JPH0983194A - Component mounting method - Google Patents
Component mounting methodInfo
- Publication number
- JPH0983194A JPH0983194A JP7235077A JP23507795A JPH0983194A JP H0983194 A JPH0983194 A JP H0983194A JP 7235077 A JP7235077 A JP 7235077A JP 23507795 A JP23507795 A JP 23507795A JP H0983194 A JPH0983194 A JP H0983194A
- Authority
- JP
- Japan
- Prior art keywords
- component
- parts
- supply unit
- mounting
- stock
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 abstract description 25
- 239000000758 substrate Substances 0.000 description 4
- 240000001973 Ficus microcarpa Species 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子部品実装機等にお
ける部品実装方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method in an electronic component mounting machine or the like.
【0002】[0002]
【従来の技術】近年、エレクトロニクス化の進展に伴
い、電子部品実装機においても一層の生産性の向上が必
要となっている。2. Description of the Related Art In recent years, with the progress of electronics, it is necessary to further improve the productivity of electronic component mounting machines.
【0003】以下、従来例の電子部品実装機について、
図2、図3、図4を参照しながら説明する。The electronic component mounter of the conventional example will be described below.
This will be described with reference to FIGS. 2, 3 and 4.
【0004】図2に電子部品実装機の概略構成を示す。
1はロータリヘッドで、複数備えたノズル2にて部品の
実装を行なう。3はXYテーブルで、部品を実装する基
板を固定し、ノズル2の下に基板を位置決めする。4
L、4Rは部品供給部で、それぞれ複数のパーツカセッ
ト(部品供給手段)5が搭載されており、所望のパーツ
カセット5をノズル2の下に位置決めする。7はコント
ローラで、電子部品実装機全体の制御を行なう。10は
部品切れ発生を作業者に知らせる表示器、11は基板の
搬入手段、12は基板の搬出手段である。FIG. 2 shows a schematic configuration of an electronic component mounter.
Reference numeral 1 denotes a rotary head, which mounts components with a plurality of nozzles 2 provided. An XY table 3 fixes a board on which components are mounted and positions the board under the nozzle 2. Four
L and 4R are component supply units, each of which is equipped with a plurality of part cassettes (component supply means) 5 and positions a desired part cassette 5 under the nozzle 2. A controller 7 controls the entire electronic component mounter. Reference numeral 10 is an indicator for notifying the operator of the occurrence of component shortage, 11 is a board loading means, and 12 is a board unloading means.
【0005】次に、図3を参照して部品供給部4L、4
R(以下、単にL、Rと記す)の動作を説明する。図3
(a)は各部品供給部L、Rにおけるパーツカセット5
の配列状態を示す。部品供給部L、Rはともに全く同一
の部品配列としてある。これは、一方の部品供給部L又
はRで生産中に部品切れとなっても他方の部品供給部R
又はLで生産を継続するためである。図3(b)は生産
中の部品切れ発生時の部品供給部L、Rの動きを示す。
(1)に示す状態は部品供給部Lが動作位置で生産中で
あり、部品供給部Rは部品供給部Lに干渉しない部品補
充位置に位置している。ここで、部品切れが発生すると
(2)の状態になる。すなわち部品供給部Lが部品補充
位置に移動し、部品供給部Rが動作位置に移動し、生産
を継続する。作業者は、部品供給部Lの補充を行なう。
さらに、部品切れが発生すると(3)の状態になる。す
なわち部品供給部Rが部品補充位置に移動し、部品供給
部Lが動作位置に移動し、生産を継続する。このように
部品供給部L、Rを入れ換えることで部品切れによる稼
働率の低下を防止している。Next, referring to FIG. 3, the component supply parts 4L, 4
The operation of R (hereinafter, simply referred to as L and R) will be described. FIG.
(A) is a parts cassette 5 in each parts supply section L, R
Shows the array state of. Both the component supply units L and R have the same component arrangement. This is because even if one of the component supply units L or R runs out of parts during production, the other component supply unit R or R
Or to continue production at L. FIG. 3B shows the movement of the component supply units L and R when a component shortage occurs during production.
