JPH097884A - Capacitor - Google Patents
CapacitorInfo
- Publication number
- JPH097884A JPH097884A JP17418395A JP17418395A JPH097884A JP H097884 A JPH097884 A JP H097884A JP 17418395 A JP17418395 A JP 17418395A JP 17418395 A JP17418395 A JP 17418395A JP H097884 A JPH097884 A JP H097884A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- electrode
- electrodes
- opposed
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 abstract description 4
- 230000002542 deteriorative effect Effects 0.000 abstract description 3
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、直方体または平板状の
平板型コンデンサに係り、特に、コンデンサの形状に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectangular parallelepiped or flat plate type capacitor, and more particularly to the shape of the capacitor.
【0002】[0002]
【従来の技術】コンデンサは、2つの電極を誘電体を間
に対向させた構造を有し、電気容量は誘電体材料の誘電
率、電極面積に比例し、電極間隔距離に反比例する。コ
ンデンサには、回路設計上の使用電圧、周波数、使用温
度、電気容量値や実装方法等の使用目的により、様々な
形態のものがあり、セラミックコンデンサ、アルミ電解
コンデンサ、有機フィルムコンデンサ、マイカコンデン
サ等がある。平板型セラミックコンデンサは、板状の誘
電体セラミックスの上下面に電極を配置した構造をもつ
コンデンサである。2. Description of the Related Art A capacitor has a structure in which two electrodes are opposed to each other with a dielectric between them, and the electric capacity is proportional to the dielectric constant of the dielectric material and the electrode area, and inversely proportional to the distance between the electrodes. There are various types of capacitors depending on the purpose of use such as circuit design voltage, frequency, temperature, electric capacity and mounting method.Ceramic capacitors, aluminum electrolytic capacitors, organic film capacitors, mica capacitors, etc. There is. The flat plate type ceramic capacitor is a capacitor having a structure in which electrodes are arranged on the upper and lower surfaces of a plate-shaped dielectric ceramic.
【0003】[0003]
【発明が解決しようとする課題】平板型セラミックコン
デンサは、板状の誘電体セラミックスの上下面に電極を
付して、この電極面のいずれかを回路基板上の接着面と
している。実装の際には、さらに上側の電極面から回路
基板上へワイヤ等で接続する必要があり、同一面からの
電極の取り出しが困難で、表面実装ができにくいという
問題点があった。In the flat plate type ceramic capacitor, electrodes are attached to the upper and lower surfaces of a plate-shaped dielectric ceramic, and one of the electrode surfaces is used as an adhesive surface on a circuit board. At the time of mounting, it is necessary to connect the electrode surface on the upper side to the circuit board with a wire or the like, which makes it difficult to take out the electrode from the same surface, which makes it difficult to perform surface mounting.
【0004】そこで、コンデンサの電気容量を損なわず
に、かつ電極の取り出しを同一面から行うために、平板
を立てて実装する方法が採られている。しかし、この実
装方法では、回路基板上に半田付けする際に平板が倒れ
るという実装不良が発生したり、また、平板を立てると
いうことで回路基板の設計が高背になるという問題点が
ある。Therefore, in order to take out the electrodes from the same plane without deteriorating the electric capacity of the capacitor, a method of mounting a flat plate is adopted. However, this mounting method has a problem in that a mounting failure occurs in which the flat plate falls down when soldering on the circuit board, and the circuit board becomes taller because the flat plate is erected.
【0005】本発明の技術的課題は、コンデンサの電気
容量を損なわずに、平板を立てることなく表面実装が可
能な平板型セラミックコンデンサを供することである。A technical problem of the present invention is to provide a flat plate type ceramic capacitor which can be surface-mounted without raising a flat plate without impairing the electric capacity of the capacitor.
