JPH10163011A - Multiple resistance parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively suppress short-circuiting of terminal electrodes by expandingly providing a glass film between surface recesses of an insulation substrate so as to cover the peripheries of thick conductor films located around the surface recesses. SOLUTION: Surface side thick conductor films 31a, 31b are formed approximately rectangularly on the surface of an insulation substrate 1, including recesses 11a, 11b formed at the long-side ends of the substrate 1. Back side thick conductor films 32a, 32b are formed substantially in the same shape as the surface side films 31a, 31b on the back side of the insulation substrate 1, including recesses 11a, 11b formed at the long-side ends of the substrate 1. Thick resistance films 2 are formed on the surface of the substrate 1, arranged between the surface side thick conductive films 31a, 31b so that both ends of the resistance films 2 overlap the conductive films 31a, 31b to become terminal electrodes 3a, 3b, and covered with a glass film 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple resistor component such as a multiple resistor, a resistor network, and the like, in which a plurality of thick film resistors are arranged on an insulating substrate.

[0002]

2. Description of the Related Art A multiple resistor, which is one of multiple resistor components, has a plurality of thick-film resistor films arranged on the surface of a rectangular insulating substrate, and both ends of each thick-film resistor film are arranged. Was connected to a terminal electrode.

[0003] There are two types of terminal electrode structures, one of which is formed so that a portion for forming a terminal electrode protrudes from a substrate. The structure of the terminal electrode includes a surface-side thick-film conductor film connected to the thick-film resistor film on the substrate surface side and extending between the tips of the protrusions, and an end-face-side thickness attached to the tip surface of the protrusion. A film conductor film, an underlying thick film conductor film comprising a back surface side thick film conductor film formed on the back surface side of the projecting portion of the substrate,
And a plating layer applied to the surface of the underlying thick conductor film.

In this method, a semicircular concave portion formed in the thickness direction of the substrate is formed at an edge of the insulating substrate, and a terminal electrode is formed at a protruding portion between the concave portions generated by the formation of the concave portion.

[0005] This terminal electrode, the adjacent terminal electrode,
Since it is completely partitioned by the concave portion, a short circuit between the terminal electrodes during the manufacturing process can be effectively suppressed. However, on the other hand, there is a problem that the shape of the substrate becomes large.

Another configuration of the terminal electrode is such that a semicircular concave portion formed in the thickness direction of the substrate is formed at an edge of the insulating substrate, and the concave portion is formed as a center. That is, the front side thick film conductor film formed around the concave opening on the surface of the insulating substrate is connected to the end of the thick film resistor film, and on the back side of the substrate facing the front side thick film conductor film. A backside thick film conductor film is formed, and an end surface thick film conductor film for conducting the front side thick film conductor film and the backside thick film conductor film is formed on the inner wall surface of the concave portion. A plating layer is applied to an underlying thick conductor film composed of a conductor film, an end-face thick conductor film, and a back-face thick conductor film.

[0007] In this structure, particularly when the end face side thick film conductor film is formed, it can be formed in a state of a large-sized insulating substrate from which a plurality of insulating substrates can be extracted, so that the manufacturing efficiency is excellent. That is, in forming the end face side thick film conductor film on the inner wall in the through hole which is divided and becomes a concave so as to straddle the break groove formed in the large insulating substrate, the thick film conductive film from the surface side of the large substrate is formed. The end face side thick film conductor film can be formed by printing and applying a conductive paste and printing and applying a thick film conductive paste from the back side.

[0008]

However, in a multiple resistor in which a terminal electrode is formed in a concave portion on an edge of a substrate,
When the plating layer is applied to the surface of the underlying thick conductor film constituting the terminal electrode, there is a problem that a short-circuit phenomenon occurs between the terminal electrodes.

This is because there is no void having a function of preventing a short circuit between the surface-side thick film conductive films formed around the adjacent recess openings, and the surface-side thick film conductive film is formed by the thick-film conductive film. When printing and applying with a conductive paste, the linearity of the edges of the adjacent thick conductor film on the front side may be disturbed, so when the plating layer is formed on the underlying thick conductor film, Plating abnormally grows on the edge of the side thick film conductor, and as a result, adjacent terminal electrodes are short-circuited.

The present invention has been devised in view of the above-mentioned problems, and an object of the present invention is to suppress an effective short-circuit phenomenon between terminal electrodes due to abnormal growth of a plating layer formed on a thick conductor film. It is intended to provide a multiple resistance component that can be used.

