JPH10152776A - Support for substrate and supporting method of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support for a substrate and a supporting method of the substrate by which holding and transportation of a mask, transfer and positioning thereof to and on a glass substrate can be simply and surely executed, handling property is excellent in detaching the mask, folding can be prevented from occurring and a color pattern of an glass substrate is not hurt and further ITO of a edge part of the mask is keen-edged to generates no blotting and shadow. SOLUTION: The support for the substrate is provided with a plate 1 on which opening parts are formed, the substrate 3 on which the color pattern is formed and the mask 2 made of a magnetic material on which opening parts are formed so as to oppose to a region where the color pattern is formed. The substrate 3 is fixed between the plate 1 and the mask 2. In this case, the plate 1 is provided with a permanent magnet 9 and electromagnets 8A, 8B capable of changing magnetic force and a magnetic pole.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used in a process for manufacturing a color filter for a liquid crystal display device or the like, and is used for forming a transparent conductive film having a predetermined shape on the color filter. About.

[0002]

2. Description of the Related Art In general, the manufacturing process of a color filter is as follows.
After forming a chromium film (or applying a resin black matrix followed by semi-curing) on a transparent rectangular substrate such as a glass or polymer film using a vacuum film forming method, apply a photoresist, and then apply a photomask. After exposing, developing, and chromium etching (or only developing), the photoresist is removed (cured in this case) to form a patterned black light-shielding layer, and then red (R) ), Green (G), and blue (B) colored layers are sequentially formed in a predetermined pattern shape, that is, after applying the first color photosensitive material (or after applying the colorant, semi-curing), the photomask is formed. After arranging and exposing, development is performed, a first color pattern is formed, a second and subsequent color patterns are formed in the same manner, and then a protective film layer is formed on the color pattern. Security After forming the indium tin oxide (ITO) by vacuum deposition on the film layer, a pattern is processed by etching or the like, comprising the step of forming a transparent conductive film.

[0003] Among the above-mentioned processes, there are various methods for forming a transparent conductive film, such as vapor deposition, ion plating, and sputtering. The protective film serving as a base of the transparent conductive film of a color filter is formed of a synthetic resin. Therefore, a sputtering method capable of forming a film at a relatively low temperature is widely used from the viewpoint of heat resistance of the protective film. In the automation line, a substrate and a mask are fixed at predetermined positions in a jig, and several tens of jigs are housed in a sputter device to perform sputtering. The conventional sputtering jig is mechanically fixed by means of a spring or the like with a glass substrate and a stainless steel mask interposed between the upper and lower two plates, for example, covering a region other than the color pattern region of the substrate. I was

However, conventionally, a glass substrate and
Due to the difference in the coefficient of thermal expansion from the stainless steel mask, there are problems that the pattern is blurred due to the floating of the mask and that the mask edge damages the color pattern edge.

In the above-mentioned conventional jig for sputtering, since the substrate and the mask are mechanically fixed by means of a spring or the like, the substrate is damaged when pressed too much, and when the pressing force is too weak. Between the mask and the mask,
There is a problem that the transparent conductive film goes around the edge of the color pattern of the substrate (bleeding). In particular,
This has been a particular problem in mass production of color filters having a plurality of color patterns formed on one substrate. In addition, the inside of the sputtering apparatus becomes high temperature of about 200 ° C., and the thermal expansion coefficient between the glass substrate and the stainless steel mask is different, so that thermal distortion occurs between the two during sputtering, thereby damaging the color pattern. Had the problem that

[0006] The thinner the mask, the better the accuracy. However, if the mask is fixed with a magnet or the like and strongly attracted by the magnetic force of the magnet, the mask may be dented when adjusting the position or removing the mask. There was a drawback that it was folded and workability deteriorated.

[0007]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and can easily and surely hold, transport, transfer and position a mask on a glass substrate. When removing the mask, it is easy to handle, it can prevent the mask from folding, it does not damage the color pattern on the glass substrate, the ITO at the mask edge is also good, and the blur and shadow It is an object of the present invention to provide a substrate support and a method for supporting a substrate which are difficult to perform.

[0008]

[Means for Solving the Problems]

(1) The plate comprising: a plate having an opening formed therein; a substrate having a color pattern formed thereon; and a mask made of a magnetic material having an opening formed so as to face a region having the color pattern formed thereon. A substrate support for fixing a substrate between the substrate and a mask, wherein the plate is provided with a permanent magnet and an electromagnet whose magnetic force and magnetic pole can be changed.

(2) The substrate support according to (1), wherein the plate is set on a carrier plate.

(3) An electromagnet capable of changing a magnetic force and a magnetic pole for transporting and transferring the mask on a substrate is movably installed at a position facing the mask. The substrate support according to 2).

(4) The substrate support according to any one of (1) to (3), wherein the material of the mask is made of an alloy having a thermal expansion coefficient substantially equal to that of glass.

(5) The thickness of the mask is from 0.1 mm to
The substrate support according to any one of the above (1) to (4), which is 1 mm.

(6) The above-mentioned (1) to (5), wherein the permanent magnet is a samarium-cobalt magnet.
The substrate support according to any one of the above.