In the state shown in (1), the component supply unit L is in production at the operating position, and the component supply unit R is located at the component replenishment position where it does not interfere with the component supply unit L. Here, if the parts are out of state, the state of (2) is brought about. That is, the component supply unit L moves to the component replenishment position, the component supply unit R moves to the operating position, and production is continued. The worker replenishes the component supply unit L.
Furthermore, when the parts run out, the state of (3) occurs. That is, the component supply unit R moves to the component replenishment position, the component supply unit L moves to the operating position, and production is continued. In this way, by switching the component supply units L and R, it is possible to prevent a decrease in the operating rate due to a component shortage.
【0006】以上のような複数の部品供給部を用いた従
来の部品実装方法について、図4のフローチャートを参
照して詳しく説明する。部品供給部Lからノズル2にて
部品を吸着し(ステップ#101)、次に部品が有る
か、部品切れかを判定し(ステップ#102)、部品が
有ればXYテーブル3に固定された基板に部品を実装す
る(ステップ#103)。次に、基板に対してこの実装
機で実装すべきすべての部品の実装が終了した(以下、
EOPと称する)か否かを判定し(ステップ#10
4)、EOPになるまでステップ#101〜#103の
動作を繰り返す。EOPになれば、実装済み基板を搬出
し、次の基板を搬入する(ステップ#105)。A conventional component mounting method using a plurality of component supply units as described above will be described in detail with reference to the flowchart of FIG. A component is sucked from the component supply unit L by the nozzle 2 (step # 101), then it is determined whether or not there is a component (step # 102), and if there is a component, it is fixed to the XY table 3. Components are mounted on the board (step # 103). Next, the mounting of all the components that should be mounted on this board with this mounting machine is completed (hereinafter,
It is determined whether or not it is called EOP (step # 10).
4), the operations of steps # 101 to # 103 are repeated until the EOP is reached. When the EOP is reached, the mounted substrate is unloaded and the next substrate is loaded (step # 105).
【0007】一方、ステップ#102で部品切れであっ
た場合、部品供給部Lを補充位置へ移動し(ステップ#
106)、部品供給部Rで生産を継続する(ステップ#
107〜#111)。ここで、ステップ#107〜#1
11は、ステップ#101〜#105と同様の処理であ
る。また、ステップ#107〜#111中のステップ#
108で部品切れであった場合、部品供給部Rを補充位
置へ移動するとともに(ステップ#112)、先に部品
切れとなった部品供給部Lに対して部品補充中であるか
否かを判定し(ステップ#113)、部品補充中であれ
ば部品切れにより生産を停止し(ステップ#121)、
部品補充が完了していれば、ステップ#101に戻って
部品供給部Lで生産を継続する。On the other hand, if the parts are out of stock in step # 102, the parts supply section L is moved to the replenishment position (step #
106), and continue production at the component supply unit R (step #
107- # 111). Here, steps # 107 to # 1
Step 11 is the same process as steps # 101 to # 105. In addition, step # in steps # 107 to # 111
If the parts are out of stock in step 108, the parts supply unit R is moved to the replenishment position (step # 112), and it is determined whether or not parts are being replenished for the parts supply unit L that was previously out of parts. (Step # 113), and if the parts are being replenished, the production is stopped due to the parts running out (step # 121),
If the parts replenishment is completed, the process returns to step # 101 to continue the production at the parts supply unit L.
【0008】[0008]
【発明が解決しようとする課題】しかしながら、上記の
ような実装方法では、作業者による部品補充が即座に行
われなければ、両部品供給部L、Rがともに部品切れと
なって生産停止する恐れがあり、稼働率が低下するとい
う問題があった。特に、夜間等作業者が少ない場合に長
時間連続運転が困難であるという問題があった。However, in the mounting method as described above, if the worker does not immediately replenish the parts, both the parts supply sections L and R may run out of parts and production may stop. However, there was a problem that the utilization rate decreased. In particular, there is a problem that continuous operation for a long time is difficult when there are few workers such as at night.
【0009】本発明は、上記従来の問題点に鑑み、部品
切れによる生産停止を減らし、長時間連続運転ができ、
実装機の稼働率を向上できる部品実装方法を提供するこ
とを目的としている。In view of the above-mentioned conventional problems, the present invention reduces production stoppages due to shortage of parts and enables long-term continuous operation,
It is an object of the present invention to provide a component mounting method capable of improving the operation rate of a mounting machine.
