JPH10130363A - Radiation hardenable powder composition, hardening and hardened material - Google Patents
Radiation hardenable powder composition, hardening and hardened materialInfo
- Publication number
- JPH10130363A JPH10130363A JP30354196A JP30354196A JPH10130363A JP H10130363 A JPH10130363 A JP H10130363A JP 30354196 A JP30354196 A JP 30354196A JP 30354196 A JP30354196 A JP 30354196A JP H10130363 A JPH10130363 A JP H10130363A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- powder composition
- component
- onium salt
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 42
- 239000000843 powder Substances 0.000 title claims description 33
- 239000000463 material Substances 0.000 title abstract description 11
- 230000005855 radiation Effects 0.000 title description 2
- 239000007787 solid Substances 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 150000003839 salts Chemical class 0.000 claims abstract description 15
- 239000000049 pigment Substances 0.000 claims abstract description 9
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000008033 biological extinction Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000012663 cationic photopolymerization Methods 0.000 claims description 6
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 abstract description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 9
- 238000010538 cationic polymerization reaction Methods 0.000 abstract description 5
- 125000003700 epoxy group Chemical group 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 19
- 238000001723 curing Methods 0.000 description 16
- 239000002904 solvent Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 239000003973 paint Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- -1 2-ethylhexyl Chemical group 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 239000004408 titanium dioxide Substances 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 2
- 229960000834 vinyl ether Drugs 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- OSNILPMOSNGHLC-UHFFFAOYSA-N 1-[4-methoxy-3-(piperidin-1-ylmethyl)phenyl]ethanone Chemical compound COC1=CC=C(C(C)=O)C=C1CN1CCCCC1 OSNILPMOSNGHLC-UHFFFAOYSA-N 0.000 description 1
- YOTSWLOWHSUGIM-UHFFFAOYSA-N 1-ethenoxy-4-[2-(4-ethenoxyphenyl)propan-2-yl]benzene Chemical compound C=1C=C(OC=C)C=CC=1C(C)(C)C1=CC=C(OC=C)C=C1 YOTSWLOWHSUGIM-UHFFFAOYSA-N 0.000 description 1
- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 1
- MFYSUUPKMDJYPF-UHFFFAOYSA-N 2-[(4-methyl-2-nitrophenyl)diazenyl]-3-oxo-n-phenylbutanamide Chemical compound C=1C=CC=CC=1NC(=O)C(C(=O)C)N=NC1=CC=C(C)C=C1[N+]([O-])=O MFYSUUPKMDJYPF-UHFFFAOYSA-N 0.000 description 1
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical class OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 1
- GRNHZMGFVFTJHF-UHFFFAOYSA-N 2-hydroxyacetic acid;prop-2-enamide Chemical compound NC(=O)C=C.OCC(O)=O GRNHZMGFVFTJHF-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- IYHIFXGFKVJNBB-UHFFFAOYSA-N 5-chloro-2-[(2-hydroxynaphthalen-1-yl)diazenyl]-4-methylbenzenesulfonic acid Chemical compound C1=C(Cl)C(C)=CC(N=NC=2C3=CC=CC=C3C=CC=2O)=C1S(O)(=O)=O IYHIFXGFKVJNBB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- PZTQVMXMKVTIRC-UHFFFAOYSA-L chembl2028348 Chemical compound [Ca+2].[O-]S(=O)(=O)C1=CC(C)=CC=C1N=NC1=C(O)C(C([O-])=O)=CC2=CC=CC=C12 PZTQVMXMKVTIRC-UHFFFAOYSA-L 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- MZRQZJOUYWKDNH-UHFFFAOYSA-N diphenylphosphoryl-(2,3,4-trimethylphenyl)methanone Chemical compound CC1=C(C)C(C)=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 MZRQZJOUYWKDNH-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 235000010187 litholrubine BK Nutrition 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、放射線硬化性粉体
組成物、硬化方法及びその硬化物に関し、更に詳しく
は、組成物を加熱溶融した後、紫外線あるいは電子線を
照射することにより重合、硬化する粉体組成物、硬化方
法及びその硬化物に関する。特に顔料を含む組成物にお
いて、硬化性に優れた放射線硬化性粉体組成物、硬化方
法及びその硬化物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation-curable powder composition, a curing method, and a cured product thereof. More specifically, the composition is heated and melted and then polymerized by irradiating ultraviolet rays or an electron beam. The present invention relates to a curable powder composition, a curing method, and a cured product thereof. Particularly, the present invention relates to a radiation-curable powder composition excellent in curability, a curing method, and a cured product thereof in a composition containing a pigment.