(7) A substrate on which a color pattern is formed is formed by using a mask made of a magnetic material having an opening formed so as to face a region where the color pattern is formed, and a permanent magnet having an opening formed. When sandwiched between a plate provided with an electromagnet whose magnetic force and magnetic pole can be changed, the magnetic force of the electromagnet is lowered, and the mask is sandwiched by a permanent magnet through the substrate. Substrate support method.

(8) The magnetic force of the permanent magnet is reduced by the electromagnet of the plate when the mask is attracted and held by an electromagnet whose magnetic force and magnetic pole can be changed, transferred to the position on the substrate, and transferred onto the substrate. The method for supporting a substrate according to the above (7), wherein a mask is transferred onto the substrate from the electromagnet held and held in the held state.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 show an embodiment of the substrate support of the present invention, and FIG. 1 is a sectional view showing a state after a mask is conveyed and transferred using an electromagnet.

FIG. 2 is a perspective view showing a state where the plate is set on the carrier plate before setting the mask and the glass substrate.

In the drawing, the substrate support of the present invention is arranged such that the plate 1 having openings 1a and 1b, the glass substrate 3 having color patterns 3a and 3b, and the color patterns 3a and 3b are opposed to each other. A jig for fixing the plate 1, the mask 2, and the glass substrate 3 to each other. The fixing of the mask 2 is not an opening (no color pattern). The plate 1 in which a permanent magnet 9 and an electromagnet 8B are embedded in a part is used.

With such a jig, the magnetic force of the permanent magnet 9 is used to clamp the glass substrate 3 and the magnetic force of the permanent magnet 9 and the reverse application electromagnet 8B is applied to remove the glass substrate 3. The magnetic force can be reduced so that the mask 2 does not bend when it is removed, and further, it is mechanized to improve workability and improve positional accuracy.

As described above, the glass substrate 3 and the mask 2 having an opening are fixed to the plate 1, and the plurality of plates 1 are set on the carrier plate 6, transported into the sputtering apparatus, and from the mask 2 side. A transparent conductive film is formed on the glass substrate through the opening of the mask 2. The plate 1 is fixed to a carrier plate 6 with a set screw 7.

As described above, the permanent magnet 9 is embedded in a portion of the plate 1 that is not an opening (no color pattern) on the back surface side of the glass substrate 3, and the electromagnet 8B is embedded below the permanent magnet. The glass substrate 3 can be sandwiched between the mask 2 made of a magnetic material.

At an upper position of the mask 2, an electromagnet 8A capable of changing a magnetic force and a magnetic pole for transferring and transferring the mask 2 onto the glass substrate 3 is movably provided.

The electromagnets 8A and 8B switch the current direction, respectively, and change the magnetic poles to plus (+) and minus (-).
There is a switch that can be switched to
An inverter switch for varying the voltage and varying the magnetic flux density is provided.

The operation of the apparatus of the present invention will be described below on the assumption that the permanent magnet 9 always has a positive (+) magnetic pole in such a sputtering jig. In addition, even if the plus (+) and minus (-) magnetic poles are all opposite,
Similar effects can be obtained.

(1) First, the electromagnet 8A is set to minus (-).
To hold and carry the ITO mask 2.

(2) The electromagnet 8B is applied to minus (-), and a portion corresponding to the magnetic force of the permanent magnet 9 is applied so that the magnetic force of the permanent magnet 9 does not work.

(3) Electromagnet 8 holding ITO mask 2
A is moved to a position above a predetermined glass substrate 3, and the negative (-) magnetic force of the electromagnet 8B is reduced (voltage is reduced) so that the magnetic force of the permanent magnet 9 gradually works.

(4) The voltage applied to the electromagnet 8A in the negative (-) direction is eliminated, and the switch is turned off. At the same time, the switch is turned off after the voltage of the negative (−) applied to the electromagnet 8B is eliminated. The electromagnet 8B switches the switch to the plus (+) application to gradually increase the voltage. ITO
The mask 2 is transferred to the permanent magnet 9 side.

(5) After the transfer, the positive (+) voltage of the electromagnet 8B is gradually lowered, and then the switch is turned off, and the mask 2 is held only by the permanent magnet 9.

Here, when the position of the ITO mask 2 is shifted, (6) Since the permanent magnet 9 is plus (+),
B is applied with a minus (-) magnetic force corresponding to the magnetic force of the permanent magnet 9 so that the magnetic force of the permanent magnet 9 does not work.
After applying the electromagnet 8A to the minus (-), the voltage is gradually increased to increase the magnetic force, and the ITO mask 2 is transferred to the electromagnet 8A side.

(7) After the voltage applied to the electromagnet 8A is reduced to a level that can be held, (1) to (5) are repeated again.

Hereinafter, the operation of the present invention will be summarized as follows.