【0010】[0010]
【課題を解決するための手段】本発明の部品実装方法
は、複数の部品供給部を選択的に用いて部品実装する部
品実装方法において、部品切れ発生時に複数の部品供給
部で同じ部品が部品切れであるか否かを判定する工程
と、部品切れでない部品供給部から部品を供給して部品
実装を行なう工程とを有することを特徴とする。The component mounting method of the present invention is a component mounting method in which a plurality of component supply units are selectively used to mount components, and the same component is copied in a plurality of component supply units when a component shortage occurs. The method is characterized by including a step of determining whether or not the product is out of stock, and a step of supplying a component from a component supply unit that is not out of stock and mounting the component.
【0011】また、複数の部品供給部を有し、一方の部
品供給部で部品実装中に何れかの部品に部品切れが生じ
るとその部品供給部を補充位置に待機させて部品補充を
行い、他方の部品供給部で部品実装を継続する部品実装
方法において、部品実装中に部品切れが生じたときに補
充位置にある部品供給部に対する部品補充がなされたか
否かを判定する工程と、部品補充がなされていないとき
に部品切れとなった部品が全ての部品供給部で部品切れ
であるか否かを判定する工程と、部品切れとなった部品
が補充位置にある部品供給部に存在する場合にその部品
は補充位置の部品供給部で部品実装する工程とを有する
ことを特徴とする。Further, a plurality of component supply units are provided, and when one of the component supply units runs out of components during component mounting, the component supply unit waits at the replenishment position for component replenishment, In a component mounting method for continuing component mounting in the other component supply unit, a step of determining whether or not the component supply unit at the replenishment position has been replenished when a component shortage occurs during component mounting, and component replenishment If the parts that have run out of parts when all the parts are out of stock are checked, and if the parts that have run out of parts exist in the parts supply part at the replenishment position In addition, the component has a step of mounting the component in the component supply unit at the replenishment position.
【0012】[0012]
【作用】本発明の部品実装方法によれば、部品切れ発生
時に複数の部品供給部すべてで当該部品が部品切れかど
うかを判定し、いずれかの部品供給部でその部品が部品
切れでなければその部品供給部から部品を供給して部品
実装を行なうので、部品供給部の入れ換えのために多少
の生産タクト低下はあっても生産停止することなく、連
続して部品実装を継続することができ、部品実装機の稼
働率を向上することができる。According to the component mounting method of the present invention, when a component shortage occurs, all of the plurality of component supply units determine whether or not the component is out of stock. Since the parts are supplied from the parts supply part to mount the parts, the parts can be continuously mounted without stopping the production even if the production tact is slightly reduced due to the replacement of the parts supply part. It is possible to improve the operation rate of the component mounter.
【0013】[0013]
【実施例】以下、本発明の部品実装方法の一実施例につ
いて、図1を参照して説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the component mounting method of the present invention will be described below with reference to FIG.
【0014】なお、部品実装機の構成については、従来
例において図2を参照して説明したものと同一であり、
その説明を援用する。The structure of the component mounter is the same as that described in the conventional example with reference to FIG.
The explanation is cited.
【0015】部品実装方法について、図1のフローチャ
ートを参照して説明する。部品供給部Lからノズル2に
て部品を吸着し(ステップ#1)、次に部品が有るか、
部品切れかを判定し(ステップ#2)、部品が有ればX
Yテーブル3に固定された基板に部品を実装する(ステ
ップ#3)。次に、基板に対してこの実装機で実装すべ
きすべての部品の実装が終了した(以下、EOPと称す
る)か否かを判定し(ステップ#4)、EOPになるま
でステップ#1〜#3の動作を繰り返す。EOPになれ
ば、実装済み基板を搬出し、次の基板を搬入する(ステ
ップ#5)。The component mounting method will be described with reference to the flowchart of FIG. The component 2 is sucked from the component supply unit L by the nozzle 2 (step # 1).
It is judged whether the parts are out (step # 2), and if there are parts, X
Components are mounted on the board fixed to the Y table 3 (step # 3). Next, it is determined whether or not all the components to be mounted by the mounting machine have been mounted on the board (hereinafter referred to as EOP) (step # 4), and steps # 1 to # are performed until the EOP is reached. The operation of 3 is repeated. When the EOP is reached, the mounted board is unloaded and the next board is loaded (step # 5).
