JPH10124819A - Thin-film magnetic head, its production and its jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin-film magnetic head with which the connection of wire for leading out is surely and easily executed and which is excellent in workability and mass productivity, and a process for producing the same and its jig. SOLUTION: A magnetic head chip is stuck onto a suitable support 80. The jig inserted with the wires 82, 84 through guide holes 72, 74 is moved from an arrow F5 direction toward bonding electrodes on a support 80. The wires 82, 84 are guided by solders 62A, 62B, 64A, 46B and are pushed into the valleys therebetween. When the wire parts near the solders 62A, 62B, 64A, 64B are heated as shown by an arrow F6, the heat is transferred through the wires 82, 84 to the solders 62A, 62B, 64A, 64B to join the wires 82, 84. The wires 82, 84 are thereafter cut as shown by an arrow F4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a VTR, a DAT
The present invention relates to a thin-film magnetic head suitable for a rotary head type magnetic recording or reproducing apparatus, a method of manufacturing the same, and a jig thereof, and more specifically to an improvement in a method of connecting lead wires.

[0002]

2. Description of the Related Art A thin film magnetic head such as a VTR has a terminal portion formed on a nonmagnetic substrate surface on which a magnetic circuit is formed, and a relay substrate provided in advance on a head support. Are connected by a wire or the like. Further, connection to external electrodes is made by wires or the like via the relay board. FIG.
(A) shows an overview of a general thin film magnetic head for a VTR. In the figure, the magnetic head has an element portion 12 made of an insulating material on a main surface of an element forming substrate 10 made of a non-magnetic material, and a protection plate 14 made of a non-magnetic material provided on a main portion of the head. I have.

As shown in FIG. 7B, for example, a pair of cores 16 constituting a magnetic circuit including a magnetic gap and a thin film formed so as to be wound therearound are provided on a main part of the head of the element section 12. A coil 18 and a pair of bonding electrodes 20 and 22 connected to both ends of the thin film coil 18 are formed, respectively. When viewed from the sliding surface side indicated by the arrow FA in FIG. 7A, as shown in FIG. It has become.

[0004] In such a magnetic head, when the lead wire is bonded to the bonding electrodes 20 and 22, thermocompression bonding of the wire is performed. However, it is difficult to secure the pitch between the two wires and to connect them with high accuracy, and it is necessary to perform wire bonding with a single core chip. Therefore, workability and reliability are poor.

Therefore, as shown in FIG. 8A, substantially L-shaped electrodes 30 and 30 are attached to the ends of the bonding electrodes 20 and 22, respectively.
The structure forming 32 is known. At the time of bonding, as shown in the enlarged view of FIG.
Conductors 34 and 36 such as solder are reinforced at 0 and 32. FIG. 3C shows a plane, and the solder 34,
The bonding is performed by placing the wires 38 and 40 on the 36.

Incidentally, a magnetic head for a VTR or the like has an azimuth angle, for example, an angle of ± 6 to 30 °. When FIG. 8 (C) is viewed from the side indicated by arrow FB, it becomes as shown in FIG. 8 (D). When the wires 38, 40 are pushed in the direction of arrow FC for bonding, as shown by dotted lines in FIG. The electrode pattern portions of the solders 34 and 36 are separated depending on the azimuth angle. Further, at this time, cracks may be generated at the boundary with the protective substrate 14 side, which causes a decrease in yield and reliability.

Further, Japanese Patent Application Laid-Open No. 2-310812 discloses that a substrate on which a main part of a head (see FIG. 7B) is formed is joined to a support substrate on which lead-out wiring is formed, and a bonding pad of the substrate and a support are formed. There is disclosed a thin-film magnetic head in which one end of a lead wire of a substrate is connected on the same surface, and the lead wire is exposed on a side surface of the support substrate. However, in this background art, since the substrate of the main part of the head and the support substrate for bonding are not integrated, they have to be connected to each other, and it cannot be said that the reliability in manufacturing the head is very high.

