JPH10125536A - Inductance element and its manufacture and wiress terminal device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower a defective rate of electronic appliances by making colors of a protective material different in accordance with its characteristic and a structure so as to facilitate the difference in the inductance elements with a protective material provided for covering grooves. SOLUTION: A conductive film 12 is provided on a base 11. Grooves 13 provided on the base 11 and on the conductive film 12 are formed by irradiating the conductive film with a laser beam or the like. Then, the part provided with the grooves 13 is coated with a protective material 14. As the protective material 14, an organic material being excellent in weather resistance and showing insulation, for instance, epoxy resin or the like showing insulation is used. Further, as the protective material 14, it is preferably to have a transparency which allows it to observe the conditions or the like of the grooves 13. Further, a color of the protective material 14 is changed in accordance with at least one of size of an element, width of the grooves 13, kind and width of the conductive film 12 and the material of the base 11. Further, the color of the protective material 14 is made different in accordance with the kind or the like of the electronic appliance.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductance element which is used for electronic equipment such as mobile communication, and is particularly preferably used for high-frequency circuits and the like, a method of manufacturing the same, and a radio terminal device.

[0002]

2. Description of the Related Art FIG. 15 is a side view showing a conventional inductance element. In FIG. 15, 1 is a square pillar base, 2 is a conductive film formed on the base 1, and 3 is a conductive film 2.
The grooves 4 provided on the conductive film 2 are protective materials laminated on the conductive film 2.

[0003] Such electronic components are adjusted to predetermined characteristics by adjusting the interval between the grooves 3 and the like.

A prior example is disclosed in Japanese Patent Application Laid-Open No. 7-307201.
JP, JP-A-7-297033, JP-A-5-1
JP-A-29133, JP-A-1-238003, JP-A-57-117636, JP-A-5-29925
No. 0, Japanese Unexamined Patent Publication No. 7-297033, and the like.

[0005]

However, since there are many types of inductance elements depending on the product number, size, characteristics, products used, etc., there are many cases where element selection errors occur and management is very difficult. was difficult.
As a result, for example, if a plurality of elements having different characteristics are mixed in a predetermined characteristic, when the elements are mounted on an electronic device or the like, this causes a failure of the electronic device.

An object of the present invention is to solve the above-mentioned conventional problems. An inductance element which can be easily distinguished according to the size and characteristics of the element and can reduce the rejection rate of electronic equipment, a method of manufacturing the same, and a method of manufacturing the same. An object is to provide a wireless terminal device.

[0007]

SUMMARY OF THE INVENTION The present invention provides a base, a conductive film formed on the base, a groove provided in the conductive film, and a protection provided so as to cover the groove. The protective element has a different color depending on characteristics, structure and the like.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 comprises a base,
An inductance element comprising: a conductive film formed on the base; a groove provided in the conductive film; and a protective material provided so as to cover the groove. By making them different in terms of structure and structure, it is possible to reduce element selection errors, and to reduce the defect rate of electronic devices on which the elements are mounted.

According to a second aspect of the present invention, in the first aspect, the color of the protective material is determined based on the inductance value of the element, the corresponding frequency of the element, the size of the element, the width of the groove, the type and thickness of the conductive film, and the base. By differentiating at least one of the materials of the table, the size, characteristics, and the like can be distinguished depending on the color, so that it is possible to further eliminate element selection errors.

According to the third aspect of the present invention, since the color of the protective material is made different depending on the type of the electronic device to which the electronic device is attached, the color of the element mounted on the electronic device can be made one color. Different elements can be prevented from being mixed, and the defect rate of the electronic device can be further reduced.

[0011] The invention according to claim 4 is the invention according to claims 1, 2, and 3.
In 3, the protective material is provided with such transparency that the groove can be observed, so that even after the protective material is applied, the shape of the groove and the peeling of the film can be observed, so that the quality of the product can be determined. The defect rate can be reduced.

According to a fifth aspect of the present invention, there is provided a base which is made of an insulating material and has a substantially square cross-section at both ends and a central portion depressed from the both ends, and formed on the surface of the base. And a spiral groove provided at the center of the base and formed so as to remove a part of the conductive film and the base, and exposing the terminal portion so as to cover the groove. An inductance element having a protective material provided on the base as described above, and by changing the color of the protective material depending on characteristics, structure, and the like, it is possible to reduce element selection errors, The failure rate of an electronic device equipped with can be reduced. In addition, since the cross-sectional shape of both ends is a square shape, it is easy to attach to a circuit board or the like,
Since the magnetic flux is parallel to the printed circuit board and has no directionality,
Since it is easy to mount on a circuit board or the like and a protective material is provided, weather resistance can be improved.

According to a sixth aspect of the present invention, in the fifth aspect, if the color of the protective material is different depending on at least one of the size of the element, the width of the groove, the type and thickness of the conductive film, and the material of the base. By doing so, the size, characteristics, and the like can be distinguished depending on the color, so that it is possible to further eliminate element selection errors.

According to the seventh aspect of the present invention, the color of the element mounted on the electronic device can be made one color by changing the color of the protective material according to the type of the electronic device to which the protective material is attached. It is easy to manage, it is possible to prevent different elements from being mixed, and it is possible to further reduce the defective rate of electronic equipment.

