JPH10134914A - Socket for two-layer type plane circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the two-layer type plane circuit board which accelerates much the effective utilization of a space over a master substrate, and concurrently is so designed as to prevent the occurrence of mutual interference of each solder tail as much as possible. SOLUTION: The solder tails 22a and 23a of a lower part contact 20 are disposed to one side of the housing main body 2 of the socket 5 for a lower plane circuit board, concurrently the solder tails 31a and 32a of a relay contact 30 to be connected with the other side of a socket 3 for an upper plate circuit substrate are disposed, and the socket 3 for the upper plane circuit board is so designed as to be removably mounted to a socket 5 for the lower plane circuit board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a DIMM (Dual Inli
ne Memory Module) and other flat circuit board sockets that connect a flat circuit board to the motherboard.
In particular, the present invention relates to a two-layer flat circuit board socket in which sockets for a flat circuit board are mounted in two layers on a parent board.

[0002]

2. Description of the Related Art In general, in a thin personal computer or the like, an expansion memory (child board) which forms an interface for an additional memory board or a peripheral device is provided in a housing which forms the main body.
In order to connect a flat circuit board such as the above, a flat circuit board socket is mounted on a main board (mother board), and the above-mentioned various flat circuit boards are inserted into the flat circuit board socket, so that the parent board and the child board are connected. Electrical connection with the flat circuit board.

This conventional flat circuit board socket has a single housing having a substantially U-shaped plane, a plurality of contacts arranged along the longitudinal direction of the center of the housing, and a plurality of contacts arranged along the contacts. And a single board insertion groove into which the connection terminal of the flat circuit board is removably inserted, and a single flat circuit board is inserted into the single board insertion groove in parallel with the parent board. To be installed.

[0004] Each of the solder tails (parts to be soldered to the corresponding wiring patterns formed on the parent board), which are the rear ends of the plurality of contacts provided in the socket for the flat board, are provided with the board insertion grooves. It protrudes from the housing side wall at the opposing position, and further extends toward the parent board.

[0005]

According to the above-mentioned conventional flat circuit board socket, the flat circuit board socket is directly mounted on the parent board, and therefore occupies a large area on the parent board. In particular, if a plurality of flat circuit board sockets are to be mounted at separate positions on the motherboard, the occupied area on the motherboard will increase significantly,
For this reason, there is a possibility that other necessary electronic components cannot be mounted on the parent board.

In order to solve the above-mentioned problems,
It is conceivable to mount the flat circuit board socket on the upper and lower layers with respect to the parent board. However, when the conventional flat circuit board socket is mounted on the upper and lower layers, a solder of a large number of contacts extending from each housing body of each socket is considered. Since the tails are close to each other, they tend to interfere with each other, so that it has been extremely difficult to mount the flat circuit board socket on the upper and lower two layers on the parent board.

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, an object of the present invention is to provide a two-layer flat circuit board socket which further promotes effective use of space on a mother board and prevents mutual interference of solder tails.

[0008]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a socket for a two-layer flat circuit board according to the present invention comprises:
An upper housing having a substantially U-shape in plan view, a plurality of upper contacts arranged along a longitudinal direction of a center portion of the upper housing, each contact tail projecting from a lower surface of the upper housing, and a juxtaposition direction of the upper contacts An upper board circuit board socket having an upper board insertion groove formed at the center of the upper housing along the upper housing and having a connection terminal of the board circuit board detachably fitted therein, and a lower housing having a substantially U-shape in plan view. A plurality of lower contacts arranged side by side along the longitudinal direction of the central portion of the lower housing; and connection terminals of the flat circuit board formed on the central portion of the lower housing along the direction of the juxtaposition of the lower contacts. And a solder tail of the lower contact extending toward the lower substrate insertion groove through the lower housing center portion. A plurality of relay contacts which are arranged side by side along a longitudinal direction in the lower housing central portion so as to face an upper surface side of the lower housing central portion, and corresponding contact tails of the upper contact are detachably connected to each other; And a lower flat circuit board socket having a solder tail of the relay contact extending from a central side wall of the lower housing at a position facing the insertion groove.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a socket for a two-layer flat circuit board according to the present invention.