【0002】[0002]
【従来の技術】従来、塗料として用いられている材料は
圧倒的に樹脂を溶剤に溶解させたタイプのものが多い。
すなわち、溶剤を含む塗料を塗装面に塗布し、溶剤を蒸
発させた後に樹脂被膜を形成させる方法である。しかし
この方法で用いる溶剤は一般に大気中に揮散し回収再使
用が困難であり、コスト面、作業環境及び地球環境面か
らも改善が強く求められている。上記溶剤型塗料の問題
点を解決する方法として、粉体塗料が注目さている。粉
体塗料は溶剤を全く使用しないので溶剤に起因する上記
問題点が解決される上、貯蔵安定性、取扱い方法の簡便
性等においても優れた技術である。しかしながら粉体塗
料は一般に固体状粉末塗料を塗装後、加熱溶融して連続
被膜を形成させた後に、更に高温に加熱して硬化反応を
生起させるものであり、溶融と硬化反応を完全に分離す
ることが困難で、溶融過程において一部硬化反応が起こ
り、十分な塗膜の仕上がりを得るのが難しく、また樹脂
の溶融温度以上で硬化反応を起こさせるため、硬化に要
する温度が高い等の欠点があった。2. Description of the Related Art Conventionally, there are many types of materials used as coating materials in which a resin is overwhelmingly dissolved in a solvent.
That is, this is a method in which a paint containing a solvent is applied to the painted surface, and after the solvent is evaporated, a resin film is formed. However, the solvent used in this method is generally volatilized in the atmosphere and is difficult to recover and reuse. Therefore, improvement in cost, working environment and global environment is strongly demanded. As a method for solving the above-mentioned problems of the solvent-type paint, powder paint has attracted attention. Since the powder coating does not use any solvent, the above-mentioned problems caused by the solvent are solved, and the powder coating is an excellent technique in storage stability, simplicity of handling method, and the like. However, a powder coating is generally a solid powder coating, which is heated and melted to form a continuous film, and then heated to a high temperature to cause a curing reaction, which completely separates the melting and the curing reaction. It is difficult to achieve a sufficient coating finish in the melting process, and it is difficult to obtain a sufficient finish of the coating film. Further, the curing reaction is caused at a temperature higher than the melting temperature of the resin, so that the temperature required for curing is high. was there.
【0003】一方、紫外線照射によりエポキシ化合物な
どのカチオン重合性化合物を硬化させる触媒及びその組
成物の例は、特開昭50−151997号、特開昭50
−158680号等に記載されている。しかしながら、
隠ぺい率が高い顔料を含有した着色塗膜等では紫外光の
透過性が低いので使用が難しく、また顔料、着色染料な
どを含まない透明系においても硬化系の厚みが増したり
透過性の悪い材料を含む系では硬化が不十分であるとい
う問題点を有している。On the other hand, examples of a catalyst for curing a cationically polymerizable compound such as an epoxy compound by irradiation with ultraviolet rays and a composition thereof are described in JP-A-50-151997 and JP-A-50-151997.
No. 158680. However,
It is difficult to use a colored coating film containing a pigment with a high concealment ratio because it has low transmittance of ultraviolet light, and even in a transparent system that does not contain pigments, colored dyes, etc., the thickness of the cured system increases or the material has poor transparency Has a problem that curing is insufficient in a system containing.
【0004】[0004]
【発明が解決しようとする課題】本発明は、従来の熱硬
化性粉体材料より低温硬化が可能でかつ、紫外線あるい
は電子線の照射により顔料添加系あるいは厚膜系でも十
分な硬化が可能である放射線カチオン重合性粉体組成物
を提供することを目的とする。SUMMARY OF THE INVENTION The present invention is capable of curing at a lower temperature than conventional thermosetting powder materials, and is capable of sufficiently curing even in a pigment-added system or a thick-film system by irradiation of ultraviolet rays or electron beams. It is an object to provide a radiation cationic polymerizable powder composition.
【0005】[0005]
【課題を解決するための手段】本発明者らは、前記の課
題を解決するため鋭意研究の結果、固体のカチオン重合
性物質を含有する粉体組成物において、波長360nm
以上の最大モル吸光係数が100以上のオニウム塩であ
る光カチオン重合開始剤を含有させることにより上記問
題点が解決されることを見い出し本発明を完成するに至
った。すなわち本発明は、Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found that a powder composition containing a solid cationically polymerizable substance has a wavelength of 360 nm.