[0015] The invention according to claim 8 is the invention according to claims 5, 6, and 7.
In 7, the protective material is provided with such transparency that the groove can be observed, so that even after the protective material is applied, the shape of the groove and film peeling can be observed, so that the quality of the product can be determined. The defect rate can be reduced.

According to a ninth aspect of the present invention, there is provided a method of manufacturing an inductance element, wherein a conductive film is provided on a base, and a protective material is formed on a semi-finished product having a groove formed in the conductive film so as to cover the groove. However, by making the color of the protective material different depending on the characteristics, structure, and the like, it is possible to reduce element selection errors, and to reduce the defect rate of electronic devices on which the elements are mounted.

According to a tenth aspect of the present invention, in the ninth aspect, if the color of the protective material is different depending on at least one of the element size, the groove width, the type and thickness of the conductive film, and the material of the base. By doing so, the size, characteristics, and the like can be distinguished depending on the color, so that it is possible to further eliminate element selection errors.

According to the eleventh aspect of the present invention, in the ninth aspect, since the color of the protective material is made different depending on the type of the electronic device to be mounted, the color of the element mounted on the electronic device can be made one color. It is easy to manage, it is possible to prevent different elements from being mixed, and it is possible to further reduce the defective rate of electronic equipment.

The twelfth aspect of the present invention is the ninth aspect of the present invention.
At 0 and 11, the protective material was provided with such transparency that grooves could be observed, so that even after the protective material was applied,
Since the shape of the groove, the peeling of the film, and the like can be observed, the quality of the product can be determined, and the defect rate can be reduced.

According to a thirteenth aspect of the present invention, there is provided a voice signal converting means for converting a voice into a voice signal, an operating means for inputting a telephone number and the like, a display means for displaying an incoming call display, a telephone number and the like, and a voice signal. A wireless terminal device comprising: a transmitting unit that demodulates the signal into a transmission signal; a receiving unit that converts a reception signal into a voice signal; an antenna that transmits and receives the transmission signal and the reception signal; and a control unit that controls each unit. 2. An inductance element constituting a filter circuit or a matching circuit constituting a receiving means and a transmitting means.
By using the inductance element described in any one of (1) to (8), an erroneous inductance element is not mounted on a circuit board or the like, and a defect such as generation of noise does not occur.

Hereinafter, embodiments of the inductance element and the wireless terminal device according to the present invention will be described.

FIGS. 1 and 2 are a perspective view and a side view, respectively, showing an inductance element according to an embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a base formed by subjecting an insulating material or the like to press working, extrusion, or the like.
Reference numeral 2 denotes a conductive film provided on the base 11.
2 is formed on the base 11 by an evaporation method such as a plating method or a sputtering method. Reference numeral 13 denotes a groove provided in the base 11 and the conductive film 12. The groove 13 may be formed by irradiating the conductive film 12 with a laser beam or the like.
Is mechanically formed by applying a grindstone or the like to the surface. Reference numeral 14 denotes a protective material applied to a portion of the base 11 and the conductive film 12 where the groove 13 is provided. Reference numerals 15 and 16 denote terminal portions on which terminal electrodes are formed, respectively. A groove 13 and a protection member 14 are provided. In addition, FIG.
FIG. 4 is a diagram in which part of FIG.

Further, the inductance element of the present embodiment has a practical frequency band of 1 to 6 GHz, which corresponds to a high frequency range, has a small inductance of 50 nH or less, and has a length L1, width L2, and length L2 of the inductance element. The height L3 is preferably as follows.

L1 = 0.5-1.1 mm (preferably 0.6-1.0 mm) L2 = 0.2-0.7 mm (preferably 0.3-0.6 mm)
mm) L3 = 0.2 to 0.7 mm (preferably 0.3 to 0.6 mm)
mm) When L1 is 0.5 mm or less, the self-resonant frequency f0 is lowered and the Q value is lowered, so that good characteristics cannot be obtained. Further, when L1 exceeds 1.1 mm, the element itself becomes large, and a substrate on which an electronic circuit or the like is formed (hereinafter abbreviated as a circuit substrate or the like)
It is not possible to reduce the size of a circuit board or the like, and thus it is impossible to reduce the size of an electronic device or the like on which the circuit board or the like is mounted.
When L2 and L3 are each 0.2 mm or less,
The mechanical strength of the element itself becomes too weak, and when the element is mounted on a circuit board or the like by a mounting device or the like, the element may be broken. On the other hand, if L2 and L3 are 0.7 mm or more, the elements become too large, and it is not possible to reduce the size of the circuit board and the like, and furthermore, the size of the device. Note that L4 (depth of step drop) is preferably about 5 μm to 50 μm, and if it is 5 μm or less, the thickness and the like of the protective material 14 must be reduced, and good protection characteristics and the like cannot be obtained. On the other hand, if L4 exceeds 50 μm, the mechanical strength of the base is weakened, which may also cause element breakage.

With respect to the inductance element configured as described above, each part will be described in detail below. FIG. 3 is a cross-sectional view of a base on which a conductive film is formed, and FIGS. 4A and 4B are a side view and a bottom view of the base, respectively.

