JPH10125829A - Semiconductor device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent excessive force when pulling out a through hole of an outer lead. A removal tool (15) mounted on each corner of a sealed body (12) of a PGA IC (10) includes a held part (17) rotatably supported in a holding hole (16) in a corner part of the sealed body, and a held part (17). The female screw 2 of the socket 20 connected to the lower end of the portion 17
3 and a held portion 17
And an engaging portion 19 connected to the upper end portion of the second member. PGA ・
When the IC 10 is removed from the socket 20, the engaging portion 1
When the driver is engaged with 9 and the puller 15 is rotated,
The male thread portion 18 is engaged with the holding hole 16 from below, and the PGA · I
Since C is lifted with respect to the socket, the PGA IC can be removed from the socket without applying excessive force to the outer leads and the socket. [Effect] Since the PGA / IC can be removed from the socket without applying excessive force, damage to the PGA / IC, the socket, the testing board, and the mounting board can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device provided with an insertion mounting type package in which a plurality of outer leads inserted into a through hole and electrically connected thereto are projected from a sealing body. For example, the present invention relates to a technology that is effective when used in a semiconductor integrated circuit device (hereinafter, referred to as IC) having a pin grid array package (hereinafter, referred to as PGA).

[0002]

2. Description of the Related Art Since PGA has a large number of pins, high connection accuracy and low contact resistance, it is widely applied as a package for ICs such as a microprocessor unit (MPU), a microcomputer, and a signal processing device. PGA is a package in which a large number of pin-shaped outer leads are arranged in an array and vertically protruded from the lower surface of a sealing body formed in a rectangular flat plate shape.

An IC having a PGA (hereinafter referred to as a PGA
It is called IC. ) Is mounted on a connection device called a socket and electrically connected to a tester when an electrical characteristic test is performed after manufacturing or before mounting. That is, PGA
The IC is mechanically and electrically connected to the socket by inserting the respective outer leads into the respective through holes formed in the socket, and is electrically connected to the tester via the through holes in the socket. After the electrical characteristic test, the PGA IC is removed from the socket by removing the outer lead group from the through hole group.
By repeating the operation of attaching and detaching such a socket, an electrical characteristic test is sequentially performed for each PGA / IC.

[0004] When the PGA IC is mounted on a mounting board such as a motherboard of a computer, the PGA IC may be electrically and mechanically connected to the mounting board via a socket. For example, when a PGA IC such as an MPU is mounted on a mounting board via a socket, the PGA IC can be removed from the mounting board by pulling out a group of outer leads from a through hole of the socket. And version upgrades.

[0005] As an example describing PGA IC, see "VLSI Packaging Technology (above)" P165-P1 issued by Nikkei BP Co., Ltd. on May 31, 1993.
73.

[0006]

At present, the number of pins of outer leads of a PGA-IC tends to increase more and more. PG
If the number of pins of the outer lead of the A / IC increases, the frictional resistance of the contact portion between the outer lead and the through hole of the socket increases, so that when the PGA / IC is pulled out of the socket, it cannot be applied to the PGA / IC, the socket, or the mounting board. There is a fear that it will be damaged due to excessive force.

An object of the present invention is to provide a semiconductor device capable of preventing an excessive force from being applied when an outer lead inserted into a through hole and electrically connected thereto is pulled out.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, at least a pair of positions of the sealing body in the semiconductor device having the insertion type package which oppose each other, the insertion mounting type package is urged by applying a reaction force to the through hole side structure. A pull-out tool for pulling out the outer lead group from the hole is attached.

According to the above-mentioned means, since the pull-out force can be applied to the insertion mounting type package by the pull-out tool, the semiconductor device can be structured on the through-hole side without applying excessive force to the outer lead or the sealing body. Can be removed from the body.

[0012]

FIG. 1 is an exploded perspective view showing a PGA IC and a socket according to an embodiment of the present invention.
2 (a), 2 (b) and 2 (c) are partially cutaway front views for explaining the operation.

In the present embodiment, the semiconductor device according to the present invention is configured as an IC (PGA.IC) having a PGA, which is an example of an insertion mounting type package. P
A PGA 11, which is a package of the GA IC 10, is composed of a sealing body 12 formed of a rectangular flat plate using an insulating resin or ceramic, and is vertically arranged in an array on the lower surface of the sealing body 12. And a large number of pin-shaped outer leads 13 protruding from each other. An index 14 for indicating the direction of the PGA IC 10 is formed at a predetermined corner of the sealing body 12. At the corners at the four corners of the sealing body 12, there are mounted removal tools 15 for urging the PGA 11 by applying a reaction force to a socket described later and pulling out a group of outer leads 13 from a through hole described later.