[0011]

According to the present invention, a plurality of thick resistor films are arranged and formed on a surface of an insulating substrate having a plurality of concave portions arranged on an end side thereof. An end portion is connected to a terminal electrode formed of a thick conductive film, which is formed on the inner wall surface of the concave portion, a part of which is led out around the concave portion on the front and back surfaces of the insulating substrate, and whose surface is coated with a plating layer. And in the multiple resistance component in which the thick film resistor film is coated with a glass film, the glass film overlaps each outer peripheral portion of the thick film conductor film located around the concave portion on the front surface side of the insulating substrate. As described above, the multiple resistance component extends between the recesses.

[0012]

According to the present invention, in the plurality of terminal electrodes connected to the ends of the plurality of thick film resistor films, the outer peripheral portion of the surface side thick film conductor film formed around the concave portion on the front surface side of the substrate is made of glass. It is covered with a coating film. Therefore, irrespective of the printing state of the surface-side thick film conductor film, even if a plating layer is applied to the surface of the surface-side thick film conductor film, the short circuit phenomenon can be effectively suppressed.

In addition, the glass coating film is formed by extending the glass coating film formed on the thick-film resistor film, which is an essential structure in the structure of the multiple resistance component, between the two surface-side thick-film conductor films. Because of this, there is no increase in the number of components.

As a result, as described above, a multiple resistance component having high manufacturing efficiency and capable of effectively suppressing a short circuit phenomenon between terminal electrodes can be obtained.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a multiple resistance component according to the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a multiple resistor which is one of multiple resistor components, and FIG. 2 is a side view as viewed from a terminal electrode side.

In the drawing, reference numeral 1 denotes an insulating substrate;
.., 3b... Are terminal electrodes, and 4 is a glass protective film.

The insulating substrate 1 is made of a rectangular alumina ceramic or the like, and has concave portions 11a,..., 11b in which terminal electrodes 3a, 3b are formed on a pair of end surfaces in the long side direction.
・ Is formed. The recesses 11a...
.. Have a substantially semicircular opening on both the front and back surfaces of the substrate 1 and are formed so as to penetrate the insulating substrate 1 in the thickness direction.

The terminal electrodes 3a,..., 3b are formed of front-side thick film conductor films 31a, 31b, and back-side thick film conductor film 32.
a, 32b, an end surface thick film conductor film 33a, 33b attached to the inner wall of the concave portion 11a, 11b, and a plating layer 34 deposited on the surface of the under film thick film conductor film.
a and 34b.

The front-side thick film conductor films 31a, 31b, the back-side thick film conductor films 32a, 32b, the end-face thick film conductor film 33a,
33b is formed by baking an Ag-based conductor paste containing Ag as a main component. Specifically, the surface-side thick film conductor films 31a and 31b are formed in a substantially rectangular shape on the surface of the insulating substrate 1 including the concave portions 11a and 11b formed on the long side edges of the insulating substrate. Also, the backside thick conductor film 32
b and 32b are formed on the back surface of the insulating substrate 1 including the concave portions 11a and 11b formed on the long side end sides of the insulating substrate in substantially the same shape as the front-side thick film conductor films 31a and 31b. . Furthermore, the end face side thick film conductor films 33a and 33b are formed on the inner walls in the concave portions 11a and 11b.

On the surface of such an insulating substrate 1, a plurality of thick film resistors 2 are formed. In particular,
Both ends of each thick-film resistor film 2 are superimposed on the surface-side thick-film conductor films 31a and 31b to be the terminal electrodes 3a and 3b, respectively.
It is arranged between the surface-side thick film conductor films 31a and 31b.
The thick resistor film 2 is formed by baking a resistor paste containing a metal oxide such as ruthenium oxide as a main component. In the center of each thick-film resistor film 2,...
・ ・ Is formed. By this adjustment, the thick-film resistor films 2 have a predetermined resistance value.

The thick-film resistor films 2...
Covered by The glass coating film 4 includes a primary overcoat glass 41 and a secondary overcoat glass 42.
This is a two-layer structure.

The primary overcoat glass 41 is made of glass mainly composed of lead borosilicate glass, and has a relatively small thickness of 5 to 15 μm. The primary overcoat glass 41 acts on the thick-film resistor film 2... To reduce the impact of the laser structure irradiated when adjusting the above-described resistance value. Extending between the terminal electrode 3a and the terminal electrode 3a, and between the terminal electrode 3b and the terminal electrode ba, and having at least the surface-side thick film conductive film 31a constituting the terminal electrode 3a; It is formed so as to overlap a part of the edge on the adjacent terminal electrode side of the surface-side thick film conductor film 31b constituting the electrode 3b, and serves to prevent a short circuit which occurs when the plating layers 34a and 34b are applied. .