First, the shape of the base 11 will be described.
As shown in FIGS. 3 and 4, the base 11 is provided with a central portion 11a having a rectangular cross section and both ends of the central portion 11a so as to be easily mounted on a circuit board or the like. It is constituted by ends 11b and 11c. Although the end portions 11b and 11c and the central portion 11a have a rectangular cross section, they may have a polygonal shape such as a pentagonal shape or a hexagonal shape. The central portion 11a is configured to drop down from the end portions 11b and 11c. In the present embodiment, the end portions 11b, 1
By making the cross-sectional shape of 1c substantially square, the mountability of the inductance element to a circuit board or the like was improved.
Further, in the present embodiment, the groove 13 is provided laterally in the central portion 11a.
Is formed, there is no direction even if it is mounted on a circuit board or the like, so that the handling becomes easy. Further, an element portion (the groove 13 and the protective material 14) is formed in the central portion 11a, and terminal portions 15 and 16 are formed in the end portions 11b and 11c.

In this embodiment, both the central portion 11a and the end portions 11b and 11c are formed in a substantially square shape.
The shape may be a regular polygon such as a regular pentagon. Furthermore, in the present embodiment, the central section 11a and the end sections 11c and 11b have the same cross-sectional shape such as a regular square.
May be different. That is, the cross-sectional shape of the end portions 11b and 11c may be a regular polygonal shape, and the cross-sectional shape of the central portion 11a may be another polygonal shape or a circular shape. Central part 11a
The groove 13 can be formed satisfactorily by making the cross-sectional shape circular.

Further, in the present embodiment, the central portion 11a
By stepping down from the ends 11b and 11c,
When the protective material 14 was applied, contact between the protective material 14 and a circuit board or the like was prevented.
The center part 11a depends on the thickness of the circuit board 4 and the condition of the circuit board or the like to be mounted (a groove is formed in a part where the circuit board or the like is mounted, or an electrode portion of the circuit board or the like is raised).
Need not be dropped. Center 11a to end 11
If the step is not dropped from b and 11c, the structure of the base 11 is simplified, the productivity is improved, and the mechanical strength of the central portion 11a is also improved. Even if you do not let the steps drop like this,
It may be a quadrangular prism having a quadrangular cross section, or a prism having a polygonal cross section.

As shown in FIG. 4A, it is preferable that the heights Z1 and Z2 of the ends of the base 11 satisfy the following conditions.

| Z1-Z2 | ≦ 80 μm (preferably 50 μm) The difference in height between Z1 and Z2 is 80 μm (preferably 50 μm).
m or less), when the element is mounted on a board and attached to a circuit board or the like with solder or the like, the element is pulled to one end by the surface tension of the solder or the like, and the element stands up. The probability of occurrence is very high. This Manhattan phenomenon is shown in FIG. As shown in FIG. 5, an inductance element is arranged on a substrate 200,
Solder 20 between each of terminal portions 15 and 16 and substrate 200
Although the solders 201 and 202 are provided, when the solders 201 and 202 are melted by reflow or the like, the molten solders 201 and 202 are melted due to a difference in the application amount of each of the solders 201 and 202 and a difference in melting point due to a difference in material. 5 differs between the terminal portion 15 and the terminal portion 16, and as a result, as shown in FIG. 5, one of the terminal portions (the terminal portion 1 in FIG.
5), the inductance element rises. If the difference between the heights of Z1 and Z2 exceeds 80 μm (preferably 50 μm or less), the elements are arranged on the substrate 200 in an inclined state, and the standing of the elements is promoted. In addition, the Manhattan phenomenon occurs remarkably particularly in small and lightweight chip-type electronic components (including a chip-type inductance element), and one of the causes of the Manhattan phenomenon is the difference in height between the terminal portions 15 and 16. It was noted that the device was inclined and was arranged on the substrate 200. As a result, by forming the base 11 by molding or the like so that the difference between the heights of Z1 and Z2 is 80 μm or less (preferably 50 μm or less), the occurrence of the Manhattan phenomenon could be significantly suppressed. . By setting the difference between the heights of Z1 and Z2 to 50 μm or less, the occurrence of the Manhattan phenomenon can be substantially suppressed.

Next, the chamfering of the base 11 will be described.
FIG. 6 is a perspective view of a base used for the inductance element according to one embodiment of the present invention. As shown in FIG. 6, each corner 1 of the ends 11 b and 11 c of the base 11 is provided.
The chamfered edges 1e and 11d are preferably formed, and the radius of curvature R1 of the chamfered corners 11e and 11d and the radius of curvature R2 of the corner 11f of the central portion 11a are preferably formed as follows.

0.03 <R1 <0.15 (mm) 0.01 <R2 (mm) If R1 is 0.03 mm or less, the corners 11e and 11d
Since the corners are sharp, the corners 11e and 11d may be chipped due to a slight impact or the like, and the chipping may cause deterioration of characteristics or the like. When R1 is 0.15 mm or more, the corner 11
Since e and 11d are too round, the above-mentioned Manhattan phenomenon is likely to occur, which causes a problem. Furthermore, when R2 is 0.
When the thickness is less than 01 mm, burrs and the like are likely to be generated on the corners 11f, and the thickness of the conductive film 12, which is formed on the central portion 11a and greatly affects the characteristics of the element, differs greatly between the corners 11f and the flat portion. And the variation in element characteristics becomes large.

Next, the constituent materials of the base 11 will be described. It is preferable to satisfy the following characteristics as a constituent material of the base 11.

