JPH10209338A - Semiconductor circuit device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor circuit device high ion reliability on insulation and low in manufacture cost. SOLUTION: A bank 3d is made in advance by applying sealing resin for application on bank in high viscosity with an applicator, surrounding the periphery of the section, for example, the high-voltage part A requiring the resin sealing on a printed wiring board 2 where an electronic component 1 is mounted, and the surrounded section is charged with sealing resin 3c for insulation so as to constitute a semiconductor circuit board 4, and a case 6 is set and bonded and fixed to it to make a semiconductor circuit device. Low viscosity will suffice for the sealing resin 3c for insulation, and it is charged, pervading into details, so favorable insulation performance can be secured, and a framework is not required for partitioning the sealing rein 3c for insulation in the specified range, and also the process of removing the framework becomes needless. Further, the bank 3d of desired height can be made by applying thin or thin and flat banks in layers plural times, or the bank 3d of optional height can be made by the number of times of superposed application.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor circuit device for controlling and driving an inverter motor or a brushless motor and a method of manufacturing the same.

[0002]

2. Description of the Related Art A conventional semiconductor circuit device will be described below. Conventionally, semiconductor modules for controlling and driving large-output inverter motors and brushless motors include power modules that integrate switching power elements, and intelligent power modules that combine switching power elements with control ICs and peripheral circuits. Has been used. Many of them employ a high-density mounting substrate using surface mounting components, pair chip components, or the like in order to realize miniaturization, weight reduction, and cost reduction. For this reason,
The distance between patterns, between components, and between electrodes is gradually narrowing, and there are problems such as the inability to secure an insulation distance and the inability to effectively dissipate heat from a switching power element that handles a large current.

[0003] As means for solving the above problems, a metal substrate is used for a printed circuit board, or a case is filled with resin to ensure insulation performance and improve heat radiation characteristics. Examples of these are disclosed in JP-A-4-277666 and JP-A-4-326755.

FIGS. 14 to 19 are sectional views showing the structure of a conventional semiconductor circuit device. Conventionally, as shown in FIG. 14, a semiconductor circuit device includes a switching power element 1a, a control IC 1b, and a peripheral circuit 1c on a printed circuit board 2.
A semiconductor circuit board 4 is formed by mounting the electronic components 1 such as a and 1cb, and a portion requiring insulation or heat radiation is potted only at a predetermined place with a sealing resin 3a having a relatively high viscosity, or FIG. As shown in FIG. 15, a mold 5 for resin molding is provided around the semiconductor circuit board 4, and a sealing resin 3 b having a relatively low viscosity is filled therein to seal the entire semiconductor circuit board 4. In addition, as shown in FIG. 16, the mold 5 is removed to form a semiconductor circuit device. In FIGS. 14 to 19, A is a switching power element 1a and its peripheral circuit 1ca generally a high voltage section, and B is a control IC 1b and its peripheral circuit 1ca.
cb generally indicates a low voltage part.

Further, in order to facilitate the handling of the semiconductor circuit device constructed as described above, and to protect the semiconductor circuit device from the contact that the sealing resin is broken due to interference with other constituent members, Means for fitting and bonding the substrate 4 to the case and then sealing the inside of the case, for example, as shown in FIG. 17, the periphery of the semiconductor circuit substrate 4 is surrounded by the case 6, or as shown in FIG. Case 6 with ceiling
To form a semiconductor circuit device by enclosing it to the upper part.

As shown in FIG. 19, when the sealing resin 3b is filled after fitting and bonding the semiconductor circuit board 4 and the case 6, the sealing resin 3b is removed from the opening 7a provided in the case 6. A means for attaching the lid 7b after the injection and filling was common.

[0007]

However, such a conventional semiconductor circuit device has the following problems.

[0008] 1. When potting the sealing resin only at a predetermined location, a relatively high-viscosity sealing resin is used, so that it is possible to seal down to details such as between electrodes of complicated electronic components and between adjacent chip components. The resin does not spread and insulation cannot be secured.