The present inventors have found that the above problems can be solved by including a photocationic polymerization initiator which is an onium salt having a maximum molar extinction coefficient of 100 or more, and have completed the present invention. That is, the present invention
【0006】(1)固体のカチオン重合性物質(A)と
波長360nm以上の最大モル吸光係数が100以上の
オニウム塩である光カチオン重合開始剤(B)及び任意
成分として顔料(C)を含有することを特徴とする放射
線硬化性粉体組成物、(2)(1)項記載のオニウム塩
である光カチオン重合開始剤(B)がチオキサントン構
造を有するオニウム塩であることを特徴とする(1)項
の粉体組成物、(3)(1)項記載の固体のカチオン重
合性物質(A)の融点が20℃〜180℃の範囲である
(1)項の粉体組成物、(4)組成物を加熱溶融、連続
被膜を形成した後、紫外線あるいは電子線を照射するこ
とにより重合、硬化させることを特徴とする(1)、
(2)又は(3)項の粉体組成物の硬化方法、(5)
(1)、(2)又は(3)項の粉体組成物の硬化物に関
する。(1) It contains a solid cationically polymerizable substance (A), a cationic photopolymerization initiator (B) which is an onium salt having a maximum molar extinction coefficient of 100 or more at a wavelength of 360 nm or more, and a pigment (C) as an optional component. (2) The cationic photopolymerization initiator (B), which is the onium salt described in (1), is an onium salt having a thioxanthone structure. (1) the powder composition according to (1), wherein the solid cationically polymerizable substance (A) according to (1) has a melting point in the range of 20 ° C to 180 ° C; 4) After heating and melting the composition to form a continuous coating, the composition is polymerized and cured by irradiating ultraviolet rays or an electron beam (1).
(2) or the method for curing the powder composition according to the item (3), (5)
It relates to a cured product of the powder composition of (1), (2) or (3).
【0007】本発明における粉体組成物は、、自動車車
体、パンパーなどの外装用及び内装、各種部品用、木工
用、家具、電子材料、建材用、金属、プラスチック無機
材料用などの一般の塗料用途に好適であるが、塗料用途
のみならず各種光硬化性材料、例えば印刷インキ、接着
剤、固体感光材料、はんだ止めマスク、メッキレジスト
用等、様々な用途に用いることが可能である。The powder composition of the present invention can be used for general paints for exterior and interior of automobile bodies, pumps, etc., various parts, woodwork, furniture, electronic materials, building materials, metals, plastic inorganic materials and the like. Although it is suitable for use, it can be used not only for paints but also for various uses such as various photocurable materials such as printing inks, adhesives, solid photosensitive materials, soldering masks, plating resists, and the like.
【0008】本発明の実施にあたって、好ましい固体の
カチオン重合性物質(A)の具体例としては、例えば次
のような化合物が挙げられる。エポキシ基を有する化合
物として、ビスフェノールA、ビスフェノールF及びビ
スフェノールS等のビスフェノールル類とエピクロルヒ
ドリンの反応物であるビスフェノール型エポキシ樹脂、
ビスフェノールジグリシジルエーテル、テトラメチルビ
フェノールジグリシジルエーテル等のビフェノール型エ
ポキシ樹脂、トリグリシジルイソシアネート、フェノー
ル・ノボラック、クレゾール・ノボラック等のノボラッ
ク樹脂とエピクロルヒドリンの反応物であるノボラック
型エポキシ樹脂、トリスフェノールメタン型エポキシ樹
脂、固体の脂環式エポキシ化合物、グリシジルメタクリ
レート等のエポキシ基含有モノ(メタ)アクリレート類
と単官能性不飽和化合物(例えば、メチル(メタ)アク
リレート、エチル(メタ)アクリレート、ブチル(メ
タ)アクリレート、2−エチルヘキシル(メタ)アクリ
レート、ベンジル(メタ)アクリレート、イソボルニル
(メタ)アクリレート、2−ヒドロキシエチル(メタ)
アクリレート、スチレン、α−メチルスチレン等)の共
重合型エポキシ樹脂等を挙げることができる。In the practice of the present invention, specific examples of preferred solid cationically polymerizable substance (A) include the following compounds. As a compound having an epoxy group, bisphenol-type epoxy resin which is a reaction product of bisphenol A such as bisphenol A, bisphenol F and bisphenol S and epichlorohydrin,
Biphenol-type epoxy resins such as bisphenol diglycidyl ether and tetramethyl biphenol diglycidyl ether; novolak resins such as triglycidyl isocyanate; Epoxy group-containing mono (meth) acrylates such as resins, solid alicyclic epoxy compounds and glycidyl methacrylate and monofunctional unsaturated compounds (eg, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate , 2-ethylhexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, 2-hydroxyethyl (meth)
Acrylate, styrene, α-methylstyrene, etc.).
