JPH0992744A - Circuit device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit device which can deal with multichannels easily and a method for manufacturing the circuit device with high productivity. SOLUTION: The circuit device comprises a body 23 where devices 2, 3 are mounted on a metal board 11 having a first connecting part 12, and a case 13 having a second connecting part 15 and fixed to the metal board 11. The circuit device is manufactured by mounting the devices 2, 3, respectively, on the metal board 11 connected through the first connecting part 12, fixing the case 13 connected through the second connecting part 15 to the metal board 11, and then separating the first and second connecting parts 12, 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit device such as a hybrid integrated circuit device having a case and a manufacturing method thereof.

[0002]

2. Description of the Related Art Recently, in a hybrid integrated circuit device, an electric component such as a semiconductor is mounted on a metal substrate, an upper portion of the hybrid integrated circuit device is covered with a case, and the case is fixed to the metal substrate with an adhesive. An example of the above-described conventional hybrid integrated circuit device will be described below with reference to the drawings. FIG. 9A is a perspective view of a conventional hybrid integrated circuit device, and FIG. 9B is a perspective view of the hybrid integrated circuit device without a case. In FIG. 9, 1 is a metal substrate, 2 is a power transistor, and 3 is I.
C, 4 are lead terminals for connection with an external circuit, 5 is a wire for connecting the semiconductor elements of the power transistor 2 and IC 3 and the conductive foil of the metal substrate 1, 6 is a case, 7 is a conventional hybrid integrated circuit device, and 8 is A hole for a mounting screw that is provided in the case 6 of the hybrid integrated circuit device 7 and is mounted on a radiator or the like is shown.

In this method for manufacturing the hybrid integrated circuit device 7, electrical components such as the power transistor 2 and the IC 3 are mounted on the metal substrate 1, and the wires 5 are electrically connected to the conductive foil of the metal substrate 1 for connection. After the lead terminals 4 are soldered and the assembly is completed, the case 6 is adhered to the metal substrate 1 with an adhesive to complete the assembly of the hybrid integrated circuit device 7.

[0004]

However, the conventional hybrid integrated circuit device as described above has a problem of poor productivity because it is manufactured as a single product. Also, it has a problem that it is difficult to support multiple channels. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a circuit device which has good productivity and is easily compatible with multiple channels, and a manufacturing method thereof.

[0005]

A circuit device according to claim 1 is
It is provided with a circuit device body in which components are mounted on a substrate having a first dividing connection portion, and a case having a second dividing connection portion and attached to the substrate. According to the circuit device of the first aspect, since the plurality of circuit device bodies and the case can be produced together by assembling, the multi-channel circuit device can be easily configured. Further, since the first dividing connecting portion and the second dividing connecting portion divide into individual pieces with the case attached to the substrate, the productivity can be doubled.

A circuit device according to a second aspect of the present invention is the circuit device according to the first aspect, wherein the case is provided with a screw hole for pressing the head of the screw against the second dividing connection portion. According to the circuit device of the second aspect, in addition to the effect of the first aspect, the mounting of the circuit device can be simplified and a circuit device with high productivity can be obtained when configuring the circuit device for multi-channels. .

A third aspect of the present invention is the circuit device according to the first aspect, wherein the second dividing connecting portion of the case is formed apart from the mounting surface of the case. According to the circuit device of the third aspect, in addition to the effect of the first aspect, it is possible to provide a circuit device that does not require post-processing such as deburring. Claim 4
The circuit device according to claim 1, wherein the first dividing connection portion of the substrate is constituted by a V groove formed on the upper and lower surfaces of the substrate, and the depth of the upper V groove and the depth of the lower V groove are defined. It is different.

According to the circuit device of claim 4, in addition to the effect of claim 1, when the base material of the substrate is made of metal, the insulation distance between the base material and the conductive foil is increased to increase the withstand voltage. In addition to the above, the force at the time of bending and cutting can be reduced, and the number of times of bending can be reduced. A circuit device according to a fifth aspect is the circuit device according to the first aspect, wherein the first dividing connection portion of the substrate is formed by a V groove formed on the upper and lower surfaces of the substrate, and an opening angle between the upper V groove and the lower V groove. Is different.