The present invention focuses on these points.
It is an object of the present invention to provide a thin-film magnetic head which can be reliably and easily connected to a drawing wire, and which is excellent in workability and mass productivity, a method of manufacturing the same, and a jig thereof.

[0009]

In order to achieve the above object, a thin film magnetic head according to the present invention comprises an element forming substrate (10).
A thin-film magnetic head in which a thin-film magnetic head main portion (16, 18) and bonding electrodes (20, 22) for connection to the main portion are formed on an end face sandwiched between the bonding electrode and the protective plate (14). And bonding wires (82,84)
Conductor with a shape that guides (62A, 62B, 64A, 64
B) is formed. According to a main mode, the reinforcing conductor is formed by a set of conductors having a valley into which the bonding wire is pushed. The valleys are formed by providing split electrodes (54, 56) on the auxiliary bonding electrodes and providing conductors on the split electrodes. According to another embodiment, the bonding wire is connected to the bonding electrode so as not to be exposed from a side surface (10A) of the element forming substrate.

In the method of manufacturing a thin-film magnetic head according to the present invention, a reinforcing conductor having a shape for guiding a bonding wire is formed on the bonding electrode, and the bonding wire is guided while being guided by the reinforcing conductor. And joining the reinforcing conductor into the reinforcing conductor. According to one aspect of the manufacturing method, the guide means (72, 74, 76) for guiding the bonding wire toward the reinforcing conductor while holding the bonding wire at a position corresponding to the reinforcing conductor.
Is used.

The above and other objects, features and advantages of the present invention will be apparent from the following detailed description and the accompanying drawings.

[0012]

Embodiments of the present invention will be described below in detail with reference to examples. Note that the same reference numerals are used for components corresponding to the above-described background art. FIG. 2A shows a substrate bar of the magnetic head according to the present embodiment. Thin film element forming bar 50
A plurality of elements 52 are formed on the main surface of the element portion 51 of FIG. Each element 52 includes a pair of cores 16 and a thin-film coil 1.
8, bonding electrodes 20 and 22 are included. Further, in this embodiment, the split electrodes 54 and 56 are formed on the bonding electrodes 20 and 22, respectively. A protection plate bar 58 is formed of glass or the like on the element main portion forming surface by an arrow F1.
Are adhered as shown in FIG.

FIG. 3A is a view of the element bar obtained as described above as viewed from the protection plate bar 58 side. Split electrode 5
The slit width d of 4, 56 is desirably about the diameter of a bonding wire, and is set to 30 μm in this embodiment. For such divided electrodes 54 and 56, for example, using a mask 60 as shown in FIG.
A, 62B, 64A, 64B are respectively attached. next,
As shown by the dotted line in FIG. 2B, the sliding surface is rounded so that the core gap is exposed. FIG. 2 (C) shows the sliding surface after processing. The element bar is cut by, for example, lines LA and LB shown in FIG. The angle θ at this time is the azimuth angle. The line LA, viewed from the side of the protection plate bar 58,
LB is the position shown in FIG.

FIG. 1A shows the magnetic head chip after cutting. The split electrode portion of the magnetic head chip is shown in an enlarged scale in FIG. As shown in these drawings, solders 62A and 62B are formed at the tip of the bonding electrode 20 at intervals of approximately the slit width d, and solders 64A and 64B are formed at the tip of the bonding electrode 22 at intervals of approximately the slit width d. It is formed with. These solders 62A, 62B, 64A, 64B
Is cut along the line LA shown in FIG. 3A, and thus has a processed shape along the side surface of the element forming substrate 10. Height Δ of solders 62A, 62B, 64A, 64B
H is set to be several tens μm, for example, about 50 μm.

Next, a jig for connecting a wire to the magnetic head chip configured as described above will be described with reference to FIG. Guide holes 72 and 74 for guiding two wires are provided on the main surface of the base 70 of the jig. A guide plate 76 having an appropriate length is provided on the guide holes 72 and 74, and a cut window 78 is provided at an appropriate position of the guide plate 76. That is, a wire is inserted from the directions of arrows F2 and F3 along the guide holes 72 and 74 and the guide plate 76, and after being connected to the magnetic head chip, a cutter (not shown) is cut through the cut window 78 as shown by the arrow F3. And cuts the wire.

