JPH10135013A - Manufacture of chip part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture appropriately with less processes, without employing a process where a magnetic substrate is divided by aligning plural magnetic elements in a specified orientation with a conductor film formation surface being front side, and depositing an armoring insulation film by a thin-film method with its both sides in longitudinal direction masked. SOLUTION: Firstly, a magnetic element 1 whose edge is rounded is manufactured. Then, sputtering or vapor-depositing is performed with the magnetic element 1 housed in a path 2a of a mask device 2, to form, a resistance film 3. Then, a trimming work is applied to the resistance film 3. With this magnetic element 1 housed in the path of anther mask device, sputtering or vapor- depositing is performed to form an armoring insulating film. Then, an electrode conductor film is formed on the magnetic element 1, after the insulation film has been formed. Thereby, without employing a process where a ceramic substrate is divided, a chip resistor is manufactured appropriately and stably with fewer number of processes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip component which can be mounted on a substrate or the like.

[0002]

2. Description of the Related Art FIG. 13 shows a square chip resistor known as such a conventional chip component.

The chip resistor includes a ceramic element 101 having a rectangular column shape with a rectangular cross section, a resistance film 102 formed on one side surface (upper surface) of the ceramic element 101, and an exterior insulating film 103 covering the resistance film 102. And a pair of electrode conductive films 104 that are electrically connected to the end of the resistive film 102.

[0004] The above chip resistor includes a step of preparing a porcelain substrate having divided grooves at a lattice shape or at predetermined intervals, a step of forming a resistive film in a rectangular area surrounded by the divided grooves on one surface of the porcelain substrate, A step of performing trimming for each resistance film for value adjustment; a step of dividing the porcelain substrate into element pieces along the division grooves; and a pair of electrodes that conduct to the resistance film at both ends of the divided porcelain element. It is manufactured through a step of forming a conductor film for use and a step of covering each resistance film with an insulating film for exterior use.

[0005] For some components, the step of forming a conductor film for an electrode is performed between the step of forming a resistive film and the step of performing trimming, and the step of forming an exterior insulating film is performed after the step of performing trimming. In some cases, the porcelain substrate is finally divided.

[0006]

In the above-mentioned conventional chip resistor, it is troublesome to divide the porcelain substrate into element pieces, and the element pieces are easily chipped or cracked at the time of division, so that the yield tends to be reduced. . In addition, burrs generated at the time of division remain on the component to deteriorate the appearance of the component, and the burrs hinder the component supply when mounting the component on a substrate or the like. The above-mentioned problem can also occur in a similar manufacturing method, particularly in other chip components having a step of dividing the porcelain substrate, such as a chip jumper.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a chip component capable of easily obtaining a high quality chip component.

[0008]

In order to achieve the above object, a method of manufacturing a chip component according to the present invention is characterized in that a circuit conductor film is formed on one side surface of a porcelain element having a prismatic shape, and is provided on both ends of the porcelain element. In a method for manufacturing a chip component in which a pair of electrode conductive films that are electrically connected to each other, and a portion of the circuit conductive film sandwiched between the electrode conductive films is covered with an exterior insulating film, a rectangular column shape with rounded edges is provided. Obtaining a porcelain element;
Forming a circuit conductor film on one side surface of each porcelain element by a thin-film method in a state where a plurality of porcelain elements are arranged in a predetermined direction and the same side faces up, and both sides in the width direction are masked; A plurality of ceramic elements after the formation of the conductive film are arranged in a predetermined direction so that the surface on which the conductive film is formed is facing up, and both sides in the longitudinal direction are masked. The main feature of the present invention is that the method includes a step of forming an insulating film for use and a step of forming a conductor film for an electrode at both ends of the ceramic element after the formation of the insulating film for exterior by a thick film method or a thin film method.

According to this method of manufacturing a chip component, by performing each of the above-described steps, a desired chip resistor can be accurately formed in a small number of steps without employing a complicated step of dividing a ceramic substrate. Can be manufactured.

[0010]

1 to 9 show embodiments in which the present invention is applied to a chip resistor. Hereinafter, a method of manufacturing the chip resistor according to the present embodiment will be described with reference to FIGS.

At the time of manufacture, first, a porcelain element 1 as shown in FIG. 1, more specifically, a porcelain element having a square cross section, a predetermined length, and rounded edges (corners and ridges). Element 1 is prepared.