【0009】ビニルエーテル化合物として、フェノール
・ノボラック、クレゾール・ノボラック等のノボラック
樹脂のビニルエーテル化合物、ビスフェノールAジビニ
ルエーテル、ビスフェノールAオキシエチルジビニルエ
ーテル、ポリビニルフェノールのビニルエーテル化合物
等を挙げることができる。これらは単独若しくは2種以
上を併用して用いることができる。特に、エポキシ基を
有する化合物が好んで使用される。Examples of the vinyl ether compound include vinyl ether compounds of novolak resins such as phenol novolak and cresol novolak, bisphenol A divinyl ether, bisphenol A oxyethyl divinyl ether, and vinylphenol compounds of polyvinyl phenol. These can be used alone or in combination of two or more. In particular, compounds having an epoxy group are preferably used.
【0010】上記、固体のカチオン重合性物質は硬化物
の物性を決定する主成分であり、各種用途に応じて要求
される硬度、強度、耐久性、付着性等の物性に応じて選
択され、配合される。これらは、粉体材料の特徴から、
室温では固体状態である必要があるので融点は20℃以
上であることが好ましく、温度の高い状態での保存など
を考慮すると更に好ましくは60℃以上である。また硬
化時に溶融させる必要から融点が高すぎることは不都合
であり、180℃以下が好ましい。加熱に要するエネル
ギー節約の観点を考慮すると更に好ましくは130℃以
下である。The above-mentioned solid cationically polymerizable substance is a main component that determines the physical properties of the cured product, and is selected according to the physical properties such as hardness, strength, durability, and adhesion required for various uses, Be blended. Because of the characteristics of powder materials,
Since it is necessary to be in a solid state at room temperature, the melting point is preferably 20 ° C. or higher, and more preferably 60 ° C. or higher in consideration of storage at a high temperature. Further, it is inconvenient that the melting point is too high because it is necessary to melt at the time of curing, and the temperature is preferably 180 ° C. or lower. Considering the viewpoint of energy saving required for heating, the temperature is more preferably 130 ° C. or lower.
【0011】本発明で用いる成分(B)の波長360n
m以上の最大モル吸光係数が100以上のオニウム塩で
ある光カチオン重合開始剤とは、一般式(1)で表され
るチオキサントン構造を有するオニウム塩等を挙げるこ
とができる。The component (B) used in the present invention has a wavelength of 360 n.
Examples of the cationic photopolymerization initiator which is an onium salt having a maximum molar extinction coefficient of 100 or more and m or more include an onium salt having a thioxanthone structure represented by the general formula (1).
【0012】[0012]
【化1】 Embedded image
【0013】{式(1)中、Xは式(2)で示される基In the formula (1), X is a group represented by the formula (2)
【0014】[0014]
【化2】 Embedded image
【0015】(式(2)中、R6 〜R15は、それぞれ水
素原子、ハロゲン原子、ニトロ基、アルコキシ基、C1
〜C20の構造中に、水酸基、エーテル基、エステル基、
(メタ)アクリロイル基、エポキシ基あるいはアリル基
を有していても良い脂肪族基、フェニル基、フェノキシ
基、チオフェノキシ基、のいずれかから選択された基で
ある。)R1 〜R5 は、それぞれ水素原子、水酸基、C
1 〜C15の脂肪族基、ハロゲン原子、ニトロ基、アルコ
キシ基、エステル基、フェニル基および式(2)で示さ
れる基から選択された基であり、nは1〜4、Zは式
(3)または式(4)(In the formula (2), R 6 to R 15 each represent a hydrogen atom, a halogen atom, a nitro group, an alkoxy group, a C 1
The structure of the -C 20, a hydroxyl group, an ether group, an ester group,
It is a group selected from an aliphatic group which may have a (meth) acryloyl group, an epoxy group or an allyl group, a phenyl group, a phenoxy group and a thiophenoxy group. ) R 1 to R 5 each represent a hydrogen atom, a hydroxyl group,
1 to C 15 are a group selected from an aliphatic group, a halogen atom, a nitro group, an alkoxy group, an ester group, a phenyl group and a group represented by the formula (2), wherein n is 1 to 4, and Z is a group represented by the formula ( 3) or equation (4)
【0016】MQp (3) MQp-1 (OH) (4)MQ p (3) MQ p-1 (OH) (4)
【0017】(式中、Mは、リン原子、ホウ素原子、ヒ
素原子またはアンチモン原子であり、Qはハロゲン原子
であり、pは4〜6の整数である。)で示される}。更
に詳細には特開平8−165290号に記載されている
チオキサントン構造を有するオニウム塩である光カチオ
ン重合開始剤等が挙げられる。(Wherein M is a phosphorus atom, a boron atom, an arsenic atom or an antimony atom, Q is a halogen atom, and p is an integer of 4 to 6). More specifically, a cationic photopolymerization initiator which is an onium salt having a thioxanthone structure described in JP-A-8-165290 is exemplified.