FIG. 1 is a conceptual perspective view showing a two-layer type flat circuit board socket 1 according to the present invention.

The socket 1 for a two-layer flat circuit board is
An upper flat circuit board socket 3 made of a polymer material such as plastic having an upper housing 2 having a substantially U-shaped flat surface, and a lower housing 4 also having a substantially U-shaped flat surface.
And a lower plate circuit board socket 5 formed of a polymer material such as plastic having the following.

The lower plate circuit board socket 5 is positioned and supported on a mother board (not shown), and the upper plate circuit board socket 3 is detachably positioned on the lower plate circuit board socket 5. It is installed.

The upper plate circuit board socket 3 of the upper and lower plate circuit board sockets 3 and 5 includes a plurality of upper contacts 10 arranged side by side along the longitudinal direction of the upper housing center portion 2a. An upper substrate insertion groove 11 is formed in the upper housing central portion 2a along the direction of the juxtaposition of 10 and has a connection terminal of a flat circuit board to be described later detachably inserted therein.

The lower plate circuit board socket 5 has a plurality of lower contacts 20 arranged side by side along the longitudinal direction of the lower housing center part 4a, and a lower housing center part 4a arranged along the direction in which the lower contacts 20 are arranged. A lower board insertion groove 21 into which a connection terminal of a flat circuit board to be described later is detachably inserted, and a lower housing central portion 4a
And a relay contact (not shown) that is arranged side by side along the longitudinal direction in the lower housing central portion 4a so as to face the upper surface of the lower housing.

A plurality of upper contacts 10 arranged side by side at the center 2a of the upper housing constituting the upper plate circuit board socket 3 are shown in FIG. 2 as shown in the AA enlarged sectional view of FIG. And a pair of upper and lower contact pins 12 and 13 connected to the connection terminals of the flat plate circuit board.
Each contact tail 1 of these contact pins 12 and 13
Reference numerals 2a and 13a protrude downward from the lower surface 2b of the central portion of the upper housing.

As shown in FIG. 3, a pair of upper and lower contact pins 12 and 13, which are constituent elements of the upper contact 10, have respective protrusions 12 protruding in the middle.
The b and 13b are inserted into holes 2e and 2f formed in the front surface 2c and the back surface 2d of the corresponding upper housing 2 as indicated by arrows, and are mounted in the upper housing 2.

A pair of upper and lower contact pins 12, 1
When the device 3 is mounted in the upper housing 2, the respective contact tails 12a, 13a of the pair of upper and lower contact pins 12, 13 project downward from the lower surface 2b of the upper housing central portion, as shown in FIG.

On the other hand, as shown in FIG. 2, a plurality of lower contacts 20 arranged in parallel in a lower housing center portion 4a constituting the lower plate circuit board socket 5 are constituted by a pair of upper and lower contact pins 22, 23, The solder tails 22a and 23b corresponding to the rear ends extend toward the lower substrate insertion groove 21 via the lower housing central front surface 4b.

As shown in FIG. 2, the upper surface 4 of the lower housing central portion 4a is formed in the longitudinal direction inside the lower housing central portion 4a constituting the lower plate circuit board socket 5.
c, each contact tail 12a, 13 of the upper contact 10 constituting the socket 3 for the upper flat circuit board.
a is removably fitted into the contact tail 12a,
A plurality of relay contacts 30 for establishing an electrical connection with 13a are arranged in parallel.

The relay contact 30 is composed of a pair of contact pins 31 and 32 disposed before and after the lower housing center portion 4a so as to face the respective contact tails 12a and 13a of the upper contact 10, and corresponds to the rear end. Each of the solder tails 31a and 32a extends from a lower portion 4d of the side wall of the lower housing center portion 4a at a position facing the lower substrate insertion groove 21.

Of the lower and relay contacts 20 and 30 constituting the socket 5 for the lower plate circuit board, a pair of upper and lower contact pins 22 and 23 constituting the lower contact 20 are arranged in the lower stage as shown in FIG. The holes 4e formed in the front surface 4b of the lower housing 4 correspond to the projections 22b and 23b formed in the lower housing 4 as shown by arrows.
4f and fitted in the lower housing 4 respectively.

