JPH0955472A - Inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inductor which is lessened in area occupied by it on a wafer and parasitic capacitance. SOLUTION: Legs 4 of insulator are provided upright onto a wafer 10 adjacently to first inductors 1, and a second inductor 3 connected to the first inductor 1 is so provided as to be supported each leg 4. By this setup, the inductors 1 and 3 are separated from each other by air, so that the parasitic capacitance induced between the inductors 1 and 3 can be lessened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor used as a basic circuit element of a high frequency integrated circuit device,
Particularly, the present invention relates to improvement of a spiral inductor having a spiral structure.

[0002]

2. Description of the Related Art As shown in FIG. 5, an inductor used in a filter circuit or the like of a conventional high-frequency integrated circuit device has a line 1 wound on a wafer 10 in a spiral shape and the line 1 itself is wound. The intersecting portion, that is, the portion where the portion 1a and the portion 1b intersect each other, is constructed by using the air bridge 2 on one side (in this case, 1b) so that the two portions 1a and 1b are three-dimensionally crossed. The line 1 used here is formed of Au (gold) or the like, and the air bridge 2 is also Au.
It is formed using a material such as (gold). Since the spiral inductor is configured in a plane as described above, a large area is required to manufacture a spiral inductor having a large inductance value.

Therefore, as disclosed in Japanese Patent Laid-Open No. 61-265857, an insulating film is arranged on a first inductor formed in a spiral shape, and a second spiral inductor is formed on the insulating film. It is known that the first and second inductors are electrically connected to each other through the opening provided in the insulation film. When seen, a larger inductance value can be obtained as compared with a one-layer structure.

[0004]

The inductor of the conventional high-frequency integrated circuit device is configured as described above, and the inductor has a multi-layered structure with an insulating film interposed therebetween, so that the same occupying area does not form a multi-layered structure. A larger inductance value can be obtained as compared with the inductors, but since the insulating film is disposed on the entire surface between the first layer and the second layer, the inductors are vertically opposed to each other with the insulating film interposed therebetween. There is a problem in that the parasitic capacitor is generated in the part, and the desired operating characteristics of the inductor cannot be obtained.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to obtain an inductor having a large inductance value with a small occupied area and excellent operating characteristics without causing parasitic capacitance. With the goal.

[0006]

SUMMARY OF THE INVENTION An inductor according to the present invention comprises a first inductor which is wound in a spiral shape and arranged on a wafer, and which is erected vertically upward at a plurality of positions on the wafer. A plurality of legs made of insulating material and electrically connected to the first inductor and wound in the same direction as the first inductor. And a second inductor that is held.

Further, it is assumed that the first inductor and the second inductor are wound in a rectangular spiral shape, and the second inductor is connected to the first inductor at a connecting portion of both inductors. The second inductor is arranged at a position rotated by an arbitrary angle with respect to the first inductor so that the second inductor intersects at a predetermined angle.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. Hereinafter, an embodiment of the present invention will be described with reference to FIGS. The configuration of the first embodiment is shown in FIG.
As shown in FIG. 2, a first inductor 1 wound in a rectangular spiral shape is arranged on a wafer 10, and leg portions 4 made of an insulating material are erected at a plurality of positions on the wafer 10,
While holding the second inductor 3 wound in a rectangular spiral shape in the same direction as the first inductor 1 above the first inductor 1 by the leg portion 4,
It is electrically connected to the first inductor 1. That is, in FIG. 1, the line 1 (first inductor) made of gold or the like formed on the wafer 10 is wound in a spiral shape and intersects itself (here, four places) with an air bridge. 2 is used, which is configured to cross over. The leg portion 4 is formed of an insulating material such as polyimide, and is erected vertically on the wafer 10 in the vicinity of the first inductor 1 in the vicinity thereof. Second inductor 3 made of gold or the like
Are formed and held on the plurality of legs 4, and thus the second inductor 3 is arranged above the first inductor 1 so as to form a second floor portion. . It should be noted that the first inductor 1 and the second inductor are the inclined portion 1a where the first inductor 1 is separated from the substrate.
It is connected by the part. Further, the height of the leg portion 4 is higher than that of the air bridge 2. The spiral inductor formed by the line 1 and the spiral inductor formed by the line 3 are wound in the same direction. Reference numeral 5 denotes a lead-out portion of the second inductor 3, which is pulled down onto the wafer 10 at the central portion of the vortex winding, and a portion intersecting with the first inductor 1 is connected to the air bridge 2 as shown in FIG. It is designed to intersect three-dimensionally.