The punching tool 15 is rotatably supported by a holding hole 16 formed in each corner of the sealing body 12 so as to penetrate in the thickness direction, and a lower end of the holding portion 17. A male screw portion 18 is provided integrally with the female portion of the socket so as to advance and retreat with a female screw of a socket to be described later, and an engaging portion 19 is provided integrally with the upper end of the held portion 17.
The vertical dimension, that is, the length L of the held portion 17 is set to be longer than the length of the holding hole 16 of the sealing body 12, that is, the thickness t of the sealing body 12. The outer diameter of the male screw portion 18 is set to be equal to or larger than the outer diameter of the held portion 17, that is, the inner diameter of the holding hole 16. From the upper side. The engaging portion 19 is formed in the shape of a bolt head having an outer diameter equal to or larger than the outer diameter of the held portion 17, that is, the inner diameter of the holding hole 16. The tool 15 is prevented from falling down from the sealing body 12. The engagement portion 19 is configured to be able to engage with a tool such as a driver as a rotation operation means for rotating the puller 15.

In this embodiment, the through-hole-side structure to which the outer leads 13 of the PGA IC 10 are electrically connected is configured as a socket 20. The socket 20 has a main body 21 formed in a rectangular flat plate shape by a resin or the like having an insulating property. A through hole 2 to which an outer lead is electrically connected is provided on the upper surface of the main body 21.
2 are arranged in the form of an array,
Each through-hole 22 is a PGA IC 10 to be connected.
Are arranged so as to correspond to each outer lead 13 group,
Each of the outer leads 13 is configured to be electrically connected by being inserted. Incidentally, each through hole 22 is electrically connected to each external terminal (not shown) formed on the lower surface of the main body 21 by electric wiring (not shown).

On the upper surface of the main body 21 of the socket 20, four female screws 23 are provided so as to be opposed to the respective extraction tools 15 of the PGA IC 10 and are opened.
Numeral 3 is configured to be screwed into and out of the male screw portion 18 of each of the punching tools 15.

Next, the method of use and operation of the PGA IC 10 and the socket 20 according to the above configuration will be described with reference to FIG.

As shown in FIG. 2A, PGA
In the IC 10, each outer lead 13 is inserted into each through hole 22 and electrically connected to the socket 20 in a state where the male screw portions 18 of the four extraction tools 15 are screwed into the respective female screws 23 facing each other. . In this state, PG
The A.IC 10 is electrically connected to, for example, a tester (not shown) for electrical characteristic inspection via the socket 20, and communicates a test signal to inspect a predetermined electrical characteristic.

When the PGA IC 10 is removed from the socket 20, as shown in FIG. 2B, a tool (not shown) such as a driver as a rotation operating means is engaged with the engaging portion 19. The male screw portion 18 is gradually extracted from the female screw 23 by rotating each of the extraction tools 15 in a predetermined direction. When the male screw portion 18 is pulled out from the female screw portion 23, the upper end edge of the male screw portion 18 is sealed.
2 is engaged with the lower edge of the holding hole 16 on the lower surface of the socket 2 from below to take a reaction force on the female screw 23 of the socket 20 to form the sealing body
2, the PGA IC 10 is lifted up so as to be jacked up with respect to the socket 20. As the PGA IC 10 is lifted from the socket 20, each outer lead 13 is gradually pulled out from each through hole 22.

At this time, if the vertical dimension L of the held portion 17 of the extraction tool 15 is set longer than the length of the holding hole 16 of the sealing body 12, that is, the thickness t of the sealing body 12, FIG.
As shown in (b), since the PGA IC 10 is lifted horizontally, the outer lead 13 is pulled straight out of the through hole 22. Therefore,
Even when the punching tools 15 are alternately operated, the outer leads 13 are prevented from being bent and deformed by the through holes 22.

As shown in FIG. 2C, in a state where the male screw portion 18 of each puller 15 is pulled out from the female screw 23, each outer lead 13 does not fit into the through hole 22 or is completely pulled out. It has been pulled out. That is, the PGA IC 10 is mechanically separated from the socket 20 and is easily removable or completely removed. Therefore, PGA · I
C10 can be moved freely with respect to socket 20.