Volume resistivity: 10 ¹³ or more (preferably 10 ¹⁴ or more) Thermal expansion coefficient: 5 × 10 ⁻⁴ or less (preferably 2 × 10 ⁻⁵ or less) [Coefficient of thermal expansion at 20 ° C. to 500 ° C.] Dielectric constant : 1 or less at 1 MHz (preferably 10 or less) Flexural strength: 1300 kg / cm ² or more (preferably 20
(00 kg / cm ² or more) Density: ^{2 to 5} g / cm ³ (preferably ³ to 4 g / cm ³ ) When the constituent material of the base 11 has a volume resistivity of 10 ¹³ or less, the base 11 together with the conductive film 12 Also, since a current starts to flow in a predetermined manner, a parallel circuit is formed, and the self-resonant frequency f0 and the Q value become low, which is not suitable for a high-frequency element.

If the coefficient of thermal expansion is 5 × 10 ⁻⁴ or more, cracks may occur in the base 11 due to heat shock or the like. In other words, when the thermal expansion coefficient is 5 × 10 ⁻⁴ or more, the laser beam or the grindstone is used when forming the groove 13 as described above. Although cracks and the like may occur, the occurrence of cracks and the like can be largely suppressed by having the above-described coefficient of thermal expansion.

If the dielectric constant is 12 or more at 1 MHz, the self-resonant frequency f0 and the Q value become low, which is not suitable for a high-frequency device.

If the bending strength is 1300 kg / cm ² or less, the element may be broken when mounted on a circuit board or the like by a mounting apparatus.

When the density is 2 g / cm ³ or less, the base 1
1, the water absorption rate is increased, the characteristics of the base 11 are significantly deteriorated, and the characteristics as an element are deteriorated. The density is 5 g / c
If it exceeds m ³ , the weight of the base will be heavy, and there will be a problem in mountability and the like. In particular, when the density is set within the above range, the water absorption rate is small, the water hardly enters the base 11, and the weight is light, so that there is no problem when mounting the chip on a substrate by a chip mounter or the like.

By defining the volume resistivity, thermal expansion coefficient, dielectric constant, bending strength, and density of the base 11 as described above, the self-resonant frequency f0 and the Q value do not decrease. It is possible to suppress the occurrence of cracks and the like in the base 11 due to heat shock or the like, so that the defect rate can be reduced, and further, the mechanical strength can be improved. Therefore, excellent effects such as an improvement in productivity can be obtained.

As a material for obtaining the above-mentioned various properties, there is a ceramic material containing alumina as a main component. However, simply using a ceramic material mainly composed of alumina cannot obtain the above-mentioned characteristics. That is,
Since the above-mentioned various characteristics vary depending on the pressing pressure, the sintering temperature, and the additives at the time of producing the base 11, the production conditions and the like must be appropriately adjusted. Specific manufacturing conditions include a pressing pressure of 2 to 5 tons when processing the base 11, a firing temperature of 1500 to 1600 ° C., and a firing time of 1 to 3 hours. Specific examples of the alumina material include Al ₂ O ₃ of 92 wt% or more, SiO ₂ of 6 wt% or less, MgO of 1.5 wt% or less, and Fe ₂ O ₃ of 0.1 wt% or less.
% Or less, and Na ₂ O of 0.3% by weight or less.

Next, the surface roughness of the base 11 will be described. The surface roughness described below means the average roughness of the center line, and the roughness described in the description of the conductive film 12 is also the average roughness of the center line.

The surface roughness of the base 11 is 0.15 to 0.5 μm
m, preferably about 0.2 to 0.3 μm. FIG. 7 is a graph showing the surface roughness of the base 11 and the rate of occurrence of peeling. FIG. 7 shows the results of an experiment as described below. The base 11 and the conductive film 12 were made of alumina and copper, respectively, and samples with various surface roughnesses of the base 11 were prepared, and the conductive film 12 was formed on each sample under the same conditions. Each sample was subjected to ultrasonic cleaning, and thereafter, the surface of the conductive film 12 was observed to determine whether or not the conductive film 12 was peeled. The surface roughness of the base 11 was measured using a surface roughness measuring device (574A, manufactured by Tokyo Seimitsu Surfcom).
The one having a tip R of 5 μm was used. As can be seen from this result, if the average surface roughness is 0.15 μm or less,
The rate of occurrence of peeling of the conductive film 12 formed thereon is about 5%, and good bonding strength between the base 11 and the conductive film 12 can be obtained. Further, if the surface roughness is 0.2 μm or more, peeling of the conductive film 12 hardly occurs. Therefore, if possible, the surface roughness of the base 11 is preferably 0.2 μm or more. Since the peeling of the conductive film 12 is a major factor in deterioration of the characteristics of the element, the rate of occurrence is 5% in terms of yield and the like.
The following is preferred.

FIG. 8 shows the frequency and Q with respect to the surface roughness of the base.
It is a graph which shows the relationship of a value. FIG. 8 shows the results of the following experiment. First, a base 11 having a surface roughness of 0.1 μm or less, a base 11 having a surface roughness of 0.2 to 0.3 μm,
Each sample of the base 11 having a surface roughness of 0.5 μm or more was prepared, and a conductive film of the same material (copper) and the same thickness was formed on each sample. Then, in each sample, the Q value at a predetermined frequency F was measured. As can be seen from FIG. 8, when the surface roughness of the base 11 is 0.5 μm or more, a decrease in the Q value, which is considered to be caused by the deterioration of the film structure of the conductive film 12, is observed. Particularly in the high frequency region, the Q value is significantly deteriorated. The self-resonant frequency f0 (the maximum value of each line) is shifted to the lower frequency side when the surface roughness of the base 11 is 0.5 μm. Therefore, the surface roughness of the base 11 is preferably 0.5 μm or less from the viewpoint of the Q value and the surface of the self-resonant frequency f0.

