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JPH10111426A - Optical fiber coupler - Google Patents

Optical fiber coupler

Info

Publication number
JPH10111426A
JPH10111426A JP26446196A JP26446196A JPH10111426A JP H10111426 A JPH10111426 A JP H10111426A JP 26446196 A JP26446196 A JP 26446196A JP 26446196 A JP26446196 A JP 26446196A JP H10111426 A JPH10111426 A JP H10111426A
Authority
JP
Japan
Prior art keywords
optical fiber
introducing hole
substrate
optical axis
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26446196A
Other languages
Japanese (ja)
Inventor
Hitoshi Hara
仁 原
Hideaki Yamagishi
秀章 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Electric Corp filed Critical Yokogawa Electric Corp
Priority to JP26446196A priority Critical patent/JPH10111426A/en
Publication of JPH10111426A publication Critical patent/JPH10111426A/en
Pending legal-status Critical Current

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  • Mechanical Coupling Of Light Guides (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable optical axis alignment of high accuracy and to simplify connection work by forming an optical fiber introducing hole tapered so that the front end of an optical fiber to be inserted is retained to a substrate. SOLUTION: The optical fiber introducing hole 2 tapered so that the front end of the optical fiber to be inserted is retained to the front end is formed by dry etching at the silicon substrate 1 or silicon laminated substrate from its one surface or both surfaces. This coupler is thus constituted in such a manner that the optical axis alignment may be executed simply by inserting the optical fiber into this introducing hole 2. According to this coupler, the front end of the optical fiber is detained by the tapered part and the optical axis alignment with high accuracy is automatically executed when the optical fiber is inserted into the introducing hole 2. In such a case, the introducing hole 2 is formed by manufacturing a mask at the time of dry, etc., with a resist and is formed by a dry etching device capable of controlling a side wall angle 3. The mask is thereafter removed and the substrate is subjected to dicing, thereby, connector parts having one piece each of the introducing hole 2 are completed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、光ファイバを接続
する結合器に関し、詳しくは光ファイバ接続における光
軸合わせ精度の向上および接続の簡易化のための改良に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coupler for connecting optical fibers, and more particularly, to an improvement in optical axis alignment accuracy in optical fiber connection and simplification of connection.

【0002】[0002]

【従来の技術】従来より光ファイバの接続においては図
6に示すようなV字型の溝(V溝)を利用した光軸位置
合わせ方式が多用されてきた。図6において、(a)は
側面図、(b)は断面図である。10はV溝が形成され
た支持部材、11,12が光ファイバである。光ファイ
バ12,13は外径が同じであり、V溝に乗せれば自ず
と両者の光軸が一致することになる。
2. Description of the Related Art Conventionally, in connecting optical fibers, an optical axis alignment method using a V-shaped groove (V groove) as shown in FIG. 6 has been frequently used. 6A is a side view, and FIG. 6B is a cross-sectional view. Reference numeral 10 denotes a support member having a V-shaped groove, and reference numerals 11 and 12 denote optical fibers. The optical fibers 12 and 13 have the same outer diameter, and if they are placed in the V-groove, the optical axes of both naturally coincide.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、このよ
うな方式においては、光軸合わせの精度を向上するには
V溝の作製精度の向上とファイバ固定時に最適な光軸合
わせの維持が必要であるが、作製精度固定時の光軸ずれ
の減少には限界があった。例えばシングルモード光ファ
イバでは、コア径が10μm前後のため、1μm以下と
いう厳しい光軸ずれ量が要求され、V溝を1μm以下の
精度で作製することには問題があった。
However, in such a system, in order to improve the optical axis alignment accuracy, it is necessary to improve the manufacturing accuracy of the V-groove and maintain the optimal optical axis alignment when fixing the fiber. However, there is a limit to the reduction of the optical axis shift when the manufacturing accuracy is fixed. For example, in a single mode optical fiber, since the core diameter is about 10 μm, a severe optical axis shift amount of 1 μm or less is required, and there is a problem in manufacturing the V-groove with an accuracy of 1 μm or less.

【0004】また、光軸を合わせるためには光ファイバ
を保持するV溝部の長さ(長手方向の長さ)は例えば1
0mm程度必要であるが、そうするとコネクタのサイズ
が大きくなるという問題があった。
In order to align the optical axes, the length (length in the longitudinal direction) of the V-groove holding the optical fiber is, for example, 1
About 0 mm is necessary, but this causes a problem that the size of the connector becomes large.