During transportation → Before transfer → During transfer → After transfer Electromagnet 8A Minus (-) → Minus (-) → OFF → OFF Permanent magnet 9 Plus (+) → Plus (+) → Plus (+) → Plus (+) Electromagnet 8B OFF → minus (−) → plus (+) → OFF In the present invention, the material of the mask 2 is preferably made of an alloy having a coefficient of thermal expansion substantially equal to that of glass. Preferable examples of such an alloy include a 42 alloy (an alloy composed of nickel and iron), for example, 42% nickel and 58% iron. The thickness of the mask is 0.1 mm to 1 m
m, preferably 0.25 mm to 0.5 mm. When the thickness of the ITO mask is increased, the weight is increased, but when the ITO mask is increased, a strong magnetic force is required. When a thin mask is used, the mask becomes lighter by that amount, and it is possible to hold and position even a small amount of magnetic force of the permanent magnet.

When a thin mask is used, its magnetic force hinders the removal of the mask. However, when the mask is thin, a "head" is formed between the portion held when the mask is removed and the boundary where it is attracted by the magnet.
In some cases, folding occurs, but since the magnet is held by a small amount of magnetic force of the permanent magnet, such folding can be prevented.

The permanent magnet 9 is preferably a samarium-cobalt magnet. Generally, even if a permanent magnet has a strong magnetic force at room temperature, the magnetic force decreases at a temperature of 200 ° C. or more. This is because the samarium-cobalt magnet hardly decreases in magnetic force even at such a high temperature.

In the present invention, the mask is positioned by sucking, holding, transporting, and transferring the glass substrate. By attaching the synthetic resin film, it is possible to prevent the glass substrate from being damaged.

In this case, the synthetic resin is made of 200 to prevent deterioration due to heat when forming a thin film on a substrate.
Those having a heat resistance of not less than ° C are preferred. For example, a fluorine resin, a silicone resin, a polyimide resin, or the like is used. These synthetic resins may be coated on the contact portion of the substrate support with the substrate, or may be bonded to the resin processed in a predetermined shape in advance. The thickness of the coating is not particularly limited, but is preferably in the range of 1 to 10000 μm from the viewpoint of the durability of the coating and the ease of gas release from the resin. If the thickness is less than 1 μm, the durability of the film is poor, and the film tends to peel off during use. On the other hand, if the thickness is more than 10000 μm, the light transmittance is likely to be reduced or the resistance value is likely to be deteriorated due to the effect of the gas released from the resin.

The polyimide film is a heat-resistant material that can withstand a high temperature of 200 ° C. and does not generate gas, and is therefore preferable, and does not adversely affect the color pattern.

The mask is preferably formed by etching.

[0041]

According to the present invention, with the above-described structure, the holding / transporting of the mask, and the transfer and positioning on the glass substrate can be performed easily and reliably.
The removal of the mask has the effect of being easy to handle because it is weakened by the reverse applied magnetic force of the electromagnet, and that the mask can be prevented from being folded. Furthermore, a substrate support can be provided which does not damage the color pattern of the glass substrate, cuts the ITO at the mask edge portion, and hardly causes blurring or shadowing.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a sputtering jig according to the present invention.

FIG. 2 is a perspective view showing an example of a state in which a plate is set on a carrier plate before setting a mask and a glass substrate according to the present invention.

[Explanation of symbols]

 1: Plate 1a, 1b: Opening 2: Mask 2a, 2b: Opening 3: Glass plate 3a, 3b: Color pattern 5: Stop pin 6: Carrier plate 7: Set screw 8A, 8B: Electromagnet 9: Permanent magnet

Claims (8)

[Claims] A plate having an opening formed therein, a substrate having a color pattern formed thereon, and a mask made of a magnetic material having an opening formed so as to face a region where the color pattern has been formed, A substrate support for fixing a substrate between the plate and a mask, wherein the plate includes a permanent magnet and an electromagnet whose magnetic force and magnetic pole can be changed. 2. The substrate support according to claim 1, wherein said plate is set on a carrier plate. 3. An electromagnet, which can change the magnetic force and magnetic pole for transporting and transferring the mask onto a substrate, is movably provided at a position facing the mask.
Or the substrate support according to 2. 4. The substrate support according to claim 1, wherein said mask is made of an alloy having a coefficient of thermal expansion substantially equal to that of glass. 5. The method according to claim 1, wherein said mask has a thickness of 0.1 mm to 1 mm.
The substrate support according to any one of claims 1 to 4, wherein 6. The substrate support according to claim 1, wherein the permanent magnet is a samarium-cobalt magnet. 7. A substrate, on which a color pattern is formed, comprising: a mask made of a magnetic material having an opening formed so as to face a region where the color pattern is formed; a permanent magnet having an opening formed; When sandwiched between a plate provided with an electromagnet whose magnetic force and magnetic pole can be changed,
A method of supporting a substrate, wherein the magnetic force of the electromagnet is reduced, and the mask is held between the substrates by the magnetic force of a permanent magnet. 8. The magnetic force of the permanent magnet is reduced by the electromagnet of the plate when the mask is attracted and held by an electromagnet whose magnetic force and magnetic pole can be changed, transferred to a position on the substrate, and transferred onto the substrate. 8. The method according to claim 7, wherein a mask is transferred onto the substrate from the attracted and held electromagnet in the state.