JPH10172945A - Wafer cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a wafer from being contaminated by water drops by providing an upper cover which prevents chemicals or cleaning liquid from being splashed and by injecting pure water toward the inside of the upper cover. SOLUTION: A chemical/pure water nozzle 3 is positioned above a rotating table 4 and through which a chemical for etching or the like and pure water for cleaning is injected toward a wafer 5 held on the rotating table 4. The wafer 5 is etched and cleaned. A cover prevents the chemical and pure water from being scattered to the outside of a cleaning chamber in the upper part of a body 6. A cover cleaning nozzle 7 is attached to the body 6 and through which pure water is injected like shower toward the under face of the cover 2 so as to wash out liquid drops attached to the cover 2. The wafer 5 is fixed to the rotating table 4 by a supporting nail 10. Thereafter, the wafer 5 and the rotating table 4 are rotated by a motor.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cleaning apparatus used for manufacturing a semiconductor device, and more particularly to an efficient cleaning of a wafer.

[0002]

2. Description of the Related Art As a prior art of a wafer cleaning apparatus, one disclosed in Japanese Patent Application Laid-Open No. 8-1390065 is known. The wafer cleaning apparatus includes a frame 22 having a concave portion 22-1 for mounting a wafer 21, a rotary table 23 on which the frame 22 is mounted on an upper surface and rotated by a motor (not shown) provided below. Penetrating the center of the frame 22 and the center of the turntable 23,
A suction pipe 24 for adsorbing and stabilizing the lower surface of the wafer 21 mounted on the frame 22 and a water nozzle 25 provided around the rotary table 23 for spraying cleaning water for cleaning the wafer 21 penetrate the side wall. And a cover 27 having an upwardly convex shape for opening and closing the entrance at the top of the body 26.
And a base 28 that holds the body 26.

[0003]

In the above-described conventional wafer cleaning apparatus, scattering of the cleaning water to the outside can be prevented by the body and the cover. However, there is a problem in that water droplets formed on the lower surface of the cover fall on the surface of the wafer inside the body, causing damage to the surface of the semiconductor chip and contaminating the semiconductor chip. As a solution to this, the upper cover is made convex or the apex angle is made obtuse so that water droplets formed on the lower surface of the cover flow toward the end,
Depending on the viscosity of the water droplet and the impurities contained therein, there is a problem that the water droplet may drop on the wafer before flowing to the edge.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an improved wafer cleaning apparatus which can solve the above-mentioned problems and can prevent contamination of a wafer by water droplets.

[0004]

A wafer cleaning apparatus according to the present invention for solving the above-mentioned problems of the prior art is provided with a rotary table for holding and rotating a wafer, and a rotary table installed above the rotary table for etching the wafer. A nozzle for injecting at least one of a chemical solution and a cleaning solution for cleaning the wafer, an upper cover for preventing scattering of the chemical solution or the cleaning solution, and a cover cleaning nozzle for spraying pure water toward the inside of the upper cover. , A body having a door for taking in and out a wafer, and a base for holding the body.

[0005]

FIG. 1 is a sectional view showing the structure of a wafer cleaning apparatus according to one embodiment of the present invention. The wafer 5 has a rotating table 4 rotated by a lower motor (not shown).
It is fixed on a support claw 10 which can be opened and closed. Body 6
Has a door 8 that can be opened and closed up and down, and puts the wafer 5 in and out of the left and right transfer chambers. The rotary table 4 is vertically moved, so that the wafer 5 loaded / unloaded through the door 8 is gripped or released by the support claws 10.

The chemical / pure water nozzle 3 is located on the table 4 and injects a chemical such as etching and pure water for cleaning onto the wafer 5 held on the rotary table 4.
Is etched or washed. The cover 2 prevents scattering of a chemical solution or pure water to the outside of the cleaning chamber in the upper part of the body 6. The cover washing nozzle 7 is attached to the body 6 and sprays pure water toward the lower surface of the cover 2 in a shower-like manner so as to wash out droplets attached to the cover 2.

In the wafer cleaning apparatus 1 of this embodiment, the wafer 5 is fixed to the turntable 4 by the support claws 10. Thereafter, the wafer 5 and the turntable 4 are rotated by a motor (not shown). At the same time, the etchant from the chemical / pure water nozzle 3 is 1.5kg / cm ² -2.5k
The ejection is performed at a discharge pressure of g / cm ² , and the wafer 5 is etched. After the end of the etching, pure water is sprayed from the chemical / pure water nozzle 3, and the chemical remaining on the wafer 5 is washed away. At the same time as the cleaning of the wafer, 1.5 kg / cm ² to 2.
Pure water is injected at a discharge pressure of 5 kg / cm ² .

The tip of the cover cleaning nozzle 7 is finely branched so that a shower-like jet of pure water can be formed, and the entire surface of the cover 2 can be cleaned with a small number of one or two. In this case, when the wafer 5 is etched, the cleaning time is set to 5 seconds to 10 seconds at the same time when the cleaning pure water is sprayed from the chemical / pure water nozzle 3 after the etching is completed.

In the case where only cleaning with pure water is performed on the wafer 5, pure water is supplied from the cover cleaning nozzle 7 only for 5 seconds from 15 seconds immediately before the injection of the pure water from the chemical / pure water nozzle 3 ends. Perform injection. After cleaning, turn table 4
Keeps rotating without spraying anything from the chemical / pure water nozzle 3, and shakes off the water remaining on the wafer 5. The wafer is then unloaded through door 8.

FIG. 2 is a block diagram showing the configuration of a wafer cleaning apparatus according to another embodiment of the present invention. In FIG. 2, the components denoted by the same reference numerals as those in FIG.
Since they are the same as corresponding components in the figure, duplicate description will be omitted. In the wafer cleaning apparatus of this embodiment, the same effect as in FIG. 1 can be obtained by increasing the height of the cover 2 on the cover cleaning nozzle side by approximately 1 cm.

[0011]

As described above in detail, in the wafer cleaning apparatus of the present invention, since the water droplets formed on the lower surface of the cover are efficiently cleaned, the chemical components and the cleaning debris in the water droplets are removed, and the wafer cleaning device according to the present invention is used. Water droplets formed on the lower surface of the cover, which is a problem of the apparatus, can be prevented from flowing toward the end and falling onto the wafer.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of a wafer cleaning apparatus according to one embodiment of the present invention.

FIG. 2 is a sectional view showing a configuration of a wafer cleaning apparatus according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a configuration of a conventional wafer cleaning apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer cleaning apparatus 2 Cover 3 Chemical liquid / pure water nozzle 4 Rotary table 5 Wafer 6 Body 7 Cover cleaning nozzle 9 Base

Claims (3)

[Claims] 1. A rotating table which holds a wafer by a supporting claw or other holding means and is rotated by a motor, a chemical solution disposed above the rotating table, for treating a wafer, and a cleaning solution for cleaning the wafer. An injection nozzle for injecting at least one of the following: an upper cover for preventing a chemical solution or a cleaning liquid injected from the injection nozzle from scattering; and a cover cleaning nozzle for injecting pure water or another cleaning liquid toward the inside of the upper cover. And a body having a door for taking in and out the wafer. 2. The wafer cleaning apparatus according to claim 1, wherein the ejection of the cleaning liquid from the cover cleaning nozzle is performed within a period of the injection of the cleaning liquid from the injection nozzle. 3. The wafer cleaning apparatus according to claim 1, wherein the jetting of the cleaning liquid from the cover cleaning nozzle is performed for a short period immediately before the jetting of the cleaning liquid from the jet nozzle is completed.