As described above, judging from the results of the adhesion strength between the conductive film 12 and the base 11, the Q value of the conductive film, and the self-resonance frequency f0, the surface roughness of the base 11 is 0.15.
μm to 0.5 μm, more preferably 0.2 μm
０．３0.3 μm is good.

It is preferable that the end portions 11b and 11c and the center portion 11a have different average surface roughnesses. That is, the average surface roughness of the end portions 11b and 11c is set in the central portion 1 within the range of 0.15 to 0.5 μm.
It is preferable to make the average surface roughness smaller than 1a.
Since the terminal portions 15 and 16 are formed by laminating the conductive films 12 on the ends 11b and 11c as described above, the surface roughness of the ends 11b and 11c is made smaller than that of the central portion 11a, so that Since the surface roughness of the conductive film 12 formed on 11b and 11c can be reduced, the adhesion to the electrodes of the circuit board or the like can be improved, and the reliable bonding of the inductance element to the circuit board or the like can be achieved. it can. Further, a conductive film 12 is laminated on the central portion 11a to form a groove 13
Is formed, so that the conductive film 12 does not come off from the base 11 when the groove 13 is formed by a laser or the like.
Therefore, it is preferable that the surface roughness of the central portion 11a is larger than that of the end portions 11b and 11c because the adhesion strength between the base 11 and the base 11 must be improved. In particular, when the groove 13 is formed by laser, the temperature of the portion irradiated with the laser rises more rapidly than other portions, and the conductive film 12 may be peeled off by heat shock or the like. Therefore, when the grooves 13 are formed by laser, it is necessary to increase the bonding density between the conductive film 12 and the base 11 as compared with other portions.

As described above, the central portion 11a and the end portions 11b, 11
By making the surface roughness different from that of c, it is possible to prevent the conductive film 12 from peeling off at the time of forming the groove 13 and the adhesion to a circuit board or the like.

In the present embodiment, the bonding strength between the conductive film 12 and the base 11 is improved by adjusting the surface roughness of the base 11.
2 to improve the adhesion strength between the conductive film 12 and the base 11 without adjusting the surface roughness by providing an intermediate layer composed of Cr alone or an alloy of Cr and another metal. Can be. Of course, when the surface roughness of the base 11 is adjusted and the intermediate layer and the conductive film 12 are laminated on the base 11, it is possible to obtain a stronger adhesion strength between the conductive film 12 and the base 11. it can.

Next, the conductive film 12 will be described. The conductive film 12 preferably has a small inductance of 50 nH or less and a Q value of 30 or more for a high frequency signal of 800 MHz or more. Conductive film 1 having such characteristics
In order to obtain 2, it is necessary to select a material and a manufacturing method.

Hereinafter, the conductive film 12 will be specifically described. Examples of a constituent material of the conductive film 12 include conductive materials such as copper, silver, gold, and nickel. A predetermined element may be added to the material such as copper, silver, gold, and nickel to improve weather resistance and the like. Alternatively, an alloy such as a conductive material and a nonmetallic material may be used. Copper and its alloys are often used as constituent materials in terms of cost, corrosion resistance, and ease of fabrication. When copper or the like is used as the material of the conductive film 12, first, a base film is formed on the base 11 by electroless plating, and a predetermined copper film is formed on the base film by electrolytic plating. The conductive film 12 is formed. Further, when the conductive film 12 is formed of an alloy or the like, it is preferable to form the conductive film 12 by a sputtering method or a vapor deposition method. When copper or an alloy thereof is used as a constituent material, the thickness of the conductive film 12 is preferably 15 μm or more. If the thickness is less than 15 μm, the conductive film 12
Is small, and it is difficult to obtain a predetermined characteristic. FIG. 9 is a graph showing the relationship between the thickness of the conductive film 12 and the Q value. Copper is used as a constituent material of the conductive film 12, and the material and surface roughness of the base 11 are set to the same conditions, and the thickness of the conductive film 12 formed on the base 11 is changed. The Q value at was measured. As can be seen from FIG. 9, when the thickness of the conductive film 12 is 15 μm or more, the Q value exceeds 30. The thickness of the conductive film 12 is 15 μm.
In the above-mentioned region, the Q value is not so much improved, and the thickness of the conductive film 12 is preferably set to 35 μm or less for cost reduction and reduction of the defective rate. The thickness of the conductive film 12 is 2
1 μm or more is more preferable.

The conductive film 12 may be composed of a single layer, but may have a multilayer structure. That is, a plurality of conductive films having different constituent materials may be stacked. For example, first, a copper film is formed on the base 11, and then a metal film having good weather resistance (such as nickel) is laminated thereon, so that corrosion of copper, which is somewhat problematic in weather resistance, can be prevented. .

Examples of the method for forming the conductive film 12 include a plating method (such as an electrolytic plating method and an electroless plating method), a sputtering method, and a vapor deposition method. Among these forming methods,
A plating method with good mass productivity and small variations in film thickness is often used.