When the pair of upper and lower contact pins 22 and 23 are mounted in the lower housing 4 in this manner, FIG.
As shown by, the solder tails 22a and 23a of the pair of upper and lower contact pins 22 and 23 extend toward the lower substrate insertion groove 21 via the lower housing center front surface 4b.

On the other hand, of the lower and relay contacts 20 and 30 constituting the lower plate circuit board socket 5, a pair of front and rear contact pins 31 and 32 constituting the relay contact 30 are located at the middle stage thereof as shown in FIG. The engagement portions 31b, 32b formed in the holes 4 are formed from the lower surface 4g of the lower housing 4 to the upper surface 4c as shown by arrows.
h, 4i and mounted in the lower housing 4.

The contact pins 12, 1 constituting the upper contact 10 are provided above the holes 4h, 4i.
Introducing holes 4j and 4k for guiding the respective contact tails 12a and 13a of FIG. 3 (FIG. 4) into the opposing holes 4h and 4i are formed.

A pair of front and rear contact pins 31, 32
6, the solder tails 31a and 32a of the pair of front and rear contact pins 31 and 32 are formed from the lower side wall 4d at the center of the lower housing facing the lower substrate insertion groove 21, as shown in FIG. It will be extended outside.

In FIG. 6, reference numeral 34 denotes a positioning boss for positioning the lower plate circuit board socket 5 with respect to a parent board (not shown).

Next, the structure of the other portions of the upper and lower circuit board sockets 3 and 5 having the above-described structure will be described in detail.

As shown in the perspective view of FIG. 7, a flat circuit board to be described later is mounted in the center of the upper housing 2 constituting the upper flat circuit board socket 3 among the upper and lower flat circuit board sockets 3, 5. In this case, a projection 35 for positioning the terminal side is integrally formed, and the upper housing central portion 2a is formed.
A pair of side plates 36 and 37 for positioning and supporting both sides of a flat circuit board described later are integrally formed on both sides of the flat board.

Further, metal side plate guards 38 and 39 are attached to the pair of side plates 36 and 37, respectively, as shown by arrows. The side plate guards 38, 39 are mounted by inserting guide projections 38a, 39a formed at the distal ends thereof into guide grooves 40, 41 formed on both sides of the upper housing 2. Holes 38b, 39b formed at the tip of each side plate guard 38, 39 are fitted to rectangular projections 42 formed at both ends. In FIG. 7, reference numerals 36a and 37a denote side positioning projections for a flat circuit board formed on the side plates 36 and 37, and reference numeral 38.
Reference numerals c and 39c denote projections for positioning and holding the upper flat circuit board socket 3 with respect to the lower flat circuit board socket 5.

FIG. 8 is a perspective view showing a state where the side plate guards 38 and 39 are mounted on the socket 3 for the upper flat circuit board.

On the other hand, as shown in the perspective view of FIG. 9, a projection 46 for positioning a terminal side when a flat circuit board, which will be described later, is mounted at the center of the lower housing 4 constituting the lower flat circuit board socket 5. A pair of side plates 47, 48 for positioning and supporting both sides of a flat circuit board, which will be described later, are integrally formed on both sides of the lower housing 4.

Metal side plate guards 49 and 50 are attached to the pair of side plates 47 and 48 as shown by arrows. The side plate guards 49, 50 are mounted by inserting guide projections 49a, 50a formed at the distal ends thereof into guide grooves 51, 52 formed on both sides of the lower housing 4. This is performed by fitting holes 49b, 50b formed at the tips of the side plate guards 49, 50 into rectangular projections 53 formed at both ends.
In FIG. 9, reference numerals 47a and 48a denote side plates 47 and 48.
The projections 49c, 50c for lateral positioning of the flat circuit board formed on the side plate guards 38, 39 of the upper flat circuit board socket 3 are fitted with the projections 38c, 39c (FIG. 8). A fitting recess for positioning and supporting the upper flat circuit board socket 3 on the lower flat circuit board socket 5.

FIG. 10 is a perspective view showing a state where the side plate guards 49 and 50 are mounted on the socket 5 for the lower flat circuit board.

Next, the procedure for mounting the flat board on the upper and lower flat board sockets 3 and 5 will be described in detail.

