JPH10189694A - Tape pasting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve an adhesive tape replacing operation and a tape pasting device in safety by a method wherein a tape feed roller and a tape take-up roller are disposed below a tape pasting section so as to be housed under a tape pasting device. SOLUTION: A tape pasting device 10 is equipped with a tape cutter 31 located above the tape pasting section of its main body and a tape feed roller 11, a tape take-up roller 13, and a tape tension adjusting section 17 provided under the tape pasting section. By this setup, the center of gravity of the device main body is located at a low position, so that the device 10 is enhanced in stability. When the tape feed roller 11 or the tape take-up roller 13 is replaced, the roller 11 or the roller 13 can be replaced by opening the lower front door 14 of the device main body, so that a replacing operation can be carried out at a low position, and the roller of comparatively heavy weight can be easily handled. As the tape feed roller 11 and others are provided under the tape pasting section, a replacing roller can be prevented from dropping down on a movable table 40 to cause damage to a wafer 70.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape attaching apparatus for integrating, for example, a semiconductor wafer as a workpiece and a ring-shaped frame for supporting and transporting the semiconductor wafer for processing or the like by using an adhesive tape. .

[0002]

2. Description of the Related Art Conventionally, as a tape attaching device for integrating a semiconductor wafer and a frame with an adhesive tape, for example, the one disclosed in Japanese Patent Application Laid-Open No. Hei 6-177243 is known. This tape sticking device 1 is shown in FIGS.
As shown in the figure, the tape feeding section 20, the tape winding section 30, and the tape attaching area 60 located between them.
A tape cutter 31 movably provided at a standby position and an operation position for tape cutting in the tape application region 60; a tape application movable roller 22; tape separation movable rollers 23 and 24; The table 4 which advances and retreats in the direction perpendicular to the feed direction of the adhesive tape on the sticking area 60
0.

The table 40 is used as a work area 50.
, The frame 80 is mounted on the frame mounting area 41, and the wafer 70 is mounted on the wafer mounting area 42.

[0004] When the button A of the table 40 is pressed, the frame 80 and the wafer 70 are attracted to the table 40, and the table 40 moves in the direction of the arrow 90 and advances to the tape application area 60.

[0005] Then, the tape application movable roller 22 is moved forward in the same direction as the adhesive tape 2 feeding direction so that the adhesive tape 2 is applied to the frame 80 and the wafer 70 positioned in the tape application area 60, When it reaches the position of the tape sticking movable roller 22a indicated by the broken line, it is moved backward in the reverse direction to return to the original position.

As a result, the pressure-sensitive adhesive tape 2 is bonded to the frame 80 and the wafer 70 in a state of a pressure-sensitive adhesive tape 2a indicated by a dashed line. And the tape cutter 31
Is lowered to the operation position, and the disk cutter 32 is rotated by 360 ° about the rotation shaft 33 to cut the adhesive tape 2 along the frame 80 in a circular shape. Thereafter, the tape cutter 31 is returned to the standby area.

[0007] The used adhesive tape cut by the tape cutter 31 is transferred to the tape peeling movable roller 2.
The adhesive tape 2 is peeled off from the frame 80 by the movement of the rollers 3 and 24, and is wound around the winding shaft 25 of the tape winding unit 30.

[0008] The table 40 is retreated to the work area 50, and the frame 80 and the wafer 70 stuck together with the adhesive tape 2 are taken out by the operator and transferred to the next step. Thus, the tape attaching step is repeated.

[0009]

However, the conventional tape sticking apparatus has the following problems.
That is, with the tape application device placed horizontally, the tape feeding unit 20 and the tape winding unit 30 are located above the positions of the frame 80 and the wafer 70 located in the tape application region 60, and Since the tape cutter 31 is also at the upper position, the upper part of the apparatus has a complicated structure, and the center of gravity of the apparatus may be deviated to the upper part, so that the stability of the entire tape applying apparatus may be impaired.

In the tape feeding section 20, the tape supply roller in which the remaining adhesive tape 2 is reduced is
The replacement operation for replacing with a new tape supply roller is difficult because the weight of the new tape supply roller is relatively heavy, and the new tape supply roller may be dropped on the tape attaching area 60, and may be deformed by hitting a device in the area. , The dimensions may be out of order. Since the tape feeding section 20 is at the upper position, it is difficult to replace the adhesive tape.

