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JPH1012457A - Surface mounting type inductor - Google Patents

Surface mounting type inductor

Info

Publication number
JPH1012457A
JPH1012457A JP17996096A JP17996096A JPH1012457A JP H1012457 A JPH1012457 A JP H1012457A JP 17996096 A JP17996096 A JP 17996096A JP 17996096 A JP17996096 A JP 17996096A JP H1012457 A JPH1012457 A JP H1012457A
Authority
JP
Japan
Prior art keywords
core
coil
surface mounting
inductor
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17996096A
Other languages
Japanese (ja)
Inventor
Yasuhiro Ishimori
康寛 石森
Hideyuki Sato
秀行 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP17996096A priority Critical patent/JPH1012457A/en
Publication of JPH1012457A publication Critical patent/JPH1012457A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PROBLEM TO BE SOLVED: To have a terminal structure tough against solder re-flow and re-flow mounting and to allow adjustment of inductance value with ease by jointing a surface mounting terminal coated with solder to a flat part side of a flange of a T-shape core and connecting the lead wire of a coil to the surface mounting terminal. SOLUTION: A surface mounting terminal 3 is combined to a flat part 12 of a flange of a T-shape core 1, and after a coil 5 wound with a melt-adhesion copper wire 8 is incorporated in the T-shape core 1, a lead wire 11 of the coil 5 is entangled to a pin terminal part 13 of the surface mounting terminal 3, for soldering. Then, covered with a U-shape lidded ring core 2, and jointed to the T-shape core 1 with a bonding agent 6, etc., a surface mounting inductor is obtained. In addition, after the coil 5 of the same winding number attached to the T-shape core 1, a specified gap is formed and adjusted at a joint part when the U-shape lidded ring core 2 is placed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子回路などに用
いられる表面実装型インダクタに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type inductor used for electronic circuits and the like.

【0002】[0002]

【従来の技術】まず、従来のこの種のインダクタについ
て、図3を参照して説明する。図3は、従来のインダク
タの一例を示す斜視図である。一般に、ドラムコアに巻
線を施してなる従来タイプのインダクタにおいては、図
3に示すように、ドラムコア7の底面に丸形のピン端子
9を圧入接着し、ドラムコア7の柱10部分に巻線を施
してコイル5を形成した後、前記ピン端子9にコイル5
のリード線11をからげ、半田付けを実施していた。
2. Description of the Related Art First, a conventional inductor of this type will be described with reference to FIG. FIG. 3 is a perspective view showing an example of a conventional inductor. Generally, in a conventional type inductor in which a winding is applied to a drum core, as shown in FIG. 3, a round pin terminal 9 is press-fitted and adhered to the bottom surface of the drum core 7, and the winding is applied to a column 10 of the drum core 7. After forming the coil 5 by applying the coil 5
And soldering was performed.

【0003】[0003]

【発明が解決しようとする課題】図3に示すコイルにお
いて、ピン端子9は、リフロー実装の端子構造を有して
いないため、高密度実装が出来ないという問題があっ
た。また、このインダクタに使用されるドラムコアは、
所定のドラムコア形状をしているため、巻線の調整でし
かインダクタンス値の調整ができないという問題があっ
た。
In the coil shown in FIG. 3, since the pin terminals 9 do not have a terminal structure for reflow mounting, there is a problem that high-density mounting cannot be performed. The drum core used for this inductor is
Since the drum core has a predetermined shape, there is a problem that the inductance value can be adjusted only by adjusting the winding.

【0004】従って、本発明の課題は、半田リフロー及
びリフロー実装に耐え得る端子構造を有し、かつ容易に
インダクタンス値の調整が可能な表面実装型インダクタ
を提供することにある。
Accordingly, an object of the present invention is to provide a surface mount type inductor having a terminal structure capable of withstanding solder reflow and reflow mounting and capable of easily adjusting an inductance value.