The secondary overcoat glass 42 is
It is made of glass containing lead borosilicate glass as a main component, and has a relatively large thickness of 15 to 50 μm. The secondary over-glass 42 is mainly composed of the thick-film resistor film 2.
The trimming groove 21 generated in the thick resistor film 2 and the primary overcoat glass 41 due to the adjustment of the resistance value
・ ・ Improve the filling resistance to improve the moisture resistance.

As described above, as shown in FIGS. 2A and 2B, the primary overcoat glass 41 forming the glass coating film 4 extends between the two terminal electrodes 3a, It is formed so as to be superimposed on the end of the surface-side thick conductor film 31a of 3a.

As shown in FIG. 3, the primary over-glass 41a is exposed along the opening of the recess 11 so that the surface-side thick film conductor film 31 is exposed by 0.1 mm or more. The film 31a is formed so as to be superimposed on substantially the entire surface of the film 31a.

The above-mentioned primary overcoat glass 4
In the description of 1 and 41a, the terminal electrode 3a is used, but the same applies to the terminal electrode 3b side.

Thus, when the plating layers 34a, 34b are deposited on the underlying thick-film conductor films to be the terminal electrodes 3a, 3b, the shape of the end portions of the surface-side underlying thick-film conductors 31a, 31b becomes thick. Even if it has a wavy shape due to the printing accuracy of the film conductive paste, it is covered and superimposed with the glass coating film 4. Therefore, the portions where the plating layers 34a and 34b are applied are only the underlying thick conductor film portions exposed from the glass coating film 4, so that abnormal growth of plating can be effectively suppressed, and the adjacent terminals A short circuit between the electrodes 3a and 3a, 3b and 3b can be suppressed.

In the above-described embodiment, the front side thick film conductor films 31a and 31b have been described. However, as shown in FIG. 2 (b), the back side thick film conductor films 32a and 32b A glass coating film 41b is formed so as to overlap only at the ends of the side thick film conductor films 32a and 32b. In the back side thick film conductive films 32a and 32b, a glass coating film 41b that overlaps only at the end is formed. This is the back side thick film conductive film 32a,
Unlike the front-side thick film conductor films 31a and 31b, the thick-film conductor film 32b is bonded to the printed wiring circuit board via solder, so the back-side thick film conductor films 32a and 32b
The surface of the plating layer 34a over a relatively large area,
34b must be applied. Further, since the glass coating film 41b is overlapped only on the ends of the back side thick conductor films 32a and 32b, the insulating substrate 1 and the back side thick conductor film 32
a, 32b, and the thermal shock resistance of the terminal electrodes 3a, 3b at the time of soldering is improved.
Also, it has a secondary effect that peeling of a and 3b can be prevented.

Next, a method of manufacturing the multiple resistor according to the present invention will be described.

First, a large ceramic substrate from which a plurality of insulating substrates 1 can be extracted is prepared. On both front and back surfaces of the large-sized ceramic substrate, break grooves are formed to divide the area of each insulating substrate 1, and further, terminal electrodes 3 a, 3 b are formed on the break grooves serving as the long-side end surfaces of the insulating substrate 1. Recess 1
Through holes 1a and 11b are formed.

Next, in the region of each insulating substrate 1 of the large ceramic substrate substrate, the front side thick film conductor films 31a and 31b, which become the terminal electrodes 3a and 3b, and the back side thick film conductor film 32
a and 32b are formed. Specifically, on the front side of the large-sized ceramic substrate, using a thick-film conductor paste, a conductor film to be a front-side thick-film conductor film is printed so as to cover a through hole opened on the front side, and dried, On the back side of the large-sized ceramic substrate, a conductor film to be a back-side thick film conductor film is printed using a thick-film conductor paste so as to cover a through hole opened on the back side, dried, and baked.

When the front-side thick film conductor films 31a and 31b and the back-side thick film conductor films 32a and 32b are formed, the conductor paste flows into the through holes, and at the same time, the end-face side thick film conductor films 33a and 33b are formed. Thus, an underlying thick conductor film is achieved. In order to facilitate the inflow of the conductive paste, it is desirable to print the conductive paste while suctioning under reduced pressure from the through-holes on the main surface opposite to the printing surface.

Next, on the surface of the region of each insulating substrate 1 of the large-sized ceramic substrate substrate, the thick-film resistor films 2 which are superimposedly connected to the front-side thick-film conductor films 31a and 31b to be the terminal electrodes 3a and 3b. Is formed by printing and baking a resistance paste.