Further, in the overall appearance of the tape applying apparatus, since the tape feeding section 20 and the tape winding section 30 are located at the upper part of the apparatus, complicated devices are concentrated only at the upper part. The balance is poor, giving the viewer a so-called heady impression and is not a smart device.

As described above, the conventional tape applying apparatus has problems to be solved in terms of safety of the operation of exchanging the adhesive tape and stability of the apparatus.

[0013]

The gist of the present invention for solving the above-mentioned problems of the tape applying apparatus according to the present invention is to provide a tape applying apparatus for integrating a workpiece and a frame with an adhesive tape. The apparatus includes a tape supply roller that supplies an unused tape, a tape feed roller that feeds the tape, a tape take-up roller that winds up the used tape, a workpiece holding unit, and a frame holding unit. And a tape cutter for integrally sticking the frame and the adhesive tape together with an adhesive tape, and a tape cutter for cutting the adhesive tape along the frame when positioned at the working position and the non-working position and positioned at the working position. The tape supply roller and the tape take-up roller are disposed below the tape application section.

A tape tension adjusting unit is provided on the tape winding roller side. The tape tension adjusting unit includes a vertical movement roller, an upper regulation sensor and a lower regulation sensor, and the tape winding roller is a tape tension adjusting unit. When the vertical movement roller reaches the upper regulation sensor by winding, the drive of the winding roller is stopped, and when the vertical movement roller reaches the lower regulation sensor by stopping the drive, the winding roller is driven. The tape applying section includes an attaching roller for attaching the tape to the frame and the workpiece, and an advancing / retreating table which reciprocates in a direction perpendicular to the tape feeding direction. A frame holding portion and a workpiece holding portion are formed; a detection sensor for detecting an opening of the tape immediately after the tape feed roller; Provided, it is to stop the driving of the tape feed roller when detecting the opening of the tape by the detection sensor.

According to the tape sticking device of the present invention, the tape supply roller and the tape take-up roller are disposed below the tape sticking portion and fit in the lower portion of the tape sticking device.
The center of gravity of the entire device is shifted to the lower portion, and the stability of the device is increased, and a lightweight tape cutter is mainly disposed at the upper portion of the device, so that the overall configuration of the device is simplified.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a tape sticking apparatus according to the present invention. Note that, for easy understanding of the invention, portions corresponding to the conventional example will be denoted by the same reference numerals as the conventional example.

As shown in FIG. 1, the tape applying device 10 includes a tape supply roller 11 for supplying an unused adhesive tape 2, a tape feed roller 12 for supplying the adhesive tape 2,
Tape take-up roller 1 for taking up used adhesive tape
3, an advancing / retreating table 40 that advances and retreats at right angles to the feed direction of the adhesive tape 2, and a tape cutter 31 that cuts the adhesive tape 2 along the frame 80.

The tape supply roller 11 and the tape take-up roller 13 are provided at a relatively lower position of the apparatus main body so that the tape supply roller 11 and the tape take-up roller 13 are located at least below the tape application area 60. Therefore, the tape supply roller 11 and the tape take-up roller 13 cannot be directly visually recognized from the outside, and they appear when the front door 14 of the apparatus main body is opened, and can be replaced.

The tape supply roller 11 is rotatably mounted on a support shaft of the apparatus main body, and the tape take-up roller 13 is mounted on the support shaft of the apparatus main body and is driven in a tape winding direction by a drive motor or the like. The rotation is controlled.

As shown in FIG. 2, a frame mounting area 41 for mounting a frame 80 and a wafer mounting area 4 for mounting a wafer 70 are provided in the reciprocating table 40 of the working area 50.
2 are provided.

In the frame mounting area 41, a plurality of suction holes 41a for adsorbing and supporting the frame 80 are provided at the periphery thereof at appropriate intervals. In the wafer mounting area 42, a substantially ring-shaped mounting table 42a of a required width is provided along the outer shape of the wafer 70, and suction holes 42b for sucking and supporting the wafer 70 are provided at appropriate intervals. Are arranged.

The inside of the ring-shaped mounting table 42a is a concave air chamber 43 so that the circuit portion on the front surface side of the wafer 70 does not come into contact with the mounting table 42a. It is configured such that air is supplied to the chamber 43. After the wafer 70 is mounted on the mounting table 42a and sucked, the air chamber 43 is maintained at a desired pressure to support the wafer 70 in a slightly arc shape.

The advance / retreat table 40 is configured to advance / retreat in a direction perpendicular to the feed direction of the adhesive tape 2 as indicated by an arrow 44 in FIG. Is reciprocated from the front side.