【0016】ステップ#2で部品切れであった場合、部
品供給部Lを補充位置へ移動し(ステップ#6)、部品
供給部Rで生産を継続する(ステップ#7〜#11)。
ここで、ステップ#7〜#11は、ステップ#1〜#5
と同様の処理である。また、ステップ#7〜#11中の
ステップ#8で部品切れであった場合、部品供給部Rを
補充位置へ移動するとともに(ステップ#12)、先に
部品切れとなった部品供給部Lに対して部品補充中であ
るか否かを判定する(ステップ#13)。部品補充が完
了していれば、ステップ#1に戻って部品供給部Lでの
生産を継続する(ステップ#1〜#5)。If the parts are out of stock in step # 2, the parts supply section L is moved to the replenishment position (step # 6), and the parts supply section R continues production (steps # 7 to # 11).
Here, steps # 7 to # 11 are steps # 1 to # 5.
This is the same processing as. In addition, if the parts are out of stock in step # 8 of steps # 7 to # 11, the parts supply unit R is moved to the replenishment position (step # 12), and the parts supply unit L that has previously run out of parts is placed. On the other hand, it is determined whether or not parts are being replenished (step # 13). If the parts replenishment is completed, the process returns to step # 1 to continue the production in the parts supply unit L (steps # 1 to # 5).
【0017】一方、ステップ#13の判定で先に部品切
れとなった部品供給部Lに対して未だ部品補充中であっ
た場合、部品供給部Lで部品切れとなった部品と、部品
供給部Rで部品切れとなった部品が別々の部品であるか
否かの判定を行い(ステップ#14)、同一の部品であ
れば当該部品の実装は不可能であるため、部品切れによ
り生産を停止する(ステップ#21)。一方、ステップ
#14の判定で別々の部品であると判定した場合、部品
供給部L、Rの両方から選択的に部品を吸着する(ステ
ップ#15)。ここでは、例えば図3で、部品供給部L
の部品Aが部品切れ、部品供給部Rの部品Bが部品切れ
となった場合、部品供給部L、Rにそれぞれ部品B、部
品Aがあれば、生産に必要な部品は部品供給部に存在し
ており、生産を停止する必要はないので、部品供給部L
から部品Bを、部品供給部Rから部品A、C〜Nを吸着
する。次に部品が有るか、部品切れかを判定し(ステッ
プ#16)、部品切れであれば、ステップ#14と同様
に他方の部品供給部に当該部品があるか否かを判定し
(ステップ#20)、部品があればステップ#15に戻
って生産を継続し、部品がなければステップ#21に移
行して部品切れにより生産を停止する。また、ステップ
#16の判定で部品があれば、XYテーブル3に固定さ
れた基板に部品を実装し(ステップ#17)、基板に対
してこの実装機で実装すべきすべての部品の実装が終了
した(以下、EOPと称する)か否かを判定し(ステッ
プ#18)、EOPになるまでステップ#15〜#17
の動作を繰り返す。EOPになれば、実装済み基板を搬
出し、次の基板を搬入する(ステップ#19)。On the other hand, if the parts supply unit L that has run out of parts in the determination in step # 13 is still being replenished with parts, the parts that have run out of parts in the parts supply unit L and the parts supply unit It is judged whether or not the parts that have run out of parts in R are different parts (step # 14), and if the parts are the same, mounting of the part is impossible, so production is stopped due to running out of parts. (Step # 21). On the other hand, if it is determined in step # 14 that the components are different components, the components are selectively sucked from both the component supply units L and R (step # 15). Here, for example, in FIG. 3, the component supply unit L
When the part A of the part is out of stock and the part B of the part supply section R is out of stock, the parts necessary for production exist in the part supply part if the parts B and A are in the part supply parts L and R, respectively. Since there is no need to stop production, the parts supply section L
From the component supply unit R, and the components A and C to N from the component supply unit R. Next, it is determined whether or not there is a component (step # 16). If the component is out, it is determined whether or not there is the component in the other component supply unit as in step # 14 (step # 16). 20) If there is a part, the process returns to step # 15 to continue the production, and if there is no part, the process proceeds to step # 21 and the production is stopped due to the parts running out. If there is a component in the judgment of step # 16, the component is mounted on the board fixed to the XY table 3 (step # 17), and the mounting of all the components to be mounted on the board by this mounting machine is completed. (Hereinafter referred to as EOP) is determined (step # 18), and steps # 15 to # 17 are performed until the EOP is reached.