【0005】なお、図7に示すようなアーク放電などに
よる光ファイバ同士の直接融着接続では、拡大鏡や顕微
鏡でファイバの位置合わせを行うため、精度を挙げるこ
とが難しく、接続部の散乱などによる光の損失や、接続
作業者の技巧の差による損失のバラツキが発生するなど
の問題があった。
[0005] In the direct fusion splicing of optical fibers by arc discharge or the like as shown in FIG. 7, since the positioning of the fibers is performed by a magnifying glass or a microscope, it is difficult to improve the accuracy, and scattering of the connection portion is difficult. There are problems such as loss of light due to light and variations in loss due to differences in the skills of connection workers.

【0006】本発明の目的は、このような点に鑑み、シ
リコン(Si)等の基板の片面または両面から光ファイ
バ導入用の孔を形成し、この孔に光ファイバを挿入する
ことにより高精度な光軸合わせおよび接続作業の簡易性
を図った光ファイバ結合器を実現するものである。
In view of the foregoing, an object of the present invention is to form a hole for introducing an optical fiber from one or both surfaces of a substrate such as silicon (Si) and insert an optical fiber into this hole to achieve high precision. An object of the present invention is to realize an optical fiber coupler which achieves easy optical axis alignment and connection work.

【0007】[0007]

【課題を解決するための手段】このような目的を達成す
るために本発明では、シリコン基板またはシリコン系積
層基板の片面または両面からドライエッチングにより、
少なくとも先端部に、挿入される光ファイバの先端が係
止するようにテーパーを付けた光ファイバ導入孔を形成
し、この導入孔に光ファイバを挿入するだけで光軸合わ
せができるように構成したことを特徴とする。
According to the present invention, in order to achieve the above object, one side or both sides of a silicon substrate or a silicon-based laminated substrate is dry-etched.
At least at the end, an optical fiber introduction hole tapered so that the tip of the optical fiber to be inserted is locked is formed, and the optical axis can be aligned simply by inserting the optical fiber into this introduction hole. It is characterized by the following.

【0008】[0008]

【作用】シリコン基板またはシリコン系積層基板にテー
パーを付けた光ファイバ導入孔を形成する。この導入孔
に光ファイバを挿入すると光ファイバの先端部がテーパ
ー部分で係止し、作業者の技量に関係なく自動的に高精
度の光軸合わせができる。
A tapered optical fiber introduction hole is formed in a silicon substrate or a silicon-based laminated substrate. When the optical fiber is inserted into the introduction hole, the tip of the optical fiber is locked at the tapered portion, and the optical axis can be automatically aligned with high accuracy regardless of the skill of the operator.

【0009】[0009]

【発明の実施の形態】以下図面を用いて本発明を詳しく
説明する。図1は本発明に係る光ファイバ結合器の一実
施例を示す構成図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a configuration diagram showing one embodiment of the optical fiber coupler according to the present invention.

【0010】図において、1はシリコン基板、2は導入
孔である。導入孔2は側壁角を制御したドライエッチン
グにより形成される。側壁角(θ)3は図ではデフォル
メしてあるが、実際は数度以下である。また、同図
(b)は片面から加工した場合、同図(c)は両面から
加工した場合を示す。片面からの加工した導入孔は光フ
ァイバと発光素子や受光素子との接続を仮定しており、
両面から加工した導入孔は光ファイバ同士の接続を仮定
している。
In FIG. 1, reference numeral 1 denotes a silicon substrate, and 2 denotes an introduction hole. The introduction hole 2 is formed by dry etching with a controlled side wall angle. The side wall angle (θ) 3 is deformed in the figure, but is actually several degrees or less. Also, FIG. 2B shows a case where processing is performed from one side, and FIG. 3C shows a case where processing is performed from both sides. The introduction hole processed from one side assumes the connection between the optical fiber and the light emitting element or light receiving element,
The introduction holes processed from both sides are assumed to connect optical fibers.

【0011】ここでは片面からの導入孔の製作プロセス
の一例を図2に示す。半導体プロセスで一般的なフォト
リソ工程では、図2(a)に示すようにドライエッチン
グ時のマスクをレジストで作製し、側壁角が制御できる
ドライエッチング装置によって導入孔を形成する(同図
(b),(c))。その後、図2(c)に示すようにマ
スクを除去し、次に同図(e)のようにダイシングして
導入孔を1個ずつ有するコネクタ部品を完成する。
FIG. 2 shows an example of a process for producing an introduction hole from one side. In a photolithography process generally used in a semiconductor process, as shown in FIG. 2A, a mask for dry etching is made of a resist, and an introduction hole is formed by a dry etching apparatus capable of controlling a side wall angle (FIG. 2B). , (C)). Thereafter, the mask is removed as shown in FIG. 2 (c), and then dicing is performed as shown in FIG. 2 (e) to complete a connector part having one introduction hole at a time.