【0018】[0018]
【表1】 表1 [Table 1] Table 1
【0019】これらのオニウム塩は顔料によって吸収さ
れない波長の紫外線に対してかなり感受性があるもので
あり、波長360nm以上で吸収が無かったり、モル吸
光係数が100以下の場合、硬化しなかったりあるいは
硬化が遅く問題となる。本発明で使用する(B)成分の
波長360nm以上の最大モル吸光係類は100以上
で、好ましくは1000以上であり、特に好ましくは2
000以上である。These onium salts are considerably sensitive to ultraviolet light having a wavelength not absorbed by the pigment. If the onium salt has no absorption at a wavelength of 360 nm or more, or has a molar extinction coefficient of 100 or less, it does not cure or cure. Is a problem late. The component (B) used in the present invention has a maximum molar extinction coefficient at a wavelength of 360 nm or more of 100 or more, preferably 1000 or more, and particularly preferably 2 or more.
000 or more.
【0020】本発明では、任意成分として顔料(C)を
使用する。顔料(C)の具体例としては、例えば、カー
ボンブラック、黄鉛、モリブデン、ベンガラ、二酸化チ
タンあるいは酸化アルミニウムで被覆されたルチル型二
酸化チタン等の無機顔料、シアニングリーン、シアニン
ブルー、ハンザイエローベンジジンイエロー,ブリリア
ントカーミン6B、レークレッドC、パーマネントレッ
ドF5R等の有機顔料等を挙げることができる。In the present invention, the pigment (C) is used as an optional component. Specific examples of the pigment (C) include, for example, inorganic pigments such as carbon black, graphite, molybdenum, red iron oxide, rutile type titanium dioxide coated with titanium dioxide or aluminum oxide, cyanine green, cyanine blue, and Hansa yellow benzidine yellow. And organic pigments such as Brilliant Carmine 6B, Lake Red C and Permanent Red F5R.
【0021】本発明の組成物は各成分(A)〜(C)の
使用割合は、(A)成分は、本発明の組成物中、34.
7〜99.7重量%が好ましく、特に好ましくは49.
7〜99.7重量%である。(B)成分は、0.3〜1
5重量%が好ましく、特に好ましくは1〜10重量%で
ある。(C)成分は、0〜65重量%が好ましく、特に
好ましくは10〜60重量%である。In the composition of the present invention, the use ratio of each component (A) to (C) is as follows.
It is preferably from 7 to 99.7% by weight, particularly preferably 49.
7 to 99.7% by weight. The component (B) is 0.3 to 1
It is preferably 5% by weight, particularly preferably 1 to 10% by weight. The component (C) is preferably from 0 to 65% by weight, particularly preferably from 10 to 60% by weight.
【0022】本発明の放射線硬化性粉体組成物は、
(A)〜(C)成分を混合、粉砕、分級する。又は、各
成分を混合、溶融混練し、次いで冷却後粉砕、分級する
ことにより調製することができる。The radiation-curable powder composition of the present invention comprises
The components (A) to (C) are mixed, pulverized and classified. Alternatively, it can be prepared by mixing and melting and kneading the respective components, followed by cooling, followed by pulverization and classification.
【0023】本発明の粉体組成物とは常温で固体状態で
ある組成物であり、一般には固体の粉子径が1mm以
下、好ましくは300ミクロン以下の固体状組成物であ
る。The powder composition of the present invention is a composition that is in a solid state at room temperature, and is generally a solid composition having a solid particle diameter of 1 mm or less, preferably 300 microns or less.
【0024】本発明の放射線硬化性粉体組成物の硬化反
応は、一般に組成物を溶融温度以上に加熱溶融して粉体
粒子同士がはや本来の粒子形状を保持させずに連続的に
接続した状態にした後、高圧水銀灯、メタルハライドラ
ンプ等による紫外線や電子線照射装置による電子線等を
照射によって達成される。In the curing reaction of the radiation-curable powder composition of the present invention, generally, the composition is heated and melted to a melting temperature or higher, and the powder particles are continuously connected without maintaining the original particle shape. Then, irradiation with ultraviolet rays from a high-pressure mercury lamp, a metal halide lamp, or the like, or irradiation with an electron beam from an electron beam irradiation device is achieved.