Repeat the operation of. When the EOP is reached, the mounted substrate is unloaded and the next substrate is loaded (step # 19).
【0018】以上のように、本実施例によれば、従来例
であれば部品切れにより生産を停止したようなケースで
あっても、生産停止することなく、連続生産を可能とす
ることができる。As described above, according to the present embodiment, in the case of the conventional example, even in the case where the production is stopped due to the shortage of parts, it is possible to perform the continuous production without stopping the production. .
【0019】[0019]
【発明の効果】本発明の部品実装方法によれば、以上の
説明から明らかなように、部品切れ発生時に複数の部品
供給部すべてで当該部品が部品切れかどうかを判定し、
いずれかの部品供給部でその部品が部品切れでなければ
その部品供給部から部品を供給して部品実装を行なうの
で、部品供給部の入れ換えのために多少の生産タクト低
下はあっても生産停止することなく、連続して部品実装
を継続するすることができ、部品実装機の稼働率を向上
することができる。According to the component mounting method of the present invention, as is clear from the above description, when a component shortage occurs, all of the plurality of component supply units determine whether the component is a component shortage,
If one of the parts supply parts does not run out of parts, the parts are supplied from the parts supply part to mount the parts, so there is a slight decrease in the production tact due to replacement of the parts supply part, but production is stopped. It is possible to continuously mount the components without doing so, and it is possible to improve the operation rate of the component mounter.
【図1】本発明の一実施例における部品実装方法のフロ
ーチャートである。FIG. 1 is a flowchart of a component mounting method according to an embodiment of the present invention.
【図2】電子部品実装機の概略構成を示す斜視図であ
る。FIG. 2 is a perspective view showing a schematic configuration of an electronic component mounting machine.
【図3】同電子部品実装機における部品供給部の部品切
れ時の動作説明図である。FIG. 3 is an operation explanatory diagram of the electronic component mounting machine when a component supply unit runs out of components.
【図4】従来例の部品実装方法のフローチャートであ
る。FIG. 4 is a flowchart of a conventional component mounting method.
【符号の説明】 4L 部品供給部 4R 部品供給部[Explanation of reference symbols] 4L parts supply section 4R parts supply section
Claims (2)
実装する部品実装方法において、部品切れ発生時に複数
の部品供給部で同じ部品が部品切れであるか否かを判定
する工程と、部品切れでない部品供給部から部品を供給
して部品実装を行なう工程とを有することを特徴とする
部品実装方法。1. A component mounting method for mounting a component by selectively using a plurality of component supply units, the step of determining whether or not the same component is out of component in a plurality of component supply units when a component outage occurs, And a step of supplying a component from a component supply unit that is not out of components and mounting the component.