First, as shown in the perspective view of FIG. 11, the lower plate circuit board socket 5 mounted on a parent board (not shown)
The flat circuit board 60 is inserted into the lower board insertion groove 21 as shown by the arrow with the terminal 60a side at the top. In addition,
In FIG. 11, reference numeral 61 denotes an electronic component such as a memory mounted on the flat circuit board 60, 62 denotes a positioning recess to be inserted into the projection 46 of the lower flat circuit board socket 5, 63, 64
Are projections for positioning the substrate which are fitted to the projections 47a, 48a of the side plates 47, 48.

As shown in FIG. 11, when the flat circuit board 60 is inserted into the lower board insertion groove 21 of the lower flat circuit board socket 5 along the arrow, as shown in the perspective view of FIG. Numeral 60 is accurately positioned and supported in the lower plate circuit board socket 5, and at the same time, each lower contact 20 of the lower plate circuit board socket 5 shown in FIG. Electrical connection between the parent board and the electronic component 61 mounted on the flat circuit board 60 is achieved.

Next, as shown in FIG. 13, the upper flat circuit board socket 3 is mounted on the lower flat circuit board socket 5 on which the flat circuit board 60 is mounted, as shown by an arrow.
Each of the contact tails 12a, 13a of the upper contact 10 projecting downward from the lower surface 2b of the upper housing central part is inserted into each of the introduction holes 4j, 4k formed in the lower housing upper surface 4c at a corresponding position. The projections 38c, 39c formed on the side plate guards 38, 39 of the board socket 3 are fitted to the fitting recesses 49c, 5c formed on the respective side plate guards 49, 50 of the lower plate circuit board socket 5.
0c.

Then, as shown in the perspective view of FIG. 14, the lower flat circuit board socket 5 with the flat circuit board 60 mounted thereon.
In contrast, the upper flat circuit board socket 3 is accurately positioned and supported, and at the same time, as shown in FIG.
Each contact tail 12a, 13 of the upper contact 10
a and each contact pin 31, 32 of the relay contact 30
Slidably contact with each other to establish an electrical connection between the upper contact 10 and the relay contact 30.

As shown in FIG. 14, after mounting the upper plate circuit board socket 3 on the lower plate circuit board socket 5,
As shown in the perspective view of FIG. 15, the flat circuit board 70 is inserted into the upper board insertion groove 11 of the upper flat circuit board socket 3.
The terminal 70a side is inserted as shown by the arrow. In FIG. 15, reference numeral 71 denotes an electronic component such as a memory mounted on the flat-plate circuit board 70, 72 denotes a positioning recess to be inserted into the protrusion 35 of the upper-plate circuit board socket 3, 73,
Reference numeral 74 denotes a fitting recess for positioning the board, which is fitted to the protrusions 36a, 37a of the side plates 36, 37.

As shown in FIG. 15, when the flat circuit board 70 is inserted into the upper board insertion groove 11 of the upper flat circuit board socket 3 along the arrow, as shown in the perspective view of FIG. Numeral 70 is accurately positioned and supported in the upper flat circuit board socket 3, and at the same time, each upper contact 10 of the upper flat circuit board socket 3 shown in FIG. Further, as shown in FIG. 2, electrical connection between the upper contact 10 and the relay contact 30 is achieved, so that the electronic component 71 mounted on the parent substrate and the flat circuit board 70 shown in FIG.
And an electrical connection between them.

[0041]

As described above, according to the socket for a two-layer type flat circuit board of the present invention, one of the upper and lower flat circuit board sockets, that is, one side of the housing body of the lower flat circuit board socket, that is, the lower flat board. On the board insertion groove side of the circuit board socket, a solder tail of a contact for connecting to a connection terminal of the flat circuit board mounted on the lower flat circuit board socket is provided, and a housing of the lower flat circuit board socket is provided. On the other side of the main body, that is, on the side opposite to the board insertion groove side, the solder tail of the contact connected to the connection terminal of the flat board mounted on the upper board circuit board socket is arranged. Solder tail of the contact connected to the flat circuit board of the circuit board socket, and contour connected to the flat circuit board of the lower circuit board socket The solder tails of the contacts are located on opposite sides of the housing body of the lower plate circuit board socket, so that the solder tails of the contacts connecting to the plate circuit board of the upper plate circuit board socket and the lower plate circuit It is possible to promote more effective use of the space on the parent board while eliminating mutual interference between the board socket and the solder tail of the contact connected to the flat circuit board.