The distance GW between the guide holes 72 and 74 corresponds to the distance between the slits formed in the divided electrodes 54 and 56, respectively. The height GH of the guide holes 72, 74 is such that a wire can be inserted between the valleys of the solders 62A, 62B, 64A, 64B.

Next, the operation of wire bonding will be described with reference to FIG. FIG. 7A shows a plane when the wire is inserted, and FIG. 7B shows an end face viewed in the direction of the arrow along line # 5- # 5 in FIG. The magnetic head chip shown in FIG. 1 is attached on an appropriate support 80 as shown in FIG. Then, on the support 80, the wires 82, 84 are inserted into the guide holes 72, 7, respectively.
4 is moved from the direction of arrow F5 toward the bonding electrodes 20 and 22.

Then, the wire 82 is connected to the solders 62A, 62A.
The wire 84 is guided by B and pushed into the valley, and the wire 84 is guided by the solders 64A and 64B and pushed into the valley. As described above, the solder 62A, 6A
2B, 64A and 64B are formed using the mask 60. In addition, the cutting out of the head chip from the element forming bar 50 is also performed with extremely high precision using semiconductor technology. Therefore, the positional accuracy of the solders 62A, 62B, 64A, 64B is extremely good. Therefore, by using a jig having guide holes 72 and 74 corresponding to those positions, the valley between the solders 62A and 62B, 64A and 64
The pushing of the wires 82 and 84 into the valley of B is performed very well. FIG. 5 shows a state in which the wires 82 and 84 are pushed into the solders 62A, 62B, 64A and 64B, respectively.

Next, in this state, the solders 62A, 62A
When the wire portions near B, 64A and 64B are heated by a bonder 86 as shown by an arrow F6 (see FIG. 5B), the heat is transmitted through the wires 82 and 84 to the solders 62A, 62B and 6B.
4A, 64B. Then, the solder 62A, 62B
Melts and joins with the wire 82. Also, solder 64
A and 64B are melted and joined to the wire 84. afterwards,
The wires 82 and 84 are cut by a cutter as shown by an arrow F4 to separate the jig from the head chip. Further, the solder portion on which the wire bonding has been performed is covered with an ultraviolet curable resin or the like, thereby ensuring reliability.

As described above, according to the present embodiment, the split electrodes are formed on the bonding electrodes, and each is reinforced by soldering. Then, bonding is performed by pushing the tip of the wire into the valley between the solders.

For this reason, since no force is applied to the element forming substrate 10 and the solder portion, the peeling of the electrode portion is favorably prevented. Accordingly, even in the case of a magnetic head on which azimuth is formed, the influence is not exerted, and the connection of the lead wire is reliably and easily performed, so that the reliability, workability and yield are remarkably improved. Further, the background art shown in FIG. 8D and FIG.
As apparent from the comparison, the wires 82 and 84 are not exposed on the side surface 10A of the element forming substrate 10. For this reason,
In the subsequent bonding step or the like, the element forming substrate 1
By not exposing the wire on the side surface 10A of the zero, there is an advantage that a reliable magnetic head can be provided without an accident such as a short circuit or disconnection between the wires during handling.

The present invention has many embodiments,
Various modifications can be made based on the above disclosure. For example, the following is also included. (1) In the above embodiment, the split electrode is provided for the bonding electrode. However, it is sufficient that solder can be formed so as to guide the wire. FIG. 6 shows such an embodiment. The example of FIG.
0, a wide electrode 100 is formed, and a solder 104
A and 104B are formed at intervals corresponding to the wire diameter. A wide electrode 102 is also formed on the bonding electrode 22, and solders 106A and 106B are formed thereon.