給部で部品実装中に何れかの部品に部品切れが生じると
その部品供給部を補充位置に待機させて部品補充を行
い、他方の部品供給部で部品実装を継続する部品実装方
法において、部品実装中に部品切れが生じたときに補充
位置にある部品供給部に対する部品補充がなされたか否
かを判定する工程と、部品補充がなされていないときに
部品切れとなった部品が全ての部品供給部で部品切れで
あるか否かを判定する工程と、部品切れとなった部品が
待機位置の部品供給部に存在する場合にその部品は補充
位置にある部品供給部で部品実装する工程とを有するこ
とを特徴とする部品実装方法。2. A plurality of component supply units are provided, and when one of the component supply units runs out of components during component mounting, the component supply unit waits at the replenishment position for component replenishment, In a component mounting method for continuing component mounting in the other component supply unit, a step of determining whether or not the component supply unit at the replenishment position has been replenished when a component shortage occurs during component mounting, and component replenishment If the parts that have run out of parts when all the parts are out of stock are checked, and if the parts that have run out of parts exist in the parts supply part at the standby position, And a step of mounting the component at a component supply unit at a replenishment position.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23507795A JP3552806B2 (en) | 1995-09-13 | 1995-09-13 | Component mounting method |
US08/836,044 US6189207B1 (en) | 1995-09-13 | 1996-09-12 | Method of mounting parts |
PCT/JP1996/002602 WO1997010694A1 (en) | 1995-09-13 | 1996-09-12 | Parts mounting method |
DE69634168T DE69634168T2 (en) | 1995-09-13 | 1996-09-12 | METHOD FOR MOUNTING COMPONENTS |
EP96930370A EP0797382B1 (en) | 1995-09-13 | 1996-09-12 | Parts mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23507795A JP3552806B2 (en) | 1995-09-13 | 1995-09-13 | Component mounting method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0983194A true JPH0983194A (en) | 1997-03-28 |
JP3552806B2 JP3552806B2 (en) | 2004-08-11 |
Family
ID=16980727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23507795A Expired - Fee Related JP3552806B2 (en) | 1995-09-13 | 1995-09-13 | Component mounting method |
Country Status (5)
Country | Link |
---|---|
US (1) | US6189207B1 (en) |
EP (1) | EP0797382B1 (en) |
JP (1) | JP3552806B2 (en) |
DE (1) | DE69634168T2 (en) |
WO (1) | WO1997010694A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1151708C (en) * | 1997-11-10 | 2004-05-26 | 松下电器产业株式会社 | Parts mounting device and parts supplying device |
JP3978910B2 (en) * | 1998-12-07 | 2007-09-19 | 松下電器産業株式会社 | Electronic component mounting equipment |
US6571462B1 (en) * | 1999-04-27 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Electronic component mounting apparatus using duplicate sources of components |
DE19919916C2 (en) * | 1999-04-30 | 2001-07-05 | Siemens Ag | Process for the time-optimized assembly of printed circuit boards |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0821798B2 (en) * | 1989-09-05 | 1996-03-04 | 富士機械製造株式会社 | Electronic component supply device |
US5193268A (en) * | 1989-11-07 | 1993-03-16 | Sanyo Electric Co., Ltd. | Parts feeding system utilizing an unmanned conveying machine |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
US5400497A (en) * | 1990-10-29 | 1995-03-28 | Matsushita Electric Industrial Co., Ltd. | Electronic parts mounting apparatus having memory equipped parts supply device |
JP2969955B2 (en) * | 1990-12-19 | 1999-11-02 | 松下電器産業株式会社 | Component mounting method |
JP3245199B2 (en) | 1991-11-01 | 2002-01-07 | 松下電器産業株式会社 | Component replacement data creation method and component mounting method for component mounter, component mounter |
JP3176691B2 (en) | 1992-02-14 | 2001-06-18 | シチズン時計株式会社 | Electronic component supply method in electronic component mounting apparatus |
JP2591634Y2 (en) | 1993-04-27 | 1999-03-10 | 三洋電機株式会社 | Electronic component automatic mounting device |
JP3841448B2 (en) | 1993-12-13 | 2006-11-01 | 松下電器産業株式会社 | Component mounting method and component mounting machine |
JPH0846388A (en) * | 1994-08-03 | 1996-02-16 | Matsushita Electric Ind Co Ltd | Parts mounter |
-
1995
- 1995-09-13 JP JP23507795A patent/JP3552806B2/en not_active Expired - Fee Related
-
1996
- 1996-09-12 WO PCT/JP1996/002602 patent/WO1997010694A1/en active IP Right Grant
- 1996-09-12 US US08/836,044 patent/US6189207B1/en not_active Expired - Fee Related
- 1996-09-12 DE DE69634168T patent/DE69634168T2/en not_active Expired - Lifetime
- 1996-09-12 EP EP96930370A patent/EP0797382B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0797382B1 (en) | 2005-01-12 |
DE69634168T2 (en) | 2005-06-23 |
DE69634168D1 (en) | 2005-02-17 |
EP0797382A1 (en) | 1997-09-24 |
JP3552806B2 (en) | 2004-08-11 |
EP0797382A4 (en) | 1999-12-08 |
US6189207B1 (en) | 2001-02-20 |
WO1997010694A1 (en) | 1997-03-20 |
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