As shown in FIGS. 2 and 3, the feed amount of the adhesive tape 2 pulled out from the tape supply roller 11 is measured on the right side of the tape attaching area 60 when the apparatus main body is viewed from the front side. A tape amount counter 15 and a sticking roller 22 that can reciprocate in the tape feed direction are provided in parallel.

The adhering roller 22 is provided with a tape peeling roller 22a in a substantially adjacent state, and moves in the tape feeding direction and the forward direction, thereby adhering the frame 80 and the wafer 70 together with the adhesive tape 2. Then, the adhesive tape 2 is separated from the frame 80 by moving in a direction opposite to the tape feeding direction.

On the other hand, on the left side of the tape application area 60, a tape feed roller 12 serving as a drive source for pulling out the adhesive tape 2 and transferring it in the tape feed direction is provided.

The tape feed roller 12 is used for the adhesive tape 2.
Immediately in the direction of pulling out and sending out, as shown in FIG. 5, a detection sensor 16 for detecting the opening 2a of the adhesive tape 2 cut by the tape cutter 31 is provided.

The detection sensor 16 is electrically connected to the control device, and a signal for detecting the opening 2a of the adhesive tape 2 is transmitted to the control device, and the control device stops driving the tape feed roller 12. It has become.

Accordingly, when the detection sensor 16 detects the opening 2a of the adhesive tape 2, the opening 2a opened by the tape cutter 31 in the tape attaching area 60 is formed.
a is fed out by the tape feed roller 12, and is replaced with an unused adhesive tape 2.
Is supplied to the tape application area 60.

In the middle of the tape feed path between the detection sensor 16 and the tape take-up roller 13, while maintaining the tension of the adhesive
Is provided with a tape tension adjusting section 17 for removing slack.

The tape tension adjusting section 17 is provided at the lower portion of the apparatus main body, because the tape take-up roller 13 is provided at the lower portion of the tape attaching section.

The tape tension adjusting section 17 is provided in the
As shown in FIG. 1, a heavy object that naturally falls in the vertical direction of the apparatus main body is used for adjusting the tape tension. For example, a sliding guide 18 having a sliding groove provided in a side wall of the apparatus main body, It comprises a vertically moving roller portion 19 which fits in a sliding groove of the moving guide 18 and slides in the vertical direction, an upper regulating sensor 26 and a lower regulating sensor 27.

The vertically moving roller portion 19 is a slide member 19a having a fitting portion fitted into the sliding groove of the sliding guide 18 and a supporting portion for supporting a roller support shaft.
And a roller 19b rotatably provided on the support shaft.

The upper regulation sensor 26 and the lower regulation sensor 27 are both electrically connected to a control unit.
When the upper regulation sensor 26 detects that the vertically moving roller portion 19 has risen to reach the sensor position, a detection signal is output and transmitted to the control device.

The control device that has received the detection signal stops the drive of the drive motor for the winding roller 13 and stops the rotation of the tape winding roller 13. Thereby, the winding of the adhesive tape 2 is stopped.

When the lower regulating sensor 27 detects that the vertically movable roller portion 19 has descended and has reached the sensor position, a detection signal is output and transmitted to the control device.

The control device that has received the detection signal starts driving the drive motor for the tape winding roller 13, and
The tape winding roller 13 rotates to start winding the adhesive tape 2.

In short, until the adhesive tape 2 sent out by the tape feed roller 12 is taken up by the tape take-up roller 13, the tape is prevented from being slackened.
The weight of the vertically moving roller portion 19 is hung on the adhesive tape 2,
When the adhesive tape 2 is sent out by the tape feed roller 12 and the vertically moving roller portion 19 is lowered to a predetermined position, that is, to the position of the up-and-down regulating sensor 27, winding is started by the tape winding roller 13 and the predetermined length is started. When the winding is performed, the vertically moving roller portion 19 rises and reaches the upper regulation sensor 26, and the winding is stopped. During this time, the weight of the vertically moving roller portion 19 is applied to the adhesive tape 2 and a predetermined tension is applied. Is given.

Further, a tape cutter 31 arranged opposite to the tape attaching area 60 is arranged above the tape attaching portion in the apparatus main body. A vertically movable rotary shaft 3 suspended from a cutter base 31d of the tape cutter 31;
1a, a support member 31e provided horizontally at the lower end of the rotating shaft 31a, and a cutter 31b and a frame roller 31c are provided at the end of the support member 31e.