【0025】本発明の組成物は、更に、必要に応じて、
常温で固体のウレタン(メタ)アクリレート化合物、ポ
リエステル(メタ)アクリレート化合物、不飽和ポリエ
ステル樹脂、エポキシ(メタ)アクリレート化合物、シ
リコン(メタ)アクリレート化合物等のオリゴマー類、
ジアセトアクリルアミド、アクリルアミド、メタクリレ
ートアミド、アクリルアミドグリコール酸、2−メトキ
シ−2−アクリルアミド−グリコール酸メチルエステ
ル、N,N−メチレンビスアクリルアミド等のモノマー
類を使用することもできる。The composition of the present invention may further comprise, if necessary,
Oligomers such as urethane (meth) acrylate compounds, polyester (meth) acrylate compounds, unsaturated polyester resins, epoxy (meth) acrylate compounds, and silicon (meth) acrylate compounds that are solid at room temperature;
Monomers such as diacetacrylamide, acrylamide, methacrylate amide, acrylamide glycolic acid, 2-methoxy-2-acrylamide-glycolic acid methyl ester, and N, N-methylenebisacrylamide can also be used.
【0026】更に、本発明の粉体組成物には任意の添加
物、充填剤等を添加することが出来る。ここでいう添加
剤としては、例えば、一般に粉体塗料用添加剤として用
いられているレベリング剤、分散剤、光安定剤、酸化防
止剤、紫外線吸収剤、流動調整剤等が挙げられる。また
充填剤としては、粉末、球状、繊維状、ウイスカー状、
鱗片状等の各種形状の有機物、無機物、或いはそれらの
複合物、混合物が挙げられる。本発明の組成物は先に述
べたように、塗料、インク、接着剤、レジスト等の放射
線硬化性材料として好適であり、地球環境改善に寄与す
ることが期待される。Further, optional additives, fillers and the like can be added to the powder composition of the present invention. Examples of the additive herein include a leveling agent, a dispersant, a light stabilizer, an antioxidant, an ultraviolet absorber, and a flow regulator generally used as an additive for powder coatings. As the filler, powder, spherical, fibrous, whisker-like,
Examples include organic substances and inorganic substances in various shapes such as flakes, and composites and mixtures thereof. As described above, the composition of the present invention is suitable as a radiation-curable material such as paints, inks, adhesives, and resists, and is expected to contribute to improving the global environment.
【0027】[0027]
【実施例】以下に実施例を挙げて本発明を説明する。 実施例1〜4 表2に示す配合組成(数値は重量部である。)に従っ
て、粉体組成物を溶融混練し、冷却後粉砕して10μm
の平均粒度の粉末を得る。作製した各組成物をアルミ板
に塗布した後に、塗膜の関が赤外ランプを用いて120
℃に加熱溶融(溶融した塗膜の厚さが約20μmになる
ように調節する。)し、次いで紫外線(メタルハライド
ランプ、160w/cm、ランプ下10cm、コンベア
ースピード5m/分)を照射し塗膜を硬化させた。得ら
れた硬化塗膜について、耐溶剤性、密着性、鉛筆硬度に
ついて評価した。 評価方法 (耐溶剤性):布にメチルエチルケトンを浸み込ませ、
硬化塗膜の表面を50回ラビングし塗膜の表面を観察し
た。 ○・・・・塗膜の表面は全く異常なし。 △・・・・表面の光沢がなくなり、塗膜が薄くなった。 ×・・・・塗膜が溶解した。 (密着性):JIS K5400に基づき、ゴバン目1
00個、セロハンテープ剥離試験により、塗膜が剥離し
なかったゴバン目の数を表示した。 (鉛筆硬度):JIS K5400に基づき、常温で三
菱鉛筆「ユニ」にて塗膜が剥離し下地まで達しない最高
硬度を表示した。The present invention will be described below with reference to examples. Examples 1 to 4 According to the composition shown in Table 2 (the numerical values are parts by weight), the powder composition was melt-kneaded, cooled and pulverized to 10 μm.
A powder having an average particle size of After applying each of the prepared compositions to an aluminum plate, the coating film was examined using an infrared lamp for 120 minutes.