【0005】[0005]

【課題を解決するための手段】本発明は、断面が略T字
型のT字型コアの柱状部にコイルを巻き回し、断面が略
コ字型のふた付きリングコアを組み合わせた表面実装型
インダクタであって、前記T字型コアの鍔の平坦部側に
半田めっきを施した面実装用端子を接合し、前記コイル
のリード線を前記面実装用端子に接続したことを特徴と
する表面実装型インダクタである。
SUMMARY OF THE INVENTION The present invention relates to a surface mount type inductor in which a coil is wound around a columnar portion of a T-shaped core having a substantially T-shaped cross section and a ring core with a lid having a substantially U-shaped cross section is combined. Wherein a surface-mounting terminal plated with solder is joined to the flat portion side of the flange of the T-shaped core, and a lead wire of the coil is connected to the surface-mounting terminal. Type inductor.

【0006】本発明は、断面が略T字型のT字型コアと
断面が略コ字型のふた付きリングコアを組み合わせてな
る表面実装型インダクタであって、前記T字型コアと前
記ふた付きリングコアの組み合せ部にギャップを形成す
ることを特徴とする上記表面実装型インダクタである。
The present invention relates to a surface mount type inductor comprising a combination of a T-shaped core having a substantially T-shaped cross section and a ring core with a lid having a substantially U-shaped cross section. The surface mount type inductor described above, wherein a gap is formed in a combination portion of the ring core.

【0007】本発明においては、リフロー実装可能な端
子構造を有しているため、各種電子機器回路基板上での
高密度実装が可能なインダクタが得られる。
According to the present invention, since it has a terminal structure capable of reflow mounting, an inductor which can be mounted at high density on various electronic equipment circuit boards can be obtained.

【0008】また、T字型コアをコ字型のふた付きリン
グコアにて磁気シールドしている構造のため、従来のコ
イルに比べ磁束の漏れ密度が小さくなる。
Further, since the T-shaped core is magnetically shielded by a U-shaped ring core with a lid, the leakage density of magnetic flux is smaller than that of a conventional coil.

【0009】また、T字型コアのギャップの調整にて、
簡単にインダクタンス値の違った表面実装型インダクタ
を容易に製造可能となる。
Also, by adjusting the gap of the T-shaped core,
Surface mount type inductors having different inductance values can be easily manufactured.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施例を図面を参
照して詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0011】図1は、本発明の表面実装型インダクタの
一部破断斜視図であり、図2は、本発明の表面実装型イ
ンダクタの分解斜視図である。図1および図2に示すよ
うに、T字型コア1の鍔の平坦部12に表面実装用端子
3を結合し、融着銅線8にて巻線したコイル5を前記T
字型コア1に組み込んだ後に、表面実装用端子3のピン
端子部13にコイル5のリード線11をからげ、半田付
けを実施する。
FIG. 1 is a partially cutaway perspective view of the surface mount inductor of the present invention, and FIG. 2 is an exploded perspective view of the surface mount inductor of the present invention. As shown in FIGS. 1 and 2, the surface mounting terminal 3 is connected to the flat portion 12 of the flange of the T-shaped core 1, and the coil 5 wound with a fused copper wire 8 is used as the T coil.
After assembling into the character-shaped core 1, the lead wire 11 of the coil 5 is wrapped around the pin terminal portion 13 of the surface mounting terminal 3, and soldering is performed.

【0012】その後、コ字型のふた付きリングコア2を
被せ、T字型コア1と接着剤6等により接合させること
で、面実装用インダクタが得られる。
Thereafter, the U-shaped ring core 2 with a lid is covered and joined to the T-shaped core 1 with an adhesive 6 or the like to obtain a surface mount inductor.

【0013】また、同じ巻き数のコイル5を、T字型コ
ア1に装着した後、コ字型のふた付きリングコア2を被
せる際、その接合部に所定のギャップを形成・調整する
ことにより、何種類かのインダクタンス値が簡単に得ら
れる。
When the coil 5 having the same number of turns is mounted on the T-shaped core 1 and then covered with the U-shaped ring core 2 with a lid, a predetermined gap is formed and adjusted at the joint thereof. Several types of inductance values can be easily obtained.