The cutter 31b and the frame roller 31
“c” is set so that the weights of both tapes are balanced in order to balance the moment of inertia in the rotation in the horizontal plane when performing the cutting action in the tape application region 60.

The cutter 31b and the frame roller 3
1c is a position where the tape is cut, and the tape is run in contact with the frame 80 mounted on the frame mounting area 41 of the advance / retreat table 40.

As described above, the tape sticking apparatus 10 of the present invention
Is a tape cutter 3 on the upper part of the tape sticking part of the device body.
1, the tape supply roller 11, the tape take-up roller 13, and the tape tension adjusting unit 17 are provided below the tape attaching unit, so that the center of gravity of the apparatus main body is at a low position. It increases stability.

Also, when replacing the tape supply roller 11 or the tape take-up roller 13, as shown in FIG. 1, the lower door is opened at the lower part of the apparatus body to replace the roller. Work becomes possible, and handling of a relatively heavy roller becomes easy.

Since the tape supply roller and the like are provided below the tape application part, there is no possibility that the replacement roller or the like is dropped on the advance / retreat table 40 of the tape application part and the wafer 70 is damaged. .

Furthermore, since only the tape cutter 31 is provided mainly at the upper part of the apparatus main body, the floor area of the apparatus main body can be reduced and its height can be increased, thereby saving space. Can be done.

The tape sticking operation by the present tape sticking device 10 will be described. As shown in FIG. 2, a frame 80 is placed on the frame placing area 41 in the reciprocating table 40 of the working area 50, and the suction hole 41a is closed. The frame 80 is sucked by evacuation.

The mounting table 42 in the wafer mounting area 42
A wafer 70 with the front side having the circuit formed thereon facing down and the back side facing upward is placed on a, and the suction hole 42a is sucked by evacuation. Thereafter, the advance / retreat table 40 is advanced to the tape attachment area 60.

Then, as shown in FIGS. 3 and 4, the adhesive roller 2 is moved in the tape feed direction, and the adhesive tape 2 is integrally attached to the back surface of the frame 80 and the wafer 70. Thereafter, the rotation axis 31a is rotated by the tape cutter 31.
Is lowered and the cutter 31b positioned from the non-operation position to the operation position is rotated once along the frame 80 to cut the adhesive tape 2 into a circular shape.

After the cutter 31b is retracted to the non-operating position by the rotating shaft 31a, the adhesive roller 22 and the tape peeling roller 22a are moved in the direction opposite to the tape feeding direction to return to the original position. Release roller 22a
The other continuous pressure-sensitive adhesive tape 2 is peeled off from the frame 80, leaving a portion cut in a circular shape by the above.

The peeled adhesive tape 2 has an opening 2 a formed by the tape cutter 31.
By rotating the tape feed roller 12, the opening 2a of the tape sticking area 60 is fed in the tape feed direction, and at the same time, the unused adhesive tape 2 is fed to the tape sticking area 60 by the tape supply roller. Supplied from 11.

The opening 2 a is detected by a detection sensor 16 disposed immediately after the tape feed roller 12 while passing through the tape feed roller 12.

When the detection sensor 16 detects the opening 2a, the rotation of the tape feed roller 12 is stopped.
The unused adhesive tape 2 is sufficiently supplied to the tape attachment area 60, and the opening 2 a is completely discharged from the tape attachment area 60.

When the adhesive tape 2 is fed in the tape feed direction by the tape feed roller 12, the adhesive tape 2 is loosened in the tape tension adjusting section 17, so that the vertically moving roller 19 is lowered accordingly. When the lower regulating sensor 27 detects that the vertically moving roller 19 has reached a predetermined position due to its lowering, the tape take-up roller 13 is driven to rotate, and the winding of the adhesive tape 2 is started.

Then, the used adhesive tape 2 having the opening 2a is taken up by the tape take-up roller 13, whereby the vertical movement roller 19 is moved by the sliding guide 1.
Slide upward along 8.

When the vertical movement roller 19 slides and reaches the position of the upper regulation sensor 26, a detection signal is transmitted from this sensor to the control device by the detection of the upper regulation sensor 26, and the control device receives the signal and receives the signal. The take-up roller 13 is stopped from rotating, and the used adhesive tape 2
Winding stops.