℃ and melted (adjusted so that the thickness of the melted coating film becomes about 20 μm), and then irradiated with ultraviolet rays (metal halide lamp, 160 w / cm, under the lamp, 10 cm, conveyor speed 5 m / min). Was cured. The obtained cured coating film was evaluated for solvent resistance, adhesion, and pencil hardness. Evaluation method (solvent resistance): Soak methyl ethyl ketone in cloth,
The surface of the cured coating was rubbed 50 times and the surface of the coating was observed.・ ・ ・: No abnormality on the surface of the coating film. Δ: Surface gloss was lost and the coating film became thin. X: The coating film was dissolved. (Adhesion): Goban 1 according to JIS K5400
By the cellophane tape peeling test, 00 pieces, the number of streaks where the coating film was not peeled off was indicated. (Pencil hardness): Based on JIS K5400, the maximum hardness at which the coating film peeled off at room temperature with Mitsubishi Pencil "Uni" and did not reach the base was indicated.
【0028】[0028]
【表2】 表2 実施例 1 2 3 4 エピコート 1004 *1 20 40 10 20 エピコート 1004 *2 20 30 15 YX−4000 *3 30 30 20 トリグリシジルイソシアヌレート 21 光カチオン重合開始剤 化合物(a) *4 3 3 光カチオン重合開始剤 化合物(b) *5 3 光カチオン重合開始剤 化合物(c) *6 3 ポリエステル樹脂 *7 9 ジアセトンアクリルアミド(融点56℃) 15 二酸化チタン 30 30 30 30 トリメチルベンゾイルジフェニルホス フィンオキサイド(光ラジカル重合開始剤) 1 耐溶剤性 ○ ○ ○ ○ 密着性 100/100 100/100 100/100 100/100 鉛筆硬度 5H 4H 5H 5HTable 2 Example 1 2 3 4 Epicoat 1004 * 1 20 40 10 20 Epicoat 1004 * 2 20 30 15 YX-4000 * 3 30 30 20 Triglycidyl isocyanurate 21 Photo-cationic polymerization initiator Compound (a) * 4 3 3 Cationic cationic polymerization initiator compound (b) * 5 3 Cationic cationic polymerization initiator compound (c) * 63 Polyester resin * 79 Diacetoneacrylamide (melting point 56 ° C) 15 Titanium dioxide 30 30 30 30 Trimethylbenzoyldiphenyl Phosphine oxide (radical polymerization initiator) 1 Solvent resistance ○ ○ ○ ○ Adhesion 100/100 100/100 100/100 100/100 Pencil hardness 5H 4H 5H 5H
【0029】注) *1. エピコート1004:油
化シェルエポキシ(株)製、ビスフェノールA型エポキ
シ樹脂、融点℃、エポキシ当量 *2. エピコート1004:日本油脂(株)製、 *3. YX−4000:油化シエルエポキシ(株)
製、テトラメチルビフェニルジグリシシジルエーテル、
融点 *4. 化合物(a) :表1、番号5、波長 nmでモ
ル吸光係数 *5. 化合物(b) :表1、番号6、波長 nmでモ
ル吸光係数 *6. 化合物(c) :表1、番号8、波長 nmでモ
ル吸光係数でモル吸光係数 *7. ポリエステル樹脂:東洋紡績(株)製、品名
バイロン 、融点℃。Note) * 1. Epicoat 1004: manufactured by Yuka Shell Epoxy Co., Ltd., bisphenol A type epoxy resin, melting point ° C, epoxy equivalent * 2. Epicoat 1004: manufactured by NOF Corporation * 3. YX-4000: Yuka Shell Epoxy Co., Ltd.
Manufactured by Tetramethylbiphenyl diglycidyl ether,
Melting point * 4. Compound (a): Table 1, No. 5, molar extinction coefficient at wavelength nm * 5. Compound (b): Table 1, No. 6, molar extinction coefficient at wavelength nm * 6. Compound (c): Table 1, No. 8, molar extinction coefficient at wavelength nm, * 7. Polyester resin: manufactured by Toyobo Co., Ltd., product name
Byron, melting point ° C.
【0030】表2の評価結果から、本発明の粉体組成物
は、硬化性に優れ、耐溶剤性、密着性、鉛筆硬度に優れ
ている。From the evaluation results shown in Table 2, the powder composition of the present invention is excellent in curability, solvent resistance, adhesiveness, and pencil hardness.
【0031】[0031]
【発明の効果】本発明により、従来より低温で硬化可能
でかつ溶融時に硬化反応の生起しない、しかも顔料添加
系でも硬化性に優れた放射線硬化性粉体組成物、硬化方
法及び硬化物が提供された。According to the present invention, there is provided a radiation-curable powder composition, a curing method, and a cured product which can be cured at a lower temperature than the conventional one, does not cause a curing reaction upon melting, and has excellent curability even in a pigment-added system. Was done.
