である。
FIG. 1 is a plan view showing a shape of a specific example of an electrode plate for plasma etching according to the present invention.

【符号の説明】[Explanation of symbols]

10 プラズマエッチング用電極板 12 貫通孔 14 取付用穴 Reference Signs List 10 electrode plate for plasma etching 12 through hole 14 mounting hole

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 含有される結晶の(002)面に関する
格子定数d002 が3.450Å〜4.500Åの範囲で
あるガラス状カーボンからなることを特徴とする、プラ
ズマエッチング用電極板。
1. An electrode plate for plasma etching, comprising a glassy carbon having a lattice constant d 002 with respect to a (002) plane of a contained crystal in a range of 3.450 ° to 4.500 °.
JP1385097A 1997-01-28 1997-01-28 Electrode plate for plasma etching Withdrawn JPH10214819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1385097A JPH10214819A (en) 1997-01-28 1997-01-28 Electrode plate for plasma etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1385097A JPH10214819A (en) 1997-01-28 1997-01-28 Electrode plate for plasma etching

Publications (1)

Publication Number Publication Date
JPH10214819A true JPH10214819A (en) 1998-08-11

Family

ID=11844765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1385097A Withdrawn JPH10214819A (en) 1997-01-28 1997-01-28 Electrode plate for plasma etching

Country Status (1)

Country Link
JP (1) JPH10214819A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US7147749B2 (en) * 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US20140231018A1 (en) * 2013-02-15 2014-08-21 Kabushiki Kaisha Toshiba Plasma processing apparatus
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282112B2 (en) 2002-09-30 2007-10-16 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7566379B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7163585B2 (en) 2002-09-30 2007-01-16 Tokyo Electron Limited Method and apparatus for an improved optical window deposition shield in a plasma processing system
US7166200B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7166166B2 (en) 2002-09-30 2007-01-23 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US7204912B2 (en) 2002-09-30 2007-04-17 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7147749B2 (en) * 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US7566368B2 (en) 2002-09-30 2009-07-28 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate in a plasma processing system
US7137353B2 (en) 2002-09-30 2006-11-21 Tokyo Electron Limited Method and apparatus for an improved deposition shield in a plasma processing system
US8877002B2 (en) 2002-11-28 2014-11-04 Tokyo Electron Limited Internal member of a plasma processing vessel
US7560376B2 (en) 2003-03-31 2009-07-14 Tokyo Electron Limited Method for adjoining adjacent coatings on a processing element
US7291566B2 (en) 2003-03-31 2007-11-06 Tokyo Electron Limited Barrier layer for a processing element and a method of forming the same
US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US7601242B2 (en) 2005-01-11 2009-10-13 Tokyo Electron Limited Plasma processing system and baffle assembly for use in plasma processing system
US20140231018A1 (en) * 2013-02-15 2014-08-21 Kabushiki Kaisha Toshiba Plasma processing apparatus

Similar Documents

Publication Publication Date Title
US6013236A (en) Wafer
JPH10214819A (en) Electrode plate for plasma etching
US20060046920A1 (en) Silicon carbide sintered product and method for production thereof
JPH1161394A (en) Sputtering target board
EP1484297A1 (en) Method for manufacturing silicon carbide sintered compact jig and silicon carbide sintered compact jig manufactured by the method
WO2003040059A1 (en) Process for producing silicon carbide sinter jig for use in semiconductor production and silicon carbide sinter jig obtained by the process
JP2005285845A (en) Gas-jetting board for plasma etching apparatus
JPH1067565A (en) Sintered silicon carbide body and its production
US20060240287A1 (en) Dummy wafer and method for manufacturing thereof
JP3437026B2 (en) Electrode plate for plasma etching and method of manufacturing the same
JPH06128762A (en) Electrode plate for plasma etching
KR100427117B1 (en) Plasma-etching electrode plate
EP0885859B1 (en) Member for semiconductor equipment
JP2000349137A (en) Wafer support tool and manufacture thereof
JPH10101432A (en) Part for dry etching device
KR102491236B1 (en) Silicon carbide powder and method of fabrication the same
JPH1179847A (en) Production of silicon carbide sintered compact
JPH0941166A (en) Electrode for etching and its manufacture
JP2000031136A (en) Protective member for plasma processing equipment
JP3255586B2 (en) Electrode plate for plasma etching
JPH06177076A (en) Electrode for plasma etching
JPH11310459A (en) Glassy carbon material with excellent plasma resistance
TW202517851A (en) Apparatus for manufacturing silicon carbide ingot and method of manufacturing silicon carbide ingot using the same
JPH10291813A (en) Electrode plate for plasma etching
TW202517843A (en) Method of manufacturing silicon carbide ingot

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20040406