The porcelain element 1 is made of alumina powder (70 w%
Extruding a ceramic slurry prepared by mixing a binder and a solvent to obtain a rod-shaped substrate having a square cross section, cutting the rod-shaped substrate into predetermined dimensions, and firing the cut chips at a firing temperature of 1300 to 1300. It is formed through a step of firing at 1500 ° C. and a firing time of 2 hours, and a step of polishing the cut chips after firing with a barrel polishing machine such as a centrifugal barrel or an eccentric rotary barrel. The cut chips after firing are subjected to the above-described barrel polishing to remove burrs and round off edges (corners and ridges).

Next, a mask device 2 as shown in FIG. 2, more specifically, a plurality of passages 2a having a square cross section slightly larger than the cross sectional shape of the porcelain element 1 are provided in parallel at equal intervals.
A mask device 2 having an opening 2b having a width smaller than the width of the side surface of the porcelain element 1 in the center of the upper surface of the ceramic device 1 is prepared. Incidentally, the width dimension of the opening 2b defines the width dimension of the resistive film 3, which will be described later, and its position defines the position where the resistive film 3 is formed.

Then, the porcelain elements 1 are vertically inserted into the passages 2a of the mask device 2, and a plurality of the porcelain elements 1 are vertically arranged without gaps in each of the passages 2a. A NiCr-based resistive film 3 is formed on a portion exposed from the side opening 2b by sputtering or vapor deposition.

Since the edge of the porcelain element 1 (here, the boundary between the end face and the side face) is previously rounded, as shown in FIG. The concave h1 is formed on the basis of the roundness of the edge, and the deposition by the sputtering method or the vapor deposition method is performed not only on one side surface of each of the ceramic elements 1 but also on the concave h1.

That is, if the porcelain element 1 is pulled out from the passage 2a of the mask device 2 after the film is deposited, one side surface of each porcelain element 1 extends in the shape as shown in FIG. In addition, the belt-shaped resistance film 3 whose both ends reach the end face of the ceramic element 1 is formed.

Next, as shown in FIG. 5, the resistive film 2 is irradiated with laser light LB, and the resistive film 3 is formed in the resistive film 3 by the irradiated laser light.
a is formed, trimming is performed, and fine adjustment of the resistance value is performed.

Next, mask devices 4 as shown in FIG. 6, more specifically, passages 4a having a rectangular cross section slightly larger than the vertical cross section of the porcelain element 1 are provided in parallel at equal intervals, and each of the passages 4a
A mask device 4 having an opening 4b having a width smaller than the side length of the porcelain element 1 in the center of the upper surface of the ceramic element 1 is prepared.
Incidentally, the width dimension of the opening 4b is determined by the exterior insulating film 5 described later.
Is defined, and the position defines the position where the exterior insulating film 5 is formed.

Then, the ceramic element 1 after the formation of the resistive film is inserted into the passage 4a of the mask device 4 so that the surface on which the resistive film is formed is turned sideways, and a plurality of the ceramic elements 1 are inserted into each passage 4a.
Are arranged side by side without any gaps, and a ceramic-based insulating insulating film such as SiO ₂ , Al ₂ O ₃ or the like is formed by sputtering or vapor deposition on a portion exposed from the opening 4 b of the resistance film forming surface of each porcelain element 1. 5 is formed.

Since the edges of the porcelain element 1 (here, the boundary between the side surfaces) are formed in advance, the upper part of the contact surface of the porcelain element 1 arranged without any gap in the lateral direction as shown in FIG. The recess h2 is formed based on the roundness of the edge, and the deposition by the sputtering method or the vapor deposition method is performed not only on one side surface of each of the ceramic elements 1 but also on the recess h2.

That is, if the porcelain element 1 is pulled out from the passage 4a of the mask device 4 after the deposition, the resistive film forming surface of each porcelain element 1 has a shape as shown in FIG.
A band-like exterior insulating film 5 extending in the width direction and extending over both sides of the adjacent ceramic element 1 is formed.

Next, as shown in FIG. 9, a conductor film 6 for an electrode is formed on both ends in the longitudinal direction of the ceramic element 1 after the formation of the insulating film by a thick film method or a thin film method. In the case of the thick film method, a conductive paste prepared by mixing a binder and a solvent with a metal powder such as Ni or Sn-Pb is applied to both ends in the longitudinal direction of the porcelain element 1 by a method such as coating or dipping,
This may be baked, and when a thin film method is used, a conductor film of Ni, Sn-Pb, or the like may be deposited on both ends in the longitudinal direction of the ceramic element 1 by a technique such as barrel plating. Thus, the manufacture of the chip resistor is completed.