[0009] 2. When the sealing resin is potted only at a predetermined location using a sealing resin having a relatively high viscosity, the position and the height of the potting cannot be accurately controlled.

[0010] 3. When the entire semiconductor circuit board is filled with the sealing resin without using the case, it is necessary to use a mold so that the sealing resin does not flow out of the semiconductor circuit board.
In addition, a step of removing the mold after filling and curing the sealing resin in the mold is required.

4. When the sealing resin is filled in a case having a ceiling, the case needs an opening for injecting the sealing resin, and the mechanical strength is reduced or the sealing resin is exposed from the opening. Inconvenient handling occurs. In order to prevent this, a lid for closing the opening is required, and a step of attaching the lid is required.

5. Except when potting the sealing resin only at a predetermined place using a sealing resin having a relatively high viscosity, the sealing resin is filled up to a place that does not require insulation or heat radiation. It was overpriced.

An object of the present invention is to solve the above-mentioned problems and to provide a highly reliable and low-cost semiconductor circuit device.

[0014]

Means for Solving the Problems Claims 1 and 5
The present invention described in (1) is a bank coat sealing having a higher viscosity than the insulating sealing resin so as to surround a portion where a predetermined portion on the printed board on which the electronic component is mounted is resin-sealed with the insulating sealing resin. A semiconductor in which a resin is injected from a nozzle of an applicator to form a bank having insulation of a predetermined width and height in advance, and the insulating sealing resin is filled in the bank surrounded by the bank to seal the resin. It is a circuit device and its manufacturing method.

[0015] Thus, only the necessary parts can be sealed with the low-viscosity insulating sealing resin, the insulating sealing resin can be spread to the minute parts to ensure insulation, and the consumption of excess resin can be reduced. Can be avoided.

According to a second aspect of the present invention, when a bank is formed by injecting a sealing resin for bank coating from a nozzle of a coating machine, the bank coating is performed at a height lower than a desired bank height. The semiconductor circuit device according to claim 1 or claim 5, wherein a bank is formed by injecting a sealing resin for application and applying a predetermined number of times to build up a bank by a desired height.

Thus, a fine bank having a narrower width than that of a single-layered bank can be formed, and only necessary portions can be accurately divided and sealed with an insulating sealing resin. In addition, since the height of the bank can be arbitrarily adjusted, banks having different heights can be easily formed, and resin sealing can be performed at an arbitrary height.

According to the third and seventh aspects of the present invention, a predetermined width on a printed circuit board on which an electronic component is mounted is set to a predetermined width so as to surround a portion to be resin-sealed with an insulating sealing resin. A semiconductor circuit device in which a mold having a height is fixedly adhered to the printed circuit board, and a portion surrounded by the mold is filled with the insulating sealing resin and resin-sealed, and a method of manufacturing the same.

Thus, the portion to be sealed with the resin can be accurately set, and the height thereof can be accurately set.

According to a fourth aspect of the present invention, a predetermined width on a printed circuit board on which an electronic component is mounted is set to a predetermined width so as to surround a portion to be resin-sealed with an insulating sealing resin. A semiconductor circuit device in which a mold having a height is set in close contact with the printed circuit board, the space surrounded by the mold is filled with the insulating sealing resin, and then the mold is removed, and a method of manufacturing the same.

Thus, the portion to be sealed with the resin can be set accurately and the height thereof can be set accurately.

The ninth and tenth aspects of the present invention are a semiconductor circuit device using a printed circuit board as a metal substrate and a method of manufacturing the same.

As a result, the heat radiation effect is improved, and it is not necessary to consider the heat radiation effect of the resin-sealed portion.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Claims 1 and 5 of the present invention
In the invention described in (1), the bank means a partition for filling with the sealing resin for insulation, and the bank is formed by applying the sealing resin for bank coating to a predetermined position while injecting the sealing resin for bank coating from the nozzle of the coating machine. A high-viscosity resin is used so that the resin does not lose its shape when injected from the nozzle of the coating machine, and a resin having an insulating property is used.