According to the circuit device of claim 5, in addition to the effect of claim 1, it is possible to increase the insulation distance between the base material and the conductive foil and increase the withstand voltage when the base material of the substrate is made of metal. In addition, it is possible to increase the bending angle when the first dividing connecting portion of the substrate is bent and divide, and it is possible to reduce the number of times of bending for dividing.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a circuit device, wherein components are mounted on a plurality of boards that are continuous through a first dividing connecting portion, and a case connected by the second dividing connecting portion is used as a substrate. And then the first split connecting portion and the second split connecting portion are split. According to the method of manufacturing a circuit device of claim 6, since the circuit device in which the case is attached to the board on which the component is mounted is manufactured together and divided in the final step, the loss of the transport system is eliminated and the productivity is doubled. can do. Further, since the division is performed after the case is attached, the cutting dust such as the metal of the substrate at the time of division does not enter the circuit device, and the circuit device of high quality can be provided.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A hybrid integrated circuit device according to a first embodiment of the present invention will be described in detail below with reference to FIGS. FIG. 1A is a perspective view of a case of the hybrid integrated circuit device according to the first embodiment, FIG. 1B is a perspective view of the contents of the hybrid integrated circuit device, that is, a circuit device body, and FIG. 2A is a case. FIG. 4B is a side view of the case, FIG. 3 is a side view of the circuit device body that has been assembled, and FIG. 4A is a side view where the case is bonded after the circuit device body has been assembled. (B) shows the top view.

In FIGS. 1 to 4, 9 is one hybrid integrated circuit device, 10 is the other hybrid integrated circuit device, 1
Reference numeral 1 is a metal substrate co-fabricated, 12 is a first dividing connecting portion formed by a V groove provided in the metal substrate 11, 2 is a power transistor mounted on the metal substrate 11, and 3 is on the metal substrate 11. The mounted IC, 4 is a lead terminal for connecting to an external circuit, 5 is a wire connecting the semiconductor element of the power transistor 2 and the IC 3 and the conductive foil of the metal substrate 11,
13 is a co-acquired case, 14 is a hybrid integrated circuit device 9,
Reference numeral 10 denotes a mounting screw hole provided in each of the co-acquired cases 13, 15 denotes a second dividing connecting portion for connecting the individual pieces of the co-acquired cases 13, and 23 denotes a circuit device body.

That is, this hybrid integrated circuit device has a first
The circuit device main body 23 in which components such as the power transistor 2 are mounted on the metal substrate 11 having the dividing connection portion 12 and the case 13 having the second dividing connection portion 15 and attached to the metal substrate 11. I have it. The case 13 is attached to the metal substrate 11 with an adhesive. A screw is inserted into the hole 14 to attach the hybrid integrated circuit device to a radiator or the like.
Also, with the case 13 attached to the metal substrate 11, as shown in FIG. 4, the first dividing connecting portion 12 and the second dividing connecting portion 15 are aligned in a straight line so that they can be divided by bending. Side by side, the second dividing connection portions 15 are located on both sides of the first dividing connection portion 12.

Next, a method of manufacturing this hybrid integrated circuit device will be described. That is, first, as shown in FIG. 3, the metal substrate 11 co-acquired through the first connecting portion 12 for division.
The electric components such as the power transistor 2 and the IC 3 are mounted on the upper part, and the assembly is completed. The case 13 co-acquired through the second dividing connection portion 15 shown in FIG. 2 is attached to the metal substrate 11 by an adhesive so that the divisible hybrid integrated circuit device 9 or 10 can be obtained as shown in FIG. Assembly is completed in the co-picking state. After the assembly is completed, as shown in FIG. 5, the first dividing connecting portion 12 of the V groove of the metal substrate 11 and the second dividing connecting portion 15 of the case 13 are used as fulcrums and bent as shown by an arrow. Force f is applied to repeat the bending motion, and the metal substrate 11 and the case 1 are simultaneously moved as shown in FIG.
Divide 3.

Further, as shown in FIG. 2B, the case 13
The second dividing connecting portion 15 of the metal substrate 1 of the case 13
If it is formed away from the mounting surface for No. 1 by the dimension a, the dimension a is secured to be equal to or higher than the height of the flash, so that post-processing such as deburring of the second split connection portion 15 of the case 13 after splitting is required. It is possible to provide a hybrid integrated circuit device having excellent productivity.