In particular, in the socket for a two-layer type flat circuit board of the present invention, the upper flat circuit board socket is configured to be detachable from the lower flat circuit board socket. Is unnecessary, it can be removed and only the socket for the lower flat circuit board can be used. Therefore, it can be used as a socket for a two-layer flat circuit board or a socket for a single-layer flat circuit board. Because of this, the range of use can be significantly expanded.

[Brief description of the drawings]

FIG. 1 is a conceptual perspective view showing a socket for a two-layer flat circuit board according to the present invention.

FIG. 2 is an enlarged sectional view taken along the line AA of FIG.

FIG. 3 is a cross-sectional view of the upper flat circuit board socket showing a procedure for mounting the upper contact.

FIG. 4 is a cross-sectional view of the upper flat circuit board socket showing a state in which the mounting of the upper contacts has been completed.

FIG. 5 is a cross-sectional view of the lower plate circuit board socket showing the procedure for mounting the lower and relay contacts.

FIG. 6 is a cross-sectional view of the lower plate circuit board socket showing a state where the lower and relay contacts have been mounted.

FIG. 7 is an exploded perspective view of an upper flat circuit board socket.

FIG. 8 is a perspective view of an upper plate circuit board socket.

FIG. 9 is an exploded perspective view of a lower flat circuit board socket.

FIG. 10 is a perspective view of a socket for a lower flat circuit board.

FIG. 11 is an exemplary perspective view showing a procedure for attaching the flat circuit board to the lower flat circuit board socket;

FIG. 12 is a perspective view showing a state in which a flat circuit board is attached to a socket for a lower flat circuit board;

FIG. 13 is a perspective view showing a procedure for mounting the upper flat circuit board socket on the lower flat circuit board socket.

FIG. 14 is a perspective view showing a state where an upper plate circuit board socket is attached to a lower plate circuit board socket;

FIG. 15 is a perspective view showing a procedure for attaching the flat circuit board to the upper flat circuit board socket according to the present invention;

FIG. 16 is a perspective view showing a state in which a flat circuit board is attached to upper and lower flat circuit board sockets of the two-layer flat circuit board socket according to the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Socket for 2 layer type flat circuit boards 2 ... Upper housing 2a ... Upper housing center part 2b ... Upper housing lower surface 3 ... Upper flat circuit board socket 4 ... Lower housing 4a ... Lower housing center part 5 ... Lower flat circuit board Socket 10 Upper contact 11 Upper substrate insertion groove 12a, 13a Contact tail 20 Lower contact 21 Lower substrate insertion groove 22a, 23a Lower contact solder tail 30 Relay contact 31a, 32a Relay contact solder tail 60 , 70 ... flat circuit board 60a, 70a ... connection terminal

Claims (1)

[Claims] An upper housing having a substantially U-shape in plan view, a plurality of upper contacts arranged side by side along a longitudinal direction of a center portion of the upper housing, and each contact tail projecting from a lower surface of the upper housing; An upper flat circuit board socket formed in the center of the upper housing along the direction in which the contacts are arranged, and having an upper board insertion groove into which the connection terminal of the flat circuit board is removably inserted; A lower housing having a shape, a plurality of lower contacts arranged side by side along a longitudinal direction of the lower housing central part, and a flat circuit board formed at the lower housing central part along the juxtaposition direction of the lower contacts. A lower board insertion groove in which a connection terminal is removably fitted; and a lower contact solder extending toward the lower board insertion groove through the lower housing center. A plurality of relay contacts, which are arranged side by side along a longitudinal direction in the lower housing central portion so as to face the upper surface side of the lower housing central portion, and each corresponding contact tail of the upper contact is detachably connected, A lower plate circuit board socket having a solder tail of the relay contact extending from a central side wall of the lower housing at a position opposed to the lower substrate insertion groove; Socket for circuit board.