The invention described in claim 2 and claim 6 is as follows:
The shape of the embankment sealing resin injected from the nozzle of the applicator is made thin, or thin and flat, and therefore, the shape of the nozzle is made thin or thin and flat.

According to the third and seventh aspects of the present invention,
The mold means a partition for filling the insulating sealing resin, and is fixed to the printed circuit board after filling. In order to set the position accurately, a fitting portion with the printed circuit board is provided.

The invention described in claim 4 and claim 8 is as follows.
The mold means a partition for filling the insulating sealing resin, and is removed after filling. For ease of removal, use a tapered formwork or a formwork with a smooth surface finish.

According to the ninth and tenth aspects of the present invention, the metal substrate means that the material of the printed board is metal, and the circuit pattern is drawn on an insulating layer provided on the surface of the metal substrate. .

[0029]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing a configuration of a semiconductor circuit device of this embodiment. In the figure, a semiconductor circuit board 4 is configured by mounting a switching power element 1a, an IC 1b, peripheral circuits 1ca, 1cb, and the like on a printed board 2. Switching power element 1
The high-voltage section A is composed of a driving circuit composed of a and the peripheral circuit 1ca, and the low-voltage section B composed of the other control IC 1b and its peripheral circuit 1cb is separately arranged. Further, since these electronic components 1 are mounted with a high degree of integration, the insulation performance cannot be satisfied as it is, and the insulating sealing resin 3c is required to secure the insulation performance.
It seals with. Needless to say, if a resin having good heat conductivity, for example, a silicon-based resin, is used as the insulating sealing resin 3c, it also contributes to the improvement of the heat radiation characteristics of the portion where heat radiation is required.

FIG. 1 also shows an insulation made of a resin having a higher viscosity than the insulating sealing resin 3c so as to surround a portion of the semiconductor circuit board 4 which needs to be sealed with the insulating sealing resin 3c. This shows a state in which the bank 3d is formed to a predetermined width and a predetermined height using the bank coating sealing resin, and a portion surrounded by the bank is filled with the insulating sealing resin 3c. For example, only the high voltage portion A can be resin-sealed at a required height depending on the location.

FIG. 2 is a perspective view showing a method of manufacturing the semiconductor circuit device of the present embodiment. In the figure, after a semiconductor circuit board 4 is formed by mounting an electronic component 1 such as a switching power element 1a or an IC 1b on a printed board 2, a portion surrounding the portion that needs to be sealed with an insulating sealing resin 3c is surrounded. , A sealing resin for bank coating is applied using a coating machine 11,
A bank 3d is formed. At this time, by using a resin having a higher viscosity than the insulating sealing resin 3c and also serving as insulation as the sealing resin for bank coating, the bank 3d with a predetermined width and a predetermined height is used.
Is easy to form. Next, the inside surrounded by the bank 3d is filled with an insulating sealing resin 3c, heated and cured, and then fitted and adhered and fixed to the case 6.

In this embodiment, a sealing resin of a type which is cured by volatilization of a volatile component is used as the insulating sealing resin 3c.
Although the case 6 is bonded and fixed, when a ventilation hole is provided in the case 6 or forced ventilation is performed, the heating / curing process and the fitting / bonding fixing process can be performed simultaneously.

Further, even when a resin containing no volatile component is used as the insulating sealing resin 3c, it goes without saying that the heating / curing treatment and the fitting / adhesion fixing treatment can be performed simultaneously.

As described above, according to the present embodiment, the portion of the semiconductor circuit board 4 on which the electronic component 1 is mounted, which needs to be sealed with resin, is covered with the bank sealing resin having relatively high viscosity for embankment. By forming the semiconductor circuit device 3d and filling it with the insulating sealing resin 3c and the manufacturing method thereof,
Only necessary parts can be sealed with resin without using a mold. No need to remove the mold, no extra insulating sealing resin is consumed, high reliability and low cost. Of the present invention can be realized.