According to the above embodiment, the following effects can be obtained. (1) At each corner of the sealed body of the PGA IC, a pull-out tool is used to urge the PGA by applying a reaction force to the socket and pull out the outer lead group from the through hole, thereby jacking up the PGA with the pull-out tool. Therefore, the PGA IC can be removed from the socket without applying excessive force to the outer lead or the socket.

(2) The PGA IC can be removed from the socket without applying excessive force to the outer leads and the socket, thereby preventing damage to the PGA IC, the socket, the testing board, and the mounting board. Can be.

(3) Since it is not necessary to set a space for installing the punching tool in the socket, the testing board, and the mounting board, it is possible to reduce the design burden of the structure and wiring layout of the mounting board, and furthermore, the high density. Implementation can be realized.

FIG. 3 is a diagram showing a second embodiment of the present invention.
3A and 3B show an IC and a socket, wherein FIG. 3A is a partially cut front view in a connected state, FIG. 3B is a partially cut front view in the middle of removal, and FIG. 3C is a partially cut front view in a removed state.

The second embodiment is different from the first embodiment in that the outer diameter of the engaging portion 19A of the puller 15A is smaller than the outer diameter of the held portion 17, that is, smaller than the inner diameter of the holding hole 16. It is.

As shown in FIG. 3A, PGA
In the IC 10, the outer leads 13 are inserted into the respective through holes 22 and electrically connected to the socket 20 in a state where the male screw portions 18 of the four extraction tools 15 </ b> A are screwed into the respective female screws 23 opposed to each other. .

When the PGA IC 10 is detached from the socket 20, a tool (not shown) is engaged with the engaging portion 19A and each of the pullers 15A is rotated, so that the male screw portion 18 is disengaged from the female screw 23. It is gradually extracted. When the male screw portion 18 is pulled out from the female screw 23, the upper edge of the male screw portion 18 is engaged with the lower edge of the holding hole 16 on the lower surface of the sealing body 12 from below, and is opposed to the female screw 23 of the socket 20. Since it is in a state of pushing up with force, P
The GA IC 10 is jacked up with respect to the socket 20. As the PGA IC 10 is jacked up with respect to the socket 20, each outer lead 13 is gradually pulled out from each through hole 22.

At this time, the outer diameter of the engaging portion 19A is
Of the engagement portion 19A
Does not interfere with the sealing body 12 of the PGA IC 10, the PGA IC 10 is lifted horizontally as shown in FIG. 3B, so that the outer leads 13 are straightened with respect to the through holes 22. Pulled out. Therefore, even when the punching tools 15A are alternately operated, the outer leads 13 are prevented from being bent and deformed by the through holes 22.

As shown in FIG. 3C, in a state where the male screw portion 18 of the puller 15A is pulled out from the female screw 23, each outer lead 13 does not fit into the through hole 22 or is pulled out completely. State has been reached. That is, the PGA IC 10 is mechanically separated from the socket 20 and is easily removable or completely removed. Therefore, PGA · I
C10 can be moved freely with respect to socket 20.

FIG. 4 is a view showing a PGA-type according to a third embodiment of the present invention.
3A and 3B show an IC and a socket, wherein FIG. 3A is a partially cut front view in a connected state, FIG. 3B is a partially cut front view in the middle of removal, and FIG. 3C is a partially cut front view in a removed state.

The third embodiment differs from the first embodiment in that the punch 15B is formed in a bolt shape as a whole. That is, the punching tool 15B is used for the sealing body 12
A female screw hole 16B penetrating in the thickness direction through a corner portion of the female screw hole and also serving as a holding hole having a female screw portion;
A male screw portion 18B serving also as a holding portion screwed rotatably and advancing and retreating, and a bolt head-shaped engaging portion 19 integrally connected to an upper end portion of the male screw portion 18B.

As shown in FIG. 4A, PGA
In the IC 10, the outer leads 13 are inserted into the through holes 22 and electrically connected to each other with the male screw portion 18 </ b> B retracted to the side opposite to the outer lead 13 with respect to the female screw hole 16 </ b> B.

When the PGA IC 10 is removed from the socket 20, a tool (not shown) such as a driver as a rotating operation means is engaged with the engaging portion 19, and each of the pulling tools 15 is engaged.
By rotating B, as shown in FIG. 4B, the male screw portion 18B is gradually advanced with respect to the female screw hole 16B. When the male screw portion 18B is advanced with respect to the female screw hole 16B, the lower end of the male screw portion 18B pushes the upper surface of the main body 21 of the socket 20.
The A.IC 10 is lifted so as to be jacked up with respect to the socket 20. As the PGA IC 10 is lifted from the socket 20, each outer lead 13 is gradually pulled out from each through hole 22.