【0006】[0006]
【課題を解決するための手段】本発明は、平板状の誘電
体セラミックス表面の向かい合った2つの対向電極面
に、対向電極が形成された平板型コンデンサの対向電極
を、それぞれの対向電極面に隣接して対向する面にまで
延ばして端子電極とし、対向電極の隣接面に延びていな
い側の互いの長さ方向に対角的に対応する稜の近傍が絶
縁された構造をとり、なおかつ、対向電極面のある誘電
体セラミックス表面に溝状の凹部を設けたことを特徴と
する平板型コンデンサである。According to the present invention, a counter electrode of a flat plate type capacitor having counter electrodes formed on two counter electrode surfaces facing each other on a flat dielectric ceramic surface is provided on each counter electrode surface. Adjacent to the opposing surface to extend to the terminal electrode, and the structure in which the vicinity of the ridges diagonally corresponding to each other on the side not extending to the adjacent surface of the opposing electrode is insulated, and, A flat-type capacitor characterized in that a groove-shaped concave portion is provided on a surface of a dielectric ceramic having an opposing electrode surface.
【0007】[0007]
【作用】本発明による平板型コンデンサによると、回路
基板からみて同一面に電極が対向して存在するので、平
板を立てることなく表面実装が可能となる。また、対向
電極面の存在する誘電体セラミックス表面に部分的に溝
状の凹部があることで、電極間距離が短かくなり、対向
電極の面積が減じても、同サイズの平板型コンデンサに
比べて、同等以上の電気容量が確保される。According to the flat type capacitor of the present invention, the electrodes are present on the same surface as the circuit board faces each other, so that the surface mounting is possible without raising the flat plate. In addition, since there is a groove-shaped recess on the surface of the dielectric ceramic where the counter electrode surface is present, the distance between the electrodes becomes shorter, and even if the area of the counter electrode is reduced, compared to a flat-type capacitor of the same size. As a result, an electric capacity equal to or higher than that is secured.
【0008】[0008]
【実施例】以下に本発明による実施例を説明する。EXAMPLES Examples according to the present invention will be described below.
【0009】本実施例では誘電体材料として誘電率
(ε)が90の誘電体セラミックスを用い、形状を長さ
1.6、巾0.8、厚さ0.5mmの平板とし、対向電極
としてAuのスパッタにより、平板型コンデンサを作製
した。In this embodiment, a dielectric ceramic having a dielectric constant (ε) of 90 is used as a dielectric material, and a flat plate having a length of 1.6, a width of 0.8 and a thickness of 0.5 mm is used as a counter electrode. A flat plate type capacitor was manufactured by sputtering Au.
【0010】(実施例1)母体となる0.5mmの厚さ
の誘電体セラミックス板に、図1に示すように、個々の
素子の長さ方向の中心に溝状の凹部1ができるように加
工し、その後、個々の素子が、図2に示すように、電極
のない部分(幅0.25mm)Rがとれるように、セラ
ミック板の両面にスパッタでAuの対向電極2を形成し
た。切断加工後、図3に示すように、長さ方向の端部に
ディップにより、Agの端子電極3を形成した。このよ
うにして、一対のAuの対向電極2は、その各々が、素
子の対角をなす稜の部分で、Agの端子電極3の各々と
電気的に接続することになる。図4は、誘電体セラミッ
クス板の長さ方向の断面形状を示して、要部に符号を付
している。作製されたコンデンサの形状ごとの電気容量
を表1に示す。(Embodiment 1) As shown in FIG. 1, a groove-shaped recess 1 is formed in the center of each element in the longitudinal direction on a dielectric ceramic plate having a thickness of 0.5 mm as a base. After processing, as shown in FIG. 2, the counter electrodes 2 made of Au were formed on both surfaces of the ceramic plate by sputtering so that the individual element-less portions (width 0.25 mm) R could be taken. After the cutting process, as shown in FIG. 3, the Ag terminal electrode 3 was formed by dipping at the end in the length direction. In this way, each of the pair of Au counter electrodes 2 is electrically connected to each of the Ag terminal electrodes 3 at the diagonal ridge portions of the element. FIG. 4 shows the cross-sectional shape of the dielectric ceramic plate in the length direction, and the main parts are indicated by reference numerals. Table 1 shows the electric capacities of the manufactured capacitors for each shape.
【0011】 [0011]
【0012】No.1は、No.5(従来型)と素子形状
が同じで、溝がないが、端子電極を付したものである。
しかし、絶縁部分を設けるために、対向電極の面積が小
さくなり、No.5に比して、容量が低下している。し
かし、溝を設けて、その寸法を選択することによって、
No.3およびNo.4のように、No.5以上の容量が
確保できる。No. 1 has the same element shape as No. 5 (conventional type) and has no groove but has a terminal electrode.