In this way, the detection sensor 16 for detecting the opening 2a of the adhesive tape 2 allows the tape attachment area 60 to be detected.
When the unused adhesive tape 2 is supplied, the tape feed is automatically stopped. Further, the tape tension adjusting unit 17 continues to apply a predetermined tension to the adhesive tape 2, and the used adhesive tape 2 is automatically wound on the tape winding roller 13, and the winding action is also automatically performed. Will be stopped.

[0057]

As described above, the tape applying apparatus according to the present invention is a tape applying apparatus for integrating a workpiece and a frame with an adhesive tape, comprising a tape supply roller for supplying unused tape, A tape application unit that includes a tape feed roller that feeds a tape, a tape take-up roller that winds up a used tape, a workpiece holding unit and a frame holding unit, and that integrally sticks a workpiece and a frame with an adhesive tape. A tape cutter that cuts the adhesive tape along the frame when the tape supply roller and the tape take-up roller are positioned at the operation position and the non-operation position and positioned at the operation position. It can be said that the replacement operation can be performed safely and easily even with a relatively heavy tape supply roller. It exhibits an excellent effect.

Further, since the tape supply roller and the tape take-up roller are disposed at the lower portion of the tape attaching portion and the center of gravity of the entire device is at the lower portion, the stability of the device is increased. Since only a light-weight tape cutter is provided, the overall configuration of the apparatus becomes neat in appearance.

[Brief description of the drawings]

FIG. 1 is a perspective view of a tape applying device according to the present invention.

FIG. 2 is a schematic plan view of a tape application area and a work area in the tape application apparatus of the present invention.

FIG. 3 is a front view showing a schematic configuration and arrangement of the tape applying apparatus of the present invention.

FIG. 4 shows a use state of the tape applying device of the present invention,
FIG. 4 is a schematic front view of a state in which a sticking roller is moved in a tape feeding direction and a tape is stuck to a frame and a wafer.

FIG. 5 is an enlarged perspective view showing a part of the tape applying device of the present invention in an enlarged manner.

FIG. 6 is a perspective view of a tape sticking device according to a conventional example.

FIG. 7 is an explanatory diagram showing a state of tape sticking by a tape sticking device according to the same example.

FIG. 8 is an explanatory diagram showing a state of tape cutting by the tape applying device according to the same example.

[Explanation of symbols]

DESCRIPTION OF REFERENCE NUMERALS 1 Tape pasting device according to conventional example
2a opening, 10 tape application device, 11 tape supply roller, 12 tape feed roller, 13 tape take-up roller, 14 front door, 15 tape amount counter,
16 detection sensor, 17 tape tension adjustment unit,
Reference Signs List 18 sliding guide, 19 vertical moving roller, 20 tape feeding section, 22 sticking roller, 22a tape peeling roller, 26 upper regulating roller, 27 lower regulating sensor, 30 tape winding section, 31 tape cutter,
31b cutter, 31d cutter base, 31e support member, 40 reciprocating table, 41 frame mounting area, 42 wafer mounting area, 50 work area, 70
Wafer, 80 frames.

Claims (4)

[Claims] 1. A tape application device for integrating a workpiece and a frame with an adhesive tape, the tape application device comprising: a tape supply roller for supplying an unused tape;
A tape application unit that includes a tape feed roller that feeds a tape, a tape take-up roller that winds up a used tape, a workpiece holding unit and a frame holding unit, and that integrally sticks a workpiece and a frame with an adhesive tape. And a tape cutter that cuts the adhesive tape along the frame when positioned at the operation position and the non-operation position and positioned at the operation position. A tape sticking device, wherein 2. A tape tension adjusting unit is provided on a tape winding roller side, the tape tension adjusting unit includes a vertical movement roller, an upper regulation sensor and a lower regulation sensor, and the tape winding roller is The take-up roller stops driving when the vertical movement roller reaches the upper regulation sensor by winding the tape, and drives the winding roller when the vertical movement roller reaches the lower regulation sensor by stopping driving. The tape sticking device according to claim 1, wherein: 3. The tape applying section includes an attaching roller for attaching a tape to a frame and a workpiece, and an advancing / retreating table moving in a direction perpendicular to a tape feeding direction. The tape attaching device according to claim 1, wherein a frame holding portion and a workpiece holding portion are formed. 4. A detection sensor for detecting an opening of the tape immediately after the tape feed roller, wherein the drive of the tape feed roller is stopped when the detection sensor detects the opening of the tape. The tape sticking apparatus according to claim 1, 2, 3, or 4, wherein