According to this embodiment, since a plurality of circuit device bodies 23 and the case 13 can be produced together by assembling until completed, a multi-channel compatible circuit device can be easily constructed. Further, since the first dividing connecting portion 12 and the second dividing connecting portion 15 are used to divide the metal substrate 11 into the individual pieces with the case 13 attached, productivity can be doubled.

Further, according to the method of manufacturing the hybrid integrated circuit device, since the hybrid integrated circuit device in which the case 13 is attached to the metal substrate 11 on which the components are mounted is manufactured in the same process and divided in the final step, the transport system loss is caused. Can be doubled and productivity can be doubled. Further, since the division is performed after the case 13 is attached, the cutting dust of the metal or the like of the metal substrate 11 at the time of division does not enter the hybrid integrated circuit device, and a high quality hybrid integrated circuit device can be provided.

The first dividing connection portion 12 and the second dividing connection portion 12
By changing the cutting method of the dividing connection portion 15 to a carbon dioxide gas laser, a cutting process, a die, or the like, it is possible to divide the first dividing connection portion 12 of the metal substrate 11 without being processed into a V groove or the like. FIG. 7 shows a second embodiment of the present invention. That is, in this hybrid integrated circuit device, the case 13 is provided with a screw hole 21 for pressing the head of a screw (not shown) against the second dividing connection portion 15 of the case 13.
Two second connecting portions 15 for division are formed corresponding to each screw hole 21.

According to this embodiment, when the hybrid integrated circuit device in the co-pickup state is mounted on a radiator or the like, the screw (not shown) for mounting the hybrid integrated circuit device is shared by the screw holes 21, and the screw is It is possible to reduce the number from four required when inserting into the hole 14 and attaching to two, simplifying the attaching, and constructing a hybrid integrated circuit device with good productivity.

A third embodiment of the present invention is shown in FIG. That is, in FIG. 8, 16 is a conductive foil of the metal substrate 11, 17 is an insulating layer of the metal substrate 11, and 18 is the metal substrate 11.
Base material, 19 is a V groove on the side of the base material 14 of the first dividing connection portion 12 of the metal substrate 11, and 20 is the metal substrate 11.
Is a V-shaped groove on the side of the conductive foil 12 of the first dividing connection portion 12.

It is possible to increase the dimensional distance d from the end face of the metal substrate 11 to the conductive foil 16 by making the groove depth dimension b of the V-groove 20 smaller than the thickness of the insulating layer 17 after securing it. it can. That is, the conductive foil 16 and the metal substrate 1
It is possible to increase the withstand voltage of the first base material 18. Further, by increasing the V groove depth dimension c of the V groove 19, the force at the time of bending and cutting can be reduced, and the number of times of bending can be reduced.

Next, the dimension distance d from the end face of the metal substrate 11 to the conductive foil 16 can be increased by reducing the groove angle f of the V groove 20, and the base material of the conductive foil 16 and the metal substrate can be increased. It is possible to increase the withstand voltage with respect to 18. In addition, by increasing the V groove angle e of the V groove 19, the bending angle can be increased and the number of times of bending can be reduced.

According to this embodiment, the reliability is high,
A hybrid integrated circuit device with good productivity can be constructed. In the present invention, the circuit device is a hybrid integrated circuit, but other circuit devices may be used, and the substrate is not limited to the metal substrate of the above-described embodiment.

[0024]

According to the circuit device of the first aspect, since a plurality of circuit device bodies and cases can be produced together by assembly until completed, a circuit device corresponding to multiple channels can be easily constructed. Also, with the case attached to the board, the first
Since the dividing connection portion and the second dividing connection portion divide into individual pieces, there is an effect that the productivity can be doubled.

According to the second aspect of the circuit device, in the first aspect, the case is provided with the screw hole for pressing the head of the screw against the second dividing connecting portion of the case. Therefore, the effect of the first aspect is provided. Besides, in the case of configuring a circuit device compatible with multiple channels, the mounting of the circuit device can be simplified, and a circuit device with good productivity can be obtained. According to the circuit device of the third aspect, in the first aspect, the second connecting portion for division of the case is formed apart from the mounting surface of the case. Therefore, in addition to the effect of the first aspect, deburring and the like are achieved. A circuit device that does not require post-processing can be provided.