The surface roughness of the conductive film 12 is preferably 1 μm or less, more preferably 0.2 μm or less. When the surface roughness of the conductive film 12 exceeds 1 μm, the Q value at high frequencies decreases due to the skin effect. FIG. 10 is a graph showing the relationship between the frequency of the conductive film 12 and the Q value. FIG. 10 was derived through the following experiment. First, a conductive film 12 made of copper is formed on a base 11 having the same size and the same material with the same surface roughness while changing the surface roughness. Was measured.
As can be seen from FIG. 10, the surface roughness of the conductive film 12 is 1 μm.
Above this, it can be seen that the Q value in the high frequency region is low. Further, it can be seen that when the surface roughness of the conductive film 12 is 0.2 μm or less, the Q value particularly in a high frequency region is extremely high.

As described above, the surface roughness of the conductive film 12 is 1.
The thickness is preferably 0 μm or less, and more preferably 0.2 μm or less, the skin effect of the conductive film 12 can be reduced, and the Q value particularly at high frequencies can be improved.

Further, the adhesion strength between the conductive film 12 and the base 11 is as follows:
After leaving the base 11 on which the conductive film 12 is formed at a temperature of 400 ° C. for a few seconds, it is preferable that the conductive film 12 be separated from the base 11 by a degree or more. When the element is mounted on a substrate or the like, a temperature of 200 ° C. or more may be applied to the element due to self-heating or heat from other members. Therefore, the conductive film 12 from the base 11 at 400 ° C.
If the adhesion strength is such that no peeling occurs, even if heat is applied to the element, the characteristics of the element do not deteriorate.

Next, the protective member 14 will be described. As the protective material 14, an organic material having excellent weather resistance and insulating properties,
For example, a material having an insulating property such as an epoxy resin is used. Further, it is preferable that the protective material 14 has a transparency such that the condition of the groove 13 can be observed. Protective material 14
When a material having transparency is used, the shape of the groove 13, the number of turns of the groove 13, the peeling of the conductive film 12 around the groove 13, and the like can be observed even after the protective material 14 is formed, and the defective product is found. Greatly contributes to In particular, the conductive film 1 around the groove 13
Peeling of 2 may cause deterioration of characteristics with the passage of time, and it is very useful to know the peeling of this conductive film before shipment. Further, it is preferable that the protective material 14 has a predetermined color while having transparency.
The protective material 14 is made of a conductive film 12 such as red, blue, or green, or a terminal 1.
By coloring different colors such as 5, 16 and the like, it is possible to distinguish each part of the element (a part where a terminal part and a groove are formed), and to easily inspect each part of the element. Especially terminal part 1
If a defective portion (peeling of the electrode film or the like) is generated in the portions 5 and 16, an element may not be properly attached to the substrate during a process such as reflow. Also,
By changing the color of the protective material 14 in at least one of the size of the element, the width of the groove 13, the type and thickness of the conductive film 12, and the material of the base 11, an element having a different characteristic or part number can be erroneously determined. It is possible to reduce mistakes such as attachment to a part. Further, the sorting of the finished product can be easily performed, so that the productivity is improved. In addition, by changing the color of the protective member 14 depending on the type of electronic device, etc., the same electronic device uses the inductance element of the same color in the same electronic device, so that the wrong component is mounted on the substrate. Can be prevented.

Therefore, the protection member 14 is provided with the terminal portions 15 and 16.
Is provided so that it is exposed and colored according to the characteristics etc.
Moreover, by providing transparency, the type of the inductance element can be easily determined, and the terminal portions 15 and 1 can be easily determined.
6 can be easily inspected (since the portion where the groove 13 is formed is covered with a protective material) and the state of the groove 13 can be easily observed, so that the process control is very simple. And productivity is improved. On the other hand, in a configuration in which an opaque resin is provided so as to cover the entire element as in a conventional resistor, the terminal portion is not exposed after the opaque resin is applied, and the terminal portion cannot be observed. Defective products cannot be found, and grooves 1 formed by laser, grinding stone, etc.
Since the peeling of the conductive film in the peripheral portion of No. 3 cannot be found, it is very difficult to find a defective product.

As shown in FIG. 11, the protection member 14 has a length Z1 between the corner 13a of the groove 13 and the surface of the protection member 14.
Is preferably 5 μm or more. Z
When 1 is smaller than 5 μm, it is conceivable that characteristic deterioration, discharge, and the like are likely to occur, and the characteristics of the element are significantly deteriorated.
In addition, the corner 13a of the groove 13 is a portion where discharge or the like is particularly likely to occur, and it is highly preferable that a protective material 14 having a thickness of 5 μm or more is formed on the corner 13a. In some cases, after the protective material 14 is formed, plating is performed again to form an electrode film or the like. However, if the protective material 14 having a thickness of 5 μm or more is not formed on the corners 13a, the electrode film or the like may adhere. Thus, an electrode film or the like is formed on the protective material 14 in which the characteristics are deteriorated, and the characteristics are deteriorated.

Next, the terminal portions 15 and 16 will be described.
Although the terminal portions 15 and 16 function satisfactorily even with the conductive film 12 alone, it is preferable that the terminal portions 15 and 16 have a multilayer structure in order to adapt to various environmental conditions and the like.