Claims (5)
60nm以上の最大モル吸光係数が100以上のオニウ
ム塩である光カチオン重合開始剤(B)及び任意成分と
して顔料(C)を含有することを特徴とする放射線硬化
性粉体組成物。1. A solid cationically polymerizable substance (A) having a wavelength of 3
A radiation-curable powder composition comprising a cationic photopolymerization initiator (B) which is an onium salt having a maximum molar extinction coefficient of not less than 60 nm and not less than 100 and a pigment (C) as an optional component.
ン重合開始剤(B)がチオキサントン構造を有するオニ
ウム塩であることを特徴とする粉体組成物。2. A powder composition, wherein the cationic photopolymerization initiator (B) as the onium salt according to claim 1 is an onium salt having a thioxanthone structure.
(A)の融点が20℃〜180℃の範囲である請求項1
の粉体組成物。3. The solid cationically polymerizable substance (A) according to claim 1, having a melting point in the range of 20 ° C. to 180 ° C.
Powder composition.
後、紫外線あるいは電子線を照射することにより重合、
硬化させることを特徴とする請求項1、2又は3の粉体
組成物の硬化方法。4. After heating and melting the composition to form a continuous film, the composition is polymerized by irradiation with ultraviolet rays or electron beams.
4. The method for curing a powder composition according to claim 1, wherein the composition is cured.
物。5. A cured product of the powder composition according to claim 1, 2 or 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30354196A JPH10130363A (en) | 1996-10-30 | 1996-10-30 | Radiation hardenable powder composition, hardening and hardened material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30354196A JPH10130363A (en) | 1996-10-30 | 1996-10-30 | Radiation hardenable powder composition, hardening and hardened material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10130363A true JPH10130363A (en) | 1998-05-19 |
Family
ID=17922246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30354196A Pending JPH10130363A (en) | 1996-10-30 | 1996-10-30 | Radiation hardenable powder composition, hardening and hardened material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10130363A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7318991B2 (en) | 2002-03-04 | 2008-01-15 | Wako Pure Chemical Industries, Ltd. | Heterocycle-bearing onium salts |
-
1996
- 1996-10-30 JP JP30354196A patent/JPH10130363A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7318991B2 (en) | 2002-03-04 | 2008-01-15 | Wako Pure Chemical Industries, Ltd. | Heterocycle-bearing onium salts |
EP1953149A2 (en) | 2002-03-04 | 2008-08-06 | Wako Pure Chemical Industries, Ltd. | A heterocycle-containing onium salt |
US7833691B2 (en) | 2002-03-04 | 2010-11-16 | Wako Pure Chemical Industries, Ltd. | Heterocycle-bearing onium salts |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6142954B2 (en) | ||
CA2028259A1 (en) | Tacky photopolymerizable adhesive compositions | |
JPS6039707B2 (en) | Solvent-free photopolymerizable coating composition | |
JP2992866B2 (en) | UV curable ink composition and method of printing inorganic material using the same | |
JP2003026993A (en) | Ultraviolet-curable coating composition | |
JPH10147745A (en) | Light/heat-curing composition | |
JP4415855B2 (en) | Cationic polymerization composition containing metal oxide fine particles | |
JP3273016B2 (en) | Photocurable coating composition for printable basecoat | |
JP2003313489A (en) | Radiation curable resin composition for coating aluminum material | |
CN1192228A (en) | Non-aqueous solvent-free process for making UV-curable adhesives and sealants from epoxidized-hydroxy diene polymers | |
JPH0330616B2 (en) | ||
JPH10130363A (en) | Radiation hardenable powder composition, hardening and hardened material | |
JP2000347001A (en) | Photopolymerizable composition and hard coat agent | |
JP2000273399A (en) | Ultraviolet-curable film-forming composition | |
JP3443967B2 (en) | UV curable resin composition and coating agent containing the same | |
JPH11302562A (en) | Photocurable coating composition | |
JP2804582B2 (en) | Active energy ray polymerizable unsaturated resin composition and curable composition containing the same | |
JP2774619B2 (en) | UV curable resin composition | |
JPS639529B2 (en) | ||
JPH0940708A (en) | Resin composition and cured product thereof | |
JPS6160720A (en) | Resin composition | |
JP2003261817A (en) | UV curable coating composition | |
JPH09328634A (en) | Ultraviolet-curable resin composition | |
JPH10168160A (en) | Energy beam curable composition and its cured product | |
JPH02113022A (en) | Ultraviolet curing type epoxy resin composition |