When the printed circuit board 2 is a metal substrate, the printed circuit board 2 itself has excellent heat dissipation properties, so that it is not necessary to consider the heat dissipation properties of the insulating sealing resin 3c.

(Embodiment 2) FIGS. 3, 4 and 5 are cross-sectional views showing the configuration of a semiconductor circuit device of this embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted. In FIG. 3, when a bank 3d is formed by injecting the sealing resin for bank coating from the nozzle of the coating machine, a thin nozzle coating machine is used which applies the resin at a height lower than the finally desired bank height. This shows a state in which a bank 3d is formed by injecting a sealing resin for bank coating and applying a predetermined number of times to build up the bank to a desired height.

FIG. 4 is a cross-sectional view showing a structure in which a bank 3d is formed using a coating machine having a thin and flat nozzle. In one coating, as shown in FIG.
When the sealing resin for bank coating is applied, the width of the bank 3d is at least twice as high as the height. In the present embodiment, however, the narrow nozzle or the thin and flat nozzle is used, so that the narrow width is used. Can be used to form a bank 3d, a place where resin sealing is not required, a place where a signal of a circuit is desired to be monitored after resin sealing, a place where resin sealing is not desired, or the like, as shown in FIG. The position can be accurately controlled so that a part of the low voltage portion B is not sealed with resin.

FIGS. 6 and 7 are perspective views showing a method of manufacturing the semiconductor circuit device of this embodiment. FIG. 6 shows a thin nozzle which can be applied at a height lower than the finally desired height of the bank when forming the bank 3d by injecting the sealing resin for bank coating from the nozzle of the coating machine 11 or a thin and flat nozzle. Inject the sealing resin for embankment using a simple nozzle and apply it a predetermined number of times to build up to the desired height and embankment 3d
Is shown.

While it is difficult to perform a fine coating operation by one-time coating, in the present embodiment, since the coating is performed with a thin nozzle or a thin and flat nozzle, the bank 3d can be formed with a narrow width. , A fine coating operation can be performed.

Further, the height of the bank 3d can be adjusted by recoating a predetermined number of times, so that banks having different heights are formed as shown in FIG. Can be obtained.

As described above, according to the present embodiment, the bank is coated with a narrow nozzle or a thin and flat nozzle, so that the bank 3 has a small width and high accuracy.
d can be formed, and the resin-sealing can be accurately performed by distinguishing the places to be resin-sealed from the places not to be resin-sealed.

Since the printed circuit board 2 is made of a metal substrate, the printed circuit board 2 itself has excellent heat radiation properties, so that it is not necessary to consider the heat radiation properties of the insulating sealing resin 3c.

(Embodiment 3) FIG. 8 is a sectional view showing a configuration of a semiconductor circuit device of this embodiment. The same components as those in the first and second embodiments are assigned the same reference numerals, and the detailed description is omitted. In the present embodiment, a molding resin having a predetermined width and a predetermined height is formed so as to surround a portion of the semiconductor circuit board 4 shown in FIG. 1 which needs to be sealed with the insulating sealing resin 3c. Is fixed to the printed circuit board 2 in close contact with the printed circuit board 2, the space surrounded by the mold 5 is filled with an insulating sealing resin 3 c, and a portion requiring resin sealing is accurately resin-sealed. The height of the resin sealing portion C can be accurately controlled to a required height. In the configuration of this embodiment, the mold 5 is left on the printed circuit board 2.

FIG. 9 is a perspective view showing a means for accurately positioning the mold 5 at a predetermined position on the printed circuit board 2.
When the printed circuit board 2 and the mold 5 are brought into close contact with each other, as shown in FIG.
a, 9b are provided on the printed circuit board 2, and the concave portions 10a, 10
b can be provided and fitted with each other so that the positioning can be performed accurately without deviation. In this case, the convex portions 9a and 9b and the concave portions 10a and 10b are each tapered so that they can be easily fitted and work can be facilitated.