As shown in FIG. 4 (c), the external thread 18B of the extraction tool 15B is
When the outer leads 13 are moved forward in the
Have not reached the through hole 22 or have been completely pulled out. That is, PGA · IC10
Is mechanically disconnected from the socket 20 so that it can be easily removed or completely removed. Therefore, the PGA IC 10 can be freely moved with respect to the socket 20.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various changes can be made without departing from the gist of the invention. Needless to say.

For example, the punching tool is not limited to being provided at the four corners of the sealing body, but may be provided at a pair of corners opposed to each other with the center of the sealing body interposed therebetween. In the case of a sealing body having a shape, the sealing body may be provided on a pair of opposite side edges.

It is desirable that the plurality of cutting tools be configured so that they can be operated collectively by a special jig.

The engaging portion is not limited to be configured to be able to engage with a driver, but may be configured to be able to engage with a tool such as a hexagon wrench, or may be engaged with a dedicated jig other than the tool. It may be configured to obtain.

The male screw and the female screw are not limited to being formed as a single thread, but may be formed as a multi-thread, or the lead angle may be set to a special value.

The socket, which is an example of the structure on the through-hole side, is not limited to a socket mounted on a testing board or the like for electrical characteristic inspection, but is mounted on a mounting board such as a mother board of a computer. There may be.

In the above description, the invention made mainly by the present inventor has been described in the field of application PGA,
The case where the present invention is applied to an IC has been described. However, the present invention is not limited to this, and the present invention can be generally applied to a case where an insert mounting type package such as an IC (DIP IC) having a dual in-line package is provided. . In particular, the present invention can obtain excellent effects when applied to a semiconductor device in which electrical connection is ensured by using a connection device such as a socket.

[0043]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

In a semiconductor device having an insertion type package, a reaction force is applied to the structure on the through hole side to urge the insertion mounting type package to at least a pair of positions opposing each other on the sealing body, and the outer lead is inserted from the through hole. By mounting the pull-out tool to pull out the group, the pull-out force can be applied to the insertion mounting type package by the pull-out tool, so that the semiconductor device can be placed on the through-hole side without applying excessive force to the outer leads or the sealing body. Can be removed from the structure.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a PGA IC and a socket according to an embodiment of the present invention.

FIGS. 2 (a), (b) and (c) are partially cut front views for explaining the operation.

3A and 3B show a PGA IC and a socket according to a second embodiment of the present invention, wherein FIG. 3A is a partially cut front view of a connected state, FIG. )
FIG. 3 is a partially cut front view in a detached state.

4A and 4B show a PGA IC and a socket according to a third embodiment of the present invention, wherein FIG. 4A is a partially cut front view in a connected state, FIG. )
FIG. 3 is a partially cut front view in a detached state.

[Explanation of symbols]

10: PGA IC (semiconductor device), 11: PGA, 1
Reference numeral 2 denotes a sealed body, 13 denotes an outer lead, 14 denotes an index, 15 denotes a punch, 16 denotes a holding hole, 17 denotes a held portion,
8 male screw part, 19 engaging part, 20 socket (through hole side structure), 21 body, 22 through hole,
23 ... female screw, 15A ... puller, 19A ... engaging part, 15
B: extraction tool, 16B: female screw hole, 18B: male screw part.

Claims (5)

[Claims] 1. A semiconductor device comprising an insertion mounting type package in which a plurality of outer leads inserted into a through-hole and electrically connected thereto are projected from a plurality of sealing bodies, wherein at least the sealing bodies face each other. In a pair of positions,
A semiconductor device, wherein a pull-out tool for applying a reaction force to the through-hole-side structure to urge the insertion package and pulling out the outer lead group from the through-hole is mounted. 2. The removal tool comprises: a held portion rotatably held by the sealing body; and a male screw portion which is screwed to an end of the held portion on the outer lead side so as to advance and retreat to the structure. 2. The semiconductor device according to claim 1, further comprising: an engagement portion formed at an end of the holding portion opposite to the male screw portion. 3. 3. The semiconductor device according to claim 2, wherein a length of the held portion is set to be longer than a thickness of the sealing body. 4. The semiconductor device according to claim 2, wherein an outer diameter of said engaging portion is formed to be smaller than an outer diameter of said held portion. 5. The device according to claim 1, wherein the extraction tool has a male screw portion screwed to the sealing body so as to advance and retreat.
3. The semiconductor device according to claim 1.