As described above, according to the method of manufacturing the chip resistor according to the present embodiment, the step of obtaining the porcelain element 1 having a rounded edge and the passage of the porcelain element 1 to the passage 2a of the mask device 2
Forming a resistive film 3 by performing sputtering or vapor deposition in a state where the resistive film 3 is trimmed, and removing the porcelain element 1 after the resistive film formation into the passage 4 a of the mask device 4. The step of forming the exterior insulating film 5 by performing sputtering or vapor deposition in the state of being housed in the ceramic element 1 and the step of forming the conductor film 6 for an electrode on the ceramic element 1 after the formation of the insulating film are performed. The desired chip resistor can be accurately and stably manufactured in a small number of steps without employing complicated steps such as division.

Further, since the conventional substrate dividing step is not required, the problem of chipping or cracking that occurred at the time of division can be avoided, and the manufacturing yield can be improved. It is possible to obtain a high-quality chip resistor suitable for bulk supply by eliminating the problem of defective or component supply failure.

Further, a plurality of porcelain elements 1 are arranged vertically so that the same side faces the front side, and the resistive film 1 is deposited by a sputtering method or a vapor deposition method in a state where both sides in the width direction are masked by the mask device 2. Along with forming the film, the plurality of ceramic elements 1 after the formation of the resistive film are arranged sideways so that the surface on which the resistive film is formed is face-up, and both sides in the longitudinal direction are masked by the mask device 2. By depositing the exterior insulating film 5, a band-shaped resistance film 3 extending in the longitudinal direction of the ceramic element 1 and having both ends reaching the end face of the ceramic element 1 on one side surface of the ceramic element 1, And a strip-shaped exterior insulating film 5 extending in the width direction and having both ends reaching the side surfaces of the adjacent ceramic element 1 with high accuracy and efficiently and collectively for a plurality of ceramic elements 1. Door can be.

In the above-described embodiment, the mask devices 2 and 4 are used to cover unnecessary portions of the porcelain element 1 at the time of depositing the resistive film 3 and the insulating film 5. By adopting such a method, the same deposition can be performed without using the mask devices 2 and 4.

That is, at the time of forming the resistive film, FIG.
As shown in (b), a resist r1 is attached to both ends in the width direction of the porcelain element 1 while leaving a resistive film forming region, and as shown in FIG. A resistive film is deposited by a sputtering method or a vapor deposition method in a state where the resistive films are arranged in a matrix without gaps, and the resists r1 of the respective ceramic elements 1 are collectively removed using a solvent or the like after the deposition. Further, at the time of forming the insulating film, resists r2 at both ends in the longitudinal direction of the ceramic element 1 are adhered while leaving the insulating film forming region as shown in FIG. 11A, and this is removed as shown in FIG. An insulating film is deposited by a sputtering method or a vapor deposition method in a state where the side surfaces (the surface on which the insulating film is formed) are arranged in a matrix without gaps, and after the deposition, the resist r2 of each porcelain element 1 is dissolved in a solvent. Etc. to remove them all at once.

In the above embodiment, the porcelain element has a square cross section. However, a porcelain element having a rectangular cross section or another polygonal shape may be used. Of course, as shown in FIG. 12, the outer shape of the central portion 11a is smaller than the outer shape of both end portions 11b as the porcelain element 11, an insulating film is formed on the central portion surface, and an electrode conductive film is formed on both end surfaces. You may do it.

Further, in the above embodiment, the present invention is applied to a chip resistor. However, the present invention is not limited to the chip resistor, and a circuit conductor film is formed on one side surface of a prismatic porcelain element. If the chip component is provided with a pair of electrode conductor films electrically connected to both ends of the porcelain element, and a portion of the circuit conductor film sandwiched between the electrode conductor films is covered with an exterior insulating film, a chip is used. The present invention can be widely applied to chip components other than resistors, for example, chip jumpers, chip capacitors, chip inductors, and the like, and similar effects can be obtained.

[0030]

As described in detail above, according to the present invention,
The desired chip component can be accurately and stably manufactured with a small number of processes without employing a complicated process such as dividing the porcelain substrate. Further, since the conventional substrate dividing step is not required, the problem of chipping or cracking that occurred at the time of division can be avoided to improve the production yield, and at the same time, appearance defects and parts due to burrs generated at the time of division can be improved. By eliminating the problem of defective supply, a high-quality chip component suitable for bulk supply can be obtained.