【0014】[0014]

【発明の効果】本発明によれば、端子のからげ半田付け
が容易なリフロー実装の端子構造となり、回路基板実装
後の半田付け状態が確認できると共に、インダクタンス
値の調整が可能で、かつ容易な製造方法の面実装用イン
ダクタが得られる。
According to the present invention, the terminal structure of the reflow mounting, in which the terminal is easily soldered, can be checked for the soldering state after mounting on the circuit board, and the inductance value can be adjusted and easily. A surface mount inductor with a simple manufacturing method can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による表面実装型インダクタの一部破断
斜視図。
FIG. 1 is a partially cutaway perspective view of a surface mount inductor according to the present invention.

【図2】本発明による表面実装型インダクタの分解斜視
図。
FIG. 2 is an exploded perspective view of the surface mount inductor according to the present invention.

【図3】従来のインダクタの斜視図。FIG. 3 is a perspective view of a conventional inductor.

【符号の説明】[Explanation of symbols]

1 T字型コア 2 コ字型のふた付きリングコア 3 表面実装用端子 4 からげ半田部 5 コイル 6 接着剤 7 ドラムコア 8 融着銅線 9 ピン端子 10 柱 11 リード線 12 鍔の平坦部 13 ピン端子部 DESCRIPTION OF SYMBOLS 1 T-shaped core 2 Ring core with a U-shaped lid 3 Surface mounting terminal 4 Soldering part 5 Coil 6 Adhesive 7 Drum core 8 Fused copper wire 9 Pin terminal 10 Column 11 Lead wire 12 Flat part of flange 13 Pin Terminal

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 断面が略T字型のT字型コアの柱状部に
コイルを巻き回し、断面が略コ字型のふた付きリングコ
アを組み合わせた表面実装型インダクタであって、前記
T字型コアの鍔の平坦部側に半田めっきを施した面実装
用端子を接合し、前記コイルのリード線を前記面実装用
端子に接続したことを特徴とする表面実装型インダク
タ。
1. A surface-mounted inductor in which a coil is wound around a columnar portion of a T-shaped core having a substantially T-shaped cross section, and a ring core with a lid having a substantially U-shaped cross section is combined, wherein said T-shaped inductor is provided. A surface-mounted inductor, wherein a solder-plated surface-mounting terminal is joined to a flat portion of a core flange, and a lead wire of the coil is connected to the surface-mounting terminal.
【請求項2】 断面が略T字型のT字型コアと断面が略
コ字型のふた付きリングコアを組み合わせてなる表面実
装型インダクタであって、前記T字型コアと前記ふた付
きリングコアの組み合せ部にギャップを形成することを
特徴とする請求項1記載の表面実装型インダクタ。
2. A surface mount inductor comprising a combination of a T-shaped core having a substantially T-shaped cross section and a ring core having a substantially U-shaped cross section, wherein the T-shaped core and the ring core having the lid are combined. The surface mount type inductor according to claim 1, wherein a gap is formed in the combination portion.
JP17996096A 1996-06-19 1996-06-19 Surface mounting type inductor Pending JPH1012457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17996096A JPH1012457A (en) 1996-06-19 1996-06-19 Surface mounting type inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17996096A JPH1012457A (en) 1996-06-19 1996-06-19 Surface mounting type inductor

Publications (1)

Publication Number Publication Date
JPH1012457A true JPH1012457A (en) 1998-01-16

Family

ID=16074986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17996096A Pending JPH1012457A (en) 1996-06-19 1996-06-19 Surface mounting type inductor

Country Status (1)

Country Link
JP (1) JPH1012457A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010100444A (en) * 2000-05-02 2001-11-14 김영욱, 조영근 Chip commonmode chokekcoil and method of manufacturing the same
US6950002B2 (en) * 2003-11-13 2005-09-27 Sumida Corporation Inductance element
US8378773B2 (en) 2010-10-04 2013-02-19 Sumida Corporation Magnetic element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010100444A (en) * 2000-05-02 2001-11-14 김영욱, 조영근 Chip commonmode chokekcoil and method of manufacturing the same
US6950002B2 (en) * 2003-11-13 2005-09-27 Sumida Corporation Inductance element
US8378773B2 (en) 2010-10-04 2013-02-19 Sumida Corporation Magnetic element

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