However, since the insulating portion is provided, the area of the counter electrode is reduced, and the capacity is reduced as compared with No. 5. However, by providing a groove and choosing its dimensions,
Like No. 3 and No. 4, the capacity of No. 5 or more can be secured.
【0013】(実施例2)得られたコンデンサの回路基
板上へ半田実装した例を図4に示す。(Embodiment 2) An example of soldering the obtained capacitor on a circuit board is shown in FIG.
【0014】図4に示すように、低背で実施可能であ
る。As shown in FIG. 4, it can be implemented with a low profile.
【0015】[0015]
【発明の効果】以上、述べたごとく、本発明による平板
型コンデンサにすることで、従来の電極溝造ではできな
かった回路基板上への表面実装が容量を低下させること
なく、かつ、低背で可能となる。As described above, by using the flat type capacitor according to the present invention, surface mounting on a circuit board, which cannot be achieved by the conventional electrode groove structure, does not reduce the capacity and the height is low. It becomes possible with.
【図1】本発明による平板状の誘電体セラミックスの外
観斜視図。FIG. 1 is an external perspective view of a flat plate-shaped dielectric ceramics according to the present invention.
【図2】本発明による平板状の誘電体セラミックスの上
下面に電極を付した斜視図。FIG. 2 is a perspective view in which electrodes are attached to upper and lower surfaces of a flat plate-shaped dielectric ceramics according to the present invention.
【図3】本発明による平板状の誘電体セラミックスの側
面に電極を付した斜視図。FIG. 3 is a perspective view in which electrodes are attached to the side surfaces of a flat plate-shaped dielectric ceramics according to the present invention.
【図4】本発明による平板状の誘電体セラミックスの長
さ方向の断面図。FIG. 4 is a longitudinal sectional view of a flat plate-shaped dielectric ceramics according to the present invention.
【図5】本発明によるコンデンサの実装例を縦断面で示
した説明図。FIG. 5 is an explanatory view showing a mounting example of a capacitor according to the present invention in a vertical section.
1 溝(凹部) 2 対向電極(Au) 3 端子電極(Ag) 4 基板 5 回路 6 半田 7 対向電極面 R 電極のない部分(絶縁部分) 1 Groove (Concave) 2 Counter Electrode (Au) 3 Terminal Electrode (Ag) 4 Substrate 5 Circuit 6 Solder 7 Counter Electrode Surface R Part without Electrode (Insulation Part)
Claims (2)
い合った2つの対向電極面に対向電極が形成されてなる
平板型コンデンサにおいて、前記対向電極は、それぞ
れ、対向電極面に隣接する互いに対向する面にまで延ば
されて端子電極を形成し、前記対向電極面の延ばされて
いない側の前記対向する面近傍では、前記対向電極が施
されていないことを特徴とするコンデンサ。1. A flat-plate capacitor having counter electrodes formed on two counter electrode surfaces facing each other on a flat dielectric ceramic surface, wherein the counter electrodes are surfaces facing each other and adjacent to the counter electrode surface. To form a terminal electrode, and the counter electrode is not provided in the vicinity of the facing surface on the non-extended side of the counter electrode surface.
片面または両面の対向電極面に凹部があることを特徴と
するコンデンサ。2. The capacitor according to claim 1, wherein
A capacitor having a recess on one or both surfaces of a counter electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17418395A JPH097884A (en) | 1995-06-15 | 1995-06-15 | Capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17418395A JPH097884A (en) | 1995-06-15 | 1995-06-15 | Capacitor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH097884A true JPH097884A (en) | 1997-01-10 |
Family
ID=15974175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17418395A Pending JPH097884A (en) | 1995-06-15 | 1995-06-15 | Capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH097884A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106216608A (en) * | 2016-09-30 | 2016-12-14 | 常州万兴纸塑有限公司 | Pouring channel tube preparation method is used in casting |
-
1995
- 1995-06-15 JP JP17418395A patent/JPH097884A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106216608A (en) * | 2016-09-30 | 2016-12-14 | 常州万兴纸塑有限公司 | Pouring channel tube preparation method is used in casting |
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