According to a fourth aspect of the present invention, there is provided the circuit device according to the first aspect, wherein the first dividing connection portion of the substrate is formed by the V groove formed on the upper and lower surfaces of the substrate, and the depth and the depth of the upper V groove are lower. Since the depth of the V-shaped groove on the side is made different, in addition to the effect of claim 1, when the base material of the substrate is made of metal, it is possible to increase the insulation distance between the base material and the conductive foil and increase the withstand voltage. In addition to being possible, the force at the time of bending and cutting can be reduced, and the number of times of bending can be reduced.

According to a fifth aspect of the circuit device of the present invention, in the first aspect, the first dividing connecting portion of the substrate is constituted by the V groove formed on the upper and lower surfaces of the substrate, and the upper V groove and the lower V groove are formed. Since the opening angle of the V groove is different, in addition to the effect of claim 1,
When the base material of the substrate is made of metal, it becomes possible to increase the insulation distance between the base material and the conductive foil to increase the withstand voltage, and at the time of bending and dividing the first dividing connection portion of the substrate. The bending angle can be increased, and the number of times of bending for division can be reduced.

According to the method of manufacturing a circuit device of claim 6,
The components are mounted on a plurality of boards that are continuous through the first connecting portion for division, the cases connected by the second connecting portion for attachment are attached to each of the boards, and then the first connecting portion and the first connecting portion Since it is characterized by dividing the connecting portion for division of 2, the circuit device in which the case is attached to the board on which the components are mounted is manufactured together, and is divided in the final step, so that there is no loss in the transfer system and production You can double your sex. Further, since the division is performed after the case is attached, the cutting dust such as the metal of the substrate at the time of division does not enter the circuit device, and the circuit device of high quality can be provided.

[Brief description of drawings]

FIG. 1 shows a hybrid integrated circuit device according to a first embodiment of the present invention, (A) is a perspective view of a case thereof, and (B) is a perspective view of a hybrid integrated circuit device main body.

2A and 2B show a case taken together, FIG. 2A is a top view thereof, and FIG. 2B is a side view thereof.

FIG. 3 is a side view of a mounted board.

FIG. 4 shows a hybrid integrated circuit device, FIG. 4A is a side view of the hybrid integrated circuit device in a co-pickup state, and FIG.

FIG. 5 is a side view for explaining division of a hybrid integrated circuit device taken together.

FIG. 6 is a side view showing the individual hybrid integrated circuit device after being divided.

FIG. 7 is a top view of a case having a common screw hole according to the second embodiment.

FIG. 8 shows a metal substrate of a third embodiment, (A) is a top view of a V groove portion of the metal substrate, and (B) is a side view of the V groove portion of the metal substrate.

9A and 9B show a conventional hybrid integrated circuit device, FIG. 9A is a perspective view thereof, and FIG. 9B is a perspective view with a case removed.

[Explanation of symbols]

 2 parts power transistor 3 parts IC 9 hybrid integrated circuit device 10 hybrid integrated circuit device 11 metal substrate 12 first dividing connection portion 13 case 15 second dividing connection portion 16 conductive foil of metal substrate 17 of metal substrate Insulation layer 18 Base material of metal substrate 19 V groove 20 V groove 21 Screw hole 23 Circuit device body

Claims (6)

[Claims] 1. A circuit device comprising: a circuit device body in which components are mounted on a substrate having a first dividing connection portion; and a case having a second dividing connection portion and attached to the substrate. 2. The circuit device according to claim 1, wherein a screw hole for pressing the head portion of the screw is provided on the second dividing connection portion of the case in the case. 3. The circuit device according to claim 1, wherein the second dividing connection portion of the case is formed apart from a mounting surface of the case. 4. The first dividing connection portion of the substrate is constituted by V grooves formed on the upper and lower surfaces of the substrate, and the depth of the upper V groove and the depth of the lower V groove are made different. The circuit device according to claim 1. 5. The first dividing connecting portion of the substrate is constituted by a V groove formed on the upper and lower surfaces of the substrate, and an opening angle between the upper V groove and the lower V groove is different. 1. The circuit device according to 1. 6. A component is mounted on each of a plurality of boards that are continuous through a first dividing connecting portion, a case connected by a second dividing connecting portion is attached to each of the boards, and then the first connecting portion is mounted. A method of manufacturing a circuit device, characterized in that one division connecting portion and the second division connecting portion are divided.