【0012】直径4インチのシリコン基板を用いた場
合、4mm角の正方形のコネクタ部品を仮定すると、1
枚のウエハから300個程度作製可能であり、半導体プ
ロセスを使用するため加工精度はサブμmオーダが得ら
れる。
When a silicon substrate having a diameter of 4 inches is used, assuming a square connector part of 4 mm square, 1
Approximately 300 wafers can be manufactured from a single wafer, and processing accuracy on the order of sub-μm can be obtained because a semiconductor process is used.

【0013】導入孔の形成方法としては、シリコン基板
を低温に冷却して加工の異方性を高めて高アスペクト比
の深穴を形成する低温RIEや誘導プラズマ(ヘリコン
プラズマ)等で加工の異方性を高める装置等ドライエッ
チングの利用が可能である。ウェットエッチングはマス
ク下へのオーバーエッチングがあり、加工の異方性の制
御に自由度がなく高アスペクト比の深穴加工は困難であ
る。
[0013] As a method of forming the introduction holes, the silicon substrate is cooled to a low temperature to enhance the anisotropy of the processing and a deep hole having a high aspect ratio is formed by low-temperature RIE or induction plasma (helicon plasma). It is possible to use dry etching such as a device for improving the anisotropy. Wet etching involves over-etching under the mask, and there is no flexibility in controlling the anisotropy of the processing, and it is difficult to form a deep hole with a high aspect ratio.

【0014】なお、光ファイバの導入孔2の加工は、図
3(a)に示すように上部から下部へのテーパーを均一
に形成する方式と、同図(b),(c)に示すように光
ファイバを保持するテーパーは無く先端部だけに光軸合
わせ用のテーパーを形成する方式とがある。
The processing of the introduction hole 2 of the optical fiber is performed by a method of forming a taper uniformly from the upper part to the lower part as shown in FIG. 3 (a), and as shown in FIGS. 3 (b) and 3 (c). There is a method of forming a taper for optical axis alignment only at the tip without a taper for holding the optical fiber.

【0015】一般的な光ファイバの外径は125μmで
あり、125μm+α(αは有意な大きさ)で導入孔マ
スクを設計して125μm+αの穴を形成するか、12
5μmのマスクでフォトリソ工程の露光でオーバー露光
して125μm+αの穴を形成する。先端部のテーパー
の形状は、基板温度やプラズマ強度等の制御によって曲
率無し(図3の(b))かまたは曲率有り(図3の
(c))のいずれかの孔を形成する。
The outer diameter of a general optical fiber is 125 μm, and an introduction hole mask is designed at 125 μm + α (α is a significant size) to form a hole of 125 μm + α or 12 μm + α.
A hole of 125 μm + α is formed by overexposure in a photolithography process using a 5 μm mask. The shape of the taper at the tip forms a hole with no curvature (FIG. 3B) or with a curvature (FIG. 3C) depending on the control of the substrate temperature and the plasma intensity.

【0016】光ファイバの光軸誤差は導入孔と光ファイ
バのコアの中心が一致していれば理論上は零となり、角
度誤差も零となる。しかしながら、光ファイバ同士の接
続では光ファイバの空隙に基づく損失が発生するため、
空隙間隔を小さく(μmオーダー)設定する必要があ
る。これは導入孔のテーパー部分を短くすることによっ
て実現できる。
The optical axis error of the optical fiber is theoretically zero if the introduction hole and the center of the core of the optical fiber coincide with each other, and the angular error is also zero. However, in connection between optical fibers, a loss due to the gap of the optical fiber occurs,
The air gap needs to be set small (μm order). This can be realized by shortening the tapered portion of the introduction hole.

【0017】なお、本発明の以上の説明は、説明および
例示を目的として特定の好適な実施例を示したに過ぎな
い。したがって本発明はその本質から逸脱せずに多くの
変更、変形をなし得ることは当業者に明らかである。
It is to be noted that the above description of the present invention has been presented by way of illustration and example only, and of particular preferred embodiments. Thus, it will be apparent to one skilled in the art that the present invention may be modified or modified in many ways without departing from its essentials.

【0018】例えば、シリコン基板にドライエッチング
で貫通孔を開ける形状については既に説明したが、孔の
テーパー加工形状やエッチング終了のストッパー層によ
る作製歩留りを向上させるためには、図4に示すように
Si,SiO2,Siの張り合わせウエハ基板を使用す
るとよい。
For example, the shape in which a through hole is formed in a silicon substrate by dry etching has already been described. However, in order to improve the production yield due to the tapered shape of the hole and the stopper layer at the end of etching, as shown in FIG. It is preferable to use a bonded wafer substrate of Si, SiO 2 and Si.