As described above, according to the first embodiment, the main part of the wafer 10 is provided above the first spirally wound first inductor 1 which is planarly arranged on the wafer 10. Since the second inductor 3 wound in a spiral shape in the same direction as the first inductor is held using the vertically arranged insulating leg portion 4 and a plurality of inductors are laminated, A large inductance value can be obtained in the occupied area, and since the stacked inductors are insulated by air, the inductors above and below are compared to the conventional inductors that are electrically separated using an insulating film. The parasitic capacitance generated between them is reduced and becomes small.

Embodiment 2 Next, Embodiment 2 of the present invention
Will be described with reference to FIG. In the configuration of the second embodiment, as shown in FIG. 4, the first inductor 1 wound in a rectangular spiral shape is arranged on the wafer 10, and an insulating material is provided at a plurality of positions on the wafer 10. The leg portion 4 is provided upright, and the second inductor 6 wound in a rectangular spiral shape in the same direction as the first inductor 1 is carried above the first inductor 1 by the leg portion 4. At the same time, the second inductor 6 which becomes the second-floor portion at the inclined portion 1a is formed.
Is arranged at a position rotated by a predetermined angle with respect to the first inductor 1 in the first floor portion formed by the line 1. The line 1 (first inductor) made of gold or the like formed on the wafer 10 is wound in a spiral shape and intersects itself (here, four places).
The air bridge 2 is used for the vehicle, and the air bridge 2 is configured to cross over. The leg portion 4 is formed of an insulating material such as polyimide, and is erected vertically on the wafer 10 in the vicinity of the first inductor 1 in the vicinity thereof.

The first inductor 1 and the second inductor 6 are connected at the inclined portion 1a where the first inductor 1 is separated from the substrate. Further, the height of the leg portion 4 is higher than that of the air bridge 2. Also, 5
Is a lead-out portion of the second inductor 3, and is pulled down onto the wafer 10 at the central portion of the vortex winding.
As shown in FIG. 3, the portion intersecting the inductor 1 of
The air bridge 2 is used to intersect three-dimensionally.

In the second embodiment, the second inductor 6 which is also arranged in a rectangular spiral shape and is arranged above the first inductor 1 which is spirally wound in a rectangular shape is provided. By arranging the inductor 1 at a position rotated by 45 ° with respect to the inductor 1, the amount of overlap between the first floor portion and the second floor portion is reduced as compared with the case of the first embodiment. It is possible to further reduce the parasitic capacitance.

Further, in the first embodiment, in order to form the lead-out portion 5 of the second inductor 3, the winding method of the second floor portion is such that each side is bent at an angle of 90 ° to form a spiral shape. It is necessary to wind the line up to the center of this vortex, that is, the vicinity of the air bridge 2 (the portion where the drawn-out portion 5 is arranged). Since the line is inclined because it is arranged in a rotated position, it is possible to approach the air bridge 2 (the part where the drawer part 5 is arranged) with a line shorter than that of the first embodiment, because the line is inclined. it can. Therefore, when the inductor has a laminated structure, the inductance value of the entire inductor can be made variable, and the inductor can be configured by arbitrarily changing the rotation angle of the second inductor with respect to the first inductor. The length of the line to be adjusted can be adjusted to the desired length,
It is possible to easily obtain an inductor having a desired inductance value.

[Brief description of drawings]

FIG. 1 is a top view of an inductor according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the inductor.

FIG. 3 is a partial cross-sectional view near the air bridge of the inductor.

FIG. 4 is a top view of the inductor according to the second embodiment of the present invention.

FIG. 5 is a top view of a conventional inductor.

[Explanation of symbols]

1 line (first inductor), 1a inclined portion, 2
Air bridge, 3 lines (2nd inductor), 4
Leg part, 5 drawer part, 6 second inductor, 10
Wafer

Claims (2)

[Claims] 1. A first inductor wound in a spiral shape and arranged on the wafer on the surface of the wafer, and a plurality of spiral wires wound in the same direction as the first inductor. A second inductor which is held above the first inductor by a plurality of leg portions made of an insulating material and which are erected vertically upward at a location, and which is electrically connected to the first inductor. An inductor characterized by 2. The inductor according to claim 1, wherein the first and second inductors are respectively wound in a rectangular spiral shape, and the second inductor is provided at a connection portion of the both inductors. The second inductor is arranged at a position rotated by an arbitrary angle with respect to the first inductor so that the second inductor intersects the first inductor at a predetermined angle.