FIG. 10 is a perspective view showing a method of manufacturing the semiconductor circuit device of this embodiment. In the figure, printed circuit board 2
After mounting the electronic component 1 such as the switching power element 1a or the IC 1b on the semiconductor circuit board 4 to form a semiconductor circuit board 4, a predetermined width, A mold frame 5 for molding a sealing resin having a predetermined height is placed in close contact with the printed circuit board 2. Next, the inside surrounded by the mold 5 is filled with an insulating sealing resin 3c, heated and cured, and then fitted and adhered and fixed to the case 6.

As described above, according to the present embodiment, it is possible to accurately seal a portion requiring resin sealing by using the mold frame 5 and to precisely adjust the height of the resin sealing portion. Height can be controlled. When the mold 5 is fixed to the printed circuit board 2, the convex portion 9 a or 9 b provided on the mold 5 and the concave portion 10 a or 10
By fitting and positioning with b, the insulating sealing resin 3c can be accurately filled at a predetermined position of the printed circuit board 2.

Although FIG. 9 shows the case where the shape of the convex portion and the concave portion is cylindrical or long cylindrical, the shape may be determined in consideration of the specifications and workability of the mold 5 and the printed circuit board 2. Needless to say.

Since the printed board 2 is a metal board, the printed board 2 itself has excellent heat dissipation, so that it is not necessary to consider heat dissipation in the insulating sealing resin 3c.

(Embodiment 4) FIG. 11 is a sectional view showing a configuration of a semiconductor circuit device of this embodiment. The same components as those in the first to third embodiments are denoted by the same reference numerals, and the detailed description will be omitted. In the configuration of the third embodiment shown in FIG. 8, the mold 5 is left on the printed circuit board 2, but in this embodiment, the inside surrounded by the mold 5 is filled with the insulating sealing resin 3 c and then filled. Then, the mold 5 is removed, and only the resin sealing portion C is left on the printed circuit board 2.

According to the present embodiment, it is possible to accurately seal a portion that requires resin sealing and to control the height of the resin sealing portion C to the required height with high accuracy. On the printed circuit board 2, only the resin sealing portion C whose height is accurately controlled can be obtained.

Further, if the surface of the mold 5 is subjected to a lubricating surface resin processing, the mold releasability is improved and the mold 5 can be easily removed, and it goes without saying that the work becomes easy.

FIG. 12 is a sectional view of a main part showing the structure of this embodiment. When the semiconductor circuit board 4 is fitted and fixed to the case 6 by adhesion, as shown in FIG. 12, the height hc of the resin sealing portion C is formed to be about 0.5 mm higher than the height h6 of the ceiling of the case 6. Thereby, the upper surface of the resin sealing portion C can be accurately brought into close contact with the ceiling portion of the case, and can contribute to heat radiation. In this embodiment, since the resin sealing portion C is soft, the thickness is set to about 0.5 mm. However, it is needless to say that the effect can be maximized by adjusting the material in consideration of the material of the resin and the assembly accuracy.

FIG. 13 is a perspective view showing a method for manufacturing the semiconductor circuit device of this embodiment. In the figure, reference numeral 12 denotes a connector. In this embodiment, the space surrounded by the mold 5 having a predetermined width and a predetermined height is filled with an insulating sealing resin 3c, and after being heated and cured, the mold 5 is removed, and the semiconductor circuit substrate 4 and the case 6 are removed. Are fitted and adhered and fixed.

As described above, according to this embodiment, the portion requiring the resin sealing is filled with the insulating sealing resin by using the mold 5 and then the mold 5 is removed. The height of the stop can be precisely controlled to the required height,
Only the resin sealing portion C whose height is controlled with high precision can be obtained on the printed circuit board 2. Therefore, resin sealing can be performed while avoiding the portion of the connector 12 that should not be sealed with resin.

When the printed circuit board 2 is a metal substrate, the printed circuit board 2 itself has excellent heat radiation properties, so that there is no need to perform resin sealing in a shape considering heat radiation properties.