FIG. 12 is a sectional view of the terminal portion 15. FIG.
2, a conductive layer 12 is formed on the end 11b of the base 11, and a protective layer 30 made of a weather-resistant material such as nickel or titanium is formed on the conductive layer 12.
0 is formed, and a bonding layer 301 made of solder or the like is formed on the protective layer 300. Protective layer 3
00 can improve the bonding strength between the bonding layer and the conductive film 12 and the weather resistance of the conductive film. In the present embodiment, at least one of nickel and a nickel alloy is used as a constituent material of the protective layer 300, and the bonding layer 301 is used.
Was used as a constituent material. The thickness of the protective layer 300 (nickel) is preferably 2 to 7 μm, and if the thickness is less than 2 μm, the weather resistance is deteriorated.
The electrical resistance of (nickel) itself increases, and the element characteristics deteriorate significantly. The thickness of the bonding layer 301 (solder) is 5
When the thickness is less than 5 μm, a solder erosion phenomenon occurs, and good bonding between the element and a circuit board cannot be expected. When the thickness exceeds 10 μm, the Manhattan phenomenon easily occurs, and the mountability is extremely low. Worse.

The inductance element constructed as described above has no characteristic deterioration, and has very good mountability and productivity.

A method of manufacturing the inductance element having the above-described configuration will be described below.

First, the base 11 is manufactured by pressing or extruding an insulating material such as alumina. Next, a conductive film 12 is formed on the entire base 11 by a plating method, a sputtering method, or the like. Next, a spiral groove 13 is formed in the base 11 on which the conductive film 12 is formed. The groove 13 is formed by laser processing or cutting. Since the laser processing has very high productivity, the laser processing will be described below. First, the base 11 is mounted on a rotating device, the base 11 is rotated, and a laser is applied to the central portion 11a of the base 11 to remove both the conductive film 12 and the base 11, thereby forming a spiral groove. I do. At this time, an excimer laser, a carbon dioxide gas laser, or the like can be used as the laser, and the laser beam is focused on the central portion 11a of the base 11 by narrowing the laser beam with a lens or the like. Further, the groove 13
The depth or the like can be adjusted by adjusting the power of the laser, and the width or the like of the groove 13 can be adjusted by exchanging a lens when narrowing down the laser beam. Also, depending on the constituent material of the conductive film 12, etc.,
Since the laser absorptivity is different, it is preferable that the type of laser (laser wavelength) be appropriately selected depending on the constituent material of the conductive film 12.

After the groove 13 is formed, a protective material 14 is applied to the portion where the groove 13 is formed (the central portion 11) and dried. At this time, the protective material 14 has an inductance value of the element,
As described above, the color of the device is varied by at least one of the following: the corresponding frequency of the device, the size of the device, the width of the groove, the type and thickness of the conductive film, and the material of the base. Management such as sorting becomes very easy, and productivity is improved.

At this point, the product is completed. In particular, a nickel layer or a solder layer may be laminated on the terminal portions 15 and 16 to improve the weather resistance and the joining property. The nickel layer and the solder layer are formed on a semi-finished product on which the protective material 14 is formed by a plating method or the like.

Although the present embodiment has been described with respect to an inductance element, the same effect can be obtained with an electronic component in which a conductive film is formed on a base made of an insulating material.

FIGS. 13 and 14 are a perspective view and a block diagram, respectively, showing a wireless terminal device according to an embodiment of the present invention. 13 and 14, reference numeral 29 denotes a microphone for converting a voice into a voice signal, 30 denotes a speaker for converting a voice signal into a voice, 31 denotes an operation unit including dial buttons and the like, and 32 denotes a display unit for displaying an incoming call and the like. Reference numeral 33 denotes an antenna, and reference numeral 34 denotes a transmission unit for demodulating an audio signal from the microphone 29 and converting it into a transmission signal. The transmission signal produced by the transmission unit 34 is emitted to the outside through the antenna. A receiving unit 35 converts a received signal received by the antenna into an audio signal.
Is converted to voice. 36 is a transmitting unit 34 and a receiving unit 3
5, a control unit for controlling the operation unit 31 and the display unit 32;

Hereinafter, an example of the operation will be described. First, when there is an incoming call, the receiving unit 35 sends the
The control unit 36 displays a predetermined character or the like on the display unit 32 based on the incoming signal,
Further, when a button or the like for receiving an incoming call is pressed from the operation unit 31, a signal is sent to the control unit 36, and the control unit 36
Set each part to the incoming call mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, and the audio signal is output from the speaker 30 as audio.
The voice input from the microphone 29 is converted into a voice signal, and is transmitted to the outside via the transmitting unit 34 and the antenna 33.

Next, the case of transmitting a call will be described. First, when transmitting a signal, a signal indicating that the signal is transmitted from the operation unit 31 is input to the control unit 36. Subsequently, when a signal corresponding to the telephone number is transmitted from the operation unit 31 to the control unit 36, the control unit 36 transmits a signal corresponding to the telephone number from the antenna 33 via the transmission unit 34. When communication with the other party is established by the transmission signal, a signal to that effect is sent to the control unit 36 through the reception unit 35 via the antenna 33, and the control unit 36 sets each unit to the transmission mode. That is, the signal received by the antenna 33 is converted into an audio signal by the receiving unit 35, the audio signal is output as audio from the speaker 30, and the audio input from the microphone 29 is converted into an audio signal, Through the antenna 33 to the outside.