Further, a circuit conductor film is deposited by a thin film method in a state where a plurality of porcelain elements are arranged in a predetermined direction and the same side face is turned on, and both sides in the width direction are masked. By arranging a plurality of porcelain elements after film formation in a predetermined direction and with the conductor film formation surface facing up, and masking both sides in the longitudinal direction, an insulating insulating film is deposited by a thin film method to form a ceramic. On one side of the element, a strip-shaped circuit conductor film extending in the longitudinal direction of the porcelain element and both ends reaching the end face of the porcelain element, and extending in the width direction of the porcelain element and both ends reaching the side of the adjacent porcelain element Such a band-shaped exterior insulating film can be formed with high accuracy and collectively and efficiently for a plurality of porcelain elements.

[Brief description of the drawings]

FIG. 1 is a perspective view of a porcelain element.

FIG. 2 is a view showing a state in which a mask device and a porcelain element are housed.

FIG. 3 is a view showing a state in which a resistive film is deposited on a ceramic element.

FIG. 4 is a perspective view of a porcelain element after a resistive film is formed.

FIG. 5 is a diagram showing a trimming method.

FIG. 6 is a diagram showing a state in which a mask device and a porcelain element are housed.

FIG. 7 is a view showing a state in which an insulating film is deposited on a porcelain element;

FIG. 8 is a perspective view of a porcelain element after an insulating film is formed.

FIG. 9 is a perspective view of a porcelain element after a conductor film for an electrode is formed.

FIG. 10 is a perspective view of a porcelain element to which a resist for resistive film deposition has been attached, and a diagram showing an element arrangement state at the time of resistive film deposition.

FIG. 11 is a perspective view of a porcelain element to which a resist for depositing an insulating film is attached, and a view showing an element arrangement state when the insulating film is deposited.

FIG. 12 is a view showing another example of the shape of the porcelain element;

FIG. 13 is a perspective view of a chip component showing a conventional example and a longitudinal sectional view thereof.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Porcelain element, 2 ... Mask apparatus, 2a ... Passage, 2b ... Opening, h1 ... Depression, 3 ... Resistive film, LB ... Laser beam, 4 ...
Mask device, 4a: passage, 4b: opening, h2: recess, 5
... exterior insulating film, 6 ... conductor film for electrode, r1, r2 ... resist, 11 ... porcelain element, 11a ... central part, 11b ... both ends.

Claims (5)

[Claims] A ceramic conductor element having a prismatic shape is provided with a circuit conductor film on one side and a pair of electrode conductor films electrically connected to both sides of the ceramic element at both ends of the ceramic element. In the method for manufacturing a chip component in which the portion sandwiched by the steps is covered with an exterior insulating film, a step of obtaining a porcelain element having a prismatic shape with rounded edges, and a plurality of porcelain elements in a predetermined direction and on the same side face Forming a circuit conductor film on one side surface of each porcelain element by a thin film method in a state where both sides in the width direction are masked, and a plurality of porcelain elements after the formation of the circuit conductor film are oriented in a predetermined direction and A step of forming an exterior insulating film by a thin film method on the conductive film forming surface of each porcelain element in a state in which the conductive film forming surfaces are arranged face-up and masking both longitudinal sides thereof; At both ends of the porcelain element And a step of forming an electrode conductor film by film method or a thin film method, a manufacturing method of a chip component, characterized in that. 2. A passage capable of accommodating porcelain elements arranged in a predetermined direction in a step of forming a circuit conductor film and a step of forming an exterior insulation film, and a deposition portion of the porcelain element accommodated in the passage. Using a mask device having an opening capable of exposing
2. The method according to claim 1, wherein masking in both steps is performed by the mask device. 3. The method for manufacturing a chip component according to claim 1, wherein masking in the step of forming the circuit conductor film and the step of forming the exterior insulating film are performed by a resist attached to the porcelain element. 4. The method according to claim 1, wherein the step of forming the circuit conductor film and the step of forming the exterior insulating film are performed by a sputtering method or a vapor deposition method. Manufacturing method of chip parts. 5. A porcelain element having an outer shape at a central portion corresponding to a portion where an exterior insulating film is formed is smaller than an outer shape at both ends corresponding to a portion where a conductor film for an electrode is formed. The method for manufacturing a chip component according to any one of claims 1 to 4, wherein