[0057]

As is clear from the description of the above embodiment,
According to the first and fifth aspects of the present invention, the insulating sealing resin surrounds a portion of the printed circuit board on which the electronic component is mounted with the insulating sealing resin. A high-viscosity embankment sealing resin is injected from a nozzle of a coating machine to previously form a bank that also serves as insulation of a predetermined width and height, and the insulating sealing resin is surrounded by the bank. By filling and resin-sealing the semiconductor circuit device and the manufacturing method thereof, a predetermined range on the printed circuit board can be resin-sealed without using a mold, so that the mold is not required.
In addition, there is no step of removing the mold, the work becomes easy, and the manufacturing cost can be reduced. Further, even when a case is used, an opening for injecting the sealing resin into the case is not required, so that mechanical strength is increased and design flexibility is increased. In addition, the step of attaching the lid is eliminated, the operation becomes easy, and the manufacturing cost can be reduced. In addition, because it is possible to use a sealing resin with relatively low viscosity and good flowability as the sealing resin for insulation, it is possible to use it for details such as between electrodes of complicated electronic components and between adjacent chip components. The sealing resin spreads, and insulation can be ensured. Further, since only the portion requiring the sealing resin can be accurately sealed with the resin, the amount of the resin can be reduced and the manufacturing cost can be reduced.

According to the second and sixth aspects of the present invention, when the bank is formed by injecting the sealing resin for bank coating from the nozzle of the coating machine, the height of the bank is lower than a desired bank height. The semiconductor circuit device according to claim 1 or 5, wherein the bank is formed by injecting the sealing resin for bank coating and stacking it up to a desired height by repeatedly applying the bank a predetermined number of times. A bank with a fine width can be constructed, only necessary parts can be accurately divided and sealed with an insulating sealing resin. It can be easily formed and can be resin-sealed at any height.

According to the third and seventh aspects of the present invention, the predetermined portion on the printed circuit board on which the electronic component is mounted has the predetermined width so as to surround the portion to be resin-sealed with the insulating sealing resin. And a mold having a predetermined height is tightly fixed to the printed circuit board, and the inside of the mold is filled with the insulating sealing resin and sealed with a resin to form a semiconductor circuit device and a method of manufacturing the same. In addition, the portion to be resin-sealed can be set with high accuracy, and the height can be set accurately.

According to the fourth and eighth aspects of the present invention, a predetermined width on a printed circuit board on which electronic components are mounted is set to a predetermined width so as to surround a portion to be resin-sealed with an insulating sealing resin. A semiconductor circuit device in which a mold having a predetermined height is set in close contact with the printed circuit board, the space surrounded by the mold is filled with the insulating sealing resin, and then the mold is removed, and a method of manufacturing the same. By doing so, the portion to be resin-sealed can be set with high accuracy, and the height can also be set accurately.For example, by controlling the height so that the upper surface of the resin-sealed portion is in close contact with the ceiling portion of the case The heat radiation effect can also be increased.

According to the ninth and tenth aspects of the present invention, a semiconductor circuit device using a printed circuit board as a metal substrate and a method of manufacturing the semiconductor circuit device improve a heat radiation effect and improve a resin-sealed portion. It is not necessary to consider the heat radiation effect.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of a semiconductor circuit device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a method of manufacturing the semiconductor circuit device of the embodiment.

FIG. 3 is a sectional view showing a configuration of a second embodiment of the semiconductor circuit device of the present invention;

FIG. 4 is a sectional view showing the configuration of the embodiment.

FIG. 5 is a sectional view showing the configuration of the embodiment.

FIG. 6 is an exemplary perspective view showing a method for manufacturing the semiconductor circuit device of the same embodiment;

FIG. 7 is a perspective view showing a method for manufacturing the semiconductor circuit device of the same embodiment.

FIG. 8 is a sectional view showing a configuration of a semiconductor circuit device according to a third embodiment of the present invention;

FIG. 9 is a perspective view showing positioning means for positioning the mold and the printed circuit board in the embodiment.