In the example shown in FIG.
The L-shaped electrodes 110 and 112 have an L-shaped tip at the ends of 0 and 22.
To form Then, solders 114A and 114B are formed at the L-shaped electrode 110 and in the vicinity thereof at intervals corresponding to the wire diameter. Similarly, solders 116A and 116B are formed on the L-shaped electrode 112 and its vicinity. Since the divided solders are connected via a wire, the bonding electrode may be connected to any of the solders. In other words, it is sufficient if there is solder that serves as a guide for pushing the wire, and the pattern of the bonding electrode may be appropriately set.

(2) The configuration of the main part of the magnetic head is also arbitrary. Instead of a so-called inductive coil, a magnetoresistive head may be used. In addition, the shape and material of each part may be appropriately changed. For example, although solder is used as the reinforcing conductor in the above embodiment, a silver paste or the like may be used.

[0025]

As described above, the present invention has the following effects. (1) Since the reinforcing conductor having a shape for guiding the bonding wire is formed on the bonding electrode, the connection with the lead wire can be reliably and easily performed. (2) The reinforcing conductor is formed using a mask for the bonding electrode, and the wire is guided to the reinforcing conductor using a guide jig, so that the wire can be guided accurately. Workability and mass productivity are improved. (3) Wires can be joined without applying force to the side surfaces of the element formation substrate and the electrodes, preventing peeling of the electrodes even if there is an azimuth angle, and improving reliability, workability, and yield. Improvement can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a magnetic head chip according to one embodiment of the present invention.

FIG. 2 is a diagram showing a state of processing from a bar of the magnetic head chip of FIG. 1;

FIG. 3 is a diagram showing a state of formation of solder for bonding.

FIG. 4 is a perspective view showing a jig used for a wire bonding operation.

FIG. 5 is a diagram showing a state during a bonding operation.

FIG. 6 is a diagram showing a main part of another embodiment of the present invention.

FIG. 7 is a diagram showing an example of a background art of a magnetic head chip.

FIG. 8 is a diagram showing another example of the background art of the magnetic head chip.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Element formation board 12, 51 ... Element part 14 ... Protective plate 16 ... Core 18 ... Thin film coil 20, 22 ... Bonding electrode 24 ... Magnetic gap 30, 32 ... Land 34, 36 ... Solder 38, 40, 82, 84 ... Wire 50: Element forming bar 52: Element 54, 56: Split electrode 58: Protective plate bar 60: Mask 62A, 62B, 64A, 64B, 104A, 104
B, 106A, 106B, 114A, 114B, 116
A, 116B Solder 70 Base 72, 74 Guide hole 76 Guide plate 80 Support 86 Bonder 100, 102 Wide electrode 110, 112 L-shaped electrode LA, LB Line indicating cutting position θ Azimuth Corner

Claims (6)

[Claims] 1. A thin-film magnetic head in which a thin-film magnetic head main part and a bonding electrode for connecting to the main part are formed on an end face sandwiched between an element forming substrate and a protective plate. A thin-film magnetic head characterized in that a reinforcing conductor having a shape for guiding a magnetic field is formed. 2. The reinforcing conductor is a set of conductors having a valley into which a bonding wire is pushed.
The thin-film magnetic head as described in the above. 3. The thin-film magnetic head according to claim 2, wherein said auxiliary bonding electrode is provided with a divided electrode, and said valley is formed by providing a conductor to each of said divided electrodes. 4. The thin film magnetic head according to claim 1, wherein said bonding wire is connected to said bonding electrode so as not to be exposed from a side surface of said element forming substrate. 5. The method of manufacturing a thin-film magnetic head according to claim 1, wherein a reinforcing conductor having a shape for guiding a bonding wire is formed on said bonding electrode. A step of pushing the bonding wire into the reinforcing conductor and joining while guiding the thin film magnetic head. 6. A jig used in the method of manufacturing a thin-film magnetic head according to claim 5, wherein a bonding wire is held toward the reinforcing conductor while holding the bonding wire at a position corresponding to the reinforcing conductor. A jig for manufacturing a thin-film magnetic head, comprising: a guide means for guiding the magnetic head.