Next, a thick-film resistor film 2 is coated on the surface of each insulating substrate 1 of the large-sized ceramic substrate substrate, and at least the surface-side thick-film conductor film 31a of the terminal electrodes 3a, 3b. , 31b is formed by printing and baking a glass paste so as to cover the end portions of the glass coating film 4.

Note that, as shown in FIG.
Is formed by printing and baking a glass paste on the back side of the terminal electrode 3a, 3b to cover the ends of the back side thick film conductor films 32a, 32b of the terminal electrodes 3a, 3b.

Next, using the thick thick conductor film underlying the terminal electrodes 3a and 3b, the thick film resistor film 2.
While simultaneously measuring the resistance value, laser irradiation is performed on the thick-film resistor film 2 through the primary overcoat glass 41 to adjust the resistance value.

Next, a secondary overcoat glass 42 is formed on the primary overcoat glass 41 on the surface of each of the insulating substrates 1 of the large ceramic substrate substrate. Care must be taken that the secondary overcoat glass 42 is not at least filled in the break groove.

Next, a division process is performed on the region of the insulating substrate 1 along the break groove of the large ceramic substrate. At this time, even if the break groove is filled with the primary overcoat glass 41, the primary overcoat glass 41
Is set to have a relatively small thickness, so that it can be divided without any trouble.

Finally, the primary overcoat glass 41,
Plating layer (Ni plating, Sn / Pd plating, etc.) on the underlying thick conductor film exposed from overcoat glass 41a
34a and 34b are formed by a barrel plating method or the like.

In the above-described manufacturing method, the primary overcoat glass 41 is formed so as to overlap the ends of the surface-side thick film conductor films 31a and 31b. The exposed portions 31a and 31b may be formed over the entire surface of the large-sized ceramic substrate, leaving the exposed regions. The glass paste flows into the through-hole at the time of glass printing and the exposed region around the through-hole causes the end face side thick film conductor films 33a, 33
3b, plating layers 34a and 34 to be formed on the surface
This is intended to prevent the reliability of the solder bonding to the printed wiring board from being reduced by narrowing the area to be attached b.

In the above-described embodiment, the recesses 11a and 11b are formed at the edges of the substrate 1, and the recesses 11a and 11b are formed.
And the terminal electrodes 3a and 3b are formed around the center, the substantial step of forming the end-face-side thick conductor films 33a and 33b can be omitted, and the division of the large-sized ceramic substrate is performed by the primary break, There is no need to divide in consideration of direction such as a next break, and the manufacturing method can be performed very efficiently.

Moreover, the primary over glass 41 for preventing the short-circuit phenomenon between the adjacent terminal electrodes 3a and 3a, 3b and 3b due to the plating layers 34a and 34b is made of the thick-film resistor film 2.
.. Is protected and is an essential component as a buffering member when performing laser trimming, so that a short circuit phenomenon can be effectively prevented without particularly adding a component.

In the above embodiment, a multiple resistor has been described. However, the insulating substrate 1 has at least a plurality of thick-film resistor films on its surface, and a thin glass coating film is formed by deposition. Any of the multiple resistance components described above (a combination of a thick-film resistor film and a capacitance element or a combination of a thick-film resistor film and an inductance element is also possible) can be widely applied.

[0045]

As described above, according to the present invention, it is possible to effectively suppress a short circuit between adjacent terminal electrodes due to a plating layer constituting a terminal electrode, but to improve the manufacturing efficiency. Become.

[Brief description of the drawings]

FIG. 1 is a plan view of a multiple resistor which is one of multiple resistor components of the present invention.

FIG. 2A is a plan view of adjacent terminal electrode portions, and FIG. 2B is a side view thereof.

FIG. 3 is a plan view of adjacent terminal electrode portions showing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Thick film resistor film 3a, 3b ... Terminal electrode 31a, 31b ... Front side thick film conductor film 32a, 32b ... Back side thick film conductor film 33a, 33b ... End face side thick film conductor film 34a, 34b plating layer 4 glass coating film 41 primary overcoat glass 42 secondary overcoat glass

Claims (1)

[Claims] 1. An insulating substrate having a plurality of concave portions provided on an end side thereof, a plurality of thick-film resistor films arranged and formed on a surface of the insulating substrate, and an end portion of the thick-film resistor film is formed inside the concave portion. A thick-film resistor connected to a terminal electrode made of a thick-film conductive film formed on a wall surface, a part of which is led out around a concave portion on the front and back surfaces of the insulating substrate, and whose front surface is coated with a plating layer; In a multiple resistance component in which a film is coated with a glass film, the glass film extends between the concave portions so as to overlap with each outer peripheral portion of the thick film conductive film located around the concave portion on the front surface of the insulating substrate. A multiple resistance component characterized by being present.