FIG. 10 is a perspective view showing the method for manufacturing the semiconductor circuit device of the embodiment.

FIG. 11 is a sectional view showing a configuration of a semiconductor circuit device according to a fourth embodiment of the present invention;

FIG. 12 is an essential part cross sectional view showing the configuration of the semiconductor circuit device of the same embodiment;

FIG. 13 is a perspective view showing the method of manufacturing the semiconductor circuit device of the embodiment.

FIG. 14 is a sectional view showing a configuration of a conventional semiconductor circuit device.

FIG. 15 is a sectional view showing a configuration of a conventional semiconductor circuit device.

FIG. 16 is a sectional view showing a configuration of a conventional semiconductor circuit device.

FIG. 17 is a sectional view showing a configuration of a conventional semiconductor circuit device.

FIG. 18 is a sectional view showing a configuration of a conventional semiconductor circuit device.

FIG. 19 is a sectional view showing a configuration of a conventional semiconductor circuit device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Printed circuit board 3c Insulating sealing resin 3d Embankment 4 Semiconductor circuit board 5 Form frame 6 Case 7a Opening 7b Cover 9a, 9b Convex part 10a, 10b Concave part 11 Coating machine 12 Connector A High voltage part B Low voltage part C Resin sealing

Claims (10)

[Claims] A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
The resin encapsulation has a predetermined width and a predetermined width that also serves as insulation of a bank coating encapsulation resin having a higher viscosity than the insulating encapsulation resin so as to surround a portion sealed by the insulating encapsulation resin. A semiconductor circuit device comprising: a bank having a height; and the insulating sealing resin filled in a portion surrounded by the bank. 2. The semiconductor circuit device according to claim 1, further comprising a bank which is piled up by applying the sealing resin for bank coating a plurality of times. 3. A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
The resin sealing is a mold having a predetermined width and a predetermined height tightly fixed to the printed circuit board so as to surround a portion sealed by the insulating sealing resin, and is filled in the mold. And a sealing circuit resin for insulation. 4. A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
The resin encapsulation is performed using a mold having a predetermined width and a predetermined height that is set in close contact with the printed circuit board so as to surround a portion sealed by the insulating encapsulation resin. A semiconductor circuit device composed of: 5. A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
A bank coating sealing resin having a higher viscosity than the insulating sealing resin is injected from a nozzle of a coating machine so as to surround a portion to be sealed with the insulating sealing resin, and insulation of a predetermined width and a predetermined height is performed. 2. The method of manufacturing a semiconductor circuit device according to claim 1, wherein a bank which also serves as a bank is formed in advance, and the sealing resin for insulation is filled in a portion surrounded by the bank to perform resin sealing. 6. When a bank is formed by injecting a sealing resin for embankment from a nozzle of an applicator, the sealing resin for embankment is injected at a height lower than a desired height of the embankment and overlapped a predetermined number of times. 3. The method for manufacturing a semiconductor circuit device according to claim 2, wherein the bank is formed by applying the material to a desired height. 7. A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
A mold frame having a predetermined width and a predetermined height is tightly fixed to the printed circuit board so as to surround a portion to be sealed with the insulating sealing resin, and the inside of the mold frame is the insulating sealing resin. 4. The method for manufacturing a semiconductor circuit device according to claim 3, wherein the semiconductor device is filled with a resin. 8. A semiconductor circuit device in which a case is fitted and adhered and fixed to a semiconductor circuit board in which a predetermined portion on a printed board on which electronic components are mounted is resin-sealed with an insulating sealing resin.
A mold having a predetermined width and a predetermined height is set in close contact with the printed circuit board so as to surround a portion to be sealed with the insulating sealing resin, and the inside of the mold is surrounded by the insulating sealing resin. 5. The method for manufacturing a semiconductor circuit device according to claim 4, wherein said mold is removed after filling with said mold. 9. The semiconductor circuit device according to claim 1, wherein the printed circuit board is a metal substrate. 10. The printed board is a metal board.
A method for manufacturing a semiconductor circuit device according to claim 8.