The inductance element described above (FIG. 1)
12 to FIG. 12) are used for a filter circuit, a matching circuit, and the like in the transmission unit 34 and the reception unit 35, and the number thereof is about several to 40 for one wireless terminal device. I have. As described above, by using an inductance element in which the color of the protective material 14 is different depending on the characteristic or size, it is possible to prevent an inductance element having an incorrect characteristic from being attached. Since the occurrence of defects can be significantly reduced, productivity can be improved.

[0071]

The present invention comprises a base, a conductive film formed on the base, a groove provided in the conductive film, and a protective material provided so as to cover the groove. By changing the color of the protective material in terms of characteristics, structure, and the like, it is possible to reduce element selection errors and to reduce the defect rate of electronic devices on which the element is mounted. In addition, since management such as sorting becomes very easy, the productivity of the element is improved.

Further, the wireless terminal device equipped with the above-described inductance element can prevent the mounting of an inductance element having wrong characteristics, so that the occurrence of defects such as an increase in noise due to a component mounting error can be greatly reduced.
Productivity can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an inductance element according to an embodiment of the present invention.

FIG. 2 is a side view showing the inductance element according to the embodiment of the present invention;

FIG. 3 is a cross-sectional view of a base on which a conductive film used for an inductance element according to an embodiment of the present invention is formed.

FIG. 4 is a diagram showing a base used for an inductance element according to one embodiment of the present invention;

FIG. 5 is a side view showing the Manhattan phenomenon.

FIG. 6 is a perspective view of a base used for the inductance element according to the embodiment of the present invention.

FIG. 7 is a graph showing the surface roughness and the rate of occurrence of peeling of a base used for an inductance element according to an embodiment of the present invention.

FIG. 8 is a graph showing a relationship between a frequency and a Q value with respect to a surface roughness of a base used for an inductance element according to an embodiment of the present invention.

FIG. 9 is a graph showing a relationship between a film pressure of a conductive film used for an inductance element and a Q value according to one embodiment of the present invention.

FIG. 10 is a graph showing a relationship between frequency and Q value with respect to surface roughness of a conductive film used for an inductance element according to one embodiment of the present invention.

FIG. 11 is a side view of a portion provided with a protective material for an inductance element according to an embodiment of the present invention.

FIG. 12 is a sectional view of a terminal portion of the inductance element according to the embodiment of the present invention;

FIG. 13 is a perspective view showing a wireless terminal device according to one embodiment of the present invention;

FIG. 14 is a block diagram showing a wireless terminal device according to an embodiment of the present invention;

FIG. 15 is a side view showing a conventional inductance element.

[Explanation of symbols]

 Reference Signs List 11 base 11a central part 11b, 11c end part 11d, 11e, 11f corner part 12 conductive film 13 groove 14 protective material 15, 16 terminal part 30 speaker 31 operation part 32 display part 33 antenna 34 transmitting part 35 receiving part 36 control part

Continued on the front page (72) Inventor Sumio Tate 1006 Ojidoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (13)

[Claims] An inductance element comprising a base, a conductive film formed on the base, a groove provided in the conductive film, and a protective material provided to cover the groove. In addition, an inductance element characterized in that the color of the protective material is different depending on characteristics, structure, and the like. 2. The color of the protective material is changed by at least one of an inductance value of an element, a corresponding frequency of the element, a size of the element, a width of a groove, a kind and a thickness of a conductive film, and a material of a base. The inductance element according to claim 1, wherein: 3. The inductance element according to claim 1, wherein the color of the protective material is made different depending on the type of electronic equipment to be attached. 4. The inductance element according to claim 1, wherein the protection member has a degree of transparency such that the groove can be observed. 5. A base which is made of an insulating material and has a substantially square cross section at both ends and a center depressed from the both ends, a conductive film formed on the surface of the base, A spiral groove formed at a central portion of the base and formed to remove the conductive film and a part of the base, on the base so as to cover the groove and expose the terminal portion. An inductance element comprising a protective material provided, wherein the color of the protective material is different depending on characteristics, structure, and the like. 6. The device according to claim 5, wherein the color of the protective material is different depending on at least one of the element size, groove width, conductive film type and thickness, and base material. Inductance element. 7. The inductance element according to claim 5, wherein the color of the protective material is made different depending on the type of electronic equipment to be attached. 8. The inductance element according to claim 5, wherein the protection member has a degree of transparency such that grooves can be observed. 9. A method of manufacturing an inductance element, comprising: forming a conductive material on a base and forming a protective material on a semi-finished product having a groove formed in the conductive film so as to cover the groove; A method for manufacturing an inductance element, wherein the color of the element is changed depending on characteristics, structure and the like. 10. The device according to claim 9, wherein the color of the protective material is different depending on at least one of the element size, groove width, conductive film type and thickness, and base material. Manufacturing method of inductance element. 11. The inductance element according to claim 9, wherein the color of the protective material is made different depending on the type of electronic equipment to be attached. 12. The inductance element according to claim 9, wherein the protection member has a degree of transparency such that the groove can be observed. 13. A voice signal conversion means for converting voice into a voice signal, an operation means for inputting a telephone number and the like, a display means for displaying an incoming call display, a telephone number and the like, and a demodulation of a voice signal into a transmission signal. A transmitting unit for converting, a receiving unit for converting a received signal into an audio signal, an antenna for transmitting and receiving the transmitted signal and the received signal, and a wireless terminal device including a control unit for controlling each unit; A wireless terminal device using the inductance element according to claim 1 as an inductance element forming a filter circuit or a matching circuit forming a transmission unit.