【0019】また、図5に示すようにストッパー層4の
SiO2の中心部にGe等をわずかにドープして屈折率
を高くすると、簡易的なマイクロレンズの働きを持つた
め、空隙に基づく損失を小さくすることができる。同様
の構造で発光素子や受光素子と組み合わせる方法もあ
る。
As shown in FIG. 5, when the refractive index is increased by slightly doping the center of SiO 2 of the stopper layer 4 with Ge or the like, the function of a simple microlens is achieved, so that the loss due to the gap is reduced. Can be reduced. There is also a method of combining a light emitting element and a light receiving element with a similar structure.

【0020】[0020]

【発明の効果】以上説明したように本発明によれば次の
ような効果がある。 (1) 従来のV溝方式に比べて、加工精度が向上できるた
め光軸ずれによる接続損失を少なくすることができる。
接続においても、導入孔に光ファイバを挿入することに
よって光ファイバ中心と導入孔の中心が簡単に一致する
ので、光軸ずれや角度ずれが最小限に抑えられ、接続時
の簡易性が確保でき、作業者による接続損失のバラツキ
も低減できる。 (2) Si系の材料を用い従来の半導体プロセス装置によ
り加工できるため、発光素子や受光素子の作製プロセス
との整合がとれ、それぞれの素子に組み込んで作製する
ことも可能である。
As described above, according to the present invention, the following effects can be obtained. (1) Since the processing accuracy can be improved as compared with the conventional V-groove method, connection loss due to optical axis shift can be reduced.
In connection, the center of the optical fiber and the center of the introduction hole are easily matched by inserting the optical fiber into the introduction hole, minimizing optical axis deviation and angle deviation, and ensuring simplicity during connection. In addition, the variation in connection loss caused by the operator can be reduced. (2) Since it can be processed by a conventional semiconductor processing apparatus using a Si-based material, it can be manufactured in a manner compatible with the manufacturing process of the light-emitting element and the light-receiving element, and can be incorporated into each element.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る光ファイバ結合器の一実施例を示
す構成図
FIG. 1 is a configuration diagram showing one embodiment of an optical fiber coupler according to the present invention.

【図2】作製プロセスを示す図FIG. 2 is a diagram showing a manufacturing process.

【図3】導入孔の詳細図FIG. 3 is a detailed view of an introduction hole.

【図4】本発明の他の実施例構成図FIG. 4 is a configuration diagram of another embodiment of the present invention.

【図5】本発明の更に他の実施例構成図FIG. 5 is a configuration diagram of still another embodiment of the present invention.

【図6】従来のV溝構造の結合器の一例を示す図FIG. 6 is a diagram showing an example of a conventional coupler having a V-groove structure.

【図7】従来の融着方式による光ファイバ接続を説明す
るための図である。
FIG. 7 is a view for explaining an optical fiber connection by a conventional fusion splicing method.

【符号の説明】[Explanation of symbols]

1 Si基板 2 貫通孔 3 側壁角 4 ストッパー層 Reference Signs List 1 Si substrate 2 Through hole 3 Side wall angle 4 Stopper layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】シリコン基板またはシリコン系積層基板の
片面または両面からドライエッチングにより、光ファイ
バの先端が係止するようにテーパーを付けた光ファイバ
導入孔を形成し、この導入孔に光ファイバを挿入したと
き光軸合わせができるように構成されたことを特徴とす
る光ファイバ結合器。
An optical fiber introduction hole tapered so that the tip of an optical fiber is locked is formed by dry etching from one or both surfaces of a silicon substrate or a silicon-based laminated substrate, and the optical fiber is inserted into the introduction hole. An optical fiber coupler configured to allow optical axis alignment when inserted.
JP26446196A 1996-10-04 1996-10-04 Optical fiber coupler Pending JPH10111426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26446196A JPH10111426A (en) 1996-10-04 1996-10-04 Optical fiber coupler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26446196A JPH10111426A (en) 1996-10-04 1996-10-04 Optical fiber coupler

Publications (1)

Publication Number Publication Date
JPH10111426A true JPH10111426A (en) 1998-04-28

Family

ID=17403543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26446196A Pending JPH10111426A (en) 1996-10-04 1996-10-04 Optical fiber coupler

Country Status (1)

Country Link
JP (1) JPH10111426A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001096914A3 (en) * 2000-06-13 2003-05-30 Siwave Inc High density fiber terminator/connector
US6695492B2 (en) * 2000-03-30 2004-02-24 Seiko Epson Corporation Optical module and production method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6695492B2 (en) * 2000-03-30 2004-02-24 Seiko Epson Corporation Optical module and production method therefor
WO2001096914A3 (en) * 2000-06-13 2003-05-30 Siwave Inc High density fiber terminator/connector
US6595698B2 (en) 2000-06-13 2003-07-22 Siwave, Inc. High density fiber terminator/connector

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